CN110343351A - A kind of selfreparing macromolecule heat conduction material and preparation method thereof - Google Patents
A kind of selfreparing macromolecule heat conduction material and preparation method thereof Download PDFInfo
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- CN110343351A CN110343351A CN201910674563.1A CN201910674563A CN110343351A CN 110343351 A CN110343351 A CN 110343351A CN 201910674563 A CN201910674563 A CN 201910674563A CN 110343351 A CN110343351 A CN 110343351A
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- heat conduction
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/042—Graphene or derivatives, e.g. graphene oxides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
Abstract
The invention discloses a kind of selfreparing macromolecule heat conduction materials and preparation method thereof, raw material containing following mass fraction: the heat filling of 0-80%, the calcium carbonate of 1-40% and >=5% polyacrylic acid, preparation method is to take calcium chloride solution in container, polyacrylic acid solution is added dropwise, at room temperature, after magnetic agitation is uniform, heat filling is added, it is lasting to stir, ultrasonic mixing is uniform, then sodium carbonate liquor is added, after standing a few hours, centrifuge separation removal supernatant liquor, obtain flexible composite heat conducting material, last hot-press solidifying molding.The material preparation process is simple, has good flexibility and ductility, thermal coefficient after molding is more than 6 Wm‑1k‑1, can be used as thermal interfacial material.
Description
Technical field
The invention belongs to technical field of polymer materials more particularly to a kind of selfreparing macromolecule heat conduction material and its preparations
Method.
Background technique
With the development of electronic industry, small size, high integration, high power chemical conversion are current all kinds of electronic components
Development trend causes device however, Highgrade integration and compact package technology greatly reduce the heat-dissipating space of device
Heat flow density sharply increases, and heat dissipation problem is increasingly prominent, and the demand of opposite heat tube reason is also being continuously increased.
Advanced thermal management materials are the material base in heat management system, including thermal interfacial material, cooling fin material
And high thermal conductivity encapsulating material etc., wherein thermal interfacial material plays the role of highly important in electronic component heat management.Heat
Boundary material is mainly used for the junction of each component or unit in device, plays support and improves the effect of heat dissipation performance.Such as
When chip, heat sink and cooling fin are combined with each other, there are a large amount of slight void, the air in gap is hot for interface junction
Non-conductor, this will lead to the reduction of system radiating efficiency, therefore need to fill these gaps using thermal interfacial material to reduce chip
With the heat sink thermal contact resistance between cooling fin, to improve heat conduction efficiency.So thermal interfacial material need to have simultaneously it is flexible,
Ductility and high thermal conductivity.
As microelectronic product develops the raising to radiating requirements, thermal interfacial material is also evolving, generally makes earliest
It is heat-conducting silicone grease, but its operation difficulty is larger, poor in timeliness, at present gradually by inorganic-macromolecule composite heat interfacial
Replaced material.Inorganic-macromolecule composite heat interfacial material is an important directions of thermal interfacial material development.But macromolecule
Material itself does not have heating conduction, usually with inorganic heat filling it is compound after heating conduction can be improved, but in order to reach one
Fixed thermal conductivity generally requires to be added a large amount of inorganic filler, the ductility and flexibility of such composite material will substantially under
Drop, machinability are not known where to begin more.In order to keep the balance between material flexibility and high thermal conductivity, thermally conductive fill out must be reduced
The additive amount of material, it is such the result is that the heating conduction promotion of composite material is limited.
Summary of the invention
The object of the invention is to remedy the disadvantages of known techniques, provide a kind of selfreparing macromolecule heat conduction material and its
Preparation method, which has good ductility, flexibility and higher thermal coefficient simultaneously, and has selfreparing function
Can, original performance can be restored by reviewing one's lessons by oneself processing when the impaired heat-conductive characteristic of shock declines by receiving in thermal interfacial material.
In order to achieve the above purpose, the present invention the following technical schemes are provided:
A kind of selfreparing macromolecule heat conduction material, the selfreparing macromolecule heat conduction material contain polyacrylic acid, calcium carbonate and
Heat filling, wherein calculate as mass fraction, calcium carbonate content 1-40%, polyacrylic acid content is >=5%, and heat filling is
0-80%。
The heat filling is selected from metal powder, boron nitride, silicon nitride, aluminium nitride, silicon carbide, aluminium oxide, graphene
With any one or a few the mixture in carbon nanotube.
Preferably, the metal powder is bronze, silver powder, copper powder or aluminium powder.
A kind of preparation method of selfreparing macromolecule heat conduction material as described above, comprising the following steps: take calcium chloride molten
Polyacrylic acid solution is added dropwise in container in liquid, after magnetic agitation is uniform, heat filling is added, lasting to stir, ultrasonic mixing
Uniformly, sodium carbonate liquor is then added, after standing a few hours, centrifuge separation removal supernatant liquor obtains flexible compound heat conduction material
Material, last hot-press solidifying molding.
Further, the molding temperature of the hot-press solidifying is 45-100 DEG C.
The invention has the advantages that
Material of the present invention has good flexibility and plasticity in wetting state, can be molded arbitrary shape, can be not only used for
It fills big gap also and small gap can be filled;In the anchorage effect of calcium carbonate particle and hydrogen bond action abundant after thermoset forming
Under, composite material exhibits go out excellent intensity, firm conducive to the support of device;The thermal coefficient of composite material can after curing molding
Reach 6 Wm-1k-1More than, not only heating conduction with higher but also there is good ductility and plasticity.Impaired forming material
As long as expecting that a small amount of water droplet is added dropwise at impaired place and drying can restore original performance.
Specific embodiment
A kind of selfreparing macromolecule heat conduction material, the selfreparing macromolecule heat conduction material contain polyacrylic acid, carbonic acid
Calcium and heat filling, wherein calculate as mass fraction, calcium carbonate content 1-40%, polyacrylic acid content is >=5%, thermally conductive to fill out
Material is 0-80%.
The heat filling is selected from metal powder, boron nitride, silicon nitride, aluminium nitride, silicon carbide, aluminium oxide, graphene
With any one or a few the mixture in carbon nanotube.
Preferably, the metal powder is bronze, silver powder, copper powder or aluminium powder.
A kind of preparation method of selfreparing macromolecule heat conduction material as described above, comprising the following steps: take calcium chloride molten
Polyacrylic acid solution is added dropwise in container in liquid, at room temperature, after magnetic agitation is uniform, heat filling is added, lasting to stir,
Ultrasonic mixing is uniform, and sodium carbonate liquor is then added, and after standing a few hours, centrifuge separation removal supernatant liquor is obtained flexible multiple
Close Heat Conduction Material, last hot-press solidifying molding.
Further, the molding temperature of the hot-press solidifying is 45-100 DEG C.
Technical solution of the present invention is clearly and completely described below, it is clear that described embodiment is only this
The section Example of invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art exist
Other all embodiments obtained under the premise of creative work are not made, protection scope of the present invention is belonged to.
Embodiment 1
It takes the calcium carbonate soln of 15ml 0.5M to be added in beaker, the polyacrylic acid aqueous solution of 5ml 50wt%, room temperature is added dropwise
Then 1g boron nitride and 0.2g graphene is added in lower magnetic agitation 4 hours, be ultrasonically treated 1h after persistently stirring three hours, obtain
Uniformly mixed suspension.Then the sodium carbonate liquor of 15ml 0.5M is added while stirring, stands 1h, is finally being centrifuged
Revolving speed in machine with 10000rpm/min turns 10mins, removes supernatant liquor, flexible composite can be obtained.It is put in rectangular mould
Hot-forming at 60 DEG C in tool, measuring thermal coefficient is 5.85 Wm-1k-1.After sample fractures, it is added dropwise on a small quantity in breaking part
Water, original intensity can be restored to by being put into drying in baking oven.
Embodiment 2
It takes the calcium carbonate soln of 15ml 0.5M to be added in beaker, the polyacrylic acid aqueous solution of 5ml 50wt%, room temperature is added dropwise
Then 1g boron nitride and 0.3g graphene is added in lower magnetic agitation 4 hours, be ultrasonically treated 1h after persistently stirring three hours, obtain
Uniformly mixed suspension.Then the sodium carbonate liquor of 15ml 0.5M is added while stirring, stands 1h, is finally being centrifuged
Revolving speed in machine with 10000rpm/min turns 10mins, removes supernatant liquor, flexible composite can be obtained.It is put in circular mode
Hot-forming at 60 DEG C in tool, measuring thermal coefficient is 6.5 Wm-1k-1.After sample fractures, it is added dropwise on a small quantity in breaking part
Water is put into the intensity that drying can be restored in baking oven.
Embodiment 3
It takes the calcium carbonate soln of 15ml 0.5M to be added in beaker, the polyacrylic acid aqueous solution of 5ml 50wt%, room temperature is added dropwise
Then 2g boron nitride and 0.3g graphene is added in lower magnetic agitation 4 hours, be ultrasonically treated 1h after persistently stirring three hours, obtain
Uniformly mixed suspension.Then the sodium carbonate liquor of 15ml 0.5M is added while stirring, stands 1h, is finally being centrifuged
Revolving speed in machine with 10000rpm/min turns 10mins, removes supernatant liquor, flexible composite can be obtained.It is put in bar shaped mould
Hot-forming at 60 DEG C in tool, measuring thermal coefficient is 4.6 Wm-1k-1.After sample fractures, it is added dropwise on a small quantity in breaking part
Water, original intensity can be restored to by being put into drying in baking oven.
Embodiment 4
It takes the calcium carbonate soln of 15ml 0.5M to be added in beaker, the polyacrylic acid aqueous solution of 5ml 50wt%, room temperature is added dropwise
Then 0.5g boron nitride and 0.3g graphene is added in lower magnetic agitation 4 hours, be ultrasonically treated 1h after persistently stirring three hours, obtain
To uniformly mixed suspension.Then be added the sodium carbonate liquor of 15ml 0.5M while stirring, stand 1h, finally from
Revolving speed in scheming with 10000rpm/min turns 10mins, removes supernatant liquor, flexible composite can be obtained.It is put in rectangular
Hot-forming at 60 DEG C in mold, measuring thermal coefficient is 5.9 Wm-1k-1.After sample fractures, it is added dropwise on a small quantity in breaking part
Water, original intensity can be restored to by being put into drying in baking oven.
Embodiment 5
It takes the calcium carbonate soln of 15ml0.5M to be added in beaker, the polyacrylic acid aqueous solution of 3ml 50wt% is added dropwise, at room temperature
Magnetic agitation 4 hours, 1g boron nitride and 0.3g graphene is then added, is ultrasonically treated 1h after persistently stirring three hours, is mixed
Close uniform suspension.Then the sodium carbonate liquor of 15ml 0.5M is added while stirring, 1h is stood, finally in centrifuge
In 10mins turned with the revolving speed of 10000rpm/min, remove supernatant liquor, flexible composite can be obtained.It is put in circular die
In it is hot-forming at 60 DEG C, measure thermal coefficient be 5.09 Wm-1k-1.After sample fractures, a small amount of water is added dropwise in breaking part,
Original intensity can be restored to by being put into drying in baking oven.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (5)
1. a kind of selfreparing macromolecule heat conduction material, which is characterized in that the selfreparing macromolecule heat conduction material contains poly- third
Olefin(e) acid, calcium carbonate and heat filling, wherein calculate as mass fraction, calcium carbonate content 1-40%, polyacrylic acid content be >=
5%, heat filling 0-80%.
2. selfreparing macromolecule heat conduction material according to claim 1, which is characterized in that the heat filling is selected from gold
Belong to any one or a few in powder, boron nitride, silicon nitride, aluminium nitride, silicon carbide, aluminium oxide, graphene and carbon nanotube
Mixture.
3. selfreparing macromolecule heat conduction material according to claim 2, which is characterized in that the metal powder is gold
Powder, silver powder, copper powder or aluminium powder.
4. a kind of preparation method of selfreparing macromolecule heat conduction material as described in claim 1, which is characterized in that including following
Step: taking calcium chloride solution in container, and polyacrylic acid solution is added dropwise, and at room temperature, after magnetic agitation is uniform, is added thermally conductive
Filler, lasting to stir, ultrasonic mixing is uniform, and sodium carbonate liquor is then added, and after standing a few hours, centrifuge separation removal upper layer is clear
Liquid obtains flexible composite heat conducting material, last hot-press solidifying molding.
5. the preparation method of selfreparing macromolecule heat conduction material according to claim 4, which is characterized in that the hot pressing
The temperature of curing molding is 45-100 DEG C.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110862686A (en) * | 2019-11-20 | 2020-03-06 | 天津工业大学 | High-molecular heat-conducting composite material and preparation method thereof |
CN112479717A (en) * | 2020-11-19 | 2021-03-12 | 航天特种材料及工艺技术研究所 | Self-healing matrix modified SiC/SiC composite material and preparation method thereof |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107573446A (en) * | 2016-07-04 | 2018-01-12 | 香港城市大学深圳研究院 | Boron nitride nanosheet and carbopol gel composite heat interfacial material and preparation method |
-
2019
- 2019-07-25 CN CN201910674563.1A patent/CN110343351A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107573446A (en) * | 2016-07-04 | 2018-01-12 | 香港城市大学深圳研究院 | Boron nitride nanosheet and carbopol gel composite heat interfacial material and preparation method |
Non-Patent Citations (2)
Title |
---|
BURCU KURT等: "High-strength semi-crystalline hydrogels with self-healing and shape memory functions", 《EUROPEAN POLYMER JOURNAL》 * |
SHUYUAN LIN等: "Synthetic Multifunctional Graphene Composites with Reshaping and Self-Healing Features via a Facile Biomineralization-Inspired Process", 《ADVANCED MATERIALS》 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110862686A (en) * | 2019-11-20 | 2020-03-06 | 天津工业大学 | High-molecular heat-conducting composite material and preparation method thereof |
CN112479717A (en) * | 2020-11-19 | 2021-03-12 | 航天特种材料及工艺技术研究所 | Self-healing matrix modified SiC/SiC composite material and preparation method thereof |
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