CN211842283U

CN211842283U - Antenna processing equipment for composite and multi-station full-die-cutting ultrahigh frequency tag

Info

Publication number: CN211842283U
Application number: CN202020344704.1U
Authority: CN
Inventors: 黄光伟
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-03-18
Filing date: 2020-03-18
Publication date: 2020-11-03
Anticipated expiration: 2030-03-18

Abstract

The utility model provides an antenna processing device of a composite and multi-station full-die-cutting ultrahigh frequency label, which relates to that a chip binding positioning point formed by a die cutting mode and a chip binding point formed by the die cutting mode are arranged on an antenna body of an ultrahigh frequency label antenna; antenna body's antenna layer one side still pastes second substrate layer or first substrate layer and second substrate layer, its characterized in that: the processing equipment comprises a first die-cutting mechanism, a second die-cutting mechanism and a traction mechanism. The utility model provides a problem one that prior art exists: how to avoid the problem that the chip binding point and the chip binding point of the ultrahigh frequency electronic tag antenna are produced by using an etching process, the problem II is that: the problem of how to completely avoid applying an etching process in the production process of the ultrahigh frequency electronic tag antenna is as follows: how to prevent in the course of working that antenna layer from moving or position when the transmission from taking place the skew, the problem four: how to help the antenna layer move or drive better while maintaining tension.

Description

Antenna processing equipment for composite and multi-station full-die-cutting ultrahigh frequency tag

Technical Field

The utility model relates to an electronic tags technical field especially relates to a compound and antenna processing equipment of full die-cut hyperfrequency label of multistation.

Background

At present, the chip binding point and the chip binding positioning point of the ultrahigh frequency electronic tag antenna are still produced by adopting an etching process, and the etching process needs chemical substances such as hydrochloric acid and the like, so that the environment is greatly influenced, and the problem that how to avoid producing the chip binding point and the chip binding positioning point of the ultrahigh frequency electronic tag antenna by adopting the etching process is urgently to be solved is solved.

In addition, how to completely avoid the problem of using an etching process in the production process of the uhf electronic tag antenna, how to prevent the antenna layer from shifting or transmitting during the processing process, and how to help the antenna layer to better move or transmit while maintaining the tension is also a problem to be solved.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an antenna processing equipment of compound and full die-cut hyperfrequency label of multistation mainly solves the problem that exists among the above-mentioned prior art one: how to avoid the problem that the chip binding point and the chip binding point of the ultrahigh frequency electronic tag antenna are produced by using an etching process, the problem II is that: the problem of how to completely avoid applying an etching process in the production process of the ultrahigh frequency electronic tag antenna is as follows: how to prevent in the course of working that antenna layer from moving or the problem of position emergence skew when transmitting, the problem four: the problem of how to help the antenna layer keep tension and better move or drive is solved.

In order to realize the purpose, the utility model discloses the technical scheme who adopts is: an antenna processing device for a composite and multi-station full-die cutting ultrahigh frequency tag relates to that a chip binding positioning point formed by a die cutting mode and a chip binding point formed by the die cutting mode are arranged on an antenna body of an ultrahigh frequency tag antenna; antenna body's antenna layer one side still pastes second substrate layer or first substrate layer and second substrate layer, its characterized in that: the antenna processing equipment for the composite and multi-station full-die cutting ultrahigh frequency tag comprises a first die cutting mechanism, a second die cutting mechanism and a traction mechanism, wherein the first die cutting mechanism is used for die cutting a chip binding positioning point and a chip binding point of the ultrahigh frequency tag antenna, the second die cutting mechanism is used for die cutting the periphery edge of the ultrahigh frequency tag antenna, and the traction mechanism is used for drawing an antenna layer of an antenna body and/or an antenna layer of a composite first base material layer and a second base material layer in the processing process of the first die cutting mechanism and the second die cutting mechanism.

Furthermore, the antenna processing equipment for the composite and multi-station full-die-cutting ultrahigh frequency tag further comprises an antenna hole processing mechanism for die-cutting an antenna hole of the ultrahigh frequency tag antenna, a composite mechanism for compounding the second substrate layer and the antenna layer or compounding the second substrate layer and the first substrate layer adhered with the antenna layer, a first waste discharge winding mechanism for winding the waste antenna processed by the first die-cutting mechanism and the second die-cutting mechanism or winding the waste antenna processed by the first die-cutting mechanism and the second die-cutting mechanism and the waste first substrate layer, and a third unwinding mechanism for unwinding the isolation layer on the antenna layer; the traction mechanism is a first traction device and a second traction device; the antenna layer to be processed or the antenna layer adhered with the first base material layer is input through the input port of the first traction device, the output port of the first traction device corresponds to the input port of the antenna hole processing mechanism, the output port of the antenna hole processing mechanism corresponds to the input port of the composite mechanism, the output port of the composite mechanism corresponds to the input port of the first die-cutting mechanism, the output port of the first die-cutting mechanism corresponds to the input port of the second die-cutting mechanism, the output port of the second die-cutting mechanism corresponds to the input port of the first waste discharge winding mechanism and the input port of the second traction device, the output port of the third unwinding mechanism corresponds to the input port of the second traction device, and the output port of the second traction device outputs the processed antenna of the ultrahigh frequency label;

or the traction mechanism is a first traction device and a second traction device; the antenna layer that the processing was waited to antenna layer or the antenna layer of pasting first substrate layer is inputed to first draw gear's input port, the output port of first draw gear corresponds the input port of antenna hole processing mechanism, the output port of antenna hole processing mechanism corresponds the input port of combined mechanism, the output port of combined mechanism corresponds the input port of second die-cutting mechanism, the output port of second die-cutting mechanism corresponds the input port of first die-cutting mechanism, the output port of first die-cutting mechanism corresponds the input port of first useless winding mechanism of row and the input port of second draw gear, the output port of third unwinding mechanism corresponds the input port of second draw gear, the antenna of the hyperfrequency label of processing completion is exported to the output port of second draw gear.

Further, the first die cutting mechanism is composed of a flat-press die cutting mechanism, and the flat-press die cutting mechanism is a flat-press die cutting machine comprising at least one die cutting tool for flat-press die cutting of chip binding positioning points and chip binding points;

or the first die-cutting mechanism consists of a circular knife die-cutting mechanism, and the circular knife die-cutting mechanism is a circular knife die-cutting machine comprising at least one rolling cutter for die-cutting a chip binding positioning point and a chip binding point by a circular knife;

or the first die cutting mechanism is a mixed die cutting mechanism formed by mixing a flat-pressing die cutting mechanism and a circular cutter die cutting mechanism, and the mixed die cutting mechanism is a mixed die cutting machine comprising at least one die cutting tool for flat-pressing die cutting chip binding positioning points or chip binding positioning points and at least one hob tool for circular cutter die cutting chip binding points or chip binding positioning points;

the second die-cutting mechanism is a flat-pressing die-cutting machine for flat-pressing the peripheral edge of the die-cutting antenna body or a circular knife die-cutting machine for circular knife die-cutting the peripheral edge of the antenna body;

the antenna hole processing mechanism is a flat-pressing die-cutting machine for flat-pressing die-cutting antenna holes or a circular knife die-cutting machine for circular knife die-cutting antenna holes.

Further, the first die cutting mechanism for die cutting the chip binding positioning points and the chip binding points and the second die cutting mechanism for die cutting the peripheral edge of the antenna body are combined into a flat press die cutting machine or a circular knife die cutting machine.

Furthermore, the processing equipment also comprises a first unreeling mechanism for unreeling the antenna layer to be processed or compounding the antenna layer to be processed of the first substrate layer, a coating mechanism for coating an adhesive on one side of the antenna layer to be processed or one side of the first substrate layer which is not adhered with the antenna layer, a drying mechanism for drying the antenna layer coated with the adhesive by the coating mechanism or drying mechanism for drying the antenna layer compounded with the adhesive by the coating mechanism, a second unreeling mechanism for unreeling the second substrate layer, and a finished product reeling mechanism for reeling the processed antenna layer, the second substrate layer and the isolation layer together;

the output port of the first unwinding mechanism corresponds to the input port of the coating mechanism, the output port of the coating mechanism corresponds to the input port of the drying mechanism, the output port of the drying mechanism corresponds to the input port of the first traction device, the output port of the second unwinding mechanism corresponds to the input port of the composite mechanism, and the input port of the finished product winding mechanism corresponds to the output port of the second traction device.

Furthermore, a deviation correcting device is additionally arranged between the drying mechanism and the first traction device, an output port of the drying mechanism corresponds to an input port of the deviation correcting device, and an output port of the deviation correcting device corresponds to an input port of the first traction device.

Further, the number of the chip binding points is two, and the first die cutting mechanism is divided into a flat die cutting machine for performing flat press die cutting on one of the chip binding points or a circular knife die cutting machine for performing circular knife die cutting, and a flat die cutting machine for performing flat press die cutting on the other of the chip binding points and the chip binding points or a circular knife die cutting machine for performing circular knife die cutting;

the output port of the compound mechanism corresponds to the input port of a flat-pressing die-cutting machine for carrying out flat-pressing die-cutting on one of the chip binding points or a circular knife die-cutting machine for carrying out circular knife die-cutting, the output port of the flat-pressing die-cutting machine for carrying out flat-pressing die-cutting on one of the chip binding points or the circular knife die-cutting machine for carrying out circular knife die-cutting corresponds to the input port of the flat-pressing die-cutting machine for carrying out flat-pressing die-cutting on the other chip binding point and the chip binding positioning point or the circular knife die-cutting machine for carrying out circular knife die-cutting, and the output port of the flat-pressing die-cutting machine for carrying out flat-pressing die-cutting on the other chip binding point and the chip binding positioning point or the;

or the output port of the composite mechanism corresponds to the input port of a flat-press die-cutting machine or a circular knife die-cutting machine for performing flat-press die-cutting on another chip binding point and a chip binding positioning point, the output port of the flat-press die-cutting machine or the circular knife die-cutting machine for performing flat-press die-cutting on another chip binding point and a chip binding positioning point corresponds to the input port of the flat-press die-cutting machine or the circular knife die-cutting machine for performing flat-press die-cutting on one of the chip binding points, and the output port of the flat-press die-cutting machine or the circular knife for performing circular knife die-cutting on one of the chip binding points corresponds to the input port of the second die-cutting mechanism.

Further, the method comprises the following steps: the processing equipment also comprises a second waste discharge winding mechanism;

the first die-cutting mechanism comprises a first flat die-cutting machine or a first circular knife die-cutting machine for carrying out flat pressing die-cutting on one chip binding point, redundant antennas on two sides of the antenna layer or redundant antennas on two sides of the first substrate layer and redundant first substrate layers, and a second flat die-cutting machine or a second circular knife die-cutting machine for carrying out flat pressing die-cutting on the other chip binding point and the chip binding point; the input port of the first flat-die cutting machine or the first circular knife cutting machine corresponds to the output port of the compound mechanism, the output port of the first flat-die cutting machine or the first circular knife cutting machine corresponds to the input port of the second waste discharge winding mechanism and the input port of the second flat-die cutting machine or the second circular knife cutting machine, and the output port of the second flat-die cutting machine or the second circular knife cutting machine corresponds to the input port of the second die cutting mechanism;

or the first die-cutting mechanism comprises a first flat die-cutting machine or a first circular knife die-cutting machine for carrying out flat pressing die-cutting on one of the chip binding points, the redundant antennas on two sides of the antenna layer or the redundant antenna on two sides of the first substrate layer and the redundant first substrate layer, and a second flat die-cutting machine or a second circular knife die-cutting machine for carrying out flat pressing die-cutting on the other chip binding point and the chip binding point; the input port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the output port of the compound mechanism, the output port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the input port of the first flat die-cutting machine or the first circular knife die-cutting machine, and the output port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the input port of the second waste discharge winding mechanism and the input port of the second die-cutting mechanism;

or the first die-cutting mechanism comprises a first flat die-cutting machine for performing flat-press die-cutting on one of the chip binding points or a first circular knife die-cutting machine for performing circular knife die-cutting, and a second flat die-cutting machine for performing flat-press die-cutting on the other chip binding point and the chip binding point, and simultaneously performing flat-press die-cutting on redundant antennas on two sides of the antenna layer or redundant antennas on the first substrate layer and redundant antennas on two sides of the antenna layer and redundant first substrate layer or a second circular knife die-cutting machine for performing circular knife die-cutting, the input port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the output port of the compound mechanism, the output port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the input port of the second flat die-cutting machine or the second circular knife die-cutting machine, and the output port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the input port of the second waste discharge winding mechanism and the input port of the second die-cutting mechanism.

Or the first die-cutting mechanism comprises a first flat die-cutting machine for performing flat-press die-cutting on one of the chip binding points or a first circular knife die-cutting machine for performing circular knife die-cutting, and a second flat die-cutting machine for performing flat-press die-cutting on the other chip binding point and the chip binding point, and simultaneously performing flat-press die-cutting on redundant antennas on two sides of the antenna layer or redundant antennas on the first substrate layer and redundant antennas on two sides of the antenna layer and redundant first substrate layer or a second circular knife die-cutting machine for performing circular knife die-cutting, the input port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the output port of the compound mechanism, the output port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the input port of the second waste discharging and winding mechanism and the input port of the first flat die-cutting machine or the first circular knife die-cutting machine, and the output port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the input port of the second die-cutting mechanism.

Furthermore, the processing equipment also comprises an antenna hole waste material collecting device which is used for collecting waste material antennas generated after the antenna hole processing mechanism punches the antenna hole or waste material antennas and a waste material first base material layer; the antenna hole waste collecting device is positioned below the antenna hole machining mechanism; the compound mechanism is also provided with a heating drum for heating the adhesive; the composite mechanism comprises a rubber roller for compounding the second substrate layer with the antenna layer or a rubber roller for compounding the second substrate layer with the antenna layer of the first substrate layer.

In view of the above technical features, the utility model discloses following beneficial effect has:

1. the utility model discloses in a hyperfrequency electronic tags antenna of full cross cutting, adopt to bind the setpoint to the chip and carry out the fashioned mode of cross cutting, for example concora crush cross cutting and/or circular knife cross cutting, can make the hyperfrequency electronic tags antenna of full cross cutting break away from etching process, can effectively reduce influence and/or pollution that the chemical substance that produces because of etching process causes the environment.

2. The utility model discloses in a hyperfrequency electronic tags antenna of full cross cutting, to the antenna hole punch also can adopt the cross cutting mode, for example concora crush cross cutting and/or circular knife cross cutting, can make the hyperfrequency electronic tags antenna of full cross cutting break away from etching process, can effectively reduce influence and/or pollution that the chemical material that produces because of etching process causes the environment.

3. The utility model discloses in a hyperfrequency electronic tags antenna of full cross cutting, also can adopt the cross cutting mode to the border position around the antenna body, for example concora crush cross cutting and/or circular knife cross cutting, can make the hyperfrequency electronic tags antenna of full cross cutting break away from etching process, can effectively reduce influence and/or pollution that the chemical material that produces because of etching process causes the environment.

4. The utility model discloses in the processing equipment of full cross cutting's hyperfrequency electronic tags antenna, to chip binding point, chip binding setpoint and antenna body border position's processing equipment position and processing order all around can exchange, do not influence the chip binding point, chip binding setpoint and antenna body border position's processing effect all around.

5. The utility model discloses in a processing technology of hyperfrequency electronic tags antenna of full cross cutting, as long as bind the setpoint and carry out the fashioned processing mode of cross cutting including binding the setpoint to chip, contain the utility model discloses in the protection scope, this processing mode can help hyperfrequency electronic tags antenna to realize full die cutting processing, need not with the help of any etching technology, can be with the production of hyperfrequency electronic tags antenna to environmental pollution with the minimum, even basically harmless.

6. The traction mechanism can be composed of at least two traction devices, for example, two traction devices place a die cutting mechanism (including an antenna hole processing mechanism, a composite mechanism, a first die cutting mechanism, a second die cutting mechanism and the like) between the two traction devices, the two traction devices help the die cutting mechanism to perform die cutting in-process antenna layer or antenna layer of a composite first substrate layer and second substrate layer to well move or transmit effect, the moving force is enhanced, the shell is not easy to clamp in the moving process, meanwhile, the antenna layer of the die cutting mechanism in-process antenna layer or composite first substrate layer or antenna layer of the composite first substrate layer and second substrate layer is straightened or flattened through the two traction devices, good tension is kept, the die cutting mechanism can be convenient to process, and the die cutting processing effect is improved. During the manufacturing process, the traction mechanism can effectively help the antenna layer to maintain tension and better move or drive.

7. Deviation correcting device can help to correct the shift position from the antenna layer of stoving mechanism output and coated adhesive or the antenna layer of compound first substrate layer, and accurate location, correction moving direction ensure that the antenna layer that gets into follow-up procedure or the antenna layer transmission position of compound first substrate layer are accurate, help to promote follow-up cross cutting mechanism's cross cutting effect and cross cutting precision. In the course of working, deviation correcting device can prevent effectively that antenna layer from taking place the skew when removing or transmitting.

8. The second winding mechanism that wastes discharge can promote the effect of wasting discharge, promotes product processingquality.

Drawings

Fig. 1 is a schematic diagram of the structure of an all die-cut uhf tag antenna of example 1.

Fig. 2 is a schematic structural diagram of an antenna processing device for a composite and multi-station full-die-cut ultrahigh frequency tag in embodiment 1.

Fig. 3 is a schematic cross-sectional view of an all-die-cut uhf rfid antenna (without the first substrate layer) in example 1.

Fig. 4 is a schematic cross-sectional view of an all-die-cut uhf rfid antenna (including a first substrate layer) in example 1.

Fig. 5 is a schematic structural diagram of the antenna processing equipment for the composite and multi-station full-die-cut uhf tag in embodiment 4.

In the figure: 1 is a first unwinding mechanism; 2 is a coating mechanism; 3 is a drying mechanism; 4, an antenna hole processing mechanism; 5 is an antenna hole waste collecting device; 6 is a composite mechanism; 7, a second unwinding mechanism; 8 is a circular knife die-cutting machine which is used for carrying out circular knife die-cutting on one of the chip binding points in the first die-cutting mechanism; 9 is a circular knife die cutting machine which is used for performing circular knife die cutting on the other chip binding point and the chip binding point in the first die cutting mechanism; 10 is a second die-cutting mechanism; 11 is a first waste discharge winding mechanism; 12 is a third unwinding mechanism; 13 is a finished product winding mechanism; 14, binding a positioning point for the chip; 15 is a chip binding point; 16 is an antenna hole; 17 is an antenna body; 18 is an aluminum foil; 19 is an adhesive applied by the applying mechanism; 20 is paper as a second base material layer, and 21 is a PET layer as a first base material layer; 22 is an adhesive for pre-compounding the PET layer and the aluminum foil; 23 is a first traction device; 24 is a second traction device; 25 is a deviation correcting device; and 26 is a second waste winding mechanism.

Detailed Description

The present invention will be further described with reference to the following detailed description. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Furthermore, it should be understood that various changes and modifications of the present invention may be made by those skilled in the art after reading the teachings of the present invention, and these equivalents also fall within the scope of the appended claims.

Referring to fig. 1 and 2, in embodiment 1, an antenna processing apparatus for a composite and multi-station full-die-cutting ultrahigh frequency tag relates to an antenna body 17 of an ultrahigh frequency tag antenna, and is provided with a chip binding and positioning point 14 formed by a die-cutting manner and a chip binding and positioning point 15 formed by a die-cutting manner;

the chip binding positioning points 14 and the chip binding points 15 of the ultrahigh frequency electronic tag antenna are manufactured in a die cutting mode, so that the etching process can be avoided in the process of producing the chip binding positioning points 14 and the chip binding points 15, and the pollution of chemical substances to the environment can be effectively reduced; in addition, the chip binding positioning points 14 and the chip binding points 15 formed in the die cutting mode are smooth and smooth in the peripheral edges, uneven edge shapes cannot exist, and the quality of the ultrahigh frequency electronic tag antenna is improved.

The peripheral edge of the antenna body 17 is formed by die cutting.

The antenna body 17 is further provided with an antenna hole 16 formed by die cutting.

That is to say, each part on the ultrahigh frequency electronic tag antenna can be carried out by adopting a die cutting mode, the whole ultrahigh frequency electronic tag antenna can be produced by adopting the die cutting mode, the etching process is completely separated, the pollution to the environment is minimized, and even no chemical pollution is caused.

The die cutting mode can adopt flat pressing die cutting and/or circular knife die cutting, which is also called rolling cutting.

In this embodiment 1, there are two chip attachment points 15, one antenna hole 16, and a gap formed between the chip attachment points 15 communicates between the antenna hole 16 and the outside of the antenna.

A second substrate layer or a first substrate layer and a second substrate layer are further adhered to one side of the antenna layer of the antenna body 17, preferably, the first substrate layer is a mylar, preferably, a PET layer 21 of the first substrate layer, and the second substrate layer is a mylar or paper 20, wherein the mylar is preferably, a PET layer; the antenna of the antenna layer may be a metal foil, such as an aluminum foil, a copper foil, etc., and in this embodiment 1, the antenna of the antenna layer is preferably an aluminum foil 18.

The antenna processing equipment for the compound and multi-station full-die cutting ultrahigh frequency label related to the ultrahigh frequency label antenna comprises a first die cutting mechanism for die cutting a chip binding positioning point 14 and a chip binding point 15 of the ultrahigh frequency label antenna, a second die cutting mechanism 10 for die cutting the periphery edge of the ultrahigh frequency label antenna, an antenna hole processing mechanism 4 for die cutting an antenna hole 16 of the ultrahigh frequency label antenna, a compound mechanism 6 for compounding a second base material layer and an antenna layer or compounding the second base material layer and a first base material layer adhered with the antenna layer, a first waste discharge winding mechanism 11 for winding a waste material antenna processed by the first die cutting mechanism and the second die cutting mechanism 10 or winding the waste material antenna and the waste material first base material layer processed by the first die cutting mechanism and the second die cutting mechanism, a third unwinding mechanism 12 for unwinding an isolation layer on the antenna layer, a first waste discharge winding mechanism 11 for winding the waste material antenna and a second waste material first base material layer, The traction mechanism is used for drawing the antenna layer and/or the antenna layer compounded with the first base material layer and the second base material layer in the processing process (particularly in each die cutting processing link);

preferably, the traction mechanism is a first traction device 23 and a second traction device 24; the antenna layer to be processed or the antenna layer to which the first base material layer is adhered is input through the input port of the first traction device 23 (for example, the aluminum foil 18 is compounded with the first base material layer, namely the PET layer 21, through the adhesive 22 in advance, namely the aluminum foil is adhered together), the output port of the first traction device 23 corresponds to the input port of the antenna hole processing mechanism 4, the output port of the antenna hole processing mechanism 4 corresponds to the input port of the compounding mechanism 6, the output port of the compounding mechanism 6 corresponds to the input port of the first die-cutting mechanism, the output port of the first die-cutting mechanism corresponds to the input port of the second die-cutting mechanism 10, the output port of the second die-cutting mechanism 10 corresponds to the input port of the first waste discharge winding mechanism 11 and the input port of the second traction device 24, the output port of the third unwinding mechanism 12 corresponds to the input port of the second traction device 24, and the output.

Alternatively, the traction mechanism is a first traction device 23 and a second traction device 24; the antenna layer that waits to process or the antenna layer of pasting first substrate layer is inputted to first draw gear 23's input port, the delivery outlet of first draw gear 23 corresponds the input port of antenna hole machining mechanism 4, the delivery outlet of antenna hole machining mechanism 4 corresponds the input port of combined mechanism 6, the delivery outlet of combined mechanism 6 corresponds the input port of second die-cutting mechanism 10, the delivery outlet of second die-cutting mechanism 10 corresponds the input port of first die-cutting mechanism, the delivery outlet of first die-cutting mechanism corresponds the input port of first useless winding mechanism 11 of arranging and the input port of second draw gear 24, the delivery outlet of third unwinding mechanism 12 corresponds the input port of second draw gear 24, the antenna of the hyperfrequency label that processing was accomplished is exported to the delivery outlet of second draw gear 24.

The traction mechanism is used for leading the antenna hole processing mechanism 4, the compound mechanism 6, the first die cutting mechanism (a circular knife die cutting machine 8 for carrying out circular knife die cutting on one chip binding point and a circular knife die cutting machine 9 for carrying out circular knife die cutting on the other chip binding point and the chip binding point), the second die cutting mechanism 10, the first waste discharge winding mechanism 11 and the third waste discharge winding mechanism 12 to be arranged between the first traction device 23 and the second traction device 24 so as to help the antenna layer and/or the first base material layer and/or the second base material layer and/or the isolation layer which are correspondingly processed by the components to be well moved or conveyed, and simultaneously help to keep the tension of the antenna layer and/or the first base material layer and/or the second base material layer and/or the isolation layer stable and uniform in the moving process, particularly the tension of the die cutting part to be stable and uniform, the corresponding processing operation of the parts is facilitated, and the accuracy of the processing operation is ensured.

The first die cutting mechanism consists of a flat-press die cutting mechanism, and the flat-press die cutting mechanism is a flat-press die cutting machine comprising at least one die cutting tool for flat-press die cutting of chip binding positioning points 14 and chip binding points 15;

or the first die-cutting mechanism consists of a circular knife die-cutting mechanism, and the circular knife die-cutting mechanism is a circular knife die-cutting machine comprising at least one rolling cutting tool for die-cutting the chip binding positioning points 14 and the chip binding points 15 by the circular knife;

or the first die cutting mechanism is a mixed die cutting mechanism formed by mixing a flat-pressing die cutting mechanism and a circular cutter die cutting mechanism, and the mixed die cutting mechanism is a mixed die cutting machine comprising at least one die cutting cutter used for flat-pressing die cutting chip binding positioning points 14 or chip binding positioning points 15 and at least one hob cutter used for circular cutter die cutting chip binding positioning points 14 or chip binding positioning points 15;

the second die-cutting mechanism 10 is a flat-pressing die-cutting machine for flat-pressing the peripheral edge of the die-cutting antenna body 17, or a circular knife die-cutting machine for circular knife die-cutting the peripheral edge of the die-cutting antenna body 17;

the antenna hole processing mechanism is a flat-pressing die-cutting machine for flat-pressing die-cutting the antenna hole 16, or the antenna hole processing mechanism is a circular knife die-cutting machine for circular knife die-cutting the antenna hole 16.

That is to say, the first die cutting mechanism, the second die cutting mechanism 10 and the antenna hole processing mechanism 4 can select the flat-pressing die cutting mechanism and/or the circular cutter die cutting mechanism according to actual needs to realize the die cutting process, so as to meet the requirements of the fully die-cut ultrahigh frequency electronic tag antenna on the die cutting process, in particular the requirements of the chip binding positioning points 14, the chip binding points 15, the peripheral edge of the antenna body 17 and the antenna holes 16 on the die cutting process.

The processing equipment further comprises a first unreeling mechanism 1 for unreeling the antenna layer to be processed or compounding the antenna layer to be processed of the first base material layer, a coating mechanism 2 for coating an adhesive on one side of the antenna layer to be processed or one side of the first base material layer which is not adhered with the antenna layer, a drying mechanism 3 for drying the antenna layer coated with the adhesive by the coating mechanism or a drying mechanism 3 for drying the antenna layer compounded with the first base material layer coated with the adhesive by the coating mechanism, a second unreeling mechanism 7 for unreeling the second base material layer, and a finished product reeling mechanism 13 for reeling the processed antenna layer together with the second base material layer and the isolation layer;

the output port of the first unwinding mechanism 1 corresponds to the input port of the coating mechanism 2, the output port of the coating mechanism 2 corresponds to the input port of the drying mechanism 3, the output port of the drying mechanism 3 corresponds to the input port of the first traction device 23, the output port of the second unwinding mechanism 7 corresponds to the input port of the compound mechanism 6, and the input port of the finished product winding mechanism 13 corresponds to the output port of the second traction device 24.

There is not first substrate layer in the hyperfrequency electronic tags antenna course of working of full cross cutting, coating mechanism coats the adhesive in one side of antenna layer when directly adopting antenna layer to add man-hour, bind setpoint 14 and chip binding point 15 to the chip when first die cutting mechanism and carry out the cross cutting, second die cutting mechanism 10 carries out the cross cutting to the edge all around of antenna body 17, antenna hole processing agency 4 all only carries out the cross cutting to the antenna layer when carrying out the cross cutting to antenna hole 16, but does not carry out the cross cutting to the second substrate layer. The adhesive 19 applied by the coating mechanism 2 at this time is used to combine the antenna layer and the second substrate layer by the combining mechanism 7, that is, the antenna layer and the second substrate layer are bonded together by the adhesive 19. The finished product of the fully die-cut ultrahigh frequency electronic tag antenna produced under the precondition is formed by sequentially bonding an antenna layer (namely, an aluminum foil 18) and a second substrate layer (namely, paper 20) from top to bottom through a bonding agent 19 of a coating mechanism 2, and is shown in detail in figure 3.

When the fully die-cut ultrahigh frequency electronic tag antenna is processed, the first substrate layer can be optionally added, or the first substrate layer can be omitted. Preferably adopt first substrate layer, first substrate layer is used for supporting the antenna on the antenna layer, in antenna layer course of working, first substrate layer carries out guard action to the antenna, coating mechanism 2 did not paste one side coating adhesive on antenna layer at first substrate layer this moment, bind setpoint 14 and chip binding point 15 and carry out the cross cutting to the chip when first die-cutting mechanism, second die-cutting mechanism 10 carries out the cross cutting to antenna body 17's all edges all around, antenna hole processing agency 4 all can carry out the cross cutting simultaneously with first substrate layer and antenna layer when carrying out the cross cutting to antenna hole 16, but do not carry out the cross cutting to the second substrate layer. The adhesive 19 applied by the application mechanism 2 is used to combine the first substrate layer and the second substrate layer by the combining mechanism 6, that is, the first substrate layer and the second substrate layer are bonded together by the adhesive 19. The finished product of the fully-die-cut ultrahigh frequency electronic tag antenna produced under the precondition is characterized in that an antenna layer (namely the aluminum foil 18) and an antenna layer pasting composite first substrate layer (namely the first substrate layer is a PET layer 21, wherein pasting composite refers to that the PET layer 21 pre-compounds the PET layer 21 and the aluminum foil 18 through a bonding agent 22 for pre-compounding and pasting the PET layer 21 and the aluminum foil 18, then the antenna layer of the composite first substrate layer is put and rolled into a coating mechanism 2 through a first unwinding mechanism 1, the first substrate layer (namely the PET layer 21) is pasted and compounded with a second substrate layer (namely paper 20) through a bonding agent 19 of the coating mechanism, and details are shown in figure 4.

A deviation correcting device 25 is additionally arranged between the drying mechanism 3 and the first traction device 23, an output port of the drying mechanism 3 corresponds to an input port of the deviation correcting device 25, and an output port of the deviation correcting device 25 corresponds to an input port of the first traction device 23. The deviation correcting device 25 is used for correcting the position and calibrating the position of the antenna layer or the antenna layer of the composite first base material layer coming out of the drying mechanism 3 when the antenna layer or the antenna layer of the composite first base material layer moves forwards (namely, in the transportation process or the moving process), especially, when a side position error or a side position deviation occurs in the antenna layer or the antenna layer of the composite first base material layer, the deviation correcting device 25 plays a role in correcting, namely, the deviation correcting device 25 performs reference positioning on the antenna layer or the antenna layer of the composite first base material layer coming out of the drying mechanism 3, corrects the moving direction of the antenna layer or the antenna layer of the composite first base material layer, ensures that the advancing direction and the positions of two sides are accurate when the antenna layer or the antenna layer of the composite first base material layer enters the first traction device 23, and helps to promote and/. Or if the antenna layer after the antenna layer or the antenna layer of the composite first substrate layer is dried in the drying mechanism due to thermal expansion, or the antenna moving and transmitting position of the composite first substrate layer deviates, the deviation correcting device 25 can also perform the functions of position correction and position calibration.

The chip binding points are two, the first die cutting mechanism is divided into a flat die cutting machine for performing flat die cutting on one of the chip binding points or a circular knife die cutting machine 8 for performing circular knife die cutting, and a flat die cutting machine for performing flat die cutting on the other chip binding point and the chip binding point or a circular knife die cutting machine 9 for performing circular knife die cutting.

An output port of the compound mechanism 6 corresponds to an input port of the flat press die-cutting machine for performing flat press die-cutting on one of the chip binding points 15 or the circular knife die-cutting machine 8 for performing circular knife die-cutting, an output port of the flat press die-cutting machine for performing flat press die-cutting on one of the chip binding points 15 or the circular knife die-cutting machine 8 for performing circular knife die-cutting corresponds to an input port of the flat press die-cutting machine for performing flat press die-cutting on the other chip binding point 15 and the chip binding point 14 or the circular knife die-cutting machine 9 for performing circular knife die-cutting, and an output port of the flat press die-cutting machine for performing flat press die-cutting on the other chip binding point 15 and the chip binding point 14 or the circular knife die-cutting machine 9 for performing circular knife die-cutting corresponds to an input;

alternative options are: the output port of the compound mechanism 6 corresponds to the input port of the flat die cutting machine for performing flat die cutting on another chip binding point 15 and a chip binding point 14 or the circular knife die cutting machine 9 for performing circular knife die cutting, the output port of the flat die cutting machine for performing flat die cutting on another chip binding point 15 and a chip binding point 14 or the circular knife die cutting machine 9 for performing circular knife die cutting corresponds to the input port of the flat die cutting machine for performing flat die cutting on one of the chip binding points 15 or the circular knife die cutting machine 8 for performing circular knife die cutting, and the output port of the flat die cutting machine for performing flat die cutting on one of the chip binding points 15 or the circular knife die cutting machine 8 for performing circular knife die cutting corresponds to the input port of the second die cutting mechanism 10.

In this embodiment 1, the full-die-cut ultrahigh frequency electronic tag antenna uses the antenna layer to be processed of the composite first substrate layer as an example (if there is no composite first substrate layer, the antenna layer to be processed can directly replace the antenna layer to be processed of the composite first substrate layer), and the connection relationship among the devices is as follows: the antenna layer of treating processing of compound first substrate layer of unreeling of first unwinding mechanism 1 corresponds the input port that gets into coating mechanism 2, the antenna layer of the compound first substrate layer after the coating of coating mechanism 2 output (adhesive coating is at the side of antenna layer is not pasted on first substrate layer this moment) gets into the input port that corresponds stoving mechanism 3, the output port of stoving mechanism 3 corresponds deviation correcting device 25's input port, deviation correcting device 25's output port gets into the input port that corresponds first draw gear 23, the output port of first draw gear 23 corresponds the input port of antenna hole processing mechanism 4, the antenna layer of the compound first substrate layer after antenna hole 16 that antenna hole processing mechanism 4 output punched gets into the input port that corresponds composite mechanism 6 again, the second substrate layer that second unwinding mechanism 7 unreeled also gets into the input port that corresponds composite mechanism 6 in the lump simultaneously, the antenna layer of the compound second substrate layer and the first substrate layer of composite mechanism 6 output gets into (first substrate layer this moment) And the second base material layer are bonded and compounded by the adhesive coated by the coating mechanism 2) and then enter the input port of the second die-cutting mechanism 10 from the output port of the first die-cutting mechanism, the antenna layer which is processed by flat-pressing die cutting and/or circular knife die cutting and is compounded with the first base material layer and the second base material layer is output from the output port of the second die-cutting mechanism 10, wherein the waste material antenna and the waste material first base material layer after flat pressing die cutting and/or circular knife die cutting processing correspond to the input port of the first waste discharging winding mechanism 11, the antenna layer and the second base material layer (at the moment, the first base material layer is still arranged between the antenna layer and the second base material layer, see figure 4) after flat pressing die cutting and/or circular knife die cutting processing enter the corresponding third unwinding mechanism 12, and after an isolating layer is superposed on the antenna layer or the second base material layer through the third unwinding mechanism 12, the antenna layer which is formed by compounding the second substrate layer and the first substrate layer and is superposed with the isolation layer enters the input port of the finished product winding mechanism 13. The finished product of the fully die-cut ultrahigh frequency electronic tag antenna formed at this time is formed by sequentially laminating an antenna layer (namely, the aluminum foil 18) and an antenna layer from top to bottom, wherein the first substrate layer (namely, the PET layer 21, the lamination here means that the PET layer 21 is laminated with the aluminum foil 18 in advance through the adhesive 22 for laminating and adhering the PET layer 21 and the aluminum foil 18 in advance, and then the antenna layer laminated with the first substrate layer is put and rolled into the coating mechanism 2 through the first unwinding mechanism 1, and the first substrate layer (namely, the PET layer 21) is laminated and compounded with a second substrate layer (namely, the paper 20) through the adhesive 19 of the coating mechanism, and the detailed view is shown in fig. 4.

The position and processing sequence of the first and second die-cutting mechanisms 10 can be interchanged.

As an alternative: the antenna layer of the composite second substrate layer or the antenna layer of the composite second substrate layer and the antenna layer of the first substrate layer output by the composite mechanism 6 enter the input port of the second die-cutting mechanism 10, and then enter the input port of the first die-cutting mechanism through the output port of the second die-cutting mechanism 10, the output port of the first die-cutting mechanism outputs the antenna layer which is processed by flat-pressing die-cutting and/or circular-knife die-cutting and is composited with the second substrate layer or the antenna layer which is processed by flat-pressing die-cutting and/or circular-knife die-cutting and is composited with the first substrate layer and the second substrate layer, wherein the waste antenna after the flat-pressing die-cutting and/or circular-knife die-cutting or the waste antenna after the flat-pressing die-cutting and/or the waste antenna after the circular-knife die-cutting and the waste first substrate.

The composite mechanism 9 is also provided with a heating drum for heating the adhesive, the adhesive is heated to facilitate the adhesion between the second substrate layer and one side surface of the first substrate layer which is not adhered with the antenna layer, and the composite adhesion function of the second substrate layer and the first substrate layer can be better realized after the composite mechanism 6 passes through; the compound mechanism 6 comprises a rubber roller for compounding the second substrate layer with the antenna layer or a rubber roller for compounding the second substrate layer with the antenna layer of the compound first substrate layer.

When the antenna layer of compound first substrate layer after stoving mechanism 2 dries punches in antenna hole machining mechanism 4, adhesive 19 of coating mechanism 2 coating can not cause the influence to punching, the operation of punching in the antenna hole of being convenient for.

The antenna processing method of the composite and multi-station full-die-cut ultrahigh frequency tag is characterized by comprising the following steps of: the production steps are as follows

The method comprises the following steps: an antenna layer to be processed or an antenna layer compounded with a first base material layer, which is unreeled by a first unreeling mechanism 1, is coated with an adhesive through a coating mechanism 2 on one side of the antenna layer to be processed or on one side of the antenna layer compounded with the first base material layer, which is not bonded with the antenna layer, of the first base material layer; the coating mechanism 2 is used for coating the adhesive 19 on the antenna layer or the first substrate layer and contains a diluting solvent, and the diluting solvent can dilute the adhesive 19 coated by the coating mechanism 2, so that the requirement of full-die-cutting ultrahigh frequency electronic tag antenna processing is met.

Step two: the coated antenna layer or the coated antenna layer of the composite first base material layer is sent to a drying mechanism 3, and the antenna layer coated with the adhesive or the antenna layer of the composite first base material layer is dried by the drying mechanism 3; the temperature range of the drying mechanism 3 is 40-160 ℃, which helps the adhesive to be dried, and is convenient for punching the antenna hole 16 of the antenna layer.

Step three: the dried antenna layer or the antenna layer compounded with the first base material layer is sent to a deviation correcting device 25, the deviation correcting device 25 is used for carrying out reference positioning on the dried antenna layer or the antenna layer compounded with the first base material layer, and the transferring direction of the antenna layer or the antenna layer compounded with the first base material layer is corrected and/or calibrated;

step four: the antenna layer after deviation rectification or the antenna layer of the composite first base material layer is sent to a first traction device, and the first traction device 23 is used for assisting the antenna layer or the antenna layer of the composite first base material layer to be transmitted; the first traction device 23 and the second traction device 24 are used for acting together, so that the transmission speed of the antenna layer or the antenna layer compounded with the first base material layer is controlled, the tension of the antenna layer or the antenna layer compounded with the first base material layer in the transmission process is stable, and each die-cutting sleeve position is accurate;

step five: the antenna layer passing through the first traction device 23 or the antenna layer compounding the first substrate layer is sent to an antenna hole machining mechanism 4 for antenna hole punching, the antenna hole machining mechanism 4 performs antenna hole 16 punching on the antenna layer or the antenna layer compounding the first substrate layer, and waste material antennas generated after punching or waste material antennas generated after punching and the waste material first substrate layer enter an antenna hole waste material collecting device 5; the antenna hole processing mechanism 4 is used for punching the antenna hole 16 in the antenna layer by adopting a flat pressing die cutting process or a circular knife die cutting process.

Step six: the antenna layer after the antenna hole 16 is punched or the antenna layer of the composite first base material layer after the antenna hole is punched is composited with a second base material layer of a second unreeling mechanism 7 through a compositing mechanism 6, namely the second base material layer is bonded with the antenna layer or the first base material layer through an adhesive; taking the antenna layer to be processed of the composite first substrate layer as an example, the composite mechanism 6 is further provided with a heating drum, and the heating drum synchronously heats the adhesive 19 on the antenna layer in the process that the antenna layer of the composite first substrate layer after the antenna hole 16 is punched is composited with the second substrate layer unreeled by the second unreeling mechanism 7 through the composite mechanism 6. The temperature range of heating drum is 50 degrees centigrade to 200 degrees centigrade, heats the antenna layer after the antenna hole punches, and the bonding agent 19 that has coated (the bonding agent actually coats on first substrate layer) heats and melts on the antenna layer of compound first substrate layer this moment, and the antenna layer of the compound first substrate layer of being convenient for utilizes bonding between 19 and the second substrate layer after the melting, and the compound mechanism 7 of being convenient for carries out compound pasting between first substrate layer and the second substrate layer.

Step seven: after the second substrate layer and the first substrate layer are compounded, the antenna layer is subjected to flat pressing die cutting and/or circular knife die cutting simultaneously through the first die cutting mechanism to form a chip binding point 14 and a chip binding positioning point 15, then the antenna and the first substrate layer at the periphery of the antenna layer antenna body of the first substrate layer are subjected to die cutting and/or roller cutting simultaneously through the second die cutting mechanism 10 to form the outline of the antenna body, then an antenna body of the preliminarily formed compound first substrate layer, a residual waste antenna and a corresponding residual waste first substrate layer are formed on the second substrate layer, and the residual waste antenna and the corresponding residual waste first substrate layer are wound and discharged through the first waste discharge winding mechanism 11;

an alternative to this step is the exchange of the positions and processing sequences of the first and second die-cutting means 10: the antenna layer of compound second substrate layer and first substrate layer carries out concora crush cross cutting and/or circular knife cross cutting to antenna and the outline that first substrate layer that antenna body edge around of antenna layer corresponds through second die cutting mechanism earlier simultaneously, carry out concora crush cross cutting and/or circular knife cross cutting to antenna and first substrate layer of antenna layer simultaneously through first die cutting mechanism again and form chip binding point 15, chip binding setpoint 14 back, then form the antenna body of the compound first substrate layer of primary forming on the second substrate layer, and surplus waste material antenna and correspond surplus waste material first substrate layer, through first row useless winding mechanism 11 with surplus waste material antenna and correspond surplus waste material first substrate layer rolling row useless of arranging

Assuming that the antenna layer released by the first unwinding mechanism 1 is not adhered with a first substrate layer, and at the moment, compounding the antenna layer with a second substrate layer, firstly performing flat-pressing die cutting and/or circular knife die cutting on the antenna of the antenna layer by using a first die cutting mechanism to form a chip binding point 15 and a chip binding positioning point 14, then performing flat-pressing die cutting and/or circular knife die cutting on the antenna at the periphery of the antenna body of the antenna layer by using a second die cutting mechanism 10 to form the outer contour of the antenna body, then forming a preliminarily formed antenna body and residual waste antennas on the second substrate layer, and rolling and discharging the residual waste antennas by using a first waste discharging and winding mechanism 11; or the alternative scheme is that the antenna layer after compounding the second substrate layer, the antennas at the edges around the antenna body of the antenna layer are subjected to flat pressing die cutting and/or circular knife die cutting by the second die cutting mechanism 10 to form the outline of the antenna body, then the antennas of the antenna layer are subjected to flat pressing die cutting and/or circular knife die cutting by the first die cutting mechanism to form the chip binding points 15 and the chip binding positioning points 14, then the preliminarily formed antenna body and the residual waste material antennas are formed on the second substrate layer, and the residual waste material antennas are rolled and discharged through the first waste material discharging rolling mechanism 11.

Referring to fig. 2, in a seventh production step of the processing technology of the fully die-cut ultrahigh frequency electronic tag antenna in this embodiment 1, the first die-cutting mechanism is divided into a flat-pressing die-cutting machine for performing flat-pressing die-cutting on one of the chip binding points 15 or a circular knife die-cutting machine 8 for performing circular knife die-cutting, and a flat-pressing die-cutting machine for performing flat-pressing die-cutting on the other of the chip binding points 15 and the chip binding positioning points 14 or a circular knife die-cutting machine 9 for performing circular knife die-cutting; in this embodiment 1, the first die cutting mechanism is divided into a circular knife die cutting machine 8 for performing circular knife die cutting on one of the chip binding points 15, and a circular knife die cutting machine 9 for performing circular knife die cutting on the other chip binding point 15 and the chip binding positioning point 14.

The circular knife die-cutting machine 8 for performing circular knife die-cutting on one of the chip binding points 15, the circular knife die-cutting machine 9 for performing circular knife die-cutting on the other chip binding point 15 and the chip binding positioning point 14, and the second die-cutting mechanism 10 for performing circular knife die-cutting on the antenna on the peripheral edge of the antenna body 17 of the antenna layer to form the outer contour of the antenna body 17 are adjustable and interchangeable at will, and the positions and the processing sequence of the three can be adjusted and interchanged at will, so that the processing on the outer contour of the chip binding positioning point 14, the chip binding point 15 and the antenna body 17 can be realized.

Step eight: after being wound and exhausted by the first exhaust and exhaust winding mechanism 11, the isolation layer is unwound by the third unwinding mechanism 12, so that the isolation layer is covered on the antenna or the first substrate layer of the preliminarily molded antenna body;

step nine: the antenna body covering the isolation layer is sent to a second traction device, the second traction device is used for helping the antenna body covering the isolation layer to be sent to a finished product winding mechanism, and the finished product winding mechanism 13 winds the antenna body to form a die-cut ultrahigh frequency electronic tag antenna finished product.

The antenna hole processing mechanism 4 is used for punching the antenna hole 16 in the antenna layer by adopting a flat pressing die cutting process or a circular knife die cutting process.

In the sixth step, in the process that the antenna layer after the antenna hole 16 is punched or the antenna layer compounded with the first base material layer is compounded with the second base material layer unreeled by the second unreeling mechanism 7 through the compounding mechanism 6, the heating drum of the compounding mechanism 6 synchronously heats the adhesive on the antenna layer, and the second base material layer is compounded with the antenna layer by using a glue stick or the second base material layer is compounded with the antenna layer compounded with the first base material layer;

naturally, the first die cutting mechanism may also perform two or more times of flat pressing die cutting and/or circular knife die cutting on the antenna of the antenna layer or the antenna of the antenna layer and the first substrate layer of the composite first substrate layer according to actual conditions to form the chip binding point and the chip binding positioning point. Although the operation is more complicated and the steps are more various, the processing precision can be improved, and the product quality is improved.

Embodiment 2, embodiment 2 is substantially the same as embodiment 1, except that: in the seventh production step of the processing technology of the fully die-cut ultrahigh frequency electronic tag antenna in embodiment 2, the first die-cutting mechanism is a die-cutting machine that performs platen die cutting and/or circular knife die cutting on the chip binding points 15 and the chip binding positioning points 14 at the same time, that is, the first die-cutting mechanism performs platen die cutting and/or circular knife die cutting on the chip binding points 15 and the chip binding positioning points 14 at one time, for example, the platen die-cutting machine is replaced by a circular knife die-cutting machine, and similar operations are performed to perform disposable platen die cutting on the antenna layer to form the chip binding points 15 and the chip binding positioning points 14, that is, the die-cutting tool of the platen die-cutting machine performs disposable die cutting on the chip binding points 15 and the chip binding positioning points 14 on the antenna layer, for example, the thickness of the blade of the die-cutting tool is controlled, so that the die-cutting tool can form a tool mold according to the shape requirements of, further, the purpose of one-time die cutting and forming of the chip binding points 15 and the chip binding positioning points 14 is achieved, for example, the die cutting of the chip binding points 15 and the chip binding positioning points 14 is achieved by parallel or certain inclined angles of the blades, and the die cutting device is particularly suitable for the situation that the distance between the chip binding points 15 and the chip binding positioning points 14 and/or between the adjacent chip binding points 15 and/or between the adjacent chip binding positioning points 14 is small. And then the second die cutting mechanism 10 performs flat pressing die cutting and/or circular knife die cutting on the antennas at the peripheral edge of the antenna body 17 of the antenna layer to form the outer contour of the antenna body 17.

The adjustment is performed according to actual conditions, for example, the first die-cutting mechanism performs one-time flat pressing die cutting and/or circular knife die cutting on the antenna of the antenna layer or the antenna layer and the first substrate layer of the composite first substrate layer to form a chip binding point and a chip binding positioning point.

The positions and the processing sequence of the first die cutting mechanism and the second die cutting mechanism can be interchanged.

Compared with the specific embodiment 1, the embodiment 2 has higher processing efficiency, and the chip binding points 15 and the chip binding points 14 are formed by one-time die cutting, so that the accuracy is higher.

Embodiment 3, embodiment 3 is substantially the same as embodiment 1, except that: in a seventh production step of the processing technology of the full-die-cut ultrahigh frequency electronic tag antenna in the specific embodiment 3, the first die cutting mechanism for die-cutting the chip binding and positioning points 14 and the chip binding and positioning points 15 and the second die cutting mechanism 10 for die-cutting the peripheral edge of the antenna body 17 are combined into a flat press die-cutting machine or a circular knife die-cutting machine.

That is, the first die cutting mechanism and the second die cutting mechanism 10 are combined into a flat press die cutting machine or a circular knife die cutting machine, and can complete the operation of forming the outer contour of the antenna body 17 by performing the flat press die cutting and/or the circular knife die cutting on the chip binding points 15, the flat press die cutting and/or the circular knife die cutting of the chip binding points 14 and the antennas at the peripheral edges of the antenna body 17 of the antenna layer at one time, for example, the flat press die cutting machine is replaced by the circular knife die cutting machine, and the similar operation is performed to perform the operation of performing the flat press die cutting on the antenna layer at one time to form the chip binding points 15, the chip binding points 14 and the outer contour of the antenna body 17, that is, the die cutting tool of the flat press die cutting machine performs the one-time die cutting on the chip binding points 15, the chip binding points 14 and the outer contour of the antenna body 17 on, the die cutting tool can form a tool die according to the shape requirements of the chip binding points 15, the chip binding positioning points 14 and the outer contour of the antenna body 17, and further achieve the purpose of performing one-time die cutting forming on the chip binding points 15, the chip binding positioning points 14 and the outer contour of the antenna body 17, for example, the die cutting of the chip binding points 15, the chip binding positioning points 14 and the outer contour of the antenna body 17 is achieved by the fact that adjacent blades are parallel or the blades have a certain inclination angle, and the die cutting tool is particularly suitable for the situation that the distance between the chip binding points 15 and the chip binding positioning points 14 and/or between the adjacent chip binding points 15 and/or between the adjacent chip binding positioning points 14 is small.

At this time, the second substrate layer and the antenna layer of the first substrate layer output by the combining mechanism 6 in the seventh step enter an input port of a flat-pressing die-cutting machine or a circular knife die-cutting machine combined by the first die-cutting mechanism and the second die-cutting mechanism 10, and the antenna layer output of the first substrate layer and the second substrate layer after being processed by the flat-pressing die-cutting machine or the circular knife die-cutting machine corresponds to an input port of the first waste-discharging winding mechanism 11 and an input port of the first traction device 24, wherein the waste antenna and the first substrate layer of the waste after being processed by the flat-pressing die-cutting machine and/or the circular knife die-cutting are discharged and wound by the first waste-discharging winding mechanism 11.

Compared with the specific embodiments 1 and 2, the embodiment 3 has higher processing efficiency, and the chip binding points 15, the chip binding positioning points 14, and the outer contour of the antenna body 17 are formed by one-time die cutting, so that the accuracy is higher.

Embodiment 4, referring to fig. 5, embodiment 4 is substantially the same as embodiment 1, except that: in specific embodiment 4, the number of the chip binding points is two, and the processing equipment further includes a second waste discharge winding mechanism 26;

the first die-cutting mechanism comprises a first flat die-cutting machine or a first circular knife die-cutting machine 8 for carrying out flat pressing die-cutting on one of the chip binding points, the redundant antennas on two sides of the antenna layer or the redundant antenna on the first substrate layer and the redundant antenna on two sides of the antenna layer and the redundant first substrate layer on two sides, and a second flat die-cutting machine or a second circular knife die-cutting machine 9 for carrying out flat pressing die-cutting on the other chip binding point 15 and the chip binding point 14; the input port of the first flat-die cutting machine or the first circular knife cutting machine corresponds to the output port of the compound mechanism 6, the output port of the first flat-die cutting machine or the first circular knife cutting machine corresponds to the input port of the second waste discharging and winding mechanism 26 and the input port of the second flat-die cutting machine or the second circular knife cutting machine 9, and the output port of the second flat-die cutting machine or the second circular knife cutting machine 9 corresponds to the input port of the second die cutting mechanism 10; at this time, the seventh step in the corresponding processing steps is that the antenna layer after the second substrate layer is compounded or the antenna layer after the second substrate layer and the first substrate layer are compounded is firstly subjected to flat pressing die cutting or circular knife die cutting by a first flat pressing die cutter or a first circular knife die cutter 8 of a first die cutting mechanism to one of the binding points of the chip, and simultaneously, the redundant antenna on two sides of the antenna layer or the redundant antenna on the first substrate layer and the redundant first substrate layer on two sides and the redundant antenna on two sides of the antenna layer and the redundant first substrate layer on two sides are subjected to flat pressing die cutting or circular knife die cutting to form two sides of residual antenna waste materials or two sides of residual antenna waste materials and first substrate waste materials, the two sides of residual antenna waste materials or two sides of residual antenna waste materials and first substrate waste materials are subjected to flat pressing die cutting or circular knife die cutting by a second flat pressing die cutter or a second circular knife die cutter 9 of the first die cutting mechanism to perform flat pressing, after the chip binding points 15 and the chip binding positioning points 14 are formed together, the antennas at the peripheral edges of the antenna body of the antenna layer are subjected to flat pressing die cutting and/or circular knife die cutting by the second die cutting mechanism 10 to form the outer contour of the antenna body, and the residual antenna waste materials or the residual antenna waste materials and the first substrate waste materials after the chip binding points 15, the chip binding positioning points 14 and the outer contour of the antenna body 17 are processed are rolled and discharged by the first waste discharge rolling mechanism 11; in the actual processing process, at least one row or even multiple rows of finished ultrahigh frequency electronic tag antennas parallel to the transportation direction (assumed to be the long direction) of the antenna layer to be processed or the antenna layer composited with the first substrate layer can be processed, in order to meet the width requirement of the die-cutting mechanism in each stage, especially the width requirement of the next processing die-cutting device in the first die-cutting mechanism or the second die-cutting mechanism positioned behind the first die-cutting mechanism on the antenna layer to be processed or the antenna layer composited with the first substrate layer, a die-cutting operation is added to the previous processing die-cutting device in the first die-cutting mechanism for die-cutting of redundant parts on two sides in the width direction of the antenna layer to be processed or the antenna layer composited with the first substrate layer, so as to meet the width requirement of the next processing die-cutting device in the first die-cutting mechanism or the second die-cutting mechanism positioned behind the first die-cutting mechanism on the antenna layer to be processed or the antenna layer composited with the first substrate layer.

Of course, in this embodiment 4, there may be an alternative that the first die cutting mechanism includes a first flat die cutting machine for performing flat die cutting on one of the die binding points or a first circular knife die cutting machine 8 for performing circular knife die cutting; the first die-cutting mechanism further comprises a second flat die-cutting machine or a second circular knife die-cutting machine 9 for performing flat-pressing die-cutting on the other chip binding point 15 and the chip binding point 14 and simultaneously performing flat-pressing die-cutting on the redundant antenna on two sides of the antenna layer or the redundant antenna on two sides of the first substrate layer and the redundant first substrate layer on two sides, wherein an input port of the first flat die-cutting machine or the first circular knife die-cutting machine 8 corresponds to an output port of the combining mechanism 6, an output port of the first flat die-cutting machine or the first circular knife die-cutting machine 8 corresponds to an input port of the second flat die-cutting machine or the second circular knife die-cutting machine 9, and an output port of the second flat die-cutting machine or the second circular knife die-cutting machine 9 corresponds to an input port of the second waste discharge winding mechanism; at this time, the seventh step in the corresponding processing steps is that the antenna layer after the second substrate layer is compounded or the antenna layer after the second substrate layer and the first substrate layer are compounded, firstly, a first flat die cutter or a first circular knife die cutter 8 of a first die cutting mechanism is used for carrying out flat die cutting or circular knife die cutting on one of the chip binding points, then, a second flat die cutter or a second circular knife die cutter 9 of the first die cutting mechanism is used for carrying out flat die cutting or circular knife die cutting on the other chip binding point 15 and the chip binding positioning point 14, simultaneously, the redundant antennas at two sides of the antenna layer or the redundant antennas at two sides of the first substrate layer and the redundant antennas at two sides of the antenna layer and the redundant first substrate layer at two sides are subjected to flat die cutting or circular knife die cutting to jointly form the chip binding point 15, the chip binding positioning point 14, the residual antenna waste materials at two sides or the residual antenna waste materials at two sides and the first substrate waste materials, and the residual antenna waste materials at two sides and the first, and then, carrying out flat-pressing die cutting and/or circular knife die cutting on the antennas at the edges around the antenna body of the antenna layer by using the second die cutting mechanism 10 to form the outer contour of the antenna body, and rolling and discharging waste by using the first waste discharging and rolling mechanism 11 for the residual antenna waste or the residual antenna waste and the first substrate waste after the chip binding points 15, the chip binding and positioning points 14 and the outer contour of the antenna body 17 are processed. The first flat die cutting machine or the first circular knife die cutting machine 8, the second flat die cutting machine or the second circular knife die cutting machine 9 of the first die cutting mechanism can also be exchanged in position, and the effects are the same.

In addition, the processing equipment also comprises an antenna hole waste material collecting device 5 which is used for collecting waste material antennas generated after the antenna hole processing mechanism 4 punches the holes or waste material antennas generated after the holes are punched and a waste material first base material layer; the antenna hole waste collecting device 5 is positioned below the antenna hole machining mechanism 4; when antenna hole 16 punches to the antenna layer of antenna layer or compound first substrate layer of antenna hole processing agency 4, be the antenna layer cross cutting that directly runs through antenna layer or compound first substrate layer, the waste material antenna or the waste material antenna and the first substrate layer of waste material of the corresponding antenna hole after punching get into in the lump or fall into garbage collection device 5, and garbage collection device 5 preferred setting is under antenna hole processing agency 4 bottoms.

In this embodiment 4, newly-increased second winding mechanism that gives up waste discharge and exhaust waste 26 can improve whole winding effect that gives up waste discharge cleaner, and the product percent of pass is higher, disperses the pressure of the first winding mechanism that gives up waste discharge, reduces the probability that the first winding mechanism that gives up waste discharge interrupted work.

The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent flow changes made by the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are included in the same way in the protection scope of the present invention.

Claims

1. An antenna processing device for a composite and multi-station full-die-cutting ultrahigh frequency tag relates to that a chip binding positioning point (14) formed by a die cutting mode and a chip binding point (15) formed by the die cutting mode are arranged on an antenna body (17) of an ultrahigh frequency tag antenna; antenna layer one side of antenna body (17) still pastes second substrate layer or first substrate layer and second substrate layer, its characterized in that: the antenna processing equipment for the composite and multi-station full-die cutting ultrahigh frequency tag comprises a first die cutting mechanism, a second die cutting mechanism and a traction mechanism, wherein the first die cutting mechanism is used for die cutting chip binding positioning points (14) and chip binding points (15) of the ultrahigh frequency tag antenna, the second die cutting mechanism is used for die cutting the periphery edge of the ultrahigh frequency tag antenna, and the traction mechanism is used for traction of an antenna layer of an antenna body (17) and/or an antenna layer of a composite first base material layer and/or an antenna layer of the composite first base material layer and a second base material layer in the processing process of the first die cutting mechanism and the second die cutting mechanism (10).

2. The antenna processing equipment for the compound and multi-station full-die cutting ultrahigh frequency tag according to claim 1, wherein the antenna processing equipment comprises: the antenna processing equipment for the composite and multi-station full-die-cutting ultrahigh frequency tag further comprises an antenna hole processing mechanism (4) for die-cutting an antenna hole (16) of the ultrahigh frequency tag antenna, a composite mechanism (6) for compounding a second substrate layer and an antenna layer or compounding the second substrate layer and a first substrate layer pasted with the antenna layer, a first waste discharge winding mechanism (11) for winding the waste material antenna processed by the first die-cutting mechanism and the second die-cutting mechanism (10) or winding the waste material antenna processed by the first die-cutting mechanism and the second die-cutting mechanism (10) and the waste material first substrate layer, and a third unwinding mechanism (12) for unwinding the isolation layer on the antenna layer; the traction mechanism is a first traction device (23) and a second traction device (24); an input port of the first traction device (23) inputs an antenna layer to be processed or an antenna layer adhered with a first base material layer, an output port of the first traction device (23) corresponds to an input port of the antenna hole processing mechanism (4), an output port of the antenna hole processing mechanism (4) corresponds to an input port of the compound mechanism (6), an output port of the compound mechanism (6) corresponds to an input port of the first die-cutting mechanism, an output port of the first die-cutting mechanism corresponds to an input port of the second die-cutting mechanism (10), an output port of the second die-cutting mechanism (10) corresponds to an input port of the first waste discharge winding mechanism (11) and an input port of the second traction device (24), an output port of the third unwinding mechanism (12) corresponds to an input port of the second traction device (24), and an output port of the second traction device (24) outputs an antenna of a processed ultrahigh frequency label;

or the traction mechanism is a first traction device (23) and a second traction device (24); the antenna layer that waits to process or the antenna layer of pasting first substrate layer is inputted to the input port of first draw gear (23), the delivery outlet of first draw gear (23) corresponds the input port of antenna hole machining mechanism (4), the delivery outlet of antenna hole machining mechanism (4) corresponds the input port of combined mechanism (6), the delivery outlet of combined mechanism (6) corresponds the input port of second die-cutting mechanism (10), the delivery outlet of second die-cutting mechanism (10) corresponds the input port of first die-cutting mechanism, the delivery outlet of first die-cutting mechanism corresponds the input port of first useless winding mechanism (11) of arranging and the input port of second draw gear (24), the delivery outlet of third unwinding mechanism (12) corresponds the input port of second draw gear (24), the delivery outlet of second draw gear (24) outputs the antenna of the ultrahigh frequency label that processing was accomplished.

3. The antenna processing equipment for the compound and multi-station full-die cutting ultrahigh frequency tag according to claim 2, characterized in that: the first die cutting mechanism consists of a flat-press die cutting mechanism, and the flat-press die cutting mechanism is a flat-press die cutting machine comprising at least one die cutting tool for flat-press die cutting of chip binding positioning points (14) and chip binding points (15);

or the first die-cutting mechanism is composed of a circular knife die-cutting mechanism, and the circular knife die-cutting mechanism is a circular knife die-cutting machine comprising at least one rolling cutting tool for die-cutting a chip binding positioning point (14) and a chip binding point (15) by a circular knife;

or the first die cutting mechanism is a mixed die cutting mechanism formed by mixing a flat-pressing die cutting mechanism and a circular cutter die cutting mechanism, and the mixed die cutting mechanism is a mixed die cutting machine comprising at least one die cutting cutter used for flat-pressing die cutting chip binding positioning points (14) or chip binding points (15) and at least one hob cutter used for circular cutter die cutting chip binding points (15) or chip binding positioning points (14);

the second die cutting mechanism (10) is a flat-pressing die cutting machine for flat-pressing the peripheral edge of the die cutting antenna body (17), or is a circular knife die cutting machine for circular knife die cutting the peripheral edge of the antenna body (17);

the antenna hole processing mechanism (4) is a flat pressing die-cutting machine for flat pressing die-cutting antenna holes (16) or a circular knife die-cutting machine for circular knife die-cutting antenna holes (16).

4. The antenna processing equipment for the compound and multi-station full-die-cutting ultrahigh frequency tag according to claim 3, wherein the antenna processing equipment comprises: the first die cutting mechanism used for die cutting the chip binding positioning points (14) and the chip binding points (15) and the second die cutting mechanism (10) used for die cutting the peripheral edges of the antenna body (17) are combined into a flat-pressing die cutting machine or a circular knife die cutting machine.

5. The antenna processing equipment for the compound and multi-station full-die-cutting UHF label as claimed in any one of claims 2 to 4, wherein: the processing equipment further comprises a first unreeling mechanism (1) for unreeling the antenna layer to be processed or compounding the antenna layer to be processed of the first base material layer, a coating mechanism (2) for coating an adhesive on one side of the antenna layer to be processed or one side of the first base material layer which is not adhered with the antenna layer, a drying mechanism (3) for drying the antenna layer coated with the adhesive by the coating mechanism (2) or drying mechanism (3) for drying the antenna layer coated with the adhesive by the coating mechanism (2) and compounding the first base material layer, a second unreeling mechanism (7) for unreeling the second base material layer, and a finished product reeling mechanism (13) for reeling the processed antenna layer, the second base material layer and the isolation layer together;

the output port of the first unwinding mechanism (1) corresponds to the input port of the coating mechanism (2), the output port of the coating mechanism (2) corresponds to the input port of the drying mechanism (3), the output port of the drying mechanism (3) corresponds to the input port of the first traction device (23), the output port of the second unwinding mechanism (7) corresponds to the input port of the composite mechanism (6), and the input port of the finished product winding mechanism (13) corresponds to the output port of the second traction device (24).

6. The antenna processing equipment for the compound and multi-station full-die-cutting ultrahigh frequency tag according to claim 5, wherein the antenna processing equipment comprises: a deviation correcting device (25) is additionally arranged between the drying mechanism (3) and the first traction device (23), an output port of the drying mechanism (3) corresponds to an input port of the deviation correcting device (25), and an output port of the deviation correcting device (25) corresponds to an input port of the first traction device (23).

7. The antenna processing equipment for the compound and multi-station full-die-cutting ultrahigh frequency tag according to claim 6, wherein the antenna processing equipment comprises: the first die cutting mechanism is divided into a flat press die cutting machine for performing flat press die cutting on one of the chip binding points (15) or a circular knife die cutting machine (8) for performing circular knife die cutting, and a flat press die cutting machine for performing flat press die cutting on the other chip binding point (15) and the chip binding point (14) or a circular knife die cutting machine (9) for performing circular knife die cutting;

the output port of the composite mechanism (6) corresponds to the input port of a flat-pressing die-cutting machine for carrying out flat-pressing die-cutting on one of the chip binding points (15) or a circular knife die-cutting machine (8) for carrying out circular knife die-cutting, the output port of the flat-pressing die-cutting machine for carrying out flat-pressing die-cutting on one of the chip binding points (15) or the circular knife die-cutting machine (8) for carrying out circular knife die-cutting corresponds to the input port of the flat-pressing die-cutting machine for carrying out flat-pressing die-cutting on the other chip binding point (15) and the chip binding positioning point (14) or the circular knife die-cutting machine (9) for carrying out circular knife die-cutting, and the output port of the flat-pressing die-cutting machine for carrying out flat-pressing die-cutting on the other chip binding point (15) and the chip binding positioning point (14) or the circular knife die-cutting machine;

or the output port of the composite mechanism (6) corresponds to the input port of a flat-die cutting machine or a circular knife cutting machine (9) which is used for carrying out flat-die cutting on another chip binding point (15) and a chip binding positioning point (14), the output port of the flat-die cutting machine or the circular knife cutting machine (9) which is used for carrying out flat-die cutting on another chip binding point (15) and a chip binding positioning point (14) corresponds to the input port of the flat-die cutting machine or the circular knife cutting machine (8) which is used for carrying out flat-die cutting on one of the chip binding points (15), and the output port of the flat-die cutting machine or the circular knife cutting machine (8) which is used for carrying out flat-die cutting on one of the chip binding points (15) corresponds to the input port of the second die cutting mechanism (10).

8. The antenna processing equipment for the compound and multi-station full-die-cutting ultrahigh frequency tag according to claim 6, wherein the antenna processing equipment comprises: the number of the chip binding points (15) is two, and the processing equipment further comprises a second waste discharge winding mechanism (26);

the first die-cutting mechanism comprises a first flat die-cutting machine or a first circular knife die-cutting machine for carrying out flat-pressing die-cutting on one of the chip binding points (15), redundant antennas on two sides of the antenna layer or redundant antennas on two sides of the first substrate layer and redundant first substrate layers at the same time, and a second flat die-cutting machine or a second circular knife die-cutting machine for carrying out flat-pressing die-cutting on the other chip binding point (15) and the chip binding point (14); the input port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the output port of the compound mechanism (6), the output port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the input port of the second waste discharge winding mechanism (26) and the input port of the second flat die-cutting machine or the second circular knife die-cutting machine, and the output port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the input port of the second die-cutting mechanism (10);

or the first die-cutting mechanism comprises a first flat die-cutting machine or a first circular knife die-cutting machine for carrying out flat-pressing die-cutting on one of the chip binding points (15), redundant antennas on two sides of the antenna layer or redundant antennas on two sides of the first substrate layer and redundant first substrate layers at the same time, and a second flat die-cutting machine or a second circular knife die-cutting machine for carrying out flat-pressing die-cutting on the other chip binding point (15) and the chip binding point (14); the input port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the output port of the compound mechanism (6), the output port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the input port of the first flat die-cutting machine or the first circular knife die-cutting machine, and the output port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the input port of the second waste discharge winding mechanism (26) and the input port of the second die-cutting mechanism (10);

or the first die-cutting mechanism comprises a first flat die-cutting machine for carrying out flat-pressing die-cutting on one chip binding point (15) or a first circular knife die-cutting machine for carrying out circular knife die-cutting, a second flat die-cutting machine for carrying out flat-pressing die-cutting on the other chip binding point (15) and the chip binding point (14), and a second circular knife die-cutting machine for simultaneously carrying out flat-pressing die-cutting on redundant antennas on two sides of the antenna layer or the first substrate layer, redundant antennas on two sides of the antenna layer and the redundant first substrate layer, the input port of the first flat die cutting machine or the first circular knife die cutting machine corresponds to the output port of the compound mechanism (6), the output port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the input port of the second flat die-cutting machine or the second circular knife die-cutting machine, and the output port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the input port of the second waste discharging and winding mechanism (26) and the input port of the second die-cutting mechanism (10).

Or the first die-cutting mechanism comprises a first flat die-cutting machine for carrying out flat-pressing die-cutting on one chip binding point (15) or a first circular knife die-cutting machine for carrying out circular knife die-cutting, a second flat die-cutting machine for carrying out flat-pressing die-cutting on the other chip binding point (15) and the chip binding point (14), and a second circular knife die-cutting machine for simultaneously carrying out flat-pressing die-cutting on redundant antennas on two sides of the antenna layer or the first substrate layer, redundant antennas on two sides of the antenna layer and the redundant first substrate layer, the input port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the output port of the compound mechanism (6), the output port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the input port of the second waste discharging and winding mechanism (26) and the input port of the first flat die-cutting machine or the first circular knife die-cutting machine, and the output port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the input port of the second die-cutting mechanism (10).

9. The apparatus for processing antenna of UHF tag as claimed in claim 7 or 8, wherein: the processing equipment also comprises an antenna hole (16) and a waste material collecting device (5), wherein the antenna hole (5) is used for collecting waste material antennas generated after the antenna hole processing mechanism (4) punches or waste material antennas generated after the antenna hole punching and a waste material first base material layer; the antenna hole (16) waste collecting device (5) is positioned below the antenna hole machining mechanism (4); the compound mechanism (6) is also provided with a heating drum for heating the adhesive; the composite mechanism (6) comprises a rubber roller for compounding the second substrate layer with the antenna layer or a rubber roller for compounding the second substrate layer with the antenna layer of the first substrate layer.