CN110687729B

CN110687729B - Display module and display device

Info

Publication number: CN110687729B
Application number: CN201910939943.3A
Authority: CN
Inventors: 刘恺; 刘敏
Original assignee: Shanghai Tianma Microelectronics Co Ltd
Current assignee: Shanghai Tianma Microelectronics Co Ltd
Priority date: 2019-09-30
Filing date: 2019-09-30
Publication date: 2022-06-10
Anticipated expiration: 2039-09-30
Also published as: CN110687729A

Abstract

The invention discloses a display module and a display device, belonging to the technical field of display, wherein the display module comprises a display panel, a flexible circuit board and a printed circuit board; the binding region of the display panel comprises at least two conductive bonding pad groups which are sequentially arranged along a first direction, and the number of the conductive bonding pads of the conductive bonding pad groups is different and is sequentially increased along the first direction; each first pin group of the flexible circuit board comprises first pins with the same number as the conductive pads of each conductive pad group; each second pin group of the printed circuit board comprises the same number of second pins as the first pins of each flexible circuit board. The display device comprises the display panel. The invention can directly identify the binding positions of different functions from the appearance, avoids binding errors, reduces the possibility of artificial errors and further improves the working efficiency and the product yield.

Description

Display module and display device

Technical Field

The invention relates to the technical field of display, in particular to a display module and a display device.

Background

With the development of Display technology, various Display products, such as LCD (Liquid Crystal Display) and OLED (Organic Light Emitting Diode) displays, have appeared. Meanwhile, the electronic technology is also rapidly developed, the smaller the electronic product is, the more the functions are, the more the requirements on the whole space are, and all the accessories need to compress the space. In general, a Flexible Printed Circuit (FPC) is bonded to the display panel to electrically connect the FPC to an external driving Circuit. The flexible printed circuit board is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent flexibility, and has the characteristics of high wiring density, light weight, thin thickness and good bending property. The flexible circuit board can be bent and folded, and can be flexibly arranged according to the installation space, so that the flexible circuit board is widely applied to the technical field of display.

Among the prior art, electronic product is more and more developing towards lighter, littleer, thinner orientation, and along with the complexity degree of product function is higher and higher, the user also improves to the requirement of display module performance, and it has a plurality of drive circuit to carry out the picture drive to begin to bind on the display panel, and this just needs to bind different FPC respectively to different drive circuit. At present, before binding a display panel, a flexible circuit board and an external driving circuit, a design department cannot effectively distinguish the display panel, the flexible circuit board and the external driving circuit from the appearance, and the specific sequence can be confirmed only by combining with multi-department check signal definition, so that the efficiency is low, the mistake is easy to make, and once the sequence is wrong, all the display panel is scrapped without any remedial measures.

Therefore, it is an urgent technical problem to provide a display module and a display device that can directly identify the binding position of different functions from the appearance, avoid the occurrence of binding errors, reduce the possibility of human error, and further improve the connection reliability of a flexible circuit board, a display panel and an external driving element.

Disclosure of Invention

In view of this, the invention provides a display module and a display device, so as to solve the problems of high binding error rate and low working efficiency of a flexible circuit board in the prior art.

The invention provides a display module, comprising: the display device comprises a display panel, a flexible circuit board and a printed circuit board, wherein the printed circuit board is electrically connected with the display panel through the flexible circuit board; the display panel comprises a display area and a non-display area, the display panel comprises a substrate base plate, and a binding area is arranged in the range of the non-display area on the substrate base plate; the binding region comprises at least two conductive bonding pad groups which are sequentially arranged along a first direction, each conductive bonding pad group comprises a plurality of conductive bonding pads, and the number of the conductive bonding pads of the conductive bonding pad groups is different and is sequentially increased along the first direction; the flexible circuit board comprises at least two first pin groups which are sequentially arranged along a first direction, each first pin group comprises first pins with the same number as the conductive bonding pads of each conductive bonding pad group, each first pin penetrates through the flexible circuit board in the direction perpendicular to the light-emitting surface of the display panel, and each first pin group is electrically connected with the conductive bonding pads of each conductive bonding pad group in a one-to-one correspondence mode through the first pins; the printed circuit board comprises at least two second pin groups which are sequentially arranged along a first direction, each second pin group comprises second pins with the same number as the first pins of each flexible circuit board, and each first pin group is electrically connected with the second pins of each second pin group in a one-to-one correspondence mode through the first pins.

Based on the same inventive concept, the invention also provides a display device which comprises the display panel.

Compared with the prior art, the display module and the display device provided by the invention at least realize the following beneficial effects:

according to the invention, the conductive bonding pads needing to be bound with a plurality of driving circuits with different functions on the display panel in the prior art are arranged in groups, and the number of each group of conductive bonding pads is designed into different fool-proof designs, so that the conductive bonding pad groups with different functions can be directly distinguished from the appearance, and no dislocation risk exists completely. The display module does not need to judge the sequence during design, and only needs to judge whether the conductive bonding pads of the binding region, the first pins of the flexible circuit board and the second pins of the printed circuit board are matched or not; the step of communicating and confirming the sequence of the conductive bonding pads of the binding area by multiple departments is omitted before design, the development process is standardized by unified standards, and the development period is shortened; when laminating electricity is connected, need not to check the name of each electrically conductive pad group, and then can promote work efficiency, both can avoid the design mistake that leads to because of the order problem of confirming the electrically conductive pad of different functions, avoid the design mistake directly to scrap, can also reduce the scrapped article problem that human error brought.

Of course, it is not necessary for any product in which the present invention is practiced to specifically achieve all of the above-described technical effects simultaneously.

Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.

Fig. 1 is a schematic plan view of a display module according to an embodiment of the present invention;

FIG. 2 is an exploded view of FIG. 1;

FIG. 3 is a schematic sectional view taken along line A-A' of FIG. 1;

FIG. 4 is another exploded view of FIG. 1;

FIG. 5 is another exploded view of FIG. 1;

FIG. 6 is another exploded view of FIG. 1;

FIG. 7 is another exploded view of FIG. 1;

FIG. 8 is another exploded view of FIG. 1;

FIG. 9 is another exploded view of FIG. 1;

FIG. 10 is an enlarged view of the area M in FIG. 9;

fig. 11 is a schematic structural diagram of a display device according to an embodiment of the present invention.

Detailed Description

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.

In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

Referring to fig. 1 and fig. 2, fig. 1 is a schematic plan structure diagram of a display module according to an embodiment of the present invention, and fig. 2 is an exploded view of fig. 1 (for clarity, the display panel 10, the flexible circuit board 20, and the printed circuit board 30 are not filled, and the number and shape of the conductive pads 1011, the first pins 2011, and the second pins 3011 are only schematically drawn, and in a specific implementation, the number and shape are not limited thereto), and a display module 000 according to an embodiment of the present invention includes: the display panel 10, the flexible circuit board 20, the printed circuit board 30 is electrically connected with the display panel 10 through the flexible circuit board 20; optionally, the printed Circuit board 30 is a pcb (printed Circuit board), and an external driving Circuit for implementing different functions required by the display panel 10 is integrated on the printed Circuit board 30;

The display panel 10 includes a display area AA and a non-display area NA arranged around the display area AA, the display panel 10 includes a substrate 100, and a binding area BA is arranged in a range of the non-display area NA on the substrate 100;

the binding area BA includes at least two conductive pad groups 101 sequentially arranged along a first direction X, each conductive pad group 101 includes a plurality of conductive pads 1011, and the number of the conductive pads 1011 of the conductive pad groups 101 is different and sequentially increased along the first direction X; the first direction X is perpendicular to the second direction Y, and the second direction Y in this embodiment is a direction in which the binding area BA points to the display area AA;

the flexible circuit board 20 includes at least two first pin groups 201 sequentially arranged along a first direction X, each first pin group 201 includes first pins 2011 having the same number as the conductive pads 1011 of each conductive pad group 101, as shown in fig. 3, fig. 3 is a schematic view of a-a' direction cross-sectional structure of fig. 1, in a direction E perpendicular to the light emitting surface of the display panel 10, each first pin 2011 penetrates through the flexible circuit board 20, and each first pin group 201 is electrically connected to the conductive pads 1011 of each conductive pad group 101 through the first pins 2011 in a one-to-one correspondence manner;

the printed circuit board 30 includes at least two second pin groups 301 sequentially arranged along the first direction X, each second pin group 301 includes second pins 3011 having the same number as the first pins 2011 of each flexible circuit board 20, and each first pin group 201 is electrically connected to the second pins 3011 of each second pin group 301 through the first pins 2011 in a one-to-one correspondence manner.

Specifically, the display module 000 of the embodiment includes a display panel 10, a flexible circuit board 20, and a printed circuit board 30, wherein a bonding area BA is disposed in a non-display area NA of the display panel 10, at least two conductive pad groups 101 are sequentially disposed in the bonding area BA along a first direction X, the number of the conductive pads 1011 of each conductive pad group 101 is different, and the conductive pads 1011 of the conductive pad groups 101 can be sequentially increased along the first direction X, for example, as shown in fig. 2, three conductive pad groups 101 are sequentially disposed in the bonding area BA along the first direction X, which are a first conductive pad group 101a, a second conductive pad group 101B, and a third conductive pad group 101c, respectively, where the number of the conductive pads 1011 of the first conductive pad group 101a is a, and the number of the conductive pads 1011 of the second conductive pad group 101B adjacent to the first conductive pad group 101a is B along the first direction X, the number of conductive pads 1011 of the third conductive pad group 101C adjacent to the second conductive pad group 101B is C, where C > B > a only needs to be satisfied, so that external driving circuits of different functions can be connected through the conductive pad groups 101 including different numbers of conductive pads 1011.

Since the bonding area BA on the display panel 10 is used for bonding the flexible circuit board 20, similarly, the flexible circuit board 20 includes at least two first pin groups 201 sequentially arranged along the first direction X, the number of the first pin groups 201 is the same as that of the conductive pad groups 101 in the bonding area BA, each first pin group 201 includes the first pins 2011 having the same number as that of the conductive pads 1011 of each conductive pad group 101, and each first pin group 201 is electrically connected to the conductive pads 1011 of each conductive pad group 101 through the first pins 2011 in a one-to-one correspondence manner.

In this embodiment, the first pins 2011 of the flexible circuit board 20 are disposed in a direction E perpendicular to the light emitting surface of the display panel 10, and each first pin 2011 of the flexible circuit board 20 penetrates through the flexible circuit board 20 (as shown in fig. 3), so that the printed circuit board 30 including an external driving circuit can be electrically connected to the display panel 10 through the flexible circuit board 20, that is, one surface 2011a of the first pin 2011 close to the substrate 100 is attached to and electrically connected to the conductive pad 1011 of the bonding area BA, and the other surface 2011b of the first pin 2011 away from the substrate 100 is attached to and electrically connected to the second pin 3011 of the printed circuit board 30. Similarly, the printed circuit board 30 includes at least two second pin groups 301 sequentially arranged along the first direction X, the number of the second pin groups 301 is the same as that of the first pin groups 201 on the flexible circuit board 20, each second pin group 301 includes second pins 3011 having the same number as that of the first pins 2011 of each flexible circuit board 20, and each first pin group 201 is electrically connected to the second pins 3011 of each second pin group 301 through the first pins 2011 in a one-to-one correspondence manner.

In the prior art, alignment mark groups adopted between different FPCs and a display panel are the same, so that production line staff are difficult to operate by mistake or identify by a machine, and the FPCs are often bound on wrong binding positions. The embodiment sets up the conductive pads that need bind a plurality of different function drive circuits on the display panel in the prior art in groups, and designs for different fool-proof designs through the quantity of every group conductive pad 1011 to can follow the conductive pad group 101 of direct difference different functions in appearance, do not have the dislocation risk completely. The design does not need to judge the sequence, and only needs to judge the number of the conductive pad 1011 of the bonding area BA, the first pin 2011 of the flexible circuit board 20 and the second pin 3011 of the printed circuit board 30 and whether the numbers are matched with each other; the step of communicating and confirming the sequence of the conductive bonding pads of the binding area by multiple departments is omitted before design, the development process is standardized by unified standards, and the development period is shortened; when the bonding is electrically connected, the names of the conductive pad groups 101 are not required to be checked, so that the working efficiency can be improved, the design errors caused by the problem of confirming the sequence of the conductive pads 1011 with different functions can be avoided, the direct scrapping of the design errors is avoided, and the problem of scrapped products caused by human errors can be reduced.

It should be noted that, in this embodiment, the connection manner of the display panel 10, the flexible circuit board 20, and the printed circuit board 30 is not specifically limited, and only needs to satisfy the electrical connection effect, and optionally, an Anisotropic Conductive Film (ACF) may be used to implement the bonding electrical connection.

It should be further noted that, in fig. 1-3 of the present embodiment, the flexible circuit board 20 is attached to the substrate 100 and electrically connected to each other, while the surface of the printed circuit board 30 attached to the side of the flexible circuit board 20 away from the substrate 100 is electrically connected to each other for example, therefore, in the present embodiment, each first pin 2011 of the flexible circuit board 20 is designed to penetrate through the flexible circuit board 20, and in the specific implementation, the flexible circuit board 20 can be attached to the substrate 100 to be electrically connected to each other, and the printed circuit board 30 is attached to the surface of the flexible circuit board 20 near the substrate 100 side and electrically connected to each other, that is, the conductive pads 1011 of the substrate base 100 and the second pins 3011 of the printed circuit board 30 are attached to and electrically connected to the same side surface of the flexible circuit board 20, and other electrical connection forms may be adopted, which may be selected according to actual situations, and are not described in detail in this embodiment. It should be further noted that fig. 2 and fig. 3 in this embodiment only schematically illustrate that the number of the conductive pads of each conductive pad group increases sequentially from left to right along the first direction X, and it can be understood that, in specific implementation, the number of the conductive pads of each conductive pad group may also increase sequentially from right to left along the first direction X, which is not described in detail in this embodiment.

In some alternative embodiments, referring to fig. 1 and fig. 4, fig. 4 is another exploded view of fig. 1, in this embodiment, the number of the conductive pads 1011 of the conductive pad group 101 is sequentially increased by one along the first direction X.

The embodiment further explains that, when a plurality of driving circuits with different functions need to be bonded on a display panel, in order to directly distinguish the conductive pad groups 101 with different functions from the appearance and avoid the risk of dislocation during attachment, the embodiment adopts a design that the number of the conductive pads 1011 of each group is different and foolproof, specifically, along the first direction X, the number of the conductive pads 1011 of the conductive pad group 101 is sequentially increased by one, that is, along the first direction X, the number of the conductive pads 1011 in each two adjacent conductive pad groups 101 is increased by 1, for example, as shown in fig. 4, three conductive pad groups 101 are sequentially arranged along the first direction X in a bonding area BA, which are sequentially a first conductive pad group 101a, a second conductive pad group 101b, and a third conductive pad group 101c, and along the first direction X, the number of the conductive pads 1011 of the first conductive pad group 101a is a, the number of the conductive pads 1011 of the second conductive pad group 101B adjacent to the first conductive pad group 101a is B, the number of the conductive pads 1011 of the third conductive pad group 101C adjacent to the second conductive pad group 101B is C, optionally, B +1 and C +2 may be set, at this time, the layout of the first pin group 101 on the flexible circuit board 20 and the second pin group 301 on the printed circuit board 30 is also set according to the number of the conductive pads 1011 of each conductive pad group 101, so that while visually distinguishing different conductive pad groups 101 by different numbers, the excessive conductive pads 1011 can be avoided to occupy too much space on the panel, which is beneficial to saving the space of the non-display area NA to layout other devices or signal lines.

In some optional embodiments, referring to fig. 1 and fig. 5, fig. 5 is another exploded view of fig. 1, in the display module 000 of the embodiment, along the first direction X, a set of first alignment marks 401 is disposed on both sides of each conductive pad group 101, a set of second alignment marks 402 is disposed on both sides of each first pin group 201, and the shapes of the forward projections of the first alignment marks 401 and the second alignment marks 402 to the substrate 100 are the same.

The present embodiment further explains that when the conductive pads 1011 of the bonding area BA on the display panel 10 are electrically bonded with the first leads 2011 on the flexible circuit board 20, in order to avoid the risk of misalignment between the conductive pads 1011 of each conductive pad group 101 and the first leads 2011 due to an excessive number of conductive pads 1011, the present embodiment provides a set of first alignment marks 401 on both sides of each conductive pad group 101, a set of second alignment marks 402 on both sides of each first lead group 201, and makes the orthogonal projections of the first alignment marks 401 and the second alignment marks 402 to the substrate 100 have the same shape, so that during the bonding process, only the first alignment marks 401 on both sides of each conductive pad group 101 and the corresponding second alignment marks 402 on both sides of each first lead group 201 need to be aligned, and then the conductive pads 1011 on the bonding area on the display panel 10 and the first leads 2011 on the flexible circuit board 20 are also aligned correspondingly, then, when the printed circuit board 30 is attached, the matched first pin group 201 can be found for binding according to the difference of the number of the second pins 3011 of each second pin group 301, which is convenient and fast. The embodiment can avoid the problems of short circuit, open circuit and the like caused by too large binding offset possibly occurring due to too many small areas of the conductive pads 1011 or the first pins 2011 in the prior art, is favorable for improving the working efficiency and the panel yield of binding and fitting, and improves the electrical property stability of the display module.

It should be noted that, in this embodiment, the shapes of the first alignment mark 401 and the second alignment mark 402 are not specifically limited, and fig. 5 only shows that the shapes of the first alignment mark 401 and the second alignment mark 402 are cross-shaped, and may also be any other shapes, which is not described in detail in this embodiment.

In some optional embodiments, referring to fig. 1 and fig. 6, fig. 6 is another exploded view of fig. 1, in the display module 000 of the present embodiment, a set of third alignment marks 403 is disposed on both sides of each second pin group 301 along the first direction X, and the forward projections of the third alignment marks 403, the second alignment marks 402, and the first alignment marks 401 to the substrate base plate 100 have the same shape.

This embodiment further explains that when the conductive pads 1011 of the bonding area BA on the display panel 10, the first leads 2011 on the flexible circuit board 20, and the second leads 3011 on the printed circuit board 30 are electrically bonded, in order to avoid the risk of joint misalignment between the conductive pads 1011 of each conductive pad group 101 and the first leads 2011 and the third leads 3011 due to an excessive number of conductive pads 1011, a set of first alignment marks 401 is disposed on both sides of each conductive pad group 101, a set of second alignment marks 402 is disposed on both sides of each first lead group 201, a set of third alignment marks 403 is disposed on both sides of each second lead group 301, and the shapes of the forward projections of the third alignment marks 403, the second alignment marks 402, and the first alignment marks 401 onto the substrate 100 are the same, so that during the bonding process, only the first alignment marks 401, the second alignment marks 401, and the first alignment marks on both sides of each conductive pad group 101 need to be aligned The second alignment marks 402 on the two sides of each corresponding first pin group 201 and the third alignment marks 403 on the two sides of each corresponding second pin group 301 are aligned, so that each conductive pad 1011 in the bonding region on the display panel 10, each first pin 2011 on the flexible circuit board 20, and each second pin 3011 on the printed circuit board 30 are also aligned correspondingly, and further problems of short circuit, open circuit and the like caused by too large bonding deviation, which may occur due to too many numbers of the conductive pads 1011 or the first pins 2011 or the second pins 3011 and small areas in the prior art, can be further avoided, which is beneficial to further improving the working efficiency and the yield of bonding, and improving the electrical performance stability of the display module.

It should be noted that, in this embodiment, the shapes of the first alignment mark 401, the second alignment mark 402, and the third alignment mark 403 are not specifically limited, and fig. 6 only shows that the shapes of the first alignment mark 401, the second alignment mark 402, and the third alignment mark 403 are T-shaped, and certainly, the shapes may be any other shapes, which is not described in detail in this embodiment.

In some alternative embodiments, referring to fig. 1 and 7, fig. 7 is another exploded view of fig. 1, in the display module 000 of the embodiment, the shape of the orthographic projection of each group of the first alignment marks 401 onto the substrate 100 within the bonding area BA is different.

The embodiment further explains that the shape of the orthographic projection of each group of first alignment marks 401 to the substrate 100 within the range of the bonding area BA is different, and as a plurality of groups of conductive pad groups 101 with different numbers of conductive pads 1011 are arranged in the bonding area BA, and the conductive pads 1011 in each group of conductive pad groups 101 are generally dense and have more numbers, which may reach hundreds, in order to visually distinguish the conductive pad groups 101 with different numbers of conductive pads 1011 from the appearance, the embodiment adopts the different shape of the orthographic projection of each group of first alignment marks 401 arranged on the two sides of each group of conductive pads 101 to the substrate 100 to distinguish and identify different conductive pad groups 101, so that an operator or a machine can easily identify the conductive pad groups 101 with different numbers and different functions, and the problem of binding dislocation of the flexible circuit board 20 is avoided.

In the specific implementation process, as long as the shapes of the first alignment marks 401 on the two sides of the different conductive pad groups 101 are different and can be recognized by an operator or a machine, the shapes of each group of the second alignment marks 402 on the flexible circuit board 20 and each group of the third alignment marks 403 on the printed circuit board 30 are also designed to be different, for example, as shown in fig. 7, three conductive pad groups 101 are sequentially arranged in the binding area BA along the first direction X, and are sequentially a first conductive pad group 101a, a second conductive pad group 101b, and a third conductive pad group 101c, the first alignment marks 401a on the two sides of the first conductive pad group 101a are T-shaped, the first alignment marks 401b on the two sides of the second conductive pad group 101b are cross-shaped, the first alignment marks 401c on the two sides of the third conductive pad group 101b are U-shaped, and accordingly, three first lead groups 201 are sequentially arranged on the flexible circuit board 20 along the first direction X, the first pin group 201a, the second first pin group 201b and the third first pin group 201c are sequentially and respectively arranged, the second alignment mark 402a on two sides of the first pin group 201a is T-shaped, the second alignment mark 402b on two sides of the second first pin group 201b is cross-shaped, and the second alignment mark 402c on two sides of the third first pin group 201c is U-shaped; three second pin groups 301 are sequentially arranged on the printed circuit board 30 along the first direction X, which are a first second pin group 301a, a second pin group 301b, and a third second pin group 301c, respectively, in sequence, the third alignment marks 403a on both sides of the first second pin group 301a are T-shaped, the third alignment marks 403b on both sides of the second pin group 301b are cross-shaped, and the third alignment marks 403c on both sides of the third second pin group 301c are U-shaped. When the conductive pads 1011 of each conductive pad group 101 in this embodiment are located between a set of first alignment marks 401, the conductive pads 1011 with different numbers are identified by setting the first alignment marks 401 with different shapes in each set, so that the difference in the number of the specific conductive pads 1011 can be identified without equipment, and only visual observation is performed, which is intuitive and quick.

In some alternative embodiments, with continuing reference to fig. 1, 5-7, in the present embodiment, the shape of the orthographic projection of the first alignment mark 401 onto the substrate 100 includes any one or more of a U shape, a cross shape, and a T shape.

The embodiment merely illustrates that the shape of the orthographic projection of the first alignment mark 401 on the substrate 100 includes any one or more of a U shape, a cross shape, and a T shape, but is not limited to this shape, and may be other patterns, and only the basic requirements of the alignment mark need to be satisfied, so that the upper, lower, left, and right deviations of the alignment mark can be visually recognized, and the alignment deviation can be recognized, which is not repeated in this embodiment.

In some optional embodiments, referring to fig. 1 and 8, fig. 8 is another exploded view of fig. 1, in the display module 000 of this embodiment, except for the conductive pad group 101a with the minimum number of conductive pads 1011, the conductive pad groups 101 of the remaining groups all include at least one floating conductive pad 1011a and a plurality of effective conductive pads 1011b, and the floating conductive pad 1011a is not connected to an electrical signal;

except for the first pin group 201a with the smallest number of first pins 2011, the first pin groups 201 of the other groups all include at least one suspended first pin 2011a and a plurality of effective first pins 2011b, and the suspended first pins 2011a are not connected with an electrical signal;

Except for the second pin group 301a with the least number of second pins 3011, the second pin groups 301 of the remaining groups all include at least one floating second pin 3011a and a plurality of effective second pins 3011b, and the floating second pin 3011a is not connected to an electrical signal.

This embodiment further explains that when the number of conductive pads 1011 of each conductive pad group 101 is different and the number of conductive pads 1011 of the conductive pad group 101 is sequentially increased along the first direction X, the conductive pad groups 101 of the remaining groups include at least one floating conductive pad 1011a and a plurality of effective conductive pads 1011b, except for the conductive pad group 101a having the smallest number of conductive pads 1011 at the end. For example, as shown in fig. 8, three conductive pad groups 101, namely a first conductive pad group 101a, a second conductive pad group 101B, and a third conductive pad group 101C, are sequentially disposed in the bonding area BA along the first direction X, and along the first direction X, the number of conductive pads 1011 of the first conductive pad group 101a is a, the number of conductive pads 1011 of the second conductive pad group 101B adjacent to the first conductive pad group 101a is B, the number of conductive pads 1011 of the third conductive pad group 101C adjacent to the second conductive pad group 101B is C, where B is a +1, C is a +2, that is, the number of conductive pads 1011 of the first conductive pad group 101a is the smallest and all effective conductive pads 1011B, and the number of conductive pads 1011 of the second conductive pad group 101B is 1 more than that of the first conductive pad group 101a, then the increased one is the floating conductive pad 1011a, the rest conductive pads 1011 of the first conductive pad group 101a are all effective conductive pads 1011b in the same number, while the number of the conductive pads 1011 of the third conductive pad group 101c is 2 more than that of the first conductive pad group 101a, so that the two increased conductive pads 1011a are suspended conductive pads 1011a, and the rest conductive pads 1011 of the first conductive pad group 101a are all effective conductive pads 1011b in the same number. At this time, the arrangement of the first lead group 101 on the flexible circuit board 20 and the second lead group 301 on the printed circuit board 30 is also set according to the number of the conductive pads 1011 of each conductive pad group 101, that is, all the first leads 2011 of the first lead group 201a are effective first leads 2011b, and the second first lead group 201b includes effective first leads 2011b and 1 suspended first lead 2011a, which have the same number as the first lead group 201 a; the second pins 3011 of the first second pin group 301a are all effective second pins 3011b, and the second pin group 301b includes the same number of effective second pins 3011b and 2 floating second pins 3011a as the first second pin group 301 a. In addition, in the present embodiment, the suspended conductive pad 1011a is not connected to an electrical signal, the suspended first pin 2011a is not connected to an electrical signal, and the suspended second pin 3011a is not connected to an electrical signal, that is, the added suspended conductive pad 1011a, the suspended first pin 2011a, and the suspended second pin 3011a are all empty pins, and there is no signal, and no signal line is led out, so that the use of electrical connection is not affected, and the cost difference can be basically ignored.

In some optional embodiments, referring to fig. 1 and 9, fig. 9 is another exploded view of fig. 1, in the display module 000 of this embodiment, along the first direction X, a set of fourth alignment marks 404 is disposed on two sides of the effective conductive pad 1011b of each conductive pad group 101, a set of fifth alignment marks 405 is disposed on two sides of the effective first lead 2011b of each first lead group 201, a set of sixth alignment marks 406 is disposed on two sides of the effective second lead 3011b of each second lead group 301, and the forward projections of the fourth alignment marks 404, the fifth alignment marks 405, and the sixth alignment marks 406 to the substrate 100 have the same shape.

The present embodiment further explains that, in order to distinguish different numbers of conductive pad groups 101, save the recognition time and improve the work efficiency, the present embodiment places the floating conductive pads 1011a added for identifying the sequence of the different-function external driving circuits connected to the conductive pad groups 101 on the left (not shown) or right (shown in fig. 9) of the normally used effective conductive pads 1011b, i.e. the effective conductive pads 1011b of the normal connection potential signals are located between the fourth alignment marks 404 of each group, the floating conductive pads 1011a are uniformly located on the side of the fourth alignment marks 404 away from the effective conductive pads 1011b, correspondingly, the effective first pins 2011b of the normal connection potential signals are located between the fifth alignment marks 405 of each group, the floating first pins 2011a are uniformly located on the side of the fifth alignment marks 405 away from the effective first pins 2011b, effective second pins 3011b for normally connecting potential signals are arranged between each group of sixth alignment marks 406, and the suspended second pins 3011a are uniformly arranged on one side of the sixth alignment marks 406 far away from the effective second pins 3011b, so that the difference of the number of each group of conductive pads 1011, the first pins 2011 and the second pins 3011 can be distinguished without using equipment, only naked eye observation is needed, and the working efficiency is improved while the operation is convenient.

In some alternative embodiments, referring to fig. 9 and 10, fig. 10 is an enlarged view of an area M in fig. 9, in this embodiment, along the first direction X, a distance L between the floating conductive pad 1011a and the effective conductive pad 1011b of each conductive pad group 101 is greater than or equal to 3 mm.

This embodiment further explains that when the suspended conductive pad 1011a added for identifying the sequence of the external driving circuits with different functions connected to the conductive pad groups 101 is placed on the left (not shown) or right (shown in fig. 9) of the normally used effective conductive pad 1011b, the distance L between the suspended conductive pad 1011a and the effective conductive pad 1011b of each conductive pad group 101 is greater than or equal to 3mm, so that it is possible to avoid placing an alignment mark when the distance L between the suspended conductive pad 1011a and the effective conductive pad 1011b of each conductive pad group 101 is too small to affect the alignment effect during attachment.

It should be noted that, a distance L between the floating conductive pad 1011a and the effective conductive pad 1011b of each conductive pad group 101 of the present embodiment is specifically a distance between an adjacent floating conductive pad 1011a and an effective conductive pad 1011b in the same conductive pad group 101, and is a distance between an edge of the floating conductive pad 1011a close to the effective conductive pad 1011b and an edge of the effective conductive pad 1011b close to the floating conductive pad 1011a (specifically as shown in fig. 10).

In some alternative embodiments, with continued reference to fig. 8-10, the number of active conductive pads 1011b in each conductive pad group 101 is the same in this embodiment.

The present embodiment further explains that the number of the effective conductive pads 1011b for the normal electrical connection signals in each conductive pad group 101 is the same, the number of the effective first pins 2011b for the normal electrical connection signals in each first pin group 201 is the same, and the number of the effective second pins 3011b for the normal electrical connection signals in each second pin group 301 is the same, so that the conductive pads 1011 in different groups can be visually distinguished from the appearance only by adding the floating pins without accessing any electrical signal without changing the original arrangement structure of the normal signals in the display panel bonding area BA, the flexible circuit board 20, and the printed circuit board 30, and the process difficulty and the process cost are hardly affected.

In some alternative embodiments, with continued reference to fig. 8-10, the floating conductive pads 1011a of each conductive pad group 101 are located on the same side of the effective conductive pad 1011b along the first direction X.

This embodiment further illustrates that, along the first direction X, the floating conductive pads 1011a in each conductive pad set 101 are located on the same side of the active conductive pads 1011b, as shown in fig. 9, the floating conductive pads 1011a of each group are uniformly disposed on a side of the fourth alignment mark 404 away from the effective conductive pads 1011b (the floating conductive pads 1011a are uniformly disposed on a right side of the fourth alignment mark 404 away from the effective conductive pads 1011b in fig. 9 is illustrated as an example), correspondingly, each group of floating first pins 2011a is uniformly disposed on a side of the fifth alignment mark 405 away from the effective first pins 2011b, each group of floating second pins 3011a is uniformly disposed on a side of the sixth alignment mark 406 away from the effective second pins 3011b, therefore, the disorder caused by the arrangement of the suspended conductive pads 1011a can be avoided, certain unified standard specifications are reached, and the efficiency is improved.

In some optional embodiments, please refer to fig. 11, where fig. 11 is a schematic structural diagram of a display device 111 according to an embodiment of the present invention, and the display device 111 according to the embodiment includes the display module 000 according to the above embodiment of the present invention. The embodiment of fig. 11 only takes a mobile phone as an example to describe the display device 111, and it should be understood that the display device 111 provided in the embodiment of the present invention may be another display device 111 with a display function, such as a computer, a television, and a vehicle-mounted display device, and the present invention is not limited thereto. The display device 111 provided in the embodiment of the present invention has the beneficial effects of the display module 000 provided in the embodiment of the present invention, and specific descriptions of each display module in the above embodiments may be specifically referred to, and this embodiment is not described herein again.

According to the embodiment, the display module and the display device provided by the invention at least realize the following beneficial effects:

according to the invention, the conductive bonding pads needing to be bound with a plurality of driving circuits with different functions on the display panel in the prior art are arranged in groups, and the number of each group of conductive bonding pads is designed into different fool-proof designs, so that the conductive bonding pad groups with different functions can be directly distinguished from the appearance, and no dislocation risk exists completely. The display module does not need to judge the sequence during design, and only needs to judge whether the conductive bonding pads of the binding region, the first pins of the flexible circuit board and the second pins of the printed circuit board are matched or not; the step of communicating and confirming the sequence of the conductive bonding pads in the binding area by multiple departments is omitted before design, the research and development process is standardized by unified standards, and the research and development period is shortened; when laminating electricity is connected, need not to check the name of each electrically conductive pad group, and then can promote work efficiency, both can avoid the design mistake that leads to because of the order problem of confirming the electrically conductive pad of different functions, avoid the design mistake directly to scrap, can also reduce the scrapped article problem that human error brought.

Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A display module, comprising: the display device comprises a display panel, a flexible circuit board and a printed circuit board, wherein the printed circuit board is electrically connected with the display panel through the flexible circuit board;

the display panel comprises a display area and a non-display area, the display panel comprises a substrate, and a binding area is arranged in the range of the non-display area on the substrate;

the binding region comprises at least two conductive bonding pad groups which are sequentially arranged along a first direction, each conductive bonding pad group comprises a plurality of conductive bonding pads, and the number of the conductive bonding pads of each conductive bonding pad group is sequentially increased by one along the first direction;

the flexible circuit board comprises at least two first pin groups which are sequentially arranged along the first direction, each first pin group comprises first pins with the same number as the conductive bonding pads of each conductive bonding pad group, each first pin penetrates through the flexible circuit board in the direction perpendicular to the light-emitting surface of the display panel, and each first pin group is electrically connected with the conductive bonding pads of each conductive bonding pad group in a one-to-one correspondence manner through the first pins;

The printed circuit board comprises at least two second pin groups which are sequentially arranged along the first direction, each second pin group comprises second pins with the same number as the first pins of each flexible circuit board, and each first pin group is electrically connected with the second pins of each second pin group in a one-to-one correspondence mode through the first pins.

2. The display module according to claim 1, wherein along the first direction, a set of first alignment marks is disposed on both sides of each of the conductive pad groups, a set of second alignment marks is disposed on both sides of each of the first lead group, and orthogonal projections of the first alignment marks and the second alignment marks on the substrate have the same shape.

3. The display module according to claim 2, wherein a set of third alignment marks is disposed on two sides of each of the second lead groups along the first direction, and the shapes of orthographic projections of the third alignment marks, the second alignment marks and the first alignment marks on the substrate are the same.

4. The display module according to claim 2, wherein each group of the first alignment marks in the range of the bonding region has a different shape in orthographic projection on the substrate base plate.

5. The display module according to claim 2, wherein the shape of the orthographic projection of the first alignment mark on the substrate base plate comprises any one or more of a U shape, a cross shape and a T shape.

6. The display module according to claim 1, wherein the groups of conductive pads of the remaining groups, except the group of conductive pads with the least number of conductive pads, each include at least one floating conductive pad and a plurality of active conductive pads, and the floating conductive pads are not connected to an electrical signal;

except the first pin group with the least number of the first pins, the first pin groups of other groups comprise at least one suspended first pin and a plurality of effective first pins, and the suspended first pin is not connected with an electric signal;

except the second pin group with the least number of the second pins, the second pin groups of other groups all comprise at least one suspended second pin and a plurality of effective second pins, and the suspended second pin is not connected with an electric signal.

7. The display module according to claim 6, wherein along the first direction, a set of fourth alignment marks is disposed on two sides of the effective conductive pad of each conductive pad group, a set of fifth alignment marks is disposed on two sides of the effective first lead of each first lead group, a set of sixth alignment marks is disposed on two sides of the effective second lead of each second lead group, and the shapes of orthographic projections of the fourth alignment marks, the fifth alignment marks, and the sixth alignment marks on the substrate are the same.

8. The display module of claim 6, wherein the distance between the floating conductive pad and the active conductive pad of each conductive pad group along the first direction is greater than or equal to 3 mm.

9. The display module of claim 6, wherein the number of active conductive pads in each of the conductive pad sets is the same.

10. The display module of claim 6, wherein the suspended conductive pads in each of the conductive pad groups are located on the same side of the active conductive pad along the first direction.

11. A display device comprising the display module according to any one of claims 1 to 10.