CN110744731B - 一种基于光电控制的晶片切片设备 - Google Patents
一种基于光电控制的晶片切片设备 Download PDFInfo
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- CN110744731B CN110744731B CN201911051070.9A CN201911051070A CN110744731B CN 110744731 B CN110744731 B CN 110744731B CN 201911051070 A CN201911051070 A CN 201911051070A CN 110744731 B CN110744731 B CN 110744731B
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- 238000001514 detection method Methods 0.000 claims abstract description 24
- 238000003698 laser cutting Methods 0.000 claims abstract description 22
- 238000009966 trimming Methods 0.000 claims abstract description 17
- 238000006243 chemical reaction Methods 0.000 claims description 12
- 239000000523 sample Substances 0.000 claims description 9
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 4
- 101100008048 Caenorhabditis elegans cut-4 gene Proteins 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0093—Working by laser beam, e.g. welding, cutting or boring combined with mechanical machining or metal-working covered by other subclasses than B23K
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/027—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade arranged underneath a stationary work table
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
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CN201911051070.9A CN110744731B (zh) | 2019-10-30 | 2019-10-30 | 一种基于光电控制的晶片切片设备 |
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CN201911051070.9A CN110744731B (zh) | 2019-10-30 | 2019-10-30 | 一种基于光电控制的晶片切片设备 |
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CN110744731A CN110744731A (zh) | 2020-02-04 |
CN110744731B true CN110744731B (zh) | 2021-07-27 |
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Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112363458A (zh) * | 2020-11-04 | 2021-02-12 | 厦门至慧机器人有限公司 | 用对射式光电开关或机械式微动开关对锯切机锯片直径在线测量及补偿方法 |
CN113053770B (zh) * | 2021-03-15 | 2024-03-08 | 上海华力微电子有限公司 | 一种晶圆切割方法 |
CN115366184B (zh) * | 2022-10-27 | 2023-03-17 | 济南鼎点数控设备有限公司 | 一种数控碳纤维管道切管机及其环切补偿方法 |
CN115446904A (zh) * | 2022-10-27 | 2022-12-09 | 济南鼎点数控设备有限公司 | 一种数控碳纤维管道切管机及其环切方法 |
Citations (24)
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JPH06151581A (ja) * | 1992-11-16 | 1994-05-31 | Hitachi Ltd | ダイシング方法および装置 |
JPH06163687A (ja) * | 1992-11-18 | 1994-06-10 | Mitsubishi Electric Corp | 半導体装置のダイシング方法及び装置 |
JP2002370140A (ja) * | 2001-06-12 | 2002-12-24 | Disco Abrasive Syst Ltd | ブレード監視装置 |
JP3746422B2 (ja) * | 2000-12-05 | 2006-02-15 | シャープ株式会社 | ダイシング装置およびダイシング方法 |
JP2006116690A (ja) * | 2004-09-22 | 2006-05-11 | Disco Abrasive Syst Ltd | 切削装置 |
JP2006310396A (ja) * | 2005-04-26 | 2006-11-09 | Tokyo Seimitsu Co Ltd | ブレード破損検出装置 |
CN101165877A (zh) * | 2006-10-17 | 2008-04-23 | 株式会社迪思科 | 砷化镓晶片的激光加工方法 |
CN101927402A (zh) * | 2009-06-17 | 2010-12-29 | 三星钻石工业股份有限公司 | 脆性材料基板的割断方法 |
JP2011110669A (ja) * | 2009-11-27 | 2011-06-09 | Disco Abrasive Syst Ltd | 切削装置 |
CN102343629A (zh) * | 2010-07-26 | 2012-02-08 | 澁谷工业株式会社 | 脆性材料的切割装置及切割方法 |
JP2012080029A (ja) * | 2010-10-06 | 2012-04-19 | Disco Abrasive Syst Ltd | 切削装置 |
JP2013146800A (ja) * | 2012-01-17 | 2013-08-01 | Toyota Motor Corp | 刃具の基準位置調整装置 |
CN104096908A (zh) * | 2013-04-03 | 2014-10-15 | 苏州宝时得电动工具有限公司 | 一种斜断锯及其切割深度调整方法 |
CN105312775A (zh) * | 2014-06-10 | 2016-02-10 | 三星钻石工业股份有限公司 | 脆性材料基板的加工方法 |
JP2016068400A (ja) * | 2014-09-30 | 2016-05-09 | 株式会社ディスコ | セラミック基板の分割方法 |
CN105810633A (zh) * | 2015-01-16 | 2016-07-27 | 株式会社迪思科 | 晶片的加工方法 |
CN106295140A (zh) * | 2016-07-29 | 2017-01-04 | 南京海威机械有限公司 | 一种数控推台锯工件斜切时的误差补偿方法 |
CN106903810A (zh) * | 2015-10-21 | 2017-06-30 | 株式会社迪思科 | 切削装置 |
CN108015650A (zh) * | 2016-11-02 | 2018-05-11 | 株式会社迪思科 | 晶片的加工方法 |
CN108943444A (zh) * | 2017-05-24 | 2018-12-07 | 株式会社迪思科 | 切削装置 |
CN109311177A (zh) * | 2016-04-27 | 2019-02-05 | 法比奥·泼尼股份公司 | 有研磨轮的圆材锯机以及研磨方法 |
CN109473351A (zh) * | 2017-09-08 | 2019-03-15 | 株式会社迪思科 | 晶片的加工方法 |
CN110000940A (zh) * | 2018-01-05 | 2019-07-12 | 株式会社迪思科 | 切削装置 |
CN110039674A (zh) * | 2018-01-16 | 2019-07-23 | 株式会社迪思科 | 切削刀具的管理方法和切削装置 |
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---|---|---|---|---|
JP2009231760A (ja) * | 2008-03-25 | 2009-10-08 | Tokyo Seimitsu Co Ltd | ブレード破損/磨耗検出装置 |
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2019
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JPH06151581A (ja) * | 1992-11-16 | 1994-05-31 | Hitachi Ltd | ダイシング方法および装置 |
JPH06163687A (ja) * | 1992-11-18 | 1994-06-10 | Mitsubishi Electric Corp | 半導体装置のダイシング方法及び装置 |
JP3746422B2 (ja) * | 2000-12-05 | 2006-02-15 | シャープ株式会社 | ダイシング装置およびダイシング方法 |
JP2002370140A (ja) * | 2001-06-12 | 2002-12-24 | Disco Abrasive Syst Ltd | ブレード監視装置 |
JP2006116690A (ja) * | 2004-09-22 | 2006-05-11 | Disco Abrasive Syst Ltd | 切削装置 |
JP2006310396A (ja) * | 2005-04-26 | 2006-11-09 | Tokyo Seimitsu Co Ltd | ブレード破損検出装置 |
CN101165877A (zh) * | 2006-10-17 | 2008-04-23 | 株式会社迪思科 | 砷化镓晶片的激光加工方法 |
CN101927402A (zh) * | 2009-06-17 | 2010-12-29 | 三星钻石工业股份有限公司 | 脆性材料基板的割断方法 |
JP2011110669A (ja) * | 2009-11-27 | 2011-06-09 | Disco Abrasive Syst Ltd | 切削装置 |
CN102343629A (zh) * | 2010-07-26 | 2012-02-08 | 澁谷工业株式会社 | 脆性材料的切割装置及切割方法 |
JP2012080029A (ja) * | 2010-10-06 | 2012-04-19 | Disco Abrasive Syst Ltd | 切削装置 |
JP2013146800A (ja) * | 2012-01-17 | 2013-08-01 | Toyota Motor Corp | 刃具の基準位置調整装置 |
CN104096908A (zh) * | 2013-04-03 | 2014-10-15 | 苏州宝时得电动工具有限公司 | 一种斜断锯及其切割深度调整方法 |
CN105312775A (zh) * | 2014-06-10 | 2016-02-10 | 三星钻石工业股份有限公司 | 脆性材料基板的加工方法 |
JP2016068400A (ja) * | 2014-09-30 | 2016-05-09 | 株式会社ディスコ | セラミック基板の分割方法 |
CN105810633A (zh) * | 2015-01-16 | 2016-07-27 | 株式会社迪思科 | 晶片的加工方法 |
CN106903810A (zh) * | 2015-10-21 | 2017-06-30 | 株式会社迪思科 | 切削装置 |
CN109311177A (zh) * | 2016-04-27 | 2019-02-05 | 法比奥·泼尼股份公司 | 有研磨轮的圆材锯机以及研磨方法 |
CN106295140A (zh) * | 2016-07-29 | 2017-01-04 | 南京海威机械有限公司 | 一种数控推台锯工件斜切时的误差补偿方法 |
CN108015650A (zh) * | 2016-11-02 | 2018-05-11 | 株式会社迪思科 | 晶片的加工方法 |
CN108943444A (zh) * | 2017-05-24 | 2018-12-07 | 株式会社迪思科 | 切削装置 |
CN109473351A (zh) * | 2017-09-08 | 2019-03-15 | 株式会社迪思科 | 晶片的加工方法 |
CN110000940A (zh) * | 2018-01-05 | 2019-07-12 | 株式会社迪思科 | 切削装置 |
CN110039674A (zh) * | 2018-01-16 | 2019-07-23 | 株式会社迪思科 | 切削刀具的管理方法和切削装置 |
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Effective date of registration: 20240611 Address after: 230000 Room 203, building 2, phase I, e-commerce Park, Jinggang Road, Shushan Economic Development Zone, Hefei City, Anhui Province Patentee after: Hefei Jiuzhou Longteng scientific and technological achievement transformation Co.,Ltd. Country or region after: China Address before: Weidu District Bayi Road Xuchang city Henan province 461000 No. 88 Patentee before: XUCHANG University Country or region before: China |