CN113939078A - Flexible circuit board, display panel, display device and manufacturing method thereof - Google Patents
Flexible circuit board, display panel, display device and manufacturing method thereof Download PDFInfo
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- CN113939078A CN113939078A CN202111330312.5A CN202111330312A CN113939078A CN 113939078 A CN113939078 A CN 113939078A CN 202111330312 A CN202111330312 A CN 202111330312A CN 113939078 A CN113939078 A CN 113939078A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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Abstract
The invention relates to a flexible circuit board, a display panel, a display device and a manufacturing method thereof. Comprises a first zone and a second zone arranged along a first direction; at least one first area is positioned at the outermost side of the flexible circuit board and is provided with a first marking part; the second area is arranged between the two first areas; each first area is provided with a first bonding area, and the elastic modulus of each first area is greater than that of each second area. This application can improve flexible circuit board and display panel's nation and decide the precision.
Description
Technical Field
The invention relates to the technical field of display, in particular to a flexible circuit board, a display panel, a display device and a manufacturing method thereof.
Background
With the development of display technology, the size of the display screen is larger and larger, and products such as a folding mobile phone and a tablet personal computer appear.
In a large-sized display screen of these products, two or more bonding regions are provided corresponding to a display panel and an FPC (Flexible Printed Circuit). The bonding between the display panel and the FPC is realized by increasing the number of bonding areas.
However, the greater the number of bonding areas, the poorer the accuracy of bonding.
Disclosure of Invention
In view of this, it is necessary to provide a flexible circuit board, a display panel, a display device, and a method of manufacturing the same, which address the problem that bonding accuracy deteriorates as the number of bonding areas increases.
A flexible circuit board includes a first region and a second region arranged in a first direction;
at least one first area is positioned at the outermost side of the flexible circuit board and is provided with a first marking part; the second area is arranged between the two first areas;
each first area is provided with a first bonding area, and the elastic modulus of each first area is greater than that of each second area.
In one embodiment, the flexibility of the first region is less than the flexibility of the second region.
In one embodiment, the material of the first region is the same as the material of the second region;
the thickness of the first region is greater than the thickness of the second region;
preferably, the thickness of the first region is 8 to 12 times the thickness of the second region.
In one embodiment, the flexible circuit board comprises at least two of the second regions;
the widths of the second regions in the first direction are equal.
In one embodiment, the flexible circuit board is provided with two first mark parts, and a central connecting line of the two first mark parts passes through the first bonding area;
preferably, a central line of the two first mark portions is parallel to the first direction; the central connecting line of the two first mark parts and the symmetry axis of the first bonding area along the first direction are collinear.
A display panel comprises a second bonding area bonded with a first bonding area of a flexible circuit board, wherein the flexible circuit board is the flexible circuit board provided by any one of the embodiments;
and second marking parts which are aligned with the first marking parts of the flexible circuit board are arranged on two sides of the second bonding area along the first direction.
In one embodiment, the display panel is provided with two second mark parts, and a central connecting line of the two second mark parts passes through the second bonding area;
preferably, a central line of the two second mark portions is parallel to the first direction; the central connecting line of the two second mark parts and the symmetry axis of the second bonding area along the first direction are collinear.
A display device, comprising the flexible circuit board provided in any of the above embodiments and the display panel provided in any of the above embodiments;
the center of the second mark part of the display panel is aligned with the center of the first mark part of the flexible circuit board, and the second bonding area of the display panel is bonded and connected with the first bonding area of the flexible circuit board.
A method of manufacturing a display device, the method comprising:
providing a flexible circuit board provided by any one of the above embodiments and a display panel provided by any one of the above embodiments;
determining the distance between two first mark parts on the flexible circuit board and the distance between two second mark parts on the display panel;
controlling the second area on the flexible circuit board to stretch until the distance between the two first mark parts is equal to the distance between the two second mark parts;
and when the midpoint of the central connecting line of the two first mark parts is aligned with the midpoint of the central connecting line of the two second mark parts, bonding and connecting the first bonding area on the flexible circuit board and the second bonding area on the display panel.
A manufacturing method of a flexible circuit board, the manufacturing method comprising:
providing a first zone and a second zone arranged along a first direction, the second zone being disposed between the two first zones;
thinning the thickness of the second region to make the elastic modulus of the first region larger than that of the second region;
forming a first mark part on the first region located at the outermost side of the flexible circuit board;
and forming a first bonding area on each first area to obtain the flexible circuit board.
The flexible circuit board, the display panel, the display device and the manufacturing method thereof comprise the first area and the second area which are arranged along the first direction, and the elastic modulus of the first area is larger than that of the second area, so that when the flexible circuit board is stretched or compressed along the first direction, the second area can be stretched preferentially, and the first area can be kept unchanged. At least one first zone is located the flexible circuit board outside, and it is equipped with first mark portion, is equipped with first bonding area on each first zone, and first mark portion and first bonding area can not receive the influence when flexible circuit board is tensile along first direction or compression to the mark distance between one first mark portion and the flexible circuit board outside or between two first mark portions can be along with the flexible and corresponding change in the flexible of second district. If the marking distance in the flexible circuit board is not equal to the marking distance in the display panel, the flexible circuit board may be stretched or compressed in the first direction until the marking distance in the flexible circuit board is equal to the marking distance in the display panel. At the moment, the dislocation between the first bonding area in the flexible circuit board and the second bonding area in the display panel is improved, the alignment effect is better, and the bonding precision of the flexible circuit board and the display panel is improved.
Drawings
Fig. 1 is a diagram illustrating a positional relationship between a flexible printed circuit and a display panel in the related art;
FIG. 2 is a diagram illustrating timing of a flexible printed circuit board and a display panel according to the related art;
FIG. 3 is a schematic structural diagram of a flexible printed circuit board according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a flexible printed circuit board according to another embodiment of the present invention;
FIG. 5 is a flow chart of a method for manufacturing a flexible circuit board according to an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
FIG. 7 is a schematic structural diagram of a display panel according to another embodiment of the present invention;
FIG. 8 is a flow chart of a method of fabricating a display device according to an embodiment of the invention;
FIG. 9 is a diagram illustrating a positional relationship between the flexible printed circuit and the display panel before the second region is stretched and contracted according to an embodiment of the present invention;
FIG. 10 is a diagram illustrating a positional relationship between the flexible printed circuit and the display panel after the flexible printed circuit is stretched and contracted in the second area according to an embodiment of the present invention;
fig. 11 is a schematic diagram illustrating timing of a flexible circuit board and a display panel according to an embodiment of the invention.
Description of reference numerals:
11-a first zone, 12-a second zone; 20-a first marker portion, 21-a second marker portion; 30-a first bonding region, 31-a second bonding region; 100-flexible circuit board, 200-display panel.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
In the related art, a flexible circuit board is provided with a first bonding area and two first mark portions, and the first bonding area is located between the two first mark portions. The display panel is provided with a second bonding area and two second mark parts, and the second bonding area is positioned between the two second mark parts.
Theoretically, the distance between the two second mark portions in the display panel is equal to the distance between the two first mark portions in the flexible circuit board, and the two second mark portions may be aligned with the two first mark portions. And when the two second mark parts are aligned with the two first mark parts, the second bonding areas in the display panel are aligned with the first bonding areas in the flexible circuit board. In fact, the display panel may remain unchanged before and after the second bonding area and the second mark portion are formed, and the actual distance between the two second mark portions in the display panel is consistent with the design distance. However, the flexible circuit board may deform before and after the first bonding area and the first mark portion are formed, which may cause the actual distance between the two first mark portions in the display panel to be inconsistent with the design distance. At this time, the distance between the two second mark portions in the display panel and the distance between the two first mark portions in the flexible circuit board may not be equal, and the two second mark portions and the two first mark portions may not be aligned.
When the display panel and the flexible circuit board are bonded, the midpoint positions of the central connecting lines of the two second marking parts in the display panel and the midpoint positions of the central connecting lines of the two first marking parts in the flexible circuit board are respectively determined. The midpoint of the two second marker center-line is then aligned with the midpoint of the two first marker center-line based on the midpoint position of the two second marker center-line and the midpoint position of the two first marker center-line. And finally, bonding and connecting the second bonding area in the display panel with the first bonding area in the flexible circuit board.
When the display panel comprises a second bonding area and the flexible circuit board comprises a first bonding area, the center of the second bonding area in the display panel generally coincides with the midpoint of the central connecting line of the two second mark parts, and the center of the first bonding area in the flexible circuit board generally coincides with the midpoint of the central connecting line of the two first mark parts. The middle points of the connecting lines of the centers of the two second mark parts in the display panel are aligned with the middle points of the connecting lines of the centers of the two first mark parts in the flexible circuit board, so that the second bonding area in the display panel is also aligned with the first bonding area in the flexible circuit board, and the bonding precision is high. However, when the display panel includes more than two second bonding areas and the flexible circuit board includes more than two first bonding areas, the center of at least one second bonding area in the display panel does not coincide with the midpoint of the central connecting line of the two second mark portions, and the center of at least one first bonding area in the flexible circuit board does not coincide with the midpoint of the central connecting line of the two first mark portions, so that when the midpoint of the central connecting line of the two second mark portions is aligned with the midpoint of the central connecting line of the two first mark portions, the second bonding area in the display panel is not aligned with the first bonding area in the flexible circuit board, and the bonding accuracy is low. And the more the number of the second bonding areas in the display panel and the first bonding areas in the flexible circuit board, the lower the bonding precision.
For example, referring to fig. 1, fig. 1 shows a positional relationship diagram of a flexible circuit board and a display panel in the related art, and a distance L1 between two first marker portions in the flexible circuit board 100 is greater than a distance L2 between two second marker portions in the display panel 200. Referring to fig. 2, fig. 2 is a schematic diagram illustrating bonding of a flexible circuit board and a display panel in the related art, when the flexible circuit board 100 is bonded to the display panel 200, two first mark portions of the flexible circuit board 100 are not aligned with two second mark portions of the display panel 200, and two first bonding areas of the flexible circuit board 100 are not aligned with two second bonding areas of the display panel 200.
In order to solve the above problems, the present application provides a flexible circuit board, which can preferably solve the above problems.
Before describing the present application in detail, some of the contents will be described first.
Modulus of elasticity: refers to the stress divided by the strain in that direction in the unidirectional stress state. Specifically, the elastic modulus refers to the proportional relation between the stress and strain of the material in the elastic deformation stage, and the proportionality coefficient is called the elastic modulus. The elastic modulus is embodied in three aspects, specifically:
1) young's modulus: the linear stress divided by the linear strain is equal to the young's modulus of the material. For example, applying a tensile force F to a thin rod, dividing the tensile force F by the cross-sectional area S of the rod, is referred to as "line stress", and the elongation dL of the rod at the original length L, is referred to as "line strain".
2) Shear modulus: the shear stress divided by the shear strain equals the shear modulus of the material. For example, when a lateral force (e.g., friction) is applied to a piece of elastomer, the elastomer changes from a square shape to a diamond shape, the angle of deformation is referred to as "shear strain", and the corresponding force F divided by the force-bearing area S is referred to as "shear stress".
3) Bulk modulus: the bulk stress divided by the bulk strain equals the bulk modulus. For example, an overall pressure F is applied to the elastomer, and this pressure is referred to as "volume stress", and the volume reduction dV of the elastomer divided by the original volume V is referred to as "volume strain".
Flexibility: which may be referred to as flexibility, is a property of an object in terms of relative rigidity. Flexibility is a physical property of an object that deforms when subjected to a force and the object itself cannot recover its original shape after the force is lost. And after the rigid object is stressed, the shape of the rigid object can be regarded as unchanged in a macroscopic view.
Referring to fig. 3, a flexible circuit board according to an embodiment of the present invention includes a first region 11 and a second region 12 arranged along a first direction. At least one first region 11 is located at the outermost side of the flexible circuit board, which is provided with a first marking portion 20. The second zone 12 is arranged between the two first zones 11. First bonding areas 30 are provided on each first region 11, and the modulus of elasticity of each first region 11 is greater than the modulus of elasticity of each second region 12.
In the present embodiment, two adjacent first regions 11 are connected by one second region 12, i.e., the first regions 11 and the second regions 12 are alternately arranged in the first direction. The first mark portion 20 is a structure that can be recognized in an image of the flexible circuit board, and is formed in a specific pattern using a high-reflectivity material such as aluminum. The first bonding region 30 is a structure for bonding with the display panel, such as an electrode having an ACF (Anisotropic Conductive Film) covering the surface thereof.
In practical applications, the number of the first regions 11 may be greater than the number of the second regions 12, or equal to the number of the second regions 12.
If the number of the first regions 11 is greater than the number of the second regions 12, for example, N +1 first regions 11 and N second regions 12 are provided on the flexible circuit board, where N is a positive integer, the first region 11, the first second region 12, the second first region 11, the second region 12, … …, the nth first region 11, the nth second region 12, and the N +1 th first region 11 are sequentially arranged along the first direction.
At this time, the two first areas 11 are located at the outermost side of the flexible circuit board and are respectively provided with the first mark portions 20, that is, the number of the first mark portions 20 is two. The flexible circuit board is aligned with the display panel by adjusting the distance between the two first mark parts 20.
The first bonding area 30 is located between the two first mark portions 20. When the first bonding area 30 and the first mark 20 are disposed in the same first area 11, the first bonding area 30 is located on a side of the first mark 20 close to another first mark 20 so as to be located between the two first marks 30.
If the number of the first regions 11 is equal to the number of the second regions 12, for example, N +1 first regions 11 and N +1 second regions 12 are provided on the flexible circuit board, where N is a positive integer, the first region 11, the first second region 12, the second first region 11, the second region 12, … …, the nth first region 11, the nth second region 12, the N +1 first region 11, and the N +1 second region 12 are sequentially arranged along the first direction, or the first second region 12, the first region 11, the second region 12, the second first region 11, … …, the nth second region 12, the nth first region 11, the N +1 second region 12, and the N +1 first region 11 are sequentially arranged along the first direction.
Only one first area 11 is located at the outermost side of the flexible circuit board and is provided with the first mark part 20, i.e. the number of the first mark parts 20 is one. The outermost side of the flexible circuit board where the first region 11 is located is referred to as a first side, and a second side of the flexible circuit board opposite to the first side is a second region 12. The flexible circuit board is aligned with the display panel by adjusting a distance between the first mark part 20 and the second side of the flexible circuit board.
The first bonding area 30 is located between this first marking portion 20 and the second side of the flexible circuit board. When the first bonding area 30 and the first mark portion 20 are disposed in the same first area 11, the first bonding area 30 is located on a side of the first mark portion 20 close to the second side of the flexible circuit board so as to be located between the first mark portion 30 and the second side of the flexible circuit board.
Illustratively, the flexible circuit board is a cuboid, and the first direction is an extending direction of the longest side of the cuboid, so that the flexible circuit board is conveniently stretched or compressed.
The flexible circuit board comprises the first area and the second area which are arranged along the first direction, and the elastic modulus of the first area is larger than that of the second area, so that when the flexible circuit board is stretched or compressed along the first direction, the second area can be stretched preferentially, and the first area can be kept unchanged. At least one first zone is located the flexible circuit board outside, and it is equipped with first mark portion, is equipped with first bonding area on each first zone, and first mark portion and first bonding area can not receive the influence when flexible circuit board is tensile along first direction or compression to the mark distance between one first mark portion and the flexible circuit board outside or between two first mark portions can be along with the flexible and corresponding change in the flexible of second district. If the marking distance in the flexible circuit board is not equal to the marking distance in the display panel, the flexible circuit board may be stretched or compressed in the first direction until the marking distance in the flexible circuit board is equal to the marking distance in the display panel. At the moment, the dislocation between the first bonding area in the flexible circuit board and the second bonding area in the display panel is improved, the alignment effect is better, and the bonding precision of the flexible circuit board and the display panel is improved.
Specifically, the flexibility of the first region 11 is smaller than that of the second region 12.
The size of the flexibility can influence the deformation degree of the object after being stressed, so that the flexibility of different areas of the flexible circuit board can be determined by the size of the flexibility. The same force is applied, the degree of deformation of the object having small flexibility is smaller than that of the object having large flexibility, and the stretchability is inferior to that of the object having large flexibility. Therefore, the flexibility of the first region 11 is small, the scalability is poor, and the elastic modulus obtained by dividing the stress in the unidirectional stress state by the strain in the direction is large; the second region 12 has a larger flexibility and a better scalability, and the elastic modulus obtained by dividing the stress in the unidirectional stress state by the strain in the direction is smaller. By the flexibility of the first region 11 being smaller than the flexibility of the second region 12, it is achieved that the elastic modulus of the first region 11 is larger than the elastic modulus of the second region 12.
In some embodiments, the material of the first region 11 is the same as the material of the second region 12; the thickness of the first region 11 is greater than the thickness of the second region 12.
The first region 11 and the second region 12 are made of the same material and have different thicknesses, so that the flexibility of the first region 11 and the flexibility of the second region 12 are different, the flexibility of the first region 11 with a larger thickness is smaller, the flexibility of the second region 12 with a smaller thickness is larger, and the flexibility of the first region 11 is smaller than that of the second region 12, that is, the elastic modulus of the first region 11 is larger than that of the second region 12.
Illustratively, the thickness of the first region 11 is 8 to 12 times, such as 10 times, the thickness of the second region 12.
The thickness difference between the first region 11 and the second region 12 is large, so that the flexibility difference between the first region 11 and the second region 12 is large, which is beneficial to concentrating the force on the second region 12 in the process of stretching or compressing the flexible circuit board, only the second region 12 stretches or compresses, and the first region 11 is kept unchanged.
In particular, the thickness of the first zone 11 is between 0.8mm and 1.2mm, such as 1 mm; the thickness of the second region 12 is in the range 0.08mm to 0.12mm, such as 0.1 mm.
The thickness of the first area 11 is 0.8 mm-1.2 mm, and the corresponding flexibility enables the first area 11 to be kept unchanged in the process of stretching or compressing the flexible circuit board; the second region 12 has a thickness of 0.08mm to 0.12mm and a corresponding flexibility that allows the second region 12 to be stretched or compressed.
In other embodiments, the material of the first region 11 is different from the material of the second region 12.
The first region 11 and the second region 12 are made of different materials, and the flexibility of the first region 11 is smaller than that of the second region 12 by directly utilizing the difference of the flexibility of the materials, that is, the elastic modulus of the first region 11 is larger than that of the second region 12.
Specifically, the material of the first region 11 is PI, and the material of the second region 12 is colloid.
The second region 12 is made of a gel material, can be adhered to the first region 11, and has a large flexibility, and can be stretched or compressed. The first region 11 is made of PI, has a flexibility much smaller than that of the gel, and can be kept unchanged during the stretching or compressing process of the substrate 10.
Illustratively, the colloid is any one of optically transparent resin, transparent silicone, ACF, OCA (optically clear adhesive), TPU (Thermoplastic polyurethane elastomer rubber).
Referring to fig. 4, in some embodiments, the flexible circuit board includes at least two second regions 12; the respective second regions 12 have the same width L in the first direction.
The widths L of the second regions 12 in the first direction are equal, and the stretching or compressing amplitude Δ L of the second regions 12 can be kept consistent in the stretching or compressing process of the flexible circuit board, so that the width of the flexible circuit board in the first direction can be uniformly adjusted.
Illustratively, the widths of the respective first regions 11 in the first direction are the same.
The widths of the first regions 11 and the second regions 12 in the first direction are equal, and the widths of the substrate 10 in the first direction can be uniformly adjusted, which is beneficial for aligning the bonding regions 30 disposed at different positions on the first regions 11 with the bonding region of the display panel.
In particular, the width of the second region 12 in the first direction is between 0.2mm and 1.2mm, such as 0.5mm or 1 mm.
The width of the second area 12 in the first direction is 0.2 mm-1.2 mm, the stretching or compressing range can make up for the distance deviation between the two marking parts of the flexible circuit board and the distance between the two marking parts of the display panel, meanwhile, the width of the second area 12 in the first direction is small, the flexible circuit board is mainly the first area 11 as a whole, and the stretching or compressing has no influence on the flexible circuit board basically.
Specifically, the flexible circuit board has a width in the first direction of 45mm to 55mm, such as 50 mm.
As shown in FIGS. 3 and 4, in some embodiments, the flexible circuit board includes at least two first bonding areas 30, with each first bonding area 30 arranged along a first direction.
Each first bonding area 30 is arranged along the first direction, which is advantageous for aligning each first bonding area 30 with the second bonding area of the display panel by stretching or compressing the flexible circuit board along the first direction.
As shown in fig. 3 and 4, in some embodiments, the flexible circuit board is provided with two first mark parts 20, and a central line of the two first mark parts 20 passes through the first bonding region 30.
The central line of the two first mark portions 20 passes through the first bonding area 30, so that when the distance between the two first mark portions 20 is adjusted to be equal to the distance between the two second mark portions of the display panel, the distance between the first bonding areas 30 can be ensured to be adjusted accordingly, which is beneficial to aligning the first bonding areas 30 with the second bonding areas of the display panel.
As shown in fig. 3 and 4, in some embodiments, the center line of the two first marker portions 20 is parallel to the first direction; the line connecting the centers of the two first mark portions 20 is collinear with the axis of symmetry of the first bonding area 30 in the first direction.
The central connecting lines of the two first mark portions 20 are parallel to the first direction, and the central connecting lines of the two first mark portions 20 and the first bonding areas 30 are collinear along the symmetry axis of the first direction, so that when the flexible circuit board is stretched or compressed along the first direction, the distance between the two first mark portions 20 and the distribution positions of the first bonding areas 30 on the base material 10 can be effectively adjusted, and alignment of the first bonding areas 30 and the second bonding areas of the display panel is facilitated.
Based on the same inventive concept, the application also provides a manufacturing method of the flexible circuit board, so as to manufacture the flexible circuit board described in any of the above embodiments.
Referring to fig. 5, an embodiment of the present invention provides a method for manufacturing a flexible printed circuit board, including the following steps:
step S502, providing a first region and a second region arranged along a first direction, the second region being disposed between the two first regions.
Step S504, the thickness of the second area is reduced, and the elastic modulus of the first area is larger than that of the second area.
In some embodiments, this step S504 includes: and forming a protective layer on the first region by utilizing a photoetching technology, and carrying out wet etching on the second region without the protective layer so as to reduce the thickness of the second region.
In other embodiments, the step S504 includes: an abrasive member is applied to the second region to reduce the thickness of the second region.
Step S506 is to form a first mark portion on the first region located at the outermost side of the flexible circuit board.
Step S508, forming a first bonding area on each first area to obtain the flexible circuit board.
Based on the same inventive concept, the application also provides a display panel.
Referring to fig. 6, the display panel according to the embodiment of the present invention includes a second bonding area 31 bonded to a first bonding area of a flexible circuit board. Along the first direction, second mark portions 21 aligned with the first mark portion of the flexible circuit board are disposed at two sides of the second bonding region 31. The flexible circuit board is provided in any one of the above embodiments.
Illustratively, the display panel is a rectangular parallelepiped, and the extending direction of the longest side of the display panel is the same as the extending direction of the longest side of the flexible circuit board.
As shown in fig. 6 and 7, in some embodiments, the display panel includes at least two second bonding areas 31, and each second bonding area 31 is arranged in the first direction.
Each second bonding area 31 is arranged along the first direction, which facilitates alignment of each first bonding area 30 with second bonding area 31 by stretching or compressing the flexible circuit board along the first direction.
In practical applications, the first bonding areas 30 in the flexible circuit board correspond to the second bonding areas 31 in the display panel one to one, and thus the number of the second bonding areas 31 in the display panel is the same as the number of the first bonding areas 30 in the flexible circuit board. For example, when the flexible circuit board includes two first bonding areas 30, as shown in fig. 6, the display panel includes two second bonding areas 31. For another example, when the flexible circuit board includes three first bonding areas 30, as shown in fig. 7, the display panel includes three second bonding areas 31.
The first mark portions 20 in the flexible circuit board correspond to the second mark portions 21 in the display panel one to one, and thus the number of the second mark portions 21 in the display panel coincides with the number of the first mark portions 20 in the flexible circuit board.
As shown in fig. 6 and 7, in some embodiments, the display panel is provided with two second mark portions 21, and a central connecting line of the two second mark portions 21 passes through the second bonding region 31.
The line connecting the centers of the two second mark portions 21 passes through the second bonding region 31, so that the distance between the two first mark portions 20 is adjusted to be equal to the distance between the two second mark portions 21, thereby facilitating the alignment of each first bonding region 30 with the second bonding region 31.
As shown in fig. 6 and 7, in some embodiments, the central line of the two second mark portions 21 is parallel to the first direction; the line connecting the centers of the two second mark portions 21 is collinear with the axis of symmetry of the second bonding area 31 in the first direction.
The central connecting line of the two second mark portions 21 is parallel to the first direction; the line connecting the centers of the two second mark portions 21 and the symmetry axis of the second bonding region 31 in the first direction are collinear, so that the alignment of each first bonding region 30 and second bonding region 31 is facilitated when the distance between the two first mark portions 20 is adjusted to be equal to the distance between the two second mark portions 21.
Based on the same inventive concept, the application also provides a display device.
The display device provided by the embodiment of the invention comprises the display panel and the flexible circuit board. The center of the second mark part of the display panel is aligned with the center of the first mark part of the flexible circuit board, and the second bonding area of the display panel is bonded and connected with the first bonding area of the flexible circuit board.
Based on the same inventive concept, the application also provides a manufacturing method of the display device, so as to manufacture the display device of any one of the above embodiments.
Referring to fig. 8, a method for manufacturing a display device according to an embodiment of the present invention includes the following steps:
step S802, providing a display panel and a flexible circuit board.
The display panel is the flexible circuit board provided by any one of the above embodiments.
Specifically, the flexible circuit board can be manufactured by using the manufacturing method of the flexible circuit board provided in any embodiment.
Step S804, determining a distance between two first mark portions on the flexible circuit board and a distance between two second mark portions on the display panel.
Specifically, the step S804 includes: acquiring a flexible circuit board image and a display panel image; determining the positions of two first mark parts in the flexible circuit board image and the positions of two second mark parts in the display panel image by adopting an image recognition technology; determining a distance between the two first mark parts based on the positions of the two first mark parts in the flexible circuit board image; the distance between the two second marker portions is determined based on the positions of the two second marker portions in the display panel image.
And step 806, controlling the second area on the flexible circuit board to stretch and contract until the distance between the two first mark parts is equal to the distance between the two second mark parts.
Specifically, the step S806 includes: fixing at least two adsorption pieces on the flexible circuit board; and adjusting the distance between the at least two adsorption pieces to enable the second area to stretch and retract until the distance between the two first mark parts is equal to the distance between the two second mark parts.
Illustratively, a servo motor is in transmission connection with the adsorption member, and the distance between at least two adsorption members can be adjusted by driving the servo motor to rotate.
In practical application, in the process of controlling the second area to stretch, the flexible circuit board image is continuously acquired, and the distance between the two first mark parts is determined based on the flexible circuit board image. If the distance between the two first marking portions and the distance between the two second marking portions deviate within an allowable tolerance range, the distance between the two first marking portions is determined to be equal to the distance between the two second marking portions.
Referring to fig. 9, fig. 9 is a diagram illustrating a positional relationship between the flexible circuit board and the display panel before the second region is stretched, and a distance L1 between two first mark portions of the flexible circuit board 100 is greater than a distance L2 between two second mark portions of the display panel 200 before the second region is stretched.
Referring to fig. 10, fig. 10 is a diagram illustrating a position relationship between the flexible circuit board and the display panel after the second region is stretched and contracted, wherein after the second region is stretched and contracted by Δ L, the width of the second region in the first direction is changed from L to L + ± Δ L, and the distance between the two first mark portions of the flexible circuit board 100 is changed from L1 to L1 + ± Δ L, which is equal to the distance L2 between the two second mark portions of the display panel 200.
Step S808, when the midpoint of the center line of the two first mark portions is aligned with the midpoint of the center line of the two second mark portions, bonding the first bonding area on the flexible circuit board and the second bonding area on the display panel.
Specifically, the step S808 includes: when the middle point of the center connecting line of the two first mark parts is aligned with the middle point of the center connecting line of the two second mark parts, the flexible circuit board is pressed on the display panel by utilizing the at least two adsorption parts, so that the first bonding area and the second bonding area are bonded and connected.
In practical application, the surfaces of the first bonding area and the second bonding area are both provided with ACF, when the flexible circuit board is pressed on the display panel, the ACF on the first bonding area and the ACF on the second bonding area are mixed together, and the first bonding area and the second bonding area are bonded and connected.
Referring to fig. 11, fig. 11 is a schematic diagram illustrating bonding timing of the flexible circuit board and the display panel according to an embodiment of the invention, where two first mark portions of the flexible circuit board 100 are aligned with two second mark portions of the display panel 200, and two first bonding areas of the flexible circuit board 100 are also aligned with two second bonding areas of the display panel 200.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A flexible circuit board characterized by comprising a first region (11) and a second region (12) arranged in a first direction;
at least one first area (11) is positioned at the outermost side of the flexible circuit board and is provided with a first marking part (20); the second zone (12) being arranged between the two first zones (11);
a first bonding area (30) is arranged on each first area (11), and the elastic modulus of each first area (11) is larger than that of each second area (12).
2. The flexible circuit board according to claim 1, wherein the flexibility of the first region (11) is smaller than the flexibility of the second region (12).
3. The flexible circuit board according to claim 2, characterized in that the material of the first region (11) is the same as the material of the second region (12);
the thickness of the first region (11) is greater than the thickness of the second region (12);
preferably, the thickness of the first region (11) is 8 to 12 times the thickness of the second region (12).
4. A flexible circuit board according to any one of claims 1 to 3, characterized in that it comprises at least two of said second regions (12);
the width of each of the second regions (12) in the first direction is equal.
5. The flexible circuit board according to any one of claims 1 to 4, wherein the flexible circuit board is provided with two first mark portions (20), and a central connecting line of the two first mark portions (20) passes through the first bonding area (30);
preferably, a center line of the two first mark portions (20) is parallel to the first direction; the center line of the two first mark portions (20) is collinear with the symmetry axis of the first bonding region (30) in the first direction.
6. A display panel comprising a second bonding area (31) bonded to a first bonding area (30) of a flexible circuit board, characterized in that the flexible circuit board is a flexible circuit board according to any one of claims 1 to 5;
and second marking parts (21) which are aligned with the first marking parts (20) of the flexible circuit board are arranged on two sides of the second bonding area (31) along the first direction.
7. The display panel according to claim 6, wherein the display panel is provided with two second mark portions (21), and a central connecting line of the two second mark portions (21) passes through the second bonding region (31);
preferably, a center line of the two second mark portions (21) is parallel to the first direction; the central connecting line of the two second mark parts (21) is collinear with the symmetry axis of the second bonding area (31) along the first direction.
8. A display device characterized by comprising the flexible circuit board of any one of claims 1 to 5 and the display panel of claim 6 or 7;
the center of the second mark part of the display panel is aligned with the center of the first mark part of the flexible circuit board, and the second bonding area of the display panel is bonded and connected with the first bonding area of the flexible circuit board.
9. A method of manufacturing a display device, the method comprising:
providing the flexible circuit board of any one of claims 1 to 5 and the display panel of claim 6 or 7;
determining the distance between two first mark parts on the flexible circuit board and the distance between two second mark parts on the display panel;
controlling the second area on the flexible circuit board to stretch until the distance between the two first mark parts is equal to the distance between the two second mark parts;
and when the midpoint of the central connecting line of the two first mark parts is aligned with the midpoint of the central connecting line of the two second mark parts, bonding and connecting the first bonding area on the flexible circuit board and the second bonding area on the display panel.
10. A method of manufacturing a flexible circuit board, comprising:
providing a first zone and a second zone arranged along a first direction, the second zone being disposed between the two first zones;
thinning the thickness of the second region to make the elastic modulus of the first region larger than that of the second region;
forming a first mark part on the first region located at the outermost side of the flexible circuit board;
and forming a first bonding area on each first area to obtain the flexible circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111330312.5A CN113939078A (en) | 2021-11-11 | 2021-11-11 | Flexible circuit board, display panel, display device and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111330312.5A CN113939078A (en) | 2021-11-11 | 2021-11-11 | Flexible circuit board, display panel, display device and manufacturing method thereof |
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| CN113939078A true CN113939078A (en) | 2022-01-14 |
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