CN101384136B - Surface mounting process for flexible circuit board and used magnetic tool and steel mesh - Google Patents
Surface mounting process for flexible circuit board and used magnetic tool and steel mesh Download PDFInfo
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- CN101384136B CN101384136B CN200810216884.9A CN200810216884A CN101384136B CN 101384136 B CN101384136 B CN 101384136B CN 200810216884 A CN200810216884 A CN 200810216884A CN 101384136 B CN101384136 B CN 101384136B
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Abstract
The invention relates to the manufacturing technology of printed wiring board, in particular to a flexible printed circuit (FPC) surface mount technology (SMT) as well as a magnetic tool and a steel mesh which are used for the FPCSMT. The magnetic tool comprises a buckle cover board and a magnetic carrying tray, wherein the magnetic carrying tray is a magnetic baseplate, the buckle cover board is a metal sheet which can be attracted by the magnetic baseplate, and the buckle cover board is provided with a slotted hole used for the solder paste printing and the surface mounting of a FPC. The invention is characterized in that the buckle cover board is a steel sheet which can be attracted by the magnetic baseplate, the step layer which is the same as the buckle cover board in shape is etched on the magnetic carrying tray, the depth of the step layer is the same as the thickness of the steel sheet; before the circuit board printing, the magnetic carrying tray is fixed on a positioning base, and then the FPC and the buckle cover board are arranged on the magnetic carrying tray; after the accurate positioning, the FPC and the magnetic tool are taken down the positioning base to conduct the solder paste printing process, the surface mounting process and the reflow soldering process.
Description
[technical field]
The present invention relates to the manufacturing technology of printed substrate, the magnetic tool that relates in particular to a kind of surface mounting process for flexible circuit board and use in this technique.
[background technology]
Flexible Printed Circuit (FPC) has the features such as distribution density is high, lightweight, thin thickness, is mainly used in a lot of products such as mobile phone, notebook computer, PDA, digital camera.The surface mounting technology of Flexible Printed Circuit (SMT) process mainly comprises paste solder printing, mounts and three basic links such as Reflow Soldering.Paste solder printing refers to that the mould printing that tin cream is passed through to predetermined pattern is to the weld pad of circuit board; Paster is that surface-assembled components and parts are accurately installed on the fixed position of Flexible Printed Circuit; Reflow Soldering refers to that dissolving tin cream makes to realize machinery between electronic devices and components pin and circuit board welding pad and be connected with electrical equipment.
In these links, to paste solder printing figure, paster all has point-device requirement, once paste solder printing figure, patch location are not accurate enough, by the bad connection causing between electronic devices and components pin and flexible circuit board weld pad, cause that product rejection maybe needs the processing of doing over again.Surface mount process completes in Flexible Printed Circuit, so will accurately locate Flexible Printed Circuit, the surface-pasted quality of guarantee like this, yet FPC itself is soft, its mechanical strength high not, so its position is more difficult more fixing than common PCB, in order to prevent that in surface mount process, distortion appears in Flexible Printed Circuit, guarantee the accuracy of paste solder printing and patch location, conventionally pending surface-pasted Flexible Printed Circuit fixed placement is carried out to surface mount processing procedure on a loading plate again.What current industrial application was more has two kinds by Flexible Printed Circuit fixed placement in the method for loading plate, the first, loading plate surrounding is posted resistant to elevated temperatures Double-face gummed paper with fixing four limits of Flexible Printed Circuit, but this kind of method be the middle part of Flexible Printed Circuit fixedly, make floating the sticking up of Flexible Printed Circuit of intermediate sector, so that after surface adhered with electronic component there is the phenomenons such as sky welds, bridge joint is bad in Flexible Printed Circuit middle part; The second, loading plate surface arranges a layer of silica gel, make flexible circuit board centre and four limits all be fixed on loading plate, but this kind of method is at the beginning of loading plate is used, the viscosity of its layer of silica gel can be higher, Flexible Printed Circuit is difficult to again FPC and loading plate to peel off after by soldering furnace like this, get when attached and easily lose, and the upper residual jelly of FPC is easily stained with dust and contaminated.Layer of silica gel is in being repeatedly used process, and the viscosity of layer of silica gel can step-down,, when the viscosity of silica gel is too low, fixedly FPC owes firmly, easily causes FPC to misplace.
Therefore be necessary to provide a kind of fully fixedly Flexible Printed Circuit, and prevent that the surface mount that Flexible Printed Circuit produces deformation in surface mount processing procedure from taking up tool.
China national Department of Intellectual Property discloses the fixture (publication number: CN200944704 of a kind of flexible circuit board (FPC) dress coupling, open day: 2007.09.05), it is characterized in that: described fixture comprises: cover plate and support plate, cover plate is the ferromagnetic material sheet metal of elastically deformable, when being on the cover board provided with alignment pin and joining for flexible circuit board dress, need exposed slotted eye, when being provided with the location hole corresponding with alignment pin and joining for flexible circuit board dress on support plate, need exposed slotted eye, on support plate, be also provided with one group of permanent magnets, alignment pin coordinates with location hole, permanent magnets and cover plate are integral by magnetic attracting.
This fixture with respect to first two adopt gluing method fixedly Flexible Printed Circuit have simple in structure, quick during use, convenient, good reliability, highly versatile, the feature such as can be repeatedly used, production efficiency is provided, has saved production cost, improved the acceptance rate of product simultaneously.Yet in this utility model, described cover plate must be the sheet metal of ferromagnetic material, and this thin plate also has certain mechanical strength, common iron plate is because its toughness is inadequate, the words of thickness too thin (being less than 0.1mm), easily fracture, this makes in getting additive process very difficult, human cost improves greatly, its useful life is also very short simultaneously, if thickness too thick (being greater than 0.1mm), if just fix Flexible Printed Circuit with cover plate and support plate in the paste solder printing stage, can affect its printing quality, cause tin cream skewness, affect follow-up technique.So the technique having adopted in the industry is at present: one deck viscose paper is set on support plate, FPC is bonded on support plate, then carry out paste solder printing technique, cover plate is placed on above FPC after paste solder printing is complete again, carry out paster and reflow soldering process.So this technology is actually a kind of improvement for said method two, by cover plate, FPC is pushed down to solve the problem on deformation of FPC in paster and reflow process.In this process, using viscose paper one deck layer of silica gel to be set on support plate in having method two has same drawback, so want fundamentally to solve the series of problems of above-mentioned appearance, must adopt a kind of new magnetic material sheet metal as cover plate.
Owing to having adopted cover plate that FPC is covered, in paste solder printing, one deck steel mesh need to be on the cover board set, and cover plate has certain thickness, if silk screen is directly overlayed on steel plate, can make the upper tin cream of FPC too much, affect follow-up paster and reflow soldering process, thereby affect the quality of whole attachment process.So steel mesh must be removed to certain thickness, the quality of the whole technique of guarantee.
[summary of the invention]
Main purpose of the present invention is to provide the magnetic tool using in a kind of novel Flexible Printed Circuit (FPC) surface mount process (SMT), and a kind of new Flexible Printed Circuit (FPC) surface mount process (SMT) having produced because used this magnetic tool.
The magnetic tool using in Flexible Printed Circuit (FPC) surface mount process (SMT), described magnetic tool comprises clinching cover plate and magnetic pallet, described magnetic pallet is for being with magnetic substrate, the sheet metal of clinching cover plate for being attracted by substrate, on clinching cover plate, be provided with the slotted eye for Flexible Printed Circuit print solder paste and paster, it is characterized in that, described clinching cover plate is can be by the steel disc of attraction.
Described steel disc is stainless steel substrates, its thickness 0.05-0.1mm, and hardness is 480-700 Vickers hardness.Steel disc is for adopting austenitic stainless steel or martensitic stain less steel to make through cold working, and the chemical composition of the steel of selecting is as follows:
C∶Si∶Mn∶P∶S∶Ni∶Cr∶Fe＝
(0.08-0.15)∶(0.75-1.00)∶(1.00-2.00)∶(0.04-0.045)∶(0.025-0.030)∶(6.00-10.00)∶(16.0-19.0)∶(68.0-76.0)。
Described magnetic pallet is to adopt the materials such as aluminium alloy, synthetic stone, glass mat to inlay the substrate that resistant to elevated temperatures permanent magnet is made.
Described magnetic tool also comprises positioning base, on positioning base, be provided with at least three alignment pins, described magnetic pallet is provided with base location hole and the pallet location hole corresponding with base alignment pin, on described clinching cover plate, be provided with the cover plate location hole corresponding with pallet location hole, in described Flexible Printed Circuit, be provided with FPC location hole, described pallet location hole, cover plate location hole and FPC location hole coordinate; On described clinching cover plate, be also provided with the mark location hole corresponding with the optical markings of Flexible Printed Circuit location use.
On described magnetic pallet, be also provided with the location notch identical with Flexible Printed Circuit profile, with wiring board on corresponding groove or the louvre in components and parts position, described groove can be filled out and put components and parts when mounting Flexible Printed Circuit is two-sided.
Described steel mesh is the non magnetic steel disc of 0.08mm or the above thickness of 0.08mm, and on it, etching has the flight identical with clinching cover plate shape, and the degree of depth of this flight is identical with the thickness of steel disc, and this flight adopts etch process local reduction to be made.
On described steel mesh, be provided with the printing hole for Flexible Printed Circuit print solder paste, described printing hole needs the part of print solder paste corresponding with Flexible Printed Circuit, and this printing hole is to be made through radium-shine laser cutting.
Flexible Printed Circuit (FPC) surface mount process (SMT) that uses above-mentioned magnetic tool and steel mesh, is characterized in that, its processing step is as follows:
(1) before printing, magnetic pallet is fixed on above positioning base, then put successively Flexible Printed Circuit and clinching cover plate, allow base location hole and the alignment pin of magnetic pallet fasten, allow corresponding cover plate location hole, FPC location hole overlap with pallet nail location hole, allow mark location hole overlap with the optical markings point in Flexible Printed Circuit, after accurate positioning, Flexible Printed Circuit is taken out from positioning base together with magnetic tool, put into printing track, etc. Flexible Printed Circuit, enter after certain printing track, the printing machine that is provided with steel mesh starts to carry out paste solder printing.
(2) be completed for printing rear Flexible Printed Circuit and enter chip mounter with magnetic tool, chip mounter carries out component mounter to Flexible Printed Circuit.
(3) entering reflow soldering after having mounted is welded and fixed the solder joint in high-temperature components and Flexible Printed Circuit.
(4) reflow soldering is taken out cooling magnetic tool from track after completing, and takes down clinching cover plate, takes out Flexible Printed Circuit, and magnetic tool enters circulation next time.
The fixed-direction of described Flexible Printed Circuit is chip component vertical direction, SOT and SOP horizontal direction; On described printing machine, be provided with optical positioning system, this optical positioning system can be identified the optical locating point in Flexible Printed Circuit; The scraper of printing machine is steel spatula, and the angle of described scraper and Flexible Printed Circuit is 60-75 degree; The print direction of printing machine is left and right or fore-and-aft direction, and print speed printing speed is 10mm/s-25mm/s, and squeegee pressure is 0.1kg/cm
2-0.3kg/cm
2; The stripping rate of printing machine is 0.1mm/s-0.2mm/s.
On described chip mounter, be provided with suction nozzle, after this suction nozzle paster completes, suction becomes 0, and after suction becomes 0, suction nozzle is removed from Flexible Printed Circuit.
Reflow process comprises warm-up phase, constant temperature stage, welding stage and cooling stage in described step (3), warm-up phase, and temperature is raised to 110 degree from room temperature, and rate of rise in temperature is 1 ℃/S-2 ℃/S; In the constant temperature stage, temperature rises to 150 degree, temperature retention time 60s-120s from 110 degree; The welding stage, 1-2 ℃/S of temperature rising speed; Maximum temperature is less than 230 ℃, keeps temperature 20s-40s at 200 ℃-220 ℃, keeps temperature 3s-5s at 220 ℃-230 ℃; Cooling stage, temperature reaches after maximum temperature and naturally declines, 2 ℃ of decrease speeds/S-5 ℃/S.
Useful technique effect of the present invention is:
(1) the present invention adopts magnetic pallet and clinching cover plate as magnetic tool, Flexible Printed Circuit to be fixed firmly, so in whole surface mount process process without adopting silica gel or double faced adhesive tape, so can not make residual silica gel in Flexible Printed Circuit, on pallet, can not be stained with ash yet, greatly improved the useful life of pallet, and removed the cost cleaning from.
(2) the stainless steel clinching cover plate toughness adopting is strong, makes it be not easy to fracture getting when attached, has saved a large amount of human costs, and the useful life of having improved clinching cover plate.
(3) the stainless steel clinching cover sheet thickness adopting is very thin, after steel mesh adopts etch process local reduction simultaneously, can not cause the too much situation of tin cream, has guaranteed the quality of whole technique.
(4) adopt magnetic tool that Flexible Printed Circuit wiring board is clipped in the middle, there is good effect of heat insulation, Flexible Printed Circuit can be out of shape in reflow process, thereby guarantee the situation that there will not be rosin joint and empty weldering that is connected between components and parts and Flexible Printed Circuit solder joint.
(5) due to the setting tool that does not adopt layer of silica gel or double faced adhesive tape as Flexible Printed Circuit in whole technical process, so can share tool in printing, paster and Reflow Soldering stage, not only simplified technological process, instrument cost and human cost have been saved, after work simplification simultaneously, the probability that affects product quality because of human factor reduces greatly, and the quality of product improves greatly.
(6) after paster technique completes, only clinching cover plate and magnetic pallet need be separated, just can take off very easily Flexible Printed Circuit, when getting wiring board, can wiring board be lost because of having adhesion between Flexible Printed Circuit and pallet.
[accompanying drawing explanation]
Fig. 1 is the dress connection schematic diagram of Flexible Printed Circuit of the present invention and magnetic tool;
Fig. 2 is the three-dimensional view of positioning base of the present invention;
Fig. 3 is the front view of magnetic pallet of the present invention;
Fig. 4 is the front view of clinching cover plate of the present invention;
Fig. 5 is the front view of Flexible Printed Circuit;
Fig. 6 is the front view of steel mesh of the present invention.
Wherein: 1: magnetic pallet; 11: base location hole; 12: pallet location hole; 13: location notch; 14: groove; 15: louvre; 16: permanent magnet; 2: Flexible Printed Circuit; 21: optical markings point; 22:FPC location hole; 3: clinching cover plate; 31: cover plate location hole; 32: mark location hole; 33: slotted eye; 4: positioning base; 41: alignment pin; 5: steel mesh; 51: flight; 52: printing hole.
[embodiment]
The magnetic tool that the present invention relates to use in surface mounting process for flexible circuit board and steel mesh and the surface mounting process for flexible circuit board that uses this magnetic tool and steel mesh, this magnetic tool comprises magnetic pallet and clinching cover plate, clinching cover plate is stainless steel substrates thin and that toughness is very high, and Flexible Printed Circuit is clipped in paste solder printing, paster and the reflow process that completes a whole set of technique between magnetic pallet and clinching cover plate.
Embodiment mono-:
As Figure 1-5, the magnetic tool the present invention relates to comprises magnetic pallet 1, clinching cover plate 3 and positioning base 4, and described positioning base 4 is provided with two alignment pins 41 (three or three above alignment pins also can be set), described magnetic pallet 1 adopts aluminium alloy melanism and then inlays the substrate that the permanent magnet 16 of resistance to 300 ℃ of high temperature is made and (also can adopt synthetic stone, resistant to elevated temperatures glass fibre is inlayed resistant to elevated temperatures permanent magnet again and is made), described magnetic pallet 1 is provided with base location hole 11 and the pallet location hole 12 corresponding with base alignment pin 41, on this magnetic pallet 1, be also provided with the location notch 13 identical with Flexible Printed Circuit 2 profiles, the groove 14 corresponding with components and parts position on wiring board and louvre 15, described groove 14 can be filled out and put components and parts when mounting Flexible Printed Circuit 2 is two-sided, described clinching cover plate 3 is can be by the stainless steel substrates of attraction, the thickness of stainless steel substrates is 0.05mm, hardness is 480 Vickers hardnesses, and steel disc is for adopting austenitic stainless steel or martensitic stain less steel to make through cold working, and the chemical composition of the steel of selecting is as follows:
C: Si: Mn: P: S: Ni: Cr: Fe=0.08: 0.7: 1.00: 0.04: 0.025: 6.00: 16.0: 76.0, all the other are other impurity.On clinching cover plate 3, be provided with the cover plate location hole 31 corresponding with pallet location hole 12, on clinching cover plate 3, be also provided with and put 21 corresponding mark location holes 32 with the optical markings of Flexible Printed Circuit 2 location use and for the slotted eye 33 of Flexible Printed Circuit 2 print solder paste and paster, in Flexible Printed Circuit 2, be provided with for printing the optical markings point 21 of locating and the FPC location hole 22 corresponding with the pallet location hole 12 of magnetic pallet 1.
Before printing, magnetic pallet 1 is fixed on above positioning base 4, then put successively Flexible Printed Circuit 2 and clinching cover plate 3, allow the base location hole 11 of magnetic pallet 1 fasten with alignment pin 41, allow corresponding cover plate location hole 31, FPC location hole 22 overlaps with 12 holes, pallet nail location, allow mark location hole 32 overlap with the optical markings point 21 in Flexible Printed Circuit, after accurate positioning, Flexible Printed Circuit 2 is taken out from positioning base 4 together with magnetic tool, put into printing track, the fixed-direction of described Flexible Printed Circuit 2 is chip component vertical direction, SOT and SOP horizontal direction.Etc. Flexible Printed Circuit 2, enter after certain printing track, the printing machine that is provided with steel mesh 5 starts to carry out paste solder printing.
As shown in Figure 6, described steel mesh 5 is the non magnetic steel disc that 0.08mm is thick, and on it, etching has the flight 51 identical with clinching cover plate 3 shapes, and the degree of depth of this flight 51 is 0.05mm, and this flight 51 adopts etch process local reduction to be made; On described steel mesh 5, be provided with the printing hole 52 for Flexible Printed Circuit 2 print solder paste, described printing hole 52 needs the part of print solder paste corresponding with Flexible Printed Circuit 2, and this printing hole 52 is made through radium-shine laser cutting.
On described printing machine, be provided with optical positioning system, this optical positioning system can be identified the optical locating point 21 in Flexible Printed Circuit 2; The scraper of printing machine is steel spatula, and the angle of described scraper and Flexible Printed Circuit is 60 degree; The print direction of printing machine is left and right directions (also can be fore-and-aft direction), and print speed printing speed is 10mm/s, and squeegee pressure is 0.1kg/cm
2; The stripping rate of printing machine is 0.1mm/s.
Be completed for printing rear Flexible Printed Circuit and enter chip mounter with magnetic tool, chip mounter carries out component mounter to Flexible Printed Circuit; After having mounted, entering reflow soldering is welded and fixed the solder joint in high-temperature components and Flexible Printed Circuit; After reflow soldering completes, from track, take out cooling magnetic tool, take down clinching cover plate, take out Flexible Printed Circuit, magnetic tool enters circulation next time.
On described chip mounter, be provided with suction nozzle, after this suction nozzle paster completes, suction becomes 0, and after suction becomes 0, suction nozzle is removed from Flexible Printed Circuit.
Reflow process comprises warm-up phase, constant temperature stage, welding stage and cooling stage, warm-up phase, and temperature is raised to 110 degree from room temperature, and rate of rise in temperature is 1 ℃/S; In the constant temperature stage, temperature rises to 150 degree, temperature retention time 60s from 110 degree; The welding stage, 1 ℃/S of temperature rising speed; Maximum temperature is 220 ℃, keeps temperature 20s at 200 ℃, keeps temperature 3s at 220 ℃; Cooling stage, temperature declines after reaching maximum temperature naturally, 2 ℃/S of decrease speed.
Embodiment bis-:
As Figure 1-5, the magnetic tool the present invention relates to comprises magnetic pallet 1, clinching cover plate 3 and positioning base 4, and described positioning base 4 is provided with two alignment pins 41 (three or three above alignment pins also can be set), described magnetic pallet 1 adopts aluminium alloy melanism and then inlays the substrate that the permanent magnet of resistance to 300 ℃ of high temperature is made and (also can adopt synthetic stone, resistant to elevated temperatures glass fibre is inlayed resistant to elevated temperatures permanent magnet again and is made), described magnetic pallet 1 is provided with base location hole 11 and the pallet location hole 12 corresponding with base alignment pin 41, on this magnetic pallet 1, be also provided with the location notch 13 identical with Flexible Printed Circuit 2 profiles, the groove 14 corresponding with components and parts position on wiring board and louvre 15, described groove 14 can be filled out and put components and parts when mounting Flexible Printed Circuit 2 is two-sided, described clinching cover plate 3 is can be by the stainless steel substrates of attraction, the thickness of stainless steel substrates is 0.1mm, hardness is 700 Vickers hardnesses, steel disc is for adopting austenitic stainless steel or martensitic stain less steel to make through cold working, the chemical composition of the steel of selecting is as follows: C: Si: Mn: P: S: Ni: Cr: Fe=0.15: 1.00: 2.00: 0.045: 0.030: 10.00: 19.0: 67.0, and all the other are other impurity.On clinching cover plate 3, be provided with the cover plate location hole 31 corresponding with pallet location hole 12, on clinching cover plate 3, be also provided with and put 21 corresponding mark location holes 32 with the optical markings of Flexible Printed Circuit 2 location use and for the slotted eye 33 of Flexible Printed Circuit 2 print solder paste and paster, in Flexible Printed Circuit 2, be provided with for printing the optical markings point 21 of locating and the FPC location hole 22 corresponding with the pallet location hole 12 of magnetic pallet 1.
Before printing, magnetic pallet 1 is fixed on above positioning base 4, then put successively Flexible Printed Circuit 2 and clinching cover plate 3, allow the base location hole 11 of magnetic pallet 1 fasten with alignment pin 41, allow corresponding cover plate location hole 31, FPC location hole 22 overlaps with 12 holes, pallet nail location, allow mark location hole 32 overlap with the optical markings point 21 in Flexible Printed Circuit, after accurate positioning, Flexible Printed Circuit 2 is taken out from positioning base 4 together with magnetic tool, put into printing track, the fixed-direction of described Flexible Printed Circuit 2 is chip component vertical direction, SOT and SOP horizontal direction.Etc. Flexible Printed Circuit 2, enter after certain printing track, the printing machine that is provided with steel mesh 5 starts to carry out paste solder printing.
As shown in Figure 6, described steel mesh 5 is the non magnetic steel disc that 0.1mm is thick, and on it, etching has the flight 51 identical with clinching cover plate 3 shapes, and the degree of depth of this flight 51 is 0.1mm, and this flight 51 adopts etch process local reduction to be made; On described steel mesh 5, be provided with the printing hole 52 for Flexible Printed Circuit 2 print solder paste, described printing hole 52 needs the part of print solder paste corresponding with Flexible Printed Circuit 2, and this printing hole 52 is made through radium-shine laser cutting.
On described printing machine, be provided with optical positioning system, this optical positioning system can be identified the optical locating point 21 in Flexible Printed Circuit 2; The scraper of printing machine is steel spatula, and the angle of described scraper and Flexible Printed Circuit is 75 degree; The print direction of printing machine is left and right directions (also can be fore-and-aft direction), and print speed printing speed is 25mm/s, and squeegee pressure is 0.3kg/cm
2; The stripping rate of printing machine is 0.2mm/s.
Be completed for printing rear Flexible Printed Circuit and enter chip mounter with magnetic tool, chip mounter carries out component mounter to Flexible Printed Circuit; After having mounted, entering reflow soldering is welded and fixed the solder joint in high-temperature components and Flexible Printed Circuit; After reflow soldering completes, from track, take out cooling magnetic tool, take down clinching cover plate, take out Flexible Printed Circuit, magnetic tool enters circulation next time.
On described chip mounter, be provided with suction nozzle, after this suction nozzle paster completes, suction becomes 0, and after suction becomes 0, suction nozzle is removed from Flexible Printed Circuit.
Reflow process comprises warm-up phase, constant temperature stage, welding stage and cooling stage, warm-up phase, and temperature is raised to 110 degree from room temperature, and rate of rise in temperature is 2 ℃/S; In the constant temperature stage, temperature rises to 150 degree, temperature retention time 120s from 110 degree; The welding stage, 2 ℃/S of temperature rising speed; Maximum temperature is 230 ℃, keeps temperature 40s at 220 ℃, keeps temperature 5s at 230 ℃; Cooling stage, temperature declines after reaching maximum temperature naturally, 5 ℃/S of decrease speed.
In a word, the present invention mainly provides a kind of very thin thickness and had can be by the securing clinching cover plate of flexible wire plate, this magnetic tool is fixed without silica gel, had just this kind of function clinching cover plate and just make the attachment process of whole Flexible Printed Circuit greatly simplify, production cost reduces greatly.
Because having advantages of with iron, steel do not have, but common steel is not but by attraction, exactly because this point, in production application, people are difficult to solve clinching cover plate can be by the problem of attraction, inventor in doing process of the present invention, developed a lot of can be by the steel disc of attraction, although the present invention only provides the material of a kind of stainless steel as clinching cover plate, can not be interpreted as and only be confined to stainless steel as the material of clinching cover plate of the present invention, any can be by the steel disc of attraction, in thickness of the present invention and hardness range, all belong to protection scope of the present invention.
Claims (4)
1. a Flexible Printed Circuit (FPC) surface mount process (SMT), it is characterized in that, the magnetic tool that described attachment process adopts comprises clinching cover plate and magnetic pallet, described magnetic pallet is for being with magnetic substrate, the sheet metal of clinching cover plate for being attracted by substrate, on clinching cover plate, be provided with the slotted eye for Flexible Printed Circuit print solder paste and paster, described clinching cover plate is can be by the steel disc of attraction; Described steel disc is stainless steel substrates, its thickness is 0.05-0.1mm, hardness is 480-700 Vickers hardness, steel disc is for adopting austenitic stainless steel or martensitic stain less steel to make through cold working, and the chemical composition of the steel of selecting is as follows: C:Si:Mn:P:S:Ni:Cr:Fe=(0.08-0.15): (0.75-1.00): (1.00-2.00): (0.04-0.045): (0.025-0.030): (6.00-10.00): (16.0-19.0): (68.0-76.0); Described magnetic pallet is to adopt aluminium alloy, synthetic stone or glass mat to inlay the substrate that resistant to elevated temperatures permanent magnet is made, and further, its processing step is as follows:
(1) before printing, magnetic pallet is fixed on above positioning base, then put successively Flexible Printed Circuit and clinching cover plate, allow base location hole and the alignment pin of magnetic pallet fasten, allow corresponding cover plate location hole, FPC location hole overlap with pallet nail location hole, allow mark location hole overlap with the optical markings point in Flexible Printed Circuit, after accurate positioning, Flexible Printed Circuit is taken out from positioning base together with magnetic tool, put into printing track, etc. Flexible Printed Circuit, enter after certain printing track, the printing machine that is provided with steel mesh starts to carry out paste solder printing; The fixed-direction of described Flexible Printed Circuit is chip component vertical direction, SOT and SOP horizontal direction; On described printing machine, be provided with optical positioning system, this optical positioning system can be identified the optical locating point in Flexible Printed Circuit; The scraper of printing machine is steel spatula, and the angle of described scraper and Flexible Printed Circuit is 60-75 degree; The print direction of printing machine is left and right or fore-and-aft direction, and print speed printing speed is 10mm/s-25mm/s, and squeegee pressure is 0.1kg/cm
2-0.3kg/cm
2; The stripping rate of printing machine is 0.1mm/s-0.2mm/s;
(2) be completed for printing rear Flexible Printed Circuit and enter chip mounter with magnetic tool, chip mounter carries out component mounter to Flexible Printed Circuit;
(3) entering reflow soldering after having mounted is welded and fixed the solder joint in high-temperature components and Flexible Printed Circuit; Wherein, reflow process comprises warm-up phase, constant temperature stage, welding stage and cooling stage, warm-up phase, and temperature is raised to 110 degree from room temperature, and rate of rise in temperature is 1 ℃/S-2 ℃/S; In the constant temperature stage, temperature rises to 150 degree, temperature retention time 60s-120s from 110 degree; The welding stage, 1-2 ℃/S of temperature rising speed; Maximum temperature is less than 230 ℃, keeps temperature 20s-40s at 200 ℃-220 ℃, keeps temperature 3s-5s at 220 ℃-230 ℃; Cooling stage, temperature reaches after maximum temperature and naturally declines, 2 ℃ of decrease speeds/S-5 ℃/S;
(4) reflow soldering is taken out cooling magnetic tool from track after completing, and takes down clinching cover plate, takes out Flexible Printed Circuit, and magnetic tool enters circulation next time.
2. Flexible Printed Circuit according to claim 1 (FPC) surface mount process (SMT), it is characterized in that, described positioning base is provided with at least two alignment pins, described magnetic pallet is provided with base location hole and the pallet location hole corresponding with base alignment pin, on described clinching cover plate, be provided with the cover plate location hole corresponding with pallet location hole, in described Flexible Printed Circuit, be provided with FPC location hole, described pallet location hole, cover plate location hole and FPC location hole coordinate; On described clinching cover plate, be also provided with the optical markings of Flexible Printed Circuit location use and put corresponding mark location hole.
3. Flexible Printed Circuit according to claim 1 and 2 (FPC) surface mount process (SMT), it is characterized in that, on described magnetic pallet, be also provided with louvre, the location notch identical with Flexible Printed Circuit profile or with wiring board on components and parts position is corresponding when mounting Flexible Printed Circuit is two-sided, can fill out the groove of putting components and parts.
4. surface mounting process for flexible circuit board according to claim 1 and 2, is characterized in that, on described chip mounter, is provided with suction nozzle, and after this suction nozzle paster completes, suction becomes 0, and after suction becomes 0, suction nozzle is removed from Flexible Printed Circuit.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810216884.9A CN101384136B (en) | 2008-10-17 | 2008-10-17 | Surface mounting process for flexible circuit board and used magnetic tool and steel mesh |
| JP2009240936A JP2010098320A (en) | 2008-10-17 | 2009-10-19 | Surface mounting process for flexible printed circuit board, and magnetic tool and steel mesh used in the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810216884.9A CN101384136B (en) | 2008-10-17 | 2008-10-17 | Surface mounting process for flexible circuit board and used magnetic tool and steel mesh |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410097893.6A Division CN103889162B (en) | 2008-10-17 | 2008-10-17 | Method for surface mounting of elements and devices on flexible printed circuit, system and magnetic fixture |
| CN201410097915.9A Division CN103826394A (en) | 2008-10-17 | 2008-10-17 | Method and system for mounting component on surface of flexible circuit board as well as magnetic jig |
Publications (2)
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| CN101384136B true CN101384136B (en) | 2014-04-02 |
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| CN101384136A (en) | 2009-03-11 |
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