CN111275154B - Full-die-cut ultrahigh frequency electronic tag antenna and processing equipment and processing technology thereof - Google Patents

Full-die-cut ultrahigh frequency electronic tag antenna and processing equipment and processing technology thereof Download PDF

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Publication number
CN111275154B
CN111275154B CN202010050631.XA CN202010050631A CN111275154B CN 111275154 B CN111275154 B CN 111275154B CN 202010050631 A CN202010050631 A CN 202010050631A CN 111275154 B CN111275154 B CN 111275154B
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antenna
layer
die
substrate layer
die cutting
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CN111275154A (en
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黄光伟
黄金良
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07775—Antenna details the antenna being on-chip
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07786—Antenna details the antenna being of the HF type, such as a dipole

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Details Of Aerials (AREA)

Abstract

The invention provides a full-die-cut ultrahigh frequency electronic tag antenna, and processing equipment and processing technology thereof, wherein the full-die-cut ultrahigh frequency electronic tag antenna comprises an antenna body and is characterized in that: the antenna body is provided with a chip binding positioning point formed by a die cutting mode and a chip binding point formed by the die cutting mode. The invention solves the problem of how to avoid using etching technology to produce the chip binding points and the chip binding positioning points of the ultra-high frequency electronic tag antenna in the prior art.

Description

Full-die-cut ultrahigh frequency electronic tag antenna and processing equipment and processing technology thereof
Technical Field
The invention relates to the technical field of electronic tags, in particular to a full-die-cut ultrahigh frequency electronic tag antenna and processing equipment and processing technology thereof.
Background
At present, the chip binding points and the chip binding positioning points of the ultrahigh frequency electronic tag antenna are still produced by adopting an etching process, and chemical substances such as hydrochloric acid and the like are needed by adopting the etching process, so that the environmental influence is large, and therefore, how to avoid the production of the chip binding points and the chip binding positioning points of the ultrahigh frequency electronic tag antenna by adopting the etching process becomes a problem to be solved urgently.
In addition, how to completely avoid the problem of etching process in the production process of the ultra-high frequency electronic tag antenna is also a problem to be solved
Disclosure of Invention
The invention aims to provide a full die-cut ultrahigh frequency electronic tag antenna, and processing equipment and processing technology thereof, which mainly solve the problems in the prior art: how to avoid using etching technology to produce the chip binding point and the chip binding positioning point of the ultrahigh frequency electronic tag antenna is called as the problem to be solved urgently, and the problem II is that: the problem of etching technology is completely avoided in the production process of the ultrahigh frequency electronic tag antenna, and the ultrahigh frequency electronic tag antenna with the full die cutting, and the processing equipment and the processing technology thereof are provided.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows: the utility model provides a full die-cut ultrahigh frequency electronic tags antenna, includes antenna body, its characterized in that: the antenna body is provided with a chip binding positioning point formed by a die cutting mode and a chip binding point formed by the die cutting mode.
Further, the peripheral edges of the antenna body are formed in a die cutting mode.
Further, the antenna body is also provided with an antenna hole formed by a die cutting mode.
Further, the number of the chip binding points is two, the number of the antenna holes is one, and gaps formed between the chip binding points are communicated with the antenna holes and the outside of the antenna.
Further, the die cutting mode is flat press die cutting and/or circular knife die cutting; a first substrate layer or a first substrate layer and a second substrate layer are also adhered to one side of the antenna layer of the antenna body, the first substrate layer is a polyester film, and the second substrate layer is a polyester film or paper.
The utility model provides a processing equipment of full cross cutting ultrahigh frequency electronic tag antenna, includes the first cross cutting mechanism that is used for cross cutting chip binding setpoint and chip binding point, its characterized in that: the first die cutting mechanism is composed of a flat die cutting mechanism, and the flat die cutting mechanism is a flat die cutting machine comprising at least one die cutting tool for flat die cutting of chip binding positioning points and chip binding points;
or the first die cutting mechanism is composed of a circular cutter die cutting mechanism, and the circular cutter die cutting mechanism is a circular cutter die cutting machine comprising at least one rolling cutter for die cutting a chip binding positioning point and a chip binding point of the circular cutter;
or the first die cutting mechanism is a mixed die cutting mechanism formed by mixing a flat die cutting mechanism and a circular cutter die cutting mechanism, and the mixed die cutting mechanism is a mixed die cutting machine comprising at least one die cutting tool for flat die cutting a chip binding positioning point or a chip binding point and at least one hob cutting tool for circular cutter die cutting the chip binding point or the chip binding positioning point.
Further, the processing equipment further comprises a second die cutting mechanism for die cutting the peripheral edge of the antenna body, wherein the second die cutting mechanism is a flat die cutting machine for flat die cutting the peripheral edge of the antenna body or a circular cutter die cutting machine for circular cutter die cutting the peripheral edge of the antenna body.
Further, the first die cutting mechanism for die cutting the chip binding positioning points and the chip binding points and the second die cutting mechanism for die cutting the peripheral edges of the antenna body are combined into a flat die cutting machine or a circular cutter die cutting machine.
Further, the processing equipment further comprises an antenna hole processing mechanism for die-cutting the antenna holes, wherein the antenna hole processing mechanism is a flat die-cutting machine for flat die-cutting the antenna holes and an antenna hole waste collection device, or the antenna hole processing mechanism is a circular cutter die-cutting machine for circular cutter die-cutting the antenna holes and an antenna hole waste collection device.
Further, the processing equipment further comprises a first unreeling mechanism for unreeling the antenna layer to be processed or the antenna layer to be processed of the composite first substrate layer, a coating mechanism for coating an adhesive on one side of the antenna layer to be processed or one side of the first substrate layer, which is not adhered with the antenna layer, a second unreeling mechanism for unreeling the second substrate layer, a composite mechanism for compositing the second substrate layer and the antenna layer to be processed/part of the antenna layer to be processed or compositing the second substrate layer and the antenna layer to be processed of the composite first substrate layer, a waste discharge reeling mechanism for reeling the processed waste antenna or the processed waste antenna and the waste first substrate layer, a third unreeling mechanism for unreeling an isolating layer on the antenna layer, and a finished reeling mechanism for reeling the processed antenna layer, the substrate layer and the isolating layer together;
The antenna layer to be processed of the first unreeling mechanism or the antenna layer to be processed of the composite first substrate layer correspondingly enters an input port of the coating mechanism, the antenna layer after coating or the antenna layer of the composite first substrate layer after coating output by the coating mechanism enters an input port of a corresponding antenna hole processing mechanism, the antenna layer after punching the antenna hole or the antenna layer of the composite first substrate layer after punching the antenna hole output by the antenna hole processing mechanism enters an input port of a corresponding composite mechanism, simultaneously, the second substrate layer unreeled by the second unreeling mechanism also enters the input port of the corresponding compounding mechanism, the antenna layer of the compounded second substrate layer or the antenna layer of the compounded second substrate layer and the antenna layer of the first substrate layer output by the compounding mechanism enter the input port of the first die-cutting mechanism, then enter the input port of the second die-cutting mechanism from the output port of the first die-cutting mechanism, the output port of the second die-cutting mechanism outputs the antenna layer of the compounded second substrate layer after being subjected to flat die-cutting and/or circular cutter die-cutting processing or the antenna layer of the compounded first substrate layer and the antenna layer of the second substrate layer after being subjected to flat die-cutting and/or circular cutter die-cutting processing, wherein the waste antenna after flat-press die cutting and/or circular knife die cutting processing or the waste antenna after flat-press die cutting and/or circular knife die cutting processing corresponds to the input port of the waste discharging and winding mechanism, the antenna layer and the second substrate layer after flat-press die cutting and/or circular knife die cutting processing enter the corresponding third unreeling mechanism, and after a layer of isolating layer is overlapped on the antenna layer or the first substrate layer through the third unreeling mechanism, an antenna layer which is compounded with the second substrate layer and is overlapped with the isolation layer or an antenna layer which is compounded with the second substrate layer and is overlapped with the first substrate layer and is overlapped with the isolation layer enters an input port of a finished product winding mechanism;
Or the antenna layer to be processed of the first unreeling mechanism or the antenna layer to be processed of the composite first substrate layer correspondingly enters an input port of the coating mechanism, the antenna layer after coating or the antenna layer of the composite first substrate layer after coating output by the coating mechanism enters an input port of a corresponding antenna hole processing mechanism, the antenna layer after punching the antenna hole output by the antenna hole processing mechanism or the antenna layer of the composite first substrate layer after punching the antenna hole enters an input port of a corresponding composite mechanism, simultaneously, the second substrate layer unreeled by the second unreeling mechanism also enters an input port of a corresponding composite mechanism, the antenna layer of the composite second substrate layer or the antenna layer of the composite second substrate layer and the antenna layer of the first substrate layer output by the composite mechanism enter an input port of a second die cutting mechanism, then the waste antenna after flat die cutting and/or circular cutter die cutting or the waste antenna after flat die cutting and/or circular cutter die cutting and the waste first substrate layer correspond to the input port of the waste discharging and winding mechanism, the antenna layer after flat die cutting and/or circular cutter die cutting and the second substrate layer enter corresponding third unreeling mechanism, and after a layer of isolating layer is overlapped on the antenna layer or the first substrate layer through the third unreeling mechanism, an antenna layer which is compounded with the second substrate layer and is overlapped with the isolation layer or an antenna layer which is compounded with the second substrate layer and is overlapped with the first substrate layer and is overlapped with the isolation layer enters an input port of a finished product winding mechanism;
Or the antenna layer to be processed of the first unreeling mechanism or the antenna layer to be processed of the composite first substrate layer correspondingly enters an input port of a coating mechanism, the antenna layer after coating output by the coating mechanism or the antenna layer of the composite first substrate layer after coating enters an input port of a corresponding antenna hole processing mechanism, the antenna layer after punching the antenna hole output by the antenna hole processing mechanism or the antenna layer of the composite first substrate layer after punching the antenna hole enters an input port of a corresponding composite mechanism, simultaneously, the second substrate layer unreeled by the second unreeling mechanism also enters an input port of a corresponding composite mechanism, the antenna layer of the composite second substrate layer or the antenna layer of the composite second substrate layer and the antenna layer of the first substrate layer output by the composite mechanism enter an input port of a flat die-cutting machine or a circular cutter die-cutting machine which is combined by the first die-cutting mechanism and the second die-cutting mechanism, outputting the antenna layer which is subjected to flat die cutting and/or circular cutter die cutting processing and is compounded with the second substrate layer or the antenna layer which is subjected to flat die cutting and/or circular cutter die cutting processing and is compounded with the first substrate layer and the second substrate layer by an output port of the flat die cutting machine or circular cutter die cutting machine, wherein the waste antenna subjected to flat die cutting and/or circular cutter die cutting processing or the waste antenna subjected to flat die cutting and/or circular cutter die cutting processing and the first substrate layer of waste correspond to an input port of a waste discharging and winding mechanism, the antenna layer subjected to flat die cutting and/or circular cutter die cutting processing and the second substrate layer enter corresponding to a third unreeling mechanism, and after a layer of isolating layer is overlapped on the antenna layer or the first substrate layer by the third unreeling mechanism, and an antenna layer which is compounded with the second substrate layer and is overlapped with the isolation layer or an antenna layer which is compounded with the second substrate layer and the first substrate layer and is overlapped with the isolation layer enters an input port of the finished product winding mechanism.
Further, the number of the chip binding points is two, and the first die cutting mechanism is divided into a flat die cutting machine for carrying out flat die cutting on one chip binding point or a round cutter die cutting machine for carrying out round cutter die cutting, and a flat die cutting machine for carrying out flat die cutting on the other chip binding point and the chip binding positioning point or a round cutter die cutting machine for carrying out round cutter die cutting;
the antenna layer of the composite second substrate layer or the antenna layer of the composite second substrate layer and the antenna layer of the first substrate layer output by the composite mechanism entering the input port of the first die-cutting mechanism means that the antenna layer of the composite second substrate layer or the antenna layer of the composite second substrate layer and the antenna layer of the first substrate layer output by the composite mechanism enters a flat die cutter for flat die cutting or a round die cutter for round die cutting of one chip binding point, and then enters a flat die cutter for flat die cutting or a round die cutter for round die cutting of the other chip binding point and the chip binding point; or the antenna layer of the composite second substrate layer and the antenna layer of the first substrate layer output by the composite mechanism is firstly used for carrying out flat die cutting on the other chip binding point and the chip binding positioning point or is firstly used for carrying out round-knife die cutting, and then enters into a flat die cutting machine used for carrying out flat die cutting on one chip binding point or a round-knife die cutting machine used for carrying out round-knife die cutting.
Further, the compounding mechanism is also provided with a heating drum for heating the adhesive; the compounding mechanism comprises a rubber roller for compounding the second substrate layer with the antenna layer or a rubber roller for compounding the second substrate layer with the antenna layer compounding the first substrate layer.
Further, the processing equipment further comprises a drying mechanism for drying the antenna layer coated with the adhesive by the coating mechanism or a drying mechanism for drying the antenna layer coated with the adhesive by the coating mechanism and composited with the first substrate layer, and the drying mechanism corresponds to an output port of the coating mechanism and an input port of the antenna hole processing mechanism.
A processing technology of a full die-cut ultrahigh frequency electronic tag antenna is characterized by comprising the following steps of: the production steps of the processing technology comprise that the first die cutting mechanism is used for carrying out flat die cutting and/or circular knife die cutting on the antenna of the antenna layer or the antenna of the antenna layer of the composite first substrate layer to form chip binding points and/or chip binding positioning points.
A processing technology of a full die-cut ultrahigh frequency electronic tag antenna is characterized by comprising the following production steps:
step one, unreeling an antenna layer to be processed or an antenna layer of a composite first substrate layer of a first unreeling mechanism, and coating an adhesive on one side of the antenna layer to be processed or one side of the antenna layer of the composite first substrate layer, which is not adhered with the antenna layer, by a coating mechanism;
Secondly, the antenna layer after coating or the antenna layer of the composite first substrate layer after coating is subjected to antenna hole punching through an antenna hole processing mechanism, and a waste antenna generated after punching or a waste antenna generated after punching and a waste first substrate layer enter an antenna hole waste collection device;
step three, the antenna layer after the perforation of the antenna hole or the antenna layer of the composite first substrate layer after the perforation of the antenna hole is composited with the second substrate layer of the second unreeling mechanism through the compositing mechanism, namely the second substrate layer is bonded with the antenna layer or the first substrate layer through the bonding agent;
fourthly, the antenna layer after the second substrate layer is compounded is subjected to flat die cutting and/or circular knife die cutting through a first die cutting mechanism to form a chip binding point and a chip binding positioning point, then subjected to flat die cutting and/or circular knife die cutting through a second die cutting mechanism to form the outer contour of the antenna body, and then the antenna body and the residual waste antenna which are formed in a preliminary mode are formed on the second substrate layer;
or the antenna layer after the second substrate layer and the first substrate layer are compounded is subjected to flat die cutting and/or circular knife die cutting to form a chip binding point and a chip binding positioning point simultaneously by a first die cutting mechanism, then is subjected to die cutting and/or roller cutting to form the outer contour of the antenna body by a second die cutting mechanism, and then the preliminarily formed antenna body of the first substrate layer, the residual waste antenna and the corresponding residual waste first substrate layer are formed on the second substrate layer;
Or the antenna layer after the second substrate layer is compounded, firstly carrying out flat die cutting and/or circular knife die cutting on the antennas at the peripheral edges of the antenna body of the antenna layer through a second die cutting mechanism to form the outer outline of the antenna body, then carrying out flat die cutting and/or circular knife die cutting on the antennas of the antenna layer through a first die cutting mechanism to form chip binding points and chip binding positioning points, and then forming a preliminarily formed antenna body and residual waste antennas on the second substrate layer;
or the antenna layer of the composite second substrate layer and the antenna layer of the first substrate layer are subjected to flat die cutting and/or circular cutter die cutting on the antenna and the first substrate layer corresponding to the peripheral edges of the antenna body of the antenna layer through a second die cutting mechanism to form the outer outline of the antenna body, then the antenna and the first substrate layer of the antenna layer are subjected to flat die cutting and/or circular cutter die cutting through the first die cutting mechanism to form a chip binding point and a chip binding positioning point, and then the antenna body of the composite first substrate layer, the residual waste antenna and the corresponding residual waste first substrate layer which are formed preliminarily are formed on the second substrate layer;
step five, winding the residual waste antenna or the residual waste antenna and the first substrate layer corresponding to the residual waste through a waste discharge winding mechanism;
Step six, after waste discharge, unreeling the isolation layer through a third unreeling mechanism so that the isolation layer is covered on the antenna or the first substrate layer of the antenna body formed preliminarily;
and step seven, winding the antenna body covering the isolation layer through a finished product winding mechanism to form a die-cut ultra-high frequency electronic tag antenna finished product.
Further, the antenna hole processing mechanism is used for punching the antenna holes on the antenna layer, and a flat press die cutting process or a circular knife die cutting process is adopted.
Further, the coating mechanism is used for coating the adhesive on the antenna layer or the first substrate layer and contains a diluting solvent.
And a step of drying the antenna layer coated with the adhesive or the antenna layer compounded with the first substrate layer by using a drying mechanism, and then conveying the dried antenna layer or the antenna layer compounded with the first substrate layer to an antenna hole processing mechanism for punching an antenna hole.
Further, the temperature range of the drying mechanism is 40 ℃ to 160 ℃.
Further, the compounding mechanism in the third step is further provided with a heating drum, and the heating drum synchronously heats the adhesive on the antenna layer in the process that the antenna layer after the perforation of the antenna hole or the antenna layer compounded with the first substrate layer is compounded with the second substrate layer unreeled by the second unreeled mechanism through the compounding mechanism.
Further, the temperature of the heating drum ranges from 50 degrees celsius to 200 degrees celsius.
Further, the first die cutting mechanism performs one-time platen die cutting and/or circular knife die cutting on the antenna of the antenna layer or the antenna of the antenna layer of the composite first substrate layer to form a chip binding point and a chip binding positioning point;
or the first die cutting mechanism carries out two or more times of flat die cutting and/or circular knife die cutting on the antenna of the antenna layer or the antenna of the antenna layer of the composite first substrate layer to form a chip binding point and a chip binding positioning point.
In view of the technical characteristics, the invention has the following beneficial effects:
1. according to the full-die-cut ultrahigh frequency electronic tag antenna, the die-cutting forming mode is adopted for the die-cutting forming mode of the die-binding points and the die-binding positioning points, such as flat die cutting and/or circular knife die cutting, so that the full-die-cut ultrahigh frequency electronic tag antenna is separated from an etching process, and the influence and/or pollution of chemical substances generated by the etching process on the environment can be effectively reduced.
2. According to the full-die-cut ultrahigh frequency electronic tag antenna, a die cutting mode, such as platen die cutting and/or circular knife die cutting, can be adopted for perforation of the antenna holes, so that the full-die-cut ultrahigh frequency electronic tag antenna is separated from an etching process, and the influence and/or pollution of chemical substances generated by the etching process on the environment can be effectively reduced.
3. According to the full-die-cut ultrahigh frequency electronic tag antenna, die cutting modes, such as platen die cutting and/or circular knife die cutting, can be adopted for the peripheral edge parts of the antenna body, so that the full-die-cut ultrahigh frequency electronic tag antenna is separated from an etching process, and the influence and/or pollution of chemical substances generated by the etching process on the environment can be effectively reduced.
4. In the processing equipment of the full die-cut ultrahigh frequency electronic tag antenna, the positions and the processing sequences of the chip binding points, the chip binding positioning points and the processing equipment of the peripheral edge parts of the antenna body can be interchanged, and the processing effects of the chip binding points, the chip binding positioning points and the peripheral edge parts of the antenna body are not influenced.
5. The processing technology of the full-die-cut ultrahigh frequency electronic tag antenna provided by the invention only comprises a processing mode of die-cutting and forming a die-binding point and a die-binding positioning point, and is included in the protection scope of the invention, the processing mode can help the full-die-cutting processing of the ultrahigh frequency electronic tag antenna, and the production of the ultrahigh frequency electronic tag antenna can be carried out at the lowest point of environmental pollution without any etching technology, and even is basically harmless.
Drawings
Fig. 1 is a schematic structural diagram of a full die-cut ultrahigh frequency electronic tag antenna in embodiment 1.
Fig. 2 is a schematic structural diagram of a processing apparatus for a full die-cut ultrahigh frequency electronic tag antenna in embodiment 1.
Fig. 3 is a schematic cross-sectional structure of an all-die-cut ultrahigh frequency electronic tag antenna (without the first substrate layer) in embodiment 1.
Fig. 4 is a schematic cross-sectional structure of an all-die-cut ultrahigh frequency electronic tag antenna (including a first substrate layer) in embodiment 1.
In the figure: 1 is a first unreeling mechanism; 2 is a coating mechanism; 3 is; 4 is an antenna hole processing mechanism; 5 is an antenna hole waste collection device; 6 is a compound mechanism; 7 is a second unreeling mechanism; 8 is a circular knife die-cutting machine used for performing circular knife die-cutting on one of the chip binding points in the first die-cutting mechanism; 9 is a circular cutter die-cutting machine used for die-cutting a circular cutter on another chip binding point and another chip binding positioning point in the first die-cutting mechanism; 10 is a second die cutting mechanism; 11 is a waste discharging winding mechanism; 12 is a third unreeling mechanism; 13 is a finished product winding mechanism; 14 is a chip binding positioning point; 15 is a chip binding point; 16 is an antenna aperture; 17 is an antenna body; 18 is aluminum foil; 19 is an adhesive applied by the coating mechanism; 20 is paper as the second substrate layer, 21 is PET layer as the first substrate layer; and 22 is an adhesive for pre-compounding the PET layer and the aluminum foil.
Detailed Description
The invention is further described below in conjunction with the detailed description. It is to be understood that these examples are illustrative of the present invention and are not intended to limit the scope of the present invention. Further, it is understood that various changes and modifications may be made by those skilled in the art after reading the teachings of the present invention, and such equivalents are intended to fall within the scope of the claims appended hereto.
Referring to fig. 1 and fig. 2, in particular embodiment 1, a full die-cut ultrahigh frequency electronic tag antenna includes an antenna body 17, and is characterized in that: the antenna body 17 is provided with a die bonding location point 14 formed by a die cutting mode and a die bonding location point 15 formed by a die cutting mode.
The die cutting mode is adopted to manufacture the chip binding positioning points 14 and 15 of the ultrahigh frequency electronic tag antenna, so that the etching process is avoided in the process of producing the chip binding positioning points 14 and 15, and the pollution of chemical substances to the environment can be effectively reduced; in addition, the chip binding positioning points 14 and the chip binding points 15 formed in a die cutting mode have smooth and round edges, uneven edge shapes can not exist, and the quality of the ultrahigh frequency electronic tag antenna is improved.
The peripheral edge of the antenna body 17 is formed by die cutting.
The antenna body 17 is further provided with an antenna hole 16 formed by die cutting.
That is, all parts on the ultra-high frequency electronic tag antenna can be die-cut, the whole ultra-high frequency electronic tag antenna can be produced by die-cut, the complete etching process can be separated, and the pollution to the environment is minimized, even no chemical pollution is caused.
The die cutting mode can adopt flat die cutting and/or circular knife die cutting, and the circular knife die cutting is also called rolling cutting; die cutting may also be used.
In this embodiment 1, there are two chip bonding points 15, one antenna hole 16, and a slot formed between the chip bonding points 15 communicates with the antenna hole 16 and the outside of the antenna.
A first substrate layer, or a first substrate layer and a second substrate layer, are adhered to one side of the antenna layer of the antenna body 17, the first substrate layer is a polyester film, and the second substrate layer is a polyester film or paper, wherein the polyester film is preferably a PET layer; the antenna of the antenna layer may be a metal foil such as an aluminum foil, a copper foil, or the like, and in this embodiment 1, the antenna of the antenna layer is preferably an aluminum foil.
The processing equipment of full cross cutting ultrahigh frequency electronic tag antenna, including being used for the cross cutting chip to bind the first cross cutting mechanism of setpoint 14 and chip binding point 15, its characterized in that: the first die cutting mechanism is composed of a flat die cutting mechanism, and the flat die cutting mechanism is a flat die cutting machine comprising at least one die cutting tool for flat die cutting of the chip binding positioning point 14 and the chip binding point 15;
Or the first die cutting mechanism is composed of a circular cutter die cutting mechanism, and the circular cutter die cutting mechanism is a circular cutter die cutting machine comprising at least one rolling cutter for die cutting a chip binding positioning point 14 and a chip binding point 15 by the circular cutter;
or the first die cutting mechanism is a mixed die cutting mechanism formed by mixing a flat die cutting mechanism and a circular cutter die cutting mechanism, and the mixed die cutting mechanism is a mixed die cutting machine comprising at least one die cutting tool for flat die cutting a chip binding positioning point 14 or a chip binding positioning point 15 and at least one hob cutting tool for circular cutter die cutting the chip binding positioning point 15 or the chip binding positioning point 14.
The processing device further comprises a second die cutting mechanism 10 for die cutting the peripheral edge of the antenna body 17, wherein the second die cutting mechanism 10 is a flat die cutter for flat die cutting the peripheral edge of the antenna body 17 or a circular cutter die cutter for circular cutter die cutting the peripheral edge of the antenna body 17.
The processing equipment further comprises an antenna hole processing mechanism 4 for die-cutting the antenna holes 16, wherein the antenna hole processing mechanism 4 is a flat die-cutting machine for flat die-cutting the antenna holes 16 and an antenna hole waste collection device 5, or the antenna hole processing mechanism 4 is a circular knife die-cutting machine for circular knife die-cutting the antenna holes 16 and the antenna hole waste collection device 5. When the antenna hole processing mechanism 4 punches the antenna hole 16 on the antenna layer or the antenna layer of the composite first substrate layer, the antenna layer is directly cut through the antenna layer or the antenna layer of the composite first substrate layer, the punched waste antenna or the waste antenna corresponding to the antenna hole or the waste first substrate layer enters or falls into the waste collecting device 5, and the waste collecting device 5 is preferably arranged in a waste collecting box at the bottom of the antenna hole processing mechanism 4.
That is to say, the first die cutting mechanism, the second die cutting mechanism 10 and the antenna hole processing mechanism 4 can select a flat die cutting mechanism and/or a circular knife die cutting mechanism according to actual conditions to realize a die cutting process, so that the requirements of the full die cutting ultrahigh frequency electronic tag antenna on the die cutting process are met, and especially the requirements of the chip binding positioning points 14, the chip binding points 15, the peripheral edges of the antenna body 17 and the antenna holes 16 on the die cutting process are met.
The processing equipment further comprises a first unreeling mechanism 1 for unreeling an antenna layer to be processed or a first substrate layer to be processed, a coating mechanism 2 for coating an adhesive on one side of the antenna layer to be processed or one side of the first substrate layer, which is not adhered with the antenna layer, a second unreeling mechanism 7 for unreeling a second substrate layer, a compounding mechanism 6 for compounding the second substrate layer and the antenna layer to be processed/part of the antenna layer to be processed or compounding the second substrate layer and the antenna layer to be processed of the first substrate layer, a waste discharge reeling mechanism 11 for reeling the processed waste antenna or the processed waste antenna and the waste first substrate layer, a third unreeling mechanism 12 for unreeling an isolating layer on the antenna layer, and a finished reeling mechanism 13 for reeling the processed antenna layer, the substrate layer and the isolating layer together;
When the full-die-cut ultrahigh frequency electronic tag antenna is not provided with the first substrate layer in the processing process, the coating mechanism directly coats an adhesive on one side of the antenna layer when the antenna layer is processed, when the first die-cutting mechanism is used for die-cutting the chip binding positioning points 14 and 15, the second die-cutting mechanism 10 is used for die-cutting the peripheral edges of the antenna body 17, and the antenna hole processing mechanism 4 is used for die-cutting the antenna holes 16, the first substrate layer and the antenna layer can be die-cut simultaneously, but the second substrate layer is not die-cut. The adhesive at this time is used to compound the antenna layer and the second substrate layer together by the compounding mechanism 7, that is, the antenna layer and the second substrate layer are bonded together with the adhesive. The finished product of the full die-cut ultrahigh frequency electronic tag antenna produced on the premise is an antenna layer (namely aluminum foil 18) which is bonded with a second substrate layer (namely paper 20) through an adhesive 19 of a coating mechanism 2 from top to bottom, and the detail is shown in fig. 3.
When the full die-cut ultrahigh frequency electronic tag antenna is processed, the first substrate layer can be added, or the first substrate layer can be omitted. Preferably, a first substrate layer is adopted, the first substrate layer is used for supporting an antenna on the antenna layer, the first substrate layer protects the antenna in the antenna layer processing process, at the moment, the coating mechanism 2 coats an adhesive on one side of the first substrate layer, which is not adhered with the antenna layer, when the first die cutting mechanism dies the die bonding positioning point 14 and the die bonding point 15, the second die cutting mechanism 10 dies the peripheral edge of the antenna body 17, and the antenna hole processing mechanism 4 dies the antenna hole 16, the first substrate layer and the antenna layer can be die-cut simultaneously, but the second substrate layer is not die-cut. The adhesive is used for compounding the first substrate layer and the second substrate layer together by a compounding mechanism, i.e., the first substrate layer and the second substrate layer are bonded together by the adhesive.
In this embodiment 1, the full die-cut ultrahigh frequency electronic tag antenna takes the antenna layer to be processed of the composite first substrate layer as an example (if the composite first substrate layer is not present, the antenna layer to be processed of the composite first substrate layer can be directly replaced by the antenna layer to be processed), and the connection relationships of the devices are as follows: the antenna layer to be processed of the unreeled composite first substrate layer of the first unreeled mechanism 1 correspondingly enters the input port of the coating mechanism 2, the antenna layer of the coated composite first substrate layer outputted by the coating mechanism 2 (at the moment, the adhesive is coated on one side surface of the first substrate layer, which is not adhered with the antenna layer) enters the input port of the corresponding antenna hole processing mechanism 4, the antenna layer of the composite first substrate layer after being punched by the antenna hole 16 outputted by the antenna hole processing mechanism 4 enters the input port of the corresponding composite mechanism 6, meanwhile, the unreeled second substrate layer of the second unreeled mechanism 7 also enters the input port of the corresponding composite mechanism 6, the composite second substrate layer outputted by the composite mechanism 6 and the antenna layer of the first substrate layer enter the input port of the first die-cutting mechanism (at the moment, the first substrate layer and the second substrate layer are adhered and compounded by the adhesive), and then the waste antenna and the waste first substrate layer which are subjected to flat die cutting and/or circular knife die cutting are corresponding to the input port of the waste discharging and winding mechanism 11, the antenna layer and the second substrate layer which are subjected to flat die cutting and/or circular knife die cutting are corresponding to the third unreeling mechanism 12, and after an isolating layer is overlapped on the antenna layer or the first substrate layer through the third unreeling mechanism 12, the antenna layer which is compounded with the second substrate layer and the first substrate layer and overlapped with the isolating layer is input port of the finished product winding mechanism 13. The finished product of the full die-cut ultrahigh frequency electronic tag antenna is formed at this time, and the antenna layer (namely the aluminum foil 18) and the antenna layer are adhered and compounded with a first substrate layer (namely the first substrate layer is namely the PET layer 21, the adhering and compounding here means that after the PET layer 21 is compounded with the aluminum foil 18 in advance through an adhesive 22 for compounding and adhering the PET layer 21 and the aluminum foil 18 in advance, the antenna layer compounded with the first substrate layer is put into the coating mechanism 2 through the first unreeling mechanism 1), and the first substrate layer (namely the PET layer 21) is adhered and compounded with a second substrate layer (namely the paper 20) through an adhesive 19 of the coating mechanism, and the details are shown in fig. 4.
The first die cutting mechanism and the second die cutting mechanism 10 can be interchanged in both position and processing sequence.
The method comprises the following steps: the antenna layer of the composite second substrate layer or the antenna layer of the composite second substrate layer and the antenna layer of the first substrate layer output by the composite mechanism 6 enters the input port of the second die-cutting mechanism 10, then enters the input port of the first die-cutting mechanism from the output port of the second die-cutting mechanism 10, and the output port of the first die-cutting mechanism outputs the antenna layer of the composite second substrate layer after being subjected to flat die-cutting and/or round cutter die-cutting or the antenna layer of the composite first substrate layer and the antenna layer of the second substrate layer after being subjected to flat die-cutting and/or round cutter die-cutting, wherein the waste antenna after being subjected to flat die-cutting and/or round cutter die-cutting or the waste antenna and the waste first substrate layer correspond to the input port of the waste discharging and winding mechanism 11.
The composite mechanism 6 is also provided with a heating drum for heating the adhesive, the adhesive is convenient for bonding between the second substrate layer and one side surface of the first substrate layer, which is not adhered with the antenna layer, and the composite adhering function of the second substrate layer and the first substrate layer can be better realized after the composite mechanism is adopted; the compounding mechanism 6 comprises a rubber roller for compounding and pasting the second substrate layer and the first substrate layer.
The processing equipment further comprises a drying mechanism 3 for drying the antenna layer coated with the adhesive by the coating mechanism 2 or a drying mechanism 3 for drying the antenna layer coated with the adhesive by the coating mechanism 2 and compounded with the first substrate layer, wherein the drying mechanism 3 corresponds to an output port of the coating mechanism 2 and an input port of the antenna hole processing mechanism 4.
When the antenna layer of the composite first substrate layer is perforated in the antenna hole processing mechanism 4 after being dried by the drying mechanism 2, the adhesive can not influence perforation, so that the perforation operation of the antenna hole is facilitated.
The production steps of the ultra-high frequency electronic tag antenna aiming at the full die cutting are as follows:
step one, an antenna layer of the first unreeling composite substrate layer of a first unreeling mechanism 1 is coated with an adhesive through a coating mechanism 2 on one side, which is not adhered with the antenna layer, of the antenna layer of the first substrate layer;
step two, drying the antenna layer coated with the adhesive and compounded with the first substrate layer by using a drying mechanism 3, and then conveying the dried antenna layer compounded with the first substrate layer to an antenna hole processing mechanism 4 for punching an antenna hole 16;
thirdly, the antenna layer of the dried composite first substrate layer is subjected to antenna hole 16 punching through an antenna hole processing mechanism 4, and a waste antenna generated after punching or a waste antenna generated after punching and the waste first substrate layer enter an antenna hole waste collection device 5;
Step four, the antenna layer of the composite first substrate layer after the perforation of the antenna hole 16 is compounded with the second substrate layer of the second unreeling mechanism 7 through the compounding mechanism 6, namely the second substrate layer is adhered with the first substrate layer through an adhesive;
step five, the antenna layer after the second substrate layer and the first substrate layer are compounded is subjected to flat die cutting and/or circular knife die cutting to form a chip binding point 15 and a chip binding positioning point 14 simultaneously by a first die cutting mechanism, then the antenna and the first substrate layer at the periphery of the antenna layer antenna body 17 of the first substrate layer are subjected to die cutting and/or roll cutting to form the outline of the antenna body 17 by a second die cutting mechanism 10, and then the antenna body 17 of the first substrate layer, the residual waste antenna and the corresponding residual waste first substrate layer which are formed in a preliminary molding mode are formed on the second substrate layer;
an alternative to this step is to interchange the positions and processing sequences of the first and second die cutting mechanisms 10: or the antenna layer of the second substrate layer and the antenna layer of the first substrate layer are compounded, firstly, the antenna and the first substrate layer corresponding to the peripheral edge of the antenna body 17 of the antenna layer are subjected to flat die cutting and/or circular knife die cutting by the second die cutting mechanism 10 to form the outer outline of the antenna body 17, then, the antenna and the first substrate layer of the antenna layer are subjected to flat die cutting and/or circular knife die cutting by the first die cutting mechanism to form the chip binding points 15 and the chip binding positioning points 14, and then, the primarily-formed antenna body 17 of the first substrate layer, the residual waste antenna and the corresponding residual waste first substrate layer are formed on the second substrate layer;
Step six, winding and discharging the residual waste antenna and the corresponding residual waste first substrate layer through a waste discharging and winding mechanism 11;
step seven, after waste discharge, unreeling the isolation layer through a third unreeling mechanism 12 so that the isolation layer is covered on the first substrate layer of the antenna body 17 formed preliminarily;
and step eight, winding the antenna body 17 covered with the isolation layer by a finished product winding mechanism 13 to form a die-cut ultrahigh frequency electronic tag antenna finished product.
In the above steps, the coating mechanism 2 is used for coating the adhesive on the antenna layer or the first substrate layer, and the adhesive can be diluted by the diluting solvent, so that the requirement of processing the full-die-cut ultrahigh frequency electronic tag antenna is met.
The temperature range of the drying mechanism 3 is 40-160 ℃, which helps the adhesive to be dried and facilitates the punching operation of the antenna holes 16 of the antenna layer.
The compounding mechanism 6 is also provided with a heating drum, and the heating drum synchronously heats the adhesive on the antenna layer in the process that the antenna layer of the first substrate layer is compounded with the second substrate layer unreeled by the second unreeling mechanism 7 through the compounding mechanism 6 after the antenna hole 16 is punched. The temperature range of the heating drum is 50-200 ℃, the antenna layer after the antenna holes are punched is heated, at the moment, the adhesive coated on the antenna layer of the composite first substrate layer (the adhesive is actually coated on the first substrate layer) is heated and melted, the antenna layer of the composite first substrate layer is conveniently bonded with the second substrate layer by using the melted adhesive, and the composite mechanism 7 is conveniently bonded between the first substrate layer and the second substrate layer.
The antenna hole processing mechanism 4 performs the perforation of the antenna hole 16 on the antenna layer, and adopts a flat press die cutting process or a circular knife die cutting process.
Referring to fig. 2, in the fifth step of the processing technology of the full die-cut ultrahigh frequency electronic tag antenna in embodiment 1, the first die-cutting mechanism is divided into a flat die-cutting machine for flat die-cutting one of the die-bonding points 15 or a circular-cutter die-cutting machine 8 for circular-cutter die-cutting, and a flat die-cutting machine for flat die-cutting the other die-bonding point 15 and the die-bonding point 14 or a circular-cutter die-cutting machine 9 for circular-cutter die-cutting; in this embodiment 1, the first die-cutting mechanism is divided into a circular-cutter die-cutting machine 8 for performing circular-cutter die-cutting on one of the die-bonding points 15, and a circular-cutter die-cutting machine 9 for performing circular-cutter die-cutting on the other of the die-bonding points 15 and the die-bonding positioning point 14.
The above-mentioned circular knife die-cutting machine 8 that is used for carrying out the circular knife die-cutting to one of them chip binding point 15, the circular knife die-cutting machine 9 that is used for carrying out the circular knife die-cutting to another chip binding point 15 and chip binding setpoint 14, and carry out the second die-cutting mechanism 10 that the circular knife die-cutting formed the outline of antenna body 17 to the antenna of antenna body 17 peripheral edge of antenna layer, the position and the processing order of three can be adjusted wantonly, exchange, all can realize the processing to the outline of chip binding setpoint 14, chip binding point 15, antenna body 17.
Embodiment 2 is substantially the same as embodiment 1 except that: in the fifth production step of the processing technology of the full-die-cut ultrahigh frequency electronic tag antenna in embodiment 2, the first die-cutting mechanism is a die-cutting machine that performs platen die-cutting and/or circular cutter die-cutting on the die-bonding points 15 and 14 at the same time, that is, the first die-cutting mechanism completes platen die-cutting and/or circular cutter die-cutting on the die-bonding points 15 and 14 at one time, for example, the die-cutting machine is replaced by the platen die-cutting machine to perform platen die-cutting on the antenna layer at one time to form the die-bonding points 15 and 14, that is, the die-cutting cutter of the platen die-cutting machine performs die-cutting and forming on the die-bonding points 15 and 14 at one time, for example, the thickness of the cutter blade of the die-cutting cutter is controlled, so that the cutter die-cutting tool can form the cutter die-cutting die according to the shape requirements of the die-bonding points 15 and 14 at one time, and the purpose of die-cutting the die-bonding points 15 and 14 at one time, for example, a certain inclination angle is formed between adjacent blades, so that the die-bonding points 15 and 14 are realized at one time, and the die-bonding points are particularly suitable for die-bonding points 15 and/or die-bonding points 14 between the die-bonding points 15 and the die-bonding points 14 and the adjacent die-bonding points 15 and the die-bonding points or the die-bonding points 14 are located at a certain distance between the die-bonding points and/or between the die-bonding points and the bonding points 15 and the adjacent die and the die bonding points and the bonding points 14. And then carrying out flat die cutting and/or circular knife die cutting on the antennae at the peripheral edges of the antenna body 17 of the antenna layer through the second die cutting mechanism 10 to form the outer contour of the antenna body 17.
The positions and the processing sequences of the first die cutting mechanism and the second die cutting mechanism can be interchanged.
Compared with the specific embodiment 1, the processing efficiency of the embodiment 2 is higher, and the die cutting molding of the die bonding points 15 and 14 is performed once, so that the accuracy is higher.
Embodiment 3 is substantially the same as embodiment 1 except that: in the fifth step of the processing technology of the full die-cut ultrahigh frequency electronic tag antenna in embodiment 3, the first die-cutting mechanism for die-cutting the die-bonding positioning points 14 and 15 and the second die-cutting mechanism 10 for die-cutting the peripheral edge of the antenna body 17 are combined into a flat die-cutting machine or a circular knife die-cutting machine.
That is, the first die cutting mechanism and the second die cutting mechanism 10 are combined into a flat die cutting machine or a round cutter die cutting machine, the flat die cutting and/or round cutter die cutting of the chip binding point 15, the chip binding point 14 and the outer contour of the antenna body 17 can be finished at one time, and the operations of flat die cutting and/or round cutter die cutting on the antennas at the peripheral edges of the antenna body 17 of the antenna layer can be performed to form the outer contour of the antenna body 17, such as the operation of replacing the flat die cutting machine into the round cutter die cutting machine by the flat die cutting machine is similar, the flat die cutting is performed on the antenna layer to form the outer contour of the chip binding point 15, the chip binding point 14 and the antenna body 17, that is, the die cutting tools of the flat die cutting machine perform one-off die cutting forming on the antenna layer to form the chip binding point 15, the chip binding point 14 and the outer contour of the antenna body 17, such as the chip binding point 15, the chip binding point 14 and the outer contour of the antenna body 17, and the adjacent chip binding point 14 are formed by one-off die cutting, and the adjacent chip binding point 14 and/or the adjacent chip binding point 14 are formed by one-off die cutting point 14, and the adjacent chip binding point 14 and the adjacent chip binding point or the adjacent chip binding point 14 are formed by one-off die cutting point or the adjacent chip binding point 14.
At this time, the antenna layer of the first substrate layer and the second substrate layer outputted by the compounding mechanism 6 in the step six enters an input port of a flat press die cutter or a circular cutter die cutter combined by the first die cutting mechanism and the second die cutting mechanism 10, and then an output port of the flat press die cutter or the circular cutter die cutter outputs the antenna layer of the first substrate layer and the second substrate layer after being subjected to flat press die cutting and/or circular cutter die cutting processing, wherein the waste antenna and the waste first substrate layer after being subjected to flat press die cutting and/or circular cutter die cutting processing correspond to the input port of the waste discharging and winding mechanism 11.
Compared with the specific embodiments 1 and 2, the processing efficiency of the embodiment 3 is higher, and the accuracy is higher because the die cutting and forming of the outer contours of the die bonding points 15, the die bonding positioning points 14 and the antenna body 17 are performed once.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes using the descriptions and drawings of the present invention or directly or indirectly applied to other related technical fields are included in the scope of the invention.

Claims (22)

1. The utility model provides a full die-cut ultrahigh frequency electronic tags antenna, includes antenna body (17), its characterized in that: the antenna body (17) is provided with a chip binding positioning point (14) formed by a die cutting mode and a chip binding point (15) formed by the die cutting mode; the number of the chip binding points (15) is two, firstly, flat-press die cutting or circular cutter die cutting is carried out on one chip binding point (15), and then flat-press die cutting or circular cutter die cutting is carried out on the other chip binding point (15) and the chip binding positioning point (14); or the chip binding points (15) and the chip binding positioning points (14) are formed by one-time die cutting by utilizing the parallelism between adjacent blades or utilizing the fact that the blades have a certain inclination angle.
2. The full die cut ultrahigh frequency electronic tag antenna of claim 1, wherein: the peripheral edge of the antenna body (17) is formed by die cutting.
3. The full die cut ultrahigh frequency electronic tag antenna of claim 2, wherein: the antenna body (17) is also provided with an antenna hole (16) formed by a die cutting mode.
4. A full die cut ultra high frequency electronic tag antenna as defined in claim 3, wherein: the antenna hole (16) is one, and a gap formed between the chip binding points (15) is communicated with the antenna hole (16) and the outside of the antenna.
5. The full die cut ultrahigh frequency electronic tag antenna of claim 4, wherein: the die cutting mode is flat-press die cutting and/or circular knife die cutting; a first substrate layer or a first substrate layer and a second substrate layer are also stuck on one side of the antenna layer of the antenna body (17), the first substrate layer is a polyester film, and the second substrate layer is a polyester film or paper.
6. The processing equipment of full cross cutting ultrahigh frequency electronic tag antenna, its characterized in that: the processing equipment comprises a first die cutting mechanism for die cutting a chip binding positioning point (14) and a chip binding point (15) of the full-cut ultrahigh frequency electronic tag antenna in any one of claims 1 to 5, wherein the first die cutting mechanism is composed of a flat die cutting mechanism, and the flat die cutting mechanism is a flat die cutting machine comprising at least one die cutting tool for flat die cutting the chip binding positioning point (14) and the chip binding point (15);
Or the first die cutting mechanism is composed of a circular cutter die cutting mechanism, and the circular cutter die cutting mechanism is a circular cutter die cutting machine comprising at least one rolling cutter for die cutting a chip binding positioning point (14) and a chip binding point (15) of the circular cutter;
or the first die cutting mechanism is a mixed die cutting mechanism formed by mixing a flat die cutting mechanism and a circular cutter die cutting mechanism, and the mixed die cutting mechanism is a mixed die cutting machine comprising at least one die cutting tool for flat die cutting a chip binding positioning point (14) or a chip binding point (15) and at least one hob cutting tool for circular cutter die cutting the chip binding point (15) or the chip binding positioning point (14).
7. The processing device of the full die-cut ultrahigh frequency electronic tag antenna as defined in claim 6, wherein: the processing equipment further comprises a second die cutting mechanism (10) for die cutting the peripheral edge of the antenna body (17), wherein the second die cutting mechanism (10) is a flat die cutting machine for flat die cutting the peripheral edge of the antenna body (17) or a circular cutter die cutting machine for circular cutter die cutting the peripheral edge of the antenna body (17).
8. The processing device of the full die-cut ultrahigh frequency electronic tag antenna according to claim 7, wherein: the first die cutting mechanism for die cutting the chip binding positioning points (14) and the chip binding points (15) and the second die cutting mechanism (10) for die cutting the peripheral edges of the antenna body (17) are combined into a flat die cutting machine or a circular cutter die cutting machine.
9. The processing apparatus of a full die cut ultrahigh frequency electronic tag antenna according to any one of claims 6 to 8, wherein: the processing equipment further comprises an antenna hole processing mechanism (4) for die-cutting the antenna holes (16), wherein the antenna hole processing mechanism (4) is a flat die-cutting machine for flat die-cutting the antenna holes (16) and an antenna hole (16) waste collection device (5), or the antenna hole processing mechanism (4) is a circular cutter die-cutting machine for circular cutter die-cutting the antenna holes (16) and an antenna hole (16) waste collection device (5).
10. The processing device of the full die-cut ultrahigh frequency electronic tag antenna according to claim 9, wherein: the processing equipment further comprises a first unreeling mechanism (1) for unreeling an antenna layer to be processed or a first substrate layer to be processed, a coating mechanism (2) for coating an adhesive on one side of the antenna layer to be processed or one side of the first substrate layer, which is not adhered with the antenna layer, a second unreeling mechanism (7) for unreeling a second substrate layer, a compounding mechanism (6) for compounding the second substrate layer and the antenna layer to be processed/part of the antenna layer to be processed or compounding the second substrate layer and the antenna layer to be processed of the first substrate layer, a waste discharge reeling mechanism (11) for reeling the processed waste antenna or the processed waste antenna and the waste first substrate layer, a third unreeling mechanism (12) for unreeling an isolating layer on the antenna layer, and a finished product reeling mechanism (13) for reeling the processed antenna layer together with the substrate layer and the isolating layer;
The antenna layer to be processed of the first unreeling mechanism (1) or the antenna layer to be processed of the composite first substrate layer correspondingly enters an input port of the coating mechanism (2), the antenna layer of the coated antenna layer or the coated composite first substrate layer output by the coating mechanism (2) enters an input port of the corresponding antenna hole processing mechanism (4), the antenna layer of the antenna hole (16) punched by the antenna hole processing mechanism (4) or the antenna layer of the composite first substrate layer punched by the antenna hole processing mechanism (16) enters an input port of the corresponding composite mechanism (6), simultaneously the second substrate layer unreeled by the second unreeled mechanism (7) also enters an input port of the corresponding composite mechanism (6), the antenna layer of the composite second substrate layer or the antenna layer of the composite second substrate layer and the antenna layer of the first substrate layer output by the composite mechanism (6) enter an input port of the first die-cutting mechanism, an output port of the first die-cutting mechanism enters a die-cutting mechanism (10), the output port of the second die-cutting mechanism (10) carries out flat die-cutting and/or round die-cutting processing, and the antenna layer of the composite second substrate layer or the antenna layer and the flat die-cutting mechanism and/or the round die-cutting die-cut layer after the flat-cutting layer of the composite second substrate layer and the antenna layer and the flat-cut layer and the waste material are processed by the flat die-cutting mechanism (11), the antenna layer and the second substrate layer enter a corresponding third unreeling mechanism (12) after flat-press die cutting and/or circular cutter die cutting, and after an isolating layer is overlapped on the antenna layer or the first substrate layer through the third unreeling mechanism (12), the antenna layer which is overlapped with the isolating layer or the antenna layer which is overlapped with the second substrate layer and the first substrate layer and is overlapped with the isolating layer enter an input port of a finished product reeling mechanism (13);
Or the antenna layer to be processed of the first unreeling mechanism (1) or the antenna layer to be processed of the composite first substrate layer correspondingly enters an input port of the coating mechanism (2), the antenna layer after coating output by the coating mechanism (2) or the antenna layer of the composite first substrate layer after coating enters an input port of the corresponding antenna hole processing mechanism (4), the antenna layer after punching of the antenna hole (16) output by the antenna hole processing mechanism (4) or the antenna layer of the composite first substrate layer after punching of the antenna hole (16) enters an input port of the corresponding composite mechanism (6), simultaneously the second substrate layer unreeled by the second unreeled mechanism (7) also enters an input port of the corresponding composite mechanism (6), the antenna layer of the composite second substrate layer or the antenna layer of the composite second substrate layer output by the composite mechanism (6) and the antenna layer of the first substrate layer enter an input port of the second die-cutting mechanism (10), the output port of the first die-cutting mechanism carries out die-cutting mechanism to carry out flat die-cutting and/or round die-cutting processing, and the antenna layer of the composite second substrate layer after flat-cutting mechanism and/or the antenna layer of the second substrate layer after flat-cutting and/or the second substrate layer and the waste material layer after flat-cutting and the flat-cutting die-cutting and the waste material layer after the flat-cutting of the antenna layer and the second substrate layer and/or the waste material layer after the flat-cutting mechanism (11) are processed, the antenna layer and the second substrate layer enter a corresponding third unreeling mechanism (12) after flat-press die cutting and/or circular cutter die cutting, and after an isolating layer is overlapped on the antenna layer or the first substrate layer through the third unreeling mechanism (12), the antenna layer which is overlapped with the isolating layer or the antenna layer which is overlapped with the second substrate layer and the first substrate layer and is overlapped with the isolating layer enter an input port of a finished product reeling mechanism (13);
Or the antenna layer to be processed of the first unreeling mechanism (1) or the antenna layer to be processed of the composite first substrate layer correspondingly enters an input port of the coating mechanism (2), the coated antenna layer output by the coating mechanism (2) or the antenna layer of the coated composite first substrate layer enters an input port of the corresponding antenna hole processing mechanism (4), the antenna layer after punching of the antenna hole (16) output by the antenna hole processing mechanism (4) or the antenna layer of the composite first substrate layer after punching of the antenna hole (16) enters an input port of the corresponding composite mechanism (6), and simultaneously the second substrate layer unreeled by the second unreeling mechanism (7) also enters an input port of the corresponding composite mechanism (6), the antenna layer of the composite second substrate layer or the antenna layer of the composite second substrate layer and the antenna layer of the first substrate layer output by the composite mechanism (6) enters an input port of a flat press die cutter or a round cutter die cutter which is combined by the first die cutter and the second die cutter (10), then an output port of the flat press die cutter or the round cutter die cutter is used for carrying out flat press die cutting and/or round cutter die cutting processing on the antenna layer of the composite second substrate layer or carrying out flat press die cutting and/or round cutter die cutting processing on the antenna layer of the composite first substrate layer and the antenna layer of the second substrate layer, wherein the flat press die cutting and/or round cutter die cutting processing waste antenna and the waste first substrate layer correspond to the input port of the waste discharging and winding mechanism (11), and after the flat-press die cutting and/or the circular knife die cutting are processed, the antenna layer and the second substrate layer enter a corresponding third unreeling mechanism (12), and after an isolating layer is overlapped on the antenna layer or the first substrate layer through the third unreeling mechanism (12), the antenna layer which is compounded with the second substrate layer and is overlapped with the isolating layer or the antenna layer which is compounded with the second substrate layer and the first substrate layer and is overlapped with the isolating layer enter an input port of a finished product reeling mechanism (13).
11. The processing device of the full die-cut ultrahigh frequency electronic tag antenna according to claim 10, wherein: the number of the chip binding points (15) is two, and the first die cutting mechanism is divided into a flat die cutter for carrying out flat die cutting on one chip binding point (15) or a round cutter die cutter (8) for carrying out round cutter die cutting, and a flat die cutter for carrying out flat die cutting on the other chip binding point (15) and the chip binding positioning point (14) or a round cutter die cutter (9) for carrying out round cutter die cutting;
the fact that the antenna layer of the composite second substrate layer or the antenna layer of the composite second substrate layer and the antenna layer of the first substrate layer output by the composite mechanism (6) enter an input port of the first die-cutting mechanism means that the antenna layer of the composite second substrate layer or the antenna layer of the composite second substrate layer and the antenna layer of the first substrate layer output by the composite mechanism (6) firstly enter a flat die-cutting machine for carrying out flat die-cutting or a round die-cutting machine for carrying out round die-cutting on one chip binding point (15), and then enter a flat die-cutting machine for carrying out flat die-cutting or a round die-cutting on the other chip binding point (15) and the chip binding positioning point (14); or the antenna layer of the composite second substrate layer and the antenna layer of the first substrate layer output by the composite mechanism (6) is firstly used for carrying out flat die cutting on the other chip binding point (15) and the chip binding positioning point (14) or is used for carrying out round knife die cutting, and then enters into a flat die cutting machine used for carrying out flat die cutting on one chip binding point (15) or a round knife die cutting machine used for carrying out round knife die cutting.
12. The processing apparatus of a full die cut ultrahigh frequency electronic tag antenna according to claim 10 or 11, wherein: the compound mechanism (6) is also provided with a heating drum for heating the adhesive; the compounding mechanism (6) comprises a rubber roller for compounding the second substrate layer with the antenna layer or a rubber roller for compounding the second substrate layer with the antenna layer compounding the first substrate layer.
13. The processing device of the full die-cut ultrahigh frequency electronic tag antenna according to claim 12, wherein: the processing equipment further comprises a drying mechanism (3) for drying the antenna layer coated with the adhesive by the coating mechanism (2) or a drying mechanism (3) for drying the antenna layer coated with the adhesive by the coating mechanism (2) and compounded with the first substrate layer, wherein the drying mechanism (3) corresponds to an output port of the coating mechanism (2) and an input port of the antenna hole processing mechanism (4).
14. A processing technology of a full die-cut ultrahigh frequency electronic tag antenna is characterized by comprising the following steps of: the production steps of the processing technology comprise that the antenna of the antenna layer or the antenna of the antenna layer of the composite first substrate layer is subjected to flat die cutting and/or circular knife die cutting through a first die cutting mechanism to form the chip binding points (15) and/or the chip binding positioning points (14) of the full-cut ultrahigh frequency electronic tag antenna in any one of claims 1 to 5.
15. The processing technology of the full-die-cut ultrahigh frequency electronic tag antenna is characterized in that the steps of producing the full-die-cut ultrahigh frequency electronic tag antenna in claim 5 are as follows:
step one, unreeling an antenna layer to be processed or an antenna layer of a composite first substrate layer by a first unreeling mechanism (1) is coated with an adhesive on one side of the antenna layer to be processed or one side of the antenna layer of the composite first substrate layer, which is not adhered with the antenna layer, by a coating mechanism (2);
secondly, perforating an antenna hole (16) on the antenna layer or the antenna layer of the composite first substrate layer through an antenna hole processing mechanism (4), and enabling a waste antenna generated after perforation or a waste antenna generated after perforation and the waste first substrate layer to enter an antenna hole (16) and waste collecting device (5);
step three, an antenna layer with an antenna hole (16) punched or an antenna layer with an antenna hole (16) punched and compounded with a first substrate layer is compounded with a second substrate layer of a second unreeling mechanism (7) through a compounding mechanism (6), namely the second substrate layer is adhered with the antenna layer or the first substrate layer through an adhesive;
fourthly, carrying out flat die cutting and/or circular knife die cutting on the antenna of the antenna layer through a first die cutting mechanism to form a chip binding point (15) and a chip binding positioning point (14), carrying out flat die cutting and/or circular knife die cutting on the antenna at the periphery edge of an antenna body (17) of the antenna layer through a second die cutting mechanism (10) to form the outer contour of the antenna body (17), and then forming a preliminarily formed antenna body (17) and a residual waste antenna on the second substrate layer;
Or the antenna layer after the second substrate layer and the first substrate layer are compounded firstly, the antenna of the antenna layer of the first substrate layer is subjected to flat die cutting and/or circular knife die cutting simultaneously to form a chip binding point (15) and a chip binding positioning point (14), then the antenna of the antenna layer of the first substrate layer and the first substrate layer are subjected to die cutting and/or roll cutting by a second die cutting mechanism (10) to form the outer contour of the antenna body (17), and then the antenna body (17) of the first substrate layer, the residual waste antenna and the corresponding residual waste first substrate layer which are formed in a preliminary mode are formed on the second substrate layer;
or the antenna layer after the second substrate layer is compounded, firstly carrying out flat die cutting and/or circular knife die cutting on the antenna at the periphery edge of the antenna body (17) of the antenna layer through a second die cutting mechanism (10) to form the outer outline of the antenna body (17), then carrying out flat die cutting and/or circular knife die cutting on the antenna of the antenna layer through a first die cutting mechanism to form a chip binding point (15) and a chip binding positioning point (14), and then forming a preliminarily formed antenna body (17) and a residual waste antenna on the second substrate layer;
or the antenna layer of the second substrate layer and the antenna layer of the first substrate layer are compounded, firstly, the antenna and the first substrate layer corresponding to the peripheral edge of the antenna body (17) of the antenna layer are subjected to flat die cutting and/or circular knife die cutting through a second die cutting mechanism (10) to form the outer outline of the antenna body (17), then, the antenna and the first substrate layer of the antenna layer are subjected to flat die cutting and/or circular knife die cutting through the first die cutting mechanism to form a chip binding point (15) and a chip binding positioning point (14), and then, the antenna body (17) of the preliminarily molded compound first substrate layer, the residual waste antenna and the corresponding residual waste first substrate layer are formed on the second substrate layer;
Step five, winding the residual waste antenna or the residual waste antenna and the corresponding residual waste first substrate layer through a waste discharge winding mechanism (11);
step six, after waste discharge, the isolation layer is unreeled through a third unreeling mechanism (12) so that the isolation layer is covered on the antenna or the first substrate layer of the antenna body (17) which is formed preliminarily;
and seventhly, winding the antenna body (17) covered with the isolation layer by a finished product winding mechanism (13) to form a die-cut ultrahigh frequency electronic tag antenna finished product.
16. The processing technology of the full die-cut ultrahigh frequency electronic tag antenna according to claim 15, wherein the processing technology is characterized in that: and the antenna hole processing mechanism (4) is used for punching the antenna holes (16) on the antenna layer, and adopts a flat die cutting process or a circular knife die cutting process.
17. The processing technology of the full die-cut ultrahigh frequency electronic tag antenna according to claim 16, wherein the processing technology is characterized in that: the coating mechanism (2) is used for coating the adhesive on the antenna layer or the first substrate layer and contains a diluting solvent.
18. The processing technology of the full die-cut ultrahigh frequency electronic tag antenna according to claim 17, wherein the processing technology is characterized in that: and a step is additionally arranged between the step one and the step two, the antenna layer coated with the adhesive or the antenna layer compounded with the first substrate layer is dried by a drying mechanism (3), and then the dried antenna layer or the antenna layer compounded with the first substrate layer is sent to an antenna hole processing mechanism (4) for punching an antenna hole (16).
19. The process for manufacturing the full die-cut ultrahigh frequency electronic tag antenna according to claim 18, wherein the process comprises the following steps of: the temperature range of the drying mechanism (3) is 40-160 ℃.
20. The processing technology of the full die-cut ultrahigh frequency electronic tag antenna as claimed in claim 19, wherein the processing technology is characterized in that: in the third step, the compounding mechanism (6) is also provided with a heating drum, and the heating drum synchronously heats the adhesive on the antenna layer in the process that the antenna layer after punching the antenna hole (16) or the antenna layer compounded with the first substrate layer is compounded with the second substrate layer unreeled by the second unreeled mechanism (7) through the compounding mechanism (6).
21. The processing technology of the full die-cut ultrahigh frequency electronic tag antenna according to claim 20, wherein the processing technology comprises the following steps: the temperature of the heating drum ranges from 50 ℃ to 200 ℃.
22. The process for manufacturing the full die cut ultrahigh frequency electronic tag antenna according to any one of claims 14 to 21, wherein: the first die cutting mechanism carries out one-time flat die cutting and/or circular knife die cutting on the antenna of the antenna layer or the antenna of the antenna layer of the composite first substrate layer to form a chip binding point (15) and a chip binding positioning point (14);
Or the first die cutting mechanism carries out two or more times of flat die cutting and/or circular knife die cutting on the antenna of the antenna layer or the antenna of the antenna layer of the composite first substrate layer to form a chip binding point (15) and a chip binding positioning point (14).
CN202010050631.XA 2020-01-17 2020-01-17 Full-die-cut ultrahigh frequency electronic tag antenna and processing equipment and processing technology thereof Active CN111275154B (en)

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CN111816998A (en) * 2020-06-15 2020-10-23 上海优比科电子科技有限公司 Forming method of high-frequency/ultrahigh-frequency die-cut antenna
CN112850260B (en) * 2021-01-04 2022-07-29 深圳名彩智能卡有限公司 Labeler for producing RFID (radio frequency identification) labels

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