CN113284649A

CN113284649A - Conductive adhesive tape, display module and display device

Info

Publication number: CN113284649A
Application number: CN202110672462.8A
Authority: CN
Inventors: 苏镜昌; 毕鑫; 吴建君; 黄文�; 王嘉华; 杨先锋; 成浩
Original assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Priority date: 2021-06-17
Filing date: 2021-06-17
Publication date: 2021-08-20

Abstract

The disclosure relates to a conductive adhesive tape, a display module and a display device. When the two circuit boards are electrically connected, one end of the conductive adhesive tape is bonded with one circuit board, so that one end of the conductive strip is connected with the conductive pin of the circuit board; bonding the other opposite end of the conductive adhesive tape with another circuit board so that the opposite end of the conductive strip is connected with the conductive pin of the circuit board; thereby electrically connecting the two circuit boards; compared with the plugging scheme of using the zero-plugging-force socket in the prior art, the zero-plugging-force socket is simple to assemble, can be assembled in place at one time, and is high in yield of the display module.

Description

Conductive adhesive tape, display module and display device

Technical Field

The disclosure relates to the technical field of display, in particular to a conductive adhesive tape, a display module comprising the conductive adhesive tape and a display device.

Background

At present, when a display module is manufactured, a touch flexible circuit board and a main flexible circuit board are generally assembled through a zero-insertion-force socket. With the increase of the number of Thin Film Transistor (TFT) wirings, the zero insertion force socket is more precise for saving space.

The touch flexible circuit board is very small and is not easy to grab, and the touch flexible circuit board is also assembled to a very small socket, so that the assembly is very difficult, and the problems of not-in-place assembly, inclined assembly and the like are easy to occur; meanwhile, the golden finger of the socket with zero insertion force is very fragile, and if the socket is not assembled in place at one time, the golden finger can fall off due to repeated insertion, so that the touch flexible circuit board is invalid, the display module is high in bad proportion, and the display module cannot be reworked and can only be scrapped.

It is to be noted that the information disclosed in the above background section is only for enhancement of understanding of the background of the present disclosure, and thus may include information that does not constitute prior art known to those of ordinary skill in the art.

Disclosure of Invention

The disclosed object is to overcome the above-mentioned problem that current display module assembly is difficult, the defective rate is higher, provides an easily assemble and higher conductive adhesive tape of yield, display module assembly and display device.

According to an aspect of the present disclosure, there is provided a conductive tape including: the substrate layer is provided with a plurality of grooves which are arranged in parallel on one side; and the conductive mixture is filled into the grooves, a conductive strip is formed in one groove, the conductive mixture comprises conductive particles and a binder, and the filling height of the conductive mixture is greater than or equal to the depth of the groove.

In one embodiment of the present disclosure, the conductive particles include insulating particles and a metal plating layer coated outside the insulating particles.

In one embodiment of the disclosure, the metal coating includes two metal coatings, one metal coating near the insulating particles is a nickel coating, and one metal coating far from the insulating particles is a gold coating.

In one embodiment of the present disclosure, the adhesive is one or both of a heat-sensitive curing agent and a light-sensitive curing agent.

In one embodiment of the present disclosure, the base layer comprises: the substrate comprises a substrate and a plurality of isolation belts, wherein the isolation belts are arranged on one side of the substrate and are arranged in parallel to form a plurality of parallel grooves.

In one embodiment of the present disclosure, the conductive tape further includes: the protective layer is arranged on one side, far away from the substrate, of the isolation strip, and the length of the protective layer along the extending direction of the conductive strip is smaller than that of the conductive strip, so that the two opposite ends of the conductive strip are exposed.

In one embodiment of the present disclosure, the substrate is made of polyimide or non-woven fabric.

In one embodiment of the present disclosure, a first alignment mark is provided on a substrate.

According to another aspect of the present disclosure, there is provided a display module including: the first circuit board is provided with a plurality of first conductive pins; the second circuit board is provided with a plurality of second conductive pins; a conductive tape of an aspect of the present disclosure connected between a plurality of the first conductive pins and a plurality of the second conductive pins; one end of the conductive strip is connected with the first conductive pin, and the other opposite end of the conductive strip is connected with the corresponding second conductive pin.

In one embodiment of the disclosure, the first conductive pin is a first gold finger, the second conductive pin is a second gold finger, and the widths of the first gold finger and the second gold finger are both greater than or equal to the sum of the widths of the at least two grooves.

In one embodiment of the present disclosure, a first alignment mark is disposed on the conductive tape, a second alignment mark is disposed on the first circuit board, a third alignment mark is disposed on the second circuit board, the first alignment mark at one end of the conductive tape is opposite to the second alignment mark, and the first alignment mark at the other end of the conductive tape is opposite to the third alignment mark.

In one embodiment of the present disclosure, the first circuit board is a main flexible circuit board, and the second circuit board is a touch flexible circuit board.

According to still another aspect of the present disclosure, there is provided a display device including the display module of another aspect of the present disclosure.

The conductive adhesive tape comprises a substrate layer, wherein a plurality of parallel grooves are formed in the substrate layer, and a conductive mixture comprising conductive particles and a bonding agent is filled in the grooves. When the two circuit boards are electrically connected, one end of the conductive adhesive tape is bonded with one circuit board, so that one end of the conductive strip is connected with the conductive pin of the circuit board; bonding the other opposite end of the conductive adhesive tape with another circuit board so that the opposite end of the conductive strip is connected with the conductive pin of the circuit board; thereby electrically connecting the two circuit boards; compared with the plugging scheme of using the zero-plugging-force socket in the prior art, the zero-plugging-force socket is simple to assemble, can be assembled in place at one time, and is high in yield of the display module.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure. It is to be understood that the drawings in the following description are merely exemplary of the disclosure, and that other drawings may be derived from those drawings by one of ordinary skill in the art without the exercise of inventive faculty.

Fig. 1 is a front view of a conductive tape according to an embodiment of the present disclosure.

Fig. 2 is a front view of a conductive tape according to an embodiment of the present disclosure.

Fig. 3 is a top view of a conductive tape according to an embodiment of the present disclosure.

Fig. 4 is a partially enlarged view of a portion C in fig. 3 according to an embodiment of the present disclosure.

Fig. 5 is a schematic structural diagram of a conductive particle according to an embodiment of the present disclosure.

Fig. 6 is a front view of another conductive tape according to an embodiment of the present disclosure.

Fig. 7 is an exploded view of another conductive tape according to an embodiment of the present disclosure.

Fig. 8 is a top view of yet another conductive tape according to an embodiment of the present disclosure.

Fig. 9 is a front view of a display module according to an embodiment of the disclosure.

Fig. 10 is a top view of a display module according to an embodiment of the disclosure.

Fig. 11 is a partially enlarged view of a portion a in fig. 10 according to an embodiment of the present disclosure.

Fig. 12 is a front view of another display module according to an embodiment of the disclosure.

Fig. 13 is a top view of a display module assembled by a touch flexible circuit board and a main flexible circuit board according to an embodiment of the disclosure.

In the figure: 1-conductive adhesive tape, 11-base layer, 111-substrate, 1111-first alignment mark, 112-isolation strip, 12-conductive mixture, 121-conductive particles, 1211-insulating particles, 1212-metal plating, 122-adhesive, 13-protective layer, 100-first connection end, 110-second connection end, 120-third connection end, 2-first circuit board, 22-first conductive pin, 3-second circuit board, and 32-second conductive pin.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted. Furthermore, the drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale.

Although relative terms, such as "upper" and "lower," may be used in this specification to describe one element of an icon relative to another, these terms are used in this specification for convenience only, e.g., in accordance with the orientation of the examples described in the figures. It will be appreciated that if the device of the icon were turned upside down, the element described as "upper" would become the element "lower". When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via another structure.

The terms "a," "an," "the," "said," and "at least one" are used to indicate the presence of one or more elements/components/parts/etc.; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. other than the listed elements/components/etc.; the terms "first," "second," and "third," etc. are used merely as labels, and are not limiting on the number of their objects.

The disclosed embodiments provide a conductive adhesive tape. As shown in fig. 1 to 8, the conductive tape 1 includes a base layer 11 and a conductive mixture 12; the substrate layer 11 is provided with a plurality of grooves arranged in parallel on one side, the conductive mixture 12 is filled into the grooves, a conductive strip is formed in one groove, the conductive mixture 12 comprises conductive particles 121 and a binder 122, and the filling height of the conductive mixture 12 is greater than or equal to the depth of the groove.

When the two circuit boards are electrically connected, one end of the conductive adhesive tape 1 is bonded with one of the circuit boards, so that one end of the conductive strip is connected with the conductive pin of the circuit board; bonding the other opposite end of the conductive adhesive tape 1 with another circuit board so that the opposite end of the conductive strip is connected with the conductive pin of the circuit board; thereby electrically connecting the two circuit boards; compared with the plugging scheme of using the zero-plugging-force socket in the prior art, the zero-plugging-force socket is simple to assemble, can be assembled in place at one time, and is high in yield of the display module.

As shown in fig. 1, in the present embodiment, the above-mentioned groove may be formed by fixing the isolation strip 112 on the surface of the substrate 111 in a pressing or bonding manner, the above-mentioned base layer 11 includes the substrate 111 and a plurality of isolation strips 112, the plurality of isolation strips 112 are disposed on one side of the substrate 111 and are parallel to each other, forming a plurality of parallel grooves. The kinds of the substrate 111 include, but are not limited to, paper, tissue paper, various polyester resin (PET) films, and various foams. The material of the isolation tape 112 is determined according to the required insulation parameters, and generally, a Polyimide (PI) material is selected as a primary material, and a non-woven fabric material may be used.

As shown in fig. 2, in other embodiments, the groove may be formed by etching on the substrate layer 11. Specifically, the base layer 11 is directly made of Polyimide (PI), the thickness of the base layer 11 is twice the thickness of the substrate 111 in the above embodiment, each groove is directly etched on the base layer 11, two adjacent grooves share a groove wall, and the thickness of the groove wall is set to be the same as the thickness of the isolation strip 112.

It is emphasized that the groove is closed at both ends. In the present embodiment, one isolation strip 112 is disposed at each end of the plurality of isolation strips 112 parallel to each other. In other embodiments, groove walls for closing both ends of the grooves are etched on the substrate 111, and the groove walls at both ends of the grooves are disposed on the same straight line.

As shown in fig. 3 and 4, the extending direction of the groove may be set to be the same as the length direction of the conductive tape 1, and of course, the extending direction of the groove may be set to be the same as the width direction of the conductive tape 1. In the present embodiment, the extending direction of the groove may be set to be the same as the length direction of the conductive tape 1. When the extending direction of the grooves is the same as the length direction of the conductive adhesive tape 1, no matter how much the cutting length of the adhesive tape is, the number of the grooves on the base layer 11 of each section of the conductive adhesive tape 1 can be always ensured to be the same.

The parallel arrangement of the plurality of grooves can be a mode that the plurality of grooves are arranged in parallel, for example: the grooves are arranged in a row array arrangement mode, and the directions of two adjacent grooves are the same; the mode that a plurality of grooves are arranged in a non-parallel mode can also be adopted, for example: a plurality of recesses set up the mode of arranging into staggering, and two adjacent recesses set up the opposite direction. In this embodiment, the plurality of grooves are arranged in parallel to each other.

The grooves can be strip-shaped grooves, and the shape and the size of each strip-shaped groove are the same. Each groove and the mixture of the conductive particles 121 and the adhesive 122 filled therein form one conductive strip, and the plurality of grooves and the mixture of the conductive particles 121 and the adhesive 122 filled therein form a plurality of conductive strips. The ratio of the conductive particles 121 to the binder 122 in the conductive mixture 12 is not particularly limited, but it is ensured that the conductive particles 121 contact each other. It should be further noted that the resistance of the conductive mixture 12 in the first direction is less than 0.05 ohm, the resistance of the conductive mixture 12 in the second direction is less than 0.05 ohm, and the first direction and the second direction are perpendicular to each other.

As shown in fig. 5, the conductive particles 121 may include insulating particles 1211 and a metal plating layer 1212 covering the insulating particles 1211. The metal plating layer 1212 may comprise two metal plating layers 1212, wherein the metal plating layer 1212 near the insulating particles 1211 may be nickel plating and the metal plating layer 1212 far from the insulating particles 1211 may be gold plating. The gold plating layer and the nickel plating layer are tightly combined, are not easy to fall off, can ensure good conductivity, can reduce the thickness of the gold plating layer, and save the cost.

It should be noted that the nickel plating layer may be replaced by another plating layer that is easily combined with gold, for example: copper, silver, nickel-iron alloy or nickel-zinc alloy. Are merely exemplary, other metals or alloys may be used, and are not intended to be exhaustive.

The diameter of the conductive particles 121 is preferably 4um to 10 um. The conductive particles 121 may adopt a spherical structure, and the spherical structures are in point contact with each other. The conductive particles 121 may also be of a polyhedral structure, and the polyhedral structure is in surface contact with each other, so that the contact area is larger than that of point contact, and the conductivity of the conductive mixture 12 is better. It should be noted that the polyhedral structure includes more than four faces, because the tetrahedral structure may cause the conductive particles 121 to stack on each other, and partially or even completely occupy the filling gap of the adhesive 122.

The adhesive 122 may employ one or both of a heat-sensitive curing agent and a light-sensitive curing agent. The curing can be realized by heating the thermosensitive curing agent, and the curing can be realized by illuminating the thermosensitive curing agent. The heat-sensitive curing agent includes, but is not limited to, thermosetting glue, and the light-sensitive curing agent includes, but is not limited to, UV curing agent. Preferably, a UV curing agent is adopted, the UV curing agent has no special requirement, and the energy of a UV machine is more than or equal to 3000mj/cm during curing²And (4) finishing.

As shown in fig. 6 and fig. 7, in an embodiment, the conductive adhesive tape 1 further includes a protective layer 13, the protective layer 13 is disposed on a side of the isolation strip 112 away from the substrate 111, and an orthographic projection of the protective layer 13 on the substrate 111 is located in an orthographic projection of the conductive mixture 12 on the substrate 111, that is, a length of the protective layer 13 along an extending direction of the conductive strip is smaller than a length of the conductive strip, so that opposite ends of the conductive strip are exposed. The extension direction of the protective layer 13 along the width of the conductive strip substantially coincides with the width of the base layer 11. Here, the protective layer 13 may be specifically made of Polyimide (PI). The addition of the protective layer 13 can make the conductive adhesive tape 1 stronger.

In addition to the above embodiments, the substrate 111 is provided with the first alignment mark 1111. When the relative positions of the conductive tape 1 and one circuit board and the relative positions of the conductive tape 1 and another circuit board are aligned in advance, the setting position of the conductive tape 1 may be aligned by using a first alignment mark 1111 through a Charge Coupled Device (CCD).

The conductive adhesive tape 1 can be provided with a plurality of connecting ends, each connecting end is respectively bonded with a circuit board, a plurality of grooves which are arranged in parallel are arranged between one connecting end and the other opposite connecting ends, a conductive mixture 12 is filled in each groove, and the height of the conductive mixture 12 is also larger than or equal to the depth of the groove. As shown in fig. 8, the conductive tape 1 includes a first connection end 100, a second connection end 110, and a third connection end 120, wherein a plurality of parallel first grooves are disposed between the first connection end 100 and the second connection end 110, and a plurality of parallel second grooves are disposed between the first connection end 100 and the third connection end 120. Filling the first groove with the conductive mixture 12 forms a first conductive strip and filling the second groove with the conductive mixture 12 forms a second conductive strip.

When the conductive adhesive tape 1 electrically connects three circuit boards, a first connecting end 100 of the conductive adhesive tape 1 is bonded with a first circuit board, so that one end of a first conductive strip is connected with a conductive pin of the first circuit board, a second connecting end 110 opposite to the first connecting end 100 is bonded with a second circuit board, so that the other end of the first conductive strip is connected with a conductive pin of the second circuit board, and the first circuit board is electrically connected with the second circuit board; the first connection end 100 of the conductive tape 1 is bonded to the first circuit board, so that one end of the second conductive strip is connected to the conductive pin of the first circuit board, and the third connection end 120 opposite to the first connection end 100 is bonded to the third circuit board, so that the other end of the second conductive strip is connected to the conductive pin of the third circuit board.

The embodiment of the disclosure also provides a display module. As shown in fig. 9 to 13, the display module may include a first circuit board 2, a second circuit board 3 and the conductive tape 1, wherein the first circuit board 2 is provided with a plurality of first conductive pins 22; the second circuit board 3 is provided with a plurality of second conductive pins 32; the conductive tape 1 is connected between the first conductive pins 22 and the second conductive pins 32; one end of the conductive strip is connected to the first conductive pin 22, and the other opposite end of the conductive strip is connected to the corresponding second conductive pin 32.

As shown in fig. 9 to 11, the first conductive leads 22 are first gold fingers, and the second conductive leads 32 are second gold fingers. It is known that the first circuit board 2 has a plurality of first gold fingers and the second circuit board 3 has a plurality of second gold fingers. When the first circuit board 2 and the second circuit board 3 are connected by the conductive adhesive tape 1, one end of the conductive adhesive tape 1 is connected with the first golden finger, and the other end of the conductive adhesive tape 1 is connected with the second golden finger.

It should be noted that, when one end of the conductive tape 1 is connected to the first gold finger and the other end of the conductive tape 1 is connected to the second gold finger, the two ends of the conductive strip are respectively contacted with the first gold finger and the second gold finger. In the present embodiment, that is, the side of the isolation strip 112 away from the substrate 111 is contacted with the first gold finger and the second gold finger respectively.

The width of the first golden finger and the width of the second golden finger are larger than or equal to the width of the at least two grooves, so that the first golden finger and the second golden finger can be well conducted, specifically, one of the conductive strips is poor in contact and can be conducted through the other conductive strip. Preferably, the width of the first gold finger and the width of the second gold finger are equal to the width of the three grooves. It should be noted that the width is perpendicular to the above-mentioned length.

It should be noted that the width of at least two grooves is the sum of the width of two adjacent grooves and the thickness of the groove wall between two adjacent grooves, and the groove wall between two adjacent grooves is usually very thin and thus can be ignored. Illustratively, the thickness of the groove wall between two grooves is 0.5-1 mil.

As shown in fig. 12, when the conductive tape 1 includes the protective layer 13, the protective layer 13 is positioned between the first gold finger and the second gold finger, and thus it is necessary to set the length of the protective layer 13 to be smaller than the length of the base layer 11. The length here refers to the span in the direction of the connection of the first gold finger with the corresponding second gold finger.

Taking a section of the conductive tape 1 as an example, two ends of the substrate 111 in the length direction extend outwards along the width direction to protrude out of the outermost base layer 11, so as to form four protruding portions, and each protruding portion is provided with a first alignment mark 1111. Two second alignment marks (not shown in the figure) are arranged on the first circuit board 2, two third alignment marks (not shown in the figure) are arranged on the second circuit board 3, the first alignment mark 1111 at one end of the conductive adhesive tape 1 is over against the second alignment mark, and the first alignment mark 1111 at the other end of the conductive adhesive tape 1 is over against the third alignment mark, so that the bonding position of the conductive adhesive tape 1 can be determined, and when the two circuit boards are connected, the situation that the assembly is not in place and the assembly is inclined can be well prevented.

As shown in fig. 13, the above-mentioned first circuit board 2 may be a main flexible circuit board, and the second circuit board 3 may be a touch flexible circuit board.

The following description will use the main flexible circuit board and the touch flexible circuit board as an example to describe the usage of the conductive tape 1 in the display module.

When the display module is assembled, the relative positions of the conductive adhesive tape 1 and the main flexible circuit board and the relative positions of the conductive adhesive tape 1 and the touch flexible circuit board are aligned in advance in the above mode, so that one end of each conductive bar is opposite to each first golden finger, and the other end of each conductive bar is opposite to each second golden finger;

respectively attaching the conductive adhesive tape 1 to the main flexible circuit board and the conductive adhesive tape 1 to the touch flexible circuit board, specifically, respectively attaching one end of each conductive strip on the conductive adhesive tape 1 to each first golden finger, and respectively attaching the other end of each conductive strip to each second golden finger;

the conductive tape 1 is cured in a corresponding manner according to the adhesive 122 included in the conductive mixture 12, so that one end of each conductive strip is bonded to each first gold finger, and the other end of each conductive strip is bonded to each second gold finger.

The touch flexible circuit board and the main flexible circuit board are assembled through the process. The assembling difficulty is simplified, the problems of improper assembling, inclined assembling and the like are solved, expensive binding equipment is not needed, and the binding cost is saved.

The disclosed embodiments provide a display device. The display device comprises the display module.

The display device may be a conventional electronic device, for example: cell phones, computers, televisions, video recorders and video players, as well as emerging wearable devices such as VR glasses, not to mention here. When the conductive tape 1 is used in a display module of a wearable device, the thickness of the base layer 11 is 2Mil, wherein the thickness of the substrate 111 is 1Mil, and the height of the isolation tape 112 is also 1 Mil. When the display module is used for the display module of other display equipment, the display module can be properly adjusted according to the display requirements.

It should be noted that, the display device includes other necessary components and components besides the display module, taking a display as an example, specifically, such as a housing, a power line, and the like, and those skilled in the art can perform corresponding supplement according to the specific use requirement of the display device, and details are not described herein.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

Claims

1. An electrically conductive adhesive tape, comprising:

the substrate layer is provided with a plurality of grooves which are arranged in parallel on one side;

and the conductive mixture is filled into the grooves, a conductive strip is formed in one groove, the conductive mixture comprises conductive particles and adhesive, and the filling height of the conductive mixture of the conductive strip is greater than or equal to the depth of the groove.

2. The conductive tape of claim 1, wherein the conductive particles comprise insulating particles and a metal coating layer coated on the insulating particles.

3. The conductive tape of claim 2 wherein the metal coating comprises two metal coatings, one metal coating adjacent to the insulating particles being a nickel coating and one metal coating distal from the insulating particles being a gold coating.

4. The conductive tape of claim 1, wherein the adhesive is one or both of a heat-sensitive curing agent and a light-sensitive curing agent.

5. The conductive tape of claim 1, wherein the base layer comprises:

a substrate;

and the isolation belts are arranged on one side of the substrate and are arranged in parallel to form a plurality of parallel grooves.

6. The conductive tape of claim 5, further comprising:

the protective layer is arranged on one side, far away from the substrate, of the isolation strip, and the length of the protective layer along the extending direction of the conductive strip is smaller than that of the conductive strip, so that the two opposite ends of the conductive strip are exposed.

7. The conductive tape of claim 5, wherein the substrate is made of polyimide or non-woven fabric.

8. The conductive tape of claim 5, wherein the substrate is provided with a first alignment mark.

9. A display module, comprising:

the first circuit board is provided with a plurality of first conductive pins;

the second circuit board is provided with a plurality of second conductive pins;

the electrically conductive tape of any one of claims 1-8, connected between a plurality of the first electrically conductive pins and a plurality of the second electrically conductive pins;

one end of the conductive strip is connected with the first conductive pin, and the other opposite end of the conductive strip is connected with the corresponding second conductive pin.

10. The display module of claim 9, wherein the first conductive pin is a first gold finger, the second conductive pin is a second gold finger, and the width of each of the first gold finger and the second gold finger is greater than or equal to the sum of the widths of at least two of the grooves.

11. The display module according to claim 9, wherein the conductive tape is the conductive tape of claim 8, the first circuit board is provided with a second alignment mark, the second circuit board is provided with a third alignment mark, the first alignment mark at one end of the conductive tape is opposite to the second alignment mark, and the first alignment mark at the other end of the conductive tape is opposite to the third alignment mark.

12. The display module assembly of claim 9, wherein the first circuit board is a main flexible circuit board and the second circuit board is a touch flexible circuit board.

13. A display device, comprising the display module according to any one of claims 9 to 12.