TWI807533B - Flexible circuit board - Google Patents

Flexible circuit board Download PDF

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TWI807533B
TWI807533B TW110146687A TW110146687A TWI807533B TW I807533 B TWI807533 B TW I807533B TW 110146687 A TW110146687 A TW 110146687A TW 110146687 A TW110146687 A TW 110146687A TW I807533 B TWI807533 B TW I807533B
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Taiwan
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alignment pattern
axis
metal layer
patterned metal
flexible circuit
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TW110146687A
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Chinese (zh)
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TW202325105A (en
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沈弘哲
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南茂科技股份有限公司
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Priority to TW110146687A priority Critical patent/TWI807533B/en
Priority to CN202210207438.1A priority patent/CN116264216A/en
Publication of TW202325105A publication Critical patent/TW202325105A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)

Abstract

A flexible circuit board includes a flexible substrate, a first patterned metal layer and a second patterned metal layer. The flexible substrate has a first surface, a second surface, two conveying regions, and a package region. The package region has a chip bonding region, a covering region, and an external region. The first patterned metal layer is disposed on the first surface of the flexible substrate, and includes a plurality of first leads and a first alignment pattern. The first leads are located in the package region and extends from the chip bonding region through the covering region to the external region. The second patterned metal layer is disposed on the second surface of the flexible substrate and includes a plurality of second leads and a second alignment pattern. The second leads are located in the package region. An orthographic projection of the second alignment pattern on the first surface is spaced at a distance with respect to the first alignment pattern without overlapping the first alignment pattern.

Description

可撓性線路載板Flexible circuit carrier

本發明是有關於一種載板，且特別是有關於一種可撓性線路載板。The present invention relates to a carrier board, and in particular to a flexible circuit carrier board.

薄膜覆晶（Chip on Film, COF）封裝結構為常見的液晶顯示器的驅動晶片的封裝型態。隨著晶片上的凸塊數的增加、引腳數的增加與引腳間距的微縮，凸塊與引腳的佈局方式日益受限。因此，為了增加引腳佈局空間，雙面銅箔可撓性基板開始受到青睞。由於薄膜廠蝕刻能力的差異，雙面銅箔可撓性基板的上層線路圖案與下層線路圖案可能產生位置偏移（shift），進而導致下層線路圖案針對內引腳接合（inner lead bonding, ILB）而讓位形成的線路開窗位置發生偏移或因線路圖案偏移而導致內引腳接合時底部支撐不均等問題產生。Chip on Film (COF) packaging structure is a common packaging type of driving chips of liquid crystal displays. With the increase in the number of bumps on the chip, the increase in the number of pins and the shrinking of the pin pitch, the layout of bumps and pins is increasingly limited. Therefore, in order to increase the pin layout space, double-sided copper foil flexible substrates are beginning to be favored. Due to the difference in the etching capability of the thin film factory, the upper layer circuit pattern and the lower layer circuit pattern of the double-sided copper foil flexible substrate may have a position shift (shift), which will lead to a shift in the position of the circuit opening formed by the lower layer circuit pattern for inner lead bonding (inner lead bonding, ILB) or uneven bottom support during inner lead bonding due to the shift of the circuit pattern.

本發明提供一種可撓性線路載板，可容易判斷第一圖案化金屬層與第二圖案化金屬層是否產生超出容許公差的偏移及其相對偏移的方向，可及早檢驗出不良品，以避免後續無謂製程。The present invention provides a flexible circuit carrier, which can easily determine whether the first patterned metal layer and the second patterned metal layer deviate beyond the allowable tolerance and the direction of the relative deviation, and can detect defective products early to avoid unnecessary follow-up processes.

本發明的一種可撓性線路載板，其包括一可撓性基板、一第一圖案化金屬層以及一第二圖案化金屬層。可撓性基板具有彼此相對的一第一表面與一第二表面、位於可撓性基板相對兩側且平行一Y軸延伸的二傳動區以及位於二傳動區之間的一封裝區。封裝區內具有一晶片接合區、環繞晶片接合區的一覆蓋區以及位於覆蓋區外側的一外接區。第一圖案化金屬層設置於可撓性基板的第一表面上，且第一圖案化金屬層包括多個第一引腳及一第一對位圖案。第一引腳位於封裝區內並自晶片接合區內延伸經過覆蓋區至外接區。第二圖案化金屬層設置於可撓性基板的第二表面上，且第二圖案化金屬層包括多個第二引腳及一第二對位圖案。第二引腳位於封裝區內，其中第二對位圖案於第一表面上的正投影與第一對位圖案之間間隔一距離而不重疊第一對位圖案。A flexible circuit carrier of the present invention comprises a flexible substrate, a first patterned metal layer and a second patterned metal layer. The flexible substrate has a first surface and a second surface opposite to each other, two transmission areas located on opposite sides of the flexible substrate and extending parallel to a Y axis, and a packaging area located between the two transmission areas. The packaging area has a chip bonding area, a covering area surrounding the chip bonding area, and an external connection area outside the covering area. The first patterned metal layer is disposed on the first surface of the flexible substrate, and the first patterned metal layer includes a plurality of first pins and a first alignment pattern. The first lead is located in the packaging area and extends from the chip bonding area through the covering area to the external connection area. The second patterned metal layer is disposed on the second surface of the flexible substrate, and the second patterned metal layer includes a plurality of second pins and a second alignment pattern. The second lead is located in the packaging area, wherein the orthographic projection of the second alignment pattern on the first surface is separated from the first alignment pattern by a distance without overlapping the first alignment pattern.

基於上述，在本發明的可撓性線路載板的設計中，第二圖案化金屬層的第二對位圖案於可撓性基板的第一表面上的正投影與第一圖案化金屬層的第一對位圖案間隔一距離而不重疊於第一對位圖案。藉此，可用來做為位於可撓性基板的第一表面上的第一圖案化金屬層與位於可撓性基板的第二表面上的第二圖案化金屬層的對位標記，提供機台或作業人員直接視覺判斷第一圖案化金屬層與第二圖案化金屬層是否產生超出容許公差的偏移及其相對偏移的方向，可及早檢驗出不良品，以避免後續無謂製程。Based on the above, in the design of the flexible circuit carrier of the present invention, the orthographic projection of the second alignment pattern of the second patterned metal layer on the first surface of the flexible substrate is separated from the first alignment pattern of the first patterned metal layer by a distance and does not overlap the first alignment pattern. In this way, it can be used as an alignment mark between the first patterned metal layer on the first surface of the flexible substrate and the second patterned metal layer on the second surface of the flexible substrate, providing machines or operators with a direct visual judgment of whether the first patterned metal layer and the second patterned metal layer have shifted beyond the allowable tolerance and the direction of the relative shift, and defective products can be detected early to avoid unnecessary follow-up processes.

為了讓本發明的上述特徵及優點能夠更明顯易懂，下文特舉實施例，並配合所附圖式詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings.

參照本實施例之圖式以更全面地闡述本發明。然而，本發明亦可以各種不同的形式體現，而不應限於本文中所述之實施例。相同或相似之標號表示相同或相似之元件，以下段落將不再一一贅述。圖式中提供直角座標X-Y以利於構件描述。The present invention will be described more fully with reference to the drawings of this embodiment. However, the present invention can also be embodied in various forms and should not be limited to the embodiments described herein. The same or similar symbols indicate the same or similar elements, and the following paragraphs will not repeat them one by one. Cartesian coordinates X-Y are provided in the drawings to facilitate component description.

圖1為根據本發明的一實施例的可撓性線路載板的俯視示意圖。圖2為沿圖1的線A-A的剖面示意圖。請同時參閱圖1及圖2，本實施例的可撓性線路載板100包括可撓性基板110、第一圖案化金屬層120以及第二圖案化金屬層130。可撓性基板110具有彼此相對的第一表面111與第二表面112、位於可撓性基板110相對兩側且平行一Y軸延伸的二傳動區113以及位於二傳動區113之間的封裝區114。封裝區114內具有晶片接合區115、環繞晶片接合區115的覆蓋區116以及位於覆蓋區116外側的外接區117。第一圖案化金屬層120設置於可撓性基板110的第一表面111上，且第一圖案化金屬層120包括多個第一引腳122及第一對位圖案124。第一引腳122位於封裝區114內並自晶片接合區115內延伸經過覆蓋區116至外接區117。第二圖案化金屬層130設置於可撓性基板110的第二表面112上，且第二圖案化金屬層130包括多個第二引腳132及第二對位圖案134。第二引腳132位於封裝區114內，特別是，第二對位圖案134於第一表面111上的正投影與第一對位圖案124之間間隔一距離D而不重疊第一對位圖案124。更詳細而言，可撓性線路載板100可更包括一第一防銲層140a設置於可撓性基板110的第一表面111上，第一防銲層140a位於覆蓋區116並暴露出晶片接合區115與外接區117，且局部覆蓋第一引腳122，以防止第一引腳122受損斷裂或因異物而橋接短路。可撓性線路載板100可更包括一第二防銲層140b設置於可撓性基板110的第二表面112上，第二防銲層140b可位於晶片接合區115與覆蓋區116並暴露出外接區117，且局部覆蓋第二引腳132，以防止第二引腳132受損斷裂或因異物而橋接短路。FIG. 1 is a schematic top view of a flexible circuit carrier according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view along line A-A of FIG. 1 . Please refer to FIG. 1 and FIG. 2 at the same time. The flexible circuit carrier 100 of this embodiment includes a flexible substrate 110 , a first patterned metal layer 120 and a second patterned metal layer 130 . The flexible substrate 110 has a first surface 111 and a second surface 112 opposite to each other, two transmission areas 113 located on opposite sides of the flexible substrate 110 and extending parallel to a Y axis, and a packaging area 114 located between the two transmission areas 113 . The packaging area 114 has a die bonding area 115 , a footprint 116 surrounding the die bonding area 115 , and a peripheral area 117 outside the footprint 116 . The first patterned metal layer 120 is disposed on the first surface 111 of the flexible substrate 110 , and the first patterned metal layer 120 includes a plurality of first pins 122 and a first alignment pattern 124 . The first lead 122 is located in the packaging area 114 and extends from the die bonding area 115 through the footprint 116 to the external connection area 117 . The second patterned metal layer 130 is disposed on the second surface 112 of the flexible substrate 110 , and the second patterned metal layer 130 includes a plurality of second pins 132 and a second alignment pattern 134 . The second pins 132 are located in the packaging area 114 . In particular, there is a distance D between the orthographic projection of the second alignment pattern 134 on the first surface 111 and the first alignment pattern 124 without overlapping the first alignment pattern 124 . In more detail, the flexible circuit carrier 100 may further include a first solder resist layer 140a disposed on the first surface 111 of the flexible substrate 110. The first solder resist layer 140a is located in the coverage area 116 and exposes the chip bonding area 115 and the external connection area 117, and partially covers the first pins 122, so as to prevent the first pins 122 from being damaged or broken or bridging short circuit due to foreign objects. The flexible circuit carrier 100 may further include a second solder resist layer 140b disposed on the second surface 112 of the flexible substrate 110. The second solder resist layer 140b may be located at the chip bonding area 115 and the covering area 116 and expose the external connection area 117, and partially cover the second pins 132, so as to prevent the second pins 132 from being damaged or broken or bridging short circuit due to foreign objects.

此處，可撓性線路載板100具體化為雙面線路基板。為了方便說明起見，於圖1中，第一表面111上的第一圖案化金屬層120以實線表示，而第二表面112上的第二圖案化金屬層130對第一表面111的正投影則以虛線表示。再者，為清楚顯示，本實施例的第一引腳122於可撓性基板110上的正投影不重疊於第二引腳132於可撓性基板110上的正投影，但本發明不以此為限。於其他實施例中，第一引腳122於可撓性基板110上的正投影亦可部分重疊於第二引腳132於可撓性基板110上的正投影，藉此使可撓性基板110的第一表面111與第二表面112應力較為平均，此仍屬於本發明所欲保護的範圍。Here, the flexible circuit carrier 100 is embodied as a double-sided circuit substrate. For convenience of illustration, in FIG. 1 , the first patterned metal layer 120 on the first surface 111 is represented by a solid line, and the orthographic projection of the second patterned metal layer 130 on the second surface 112 on the first surface 111 is represented by a dotted line. Furthermore, for clarity, the orthographic projection of the first pins 122 on the flexible substrate 110 in this embodiment does not overlap the orthographic projection of the second pins 132 on the flexible substrate 110 , but the invention is not limited thereto. In other embodiments, the orthographic projection of the first pins 122 on the flexible substrate 110 may partially overlap the orthographic projection of the second pins 132 on the flexible substrate 110, so as to make the stress on the first surface 111 and the second surface 112 of the flexible substrate 110 more even, which still belongs to the protection scope of the present invention.

請再同時參考圖1與圖2，在平行於Y軸與平行於垂直Y軸的一X軸的至少其中一者的方向上，第二對位圖案134於第一表面111上的正投影與第一對位圖案124其中的一者位於其中的另一者之間且分別間隔距離D。進一步而言，第一對位圖案124與第二對位圖案134其中的一者包括至少二圖案，而第一對位圖案124與第二對位圖案134其中的另一者包括一圖案。詳細來說，在本實施例中，位於第一表面111上的第一對位圖案124包括四個圖案125，而位於第二表面112的第二對位圖案134為一個圖案。第二對位圖案134於第一表面111上的正投影位於四個圖案125之間且分別與四個圖案125間隔距離D，使得第二對位圖案134於第一表面111上的正投影不重疊四個圖案125。此處，距離D等於引腳位置公差，詳細而言，引腳位置公差即為實際形成於可撓性基板上的引腳位置與設計圖面上的引腳位置的容許偏移量，其中公差值例如為正負8微米至20微米(±8~20μm)，較佳的為正負12微米(±12μm)。如圖1所示，第一對位圖案124的四個圖案125在平行於X軸與平行於Y軸的方向上分別位於第二對位圖案134於第一表面111上的正投影的相對兩側，其中四個圖案125的形狀分別為矩形，而第二對位圖案134的形狀為圓形，但本發明不以此為限。Please refer to FIG. 1 and FIG. 2 at the same time, in the direction of at least one of the direction parallel to the Y axis and an X axis parallel to the Y axis, the orthographic projection of the second alignment pattern 134 on the first surface 111 and the first alignment pattern 124 are located between one of them and the other, and are separated by a distance D. Further, one of the first alignment pattern 124 and the second alignment pattern 134 includes at least two patterns, and the other of the first alignment pattern 124 and the second alignment pattern 134 includes one pattern. In detail, in this embodiment, the first alignment pattern 124 on the first surface 111 includes four patterns 125 , and the second alignment pattern 134 on the second surface 112 is one pattern. The orthographic projection of the second alignment pattern 134 on the first surface 111 is located between the four patterns 125 and separated from the four patterns 125 by a distance D, so that the orthographic projection of the second alignment pattern 134 on the first surface 111 does not overlap the four patterns 125 . Here, the distance D is equal to the tolerance of the pin position. Specifically, the tolerance of the pin position is the allowable offset between the pin position actually formed on the flexible substrate and the pin position on the design drawing, wherein the tolerance value is, for example, plus or minus 8 microns to 20 microns (±8~20 μm), preferably plus or minus 12 microns (±12 μm). As shown in FIG. 1 , the four patterns 125 of the first alignment pattern 124 are respectively located on opposite sides of the orthographic projection of the second alignment pattern 134 on the first surface 111 in directions parallel to the X-axis and the Y-axis. The shapes of the four patterns 125 are respectively rectangular, and the shape of the second alignment pattern 134 is circular, but the present invention is not limited thereto.

以第一對位圖案124與第二對位圖案134為一個對位單元，如圖1所示，對位單元可選擇性地設置於晶片接合區115旁(例如：對位單元U1、U2)、於二傳動區113其中之一內(例如：對位單元U3)及/或於外接區117(例如：對位單元U4、U5)。應當理解的是，本實施例僅作為一種範例而非限制。對位單元的設置位置與數量可視需求自行調整與增減，於此並不加以限制。此外，第一對位圖案124與第二對位圖案134也根據對位單元所設置的位置可為第一防銲層140a與第二防銲層140b所覆蓋或暴露出。Taking the first alignment pattern 124 and the second alignment pattern 134 as an alignment unit, as shown in FIG. 1 , the alignment unit can be selectively arranged beside the wafer bonding area 115 (for example: alignment units U1, U2), in one of the two transmission areas 113 (for example: alignment unit U3) and/or in the external connection area 117 (for example: alignment units U4, U5). It should be understood that this embodiment is only used as an example rather than limitation. The position and quantity of the alignment units can be adjusted and increased or decreased according to the needs, and are not limited here. In addition, the first alignment pattern 124 and the second alignment pattern 134 can also be covered or exposed by the first solder resist layer 140a and the second solder resist layer 140b according to the position of the alignment unit.

簡言之，當第二對位圖案134於第一表面111上的正投影不重疊於第一對位圖案124時，即可得知位於第一表面111上的第一圖案化金屬層120與位於第二表面112上的第二圖案化金屬層130的相對位置未產生超出容許公差的偏移量。換句話說，當第二對位圖案134於第一表面111上的正投影與第一對位圖案124重疊時，即可得知第一圖案化金屬層120與第二圖案化金屬層130的相對位置已產生超出容許公差的偏移量，且可透過第一對位圖案124與第二對位圖案134之間的相對位置而容易得知相對偏移的方向。簡言之，第一對位圖案124以及第二對位圖案134可用來做為第一圖案化金屬層120與第二圖案化金屬層130的對位標記，提供機台或作業人員直接視覺判斷第一圖案化金屬層120與第二圖案化金屬層130是否產生超出容許公差的偏移及其相對偏移的方向，可及早檢驗出不良品，以避免後續無謂製程。In short, when the orthographic projection of the second alignment pattern 134 on the first surface 111 does not overlap the first alignment pattern 124, it can be known that the relative position of the first patterned metal layer 120 on the first surface 111 and the second patterned metal layer 130 on the second surface 112 does not produce an offset beyond the allowable tolerance. In other words, when the orthographic projection of the second alignment pattern 134 on the first surface 111 overlaps with the first alignment pattern 124 , it can be known that the relative position of the first patterned metal layer 120 and the second patterned metal layer 130 has produced an offset beyond the allowable tolerance, and the direction of the relative offset can be easily known through the relative position between the first alignment pattern 124 and the second alignment pattern 134 . In short, the first alignment pattern 124 and the second alignment pattern 134 can be used as alignment marks for the first patterned metal layer 120 and the second patterned metal layer 130, providing machines or operators with a direct visual judgment of whether the first patterned metal layer 120 and the second patterned metal layer 130 have shifted beyond the allowable tolerance and the direction of the relative shift, and defective products can be detected early to avoid subsequent unnecessary processes.

在此必須說明的是，以下實施例沿用上述實施例的元件標號與部分內容，其中採用相同或近似的標號來表示相同或近似的元件，並且省略了相同技術內容的說明，關於省略部分的說明可參考前述實施例，下述實施例不再重複贅述。It must be noted here that the following embodiments continue to use the component numbers and part of the content of the above-mentioned embodiments, wherein the same or similar numbers are used to indicate the same or similar components, and the description of the same technical content is omitted. For the description of the omitted parts, refer to the previous embodiments, and the following embodiments will not be repeated.

圖3A為根據本發明的一實施例的第一對位圖案及第二對位圖案相對位置的示意圖。請同時參考圖1及圖3A，本實施例的第一對位圖案124a及第二對位圖案134a類似於上述實施例的第一對位圖案124及第二對位圖案134，兩者的差異在於：在本實施例中，第二對位圖案134a包括二個圖案135a，而第一對位圖案124a包括一個圖案，其中二個圖案135a分別為直角三角形，而第一對位圖案124a為矩形。在平行於Y軸的方向上，第一對位圖案124a位於第二對位圖案134a的二個圖案135a於第一表面111上的正投影之間且分別與二個圖案135a間隔距離D，且第二對位圖案134a的二個圖案135a於第一表面111上的正投影平行於Y軸的一邊緣136a與第一對位圖案124a平行於Y軸的一邊緣126a位於一直線R1上。值得一提的是，本實施例的可撓性線路載板可能因為圖案化金屬層的佈線空間限制或者針對平行於Y軸方向上的引腳偏移精準度的特別要求，而僅在平行於Y軸的方向上設置相互干涉的第一對位圖案124a與第二對位圖案134a，藉由第二對位圖案134a的二個圖案135a在平行於Y軸的方向上分別與第一對位圖案124a間隔距離D的配置，即可得知第一圖案化金屬層120與第二圖案化金屬層130在平行於Y軸的方向上的相對位置是否產生超出容許公差的偏移量。此外，透過第二對位圖案134a的二個圖案135a的邊緣136a與第一對位圖案124a的邊緣126a位於同一直線R1上的設計，也可概略判斷第一圖案化金屬層120與第二圖案化金屬層130在平行於X軸的方向上是否產生位置偏移。也就是說，當第二對位圖案134a的二個圖案135a的邊緣136a與第一對位圖案124a的邊緣126a不位於同一直線R1上時，即可得知第一圖案化金屬層120與第二圖案化金屬層130在平行於X軸的方向上已產生位置偏移。3A is a schematic diagram of relative positions of a first alignment pattern and a second alignment pattern according to an embodiment of the present invention. 1 and 3A, the first alignment pattern 124a and the second alignment pattern 134a of this embodiment are similar to the first alignment pattern 124 and the second alignment pattern 134 of the above-mentioned embodiment, the difference between the two is: in this embodiment, the second alignment pattern 134a includes two patterns 135a, and the first alignment pattern 124a includes a pattern, wherein the two patterns 135a are respectively right-angled triangles, and the first alignment pattern 124a is a rectangle. In the direction parallel to the Y-axis, the first alignment pattern 124a is located between the orthographic projections of the two patterns 135a of the second alignment pattern 134a on the first surface 111 and is separated from the two patterns 135a by a distance D, and an edge 136a of the orthographic projection of the two patterns 135a of the second alignment pattern 134a on the first surface 111 parallel to the Y-axis and an edge 126a of the first alignment pattern 124a parallel to the Y-axis are located on a straight line R1 on. It is worth mentioning that the flexible circuit carrier of this embodiment may be due to the limitation of the wiring space of the patterned metal layer or the special requirement for the pin offset accuracy in the direction parallel to the Y axis, only the first alignment pattern 124a and the second alignment pattern 134a that interfere with each other are provided in the direction parallel to the Y axis, and the first pattern can be obtained by disposing the two patterns 135a of the second alignment pattern 134a at a distance D from the first alignment pattern 124a in the direction parallel to the Y axis. Whether the relative position of the metallization layer 120 and the second patterned metal layer 130 in the direction parallel to the Y-axis produces an offset beyond the allowable tolerance. In addition, through the design that the edges 136a of the two patterns 135a of the second alignment pattern 134a and the edge 126a of the first alignment pattern 124a are located on the same straight line R1, it is also possible to roughly determine whether the first patterned metal layer 120 and the second patterned metal layer 130 have a positional shift in the direction parallel to the X-axis. That is to say, when the edges 136a of the two patterns 135a of the second alignment pattern 134a are not located on the same straight line R1 as the edge 126a of the first alignment pattern 124a, it can be known that the first patterned metal layer 120 and the second patterned metal layer 130 have shifted in a direction parallel to the X-axis.

圖3B為根據本發明的另一實施例的第一對位圖案及第二對位圖案相對位置的示意圖。請同時參考圖3A及圖3B，本實施例的第一對位圖案124b及第二對位圖案134b類似於上述實施例的第一對位圖案124a及第二對位圖案134a，兩者的差異在於：在本實施例中，第二對位圖案134b的二個圖案135b的形狀與第一對位圖案124b的形狀相同，皆分別為矩形。第二對位圖案134b的二個圖案135b於第一表面111上的正投影平行於Y軸的一邊緣136b1與第一對位圖案124b平行於Y軸的一邊緣126b1位於一直線R1上，而二個圖案135b於第一表面111上的正投影平行於Y軸的另一邊緣136b2與第一對位圖案124b平行於Y軸的另一邊緣126b2位於一直線R2上。透過第二對位圖案134b的二個圖案135b的邊緣136b1、136b2與第一對位圖案124b的邊緣126b1、126b2分別位於同一直線R1、R2上，可概略判斷第一圖案化金屬層120與第二圖案化金屬層130在平行於X軸的方向上是否產生位置偏移。3B is a schematic diagram of the relative positions of the first alignment pattern and the second alignment pattern according to another embodiment of the present invention. Please refer to FIG. 3A and FIG. 3B at the same time. The first alignment pattern 124b and the second alignment pattern 134b of this embodiment are similar to the first alignment pattern 124a and the second alignment pattern 134a of the above-mentioned embodiment. The difference between the two lies in that: in this embodiment, the shape of the two patterns 135b of the second alignment pattern 134b is the same as the shape of the first alignment pattern 124b, both of which are rectangles. An edge 136b1 of the orthographic projection of the two patterns 135b of the second alignment pattern 134b on the first surface 111 parallel to the Y axis and an edge 126b1 of the first alignment pattern 124b parallel to the Y axis are located on a straight line R1, and the other edge 136b2 of the orthographic projection of the two patterns 135b on the first surface 111 parallel to the Y axis is located on a straight line R2. on. Through the edges 136b1, 136b2 of the two patterns 135b of the second alignment pattern 134b and the edges 126b1, 126b2 of the first alignment pattern 124b are respectively located on the same straight line R1, R2, it can be roughly judged whether the first patterned metal layer 120 and the second patterned metal layer 130 have a positional shift in the direction parallel to the X-axis.

圖3C為根據本發明的另一實施例的第一對位圖案及第二對位圖案相對位置的示意圖。請同時參考圖3A及圖3C，本實施例的第一對位圖案124c以及第二對位圖案134c與上述的第一對位圖案124a以及第二對位圖案134a相似，兩者的差異在於：在本實施例中，在平行於X軸的方向上，第一對位圖案124c位於第二對位圖案134c的二個圖案135c於第一表面111上的正投影之間且分別與二個圖案135c間隔距離D，且第二對位圖案134c的二個圖案135c於第一表面111上的正投影平行於X軸的一邊緣136c與第一對位圖案124c平行於X軸的一邊緣126c位於一直線R3上。透過第二對位圖案134c的二個圖案135c的邊緣136c與第一對位圖案124c的邊緣126c位於同一直線R3上，可概略判斷第一圖案化金屬層120與第二圖案化金屬層130在平行於Y軸的方向上是否產生位置偏移。3C is a schematic diagram of the relative positions of the first alignment pattern and the second alignment pattern according to another embodiment of the present invention. Please refer to FIG. 3A and FIG. 3C at the same time. The first alignment pattern 124c and the second alignment pattern 134c of this embodiment are similar to the first alignment pattern 124a and the second alignment pattern 134a above. D, and an edge 136c of the two patterns 135c of the second alignment pattern 134c on the first surface 111 parallel to the X-axis and an edge 126c of the first alignment pattern 124c parallel to the X-axis are located on a straight line R3. Through the edge 136c of the two patterns 135c of the second alignment pattern 134c and the edge 126c of the first alignment pattern 124c being on the same straight line R3, it can be roughly judged whether the first patterned metal layer 120 and the second patterned metal layer 130 have a positional shift in the direction parallel to the Y-axis.

圖3D為根據本發明的另一實施例的第一對位圖案及第二對位圖案相對位置的示意圖。請同時參考圖3B及圖3D，本實施例的第一對位圖案124d及第二對位圖案134d類似於上述實施例的第一對位圖案124b及第二對位圖案134b，兩者的差異在於：在本實施例中，在平行於X軸的方向上，第一對位圖案124d位於第二對位圖案134d的二個圖案135d於第一表面111上的正投影之間且分別與二個圖案135d間隔距離D，且第二對位圖案134d的二個圖案135d於第一表面111上的正投影平行於X軸的一邊緣136d1與第一對位圖案124d平行於X軸的一邊緣126d1位於一直線R3上，而第二對位圖案134d的二個圖案135d於第一表面111上的正投影平行於X軸的另一邊緣136d2與第一對位圖案124d平行於X軸的另一邊緣126d2位於一直線R4上。透過第二對位圖案134d的二個圖案135d的邊緣136d1、136d2與第一對位圖案124d的邊緣126d1、126d2分別位於同一直線R3、R4上，可概略判斷第一圖案化金屬層120與第二圖案化金屬層130在平行於Y軸的方向上是否產生位置偏移。3D is a schematic diagram of the relative positions of the first alignment pattern and the second alignment pattern according to another embodiment of the present invention. Please refer to FIG. 3B and FIG. 3D at the same time. The first alignment pattern 124d and the second alignment pattern 134d of this embodiment are similar to the first alignment pattern 124b and the second alignment pattern 134b of the above-mentioned embodiment. The difference between the two is that in this embodiment, in the direction parallel to the X axis, the first alignment pattern 124d is located between the orthographic projections of the two patterns 135d of the second alignment pattern 134d on the first surface 111 and spaced from the two patterns 135d respectively. The distance D, and an edge 136d1 of the orthographic projection of the two patterns 135d of the second alignment pattern 134d on the first surface 111 parallel to the X-axis and an edge 126d1 of the first alignment pattern 124d parallel to the X-axis are located on a straight line R3, and the other edge 136d2 of the two patterns 135d of the second alignment pattern 134d on the first surface 111 is parallel to the X-axis and the other edge 136d2 of the first alignment pattern 124d is parallel to the X-axis. The other edge 126d2 is located on a straight line R4. Through the edges 136d1, 136d2 of the two patterns 135d of the second alignment pattern 134d and the edges 126d1, 126d2 of the first alignment pattern 124d are respectively located on the same straight line R3, R4, it can be roughly judged whether the first patterned metal layer 120 and the second patterned metal layer 130 have a positional shift in the direction parallel to the Y-axis.

圖4A為根據本發明的另一實施例的第一對位圖案及第二對位圖案相對位置的示意圖。請同時參考圖1及圖4A，本實施例的第一對位圖案124e以及第二對位圖案134e與上述的第一對位圖案124以及第二對位圖案134相似，兩者差異之處在於：在本實施例中，第一對位圖案124e以及第二對位圖案134e分別為一個圖案，且第一對位圖案124e的形狀為圓形以及第二對位圖案134e的形狀為環形。第二對位圖案134e於第一表面111上的正投影與第一對位圖案124e之間間隔距離D且不重疊第一對位圖案124e，其中第一對位圖案124e與第二對位圖案134e於第一表面111上的正投影其中的一者環繞其中的另一者。此處，第二對位圖案134e於第一表面111上的正投影環繞第一對位圖案124e，但本發明不以此為限。4A is a schematic diagram of the relative positions of the first alignment pattern and the second alignment pattern according to another embodiment of the present invention. Please refer to FIG. 1 and FIG. 4A at the same time. The first alignment pattern 124e and the second alignment pattern 134e of this embodiment are similar to the above-mentioned first alignment pattern 124 and the second alignment pattern 134. The difference between the two lies in that: in this embodiment, the first alignment pattern 124e and the second alignment pattern 134e are respectively a pattern, and the shape of the first alignment pattern 124e is a circle and the shape of the second alignment pattern 134e is a ring. The distance D between the orthographic projection of the second alignment pattern 134e on the first surface 111 and the first alignment pattern 124e does not overlap the first alignment pattern 124e, wherein one of the first alignment pattern 124e and the orthographic projection of the second alignment pattern 134e on the first surface 111 surrounds the other. Here, the orthographic projection of the second alignment pattern 134e on the first surface 111 surrounds the first alignment pattern 124e, but the invention is not limited thereto.

圖4B為根據本發明的另一實施例的第一對位圖案及第二對位圖案相對位置的示意圖。請同時參考圖4A及圖4B，本實施例的第一對位圖案124f以及第二對位圖案134f與上述的第一對位圖案124e以及第二對位圖案134e相似，兩者的差異在於：在本實施例中，第二對位圖案134f包括四個圖案135f，且四個圖案135f的形狀分別為弧形，其中第二對位圖案134f的四個圖案135f於第一表面111上的正投影環繞第一對位圖案124f，且第二對位圖案134f的四個圖案135f於第一表面111上的正投影與第一對位圖案124f之間分別間隔距離D。4B is a schematic diagram of the relative positions of the first alignment pattern and the second alignment pattern according to another embodiment of the present invention. Please refer to FIG. 4A and FIG. 4B at the same time. The first alignment pattern 124f and the second alignment pattern 134f of this embodiment are similar to the above-mentioned first alignment pattern 124e and the second alignment pattern 134e. The difference between the two is that in this embodiment, the second alignment pattern 134f includes four patterns 135f, and the shapes of the four patterns 135f are respectively arc-shaped. The distance D between the first alignment pattern 124f and the four patterns 135f of the second alignment pattern 134f on the first surface 111 is respectively separated from the first alignment pattern 124f.

圖5A為根據本發明的另一實施例的第一對位圖案以及第二對位圖案相對位置的示意圖。請同時參考圖1及圖5A，本實施例的第一對位圖案124g以及第二對位圖案134g與上述的第一對位圖案124以及第二對位圖案134相似，兩者的差異在於：在本實施例中，第一對位圖案124g的四個圖案125g的形狀分別為三角形，本發明對於第一對位圖案124g與第二對位圖案134g的形狀並不加以限制。更詳細而言，四個圖案125g的三角形頂點與第二對位圖案134g於第一表面111上的正投影分別間隔距離D，但本發明不以此為限。5A is a schematic diagram of the relative positions of the first alignment pattern and the second alignment pattern according to another embodiment of the present invention. Please refer to FIG. 1 and FIG. 5A at the same time. The first alignment pattern 124g and the second alignment pattern 134g of this embodiment are similar to the above-mentioned first alignment pattern 124 and the second alignment pattern 134. The difference between them is that in this embodiment, the shapes of the four patterns 125g of the first alignment pattern 124g are triangles respectively. The present invention does not limit the shapes of the first alignment pattern 124g and the second alignment pattern 134g. More specifically, the triangle vertices of the four patterns 125g and the orthographic projection of the second alignment pattern 134g on the first surface 111 are separated by a distance D, but the invention is not limited thereto.

圖5B為根據本發明的另一實施例的第一對位圖案以及第二對位圖案相對位置的示意圖。請同時參考圖1及圖5B，本實施例的第一對位圖案124h以及第二對位圖案134h與上述的第一對位圖案124以及第二對位圖案134相似，兩者的差異在於：在本實施例中，第二對位圖案134h為矩形，本發明對於第一對位圖案124h與第二對位圖案134h的形狀並不加以限制。5B is a schematic diagram of the relative positions of the first alignment pattern and the second alignment pattern according to another embodiment of the present invention. Please refer to FIG. 1 and FIG. 5B at the same time. The first alignment pattern 124h and the second alignment pattern 134h of this embodiment are similar to the above-mentioned first alignment pattern 124 and the second alignment pattern 134. The difference between the two is that in this embodiment, the second alignment pattern 134h is a rectangle. The present invention does not limit the shapes of the first alignment pattern 124h and the second alignment pattern 134h.

圖5C為根據本發明的另一實施例的第一對位圖案以及第二對位圖案相對位置的示意圖。請同時參考圖5B及圖5C，本實施例的第一對位圖案124i以及第二對位圖案134i與上述的第一對位圖案124h以及第二對位圖案134h相似，兩者的差異在於：在本實施例中，第一對位圖案124i的四個圖案125i分別為三角形，本發明對於第一對位圖案124i與第二對位圖案134i的形狀並不加以限制。5C is a schematic diagram of the relative positions of the first alignment pattern and the second alignment pattern according to another embodiment of the present invention. Please refer to FIG. 5B and FIG. 5C at the same time. The first alignment pattern 124i and the second alignment pattern 134i of this embodiment are similar to the above-mentioned first alignment pattern 124h and the second alignment pattern 134h. The difference between the two lies in that in this embodiment, the four patterns 125i of the first alignment pattern 124i are triangles. The present invention does not limit the shapes of the first alignment pattern 124i and the second alignment pattern 134i.

綜上所述，在本發明的可撓性線路載板的設計中，第二圖案化金屬層的第二對位圖案於可撓性基板的第一表面上的正投影與第一圖案化金屬層的第一對位圖案之間間隔一距離而不重疊於第一對位圖案。藉此，可用來做為位於可撓性基板的第一表面上的第一圖案化金屬層與位於可撓性基板的第二表面上的第二圖案化金屬層的對位標記，提供機台或作業人員直接視覺判斷第一圖案化金屬層與第二圖案化金屬層是否產生超出容許公差的偏移及其相對偏移的方向，可及早檢驗出不良品，以避免後續無謂製程。In summary, in the design of the flexible circuit carrier of the present invention, there is a distance between the orthographic projection of the second alignment pattern of the second patterned metal layer on the first surface of the flexible substrate and the first alignment pattern of the first patterned metal layer without overlapping the first alignment pattern. In this way, it can be used as an alignment mark between the first patterned metal layer on the first surface of the flexible substrate and the second patterned metal layer on the second surface of the flexible substrate, providing machines or operators with a direct visual judgment of whether the first patterned metal layer and the second patterned metal layer have shifted beyond the allowable tolerance and the direction of the relative shift, and defective products can be detected early to avoid unnecessary follow-up processes.

雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed as above with the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the scope of the appended patent application as the criterion.

100：可撓性線路載板 110：可撓性基板 111：第一表面 112：第二表面 113：傳動區 114：封裝區 115：晶片接合區 116：覆蓋區 117：外接區 120：第一圖案化金屬層 122：第一引腳 124、124a、124b、124c、124d、124e、124f、124g、124h、124i：第一對位圖案 125、125g、125h、125i：圖案 126a、126b1、126b2、126c、126d1、126d2：邊緣 130：第二圖案化金屬層 132：第二引腳 134、134a、134b、134c、134d、134e、134f、134g、134h、134i：第二對位圖案 135a、135b、135c、135d、135f：圖案 136a、136b1、136b2、136c、136d1、136d2：邊緣 140a：第一防銲層 140b：第二防銲層 D：距離 R1、R2、R3、R4：直線 U1、U2、U3、U4、U5：對位單元 100: flexible circuit carrier board 110: flexible substrate 111: First Surface 112: second surface 113: Transmission area 114: Packaging area 115: Wafer bonding area 116: Coverage area 117: External area 120: first patterned metal layer 122: first pin 124, 124a, 124b, 124c, 124d, 124e, 124f, 124g, 124h, 124i: first alignment pattern 125, 125g, 125h, 125i: pattern 126a, 126b1, 126b2, 126c, 126d1, 126d2: edge 130: second patterned metal layer 132: Second pin 134, 134a, 134b, 134c, 134d, 134e, 134f, 134g, 134h, 134i: second alignment pattern 135a, 135b, 135c, 135d, 135f: patterns 136a, 136b1, 136b2, 136c, 136d1, 136d2: edge 140a: first solder resist layer 140b: Second solder resist layer D: distance R1, R2, R3, R4: straight line U1, U2, U3, U4, U5: alignment unit

圖1為根據本發明的一實施例的一種可撓性線路載板的俯視示意圖。 圖2為沿圖1的線A-A的剖面示意圖。 圖3A為根據本發明的一實施例的第一對位圖案及第二對位圖案相對位置的示意圖。 圖3B為根據本發明的另一實施例的第一對位圖案及第二對位圖案相對位置的示意圖。 圖3C為根據本發明的另一實施例的第一對位圖案及第二對位圖案相對位置的示意圖。 圖3D為根據本發明的另一實施例的第一對位圖案及第二對位圖案相對位置的示意圖。 圖4A為根據本發明的另一實施例的第一對位圖案及第二對位圖案相對位置的示意圖。 圖4B為根據本發明的另一實施例的第一對位圖案及第二對位圖案相對位置的示意圖。 圖5A為根據本發明的另一實施例的第一對位圖案及第二對位圖案相對位置的示意圖。 圖5B為根據本發明的另一實施例的第一對位圖案及第二對位圖案相對位置的示意圖。 圖5C為根據本發明的另一實施例的第一對位圖案及第二對位圖案相對位置的示意圖。 FIG. 1 is a schematic top view of a flexible circuit carrier according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view along line A-A of FIG. 1 . 3A is a schematic diagram of relative positions of a first alignment pattern and a second alignment pattern according to an embodiment of the present invention. 3B is a schematic diagram of the relative positions of the first alignment pattern and the second alignment pattern according to another embodiment of the present invention. 3C is a schematic diagram of the relative positions of the first alignment pattern and the second alignment pattern according to another embodiment of the present invention. 3D is a schematic diagram of the relative positions of the first alignment pattern and the second alignment pattern according to another embodiment of the present invention. 4A is a schematic diagram of the relative positions of the first alignment pattern and the second alignment pattern according to another embodiment of the present invention. 4B is a schematic diagram of the relative positions of the first alignment pattern and the second alignment pattern according to another embodiment of the present invention. 5A is a schematic diagram of the relative positions of the first alignment pattern and the second alignment pattern according to another embodiment of the present invention. 5B is a schematic diagram of the relative positions of the first alignment pattern and the second alignment pattern according to another embodiment of the present invention. 5C is a schematic diagram of the relative positions of the first alignment pattern and the second alignment pattern according to another embodiment of the present invention.

100：可撓性線路載板 110：可撓性基板 111：第一表面 113：傳動區 114：封裝區 115：晶片接合區 116：覆蓋區 117：外接區 120：第一圖案化金屬層 122：第一引腳 124：第一對位圖案 125：圖案 130：第二圖案化金屬層 132：第二引腳 134：第二對位圖案 140a：第一防銲層 D：距離 U1、U2、U3、U4、U5：對位單元 100: flexible circuit carrier board 110: flexible substrate 111: First Surface 113: Transmission area 114: Packaging area 115: Wafer bonding area 116: Coverage area 117: External area 120: first patterned metal layer 122: first pin 124: First alignment pattern 125: pattern 130: second patterned metal layer 132: Second pin 134: Second alignment pattern 140a: first solder resist layer D: distance U1, U2, U3, U4, U5: alignment unit

Claims (11)

一種可撓性線路載板，包括： 一可撓性基板，具有彼此相對的一第一表面與一第二表面、位於該可撓性基板相對兩側且平行一Y軸延伸的二傳動區以及位於該二傳動區之間的一封裝區，該封裝區內具有一晶片接合區、環繞該晶片接合區的一覆蓋區以及位於該覆蓋區外側的一外接區； 一第一圖案化金屬層，設置於該可撓性基板的該第一表面上，該第一圖案化金屬層包括多個第一引腳以及一第一對位圖案，該些第一引腳位於該封裝區內並自該晶片接合區內延伸經過該覆蓋區至該外接區；以及 一第二圖案化金屬層，設置於該可撓性基板的該第二表面上，該第二圖案化金屬層包括多個第二引腳以及一第二對位圖案，該些第二引腳位於該封裝區內，其中該第二對位圖案於該第一表面上的正投影與該第一對位圖案之間間隔一距離而不重疊該第一對位圖案。 A flexible circuit carrier, comprising: A flexible substrate has a first surface and a second surface opposite to each other, two transmission areas located on opposite sides of the flexible substrate and extending parallel to a Y axis, and a packaging area located between the two transmission areas. The packaging area has a chip bonding area, a covering area surrounding the chip bonding area, and an external connection area outside the covering area; A first patterned metal layer, disposed on the first surface of the flexible substrate, the first patterned metal layer includes a plurality of first pins and a first alignment pattern, the first pins are located in the package area and extend from the chip bonding area through the coverage area to the external connection area; and A second patterned metal layer is disposed on the second surface of the flexible substrate, the second patterned metal layer includes a plurality of second pins and a second alignment pattern, the second pins are located in the packaging area, wherein the orthographic projection of the second alignment pattern on the first surface is separated from the first alignment pattern by a distance without overlapping the first alignment pattern. 如請求項1所述的可撓性線路載板，其中該距離等於一引腳位置公差。The flexible circuit carrier as claimed in claim 1, wherein the distance is equal to a pin position tolerance. 如請求項1所述的可撓性線路載板，其中在平行於該Y軸與平行於垂直該Y軸的一X軸的至少其中一者的方向上，該第二對位圖案於該第一表面上的正投影與該第一對位圖案其中的一者位於其中的另一者之間且分別間隔該距離。The flexible circuit carrier as described in claim 1, wherein in the direction of at least one of parallel to the Y-axis and an X-axis perpendicular to the Y-axis, the orthographic projection of the second alignment pattern on the first surface is separated from the other of the first alignment patterns by the distance. 如請求項3所述的可撓性線路載板，其中在平行於該Y軸的方向上，該第二對位圖案於該第一表面上的正投影與該第一對位圖案其中的一者位於其中的另一者之間且分別間隔該距離，且該第二對位圖案於該第一表面上的正投影平行於該Y軸的一邊緣與該第一對位圖案平行於該Y軸的一邊緣位於一直線上。The flexible circuit carrier as described in claim 3, wherein in a direction parallel to the Y-axis, the orthographic projection of the second alignment pattern on the first surface is separated from the other of the first alignment pattern by the distance, and an edge of the orthographic projection of the second alignment pattern on the first surface parallel to the Y-axis and an edge of the first alignment pattern parallel to the Y-axis are on a straight line. 如請求項3所述的可撓性線路載板，其中在平行於該X軸的方向上，該第二對位圖案於該第一表面上的正投影與該第一對位圖案其中的一者位於其中的另一者之間且分別間隔該距離，且該第二對位圖案於該第一表面上的正投影平行於該X軸的一邊緣與該第一對位圖案平行於該X軸的一邊緣位於一直線上。The flexible circuit carrier as described in claim 3, wherein in a direction parallel to the X-axis, the orthographic projection of the second alignment pattern on the first surface is separated from the other of the first alignment pattern by the distance, and an edge of the orthographic projection of the second alignment pattern on the first surface parallel to the X-axis and an edge of the first alignment pattern parallel to the X-axis are on a straight line. 如請求項1所述的可撓性線路載板，其中該第一對位圖案與該第二對位圖案位於該晶片接合區旁。The flexible circuit carrier as claimed in claim 1, wherein the first alignment pattern and the second alignment pattern are located beside the chip bonding area. 如請求項1所述的可撓性線路載板，其中該第一對位圖案與該第二對位圖案位於該二傳動區其中之一內。The flexible circuit carrier as claimed in claim 1, wherein the first alignment pattern and the second alignment pattern are located in one of the two transmission areas. 如請求項1所述的可撓性線路載板，其中該第一對位圖案與該第二對位圖案位於該外接區。The flexible circuit carrier as claimed in claim 1, wherein the first alignment pattern and the second alignment pattern are located in the external area. 如請求項1所述的可撓性線路載板，其中該第一對位圖案與該第二對位圖案於該第一表面上的正投影其中的一者環繞其中的另一者。The flexible circuit carrier as claimed in claim 1, wherein one of the orthographic projections of the first alignment pattern and the second alignment pattern on the first surface surrounds the other. 如請求項1所述的可撓性線路載板，其中該第一對位圖案與該第二對位圖案其中的一者包括至少二圖案，而該第一對位圖案與該第二對位圖案其中的另一者包括一圖案。The flexible circuit carrier as claimed in claim 1, wherein one of the first alignment pattern and the second alignment pattern includes at least two patterns, and the other of the first alignment pattern and the second alignment pattern includes one pattern. 如請求項10所述的可撓性線路載板，其中該至少二圖案在平行於該Y軸與平行於垂直該Y軸的一X軸的至少其中一者的方向上分別位於該圖案的相對兩側。The flexible circuit carrier as claimed in claim 10, wherein the at least two patterns are located on opposite sides of the patterns in a direction parallel to at least one of the Y axis and an X axis perpendicular to the Y axis.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080296752A1 (en) * 2007-04-27 2008-12-04 Shinko Electric Industries Co., Ltd. Substrate with pin, manufacturing method thereof, and semiconductor product
TWI307769B (en) * 2003-10-20 2009-03-21 Himax Tech Inc Apparatus for inspecting leads and method thereof
CN110687729A (en) * 2019-09-30 2020-01-14 上海天马微电子有限公司 Display module and display device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI307769B (en) * 2003-10-20 2009-03-21 Himax Tech Inc Apparatus for inspecting leads and method thereof
US20080296752A1 (en) * 2007-04-27 2008-12-04 Shinko Electric Industries Co., Ltd. Substrate with pin, manufacturing method thereof, and semiconductor product
CN110687729A (en) * 2019-09-30 2020-01-14 上海天马微电子有限公司 Display module and display device

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