CN111430882A - Equipment and method for processing composite and multi-station printing full-die cutting ultrahigh frequency tag antenna - Google Patents
Equipment and method for processing composite and multi-station printing full-die cutting ultrahigh frequency tag antenna Download PDFInfo
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- CN111430882A CN111430882A CN202010337082.4A CN202010337082A CN111430882A CN 111430882 A CN111430882 A CN 111430882A CN 202010337082 A CN202010337082 A CN 202010337082A CN 111430882 A CN111430882 A CN 111430882A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/44—Cutters therefor; Dies therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F19/00—Apparatus or machines for carrying out printing operations combined with other operations
- B41F19/008—Apparatus or machines for carrying out printing operations combined with other operations with means for stamping or cutting out
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F23/00—Devices for treating the surfaces of sheets, webs, or other articles in connection with printing
- B41F23/04—Devices for treating the surfaces of sheets, webs, or other articles in connection with printing by heat drying, by cooling, by applying powders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
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- Details Of Aerials (AREA)
Abstract
The invention provides a processing device and a processing method for a composite and multi-station printing full-die-cutting ultrahigh frequency tag antenna, and relates to a method for processing the ultrahigh frequency tag antenna, wherein a chip binding positioning point formed by a die cutting mode and a chip binding point formed by the die cutting mode are arranged on an antenna body of the ultrahigh frequency tag antenna; antenna body's antenna layer one side still pastes second substrate layer or first substrate layer and second substrate layer, its characterized in that: the processing equipment comprises a first die-cutting mechanism, a second die-cutting mechanism and a printing mechanism. The invention solves the problems in the prior art that: the problem of how to avoid using an etching process to produce a chip binding point and a chip binding positioning point of an ultrahigh frequency electronic tag antenna and simultaneously save adhesive coated between an antenna layer and a second substrate layer or between a first substrate layer and the second substrate layer compounded on the antenna layer as much as possible; the second problem is that: the problem of how to improve the adhesive coating accuracy while avoiding the need to coat the entire adhesive on the antenna layer or on the first substrate layer.
Description
Technical Field
The invention relates to the technical field of electronic tags, in particular to equipment and a method for processing a composite and multi-station printing full-die-cutting ultrahigh frequency tag antenna.
Background
At present, the chip binding point and the chip binding positioning point of the ultrahigh frequency electronic tag antenna are still produced by adopting an etching process, and the etching process needs chemical substances such as hydrochloric acid and the like, so that the environmental impact is great, and therefore, how to avoid producing the chip binding point and the chip binding positioning point of the ultrahigh frequency electronic tag antenna by adopting the etching process and simultaneously save the adhesive coated between the antenna layer and the second base material layer or between the first base material layer and the second base material layer compounded on the antenna layer as much as possible becomes a problem to be solved urgently.
In addition, how to completely avoid the problem of applying an etching process in the production process of the ultrahigh frequency electronic tag antenna, how to prevent the antenna layer from shifting or shifting during transmission in the processing process, how to help the antenna layer to better shift or transmit while maintaining tension, how to help the antenna hole, the chip binding point and the chip binding point to perform precise processing, how to improve the adhesive coating precision and avoid completely coating an adhesive on the antenna layer or the first substrate layer, how to further accurately determine the chip mounting position besides utilizing the chip binding point, and these problems also become urgent to be solved.
Disclosure of Invention
The invention aims to provide equipment and a method for processing a composite and multi-station printing full-die-cutting ultrahigh frequency tag antenna, which mainly solve the problems in the prior art that: the problem of how to avoid using an etching process to produce a chip binding point and a chip binding positioning point of an ultrahigh frequency electronic tag antenna and simultaneously save adhesive coated between an antenna layer and a second substrate layer or between a first substrate layer and the second substrate layer compounded on the antenna layer as much as possible;
the second problem is that: the problem of how to improve the coating precision of the adhesive is solved, and the adhesive is prevented from being completely coated on the antenna layer or the first substrate layer;
the third problem is that: the problem of how to help the antenna hole, the chip binding point and the chip binding point to carry out accurate processing;
the fourth problem is that: how to further accurately determine the chip mounting position in addition to utilizing the chip binding point;
the fifth problem is that: the problem of how to completely avoid applying an etching process in the production process of the ultrahigh frequency electronic tag antenna;
problem six: the problem of position deviation when the antenna layer moves or is transmitted is solved in the processing process;
the seventh problem: the problem of how to help the antenna layer keep tension and better move or drive is solved.
In order to achieve the purpose, the invention adopts the technical scheme that: a processing device for a composite and multi-station printing full-die-cutting ultrahigh frequency label antenna relates to a chip binding positioning point formed by a die cutting mode and a chip binding point formed by the die cutting mode are arranged on an antenna body of the ultrahigh frequency label antenna; antenna body's antenna layer one side still pastes second substrate layer or first substrate layer and second substrate layer, its characterized in that: the processing equipment for the composite and multi-station printing full-die-cutting ultrahigh frequency tag antenna comprises a die-cutting mechanism and a printing mechanism, wherein the die-cutting mechanism is used for performing die cutting on chip binding positioning points of the ultrahigh frequency tag antenna, chip binding points and the peripheral edge of the ultrahigh frequency tag antenna, and the printing mechanism is used for coating an adhesive on one side of an antenna layer to be processed or one side of a first base material layer which is not adhered with the antenna layer according to the shape of an antenna body.
Further, the printing mechanism comprises a first female die printing seat which is used for coating adhesive with colors on one side of the antenna layer to be processed or one side of the first base material layer, which is not adhered with the antenna layer, according to the shape of the antenna body and synchronously printing a first positioning mark near the adhesive block coated according to the shape of the antenna body;
or the printing mechanism comprises a second female die printing seat for printing a first positioning mark and a mark block by ink on one side of the antenna layer to be processed or on one side of the first base material layer which is not adhered with the antenna layer, a first exposure device for exposing the first positioning mark and the mark block to enable the first positioning mark and the mark block to be formed by the ink to be quickly exposed and dried, and a third female die printing seat for coating an adhesive according to the shape of the antenna body on one side of the antenna layer to be processed or on one side of the first base material layer which is not adhered with the antenna layer according to the mark block.
Further, the die cutting mechanism comprises a first die cutting mechanism used for die cutting the chip binding positioning points and the chip binding points of the ultrahigh frequency tag antenna, and a second die cutting mechanism used for die cutting the peripheral edge of the ultrahigh frequency tag antenna.
Furthermore, the processing equipment for the full-die-cutting ultrahigh frequency tag antenna for the composite and multi-station printing further comprises an antenna hole processing mechanism for die-cutting an antenna hole of the ultrahigh frequency tag antenna, a composite mechanism for compounding the second substrate layer and the antenna layer or compounding the second substrate layer and the first substrate layer adhered with the antenna layer, a first waste discharge winding mechanism for winding the waste antenna processed by the first die-cutting mechanism and the second die-cutting mechanism or winding the waste antenna processed by the first die-cutting mechanism and the second die-cutting mechanism and the waste first substrate layer, and a third unwinding mechanism for unwinding the isolation layer on the antenna layer or the second substrate layer;
the antenna layer to be processed or the antenna layer adhered with the first substrate layer is input through the input port of the first female die printing seat, the output port of the first female die printing seat corresponds to the input port of the antenna hole processing mechanism, the output port of the antenna hole processing mechanism corresponds to the input port of the composite mechanism, the output port of the composite mechanism corresponds to the input port of the first die-cutting mechanism, the output port of the first die-cutting mechanism corresponds to the input port of the second die-cutting mechanism, and the output port of the second die-cutting mechanism corresponds to the input port of the first waste discharging winding mechanism and the output port of the third unwinding mechanism;
or the input port of the first female die printing seat inputs an antenna layer to be processed or an antenna layer adhered with a first substrate layer, the output port of the first female die printing seat corresponds to the input port of the antenna hole processing mechanism, the output port of the antenna hole processing mechanism corresponds to the input port of the compound mechanism, the output port of the compound mechanism corresponds to the input port of the second die cutting mechanism, the output port of the second die cutting mechanism corresponds to the input port of the first die cutting mechanism, and the output port of the first die cutting mechanism corresponds to the input port of the first waste discharging winding mechanism and the output port of the third unwinding mechanism;
or the input port of the second female die printing seat inputs an antenna layer to be processed or an antenna layer adhered with a first substrate layer, the output port of the second female die printing seat corresponds to the input port of the first exposure device, the output port of the first exposure device corresponds to the input port of the third female die printing seat, the output port of the third female die printing seat corresponds to the input port of the antenna hole processing mechanism, the output port of the antenna hole processing mechanism corresponds to the input port of the compound mechanism, the output port of the compound mechanism corresponds to the input port of the first die-cutting mechanism, the output port of the first die-cutting mechanism corresponds to the input port of the second die-cutting mechanism, and the output port of the second die-cutting mechanism corresponds to the input port of the first waste-discharging winding mechanism and the output port of the;
or the antenna layer of processing is treated or the antenna layer of pasting first substrate layer has been pasted in the input port input of second die printing seat, the delivery outlet of second die printing seat corresponds the input port of first exposure device, the delivery outlet of first exposure device corresponds the input port of third die printing seat, the delivery outlet of third die printing seat corresponds the input port of antenna hole processing mechanism, the delivery outlet of antenna hole processing mechanism corresponds the input port of combined mechanism, the delivery outlet of combined mechanism corresponds the input port of second die-cutting mechanism, the delivery outlet of second die-cutting mechanism corresponds the input port of first die-cutting mechanism, the delivery outlet of first die-cutting mechanism corresponds the input port of first useless winding mechanism of row and the delivery outlet of third unwinding mechanism.
Further, compound and full die-cut hyperfrequency label antenna processing equipment of multistation printing still includes a deviation correcting device, and a deviation correcting device is located before the printing mechanism, and the antenna layer that waits to process or the antenna layer of pasting first substrate layer are imported to the input port of a deviation correcting device promptly, and the output port of a deviation correcting device corresponds the input port of first die printing seat or the input port of second die printing seat.
Furthermore, the composite and multi-station printing full-die-cutting ultrahigh frequency tag antenna processing equipment further comprises a fourth male die printing seat and a second exposure device, wherein the fourth male die printing seat is used for printing a second positioning mark on the antenna layer and/or the second substrate layer by adopting ink, the second exposure device is used for exposing the second positioning mark so that the second positioning mark is formed by the ink and is quickly exposed, and the second positioning mark is used for positioning a chip during chip installation and/or binding;
the output port of the compound mechanism corresponds to the input port of a fourth male die printing seat, the output port of the fourth male die printing seat corresponds to the input port of a second exposure device, the output port of the second exposure device corresponds to the input port of the first die cutting mechanism, the output port of the first die cutting mechanism corresponds to the input port of the second die cutting mechanism, and the output port of the second die cutting mechanism corresponds to the input port of the first waste discharging winding mechanism and the output port of the third unwinding mechanism;
or the output port of the compound mechanism corresponds to the input port of a fourth male die printing seat, the output port of the fourth male die printing seat corresponds to the input port of a second exposure device, the output port of the second exposure device corresponds to the input port of a second die cutting mechanism, the output port of the second die cutting mechanism corresponds to the input port of a first die cutting mechanism, and the output port of the first die cutting mechanism corresponds to the input port of a first waste discharging winding mechanism and the output port of a third unwinding mechanism.
Further, the first die cutting mechanism is composed of a flat-press die cutting mechanism, and the flat-press die cutting mechanism is a flat-press die cutting machine comprising at least one die cutting tool for flat-press die cutting of chip binding positioning points and chip binding points;
or the first die-cutting mechanism consists of a circular knife die-cutting mechanism, and the circular knife die-cutting mechanism is a circular knife die-cutting machine comprising at least one rolling cutter for die-cutting a chip binding positioning point and a chip binding point by a circular knife;
or the first die cutting mechanism is a mixed die cutting mechanism formed by mixing a flat-pressing die cutting mechanism and a circular cutter die cutting mechanism, and the mixed die cutting mechanism is a mixed die cutting machine comprising at least one die cutting tool for flat-pressing die cutting chip binding positioning points or chip binding positioning points and at least one hob tool for circular cutter die cutting chip binding points or chip binding positioning points;
the second die-cutting mechanism is a flat-pressing die-cutting machine for flat-pressing the peripheral edge of the die-cutting antenna body or a circular knife die-cutting machine for circular knife die-cutting the peripheral edge of the antenna body;
the antenna hole processing mechanism is a flat-pressing die-cutting machine for flat-pressing die-cutting antenna holes or a circular knife die-cutting machine for circular knife die-cutting antenna holes.
Further, the first die cutting mechanism for die cutting the chip binding positioning points and the chip binding points and the second die cutting mechanism for die cutting the peripheral edge of the antenna body are combined into a flat press die cutting machine or a circular knife die cutting machine.
Furthermore, the processing equipment for the composite and multi-station printing full-die-cutting ultrahigh frequency tag antenna further comprises a first unreeling mechanism for unreeling the antenna layer to be processed or the antenna layer to be processed of the composite first substrate layer, a drying mechanism for drying the antenna layer coated with the adhesive according to the shape of the antenna body or the antenna layer coated with the adhesive according to the shape of the antenna body and compounded with the first substrate layer, a second deviation correcting device, a first traction device, a second unreeling mechanism for unreeling the second substrate layer, and a finished product reeling mechanism for reeling the processed antenna layer, the second substrate layer and the isolating layer together or reeling the processed antenna layer, the first substrate layer, the second substrate layer and the isolating layer together;
the output port of the first unreeling mechanism corresponds to the input port of the first deviation correcting device, the output port of the first female die printing seat or the output port of the third female die printing seat corresponds to the input port of the drying mechanism, the output port of the drying mechanism corresponds to the input port of the second deviation correcting device, the output port of the second deviation correcting device corresponds to the input port of the first traction device, the output port of the first traction device corresponds to the input port of the antenna hole processing mechanism, the output port of the antenna hole processing mechanism corresponds to the input port of the composite mechanism, the output port of the second unreeling mechanism corresponds to the input port of the composite mechanism, the output port of the composite mechanism corresponds to the input port of the fourth male die printing seat, the output port of the fourth male die printing seat corresponds to the input port of the second exposure device, the output port of the second exposure device corresponds to the input port of the first die cutting mechanism, the output port of the second die cutting mechanism corresponds to the input port of the first waste discharging winding mechanism and the input port of the second traction device, the output port of the third unwinding mechanism corresponds to the input port of the second traction device, and the output port of the second traction device corresponds to the input port of the finished product winding mechanism;
or the output port of the first unreeling mechanism corresponds to the input port of the first deviation correcting device, the output port of the first female die printing seat or the output port of the third female die printing seat corresponds to the input port of the drying mechanism, the output port of the drying mechanism corresponds to the input port of the second deviation correcting device, the output port of the second deviation correcting device corresponds to the input port of the first traction device, the output port of the first traction device corresponds to the input port of the antenna hole machining mechanism, the output port of the antenna hole machining mechanism corresponds to the input port of the composite mechanism, the output port of the second unreeling mechanism corresponds to the input port of the composite mechanism, the output port of the composite mechanism corresponds to the input port of the fourth male die printing seat, the output port of the fourth male die printing seat corresponds to the input port of the second exposure device, the output port of the second exposure device corresponds to the input port of the second die cutting mechanism, the output port of the first die cutting mechanism corresponds to the input port of the first waste discharging winding mechanism and the input port of the second traction device, the output port of the third unwinding mechanism corresponds to the input port of the second traction device, and the output port of the second traction device corresponds to the input port of the finished product winding mechanism.
Further, the number of the chip binding points is two, and the first die cutting mechanism is divided into a flat die cutting machine for performing flat press die cutting on one of the chip binding points or a circular knife die cutting machine for performing circular knife die cutting, and a flat die cutting machine for performing flat press die cutting on the other of the chip binding points and the chip binding points or a circular knife die cutting machine for performing circular knife die cutting;
the output port of the compound mechanism corresponds to the input port of a fourth male die printing seat, the output port of the fourth male die printing seat corresponds to the input port of a second exposure device, the output port of the second exposure device corresponds to the input port of a flat-pressing die-cutting machine for carrying out flat-pressing die-cutting on one of the chip binding points or a circular knife die-cutting machine for carrying out circular knife die-cutting, the output port of the flat-die cutting machine for carrying out flat-die cutting on one of the chip binding points or the circular knife cutting machine for carrying out circular knife cutting corresponds to the input port of the flat-die cutting machine for carrying out flat-die cutting on the other chip binding point and the chip binding point or the circular knife cutting machine for carrying out circular knife cutting, the output port of the flat-die cutting machine for carrying out flat-die cutting on the other chip binding point and the chip binding point or the circular knife cutting machine for carrying out circular knife cutting corresponds to the input port of the second die cutting mechanism;
or the output port of the compound mechanism corresponds to the input port of a fourth male die printing seat, the output port of the fourth male die printing seat corresponds to the input port of a second exposure device, the output port of the second exposure device corresponds to the input port of a flat-pressing die-cutting machine for carrying out flat-pressing die-cutting on another chip binding point and a chip binding positioning point or a circular knife die-cutting machine for carrying out circular knife die-cutting, the output port of the flat-die cutting machine for carrying out flat-die cutting on the other chip binding point and the chip binding positioning point or the circular knife cutting machine for carrying out circular knife cutting corresponds to the input port of the flat-die cutting machine for carrying out flat-die cutting on one chip binding point or the circular knife cutting machine for carrying out circular knife cutting, the output port of the flat-die cutting machine for carrying out flat-die cutting on one of the chip binding points or the circular knife cutting machine for carrying out circular knife cutting corresponds to the input port of the second die cutting mechanism.
Further, the processing equipment also comprises a second waste discharge winding mechanism;
the first die-cutting mechanism comprises a first flat die-cutting machine or a first circular knife die-cutting machine for carrying out flat pressing die-cutting on one chip binding point, redundant antennas on two sides of the antenna layer or redundant antennas on two sides of the first substrate layer and redundant first substrate layers, and a second flat die-cutting machine or a second circular knife die-cutting machine for carrying out flat pressing die-cutting on the other chip binding point and the chip binding point; the input port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the output port of the second exposure device, the output port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the input port of the second waste discharge winding mechanism and the input port of the second flat die-cutting machine or the second circular knife die-cutting machine, and the output port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the input port of the second die-cutting mechanism;
or the first die-cutting mechanism comprises a first flat die-cutting machine or a first circular knife die-cutting machine for carrying out flat pressing die-cutting on one of the chip binding points, the redundant antennas on two sides of the antenna layer or the redundant antenna on two sides of the first substrate layer and the redundant first substrate layer, and a second flat die-cutting machine or a second circular knife die-cutting machine for carrying out flat pressing die-cutting on the other chip binding point and the chip binding point; the input port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the output port of the second exposure device, the output port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the input port of the first flat die-cutting machine or the first circular knife die-cutting machine, and the output port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the input port of the second waste discharge winding mechanism and the input port of the second die-cutting mechanism;
or the first die-cutting mechanism comprises a first flat die-cutting machine for performing flat-press die-cutting on one of the chip binding points or a first circular knife die-cutting machine for performing circular knife die-cutting, and a second flat die-cutting machine for performing flat-press die-cutting on the other chip binding point and the chip binding point, and simultaneously performing flat-press die-cutting on redundant antennas on two sides of the antenna layer or redundant antennas on the first substrate layer and redundant antennas on two sides of the antenna layer and redundant first substrate layer or a second circular knife die-cutting machine for performing circular knife die-cutting, the input port of the first flat die cutting machine or the first circular knife die cutting machine corresponds to the output port of the second exposure device, the output port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the input port of the second flat die-cutting machine or the second circular knife die-cutting machine, and the output port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the input port of the second waste discharge winding mechanism and the input port of the second die-cutting mechanism;
or the first die-cutting mechanism comprises a first flat die-cutting machine for performing flat-press die-cutting on one of the chip binding points or a first circular knife die-cutting machine for performing circular knife die-cutting, and a second flat die-cutting machine for performing flat-press die-cutting on the other chip binding point and the chip binding point, and simultaneously performing flat-press die-cutting on redundant antennas on two sides of the antenna layer or redundant antennas on the first substrate layer and redundant antennas on two sides of the antenna layer and redundant first substrate layer or a second circular knife die-cutting machine for performing circular knife die-cutting, and the input port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the output port of the second exposure device, the output port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the input port of the second waste discharge winding mechanism and the input port of the first flat die-cutting machine or the first circular knife die-cutting machine, and the output port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the input port of the second die-cutting mechanism.
Furthermore, the processing equipment also comprises an antenna hole waste material collecting device which is used for collecting waste material antennas generated after the antenna hole processing mechanism punches the antenna hole or waste material antennas and a waste material first base material layer; the antenna hole waste collecting device is positioned below the antenna hole machining mechanism; the compound mechanism is also provided with a heating drum for heating the adhesive; the composite mechanism comprises a rubber roller for compounding the second substrate layer with the antenna layer or a rubber roller for compounding the second substrate layer with the antenna layer of the first substrate layer.
A processing method of a composite and multi-station printing full-die-cutting ultrahigh frequency tag antenna relates to the processing equipment of the composite and multi-station printing full-die-cutting ultrahigh frequency tag antenna, and is characterized in that: the processing method comprises the steps of coating an adhesive on one side of an antenna layer to be processed or one side of a first substrate layer, which is not adhered with the antenna layer, according to the shape of an antenna body by using a printing mechanism, and performing die cutting on chip binding positioning points, chip binding points and the peripheral edge of the ultrahigh frequency tag antenna by using a die cutting mechanism.
Further, the production steps are as follows
The method comprises the following steps: the antenna layer to be processed or the antenna layer compounded with the first base material layer is unreeled to a first female die printing seat by a first unreeling mechanism, a bonding agent with a color is coated on one side of the antenna layer to be processed or one side of the antenna layer compounded with the first base material layer, which is not bonded with the antenna layer, of the first base material layer according to the shape of an antenna body by the first female die printing seat, a first positioning mark is printed nearby a bonding block correspondingly coated according to the shape of the antenna body, then the antenna layer coated with the bonding agent or the antenna layer compounded with the first base material layer coated with the bonding agent is sent to a drying mechanism by the first female die printing seat, and the antenna layer coated with the bonding agent or the antenna layer compounded with the first base material layer is dried by the drying mechanism;
or the antenna layer to be processed or the antenna layer compounded with the first substrate layer is unreeled by the first unreeling mechanism to the second female die printing seat, the first positioning mark and the mark block are printed by the second female die printing seat by adopting printing ink on one side of the antenna layer to be processed or one side of the first substrate layer which is not stuck with the antenna layer, the first positioning mark and the mark block are exposed by the first exposure device so that the first positioning mark and the mark block formed by the printing ink are quickly exposed, then coating an adhesive on one side of the antenna layer to be processed or one side of the first base material layer, which is not adhered with the antenna layer, of the third concave die printing seat according to the shape of the antenna body by the mark block, conveying the antenna layer coated with the adhesive or the antenna layer of the composite first base material layer coated with the adhesive to a drying mechanism by the third concave die printing seat, and drying the antenna layer coated with the adhesive or the antenna layer of the composite first base material layer by the drying mechanism;
step two: conveying the dried antenna layer or the antenna layer compounded with the first base material layer to a deviation correcting device, performing reference positioning on the dried antenna layer or the antenna layer compounded with the first base material layer by using a second deviation correcting device, and correcting and/or calibrating the conveying direction of the antenna layer or the antenna layer compounded with the first base material layer;
step three: the antenna layer rectified by the second rectifying device or the antenna layer compounded with the first substrate layer is sent to a first traction device, and the first traction device is used for assisting the antenna layer or the antenna layer compounded with the first substrate layer to be transmitted; the first traction device and the second traction device are used for acting together, so that the transmission speed of the antenna layer or the antenna layer compounded with the first base material layer is controlled, the tension of the antenna layer or the antenna layer compounded with the first base material layer in the transmission process is stable, and each die-cutting sleeve position is accurate;
step four: the antenna layer passing through the first traction device or the antenna layer compounded with the first base material layer is sent to an antenna hole machining mechanism for antenna hole punching, and the antenna hole machining mechanism conducts antenna hole punching on the antenna layer or the antenna layer compounded with the first base material layer;
step five: the antenna layer with the punched antenna hole or the antenna layer with the punched antenna hole and the compounded first base material layer is compounded with a second base material layer of a second unwinding mechanism through a compounding mechanism, namely the second base material layer is adhered with the antenna layer or the first base material layer through an adhesive;
step six: the antenna layer after the second substrate layer is compounded is subjected to flat pressing die cutting and/or circular knife die cutting on the antenna of the antenna layer through the first die cutting mechanism to form a chip binding point and a chip binding positioning point, then the antenna at the periphery of the antenna body of the antenna layer is subjected to flat pressing die cutting and/or circular knife die cutting through the second die cutting mechanism to form the outer contour of the antenna body, then the preliminarily formed antenna body and the residual waste material antenna are formed on the second substrate layer, and the residual waste material antenna is wound and discarded through the first waste discharge winding mechanism;
or the antenna layer after the second substrate layer and the first substrate layer are compounded is subjected to flat pressing die cutting and/or circular knife die cutting simultaneously by the first die cutting mechanism on the antennas of the first substrate layer and the antenna layer to form a chip binding point and a chip binding positioning point, then the antennas at the periphery of the antenna layer antenna body of the compounded first substrate layer and the first substrate layer are subjected to die cutting and/or roll cutting simultaneously by the second die cutting mechanism to form the outline of the antenna body, then the antenna body of the preliminarily molded compounded first substrate layer is formed on the second substrate layer, the residual waste antennas and the corresponding residual waste first substrate layer are formed, and the residual waste antennas and the corresponding residual waste first substrate layer are wound and discharged through the first waste discharging winding mechanism;
or the antenna layer after the second substrate layer is compounded is subjected to flat pressing die cutting and/or circular knife die cutting on the antennas at the periphery of the antenna body of the antenna layer by the second die cutting mechanism to form the outer contour of the antenna body, then the antennas of the antenna layer are subjected to flat pressing die cutting and/or circular knife die cutting by the first die cutting mechanism to form chip binding points and chip binding positioning points, then the preliminarily formed antenna body and the residual waste antennas are formed on the second substrate layer, and the residual waste antennas are rolled and discharged by the first waste discharge rolling mechanism;
or compounding the second substrate layer and the antenna layer of the first substrate layer, simultaneously carrying out flat pressing die cutting and/or circular knife die cutting on the antenna and the first substrate layer corresponding to the peripheral edge of the antenna body of the antenna layer by the second die cutting mechanism to form the outline of the antenna body, simultaneously carrying out flat pressing die cutting and/or circular knife die cutting on the antenna and the first substrate layer of the antenna layer by the first die cutting mechanism to form a chip binding point and a chip binding positioning point, then forming the preliminarily formed antenna body of the compounded first substrate layer on the second substrate layer, the residual waste antenna and the corresponding residual waste first substrate layer, and rolling and discharging the residual waste antenna and the corresponding residual waste first substrate layer by the first waste discharging and rolling mechanism;
or the antenna layer after the second substrate layer is compounded or the antenna layer after the second substrate layer and the first substrate layer are compounded, a first flat die cutting machine or a first circular knife die cutting machine of a first die cutting mechanism is firstly used for binding a point of one chip, simultaneously, the horizontal pressing die cutting is carried out on redundant antennas at two sides of the antenna layer or redundant antennas at two sides of the first substrate layer and redundant first substrate layer to form residual antenna waste materials at two sides or residual antenna waste materials at two sides and first substrate waste materials, the residual antenna waste materials at two sides or residual antenna waste materials at two sides and first substrate waste materials are rolled and discharged by a second waste discharge rolling mechanism, then the second flat die cutting machine or a second circular knife die cutting machine of the first die cutting mechanism is used for carrying out the horizontal pressing die cutting or the circular knife die cutting to the other chip binding point and the chip binding point, and the chip binding point are jointly formed, then, carrying out flat pressing die cutting and/or circular knife die cutting on the antennas at the edge of the periphery of the antenna body of the antenna layer or the antennas corresponding to the edge of the periphery of the antenna body of the antenna layer and the first substrate layer by a second die cutting mechanism to form the outer contour of the antenna body, and rolling and discharging waste materials through a first waste discharging and rolling mechanism, wherein the residual antenna waste materials or the residual antenna waste materials and the first substrate waste materials are obtained after the chip binding points, the chip binding and positioning points and the outer contour of the antenna body are processed;
or the antenna layer after the second substrate layer is compounded or the antenna layer after the second substrate layer and the first substrate layer are compounded is firstly subjected to flat pressing die cutting or circular knife die cutting on one chip binding point through a first flat die cutting machine or a first circular knife die cutting machine of a first die cutting mechanism, then the second flat die cutting machine or the second circular knife die cutting machine of the first die cutting mechanism is used for carrying out flat pressing die cutting or circular knife die cutting on the other chip binding point and the chip binding positioning point, simultaneously carrying out flat pressing die cutting on redundant antennas at two sides of the antenna layer or redundant first substrate layer and redundant antennas at two sides of the antenna layer and the first substrate layer, and then jointly forming a chip binding point, a chip binding positioning point, residual antenna waste materials at two sides or residual antenna waste materials at two sides and first substrate waste materials, and rolling the residual antenna waste materials at two sides or residual antenna waste materials at two sides and the first substrate waste materials through a second waste discharging mechanism, then, carrying out flat pressing die cutting and/or circular knife die cutting on the antennas at the edge of the periphery of the antenna body of the antenna layer or the antennas corresponding to the edge of the periphery of the antenna body of the antenna layer and the first substrate layer by a second die cutting mechanism to form the outer contour of the antenna body, and rolling and discharging waste materials through a first waste discharging and rolling mechanism, wherein the residual antenna waste materials or the residual antenna waste materials and the first substrate waste materials are obtained after the chip binding points, the chip binding and positioning points and the outer contour of the antenna body are processed;
step seven: after the antenna is wound and exhausted by the first waste-exhausting winding mechanism, the isolation layer is unwound by the third unwinding mechanism, so that the isolation layer is covered on the antenna or the first substrate layer of the preliminarily molded antenna body;
step eight: and the antenna body covering the isolation layer is conveyed to a second traction device, the second traction device is used for helping the antenna body covering the isolation layer to be conveyed to a finished product winding mechanism, and the finished product winding mechanism is used for winding to form a die-cut ultrahigh frequency electronic tag antenna finished product.
Furthermore, in the first step, a deviation rectifying process of a first deviation rectifying device is additionally arranged between the first unwinding mechanism and the first female die printing seat or between the first unwinding mechanism and the second female die printing seat, namely, the antenna layer unwound by the first unwinding mechanism or the antenna layer compounded with the first substrate layer is subjected to reference positioning by the first deviation rectifying device, the transfer direction of the antenna layer is corrected and/or calibrated, and then the antenna layer is sent to the input port of the first female die printing seat or the input port of the second female die printing seat by the first deviation rectifying device.
Further, in the sixth step, a printing process of a second positioning mark of a fourth male die printing seat and a second exposure process of a second exposure device are added between the compound mechanism and the first die cutting mechanism, namely the antenna layer compounded with the second substrate layer or the antenna layer compounded with the second substrate layer and the first substrate layer is firstly sent to a fourth male die printing seat, a second positioning mark is printed on the antenna layer and/or the second substrate layer by the fourth male die printing seat by adopting printing ink, the second positioning mark is used for positioning the chip during chip installation and/or binding, and then exposing the second positioning mark by a second exposure device so as to enable the second positioning mark consisting of printing ink to be quickly exposed and dried, and then conveying the antenna layer printed with the second positioning mark and compounded with the second base material layer or the antenna layer printed with the second positioning mark and compounded with the second base material layer and the first base material layer to an input port of the first die-cutting mechanism.
Further, the antenna hole machining mechanism punches the antenna hole in the antenna layer and adopts a flat pressing die cutting process or a circular knife die cutting process;
in the fifth step, the antenna hole machining mechanism punches the antenna hole, and waste antennas generated after punching or waste antennas generated after punching and a waste first base material layer enter the antenna hole waste collecting device;
in the fifth step, in the process that the antenna layer after the antenna hole is punched or the antenna layer compounded with the first base material layer is compounded with the second base material layer unreeled by the second unreeling mechanism through the compounding mechanism, a heating drum of the compounding mechanism synchronously heats the adhesive on the antenna layer, and the second base material layer is compounded with the antenna layer by using a glue stick or the second base material layer is compounded with the antenna layer compounded with the first base material layer;
the temperature range of the heating drum is 50-200 ℃; the temperature range of the drying mechanism is 40-160 ℃; and the first concave die printing seat or the third concave die printing seat is used for coating a bonding agent on the antenna layer or the first substrate layer and contains a diluting solvent.
Further, the first die cutting mechanism performs one-time flat pressing die cutting and/or circular knife die cutting on the antenna of the antenna layer or the antenna of the antenna layer and the first substrate layer of the composite first substrate layer to form a chip binding point and a chip binding positioning point;
or the first die cutting mechanism carries out two or more times of flat pressing die cutting and/or circular knife die cutting on the antenna of the antenna layer or the antenna of the antenna layer compounded with the first substrate layer and the first substrate layer to form a chip binding point and a chip binding positioning point.
In view of the technical characteristics, the invention has the following beneficial effects:
1. according to the full-die-cut ultrahigh frequency electronic tag antenna, the die cutting forming mode such as flat pressing die cutting and/or circular knife die cutting is adopted for the chip binding points and the chip binding points, so that the full-die-cut ultrahigh frequency electronic tag antenna can be separated from an etching process, and the influence and/or pollution of chemical substances generated by the etching process on the environment can be effectively reduced.
2. According to the full-die-cut ultrahigh frequency electronic tag antenna, a die cutting mode such as flat pressing die cutting and/or circular knife die cutting can be adopted for punching the antenna hole, so that the full-die-cut ultrahigh frequency electronic tag antenna can be separated from an etching process, and the influence and/or pollution of chemical substances generated by the etching process on the environment can be effectively reduced.
3. According to the full-die-cut ultrahigh frequency electronic tag antenna, the die cutting mode such as flat pressing die cutting and/or circular knife die cutting can be adopted for the peripheral edge part of the antenna body, so that the full-die-cut ultrahigh frequency electronic tag antenna can be separated from the etching process, and the influence and/or pollution of chemical substances generated by the etching process to the environment can be effectively reduced.
4. In the processing equipment for the full-die-cutting ultrahigh frequency electronic tag antenna, the chip binding points, the chip binding positioning points and the positions and the processing sequence of the processing equipment at the peripheral edge part of the antenna body can be interchanged, and the processing effects of the chip binding points, the chip binding positioning points and the peripheral edge part of the antenna body are not influenced.
5. The processing technology of the full-die-cut ultrahigh frequency electronic tag antenna comprises the processing mode of die-cutting and forming the chip binding points and the chip binding positioning points, is included in the protection scope of the invention, can help the ultrahigh frequency electronic tag antenna to realize full-die-cutting processing, does not need any etching technology, and can bring the environmental pollution of the ultrahigh frequency electronic tag antenna production to the lowest point, even is basically harmless.
6. The traction mechanism can be composed of at least two traction devices, for example, two traction devices place a die cutting mechanism (including an antenna hole processing mechanism, a composite mechanism, a first die cutting mechanism, a second die cutting mechanism and the like) between the two traction devices, the two traction devices help the die cutting mechanism to perform die cutting in-process antenna layer or antenna layer of a composite first substrate layer and second substrate layer to well move or transmit effect, the moving force is enhanced, the shell is not easy to clamp in the moving process, meanwhile, the antenna layer of the die cutting mechanism in-process antenna layer or composite first substrate layer or antenna layer of the composite first substrate layer and second substrate layer is straightened or flattened through the two traction devices, good tension is kept, the die cutting mechanism can be convenient to process, and the die cutting processing effect is improved. During the manufacturing process, the traction mechanism can effectively help the antenna layer to maintain tension and better move or drive.
7. The second deviation correcting device can help to correct the moving position of the antenna layer which is output from the drying mechanism and coated with the adhesive or the antenna layer of the composite first base material layer, accurately positions and corrects the moving direction, ensures that the transmission position of the antenna layer which enters a subsequent processing procedure or the antenna layer of the composite first base material layer is accurate, and helps to promote the die cutting effect and the die cutting accuracy of the subsequent die cutting mechanism. In the course of working, the second deviation correcting device can prevent effectively that the position from taking place the skew when antenna layer removes or the transmission.
8. The second winding mechanism that wastes discharge can promote the effect of wasting discharge, promotes product processingquality.
9. The die cutting process is realized by utilizing the antenna hole processing mechanism, the first die cutting mechanism and the second die cutting mechanism to the antenna hole, the chip binding point and the chip binding point of the ultrahigh frequency electronic tag antenna, the etching process is effectively avoided, the pollution caused by the etching process to the environment is reduced or even completely avoided, meanwhile, when the adhesive is coated, the concave die printing seat design (such as a first concave die printing seat and a third concave die printing seat) is adopted, the adhesive is precisely coated according to the shape of the antenna layer body (but not completely coated, the adhesive is effectively prevented from being completely coated on the antenna layer or the first substrate layer), namely, the adhesive is printed or coated only at the position where the antenna layer body is formed by the final die cutting, no adhesive exists between other produced antenna layer waste materials and second waste materials, or no adhesive exists between the first substrate layer waste materials and the second substrate layer waste materials compounded on one side of the antenna layer, therefore, the quality of the final finished product of the ultrahigh frequency electronic tag antenna is not influenced, the using amount of the adhesive can be effectively saved, and the production cost is saved.
10. A printing mechanism for accurate coating adhesive prints first location sign simultaneously comprises first die printing seat, and first die printing seat has and carries out accurate coating adhesive function (adopts the adhesive that has the colour to carry out accurate coating this moment) according to antenna layer body shape, still has the function that utilizes printing ink (preferred UV printing ink) to print first location sign simultaneously, once only realizes two functions. Therefore, the production efficiency is higher, and the production steps can be adjusted according to the requirements of customers, and the exposure device is not needed.
11. The printing mechanism for accurately coating the adhesive and printing the first positioning mark can also alternatively consist of a second female die printing seat, a first exposure device and a third female die printing seat, wherein the second female die printing seat is arranged on one side of the antenna layer or one side of the first base material layer compounded on the antenna layer, which is not adhered with the antenna layer, and the first positioning mark and the marking blocks (also can be a plurality of marking blocks) are printed by ink (preferably UV ink), the shape of the marking blocks is the same as that of the antenna layer body, then the first positioning mark and the marking blocks are exposed through the first exposure device to realize quick exposure, so that the adhesive is not influenced to be printed or coated on each marking block by the third female die printing seat, the adhesive coating accuracy is improved, meanwhile, the method of completely coating the adhesive on the antenna layer or the first base material layer is avoided, and the usage amount of the adhesive is effectively saved, the production cost is saved. At this time, the marking block printed by the ink needs to be exposed and dried by a first exposure device (UV lamp), and the marking block formed after the exposure and drying can be conveniently adhered to the corresponding marking block by the adhesive to form an adhesive block.
12. The first positioning mark is in the subsequent die cutting processes of utilizing the antenna hole processing mechanism, the first die cutting mechanism and the second die cutting mechanism to produce the antenna hole of the ultrahigh frequency electronic tag antenna, the chip binding point and the chip binding point, and the like, and plays a role in positioning the reference, the antenna hole processing mechanism convenient to use, the first die cutting mechanism and the second die cutting mechanism utilize the first positioning mark, the accurate antenna hole is carried out on the antenna layer, the die cutting processing of the chip binding point and the chip binding point is carried out, the product processing precision is improved, and the product quality is improved.
13. The setting of first deviation correcting device can help to prepare the transportation position that gets into the antenna layer of printing mechanism or the antenna layer of compound first substrate layer and carry out the position and correct, guarantees that it gets into printing mechanism according to the assigned position, can guarantee like this that printing mechanism (first die printing seat or second die printing seat and third die printing seat promptly) prints first locating mark accurately, prints or coats the adhesive according to antenna layer body shape, guarantees the precision of printing mechanism processing.
14. The fourth male die printing seat and the second exposure device (such as a UV lamp and an ultraviolet lamp) are used for printing and quickly exposing the second positioning mark before entering the chip binding point and the chip binding positioning point for die cutting after the antenna hole is punched, so that the second positioning mark (actually, the position mark for chip installation) can be formed, and the subsequent die cutting process of the chip binding point and the chip binding positioning point is not influenced. The chip can be further confirmed to the second location sign, improves the degree of accuracy of chip mounted position, especially compares with the chip size, and the chip binds under the less or great condition of some area, and the second location sign can fix a position for the chip mounting, and help the chip to realize accurate installation, and chip mounted position precision is higher.
Drawings
Fig. 1 is a schematic diagram of the structure of an all die-cut uhf tag antenna of example 1.
Fig. 2 is a schematic cross-sectional view of an all-die-cut uhf rfid antenna (without the first substrate layer) in example 1.
Fig. 3 is a schematic cross-sectional view of an all-die-cut uhf rfid antenna (including a first substrate layer) in example 1.
FIG. 4 is a schematic structural diagram of an all-die-cut UHF RFID tag antenna and a first positioning mark in example 1;
fig. 5 is a schematic structural diagram of the processing equipment for the composite and multi-station printing full-die cutting ultrahigh frequency tag antenna in the embodiment 1;
fig. 6 is a schematic structural diagram of a processing device for a composite and multi-station printing full-die cutting ultrahigh frequency tag antenna in embodiment 1;
fig. 7 is a schematic structural diagram of the processing equipment for the composite and multi-station printing full-die cutting ultrahigh frequency tag antenna in the embodiment 2;
fig. 8 is a schematic structural diagram of a processing device for a composite and multi-station printing full-die cutting ultrahigh frequency tag antenna in embodiment 2;
fig. 9 is a schematic structural diagram of the processing equipment for the composite and multi-station printing full-die cutting ultrahigh frequency tag antenna in the embodiment 3;
fig. 10 is a schematic structural diagram of a processing device for a composite and multi-station printing full-die cutting ultrahigh frequency tag antenna in embodiment 3;
fig. 11 is a schematic structural diagram of the processing equipment for the composite and multi-station printing full-die cutting ultrahigh frequency tag antenna in the embodiment 4;
fig. 12 is a schematic structural diagram of a processing device for a composite and multi-station printing full-die-cutting ultrahigh frequency tag antenna in embodiment 4;
fig. 13 is a schematic structural diagram of the processing equipment for the composite and multi-station printing full-die cutting ultrahigh frequency tag antenna in the embodiment 5;
FIG. 14 is a schematic structural diagram of a processing apparatus for a full-mold UHF tag antenna for composite and multi-station printing according to embodiment 5;
FIG. 15 is the third schematic structural diagram of the composite and multi-station printed full-mold ultrahigh frequency tag antenna processing equipment in embodiment 5;
fig. 16 is a schematic structural diagram of the processing equipment for the composite and multi-station printing full-die cutting ultrahigh frequency tag antenna in the embodiment 5;
fig. 17 is a schematic structural diagram of a processing device for a composite and multi-station printing full-die cutting ultrahigh frequency tag antenna in example 5;
fig. 18 is a schematic structural diagram six of the processing equipment for the composite and multi-station printing full-die-cutting ultrahigh frequency tag antenna in the embodiment 5.
In the figure: 1 is a first unwinding mechanism; 3 is a drying mechanism; 4, an antenna hole processing mechanism; 5 is an antenna hole waste collecting device; 6 is a composite mechanism; 7, a second unwinding mechanism; 8 is a circular knife die-cutting machine which is used for carrying out circular knife die-cutting on one of the chip binding points in the first die-cutting mechanism; 9 is a circular knife die cutting machine which is used for performing circular knife die cutting on the other chip binding point and the chip binding point in the first die cutting mechanism; 10 is a second die-cutting mechanism; 11 is a first waste discharge winding mechanism; 12 is a third unwinding mechanism; 13 is a finished product winding mechanism; 14, binding a positioning point for the chip; 15 is a chip binding point; 16 is an antenna hole; 17 is an antenna body; 18 is an aluminum foil; 19 is an adhesive printed or coated by the first concave die printing seat or the third concave die printing seat; 20 is paper as a second base material layer, and 21 is a PET layer as a first base material layer; 22 is an adhesive for pre-compounding the PET layer and the aluminum foil; 23 is a first traction device; 24 is a second traction device; 25 is a second deviation correcting device; 26 is a second waste discharge winding mechanism; 27 is a first die-cutting mechanism; 28 is a first female die printing seat; 29 is a second female die printing seat; 30 is a third concave die printing seat; 31 is a fourth male die printing seat; 32 is a first exposure device; 33, a second exposure device; 34 is a first deviation rectifying device; 36 is a first positioning identifier; 37 is a second positioning mark; reference numeral 38 denotes an adhesive patch.
Detailed Description
The invention will be further illustrated with reference to specific embodiments. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Further, it should be understood that various changes or modifications of the present invention may be made by those skilled in the art after reading the teaching of the present invention, and such equivalents may fall within the scope of the present invention as defined in the appended claims.
In specific embodiment 1, referring to fig. 1 to 6, embodiment 1 provides a processing device for a composite and multi-station printing full-die-cutting ultrahigh frequency tag antenna, and relates to an ultrahigh frequency tag antenna, wherein a chip binding positioning point 14 formed by a die cutting mode and a chip binding point 15 formed by a die cutting mode are arranged on an antenna body 17 of the ultrahigh frequency tag antenna; antenna body 17's antenna layer one side still pastes second substrate layer or first substrate layer and second substrate layer, refer to fig. 1, fig. 2 and fig. 3, its characterized in that: the processing equipment for the composite and multi-station printing full-die-cutting ultrahigh frequency label antenna comprises a first die-cutting mechanism 27, a second die-cutting mechanism 10 and a printing mechanism, wherein the first die-cutting mechanism 27 is used for die-cutting a chip binding positioning point 14 and a chip binding point 15 of the ultrahigh frequency label antenna, the second die-cutting mechanism 10 is used for die-cutting the peripheral edge of the ultrahigh frequency label antenna, and the printing mechanism is used for coating an adhesive on one side of an antenna layer to be processed or one side of a first substrate layer, which is not adhered with the.
The chip binding positioning points 14 and the chip binding points 15 of the ultrahigh frequency electronic tag antenna are manufactured in a die cutting mode, so that the etching process can be avoided in the process of producing the chip binding positioning points 14 and the chip binding points 15, and the pollution of chemical substances to the environment can be effectively reduced; in addition, the chip binding positioning points 14 and the chip binding points 15 formed in the die cutting mode are smooth and smooth in the peripheral edges, uneven edge shapes cannot exist, and the quality of the ultrahigh frequency electronic tag antenna is improved.
The peripheral edge of the antenna body 17 is formed by die cutting.
The antenna body 17 is further provided with an antenna hole 16 formed by die cutting.
That is to say, each part on the ultrahigh frequency electronic tag antenna can be carried out by adopting a die cutting mode, the whole ultrahigh frequency electronic tag antenna can be produced by adopting the die cutting mode, the etching process is completely separated, the pollution to the environment is minimized, and even no chemical pollution is caused.
The die cutting mode can adopt flat pressing die cutting and/or circular knife die cutting, which is also called rolling cutting.
In this embodiment 1, there are two chip attachment points 15, one antenna hole 16, and a gap formed between the chip attachment points 15 communicates between the antenna hole 16 and the outside of the antenna.
A second substrate layer or a first substrate layer and a second substrate layer are further adhered to one side of the antenna layer of the antenna body 17, preferably, the first substrate layer is a mylar, preferably, a PET layer 21 of the first substrate layer, and the second substrate layer is a mylar or paper 20, wherein the mylar is preferably, a PET layer; the antenna of the antenna layer may be a metal foil, such as an aluminum foil, a copper foil, etc., and in this embodiment 1, the antenna of the antenna layer is preferably an aluminum foil 18.
The processing equipment for the full-die-cutting ultrahigh frequency tag antenna for the composite and multi-station printing further comprises an antenna hole processing mechanism 4 for die-cutting an antenna hole 16 of the ultrahigh frequency tag antenna, a composite mechanism 6 for compounding a second substrate layer and an antenna layer or compounding the second substrate layer and a first substrate layer adhered with the antenna layer, a first waste discharge winding mechanism 11 for winding the waste antenna processed by the first die-cutting mechanism 27 and the second die-cutting mechanism 10 or winding the waste antenna processed by the first die-cutting mechanism 27 and the second die-cutting mechanism 10 and the waste first substrate layer, and a third unwinding mechanism 12 for unwinding an isolation layer on the antenna layer; the antenna layer drying device comprises a first unwinding mechanism 1, a drying mechanism 3, a second deviation correcting device 25, a first traction device 23, a second traction device 24, a second unwinding mechanism 7, a finished product winding mechanism 13, a first substrate layer, a second substrate layer and an isolation layer, wherein the first unwinding mechanism 1 is used for unwinding the antenna layer to be processed or compounding the antenna layer to be processed of the first substrate layer, the drying mechanism 3 is used for drying the antenna layer coated with an adhesive according to the shape of an antenna body or the drying mechanism 3 is used for drying the antenna layer compounded with the first substrate layer coated with the adhesive according to the shape of the antenna body, the second deviation correcting device 25, the first traction device 23, the second traction device 24, the second unwinding mechanism 7 is used for unwinding the second substrate layer, and the finished product winding mechanism 13 is used;
the antenna hole processing mechanism 4, the compound mechanism 6, the first die-cutting mechanism 27 (the circular knife die-cutting machine 8 for performing circular knife die-cutting on one chip binding point and the circular knife die-cutting machine 9 for performing circular knife die-cutting on the other chip binding point and the chip binding positioning point), the second die-cutting mechanism 10, the first waste discharge winding mechanism 11 and the third unwinding mechanism 12 are arranged between the first traction device 23 and the second traction device 24 by the traction mechanism consisting of the first traction device 23 and the second traction device 24 in a tandem way, so that the antenna layer and/or the first substrate layer and/or the second substrate layer and/or the isolation layer which are used for helping the corresponding processing of the components can be well moved or conveyed, and meanwhile, the tension of the antenna layer and/or the first substrate layer and/or the second substrate layer and/or the isolation layer in the moving process can be kept stable, The tension of the die cutting part is uniform, particularly the tension of the die cutting part is stable and uniform, the corresponding processing operation of the parts is facilitated, and the accuracy of the processing operation is ensured.
The printing mechanism is a first female die printing seat 28 which is used for coating adhesive with colors on one side of an antenna layer to be processed or one side of a first substrate layer which is not adhered with the antenna layer according to the shape of the antenna body and synchronously printing a first positioning mark 36 near a bonding block 38 coated according to the shape of the antenna body, the vicinity of the bonding block 38 means that the first positioning mark 36 is arranged at a specified distance around or on two sides of the outermost edge of the bonding block 38, the first positioning mark 36 in the embodiment 1 is arranged on two sides of the outermost edge of the bonding block 38, referring to fig. 4, the first positioning mark 36 can provide a positioning basis for the antenna hole processing mechanism 4, the fourth male die printing seat 31, the first module mechanism 27 and the second module mechanism 10 in the processing processes of the subsequent antenna hole processing mechanism 4, the fourth male die printing seat 31, the first module mechanism 27 and the second module mechanism 10, the accuracy of the antenna hole machining mechanism 4, the accuracy of the fourth male die printing seat 31, the accuracy of the first module mechanism 27 and the accuracy of the second module mechanism 10 are improved, and the product quality is improved, for example, the outer contour of a specific tag antenna on an antenna layer is positioned through the first positioning mark 36, which is also called die-set positioning.
At this time, the first positioning mark 36 may be printed by ink, preferably UV ink, and the adhesive coated into the adhesive block may be added with color (ink or pigment powder, such as red or black, etc.), so that the printing of the first positioning mark 36 and the coating of the adhesive block 38 may be simultaneously completed by the first female die printing seat 28 at one time, that is, the printing of the tag antenna pattern and the positioning point (color register position, i.e., the first positioning mark) beside the tag antenna pattern are realized, and the positioning point (color register position) is used for the subsequent antenna hole processing mechanism 4, the fourth male die printing seat 31, the first die cutting mechanism 27, and the second die cutting mechanism 10, so as to improve the accuracy of the subsequent antenna hole processing, the chip binding point processing, and the chip binding positioning point processing.
The groove portions of the first female die printing base 28 are used for installing the adhesive, the shape of the groove portions is matched with the shape of the antenna body, namely, the shape of each groove portion is the shape of the antenna body to be cut, the adhesive is printed according to the shape, a plurality of groove portions can be arranged simultaneously, female die printing of a plurality of bonding blocks 38 is achieved, and the adhesive is convenient and saved.
Referring to fig. 5, an output port of the first unwinding mechanism 1 corresponds to an input port of the first female die printing seat 28, an output port of the first female die printing seat 28 corresponds to an input port of the drying mechanism 3, an output port of the drying mechanism 3 corresponds to an input port of the second deviation correcting device 25, an output port of the second deviation correcting device 25 corresponds to an input port of the first traction device 23, an output port of the first traction device 23 corresponds to an input port of the antenna hole machining mechanism 4, an output port of the antenna hole machining mechanism 4 corresponds to an input port of the combining mechanism 6, an output port of the second unwinding mechanism 7 corresponds to an input port of the combining mechanism 6, an output port of the combining mechanism 6 corresponds to an input port of the first die-cutting mechanism 27, an output port of the first die-cutting mechanism 27 corresponds to an input port of the second die-cutting mechanism 10, and an output port of the second die-cutting mechanism 10 corresponds to, meanwhile, the output port of the third unwinding mechanism 12 also corresponds to the input port of the second traction device 24, and the output port of the second traction device 24 corresponds to the input port of the finished product winding mechanism 13; in addition, the positions of the first die-cutting mechanism 27 and the second die-cutting mechanism 10 can be interchanged, the corresponding part connection modes are correspondingly adjusted, and the sequence of the working procedures of the first die-cutting mechanism 27 and the second die-cutting mechanism 10 is also interchanged, so that the production of products is not influenced, and the processing effects are the same.
As an alternative, referring to fig. 6, the first female die printing base 28 may also be replaced by a second female die printing base 29 for printing the first positioning mark 36 and the mark block by using ink on one side of the antenna layer to be processed or one side of the first substrate layer to which the antenna layer is not attached, a first exposure device 32 for exposing the first positioning mark 36 and the mark block so that the first positioning mark 36 and the mark block are formed by ink and are exposed quickly, and a third female die printing base 30 for coating an adhesive according to the shape of the antenna body on one side of the antenna layer to be processed or one side of the first substrate layer to which the antenna layer is not attached according to the mark block, wherein an output port of the first unwinding mechanism 1 corresponds to an input port of the second female die printing base 29, an output port of the second female die printing base 29 corresponds to an input port of the first exposure device 32, an output port of the first exposure device 32 corresponds to an input port of the third female die printing base 30, the output port of the third female die printing seat 30 corresponds to the input port of the drying mechanism 3, and the subsequent components and the connection relationship thereof are the same as those in the above scheme and are not described again. The first positioning mark 36 and the mark block are formed by concave groove part concave die printing of the second concave die printing seat 29, the concave groove part of the second concave die printing seat 29 is used for installing ink, preferably UV ink, the shape of the concave groove part is matched with the second positioning mark 36 and the shape of the antenna body, namely, the shape of each concave groove part is the shape of the second positioning mark 36 and the shape of the antenna body to be cut, the UV ink is printed in the shape, a plurality of concave groove parts can be simultaneously arranged, concave die printing of the second positioning mark 36 and the mark blocks is simultaneously realized, the mark block and the paste block 38 are formed, namely, the paste block 38 is formed after the paste agent 19 is printed or coated on the mark block, and the convenience and the adhesive saving are realized. The marker blocks are not shown in the drawings.
The groove portion of the third female die printing seat 30 is used for installing an adhesive, the shape of the groove portion is matched with the shape of the antenna body, namely, the shape of each groove portion is the shape of the antenna body to be cut, the adhesive is printed according to the shape, a plurality of groove portions can be arranged simultaneously, female die printing of a plurality of bonding blocks 38 is achieved, and the adhesive is convenient to use and is saved.
The mark block can be formed by peripheral lines matched with the shape of the antenna body, or the mark block is a color block area printed according to the shape of the antenna body, and the color block area has the same shape as the antenna body.
In addition, in the alternative, the positions of the first die-cutting mechanism 27 and the second die-cutting mechanism 10 can be interchanged, the corresponding component connection modes are adjusted correspondingly, and the process sequences of the first die-cutting mechanism 27 and the second die-cutting mechanism 10 are also interchanged, so that the product production is not influenced, and the processing effects are the same.
The first die-cutting mechanism 27 is a flat-press die-cutting mechanism, and the flat-press die-cutting mechanism is a flat-press die-cutting machine comprising at least one die-cutting cutter for flat-press die-cutting the chip binding and positioning points 14 and 15;
or the first die-cutting mechanism 27 is composed of a circular knife die-cutting mechanism, and the circular knife die-cutting mechanism is a circular knife die-cutting machine comprising at least one rolling cutter for die-cutting the chip binding positioning points 14 and the chip binding points 15 by the circular knife;
or the first die cutting mechanism 27 is a mixed die cutting mechanism formed by mixing a flat-pressing die cutting mechanism and a circular cutter die cutting mechanism, and the mixed die cutting mechanism is a mixed die cutting machine comprising at least one die cutting cutter for flat-pressing die cutting chip binding and positioning points 14 or chip binding and positioning points 15 and at least one hob cutter for circular cutter die cutting chip binding and positioning points 14 or chip binding and positioning points 15;
the second die-cutting mechanism 10 is a flat-pressing die-cutting machine for flat-pressing the peripheral edge of the die-cutting antenna body 17, or a circular knife die-cutting machine for circular knife die-cutting the peripheral edge of the die-cutting antenna body 17;
the antenna hole processing mechanism 4 is a flat-pressing die-cutting machine for flat-pressing die-cutting the antenna hole 16, or the antenna hole processing mechanism is a circular knife die-cutting machine for circular knife die-cutting the antenna hole 16.
That is to say, the first die cutting mechanism 27, the second die cutting mechanism 10 and the antenna hole processing mechanism 4 can select the flat-pressing die cutting mechanism and/or the circular cutter die cutting mechanism according to the actual requirement to realize the die cutting process, so as to meet the requirements of the full-die-cut ultrahigh frequency electronic tag antenna on the die cutting process, in particular the requirements of the chip binding positioning points 14, the chip binding points 15, the peripheral edge of the antenna body 17 and the antenna hole 16 on the die cutting process.
The processing steps of the two schemes in the embodiment 1 are as follows:
the method comprises the following steps: the antenna layer to be processed or the antenna layer of the composite first base material layer of the first unreeling mechanism 1 is unreeled to a first female die printing seat 28, a bonding agent with a color is coated on one side of the antenna layer to be processed or one side of the antenna layer of the composite first base material layer, which is not bonded with the antenna layer, of the first base material layer according to the shape of an antenna body by the first female die printing seat 28, a first positioning mark 36 is synchronously printed near a bonding block 38 correspondingly coated according to the shape of the antenna body, then the antenna layer coated with the bonding agent or the antenna layer of the composite first base material layer coated with the bonding agent is sent to a drying mechanism by the first female die printing seat 28, and the antenna layer coated with the bonding agent or the antenna layer of the composite first base material layer is dried by the drying mechanism;
or the antenna layer to be processed or the antenna layer compounded with the first substrate layer of the first unreeling mechanism 1 is unreeled to the second female die printing seat 29, the first positioning mark 36 and the mark block are printed by ink on one side of the antenna layer to be processed or one side of the first substrate layer which is not adhered with the antenna layer through the second female die printing seat 29, then the first positioning mark 36 and the mark block are exposed through the first exposure device 32, so that the first positioning mark 36 and the mark block formed by the ink are quickly exposed, then, an adhesive is coated on one side of the antenna layer to be processed or one side of the first base material layer, which is not adhered with the antenna layer, according to the shape of the antenna body by the third concave die printing seat 30 according to the mark blocks, the antenna layer coated with the adhesive or the antenna layer of the composite first base material layer coated with the adhesive is sent to the drying mechanism 3 by the third concave die printing seat 30, and the antenna layer coated with the adhesive or the antenna layer of the composite first base material layer is dried by the drying mechanism 3.
Step two: the dried antenna layer or the antenna layer compounded with the first base material layer is sent to a deviation correcting device 25, the dried antenna layer or the antenna layer compounded with the first base material layer is subjected to reference positioning by using a second deviation correcting device 25, and the transferring direction of the antenna layer or the antenna layer compounded with the first base material layer is corrected and/or calibrated;
step three: the antenna layer rectified by the second rectifying device 25 or the antenna layer compounded with the first base material layer is sent to the first traction device 23, and the first traction device 23 is used for assisting the antenna layer or the antenna layer compounded with the first base material layer to be transmitted; the first traction device 23 and the second traction device 24 are used for acting together, so that the transmission speed of the antenna layer or the antenna layer compounded with the first base material layer is controlled, the tension of the antenna layer or the antenna layer compounded with the first base material layer in the transmission process is stable, and each die-cutting sleeve position is accurate;
step four: the antenna layer passing through the first traction device 23 or the antenna layer compounded with the first base material layer is sent to the antenna hole machining mechanism 4 for antenna hole 16 punching, and the antenna hole machining mechanism 4 performs antenna hole 16 punching on the antenna layer or the antenna layer compounded with the first base material layer;
step five: the antenna layer after the antenna hole 16 is punched or the antenna layer of the composite first base material layer after the antenna hole 16 is punched is composited with a second base material layer of a second unreeling mechanism 7 through a compositing mechanism 6, namely the second base material layer is bonded with the antenna layer or the first base material layer through an adhesive;
step six: the antenna layer after the second substrate layer is compounded is subjected to flat pressing die cutting and/or circular knife die cutting on the antenna of the antenna layer through the first die cutting mechanism 27 to form a chip binding point 15 and a chip binding positioning point 14, then the antenna at the periphery of the antenna body 17 of the antenna layer is subjected to flat pressing die cutting and/or circular knife die cutting through the second die cutting mechanism 10 to form the outer contour of the antenna body 17, then the preliminarily formed antenna body 17 and the residual waste material antenna are formed on the second substrate layer, and the residual waste material antenna is rolled and discharged through the first waste discharge rolling mechanism 11;
or the antenna layer after the second substrate layer and the first substrate layer are compounded is subjected to flat pressing die cutting and/or circular knife die cutting simultaneously by the first die cutting mechanism 27 to form the chip binding point 15 and the chip binding positioning point 14, then the antenna and the first substrate layer at the periphery of the antenna layer antenna body 17 compounded with the first substrate layer are subjected to die cutting and/or roll cutting simultaneously by the second die cutting mechanism 10 to form the outline of the antenna body 17, then the antenna body 17 of the preliminarily molded compounded first substrate layer, the residual waste antenna and the corresponding residual waste first substrate layer are formed on the second substrate layer, and the residual waste antenna and the corresponding residual waste first substrate layer are wound and discharged through the first waste discharge winding mechanism 11;
in the sixth step, the processing sequence of the first die-cutting mechanism 27 and the second die-cutting mechanism 10 can be changed, and the final product obtained by processing is not affected. The replaced alternative scheme is that the antenna layer is formed after a second substrate layer is compounded, flat-pressing die cutting and/or circular knife die cutting are carried out on the antennas at the periphery of the antenna body 17 of the antenna layer through the second die cutting mechanism 10 to form the outer contour of the antenna body 17, flat-pressing die cutting and/or circular knife die cutting are carried out on the antennas of the antenna layer through the first die cutting mechanism 27 to form the chip binding points 15 and the chip binding positioning points 14, then the antenna body 17 and the residual waste antennas which are formed preliminarily are formed on the second substrate layer, and the residual waste antennas are wound and discharged through the first waste discharging winding mechanism 11; or compound second substrate layer and the antenna layer of first substrate layer, carry out concora crush cross cutting and/or circular knife cross cutting to antenna and the outline that antenna body 17 all around edge corresponds of antenna layer through second die cutting mechanism 10 earlier simultaneously, carry out concora crush cross cutting and/or circular knife cross cutting to antenna and the first substrate layer of antenna layer simultaneously through first die cutting mechanism 27 again and form chip binding point 15, after chip binding setpoint 14, then form the antenna body 17 of the compound first substrate layer of primary forming on the second substrate layer, and surplus waste material antenna and correspond the first substrate layer of surplus waste material, it is useless with surplus waste material antenna and the first substrate layer rolling of corresponding surplus waste material to arrange useless through first row useless winding mechanism 11.
Step seven: after the antenna is wound and exhausted by the first waste-exhausting winding mechanism 11, the isolation layer is unwound by the third unwinding mechanism 12, so that the isolation layer is covered on the antenna of the antenna body 17 which is preliminarily molded or the first base material layer;
step eight: the antenna body 17 covering the isolation layer is sent to the second traction device 24, and the second traction device 24 helps the antenna body 17 covering the isolation layer to be sent to the finished product winding mechanism 13 by the aid of the second traction device 24, and the finished product winding mechanism 13 winds the antenna body to form a die-cut ultrahigh frequency electronic tag antenna finished product.
When the ultrahigh frequency electronic tag antenna of full cross cutting does not have first substrate layer in the course of working, directly adopt antenna layer to add first die print seat 28 or third die print seat 30 and at one side coating adhesive 19 of antenna layer man-hour, bind setpoint 14 and chip binding point 15 to the chip as first die cutting mechanism and carry out the cross cutting, second die cutting mechanism 10 carries out the cross cutting to the edge all around of antenna body 17, antenna hole processing mechanism 4 all only carries out the cross cutting to the antenna layer when carrying out the cross cutting to antenna hole 16, but does not carry out the cross cutting to the second substrate layer. The adhesive 19 printed or coated on the first female die printing seat 28 or the third female die printing seat 30 is used for combining the antenna layer and the second substrate layer together through the combining mechanism 7, that is, the antenna layer and the second substrate layer are bonded together by the adhesive 19. The finished product of the fully die-cut ultrahigh frequency electronic tag antenna produced on the premise is formed by sequentially bonding an antenna layer (namely an aluminum foil 18) and an antenna layer with a second substrate layer (namely paper 20) from top to bottom through an adhesive 19 printed or coated on a first female die printing seat 28 or a third female die printing seat 30, and the details are shown in the attached drawing 2.
When the fully die-cut ultrahigh frequency electronic tag antenna is processed, the first substrate layer can be optionally added, or the first substrate layer can be omitted. Preferably adopt first substrate layer, first substrate layer is used for supporting the antenna on the antenna layer, in antenna layer course of working, first substrate layer carries out guard action to the antenna, first die print seat 28 or third die print seat 30 do not paste the one side coating adhesive on antenna layer at first substrate layer this moment, bind setpoint 14 and chip binding point 15 to the chip and carry out the cross cutting when first die-cutting mechanism, second die-cutting mechanism 10 carries out the cross cutting to antenna body 17's all edges all around, antenna hole processing mechanism 4 all can carry out the cross cutting simultaneously with first substrate layer and antenna layer when carrying out the cross cutting to antenna hole 16, but do not carry out the cross cutting to the second substrate layer. The adhesive 19 printed or coated by the first female die printing seat 28 or the third female die printing seat 30 is used for combining the first substrate layer and the second substrate layer together through the combining mechanism 6, namely, the first substrate layer and the second substrate layer are bonded together by using the adhesive 19. The fully die-cut finished ultrahigh frequency electronic tag antenna product produced under the condition is characterized in that an antenna layer (namely, an aluminum foil 18) and an antenna layer pasting composite first substrate layer (namely, a PET layer 21, here pasting composite means that the PET layer 21 pre-compounds the PET layer 21 and the aluminum foil 18 through a bonding agent 22 for pre-compounding and pasting the PET layer 21 and the aluminum foil 18, then the antenna layer compounding the first substrate layer is placed and rolled into a first concave die printing seat 28 or a second concave die printing seat 29 and a third concave die printing seat 30 through a first unwinding mechanism 1), the first substrate layer (namely, the PET layer 21) is pasted and compounded with a second substrate layer (namely, paper 20) through a bonding agent 19 printed or coated by the first concave die printing seat 28 or the third concave die printing seat 30, and detailed picture 3 is shown.
The second deviation correcting device 25 is used for correcting the position and calibrating the position of the antenna layer or the antenna layer of the composite first base material layer coming out of the drying mechanism 3 when the antenna layer or the antenna layer of the composite first base material layer moves forwards (namely, in the transportation process or the moving process), especially, when a side position error or a side position deviation occurs in the antenna layer or the antenna layer of the composite first base material layer, the second deviation correcting device 25 plays a role in correcting, namely, the second deviation correcting device 25 performs reference positioning on the antenna layer or the antenna layer of the composite first base material layer coming out of the drying mechanism 3, corrects the moving direction of the antenna layer or the antenna layer of the composite first base material layer, ensures that the advancing direction and the positions of two sides are accurate when the antenna layer or the antenna layer of the composite first base material layer enter the first traction device 23, and helps to promote and/or ensure the. Or if the antenna layer or the antenna layer of the composite first substrate layer shifts in the antenna moving and transmitting position of the dried antenna layer or the antenna of the composite first substrate layer caused by thermal expansion in the drying mechanism, the second deviation correcting device 25 can also perform the functions of position correction and position calibration.
The composite mechanism 9 is also provided with a heating drum for heating the adhesive, the adhesive is heated to facilitate the adhesion between the second substrate layer and one side surface of the first substrate layer which is not adhered with the antenna layer, and the composite adhesion function of the second substrate layer and the first substrate layer can be better realized after the composite mechanism 6 passes through; the compound mechanism 6 comprises a rubber roller for compounding the second substrate layer with the antenna layer or a rubber roller for compounding the second substrate layer with the antenna layer of the compound first substrate layer.
When the antenna layer of the first substrate layer is dried by the drying mechanism 2 and then punched in the antenna hole machining mechanism 4, the adhesive 19 printed or coated on the first concave die printing seat 28 or the third concave die printing seat 30 cannot affect punching, so that punching operation of the antenna hole is facilitated.
In this embodiment 1, the processing apparatus and the processing method for the composite and multi-station printing full-die-cutting ultrahigh frequency tag antenna can precisely coat the adhesive according to the shape of the antenna body (the shape of the antenna body is not limited to that shown in fig. 1, and other shapes can be designed according to the actual needs of the ultrahigh frequency tag, as long as the work requirements of the ultrahigh frequency tag are met) to form the adhesive block 38, and the other parts not forming the antenna body can not coat the adhesive, so that the waste of the adhesive is effectively avoided, and the production cost is saved; in addition, the accuracy of respective processing of the antenna hole processing mechanism 4, the fourth male die printing seat 31, the first module mechanism 27 and the second module mechanism 10 can be effectively improved by printing the first positioning mark 36.
Referring to fig. 7 and 8, in embodiment 2, embodiment 2 provides a composite and multi-station printing full-die-cutting ultrahigh frequency tag antenna processing device, and embodiment 2 differs from embodiment 1 in that: a first deviation correcting device 34 is additionally arranged between the first unwinding mechanism 1 and the first female die printing seat 28 (see fig. 7) or between the first unwinding mechanism 1 and the second female die printing seat 29 (see fig. 8), the antenna layer unwound by the first unwinding mechanism 1 or the antenna layer of the composite first base material layer is subjected to reference positioning by the first deviation correcting device 34, the transfer direction of the antenna layer or the antenna layer of the composite first base material layer is corrected and/or calibrated, and the antenna layer or the antenna layer of the composite first base material layer can be more accurately printed with the first positioning mark 36 and the adhesive 19 can be coated according to the shape of the antenna body by the subsequent first female die printing seat 28, the second female die printing seat 29 and the third female die printing seat 30.
At this time, the output port of the first unwinding mechanism 1 corresponds to the input port of the first deviation correcting device 34, and the output port of the first deviation correcting device 34 corresponds to the input port of the first female die printing seat 28 or the input port of the second female die printing seat 29. In the first step of the processing step, the antenna layer to be processed or the antenna layer to be combined with the first substrate layer is also adjusted to be the antenna layer to be processed of the first unwinding mechanism 1 and is unreeled to the first deviation correcting device 34, after the first deviation correcting device corrects the deviation of the antenna layer to be processed or the antenna layer to be combined with the first substrate layer, the antenna layer to be processed or the antenna layer to be combined with the first substrate layer is moved to the first female die printing seat 28 or the second female die printing seat 29, and subsequent processing is performed, the subsequent processing step is the same as the processing step in embodiment 1, and repeated description is omitted here.
Referring to fig. 9 and 10, in embodiment 3, embodiment 3 provides a composite and multi-station printing full-die-cutting uhf tag antenna processing apparatus, and embodiment 3 differs from embodiment 2 in that: when the second die-cutting mechanism 10 is positioned behind the first die-cutting mechanism 27, a fourth male die printing seat 31 and a second exposure device 33 are additionally arranged between the compound mechanism 6 and the first die-cutting mechanism 27, at this time, an output port of the compound mechanism 6 corresponds to an input port of the fourth male die printing seat 31, an output port of the fourth male die printing seat 31 corresponds to an input port of the second exposure device 33, an output port of the second exposure device 33 corresponds to an input port of the first die-cutting mechanism 27, and an output port of the first die-cutting mechanism 27 corresponds to an input port of the second die-cutting mechanism 10; in the sixth step of the processing step, the antenna layer after the second substrate layer is compounded or the antenna layer after the second substrate layer and the first substrate layer are compounded is also adjusted, the fourth male die printing seat 31 prints the second positioning mark 37 by using ink, then the second positioning mark 37 is exposed by the second exposure device 33, so that the second positioning mark 37 consisting of the ink is quickly exposed and dried, and then the antenna layer is sequentially processed by the first die cutting mechanism 27 and the second die cutting mechanism 10, the other process steps are the same as the processing steps in the embodiment 2, and are not repeated here, when the first female die printing seat 28 is included, see fig. 9, and when the second female die printing seat 29 and the third female die printing seat 30 are included, see fig. 10. The second positioning mark 37 may be located on the antenna layer and/or the second substrate layer, and the second exposure device may rapidly expose and dry the ink to a plurality of second positioning marks 37 at the same time.
Both the first exposure device and the second exposure device are preferably UV lamps (i.e., ultraviolet lamps), i.e., a first UV lamp and a second UV lamp.
Alternatively, when the first die-cutting mechanism 27 is located behind the second die-cutting mechanism 10, a fourth male die printing seat 31 and a second exposure device 33 are newly added between the compound mechanism 6 and the second die-cutting mechanism 10, at this time, an output port of the compound mechanism 6 corresponds to an input port of the fourth male die printing seat 31, an output port of the fourth male die printing seat 31 corresponds to an input port of the second exposure device 33, an output port of the second exposure device 33 corresponds to an input port of the second die-cutting mechanism 10, and an output port of the second die-cutting mechanism 10 corresponds to an input port of the first die-cutting mechanism 27; in the sixth step of the processing step, the antenna layer after the second substrate layer is compounded or the antenna layer after the second substrate layer and the first substrate layer are compounded is also adjusted, the fourth male die printing base 31 prints the second positioning mark 37 by using ink, then the second positioning mark 37 is exposed by the second exposure device 33, so that the second positioning mark 37 formed by the ink is quickly exposed and dried, and then the second positioning mark is processed by the second die cutting mechanism 10 and the first die cutting mechanism 10 in sequence, other process steps are the same as the processing steps in the embodiment 2, and repeated description is not repeated here.
The second positioning mark 37 can mark the mounting position of the chip on the antenna body, and can print marks such as small crosses or small dots which are beneficial to mounting and positioning the chip for mounting and binding the chip for positioning later. Especially, when the tag antenna body is small, and the chip binding point is also small, when the chip mounting and positioning are inaccurate by using the chip binding point, the chip mounting position is calibrated simultaneously through the second positioning mark 37, so that the chip can be accurately mounted on a specified position, the chip mounting accuracy is improved, and the product quality is improved.
Referring to fig. 11 and 12, embodiment 4 provides a composite and multi-station printing full-die-cutting uhf tag antenna processing apparatus, and embodiment 4 differs from embodiment 3 in that: a second waste discharging and rolling mechanism 26 is additionally arranged behind the first die cutting mechanism 27, namely, the output port of the first die cutting mechanism 27 corresponds to the input port of the second waste discharging and rolling mechanism 26 and the input port of the second die cutting mechanism 10, the output port of the second die cutting mechanism corresponds to the input ports of the first waste discharging and rolling mechanism 11 and the second traction device 24, at the moment, the first die cutting mechanism 27 is used for binding two chip binding points 15 and chip binding positioning points 14, and simultaneously carrying out flat-pressing die cutting or circular-knife die cutting on redundant antennas or first substrate layers at two sides of the antenna layer and redundant antennas and redundant first substrate layers at two sides of the antenna layer, so as to form two-side residual antenna waste materials or two-side residual antenna waste materials and first substrate waste materials, carrying out flat-pressing die cutting and/or circular-knife die cutting on the antennas at the four edges of the antenna body 17 of the antenna layer through the second waste discharging and rolling mechanism 26, and carrying out flat-pressing die cutting and/or circular-knife die cutting on the antennas at the four edges of The outline of antenna body 17 then forms preliminary fashioned antenna body 17 and surplus waste material antenna on the second substrate layer, and the coiling of surplus waste material antenna is wasted discharge through first exhaust winding mechanism 11. At this time, the other process steps are the same as those in embodiment 3, and are not repeated herein, and refer to fig. 11 when the first female die printing seat 28 is included, and refer to fig. 12 when the second female die printing seat 29 and the third female die printing seat 30 are included.
The second waste discharge and waste discharge winding mechanism 26 can improve the whole waste discharge and winding effect, the waste discharge is cleaner, the product percent of pass is higher, the pressure of the first waste discharge winding mechanism is dispersed, and the probability of the first waste discharge winding mechanism in the interruption work is reduced.
Referring to fig. 13 to 18, embodiment 5 provides a device for processing a composite and multi-station printed full-die-cut uhf tag antenna, and the difference between embodiment 5 and embodiment 4 is that:
the first die-cutting mechanism 27 includes a first flat die-cutting machine for performing flat-pressing die-cutting on one of the chip binding points 15, and simultaneously performing flat-pressing die-cutting on the redundant antenna on both sides of the antenna layer or the redundant antenna on both sides of the first substrate layer and the redundant first substrate layer and a first circular knife die-cutting machine for performing circular knife die-cutting (i.e., reference numeral 8 in fig. 15 and 16), and a second flat die-cutting machine for performing flat-pressing die-cutting on the other chip binding point 15 and the chip binding point 14 or a second circular knife die-cutting machine for performing circular knife die-cutting (i.e., reference numeral 9 in fig. 15 and 16); the input port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the output port of the second exposure device 33, the output port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the input port of the second waste discharging and winding mechanism 26 and the input port of the second flat die-cutting machine or the second circular knife die-cutting machine, and the output port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the input port of the second die-cutting mechanism 10, and at this time, the other process steps are the same as the processing steps in embodiment 4, and are not repeated here, when the first concave die printing seat 28 is included, refer to fig. 15, and when the second concave die printing seat 29 and the third concave die printing seat 30 are included; of course, the positions of the first flat die cutting machine or the first circular knife die cutting machine for performing flat pressing die cutting on one of the chip binding points 15, the redundant antennas on two sides of the antenna layer or the redundant antennas on the first substrate layer and the redundant antennas on two sides of the antenna layer and the redundant first substrate layer, and the second flat die cutting machine or the second circular knife die cutting machine for performing flat pressing die cutting on the other of the chip binding points 15 and the chip binding points 14 can be interchanged without affecting the product processing.
Or, the first die-cutting mechanism 27 includes a first flat die-cutting machine for performing flat-pressing die-cutting on one of the chip binding points 15 or a first circular knife die-cutting machine for performing circular knife die-cutting (i.e. the identification number 8 in fig. 17 and fig. 18), and a second flat die-cutting machine for performing flat-pressing die-cutting on another chip binding point 15 and a chip binding positioning point 14, and simultaneously performing flat-pressing die-cutting on the redundant antenna on both sides of the antenna layer or the redundant antenna on both sides of the first substrate layer and the redundant first substrate layer, or a second circular knife die-cutting machine for performing circular knife die-cutting (i.e. the identification number 9 in fig. 17 and fig. 18), an input port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to an output port of the second exposure device 33, an output port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to an input port of the second, the output port of the first flat die cutting machine or the first circular knife die cutting machine corresponds to the input port of the second die cutting mechanism 10, and at this time, the other process steps are the same as the processing steps in embodiment 4, and are not repeated herein, and reference is made to fig. 17 when the first concave die printing seat 28 is included, and reference is made to fig. 18 when the second concave die printing seat 29 and the third concave die printing seat 30 are included; in the scheme, a first flat die cutting machine for carrying out flat die cutting on one of the chip binding points 15 or a first circular knife die cutting machine for carrying out circular knife die cutting and a second flat die cutting machine for carrying out flat die cutting on redundant antennas on two sides of an antenna layer or redundant antennas on two sides of a first substrate layer and an antenna layer and redundant first substrate layers or a second circular knife die cutting machine for carrying out circular knife die cutting can be exchanged at the same time, and the processing of a product is not influenced.
Alternatively, the first die cutting mechanism 27 may be divided into a flat die cutting machine for performing flat die cutting on one of the chip binding points 15 or a circular knife die cutting machine 8 for performing circular knife die cutting, a flat die cutting machine for performing flat die cutting on the other of the chip binding points 15 and the chip binding positioning points 14 or a circular knife die cutting machine 9 for performing circular knife die cutting, and at this time, the output port of the second exposure device 33 corresponds to the input port of the flat die cutting machine for performing flat die cutting on one of the chip binding points 15 or the circular knife die cutting machine 8 for performing circular knife die cutting, and the output port of the flat die cutting machine for performing flat die cutting on one of the chip binding points 15 or the circular knife 8 for performing circular knife die cutting corresponds to the input port of the flat die cutting machine for performing flat die cutting on the other of the chip binding points 15 and the chip binding positioning points 14 or the circular knife 9 for performing circular knife die cutting, an output port of a flat die cutting machine for performing flat die cutting on another chip binding point 15 and a chip binding positioning point 14 or an output port of a circular knife die cutting machine 9 for performing circular knife die cutting corresponds to an input port of the second die cutting mechanism 10, and at this time, a second waste discharge winding mechanism 26 is not included, and other process steps are the same as the processing steps in embodiment 3, and are not repeated herein, and when a first female die printing seat 28 is included, refer to fig. 13, and when a second female die printing seat 29 and a third female die printing seat 30 are included, refer to fig. 14; of course, the positions of the flat-die cutting machine used for performing flat-die cutting on one of the chip binding points 15 or the circular knife cutting machine 8 used for performing circular knife cutting, and the flat-die cutting machine used for performing flat-die cutting on the other of the chip binding points 15 and the chip binding points 14 or the circular knife cutting machine 9 used for performing circular knife cutting can be interchanged without affecting the processing of the tag antenna.
The processing equipment also comprises an antenna hole waste material collecting device 5 which is used for collecting waste material antennas generated after the antenna hole processing mechanism 4 punches the antenna holes or waste material antennas generated after the antenna holes punch the antenna holes and a waste material first base material layer; the antenna hole waste collecting device 5 is positioned below the antenna hole machining mechanism 4; when antenna hole 16 punches to the antenna layer of antenna layer or compound first substrate layer of antenna hole processing agency 4, be the antenna layer cross cutting that directly runs through antenna layer or compound first substrate layer, the waste material antenna or the waste material antenna and the first substrate layer of waste material of the corresponding antenna hole after punching get into in the lump or fall into garbage collection device 5, and garbage collection device 5 preferred setting is under antenna hole processing agency 4 bottoms.
The antenna hole processing mechanism 4 is used for punching the antenna hole 16 in the antenna layer by adopting a flat pressing die cutting process or a circular knife die cutting process.
The temperature range of the drying mechanism 3 is 40-160 ℃, which helps the adhesive to be dried, and is convenient for punching the antenna hole 16 of the antenna layer.
The antenna layer after the antenna hole 16 is punched or the antenna layer of the composite first base material layer is in the process of compounding the second base material layer unreeled by the compounding mechanism 6 and the second unreeling mechanism 7, the heating drum of the compounding mechanism 6 synchronously heats the adhesive on the antenna layer, and the second base material layer is compounded with the antenna layer or compounded with the antenna layer of the composite first base material layer by using the glue stick.
The first concave die printing seat 28 or the third concave die printing seat 30 is used for being coated on the antenna layer or the adhesive 19 on the first substrate layer and contains a diluting solvent, and the diluting solvent can dilute the adhesive 19 coated on the first concave die printing seat 28 or the third concave die printing seat 30, so that the requirement of full-die-cutting ultrahigh frequency electronic tag antenna processing is met.
Of course, the first die-cutting mechanism 27 may also perform two or more times of flat-pressing die cutting and/or circular-knife die cutting on the antenna of the antenna layer or the antenna layer and the first substrate layer of the composite first substrate layer to form the chip binding points 15 and the chip binding positioning points 14 as required by actual conditions. Although the operation is more complicated and the steps are more various, the processing precision can be improved, and the product quality is improved.
In specific embodiment 6, embodiment 5 provides a processing apparatus for a composite and multi-station printing full-die-cutting ultrahigh frequency tag antenna, and the difference between embodiment 5 and the above embodiments is as follows: the first die-cutting mechanism performs one-time flat pressing die cutting and/or circular knife die cutting on the antenna of the antenna layer or the antenna of the antenna layer and the first substrate layer of the composite first substrate layer to form a chip binding point 15 and a chip binding positioning point 14. The chip binding points 15 and the chip binding positioning points 14 are formed by one-time die cutting, so that the accuracy is high, and the processing efficiency is high.
In specific embodiment 7, embodiment 6 provides a device for processing a composite and multi-station printed full-die-cut ultrahigh frequency tag antenna, and the difference between embodiment 6 and the above embodiments is as follows: the first die cutting mechanism 27 for die cutting the chip binding positioning points 14 and the chip binding points 15 and the second die cutting mechanism 10 for die cutting the peripheral edge of the antenna body 17 are combined into a flat press die cutting machine or a circular knife die cutting machine.
That is, the first die cutting mechanism 27 and the second die cutting mechanism 10 are combined into a flat press die cutting machine or a circular knife die cutting machine, and can perform operations of forming the outer contour of the antenna body 17 by performing flat press die cutting and/or circular knife die cutting on the antenna at the peripheral edge of the antenna body 17 of the antenna layer at one time, for example, the flat press die cutting machine is replaced by the circular knife die cutting machine, and similar operations are performed to perform the operations of performing the flat press die cutting and/or circular knife die cutting on the antenna layer at one time to form the chip bonding point 15, the chip bonding positioning point 14 and the outer contour of the antenna body 17, that is, the die cutting tool of the flat press die cutting machine performs the die cutting and forming of the chip bonding point 15, the chip bonding positioning point 14 and the outer contour of the antenna body 17 on the antenna layer at one time, for example, the thickness of the blade of the die cutting tool is controlled, the die cutting tool can form a tool die according to the shape requirements of the chip binding points 15, the chip binding positioning points 14 and the outer contour of the antenna body 17, and further achieve the purpose of performing one-time die cutting forming on the chip binding points 15, the chip binding positioning points 14 and the outer contour of the antenna body 17, for example, the die cutting of the chip binding points 15, the chip binding positioning points 14 and the outer contour of the antenna body 17 is achieved by the fact that adjacent blades are parallel or the blades have a certain inclination angle, and the die cutting tool is particularly suitable for the situation that the distance between the chip binding points 15 and the chip binding positioning points 14 and/or between the adjacent chip binding points 15 and/or between the adjacent chip binding positioning points 14 is small.
At this time, the antenna layer of the composite second substrate layer or the antenna layer of the composite second substrate layer and the antenna layer of the first substrate layer in the sixth step enter the input port of the flat-pressing die-cutting machine or the circular knife die-cutting machine combined by the first die-cutting mechanism and the second die-cutting mechanism 10, and the output port of the flat-pressing die-cutting machine or the circular knife die-cutting machine corresponds to the input port of the first waste-discharging winding mechanism 11 and the input port of the first traction device 24 to the antenna layer of the composite second substrate layer or the antenna layer of the composite first substrate layer and the antenna layer of the second substrate layer after being processed by the flat-pressing die-cutting and/or the circular knife die-cutting, wherein the waste antennas and the first waste substrate layer after being processed by the flat-pressing die-cutting and/or the circular knife die-cutting are discharged and wound by the first waste. This embodiment 6, machining efficiency is higher, and the outline of chip binding point 15, chip binding setpoint 14 and antenna body 17 is once only die-cut shaping, and the accuracy is higher.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (18)
1. A processing device for a composite and multi-station printing full-die-cutting ultrahigh frequency label antenna relates to that a chip binding positioning point (14) formed by a die cutting mode and a chip binding point (15) formed by the die cutting mode are arranged on an antenna body (17) of the ultrahigh frequency label antenna; antenna layer one side of antenna body (17) still pastes second substrate layer or first substrate layer and second substrate layer, its characterized in that: the processing equipment for the composite and multi-station printing full-die-cutting ultrahigh frequency label antenna comprises a die-cutting mechanism and a printing mechanism, wherein the die-cutting mechanism is used for performing die cutting on chip binding positioning points (14) and chip binding points (15) of the ultrahigh frequency label antenna and the peripheral edge of the ultrahigh frequency label antenna, and the printing mechanism is used for coating an adhesive on one side of an antenna layer to be processed or one side of a first base material layer which is not adhered with the antenna layer according to the shape of an antenna body.
2. The apparatus of claim 1 for processing a composite and multi-station printed full-die-cut UHF tag antenna, wherein: the printing mechanism comprises a first female die printing seat (28) which is used for coating adhesive with colors on one side of the antenna layer to be processed or one side of the first substrate layer which is not adhered with the antenna layer according to the shape of the antenna body and synchronously printing a first positioning mark (36) near a bonding block (38) coated according to the shape of the antenna body;
or the printing mechanism comprises a second female die printing seat (29) for printing a first positioning mark (36) and a mark block by ink on one side of the antenna layer to be processed or on one side of the first base material layer which is not adhered with the antenna layer, a first exposure device (32) for exposing the first positioning mark (36) and the mark block to enable the first positioning mark (36) and the mark block to be quickly exposed and dried, and a third female die printing seat (30) for coating an adhesive according to the shape of the antenna body on one side of the antenna layer to be processed or on one side of the first base material layer which is not adhered with the antenna layer according to the mark block.
3. The apparatus of claim 2 for processing a composite and multi-station printed full-die-cut UHF tag antenna, wherein: the die cutting mechanism comprises a first die cutting mechanism (27) used for die cutting the chip binding positioning points (14) and the chip binding points (15) of the ultrahigh frequency tag antenna and a second die cutting mechanism (10) used for die cutting the peripheral edge of the ultrahigh frequency tag antenna.
4. The apparatus of claim 3 for processing a composite and multi-station printed full-die-cut UHF tag antenna, wherein: the processing equipment for the full-die-cutting ultrahigh frequency label antenna for the composite and multi-station printing further comprises an antenna hole processing mechanism (4) for die-cutting an antenna hole (16) of the ultrahigh frequency label antenna, a composite mechanism (6) for compounding a second base material layer and the antenna layer or compounding the second base material layer and a first base material layer pasted with the antenna layer, a first waste discharge winding mechanism (11) for winding the waste antenna processed by the first die-cutting mechanism (27) and the second die-cutting mechanism (10) or winding the waste antenna processed by the first die-cutting mechanism (27) and the second die-cutting mechanism (10) and the waste first base material layer, and a third unwinding mechanism (12) for unwinding an isolation layer on the antenna layer or the second base material layer;
an input port of the first female die printing seat (28) inputs an antenna layer to be processed or an antenna layer adhered with a first base material layer, an output port of the first female die printing seat (28) corresponds to an input port of the antenna hole processing mechanism (4), an output port of the antenna hole processing mechanism (4) corresponds to an input port of the combining mechanism (6), an output port of the combining mechanism (6) corresponds to an input port of the first die cutting mechanism (27), an output port of the first die cutting mechanism (27) corresponds to an input port of the second die cutting mechanism (10), and an output port of the second die cutting mechanism (10) corresponds to an input port of the first waste discharging winding mechanism (11) and an output port of the third unwinding mechanism (12);
or the input port of the first female die printing seat (28) inputs an antenna layer to be processed or an antenna layer adhered with a first substrate layer, the output port of the first female die printing seat (28) corresponds to the input port of the antenna hole processing mechanism (4), the output port of the antenna hole processing mechanism (4) corresponds to the input port of the combining mechanism (6), the output port of the combining mechanism (6) corresponds to the input port of the second die cutting mechanism (10), the output port of the second die cutting mechanism (10) corresponds to the input port of the first die cutting mechanism (27), and the output port of the first die cutting mechanism (27) corresponds to the input port of the first waste discharging winding mechanism (11) and the output port of the third unwinding mechanism (12);
or the input port of the second female die printing seat (29) inputs an antenna layer to be processed or an antenna layer adhered with a first substrate layer, the output port of the second female die printing seat (29) corresponds to the input port of the first exposure device (32), the output port of the first exposure device (32) corresponds to the input port of the third female die printing seat (30), the output port of the third female die printing seat (30) corresponds to the input port of the antenna hole processing mechanism (4), the output port of the antenna hole processing mechanism (4) corresponds to the input port of the composite mechanism (6), the output port of the composite mechanism (6) corresponds to the input port of the first die cutting mechanism (27), the output port of the first die cutting mechanism (27) corresponds to the input port of the second die cutting mechanism (10), and the output port of the second die cutting mechanism (10) corresponds to the input port of the first waste discharging and winding mechanism (11) and the output port of the third unwinding mechanism (12);
or the antenna layer that the antenna layer of treating processing or the antenna layer of pasting first substrate layer has been imported to the input port of second die printing seat (29), the output port of second die printing seat (29) corresponds the input port of first exposure device (32), the output port of first exposure device (32) corresponds the input port of third die printing seat (30), the output port of third die printing seat (30) corresponds the input port of antenna hole machining mechanism (4), the output port of antenna hole machining mechanism (4) corresponds the input port of combined mechanism (6), the output port of combined mechanism (6) corresponds the input port of second die cutting mechanism (10), the output port of second die cutting mechanism (10) corresponds the input port of first die cutting mechanism (27), the output port of first die cutting mechanism (27) corresponds the input port of first useless winding mechanism (11) and the output port of third unwinding mechanism (12).
5. The apparatus of claim 4 for processing a composite and multi-station printed full-die-cut UHF tag antenna, wherein: the processing equipment for the composite and multi-station printing full-die-cutting ultrahigh frequency label antenna further comprises a first deviation correcting device (34), wherein the first deviation correcting device (34) is positioned in front of the printing mechanism, namely an input port of the first deviation correcting device (34) inputs an antenna layer to be processed or an antenna layer on which a first base material layer is pasted, and an output port of the first deviation correcting device (34) corresponds to an input port of the first female die printing seat (28) or an input port of the second female die printing seat (29).
6. The apparatus of claim 5 for processing composite and multi-station printed full-die-cut UHF tag antenna, wherein: the processing equipment for the composite and multi-station printing full-die-cutting ultrahigh frequency label antenna further comprises a fourth male die printing seat (31) for printing a second positioning mark (37) on the antenna layer and/or a second substrate layer by adopting ink, and a second exposure device (33) for exposing the second positioning mark (37) to enable the second positioning mark (37) consisting of the ink to be quickly exposed, wherein the second positioning mark (37) is used for positioning the chip during chip installation and/or binding;
the output port of the compound mechanism corresponds to the input port of a fourth male die printing seat (31), the output port of the fourth male die printing seat (31) corresponds to the input port of a second exposure device (33), the output port of the second exposure device (33) corresponds to the input port of a first die cutting mechanism (27), the output port of the first die cutting mechanism (27) corresponds to the input port of the second die cutting mechanism, and the output port of the second die cutting mechanism (10) corresponds to the input port of a first waste discharging and winding mechanism (11) and the output port of a third unwinding mechanism (12);
or the output port of the compound mechanism corresponds to the input port of a fourth male die printing seat (31), the output port of the fourth male die printing seat (31) corresponds to the input port of a second exposure device (33), the output port of the second exposure device (33) corresponds to the input port of a second die cutting mechanism (10), the output port of the second die cutting mechanism (10) corresponds to the input port of a first die cutting mechanism (27), and the output port of the first die cutting mechanism (27) corresponds to the input port of a first waste discharging winding mechanism (11) and the output port of a third unwinding mechanism (12).
7. The apparatus of claim 6, wherein the apparatus for processing the UHF tag antenna comprises: the first die cutting mechanism (27) is a flat-press die cutting mechanism, and the flat-press die cutting mechanism is a flat-press die cutting machine comprising at least one die cutting tool for flat-press die cutting of chip binding positioning points (14) and chip binding points (15);
or the first die-cutting mechanism (27) is composed of a circular cutter die-cutting mechanism, and the circular cutter die-cutting mechanism is a circular cutter die-cutting machine comprising at least one rolling cutter for die-cutting a chip binding positioning point (14) and a chip binding point (15) by a circular cutter;
or the first die cutting mechanism (27) is a mixed die cutting mechanism formed by mixing a flat-pressing die cutting mechanism and a circular cutter die cutting mechanism, and the mixed die cutting mechanism is a mixed die cutting mechanism comprising at least one die cutting cutter used for flat-pressing die cutting chip binding positioning points (14) or chip binding points (15) and at least one hob cutter used for circular cutter die cutting chip binding points (15) or chip binding positioning points (14);
the second die cutting mechanism (10) is a flat-pressing die cutting machine for flat-pressing the peripheral edge of the die cutting antenna body (17), or is a circular knife die cutting machine for circular knife die cutting the peripheral edge of the antenna body (17);
the antenna hole processing mechanism (4) is a flat pressing die-cutting machine for flat pressing die-cutting antenna holes (16) or a circular knife die-cutting machine for circular knife die-cutting antenna holes (16).
8. The apparatus of claim 7 for processing a composite and multi-station printed full-die-cut UHF tag antenna, wherein: the first die cutting mechanism (27) used for die cutting the chip binding positioning points (14) and the chip binding points (15) and the second die cutting mechanism (10) used for die cutting the peripheral edge of the antenna body (17) are combined into a flat pressing die cutting machine or a circular knife die cutting machine.
9. The apparatus for processing a composite and multi-station printed full-die-cut UHF tag antenna as claimed in claim 8, wherein: the processing equipment for the composite and multi-station printing full-die-cutting ultrahigh frequency label antenna further comprises a first unreeling mechanism (1) for unreeling the antenna layer to be processed or the antenna layer to be processed of the composite first base material layer, a drying mechanism (3) for drying the antenna layer coated with the adhesive according to the shape of the antenna body or a drying mechanism (3) for drying the antenna layer coated with the adhesive according to the shape of the antenna body and the composite first base material layer, a second deviation correcting device (25), a first traction device (23) and a second traction device (24), the antenna layer winding mechanism comprises a second unwinding mechanism (7) for unwinding a second substrate layer, and a finished product winding mechanism (13) for winding the processed antenna layer, the second substrate layer and the isolation layer together or winding the processed antenna layer, the first substrate layer, the second substrate layer and the isolation layer together;
the output port of the first unreeling mechanism (1) corresponds to the input port of a first deviation correcting device (34), the output port of a first female die printing seat (28) or the output port of a third female die printing seat (30) corresponds to the input port of a drying mechanism (3), the output port of the drying mechanism (3) corresponds to the input port of a second deviation correcting device (25), the output port of the second deviation correcting device (25) corresponds to the input port of a first traction device (23), the output port of the first traction device (23) corresponds to the input port of an antenna hole machining mechanism (4), the output port of the antenna hole machining mechanism (4) corresponds to the input port of a composite mechanism (6), the output port of the second unreeling mechanism (7) corresponds to the input port of the composite mechanism (6), the output port of the composite mechanism (6) corresponds to the input port of a fourth male die printing seat (31), the output port of the fourth male die printing seat (31) corresponds to the input port of a second exposure device (, an output port of the second exposure device (33) corresponds to an input port of the first die cutting mechanism (27), an output port of the first die cutting mechanism (27) corresponds to an input port of the second die cutting mechanism (10), an output port of the second die cutting mechanism (10) corresponds to an input port of the first waste discharging and winding mechanism (11) and an input port of the second traction device (24), an output port of the third unwinding mechanism (12) corresponds to an input port of the second traction device (24), and an output port of the second traction device (24) corresponds to an input port of the finished product winding mechanism (13);
or the output port of the first unreeling mechanism (1) corresponds to the input port of the first deviation correcting device (34), the output port of the first female die printing seat (28) or the output port of the third female die printing seat (30) corresponds to the input port of the drying mechanism (3), the output port of the drying mechanism (3) corresponds to the input port of the second deviation correcting device (25), the output port of the second deviation correcting device (25) corresponds to the input port of the first traction device (23), the output port of the first traction device (23) corresponds to the input port of the antenna hole machining mechanism (4), the output port of the antenna hole machining mechanism (4) corresponds to the input port of the composite mechanism (6), meanwhile, the output port of the second unreeling mechanism (7) corresponds to the input port of the composite mechanism (6), the output port of the composite mechanism (6) corresponds to the input port of the fourth male die printing seat (31), the output port of the fourth male die printing seat (31) corresponds to the input port of the second exposure, the output port of the second exposure device (33) corresponds to the input port of the second die cutting mechanism (10), the output port of the second die cutting mechanism (10) corresponds to the input port of the first die cutting mechanism (27), the output port of the first die cutting mechanism (27) corresponds to the input port of the first waste discharging winding mechanism (11) and the input port of the second traction device (24), meanwhile, the output port of the third unwinding mechanism (12) corresponds to the input port of the second traction device (24), and the output port of the second traction device (24) corresponds to the input port of the finished product winding mechanism (13).
10. The apparatus of claim 9 for processing a composite and multi-station printed full-die-cut UHF tag antenna, wherein: the die cutting machine comprises two chip binding points (15), and the first die cutting mechanism (27) is divided into a flat pressing die cutting machine for carrying out flat pressing die cutting on one chip binding point (15) or a circular knife die cutting machine (8) for carrying out circular knife die cutting, and a flat pressing die cutting machine for carrying out flat pressing die cutting on the other chip binding point (15) and the chip binding point (14) or a circular knife (9) for carrying out circular knife die cutting;
the output port of the compound mechanism (6) corresponds to the input port of the fourth male die printing seat (31), the output port of the fourth male die printing seat (31) corresponds to the input port of the second exposure device (33), the output port of the second exposure device (33) corresponds to the input port of the flat-pressing die-cutting machine or the circular knife die-cutting machine (8) which is used for carrying out flat-pressing die-cutting on one of the chip binding points (15), the output port of the flat-pressing die-cutting machine or the circular knife die-cutting machine (8) which is used for carrying out flat-pressing die-cutting on one of the chip binding points (15) corresponds to the input port of the flat-pressing die-cutting machine or the circular knife die-cutting machine (9) which is used for carrying out flat-pressing die-cutting on the other chip binding point (15) and the chip binding point (14), and the output port of the circular knife die-cutting machine (9) which is used for carrying out flat-pressing die-cutting on the other chip binding point (15) and the chip binding point (14) The output port corresponds to the input port of the second die-cutting mechanism (10);
or the output port of the composite mechanism (6) corresponds to the input port of the fourth male die printing seat (31), the output port of the fourth male die printing seat (31) corresponds to the input port of the second exposure device (33), the output port of the second exposure device (33) corresponds to the input port of a flat-press die-cutting machine or a circular knife die-cutting machine (9) which is used for carrying out flat-press die-cutting on another chip binding point (15) and a chip binding positioning point (14), the output port of the flat-press die-cutting machine or the circular knife die-cutting machine (9) which is used for carrying out flat-press die-cutting on another chip binding point (15) and a chip binding positioning point (14) corresponds to the input port of the flat-press die-cutting machine or the circular knife die-cutting machine (8) which is used for carrying out flat-press die-cutting on one chip binding point (15) or the circular knife (8) which is used for carrying out circular knife die-cutting on one chip binding point (15) The output port corresponds to the input port of the second die cutting mechanism (10).
11. The apparatus of claim 10 for processing a composite and multi-station printed full-die-cut UHF tag antenna, wherein: the processing equipment also comprises a second waste discharge winding mechanism (26);
the first die-cutting mechanism (27) comprises a first flat die-cutting machine or a first circular knife die-cutting machine for carrying out flat-pressing die-cutting on one of the chip binding points (15), redundant antennas on two sides of the antenna layer or redundant antennas on two sides of the first substrate layer and redundant first substrate layers, and a second flat die-cutting machine or a second circular knife die-cutting machine for carrying out flat-pressing die-cutting on the other chip binding point (15) and the chip binding point (14); the input port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the output port of the second exposure device (33), the output port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the input port of the second waste discharging and winding mechanism (26) and the input port of the second flat die-cutting machine or the second circular knife die-cutting machine, and the output port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the input port of the second die-cutting mechanism (10);
or the first die-cutting mechanism (27) comprises a first flat die-cutting machine or a first circular knife die-cutting machine for carrying out flat-pressing die-cutting on one of the chip binding points (15), redundant antennas on two sides of the antenna layer or redundant antennas on two sides of the first substrate layer and redundant first substrate layers, and a second flat die-cutting machine or a second circular knife die-cutting machine for carrying out flat-pressing die-cutting on the other chip binding point (15) and the chip binding point (14); the input port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the output port of the second exposure device (33), the output port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the input port of the first flat die-cutting machine or the first circular knife die-cutting machine, and the output port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the input port of the second waste discharge winding mechanism (26) and the input port of the second die-cutting mechanism (10);
or the first die-cutting mechanism (27) comprises a first flat die-cutting machine for performing flat-press die-cutting on one of the chip binding points (15) or a first circular knife die-cutting machine for performing circular knife die-cutting, a second flat die-cutting machine for performing flat-press die-cutting on the other chip binding point (15) and the chip binding point (14), and a second circular knife die-cutting machine for performing circular knife die-cutting on the redundant antenna or the first substrate layer on two sides of the antenna layer, the redundant antenna and the redundant first substrate layer on two sides of the antenna layer, the input port of the first flat die cutting machine or the first circular knife die cutting machine corresponds to the output port of the second exposure device (33), the output port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the input port of the second flat die-cutting machine or the second circular knife die-cutting machine, and the output port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the input port of the second waste discharge winding mechanism (26) and the input port of the second die-cutting mechanism (10);
or the first die-cutting mechanism (27) comprises a first flat die-cutting machine for performing flat-press die-cutting on one of the chip binding points (15) or a first circular knife die-cutting machine for performing circular knife die-cutting, a second flat die-cutting machine for performing flat-press die-cutting on the other chip binding point (15) and the chip binding point (14), and a second circular knife die-cutting machine for performing circular knife die-cutting on the redundant antenna or the first substrate layer on two sides of the antenna layer, the redundant antenna and the redundant first substrate layer on two sides of the antenna layer, the input port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the output port of the second exposure device (33), the output port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the input port of the second waste discharging and winding mechanism (26) and the input port of the first flat die-cutting machine or the first circular knife die-cutting machine, and the output port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the input port of the second die-cutting mechanism (10).
12. The apparatus of claim 11, wherein the apparatus for processing the UHF tag antenna comprises: the processing equipment also comprises an antenna hole (16) and a waste material collecting device (5), wherein the antenna hole (5) is used for collecting waste material antennas generated after the antenna hole processing mechanism (4) punches or waste material antennas generated after the antenna hole punching and a waste material first base material layer; the antenna hole (16) waste collecting device (5) is positioned below the antenna hole machining mechanism (4); the compound mechanism (6) is also provided with a heating drum for heating the adhesive; the composite mechanism (6) comprises a rubber roller for compounding the second substrate layer with the antenna layer or a rubber roller for compounding the second substrate layer with the antenna layer of the first substrate layer.
13. A processing method of a composite and multi-station printing full-die-cutting ultrahigh frequency tag antenna relates to the processing equipment of the composite and multi-station printing full-die-cutting ultrahigh frequency tag antenna in claims 1 to 12, and is characterized in that: the processing method comprises the steps of coating an adhesive on one side of an antenna layer to be processed or one side of a first substrate layer, which is not adhered with the antenna layer, according to the shape of an antenna body by using a printing mechanism, and performing die cutting on chip binding positioning points (14) and chip binding points (15) of the ultrahigh frequency tag antenna and the peripheral edge of the ultrahigh frequency tag antenna by using a die cutting mechanism.
14. The method for processing a composite and multi-station printed full-die-cut UHF tag antenna as claimed in claim 13, wherein the method comprises the following steps: the production steps are as follows
The method comprises the following steps: the antenna layer to be processed or the antenna layer compounded with the first base material layer is unreeled to a first female die printing seat (28) by a first unreeling mechanism (1), a colored adhesive is coated on one side of the antenna layer to be processed or one side of the antenna layer compounded with the first base material layer, which is not bonded with the antenna layer, of the first base material layer according to the shape of an antenna body by the first female die printing seat (28), a first positioning mark (36) is synchronously printed near a bonding block (38) coated correspondingly according to the shape of the antenna body, then the antenna layer coated with the adhesive or the antenna layer compounded with the first base material layer coated with the adhesive is sent to a drying mechanism (3) by the first female die printing seat (28), and the antenna layer coated with the adhesive or the antenna layer compounded with the first base material layer is dried by the drying mechanism (3);
or the antenna layer to be processed or the antenna layer of the composite first substrate layer is unreeled to a second concave die printing seat (29) by a first unreeling mechanism (1), a first positioning mark (36) and a mark block are printed by ink on one side of the antenna layer to be processed or one side of the first substrate layer which is not adhered with the antenna layer by the second concave die printing seat (29), the first positioning mark (36) and the mark block are exposed by a first exposure device (32) to enable the first positioning mark (36) and the mark block to be formed by the ink to be quickly exposed and dried, then an adhesive is coated on one side of the antenna layer to be processed or one side of the first substrate layer which is not adhered with the antenna layer by the third concave die printing seat (30) according to the shape of the antenna body by the mark block, the antenna layer coated with the adhesive or the antenna layer coated with the adhesive and composited with the first substrate layer is sent to a drying mechanism (3) by the third concave die printing seat (30), drying the antenna layer coated with the adhesive or the antenna layer compounded with the first base material layer by using a drying mechanism (3);
step two: the dried antenna layer or the antenna layer compounded with the first base material layer is sent to a deviation correcting device (25), the dried antenna layer or the antenna layer compounded with the first base material layer is subjected to reference positioning by using a second deviation correcting device (25), and the transferring direction of the antenna layer or the antenna layer compounded with the first base material layer is corrected and/or calibrated;
step three: the antenna layer rectified by the second rectifying device (25) or the antenna layer compounded with the first base material layer is sent to a first traction device (23), and the first traction device (23) is utilized to help the antenna layer or the antenna layer compounded with the first base material layer to be transmitted; the first traction device (23) and the second traction device (24) are used for acting together, so that the transmission speed of the antenna layer or the antenna layer of the composite first base material layer is controlled, the tension of the antenna layer or the antenna layer of the composite first base material layer in the transmission process is stable, and each die-cutting sleeve position is accurate;
step four: the antenna layer passing through the first traction device (23) or the antenna layer compounded with the first base material layer is sent to an antenna hole machining mechanism (4) to be punched, and the antenna hole machining mechanism (4) punches the antenna hole (16) in the antenna layer or the antenna layer compounded with the first base material layer;
step five: the antenna layer after the antenna hole (16) is punched or the antenna layer of the composite first base material layer after the antenna hole (16) is punched is composited with a second base material layer of a second unreeling mechanism (7) through a compositing mechanism (6), namely the second base material layer is bonded with the antenna layer or the first base material layer through an adhesive;
step six: the antenna layer after the second substrate layer is compounded is subjected to flat pressing die cutting and/or circular knife die cutting on the antenna of the antenna layer through a first die cutting mechanism (27) to form a chip binding point (15) and a chip binding positioning point (14), then the antenna at the periphery of an antenna body (17) of the antenna layer is subjected to flat pressing die cutting and/or circular knife die cutting through a second die cutting mechanism (10) to form the outer contour of the antenna body (17), then a preliminarily formed antenna body (17) and residual waste antennas are formed on the second substrate layer, and the residual waste antennas are rolled and discharged through a first waste discharging and rolling mechanism (11);
or the antenna layer after the second substrate layer and the first substrate layer are compounded is subjected to flat pressing die cutting and/or circular knife die cutting simultaneously through the first die cutting mechanism (27) to form a chip binding point (15) and a chip binding positioning point (14), then the antenna and the first substrate layer at the periphery of the antenna layer antenna body (17) of the compounded first substrate layer are subjected to die cutting and/or roll cutting simultaneously through the second die cutting mechanism (10) to form the outer contour of the antenna body (17), then an antenna body (17) of the preliminarily formed compounded first substrate layer is formed on the second substrate layer, the residual waste material antenna and the corresponding residual waste material first substrate layer are coiled and corresponding to the residual waste material first substrate layer through the first waste material discharge coiling mechanism (11) to discharge waste materials;
or the antenna layer after compounding the second substrate layer, carry on the die cutting of the concora crush and/or circular knife die cutting to the aerial of the aerial body (17) peripheral edge of the antenna layer through the second die cutting organization (10) first and form the outline of the aerial body (17), carry on the die cutting of the concora crush and/or circular knife die cutting to the aerial of the antenna layer through the first die cutting organization (27) and form the chip and bind the fixed point (15), chip and bind the locating point (14), then form the aerial body (17) and surplus waste material aerial of the primary shaping on the second substrate layer, through the first row of waste winding mechanisms (11) the surplus waste material aerial is rolled up and exhausted;
or compounding the antenna layer of the second substrate layer and the first substrate layer, simultaneously carrying out flat pressing die cutting and/or circular knife die cutting on the antenna and the first substrate layer corresponding to the periphery of the antenna body (17) of the antenna layer by the second die cutting mechanism (10) to form the outline of the antenna body (17), then simultaneously carrying out flat pressing die cutting and/or circular knife die cutting on the antenna and the first substrate layer of the antenna layer by the first die cutting mechanism (27) to form a chip binding point (15) and a chip binding positioning point (14), then forming an antenna body (17) of a preliminarily molded compounded first substrate layer on the second substrate layer, and rolling and waste material antenna and corresponding waste material first substrate layer by the first waste material discharging and rolling mechanism (11) to discharge waste material;
or the antenna layer after the second substrate layer is compounded and the first substrate layer, a first flat die cutting machine or a first circular knife die cutting machine of a first die cutting mechanism (27) is firstly used for carrying out flat die cutting on one chip binding point (15) and simultaneously carrying out flat die cutting on redundant antennas at two sides of the antenna layer or redundant antennas at two sides of the first substrate layer and redundant first substrate layer to form residual antenna waste materials at two sides or residual antenna waste materials at two sides and first substrate waste materials, a second waste discharging and winding mechanism (26) is used for carrying out flat die cutting on the residual antenna waste materials at two sides or residual antenna waste materials at two sides and first substrate waste materials, and then a second flat die cutting machine or a second circular knife die cutting machine of the first die cutting mechanism (27) is used for carrying out flat die cutting or circular knife die cutting on another chip binding point (15) and a chip binding point (14), after the chip binding points (15) and the chip binding positioning points (14) are formed together, the antennas at the periphery of the antenna body (17) of the antenna layer or the antennas corresponding to the periphery of the antenna body (17) of the antenna layer and the first substrate layer are subjected to flat pressing die cutting and/or circular knife die cutting by the second die cutting mechanism (10) to form the outer contour of the antenna body (17), and the chip binding points (15), the chip binding positioning points (14) and the residual antenna waste materials or the residual antenna waste materials and the first substrate waste materials after the outer contour of the antenna body (17) is processed are rolled and discharged through the first waste discharging and rolling mechanism (11);
or the antenna layer after the second substrate layer is compounded and the first substrate layer is firstly subjected to flat pressing die cutting or circular knife die cutting by a first flat die cutting machine or a first circular knife die cutting machine of a first die cutting mechanism (27) to one of the chip binding points (15), then the second flat die cutting machine or the second circular knife die cutting machine of the first die cutting mechanism (27) is used for carrying out flat pressing die cutting or circular knife die cutting to the other chip binding point (15) and the chip binding point (14), and simultaneously carrying out flat pressing die cutting or circular knife die cutting on redundant antennas at two sides of the antenna layer or redundant antennas at two sides of the first substrate layer and redundant antennas at two sides of the antenna layer and the first substrate layer to jointly form the chip binding point (15), the chip binding point (14), residual antenna waste materials at two sides or residual antenna waste materials at two sides and first substrate waste materials, and the residual antenna waste materials at two sides and the first substrate material are rolled and discharged through a second waste discharging and rolling mechanism (, then, the antennas at the periphery of the antenna body (17) of the antenna layer or the antennas and the first substrate layer corresponding to the periphery of the antenna body (17) of the antenna layer are subjected to flat pressing die cutting and/or circular knife die cutting by the second die cutting mechanism (10) to form the outer contour of the antenna body (17), and the chip binding points (15), the chip binding positioning points (14) and the residual antenna waste materials or the residual antenna waste materials and the first substrate waste materials after the outer contour of the antenna body (17) is processed are rolled and discharged by the first waste discharging and rolling mechanism (11);
step seven: after being wound and exhausted by the first waste exhausting and winding mechanism (11), the isolation layer is unwound by the third unwinding mechanism (12) so that the isolation layer is covered on the antenna of the preliminarily molded antenna body (17) or the first substrate layer;
step eight: and the antenna body (17) covering the isolation layer is sent to a second traction device (24), the second traction device (24) is utilized to help the antenna body (17) covering the isolation layer to be transmitted to a finished product winding mechanism (13), and the finished product winding mechanism (13) winds the finished product to form the die-cut ultrahigh frequency electronic tag antenna finished product.
15. The method for processing a composite and multi-station printed full-die-cut UHF tag antenna according to claim 14, wherein the method comprises the following steps: in the first step, a deviation rectifying process of a first deviation rectifying device (34) is additionally arranged between the first unwinding mechanism and the first female die printing seat (28) or between the first unwinding mechanism and the second female die printing seat (29), namely, an antenna layer unwound by the first unwinding mechanism or an antenna layer compounded with a first substrate layer is subjected to reference positioning through the first deviation rectifying device (34), the transfer direction of the antenna layer is corrected and/or calibrated, and then the antenna layer is sent to an input port of the first female die printing seat (28) or an input port of the second female die printing seat (29) through the first deviation rectifying device (34).
16. The method for processing a composite and multi-station printed full-die-cut UHF tag antenna as claimed in claim 15, wherein the method comprises the following steps: in the sixth step, a printing process of a second positioning mark (37) of a fourth male die printing seat (31) and a second exposure process of a second exposure device (33) are added between the compound mechanism and the first die cutting mechanism (27), namely, an antenna layer after the second substrate layer is compounded or an antenna layer after the second substrate layer and the first substrate layer are compounded are firstly sent to the fourth male die printing seat (31), the fourth male die printing seat (31) is used for printing the second positioning mark (37) on the antenna layer and/or the second substrate layer by adopting ink, the second positioning mark (37) is used for positioning a chip during chip installation and/or binding, then the second exposure device (33) is used for exposing the second positioning mark (37) to enable the second positioning mark (37) consisting of the ink to be quickly exposed, and then the antenna layer after the second positioning mark (37) is printed and the second positioning mark (37) is compounded or the antenna layer after the second positioning mark (37) is printed and the second substrate layer and the first substrate layer are compounded The layers are fed to the input of a first die-cutting mechanism (27).
17. The method for processing a composite and multi-station printed full-die-cut UHF tag antenna as claimed in claim 16, wherein the method comprises the following steps: the antenna hole machining mechanism (4) punches the antenna hole (16) in the antenna layer and adopts a flat pressing die cutting process or a circular knife die cutting process;
in the fifth step, the antenna hole machining mechanism (4) punches the antenna hole (16), and waste material antennas generated after punching or waste material antennas generated after punching and a waste material first base material layer enter the antenna hole (16) and a waste material collecting device (5);
in the fifth step, in the process that the antenna layer after the antenna hole (16) is punched or the antenna layer compounded with the first base material layer is compounded with the second base material layer unreeled by the second unreeling mechanism (7) through the compounding mechanism (6), the heating drum of the compounding mechanism (6) synchronously heats the adhesive on the antenna layer, and the second base material layer is compounded with the antenna layer by using a glue stick or the second base material layer is compounded with the antenna layer compounded with the first base material layer;
the temperature range of the heating drum is 50-200 ℃; the temperature range of the drying mechanism (3) is 40-160 ℃; and the first concave die printing seat (28) or the third concave die printing seat (30) is used for coating the adhesive on the antenna layer or the first substrate layer and contains a diluting solvent.
18. The method of processing a composite and multi-station printed full-die-cut UHF tag antenna according to any one of claims 14 to 17, wherein: the first die-cutting mechanism performs one-time flat pressing die cutting and/or circular knife die cutting on the antenna of the antenna layer or the antenna of the antenna layer and the first substrate layer compounded with the first substrate layer to form a chip binding point (15) and a chip binding positioning point (14);
or the first die cutting mechanism (27) performs two or more times of flat pressing die cutting and/or circular knife die cutting on the antenna of the antenna layer or the antenna of the antenna layer and the first substrate layer of the composite first substrate layer to form the chip binding points (15) and the chip binding positioning points (14).
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