CN214587759U - Binding structure, display panel and display device - Google Patents
Binding structure, display panel and display device Download PDFInfo
- Publication number
- CN214587759U CN214587759U CN202120391124.2U CN202120391124U CN214587759U CN 214587759 U CN214587759 U CN 214587759U CN 202120391124 U CN202120391124 U CN 202120391124U CN 214587759 U CN214587759 U CN 214587759U
- Authority
- CN
- China
- Prior art keywords
- binding
- bonding
- substrate
- area
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
The application provides a binding structure, including first binding base plate, second binding base plate and locate first binding base plate and second binding base plate between the anisotropic conducting resin. The first binding substrate comprises a first binding area, the second binding substrate comprises a second binding area corresponding to the first binding area, the first binding substrate further comprises a first adhesion area positioned at each end of the first binding area in the extension direction, and the first adhesion area is provided with a concave-convex structure; the anisotropic conductive adhesive is pre-attached to one side, facing the second binding substrate, of the first binding substrate and covers the first binding area and the first adhesion area, and the first binding area and the second binding area are bonded and conducted after the anisotropic conductive adhesive is pressed. The binding structure can avoid the phenomenon that the anisotropic conductive adhesive is folded reversely in the binding process. The application also provides a display panel comprising the binding structure and a display device comprising the display panel.
Description
Technical Field
The present application relates to the field of display technologies, and in particular, to a binding structure, a display panel including the binding structure, and a display device including the display panel.
Background
The bonding is a technical means for electrically connecting a circuit between the flexible circuit board and the display panel, or a circuit between the flexible circuit board and the printed circuit board, or a circuit between two flexible circuit boards in the manufacturing process of the display device.
In the prior art, during the hot-press bonding of the bonded substrates by using an ACF (anisotropic conductive adhesive), the ACF is pre-bonded to one of the bonded substrates, so that the ACF covers the bonding area of the bonded substrate and the partial areas at the two ends of the bonding area, and then the ACF release film is peeled off from the ACF by using a peeling bar. However, since the bonding substrate is not provided with bonding wires in the partial regions at the two ends of the bonding region, the surface roughness of the bonding substrate is low, the adhesion between the ACF glue and the partial bonding substrate is small, the ACF glue is easily taken up when the ACF release film is peeled off, and then the ACF glue is reversely folded, so that the ACF glue and the bonding substrate are poorly attached, the ACF glue needs to be manually erased and then attached again, the manual operation time and the labor load are increased, and the risk of product scrapping exists.
SUMMERY OF THE UTILITY MODEL
The present application is directed to solving at least one of the problems in the prior art. Therefore, the application provides a binding structure, a display panel and a display device, wherein the binding structure can avoid the phenomenon that the anisotropic conductive adhesive is reversely folded in the binding process.
In order to achieve the above object, in a first aspect, the present application provides a bonding structure, including a first bonding substrate, a second bonding substrate, and an anisotropic conductive adhesive disposed between the first bonding substrate and the second bonding substrate. The first binding substrate comprises a first binding area, the second binding substrate comprises a second binding area corresponding to the first binding area, the first binding substrate further comprises a first adhesion area positioned at each end of the first binding area in the extension direction, and the first adhesion area is provided with a concave-convex structure; the anisotropic conductive adhesive is pre-attached to one side, facing the second binding substrate, of the first binding substrate and covers the first binding area and the first adhesion area, and the anisotropic conductive adhesive is pressed to bond and conduct the first binding area and the second binding area.
In one embodiment, the first bonding substrate further includes a first alignment mark located at each end in an extending direction of the first bonding region, and the second bonding substrate further includes a second alignment mark corresponding to the first alignment mark of the first bonding substrate; the first bonding area at each end of the first binding area is positioned at one side, far away from the first binding area, of the first alignment mark at the corresponding end of the first bonding area.
In an embodiment, the second binding substrate further includes a second adhesion area corresponding to the first adhesion area of the first binding substrate, and the concave-convex structure is disposed in the second adhesion area.
In one embodiment, the first binding substrate further comprises a first bias detection region, the first bias detection region is located between a first alignment mark at each end of the first binding region and the first binding region; the second binding substrate further comprises a second partial inspection area corresponding to the first partial inspection area of the first binding substrate, and the second binding substrate is transparent at least at a position corresponding to the second partial inspection area; the first partial examination area and the second partial examination area are provided with detection structures which correspond to each other one by one.
In an embodiment, the detection structure includes at least one bar mark, and an extending direction of each bar mark intersects with an extending direction of the first binding region.
Preferably, in an embodiment, the detection structure includes a plurality of bar marks arranged at intervals, and the interval direction of the plurality of bar marks is the same as or different from the extending direction of a single bar mark.
In an embodiment, a circuit structure is disposed on a side of the second bonding substrate opposite to the first bonding substrate, and the circuit structure is disposed between the second bias inspection regions of the second bonding substrate.
In one embodiment, the concave-convex structure comprises a plurality of strip-shaped bulges or a plurality of strip-shaped grooves which are arranged at intervals; or the concave-convex structure comprises a plurality of bulges or a plurality of grooves distributed in an array, and the shapes of the bulges or the grooves comprise at least one of a square shape, a conical shape and a spherical shape.
In a second aspect, the present application further provides a display panel including the above binding structure.
In a third aspect, the present application further provides a display device, which includes a display panel, where the display panel includes the above binding structure.
Compared with the prior art, the beneficial effect that this application has does: in the binding structure, the concave-convex structure is arranged in the first adhesion area of the first binding substrate, so that the surface roughness of the first binding substrate in the first adhesion area is increased, and further, the adhesion between the anisotropic conductive adhesive and the part of the first binding substrate is increased, so that the anisotropic conductive adhesive is not easily taken up by the anisotropic conductive adhesive to be peeled off from the release film in the binding process, the phenomenon of reverse folding of the anisotropic conductive adhesive can be avoided, the attachment superiority between the anisotropic conductive adhesive and the first binding substrate is favorably improved, and the reliability of binding connection between the first binding substrate and the second binding substrate through the anisotropic conductive adhesive is favorably improved.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
Fig. 1 is a schematic diagram of a binding structure provided in an embodiment of the present application.
Fig. 2 is a schematic diagram of the first bonding substrate in fig. 1 according to an embodiment.
Fig. 3 is a schematic diagram of the second bonding substrate in fig. 1 according to an embodiment.
Fig. 4 is a schematic diagram of the first bonding substrate of fig. 1 in another embodiment.
Fig. 5 is a schematic view of the second bonding substrate of fig. 1 in another embodiment.
Description of the main element symbols:
First binding substrate 20
First binding region 21
First adhesive area 23
First partial examination region 27
Second binding substrate 40
Second binding region 41
Second adhesive area 43
Second partial examination region 47
Anisotropic conductive adhesive 60
The first concave-convex structure 31
Second concave-convex structure 32
The following detailed description will further illustrate the present application in conjunction with the above-described figures.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
In the description of the present application, it should be noted that the terms "upper", "lower", "left", "right", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance
Referring to fig. 1, an embodiment of the present application provides a bonding structure 100 including a first bonding substrate 20, a second bonding substrate 40, and an anisotropic conductive adhesive 60. Wherein the first binding substrate 20 and the second binding substrate 40 are partially stacked; the anisotropic conductive adhesive 60 is disposed between the first bonding substrate 20 and the second bonding substrate 40, so as to realize bonding connection between the first bonding substrate 20 and the second bonding substrate 40. It should be noted that the first bonding substrate 20 and the second bonding substrate 40 may be any two substrates that need to be bonded, such as a flexible printed circuit board, a printed circuit board, and a chip on film, and are not limited thereto. In this embodiment, the first bonding substrate 20 is a flexible printed circuit board, and the second bonding substrate 40 is a chip on film.
Specifically, referring to fig. 2, the first bonding substrate 20 includes a first bonding region 21 and a first adhesion region 23 located at each end of the first bonding region 21 in the extending direction, wherein the first bonding region 21 is provided with a plurality of first bonding pins (not numbered), and the first adhesion region 23 is provided with a concave-convex structure. Referring to fig. 3, the second bonding substrate 40 includes a second bonding region 41 having a plurality of second bonding pins (not numbered), and the plurality of second bonding pins correspond to the plurality of first bonding pins one to one, that is, the second bonding region 41 corresponds to the first bonding region 21.
As shown in fig. 2 and fig. 3, in this embodiment, the first bonding pins on the first bonding substrate 20 are arranged at intervals, and extend along the same direction, that is, the first bonding pins are parallel to each other; the plurality of second bonding pins on the second bonding substrate 40 are arranged at intervals, and extend in the same direction parallel to the extending direction of the plurality of first bonding pins, so that the plurality of second bonding pins are parallel to each other and correspond to the plurality of first bonding pins one to one. Wherein the extending direction of the first and second bonding pins may be the same as or different from the extending direction of the first bonding region 21. In this embodiment, the extending directions of the first bonding pin and the second bonding pin are perpendicular to the extending direction of the first bonding region 21.
It is to be understood that the respective extension lengths of the plurality of first bonding pins and the plurality of second bonding pins may be the same or different. Preferably, in this embodiment, the respective extension lengths of the plurality of first bonding pins and the plurality of second bonding pins are the same, which is beneficial to processing and manufacturing the bonding pins.
In other embodiments, the extension lengths of the first bonding pins and the second bonding pins may be different, as long as each of the first bonding pins and the corresponding second bonding pin can be bonded and connected by the anisotropic conductive adhesive 60.
In other embodiments, the plurality of first bonding pins and the plurality of second bonding pins may also extend in different directions as long as there is no overlap between the plurality of first bonding pins and between the plurality of second bonding pins.
Referring to fig. 1 again, in the embodiment of the application, in the binding process of the binding structure 100, the anisotropic conductive adhesive 60 is attached to a side of the first binding substrate 20 facing the second binding substrate 40 in advance, and covers the first binding region 21 and the first adhesion region 23, and after the anisotropic conductive adhesive 60 is pressed, the first binding region 21 and the second binding region 41 are bonded and conducted, so that the binding connection between the first binding substrate 20 and the second binding substrate 40 is realized. It can be understood that the first adhesion region 23 is provided with the concave-convex structure, so that the surface roughness of the first binding substrate 20 of the first adhesion region 23 can be increased, and further, the adhesion between the anisotropic conductive adhesive 60 and the first binding substrate 20 of the portion can be increased, so that the anisotropic conductive adhesive 60 is not easily taken up by the anisotropic conductive adhesive release film to be peeled off in the binding process, and thus, the phenomenon that the anisotropic conductive adhesive 60 is reversely folded can be avoided, which is beneficial to improving the attachment superiority between the anisotropic conductive adhesive 60 and the first binding substrate 20, and is further beneficial to improving the reliability of the binding connection between the first binding substrate 20 and the second binding substrate 40 through the anisotropic conductive adhesive 60.
In an embodiment of the present application, the concave-convex structure may include a plurality of strip-shaped protrusions or a plurality of strip-shaped grooves arranged at intervals, and may also include a plurality of protrusions or a plurality of grooves distributed in an array, where the shape of the plurality of protrusions or the plurality of grooves includes at least one of a square shape, a cone shape, and a sphere shape. As shown in fig. 2, in the present embodiment, the concave-convex structure includes a plurality of strip-shaped protrusions arranged at intervals. The extending direction of each of the strip-shaped protrusions may be the same as or different from the extending direction of the first binding region 21, and the spacing direction of the plurality of strip-shaped protrusions is perpendicular to the extending direction of each of the strip-shaped protrusions, which is not limited herein. In this embodiment, the extending direction of each of the strip-shaped protrusions may be perpendicular to the extending direction of the first binding region 21. In other embodiments, the extending direction of each of the strip-shaped protrusions may be parallel to or at an angle with the extending direction of the first binding region 21.
Referring to fig. 2 and 3 again, in an embodiment of the present application, the first bonding substrate 20 further includes a first alignment mark 25 located at each end of the first bonding region 21 in the extending direction, the second bonding substrate 40 further includes a second alignment mark 45 corresponding to the first alignment mark 25 of the first bonding substrate 20, and the first adhesion region 23 located at each end of the first bonding region 21 is located at a side of the first alignment mark 25 located at the corresponding end thereof away from the first bonding region 21. The first alignment mark 25 and the corresponding second alignment mark 45 are used for positioning, so as to prevent the plurality of first bonding pins and the plurality of second bonding pins from being misaligned when the first bonding substrate 20 and the second bonding substrate 40 are stacked.
Specifically, in some embodiments, the first alignment mark 25 and the second alignment mark 45 may be positioning holes formed on the first bonding substrate 20 and the second bonding substrate 40, and when the alignment of the respective positioning holes of the first bonding substrate 20 and the second bonding substrate 40 is observed, it is stated that the plurality of first bonding pins and the plurality of second bonding pins are in one-to-one correspondence. The positioning holes include, but are not limited to, circular through holes and cross-shaped through holes.
In other embodiments, the first alignment mark 25 and the second alignment mark 45 may also be alignment marks coated on the first bonding substrate 20 and the second bonding substrate 40, the second bonding substrate 40 is transparent in a region corresponding to the second alignment mark 45, and when the alignment of the respective alignment marks of the first bonding substrate 20 and the second bonding substrate 40 is observed through the second bonding substrate 40 in the transparent portion, it is stated that the plurality of first bonding pins and the plurality of second bonding pins are in one-to-one correspondence. Also, the positioning marks include, but are not limited to, circular marks, cross-shaped marks.
Of course, in other embodiments, the first alignment mark 25 and the second alignment mark 45 may be in other forms, which are not described herein. In this embodiment, the first alignment mark 25 and the second alignment mark 45 are cross-shaped through holes respectively formed on the first binding substrate 20 and the second binding substrate 40.
It should be noted that the first alignment mark 25 and the second alignment mark 45 may be formed on the first binding substrate 20 and the second binding substrate 40 by common means such as laser processing and etching, which is not described in detail herein.
Preferably, as shown in fig. 3, in this embodiment, the second binding substrate 40 further includes a second adhesive region 43 corresponding to the first adhesive region 23 of the first binding substrate 20, wherein the second adhesive region 43 at each end of the second binding region 41 is located at a side of the second alignment mark 45 at the corresponding end thereof, which is far away from the second binding region 41, and the second adhesive region 43 is provided with the foregoing concave-convex structure. It can be understood that by providing the concave-convex structure in the second adhesion region 43, the surface roughness of the second bonding substrate 40 of the second adhesion region 43 can be increased, and then the adhesion between the anisotropic conductive adhesive 60 and the portion of the second bonding substrate 40 can be increased, which is beneficial to improving the adhesion quality between the anisotropic conductive adhesive 60 and the second bonding substrate 40, and further improving the reliability of the bonding connection between the first bonding substrate 20 and the second bonding substrate 40 through the anisotropic conductive adhesive 60.
For convenience of description, in the embodiment of the present application, as shown in fig. 2 and 3, the concave-convex structure in the first adhesion region 23 is defined as a first concave-convex structure 31, and the concave-convex structure in the second adhesion region 43 is defined as a second concave-convex structure 32. The first relief structure 31 and the second relief structure 32 may have the same or different structures.
Specifically, as shown in fig. 2 and fig. 3, in an implementation manner of this embodiment, the first concave-convex structure 31 and the second concave-convex structure 32 have the same structure, and both of them include a plurality of strip-shaped protrusions arranged at intervals, and an extending direction of each strip-shaped protrusion is perpendicular to an extending direction of the first binding region 21. In other embodiments, the first concave-convex structure 31 and the second concave-convex structure 32 may also be other types of concave-convex structures with the same structure, which is not described herein again. Referring to fig. 4 and 5, in another embodiment of the present invention, the first concave-convex structure 31 and the second concave-convex structure 32 have different structures, the first concave-convex structure 31 includes a plurality of protrusions distributed in an array, each of the protrusions has a square shape, the second concave-convex structure 32 includes a plurality of strip-shaped protrusions arranged at intervals, and an extending direction of each of the strip-shaped protrusions is parallel to an extending direction of the first binding region 21. Of course, in other embodiments, the first concave-convex structure 31 and the second concave-convex structure 32 may also be other types of concave-convex structures with different structures, and details thereof are not described here.
Further, as shown in fig. 2 and fig. 3, in an embodiment of the present application, the first binding substrate 20 further includes a first biased inspection region 27, the first biased inspection region 27 is located between the first alignment mark 25 at each end of the first binding region 21 and the first binding region 21, the second binding substrate 40 further includes a second biased inspection region 47 corresponding to the first biased inspection region 27 of the first binding substrate 20, the first biased inspection region 27 and the second biased inspection region 47 are provided with a one-to-one corresponding detection structure 80, and the second binding substrate 40 is at least transparent at a position corresponding to the second biased inspection region 47.
Whether the detection structures 80 of the first partial inspection region 27 and the second partial inspection region 47 are aligned or not is observed through the portion of the second binding substrate 40 corresponding to the second partial inspection region 47, which also has a positioning effect, so as to prevent the plurality of first binding pins and the plurality of second binding pins from being misaligned when the first binding substrate 20 and the second binding substrate 40 are stacked. It can be understood that, the dual positioning is realized by using the first alignment mark 25 and the corresponding second alignment mark 45, and the detection structures 80 of the first deviation detection area 27 and the second deviation detection area 47, which is not only beneficial to improving the positioning accuracy, but also can prevent the problem of the misalignment of the first alignment mark 25 and the corresponding second alignment mark 45 caused by the poor processing accuracy.
Wherein the detecting structure 80 comprises at least one bar-shaped mark, and the extending direction of each bar-shaped mark intersects with the extending direction of the first binding region 21. Preferably, as shown in fig. 2 and fig. 3, in this embodiment, the detection structure 80 includes a plurality of bar marks arranged at intervals, an extending direction of each bar mark is perpendicular to an extending direction of the first binding region 21, and the interval direction of the plurality of bar marks is perpendicular to the extending direction of a single bar mark.
In other embodiments, the detection structure 80 includes a plurality of bar marks arranged at intervals, an extending direction of each bar mark is perpendicular to an extending direction of the first binding region 21 at an included angle, and the interval directions of the plurality of bar marks are perpendicular to the extending direction of a single bar mark.
In other embodiments, the detection structure 80 includes a plurality of bar marks arranged at intervals, the interval direction of the plurality of bar marks is the same as the extending direction of a single bar mark, wherein the plurality of bar marks may be distributed on the same straight line or different straight lines, and the extending direction of each bar mark is perpendicular to the extending direction of the first binding region 21 or forms a certain included angle.
Furthermore, in the embodiment of the present application, the first binding substrate 20 and the second binding substrate 40 are respectively disposed with the first biased inspection region 27 and the second biased inspection region 47, and when the second binding substrate 40 is at least at a position corresponding to the second biased inspection region 47, a circuit structure can be disposed on one side of the second binding substrate 40 facing away from the first binding substrate 20, and the circuit structure is disposed between the second biased inspection regions 47 of the second binding substrate 40. The circuit structure may be any kind of functional circuit, such as a driving circuit, an ESD protection circuit, and the like, which is not limited thereto.
It can be understood that, by disposing the circuit structure on the side of the second bonding substrate 40 opposite to the first bonding substrate 20 and between the two second bias detection regions 47 of the second bonding substrate 40, it is not prevented that a user can observe whether the detection structures 80 of the first bias detection region 27 and the second bias detection region 47 are aligned through the portion of the second bonding substrate 40 corresponding to the second bias detection region 47, and the circuit integration of the second bonding substrate 40 can be improved.
As described above, in the bonding structure 100 provided by the present application, the concave-convex structures are respectively disposed in the first bonding region 23 of the first bonding substrate 20 and the second bonding region 43 of the second bonding substrate 40, so that the surface roughness of the first bonding substrate 20 of the first bonding region 23 and the surface roughness of the second bonding substrate 40 of the second bonding region 43 can be increased, and the adhesion between the anisotropic conductive adhesive 60 and the first bonding substrate 20 and the second bonding substrate 40 can be further increased, which is beneficial to improving the adhesion quality between the anisotropic conductive adhesive 60 and the first bonding substrate 20 and the second bonding substrate 40, and is further beneficial to improving the reliability of the bonding connection between the first bonding substrate 20 and the second bonding substrate 40; moreover, by respectively providing the first binding substrate 20 and the second binding substrate 40 with offset detection regions having the detection structures 80, and by providing the second binding substrate 40 with a transparent portion corresponding to the offset detection regions, the alignment marks and the detection structures 80 of the first binding substrate 20 and the second binding substrate 40 can be used for realizing dual positioning, which is not only beneficial to improving the positioning accuracy, but also can prevent the problem of misalignment caused by poor processing accuracy of the alignment marks of the first binding substrate 20 and the second binding substrate 40; in addition, any functional circuit structure may be further disposed on a side of the second bonding substrate 40 opposite to the first bonding substrate 20, which is beneficial to improving the circuit integration of the second bonding substrate 40.
Further, the present application also provides a display panel, where the display panel may be a liquid crystal display panel, a field emission display panel, a plasma display panel, an organic light emitting panel of an organic light emitting diode display device, or a panel of any suitable display device, and any two substrates to be bonded in the display panel are bonded by using the bonding structure 100 provided in the present application.
Furthermore, the present application further provides a display device, which includes any one of the display panels described above, and any two substrates to be bonded in the display panel are bonded by using the bonding structure 100 provided in the present application.
It can be understood that, in the display panel and the display device, the binding structure 100 provided by the present application is adopted to bind between any two substrates to be bound, so that the phenomenon of reverse folding of the anisotropic conductive adhesive can be avoided, the attachment superiority between the anisotropic conductive adhesive and the substrate to be bound is improved, and the reliability of the binding connection between the substrates to be bound is improved. For a more detailed description, please refer to the related contents, which are not described herein again.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, or through the communication between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
In the description of the present application, reference to the description of the terms "embodiment," "particular embodiment," "example," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A binding structure, comprising:
a first binding substrate including a first binding region;
a second binding substrate including a second binding region, the first binding region corresponding to the second binding region; and
an anisotropic conductive adhesive disposed between the first and second binding substrates;
the first binding substrate further comprises a first adhesion area positioned at each end of the first binding area in the extension direction, and the first adhesion area is provided with a concave-convex structure; the anisotropic conductive adhesive is pre-attached to one side, facing the second binding substrate, of the first binding substrate and covers the first binding area and the first adhesion area, and the anisotropic conductive adhesive is pressed to bond and conduct the first binding area and the second binding area.
2. The bonding structure of claim 1, wherein the first bonding substrate further comprises a first alignment mark at each end in an extending direction of the first bonding region, and the second bonding substrate further comprises a second alignment mark corresponding to the first alignment mark of the first bonding substrate;
the first bonding area at each end of the first binding area is positioned at one side, far away from the first binding area, of the first alignment mark at the corresponding end of the first bonding area.
3. The bonding structure of claim 2, wherein the second bonding substrate further comprises a second adhesive region corresponding to the first adhesive region of the first bonding substrate, the second adhesive region providing the concavo-convex structure.
4. The bonding structure of claim 2 or 3, wherein the first bonding substrate further comprises a first bias detection region between a first alignment mark at each end of the first bonding region and the first bonding region;
the second binding substrate further comprises a second partial inspection area corresponding to the first partial inspection area of the first binding substrate, and the second binding substrate is transparent at least at a position corresponding to the second partial inspection area;
the first partial examination area and the second partial examination area are provided with detection structures which correspond to each other one by one.
5. The binding structure according to claim 4, wherein the detection structure comprises at least one bar-shaped mark, and an extending direction of each bar-shaped mark intersects with an extending direction of the first binding region.
6. The binding structure according to claim 5, wherein the detection structure comprises a plurality of bar marks arranged at intervals, and the interval direction of the plurality of bar marks is the same as or different from the extending direction of a single bar mark.
7. The bonded structure of claim 4, wherein a side of the second bonded substrate facing away from the first bonded substrate is provided with a circuit structure, the circuit structure being disposed between the second bias test regions of the second bonded substrate.
8. The binding structure according to claim 1, wherein the concavo-convex structure includes a plurality of strip-shaped protrusions or a plurality of strip-shaped grooves arranged at intervals; or
The concave-convex structure comprises a plurality of protrusions or a plurality of grooves distributed in an array, and the shape of the plurality of protrusions or the plurality of grooves comprises at least one of a square shape, a conical shape and a spherical shape.
9. A display panel comprising the binding structure according to any one of claims 1 to 8.
10. A display device comprising a display panel comprising the binding structure of any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120391124.2U CN214587759U (en) | 2021-02-22 | 2021-02-22 | Binding structure, display panel and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120391124.2U CN214587759U (en) | 2021-02-22 | 2021-02-22 | Binding structure, display panel and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214587759U true CN214587759U (en) | 2021-11-02 |
Family
ID=78316701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120391124.2U Expired - Fee Related CN214587759U (en) | 2021-02-22 | 2021-02-22 | Binding structure, display panel and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214587759U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114167653A (en) * | 2021-12-07 | 2022-03-11 | 苏州华星光电技术有限公司 | Display panel and display device |
| WO2023246536A1 (en) * | 2022-06-21 | 2023-12-28 | 京东方科技集团股份有限公司 | Display device |
-
2021
- 2021-02-22 CN CN202120391124.2U patent/CN214587759U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114167653A (en) * | 2021-12-07 | 2022-03-11 | 苏州华星光电技术有限公司 | Display panel and display device |
| WO2023246536A1 (en) * | 2022-06-21 | 2023-12-28 | 京东方科技集团股份有限公司 | Display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN214587759U (en) | Binding structure, display panel and display device | |
| TWI821301B (en) | Electronic apparatus including display panel | |
| CN110687729B (en) | Display module and display device | |
| US9572248B2 (en) | Display device | |
| US20160188059A1 (en) | Touch screen-integrated display device | |
| US7090506B2 (en) | Signal transmission device having flexible printed circuit boards | |
| EP2133739B1 (en) | Flat panel display apparatus and method of manufacturing the same | |
| CN106057082A (en) | Display device | |
| US7342180B2 (en) | Flexible printed circuit and liquid crystal display device using same | |
| US11199882B2 (en) | Display device | |
| WO2019146253A1 (en) | Substrate bonding structure | |
| CN113301713A (en) | Printed circuit board, flexible circuit board, display panel and manufacturing method | |
| US9559157B2 (en) | Display device | |
| CN108828856B (en) | Array substrate and display panel | |
| JP2008145753A (en) | Display device | |
| CN107871758B (en) | Display device | |
| CN100397165C (en) | Liquid crystal display apparatus | |
| CN219162954U (en) | Micro display module connection structure | |
| CN218679473U (en) | Flexible circuit board and display device | |
| KR100762700B1 (en) | Flat Panel Display equipped with Tape Carrier Package | |
| TWI829077B (en) | Electronic device | |
| CN215734997U (en) | Printed circuit board, flexible circuit board and display panel | |
| CN219740726U (en) | Circuit substrate | |
| KR200234998Y1 (en) | Plasma Display Panel Device | |
| CN109459887B (en) | Method for manufacturing light source component and light source component |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211102 |