CN110862686A - High-molecular heat-conducting composite material and preparation method thereof - Google Patents
High-molecular heat-conducting composite material and preparation method thereof Download PDFInfo
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Abstract
The invention relates to a high-molecular heat-conducting composite material and a preparation method thereof. The high polymer heat-conducting composite material provided by the invention consists of a heat-conducting filler, a high polymer material and an auxiliary agent; the preparation method comprises the following steps: uniformly mixing the heat-conducting filler, the raw materials of the high polymer material and the auxiliary agent to form a mixture, and enabling the heat-conducting filler to form close packing in the mixture through centrifugal force generated by a centrifugal device; polymerizing or drying the mixture to obtain a high-molecular heat-conducting composite material; the material can be further cut or processed into required shapes and sizes, and can be applied to the fields of heat conduction, heat dissipation, thermal interface materials, heat management and the like.
Description
Technical Field
The invention relates to the field of materials, in particular to a high-molecular heat-conducting composite material and a preparation method thereof.
Technical Field
With the development of industries such as electronics, information, energy and the like, the integration level of products such as chips, integrated circuits, communication equipment, radio frequency devices, mobile phones, batteries and the like is higher and higher, heat accumulation is serious during working, and the heat dissipation problem becomes an important factor influencing the performance and the service life of products.
Heat dissipation is significantly affected by the state of contact between a heat generating device (heat source) and a heat sink, in addition to being related to the heat generating device and the heat sink itself. The surfaces of the heating device and the radiator have certain roughness, and a large number of gaps are formed between the surfaces when the heating device and the radiator are in contact with each other, so that the heating device and the radiator are filled with air. Air is a poor conductor of heat, with a thermal conductivity of only about 0.02W/mK, resulting in a large interfacial thermal resistance between the two surfaces. The thermal interface resistance can be effectively reduced by filling the pores between the two surfaces with the heat conducting material.
The polymer heat-conducting composite material is one of the most widely applied heat-conducting materials, and has the advantages of high heat conductivity, easiness in molding, corrosion resistance, low density and the like. The polymer heat-conducting composite material generally comprises a heat-conducting filler, a polymer matrix and an auxiliary agent. In order to obtain higher thermal conductivity, the filling amount of the heat conductive filler is usually very high, which often causes the problems of very high viscosity, very poor fluidity, not easy to mix sufficiently, easy to form holes inside, poor processability, no increase or decrease of thermal conductivity, and the like when raw materials are mixed. The development of the high-molecular heat-conducting composite material which has high heat conductivity, high filling amount and high density and the preparation method thereof have important promotion and actual urgency for the development and application of the high-molecular heat-conducting composite material.
The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.
Disclosure of Invention
Object of the Invention
The invention aims to provide a high-molecular heat-conducting composite material which has high heat conductivity, high filling amount and high density and is applied to the fields of heat conduction, heat dissipation, heat management, thermal interface materials and the like.
The invention also aims to provide a preparation method of the high-molecular heat-conducting composite material, which has simple process and easy operation and can form dense accumulation of high-concentration raw materials.
Solution scheme
In order to realize the purpose of the invention, the invention adopts the following solution:
a high-molecular heat-conducting composite material is prepared from the following raw materials in percentage by mass: heat-conducting filler: high polymer material: the assistant (1-95%), 1-98%, 0-94% and the high-molecular heat-conducting composite material is compact in structure and has no holes.
The compact pore-free structure of the high polymer heat-conducting composite material is obtained by a supergravity technology.
Further, the heat-conducting filler, the raw materials of the high polymer material and the auxiliary agent are uniformly mixed to form a mixture, and the heat-conducting filler is tightly stacked in the mixture through supergravity; polymerizing or drying the mixture to obtain a high-molecular heat-conducting composite material; and may be further cut or machined to desired shapes and sizes.
Further, the hypergravity is the "centrifugal force" of the centrifugal device.
Further, in a possible implementation manner, the polymer heat-conducting composite material and the preparation method thereof described above, the heat-conducting filler is one or a combination of multiple materials of an oxide, a hydroxide, a nitride, a carbon material, and a metal. The oxides include, but are not limited to: alumina, zinc oxide, magnesium oxide and beryllium oxide, preferably one or more of alumina and zinc oxide; such hydroxides include, but are not limited to: aluminum hydroxide, magnesium hydroxide, zinc hydroxide, preferably aluminum hydroxide; the nitrides include, but are not limited to: boron nitride, silicon nitride and aluminum nitride, preferably one or more of boron nitride and aluminum nitride; the carbon materials include, but are not limited to: graphite, expanded graphite, graphite nanosheet, graphene nanosheet, graphene oxide, reduced graphene oxide, fullerene, diamond, carbon nanotube, carbon nanofiber, carbon fiber, silicon carbide, graphite fiber, carbon black, silicon carbide, boron carbide, zirconium carbide, calcium carbide, chromium carbide, tungsten carbide and vanadium carbide, preferably one or more of graphite, expanded graphite, carbon nanofiber, graphite nanosheet, graphene, carbon nanotube and carbon fiber; such metals include, but are not limited to: powders, nanosheets, nanowires, nanotubes of metals such as gold, silver, aluminum, copper, magnesium, iron, tungsten, molybdenum, zinc, manganese, titanium, or alloys thereof; and the like.
The heat conductive filler may be combined in the following manner: single or multiple heat conductive fillers or combinations of single or different particle sizes, and the components and formulation ratios can be selected according to specific practical requirements.
Further, the particle size of the heat conductive filler is 0.1-500 μm, and preferably 1-100 μm.
Further, in a possible implementation manner, the polymer material includes but is not limited to: polyamides, polyethylene, polypropylene, polyoxymethylene, epoxy resins, phenolic resins, polystyrene, polyvinyl chloride, unsaturated polyesters, polymethacrylates, polyacrylates, polycarbonates, polyetherimides, polyimides, polyacrylamides, polyvinylidene fluoride, polyisobutylene, polybutadiene, polyacrylonitrile, polybenzoxazines, polydimethylsiloxane, styrene-butadiene rubber, nitrile-butadiene rubber, styrene block polymers, acrylonitrile-butadiene-acrylate copolymers, acrylonitrile-butadiene-styrene copolymers, acrylonitrile-ethylene-styrene copolymers, acrylonitrile-styrene resins, ethylene-vinyl acetate copolymers, polyarylene ethers, polyarylates, polyether sulfones, polyethylene terephthalate, polyisobutylene, polyphenylene oxide, polysulfone, silicone plastics, epoxy resins, At least one of polyolefin thermoplastic elastomer, silicone rubber elastomer, and polylactic acid; further optionally, the polymer material includes: at least one of silicon rubber, epoxy resin, natural rubber, polyamide, polyurethane, nitrile rubber, polystyrene and polylactic acid.
Further, in a possible implementation manner, the polymer heat-conducting composite material and the preparation method thereof further include at least one auxiliary agent required for preparing the polymer heat-conducting composite material, in addition to the raw materials of the heat-conducting filler and the polymer material; optionally, the adjuvant comprises at least one of a plasticizer, a toughener, a reinforcing agent, a flame retardant, an initiator, a vulcanizing agent, or a curing agent.
Further, in a possible implementation manner, the raw materials of the polymer material can be made into at least one of a polymer monomer, an oligomer, a prepolymer, a solution or an emulsion with fluidity.
Further, the raw materials and the auxiliary agents of the high polymer material should be mixed with the heat-conducting filler in a fluid form.
Further, in a possible implementation manner, the mixing method of the polymer heat-conducting composite material and the preparation method thereof includes at least one of mechanical stirring, ultrasonic mixing, high-speed shear mixing, or ball milling mixing.
Further, in a possible implementation manner, the polymer heat-conducting composite material and the preparation method thereof are characterized in that the mass fraction ratio of the heat-conducting filler, the polymer material and the auxiliary agent is (1% -95%): (1% -98%): (0% to 94%), preferably (5% to 80%): (10% -80%): (0-80%).
Further, in a possible implementation manner, the uniform mixture formed by the heat-conducting filler, the raw materials of the polymer material and the auxiliary agent is centrifuged on a centrifugal device, the holes in the mixture are eliminated through a supergravity environment generated by centrifugation, residual bubbles in the mixture are removed, and the heat-conducting filler is promoted to form compact accumulation in the mixture.
Further, in a possible implementation manner, the centrifugal device may be a centrifuge or a supergravity machine; parameters such as centrifugal speed, centrifugal time, relative centrifugal acceleration and the like can be regulated and controlled through regulating equipment according to actual samples and requirements. Preferably, the centrifugation speed is 500-50000rpm, the centrifugation time is 3-300min, and more preferably, the centrifugation speed: 2000 and 20000rpm, and the centrifugation time is 10-120 min.
Further, in a possible implementation manner, the centrifuged mixture is polymerized or dried to form the polymer heat-conducting composite material.
Further, when the raw materials of the high polymer material form a mixture with the heat-conducting filler and the auxiliary agent in the form of a monomer, an oligomer or a prepolymer, the mixture is prepared into the high polymer heat-conducting composite material by a polymerization method after centrifugation. The polymerization method includes at least one of thermal curing, thermal vulcanization, thermally initiated polymerization, anionic polymerization, cationic polymerization, radical polymerization, radiation polymerization, and the like.
Further, when the raw material of the polymer material forms a mixture with the heat-conducting filler and the auxiliary agent in the form of solution or emulsion, the mixture is centrifuged and then dried to prepare the polymer heat-conducting composite material. The drying method comprises at least one of natural drying, blow-drying, vacuum drying, infrared drying, freeze drying, supercritical drying and the like. Preferably by gradient heating method, preferably drying at 60-90 deg.C for 1-3 hr, and heating to 95-150 deg.C for 1-3 hr.
Further, in a possible implementation manner, the prepared polymer heat-conducting composite material can be further cut and processed into a required shape or size so as to meet the requirements of different applications.
Further, in a possible implementation manner, the heat-conducting filler, the polymer material and the auxiliary agent are uniformly mixed according to the mass ratio of (5-100) to (4-60) to (0.1-28), then the mixture is transferred into a centrifuge tube, centrifuged at the rotation speed of 4000-.
Further, in a possible implementation manner, the heat conductive filler, the polymer material and the auxiliary agent are uniformly mixed according to the mass ratio of (5-100) to (4-60) to (0.1-28), then the mixture is transferred into a centrifuge tube, centrifuged at the rotation speed of 4000-.
Advantageous effects
1. When the filling amount of the heat-conducting filler is small, a large amount of contact and interaction cannot be formed between the heat-conducting fillers, and the heat-conducting property of the high polymer material is poor. The inventor finds that bubbles and holes in a mixture with high filling amount can be eliminated through a supergravity environment, the heat-conducting fillers are promoted to be tightly stacked, the prepared composite material is compact in internal structure, has no obvious holes, is tightly contacted with heat-conducting particles, has higher heat conductivity compared with a high-molecular composite material prepared by a common method without being treated in a supergravity environment, and can be applied to the fields of heat conduction, heat dissipation, heat management, thermal interface materials and the like.
2. The proportioning range of the high-molecular heat-conducting composite material is obtained through a large amount of practices, and the inventor finds that the heat conductivity is not greatly influenced by the dosage of other high-molecular materials and additives as long as the ingredients are in the range of the invention and the high-speed centrifugal process is matched to meet the dosage of the heat-conducting filler. Because the materials are fully settled and closely stacked after high-speed centrifugation, the heat conductivity of the finally prepared composite material is favorably improved.
Drawings
One or more embodiments are illustrated by the corresponding figures in the drawings, which are not meant to be limiting. The word "exemplary" is used exclusively herein to mean "serving as an example, embodiment, or illustration. Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments.
Fig. 1 is a digital photograph of the graphite/silicone rubber heat-conducting composite material in the centrifuge tube after vulcanization prepared in example 1 of the present invention.
Fig. 2 is a digital photograph of a graphite/silicone rubber heat conductive composite chip prepared in example 1 of the present invention.
Fig. 3 is a scanning electron microscope picture of a cross section of the graphite/silicone rubber heat-conducting composite material prepared in example 1 of the present invention.
Fig. 4 is a scanning electron microscope picture of a cross section of the alumina/epoxy resin thermal conductive composite prepared in example 2 of the present invention.
Fig. 5 is a digital photograph of a boron nitride/silicone rubber thermal conductive composite slice prepared in example 3 of the present invention.
Fig. 6 is a digital photograph of the boron nitride/silicone rubber thermal conductive composite material prepared in example 4 of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are a part of the embodiments of the present invention, but not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. Throughout the specification and claims, unless explicitly stated otherwise, the word "comprise", or variations such as "comprises" or "comprising", will be understood to imply the inclusion of a stated element but not the exclusion of any other element.
Furthermore, in the following detailed description, numerous specific details are set forth in order to provide a better understanding of the present invention. It will be understood by those skilled in the art that the present invention may be practiced without some of these specific details. In some instances, materials, methods, means, and the like that are well known to those skilled in the art have not been described in detail in order to not unnecessarily obscure the present invention.
The starting materials used in the following examples are all commercially available products.
Example 1
Uniformly mixing 10g of graphite (10000 meshes), 15g of dimethyl silicone oil (auxiliary agent, the same below), 10g of raw silicone rubber and 1g of vulcanizing agent in a mortar, transferring the mixture into a centrifuge tube, centrifuging for 30 minutes at 10000rpm, opening the cover of the centrifuge tube, putting the centrifuge tube into a blast oven, vulcanizing at 80 ℃ for 1 hour, and vulcanizing at 120 ℃ for 2 hours to obtain the graphite/silicone rubber heat-conducting composite material.
Fig. 1 is a digital photograph of the graphite/silicone rubber heat-conductive composite material still in the centrifuge tube after vulcanization.
And taking out the composite material from the centrifuge tube and slicing. FIG. 2 is a digital photograph of a graphite/silicone rubber heat-conductive composite material slice (thickness 2 mm). The material was seen to be overall dense with no apparent pores.
Fig. 3 is a scanning electron microscope picture of the cross section of the graphite/silicone rubber heat-conducting composite material, and it can be seen that graphite particles are in close contact with each other in the silicone rubber matrix.
The thermal conductivity of the graphite/silicon rubber heat-conducting composite material gasket measured by a steady-state heat flow method is 1.8W/mK. In contrast, the sample prepared by vulcanizing the mixture without centrifugation has a thermal conductivity of only 0.5W/mK.
Example 2
Uniformly mixing 100g of spherical alumina (with the average particle size of 20 mu m), 16g of epoxy resin prepolymer and 4g of curing agent in a beaker, transferring the mixture into a centrifuge tube, centrifuging at 6000rpm for 20 minutes, opening the cover of the centrifuge tube, putting the centrifuge tube into an air-blast oven, vulcanizing at 60 ℃ for 2 hours, and vulcanizing at 120 ℃ for 2 hours to obtain the alumina/epoxy resin heat-conducting composite material.
Fig. 4 is a scanning electron microscope photograph of a cross-section of an alumina/epoxy thermally conductive composite, showing that the alumina particles form relatively close contact in the epoxy.
The thermal conductivity of the alumina/epoxy resin heat-conducting composite material is tested by a steady-state heat flow method and is 2.5W/mK.
Example 3
Uniformly mixing 5g of spherical boron nitride (with the average particle size of 18 mu m), 8g of dimethyl silicone oil, 4.8g of raw silicone rubber and 0.2g of vulcanizing agent in a beaker, then transferring the mixture into a centrifuge tube, centrifuging at 10000rpm for 40 minutes, opening the cover of the centrifuge tube, putting the centrifuge tube into an air-blast oven, vulcanizing at 80 ℃ for 1 hour, and vulcanizing at 120 ℃ for 2 hours to obtain the boron nitride/silicone rubber heat-conducting composite material. Taking out and slicing.
FIG. 5 is a digital photograph of the above-mentioned boron nitride/silicone rubber heat-conductive composite material slice (thickness 2 mm).
The thermal conductivity of the boron nitride/silicon rubber heat-conducting composite material is tested by a steady-state heat flow method and is 4.5W/mK. In contrast, the thermal conductivity of the boron nitride/silicone rubber thermal conductive composite material prepared from the mixture without centrifugation treatment is 2.5W/mK.
Example 4
30g of boron nitride (average size 5 μm), 45g of dimethylsilicone oil, 20g of raw silicone rubber and 2g of vulcanizing agent were mixed in a beaker and the mixture was transferred to a centrifuge tube and centrifuged at 8000rpm for 30 minutes. And opening the cover of the centrifugal tube, removing transparent oily substances on the surface layer of the sediment, putting the residual sediment in a stainless steel mold frame (10cm multiplied by 2cm) for flattening, clamping the mold frame between two pieces of polyester film paper, then integrally clamping the polyester film paper between two stainless steel plates, putting the polyester film paper and the polyester film paper on a flat vulcanizing machine, vulcanizing at 80 ℃ for 30min under the pressure of 5MPa and at 150 ℃ for 1 hour, and preparing the boron nitride/silicon rubber heat-conducting composite material.
Fig. 5 is a digital photograph of the boron nitride/silicone rubber thermal conductive composite material.
Example 5
Uniformly mixing 15g of carbon nanofiber, 6g of styrene and 0.1g of dibenzoyl peroxide in a beaker, transferring the mixture into a centrifuge tube, centrifuging at 12000rpm for 30 minutes, pouring out supernatant in the centrifuge tube, putting the centrifuge tube containing precipitates into a blast oven, polymerizing for 150 minutes at 85 ℃, and then heating to 92 ℃ for constant temperature for 60 minutes to obtain the carbon nanofiber/polystyrene heat-conducting composite material. The thermal conductivity of the alloy is 3.5W/mK measured by a steady-state heat flow method.
Example 6
Uniformly mixing 60g of copper powder, 16g of epoxy resin and 4g of curing agent in a beaker, transferring the mixture into a centrifuge tube, centrifuging at the rotating speed of 4000rpm for 10 minutes, pouring out liquid with strong fluidity on the upper layer in the centrifuge tube, putting the centrifuge tube containing precipitates into an air-blast oven, curing at 60 ℃ for 1.5 hours, and curing at 150 ℃ for 2 hours to obtain the copper/epoxy resin heat-conducting composite material. The thermal conductivity of the alloy is 7.5W/mK measured by a steady-state heat flow method.
Example 7
Dispersing 10g of graphite nanosheets into 200g of polyvinyl alcohol aqueous solution (with the concentration of 5%), ultrasonically stirring uniformly, transferring the mixture into a centrifuge tube, centrifuging at 8000rpm for 30 minutes, pouring out the upper semitransparent liquid in the centrifuge tube, carefully digging out the precipitate, putting the precipitate into a plastic culture dish, naturally airing, and completely drying in an oven at 80 ℃ to obtain the graphite nanosheet/polyvinyl alcohol heat-conducting composite material. The thermal conductivity of the alloy is 2.8W/mK measured by a steady-state heat flow method.
Example 8
The polylactic acid is dissolved in the auxiliary agent tetrahydrofuran to obtain the tetrahydrofuran solution (the concentration is 4%) of the polylactic acid. Dispersing 5g of graphene and 10g of carbon nanotubes into 300g of tetrahydrofuran solution of polylactic acid, uniformly stirring by ultrasonic waves, transferring the mixture into a centrifuge tube, centrifuging at 12000rpm for 60 minutes, pouring out semitransparent liquid on the upper layer in the centrifuge tube, carefully digging out a precipitate, putting the precipitate into a glass culture dish, calendaring into a sheet, and naturally airing to obtain the graphene/carbon nanotube/polylactic acid heat-conducting composite material. The thermal conductivity of the alloy is 4.2W/mK measured by a steady-state heat flow method.
Example 9
15g of expanded graphite, 25g of dimethyl silicone oil, 12g of raw silicone rubber and 3g of vulcanizing agent are uniformly mixed in a mortar, and then the mixture is transferred into a centrifuge tube and centrifuged at 5000rpm for 10 minutes and 15000rpm for 90 minutes. And opening the cover of the centrifugal tube, pouring out the liquid which can flow at the upper layer in the centrifugal tube, putting the centrifugal tube into a blast oven, vulcanizing the centrifugal tube at the temperature of 80 ℃ for 1 hour, and vulcanizing the centrifugal tube at the temperature of 120 ℃ for 2 hours to prepare the expanded graphite/silicon rubber heat-conducting composite material.
And taking out the composite material from the centrifuge tube and slicing. The thermal conductivity was measured by the steady state heat flow method, up to 10W/mK.
Claims (10)
1. A macromolecule heat-conducting composite material is characterized in that: the heat-conducting filler is prepared from the following raw materials in percentage by mass: high polymer material: the assistant (1-95%), 1-98%, 0-94% and the high-molecular heat-conducting composite material is compact in structure and has no holes.
2. The polymer heat-conducting composite material as claimed in claim 1, wherein: the compact structure without holes of the high-molecular heat-conducting composite material is obtained by a supergravity technology.
3. The polymer heat-conducting composite material as claimed in claim 1, wherein the mass fraction ratio of the heat-conducting filler, the polymer material and the auxiliary agent is (5% -80%): (10% -80%): (0-80%).
4. A polymer heat-conducting composite material according to any one of claims 1 to 3, characterized in that: the heat conducting filler is one or a combination of more of oxides, hydroxides, nitrides, carbon materials and metals; preferably, the oxide is one or more of aluminum oxide, zinc oxide, magnesium oxide and beryllium oxide, and preferably one or more of aluminum oxide and zinc oxide; preferably, the hydroxide is one or more of aluminum hydroxide, magnesium hydroxide and zinc hydroxide, preferably aluminum hydroxide; preferably, the nitride is one or more of boron nitride, silicon nitride and aluminum nitride, preferably one or more of boron nitride and aluminum nitride; preferably, the carbon material is one or more of graphite, expanded graphite, graphite nanosheet, graphene nanosheet, graphene oxide, reduced graphene oxide, fullerene, diamond, carbon nanotube, carbon nanofiber, carbon fiber, graphite fiber, carbon black, silicon carbide, boron carbide, zirconium carbide, calcium carbide, chromium carbide, tungsten carbide and vanadium carbide, and preferably one or more of graphite, expanded graphite, carbon nanofiber, graphite nanosheet, graphene, carbon nanotube, carbon fiber and silicon carbide; preferably, the metal is one or more of powder, nanosheet, nanowire and nanotube of metal such as gold, silver, aluminum, copper, magnesium, iron, tungsten, molybdenum, zinc, manganese, titanium and the like or alloy thereof, and preferably one or more of copper, silver and aluminum.
5. The polymer heat-conducting composite material as claimed in claim 4, wherein the heat-conducting filler has a particle size of 0.1-500 μm, preferably 1-100 μm.
6. A polymer heat-conducting composite material according to any one of claims 1 to 3, characterized in that: the raw materials of the high polymer material are prepared into at least one of a high polymer monomer, an oligomer, a prepolymer, a solution or an emulsion with fluidity.
7. The polymer heat-conducting composite material according to claim 6, wherein: the high polymer material is polyamide, polyethylene, polypropylene, polyformaldehyde, epoxy resin, phenolic resin, polystyrene, polyvinyl chloride, polyvinyl alcohol, unsaturated polyester, polymethacrylate, polyacrylate, polycarbonate, polyetherimide, polyimide, polyacrylamide, polyvinylidene fluoride, polyisobutylene, polybutadiene, polyacrylonitrile, polybenzoxazine, polydimethylsiloxane, styrene-butadiene rubber, nitrile-butadiene rubber, styrene-butadiene-acrylate copolymer, acrylonitrile-butadiene-styrene copolymer, acrylonitrile-ethylene-styrene copolymer, acrylonitrile-styrene resin, ethylene-vinyl acetate copolymer, polyarylether, polyarylate, polyethersulfone, polyethylene terephthalate, polyisobutylene, polyethylene terephthalate, polyvinyl chloride, polyvinyl acetate, polyvinyl chloride, polyvinyl alcohol, polyvinyl, At least one of polyphenylene oxide, polysulfone, silicone plastic, polyolefin thermoplastic elastomer, silicone rubber elastomer, and polylactic acid; further preferably, the polymer material comprises at least one of silicone rubber, epoxy resin, natural rubber, polyamide, polyurethane, nitrile rubber, polystyrene and polylactic acid.
8. A polymer heat-conducting composite material according to any one of claims 1 to 3, characterized in that: the auxiliary agent comprises at least one of a plasticizer, a toughening agent, a reinforcing agent, a flame retardant, an initiator, a vulcanizing agent or a curing agent.
9. A preparation method of a high-molecular heat-conducting composite material is characterized by comprising the following steps: centrifuging a mixture formed by the heat-conducting filler, the raw materials of the high polymer material and the auxiliary agent on a centrifugal device, eliminating holes in the mixture through supergravity generated by centrifugation, removing residual bubbles in the mixture, promoting the heat-conducting filler to form a tightly-packed mixture in the mixture, and polymerizing or drying the mixture to obtain the heat-conducting filler/polymer composite material; preferably, the centrifugation speed is 500-50000rpm, and the centrifugation time is 3-300 min.
10. The method of claim 9, wherein: the raw materials of the high polymer material form a mixture with the heat-conducting filler and the auxiliary agent in the form of a monomer, an oligomer or a prepolymer, and the mixture can be prepared into the high polymer heat-conducting composite material by a polymerization method; or the raw materials of the high polymer material form a mixture with the heat-conducting filler and the auxiliary agent in the form of solution or emulsion, and the mixture can be prepared into the high polymer heat-conducting composite material by a drying method.
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