CN110653173B

CN110653173B - Sorter for testing electronic components

Info

Publication number: CN110653173B
Application number: CN201910925100.8A
Authority: CN
Inventors: 卢种基; 尹广熙; 李斗吉
Original assignee: Techwing Co Ltd
Current assignee: Techwing Co Ltd
Priority date: 2016-03-18
Filing date: 2017-02-24
Publication date: 2022-04-19
Anticipated expiration: 2037-02-24
Also published as: TW201734482A; CN107199183B; CN107199183A; CN110653174A; CN110653174B; KR20230045002A; KR102656451B1; CN110252685A; CN110653173A; KR20230047989A; KR20240031993A; KR20230046290A; TWI611195B; KR20170108703A; CN110252685B

Abstract

The present invention relates to a handler for testing electronic components. The invention provides a sorter for testing electronic components, comprising: a loading device for loading a plurality of electronic components to be tested from the supply tray to the test tray; a connecting device for electrically connecting the plurality of electronic components mounted on the test tray to a tester; an unloading device for unloading the tested electronic components from the test tray and moving the electronic components to the recovery tray; and a buffer device having a buffer table movable between a working area of the loading device and a working area of the unloading device. Further, the buffer stage is moved between the working area of the loading device and the working area of the unloading device by the buffer device as needed, so that the buffer stage can be flexibly applied to the loading operation by the loading device and the unloading operation by the unloading device.

Description

Sorter for testing electronic components

(the application is a divisional application of a Chinese invention patent application with the application date of 2017, 2, 24 and the application number of 201710102266.0.)

Technical Field

The present invention relates to a handler (handler) for testing electrical characteristics of electronic parts to be produced. In particular, the present invention relates to a technique for moving electronic components in a handler.

Background

After production, a plurality of electronic components such as semiconductor devices and module memories are shipped after being subjected to an electrical characteristic test. At this time, a handler for electrically connecting the electronic part to be tested with the tester is required.

Generally, a handler includes a test tray, a first stacker, a loading device, a connecting device, an unloading device, and a second stacker.

The test tray circulates along a circulation path reconnected to the loading position after passing through the loading position, the test position, and the unloading position.

The first stacker is configured to receive a plurality of supply trays each containing a plurality of electronic components to be tested. By sequentially supplying the supply trays stored in such a first stacker to the supply position, the loading operation by the loading device is performed smoothly.

The loading device is used for loading a plurality of electronic components to be tested from the supply tray to the test tray positioned at the loading position.

When the test tray loaded with the plurality of electronic components reaches the test position by the loading device, the connection device electrically connects the plurality of electronic components loaded on the test tray to the tester.

The unloading device is used for unloading the electronic components from the test tray reaching the unloading position after the test of the loaded electronic components is finished at the test position, classifying the electronic components according to the test result and moving the electronic components to the recovery tray.

The second stacker is configured to store a plurality of collecting trays for collecting a plurality of electronic components subjected to a test. Such a plurality of trays for collection are sequentially supplied to the collection position, and the unloading operation by the unloading device is smoothly performed.

However, as in korean laid-open patent No. 10-2009-0063542, a plurality of electronic components classified into retests after completion of a primary test need to be subjected to a secondary Retest (Retest) process for re-supply to a handler. At this time, the electronic components sorted into retests and loaded on the tray for collection are manually supplied to the sorter by an operator.

Therefore, the operation of the sorter between the primary test and the secondary retest is terminated, which lowers the operation rate of the sorter.

On the other hand, as in korean laid-open patent No. 10-2009-0008062 and the like, to assist an appropriate loading work by a loading device, a buffer table is provided in the sorter.

In general, the buffer stage can temporarily load electronic components that need to be temporarily removed at the time of loading, by closing a test socket in a tester or the like. This makes the loading work smooth and improves the loading speed. Among them, the turning-off is the turning-Off (OUT) of the test socket, and whether or not a specific test socket is an object of the turning-off may be changed according to the designer's intention. For example, if the abnormal determination occurs for a specific test socket for a set number of times or more, the test socket may be set to be turned off. In the case of a test socket having a closed position, electronic components are not mounted on positions corresponding to the test sockets facing the test tray, but the electronic components to be mounted on the positions are collected and moved to the test tray when the electronic components are collected to a predetermined amount. The invention relates to a flexible application of such a buffer station.

Disclosure of Invention

Technical problem to be solved

A first object of the present invention is to provide a method for smoothly performing a loading operation, an unloading operation, and a retesting operation by flexibly using a buffer stage.

A second object of the present invention is to provide a technique for accurately grasping the flow of electronic components to which a buffer stage is flexibly applied by individually recognizing the electronic components.

Technical scheme for solving problems

The electronic component test handler according to a first embodiment of the present invention includes: a test tray circulating along a circulation path connected to the loading position after passing through the loading position, the test position, and the unloading position; a loading device for loading a plurality of electronic components to be tested from a supply tray to the test tray located at the loading position; a connecting device for electrically connecting the plurality of electronic components loaded on the test tray to a tester when the test tray loaded with the plurality of electronic components reaches the test position by the loading device; an unloading device for unloading the electronic components from the test tray reaching the unloading position after the test of the loaded electronic components is completed at the test position, classifying the electronic components according to the test result, and moving the electronic components to a recovery tray; and a buffer device having a buffer stage movable between a working area of the loading device and a working area of the unloading device, wherein the buffer stage is moved between the working area of the loading device and the working area of the unloading device by the buffer device as needed, thereby flexibly applying the buffer stage to the loading operation by the loading device and the unloading operation by the unloading device.

The unloading device loads the specific electronic components classified according to the retest result on the buffer stage located in the working area of the unloading device, and the loading device moves the specific electronic components on the buffer stage moving from the working area of the unloading device to the working area of the loading device to the test tray located at the loading position.

The handler for testing electronic components further includes: a first stacker for receiving a plurality of supply trays loaded with a plurality of electronic components to be tested; and a second stacker configured to store a plurality of trays for recovery that recover a plurality of electronic components that have been tested, the second stacker including: a lifting frame capable of loading a plurality of trays for recovery along the vertical direction with a predetermined interval; a lifter for lifting the lifting frame; and a plurality of driving and reversing devices for selectively driving and reversing the plurality of recovery trays loaded on the lifting frame to make the plurality of recovery trays positioned at the recovery position or returned to the storage position.

A handler for testing electronic components according to a second embodiment of the present invention includes: a test tray circulating along the circulation path after passing through the loading position, the testing position and the unloading position; a loading device for loading a plurality of electronic components to be tested from a supply tray to the test tray located at the loading position; a connecting device for electrically connecting the plurality of electronic components loaded on the test tray to a tester when the test tray loaded with the plurality of electronic components reaches the test position by the loading device; an unloading device for unloading the electronic components from the test tray reaching the unloading position after the test of the loaded electronic components is completed at the test position, classifying the electronic components according to the test result, and moving the electronic components to a recovery tray; and a recognition device for recognizing the plurality of electronic components loaded on the test tray located at the loading position by the loading device, wherein the loading device moves the plurality of held electronic components to the test tray located at the loading position through the recognition device so that the plurality of held electronic components can be recognized by the recognition device, the recognition device comprising: a camera for shooting a bar code printed on the electronic component; and a reader for reading the barcode on the picture taken by means of the camera.

The recognition device further includes a reflecting mirror corresponding to the camera and reflecting the barcode printed on the electronic component to the camera.

The loading device recognizes the bar code while holding the electronic component.

The recognition device further comprises a foreign matter removing mechanism for removing foreign matters of the electronic component.

The loading device can hold a plurality of electronic components, and the recognition device recognizes barcodes of the plurality of electronic components held by the loading device.

The reader also reads the loading direction of the electronic components through the pictures shot by the camera.

The recognition device recognizes the bar code and reads the electronic component mounting direction at the same time.

Advantageous effects of the invention

According to the present invention as described above, the following effects are obtained.

First, since the buffer stage is flexibly applied to the loading work, the unloading work, and the retest work, the moving flow of the electronic parts is optimized with a minimum additional structure, thereby having an effect of finally greatly improving the operation rate of the handler.

Second, the electronic components are individually recognized by using the recognition device, so that the moving flow of the electronic components using the buffer stage can be supported.

Third, the recognition device obtains a reading function of a mounting direction of the electronic component and a foreign matter removal function of the electronic component by adding a recognition function of recognizing the electronic component, thereby realizing effective use and design of the recognition device.

Drawings

Fig. 1 is a conceptual top view of a handler for electronic component tests according to an embodiment of the present invention.

Fig. 2 and 3 are drawings for explaining an identification device applied to the sorter of fig. 1.

Fig. 4 is an illustration relating to an electronic component to be tested.

Fig. 5 is a schematic top view of a buffer device suitable for use in the sorter of fig. 1.

Fig. 6 is a diagram for explaining a difference in height between a loading buffer plate/unloading buffer plate and a buffer table applied to the sorter of fig. 1.

Fig. 7 and 8 are diagrams for explaining a technique of positioning a collecting tray at a collecting position in a second stacker applied to a sorting machine.

Fig. 9 to 11 are diagrams showing examples of a barcode for imaging an electronic component.

Description of reference numerals

100: sorter for testing electronic components

TT: test tray

120: loading device

130: buffer board for loading

140: identification device

150: connecting device

160: unloading device

170: buffer plate for unloading

190: buffer device

191: buffer table

192: moving device

Detailed Description

As described above, a plurality of preferred embodiments according to the present invention are explained by referring to the drawings, but repetitive explanations are omitted or compressed as much as possible for the simplicity of explanation.

Fig. 1 is a conceptual plan view of a handler 100 for electronic component testing (hereinafter, simply referred to as "handler") according to an embodiment of the present invention.

The sorter of fig. 1 includes a test tray TT, a first stacker 110, a loading device 120, a buffer plate for loading 130, an identification device 140, a connecting device 150, an unloading device 160, a buffer plate for unloading 170,

second stackers

181, 182, 183, and a buffer device 190.

The test tray TT circulates along a circulation path C passing through the loading position LP, the test position TP, and the unloading position UP and then connected to the loading position LP. Such a test tray TT is used for connecting the movement of the electronic components at the loading position LP, the testing position TP, and the unloading position UP. That is, the plurality of electronic components are loaded on the test tray TT at the loading position LP, pass through the test position TP, and then move to the unloading position UP.

In the first stacker 110, a plurality of supply trays ST on which a plurality of electronic components to be tested are loaded are stored. The plurality of supply trays ST stored in the first stacker 110 are sequentially supplied to the supply position SP, so that the loading operation by the loader 120 can be smoothly performed. The first stacker 110 may be configured to allow a worker to directly load the supply tray ST, or may be configured to accommodate a plurality of carriages loaded on the supply tray ST.

For reference, a camera CM may be provided at an upper side of the supply position SP or at an upper side of a waiting position WP where the supply tray ST waits before entering the supply position SP. In this case, since whether or not the electronic components D loaded on the supply tray ST are loaded (loading position or number) can be confirmed in advance by the camera CM, the loading device 120 can be controlled appropriately. Of course, since the supply position SP belongs to the working area of the loading device 120, it is preferable that the camera CM is disposed above the waiting position WP as in the present embodiment.

The loader 120 loads a plurality of electronic components to be tested from the supply tray ST located at the supply position SP to the test tray TT located at the loading position LP.

The loading buffer plate 130 is used to temporarily load a plurality of electronic parts to be tested according to the requirements. The loading buffer plate 130 is fixedly provided. Therefore, the loader 120 performs a task of loading the plurality of electronic components held by the loader buffer plate 130 or moving the plurality of electronic components loaded on the loader buffer plate 130 to the test tray TT located at the loading position LP according to the control situation.

The recognition device 140 is used to recognize a plurality of electronic components that are moving from the supply position ST to the loading position LP in the holding state by the loading device 120. The recognition device 140 may be any device as long as it can recognize a plurality of electronic components individually. Therefore, it may be composed of a bar code reader or a camera, and in this case, it is necessary to print an identification code that can be recognized by the bar code or the camera on the electronic component. In a plan view, the loader 120 is controlled so as to move the plurality of electronic components held by the recognition device 140 to the test tray TT located at the loading position LP after passing through the recognition position RP where the recognition device 140 is provided, so that the electronic components are recognized by the recognition device 140. If necessary, the electronic components held by the loading device 120 may be temporarily stopped at the recognition position RP, and the electronic components may be moved forward and backward more or less at the recognition position RP, so that the electronic components can be correctly recognized by the recognition device 140.

Fig. 2 shows an example of the recognition device 140. The identification device 140 is constituted by four barcode readers BR spaced at predetermined intervals. Such a barcode reader BR may be a camera and has a structure to photograph the barcode B through the mirror M. Of course, the loader 120 can hold four electronic components D at the same time in a state of being spaced apart from each other, and the side surfaces of the electronic components D need to be printed with bar codes. In the example of fig. 2, the loader 120 is capable of temporarily lowering four electronic components D held, placing a plurality of electronic components D on a plurality of mirrors M, and then moving the plurality of electronic components D forward and backward more or less to correctly recognize the barcodes, so that the plurality of barcode readers BR can recognize the barcodes of the plurality of electronic components D, as shown in fig. 3. Of course, when the identification of the barcode by the plurality of barcode readers BR is completed, the reader DA reads the barcode on the picture taken by the barcode reader BR. In the case where the barcode reader BR of the present embodiment is a camera, the reader DA may confirm the mounting direction of the electronic component D by whether or not the barcode is reflected on the picture, or may confirm the mounting direction of the electronic component D by reading the form of the region other than the barcode (the form of the direction slot in fig. 4, etc.) by applying the entire picture flexibly.

The recognition device 140 is provided with a flow path L for blowing air into the electronic component D. Therefore, since air can be blown into the electronic component D through the flow path L, foreign substances of the electronic component D can be swept out. That is, the flow path L functions as a foreign substance removal mechanism for removing foreign substances from the electronic component D. Of course, a configuration may be adopted in which the foreign matter is brushed off by a suction or brushing tool (brush). In addition, in the case of suction, a space for collecting foreign matter needs to be separately provided.

In the present embodiment, the recognition device 140 can recognize four electronic components D at the same time, and the loading device 120 can also be constituted by a structure that moves four electronic components D at the same time, although the number of recognition or the number of movement can be increased or decreased according to the implementation.

For reference, in the present embodiment, the barcode reader BR constituted by a camera and the mirror M are used to read the barcode of the electronic component and confirm the loading direction of the electronic component, but may be implemented by dividing the two functions into different structures from each other according to the specific implementation. For example, a plurality of direction grooves DS are formed in the electronic component D shown in fig. 4. Such a plurality of direction slots DS can be used to read the loading direction of the electronic component D. That is, the mounting direction of the electronic component D is read by using the light emitting element and the light receiving element and recognizing whether or not the light emitted toward the direction groove DS by the light emitting element is received by the light receiving element. Also, the barcode of the electronic part D can be recognized by a camera or a reader.

When the test tray TT loaded with the plurality of electronic components by the loader 120 reaches the test position TP, the connection device 150 electrically connects the plurality of electronic components loaded on the test tray TT with the tester.

The unloading device 160 unloads the plurality of electronic components loaded at the loading test position TP from the test tray TT which reaches the unloading position UP after the completion of the test, sorts the electronic components according to the test results, and moves to the recovery position DP₁To DP₃The recovery tray DT₁To DT₃。

The buffer plate 170 for unloading as required is used to temporarily load a plurality of electronic components that have been tested. The unloading buffer plate 170 is fixedly provided. Therefore, the unloading device 160 performs the following operation according to the control condition, i.e., the unloading position UP or the recovery position DP₁To DP₃The plurality of electronic components held by the holding unit are loaded on the unloading buffer plate 170, or the plurality of electronic components loaded on the unloading buffer plate 170 are moved to the recovery position DP₁To DP₃The recovery tray DT₁To DT₃。

The

second stacker

181, 182, 183 accommodates a plurality of trays DT for collection for collecting a plurality of electronic components subjected to a test₁To DT₃. Such a plurality of trays DT for recovery₁To DT₃By sequential supply to the recovery position DP₁To DP₃So that the unloading work by the unloading device 160 is smoothly performed. As shown in fig. 7, the second stacker indicated by reference numeral 181 stores a tray for collection DTb on which electronic components determined to be defective are mounted, or stores a tray for collection DTa on which electronic components determined to be retested are mounted. In the second stacker denoted by

reference numerals

182 and 183, a tray DT for collection, on which electronic components determined to be good are mounted, is stored₂And DT₃。

The buffer device 190 is used to facilitate the proper movement of the electronic components by the loading device 120 and the unloading device 160, and includes a buffer stage 191, a mover 192, and a guide 193 as shown in fig. 5.

The buffer stage 191 is movable between the working area a of the loading device 120 and the working area B of the unloading device 160. Electronic parts to be tested may be temporarily loaded on such a buffer stage 191 as required, or a plurality of electronic parts whose testing is completed may be temporarily loaded as electronic parts under test. That is, the buffer stage 191 may be selectively located in the working area a of the loading device 120 and the working area B of the unloading device 160, so that interference between the loading device 120 and the unloading device 160 may be prevented, and may be flexibly applied to loading work by the loading device 120 and unloading work by the unloading device 160 as required. Of course, in the case of flexible application to the loading process, the buffer stage 191 moves to the loading device 120 side, and in the case of flexible application to the unloading process, the buffer stage 191 moves to the unloading device 160 side. In addition, it is sufficient to consider designing a shared space in which the loading device 120 and the unloading device 160 share with each other, and instead of fixing the buffer stage 191 in the corresponding shared space or stopping it at the corresponding shared space, by finely controlling the operations of the loading device 120 and the unloading device 160, so that mutual interference does not occur in the shared space.

The shifter 192 selectively positions the buffer stage 191 in the working area a of the loading device 120 and the working area B of the unloading device 160. That is, the mover 192 separates the working area a of the loading device 120 from the working area B of the unloading device 160 so as to avoid the mutual working interference between the loading device 120 and the unloading device 160. Of course, although the basic design policy is to prevent interference between the loading device 120 and the unloading device 160 according to a working error, as described above, the loading device 120 and the unloading device 160 may share a working area with each other according to circumstances, and the buffer stage 191 fixed to the corresponding shared area may be provided, in which case, the collision interference between the loading device 120 and the unloading device 160 may be prevented by control.

On the other hand, as shown in fig. 6 when viewed from the side, the buffer table 191 is located above the loading buffer plate 130 and the unloading buffer plate 170. Therefore, the buffer stage 191 may overlap the loading buffer plate 130 or the unloading buffer plate 170 when viewed from above. Because, it is possible to have efficiency and stability of driving by minimizing the working distance of the loading device 120 and the unloading device 160. That is, since the buffer stage 191 may be located at a position above the loading buffer plate 130 and the unloading buffer plate 170, it is possible to easily design to prevent overlapping of the work areas of the loading device 120 and the unloading device 160 and also to minimize the moving distance of the electronic components by the loading device 120 and the unloading device 160.

The guide rail 193 guides the buffer stage 191 to move left and right.

With continued reference to FIG. 1, it can be seen that the first stacker 110 is positioned to the left and forward, and the

second stackers

181, 182, 183 are disposed to the right and forward of the first stacker 110. Further, a buffer zone BZ is disposed between the first stacker 110 and the

second stacker

181, 182, and 183 and the loading position LP and the unloading position UP. The buffer zone BZ includes a loading buffer plate 130, an unloading buffer plate 170, and a buffer table 191. Further, a recognition device 140 is provided on the left side of the loading buffer plate 130.

The following describes the above-described sorter 100.

Basic work

The plurality of feeding trays ST located at the first stacker 110 are sequentially fed to the feeding position SP.

After simultaneously gripping four electronic components, the loader 120 moves the gripped electronic components to the test tray TT located at the loading position LP via the recognition position RP. In this process, when the electronic component is located at the recognition position RP, foreign substances are blown to both side surfaces of the electronic component through the flow path L, and then the plurality of electronic components held by the loader 120 are individually recognized by the barcode reader BR. Of course, the mounting direction of the plurality of electronic components is also determined at the same time as the recognition. The sequence of the operation of scraping the foreign matter, the identification operation and the judgment operation related to the loading direction can be changed as required, and the identification operation and the judgment operation can be simultaneously performed. In this process, the loader 120 recognizes the bar code and determines the mounting direction of the electronic components while holding the four electronic components. If the configuration is such that the barcode is recognized after a plurality of electronic components are placed on another tray or a shuttle, the barcode can be read, but since a portion in which the mounting direction can be confirmed is inserted into the tray or the shuttle, it is difficult to confirm the mounting direction. Even if the electronic component is mounted on the tray or the shuttle, the mounting direction can be confirmed to some extent. That is, the electronic component is mounted in a manner inclined with respect to the tray or the shuttle, or in a manner biased to one side, or in a case where the electronic component is not completely inserted, the barcode recognition position or the mounting direction determination position is changed every time, and therefore, the accuracy thereof is lowered. Further, there may occur a problem that it is necessary to confirm an abnormal loading state, deal with a corresponding error, and the like. Therefore, in the present embodiment, the loader device 120 performs operations of recognizing the barcode and determining the mounting direction of the electronic component while holding the electronic component.

Further, in the present embodiment, four (at least two or more) electronic components are simultaneously recognized, instead of recognizing the bar codes of the electronic components held by the loading device 120 one by one. That is, in a state where two or more remaining electronic components can be held, the recognition device 140 recognizes the barcode and determines the mounting direction of the electronic components at the same time.

On the other hand, the data of the recognized bar code is analyzed for confirming the identifier per electronic component and information related to the corresponding electronic component. Therefore, it is possible to confirm under which production condition the corresponding electronic component is produced, based on the inputted information.

For reference, the identifier of each electronic component and information related to the electronic component are transmitted to the tester side, where the test result of a specific electronic component is stored by being connected to the identifier of the specific electronic component. Also, the tester transmits information on the test result of the specific semiconductor element to the handler 100. Thus, the handler records and stores the information relating to the test results from the tester by associating it with the identifier of the particular electronic component. Thus, the handler can individually manage a plurality of electronic components. Of course, the information recorded and stored can be flexibly applied to retesting of electronic components, and when retesting is performed, retest results can also be managed as a history.

For reference, by individually identifying a plurality of electronic components, it is possible to record, for the respective electronic components, test results of the respective electronic components by binding them in a history provided in advance. Therefore, individual history management for each electronic component can be realized.

When the loading of the plurality of electronic components on the test tray TT located at the loading position LP is completed, the loading state of the plurality of electronic components is confirmed using the laser and the camera located at the side of the loading position LP. The test tray TT is transferred from the loading position LP to the test position TP by a transfer device not shown.

At the test position TP, the plurality of electronic components mounted on the test tray TT are electrically connected to the tester by the connection device 150, and then the electrical characteristics of the plurality of electronic components are tested by the tester.

After the test of the plurality of electronic components loaded thereon is completed, the test tray TT is transferred from the test position TP to the unloading position UP by a transfer device not shown.

The unloading device 160 unloads the plurality of electronic components loaded on the test tray TT positioned at the unloading position UP, and moves to the recovery position DP in a sorted manner according to the test result₁To DP₃The recovery tray (DT). Of course, the collecting trays DT located in the

second stackers

181, 182, and 183 are also sequentially supplied to the collecting position DP₁To DP₃。

When the first basic operation is completed, a second operation is performed as a retest operation to which the buffer stage 191 described later is flexibly applied.

Next, functions of the loading buffer plate 130, the unloading buffer plate 170, and the buffer stage 191, which are contributed in the loading process, the unloading process, and the retest process, will be described.

Loading process

The buffer plate 130 and the buffer stage 191 for loading may be used during the loading process.

For example, in the case where 50 electronic components are loaded on the supply tray ST and the loader 120 can simultaneously hold four electronic components, when 48 electronic components located on the supply tray ST are moved to the test tray TT, only two electronic components remain on the supply tray ST. In this case, the loader 120 moves to the test tray TT after the recognition process by gripping the remaining two electronic components, but in the present embodiment, in order to increase the work efficiency, after the remaining two electronic components are loaded on the loading buffer plate 130, the work of moving the plurality of electronic components of the supply tray ST newly supplied at the supply position SP to the test tray TT located at the loading position LP is first performed. Thus, the operation of mounting the two electronic components remaining in the predetermined cycle on the loading buffer plate 130 is performed, and when the number of the electronic components mounted on the loading buffer plate 130 is four or more, the operation of recognizing the bar codes together and moving the electronic components to the test tray TT is performed with four electronic components as a set. Further, in the case where a situation such as a test socket in the tester being closed (socket-off) occurs, the loading buffer plate 130 can be flexibly applied as a purpose for loading the reserved electronic components. Of course, the loader 120 may move to the test tray TT located at the loading position LP by holding four electronic components loaded on the loading buffer plate 130 later as necessary. In this process, the order of the plurality of electronic components is changed, but since the plurality of electronic components are individually managed by the recognition device 140, it is not necessary to consider the change of the order of the plurality of electronic components.

On the other hand, in the case where the loading buffer board 130 holds more than the number of electronic components that can be accommodated in the loading operation, the buffer stage 191 is flexibly applied. Therefore, when the loading buffer plate 130 is filled with the electronic components, the buffer stage 191 moves to the work area a of the loading device 120 to assist the loading work by the loading device 120.

For reference, when the test tray TT located at the loading position LP finishes loading the electronic components, a process of confirming whether the electronic components are properly loaded on the test tray TT using a laser and a camera may be performed.

Unloading process

The unloading buffer plate 170 and the buffer stage 191 may be used during the unloading process.

For example, when the unloading device 160 holds a plurality of electronic components determined to be good from the test tray TT located at the unloading position UP, the plurality of electronic components are moved to the second recovery position DP₂Or a firstThree recovery positions DP₃The recovery tray (DT). However, for example, when one of the plurality of electronic components held is determined to be defective, one is determined to be retested, and both are determined to be good, the one electronic component determined to be defective is mounted on the unloading buffer plate 170, the one electronic component determined to be retested is mounted on the buffer table 191, and then the two electronic components determined to be good are moved to be located at the second recovery position DP₂Or a third recovery position DP₃The recovery tray (DT).

The following is a processing method for explaining the number of retests performed during the unloading process.

Judging that the number of retests is small

When the number of retests is determined to be small and all of the retests can be loaded on the buffer table 191, the existing buffer table 191 located in the working area a of the loading device 160 is moved to the working area B of the loading device 120 after all of the tests related to the plurality of electronic components are completed. Further, by the operation of the loading device 120, the retest quantity is moved from the buffer stage 191 to the test tray TT located at the loading position LP. Of course, the plurality of electronic components located at the loading position LP moved again to the test tray TT are moved together with the test tray TT and subjected to the retest process. Therefore, the buffer zone BZ may be named as a return zone (return zone) for moving the electronic component determined to be retested to the loading position LP by the buffer stage 191.

Judging the case that the number of retests is large

When the buffer stage 191 is filled with the amount of the electronic components determined to be retested larger than the loading capacity of the buffer stage 191 during one test, or a fixed percentage (%) of the loading amount of the buffer stage 191 is filled in consideration of the interdependence between the buffer stage 191 and the loading device 120, the unloading device 160 moves the electronic components determined to be retested from the buffer stage 191 to the first recovery position DP where the electronic components are now supplied₁The recovery tray (DT). Then, the number of retests loaded on the recovery tray DT is transferred to the unloading buffer plate 170 by the unloading device 160, transferred to the buffer table 191, and sequentially transferred to the loading device 120The test tray TT is moved to the loading position LP after passing through the loading buffer plate 130 and the buffer stage 191. Of course, in such a movement flow of the retest number, the use of the loading buffer plate 130 or the unloading buffer plate 170 may be selectively omitted depending on the degree of the retest number.

On the other hand, for an appropriate movement sequence of the retest quantity, it is preferable to perform the first recovery position DP₁A tray DT for loading retests and a tray DT for loading defective trays are selectively provided. For example, as shown in the side views of fig. 7 and 8, the second stacker 181 includes a lift 181a, a lift frame 181b, and a plurality of retractors 181 c.

The lifter 181a lifts the lifting frame 181 b.

A plurality of the trays DTa and DTb for collection are vertically loaded on the lifting frame 181b so as to be spaced apart from each other by a predetermined distance.

The plurality of retractors 181c selectively retract and retract the plurality of recovery trays DT in the front-rear direction to position the plurality of recovery trays DTa and DTb at the recovery position DP₁Or retracted to the storage position.

Therefore, the plurality of recovery trays DTa and DTb of the second stacker 181 are lifted and selectively moved to the first recovery position DP₁The recovery tray DTa for loading the retest number and the recovery tray DTb for loading the defective number may be selectively positioned at the recovery position DP₁。

As described above, the loading buffer plate 130, the unloading buffer plate 170, and the buffer stage 191 function in the loading process, the unloading process, and the retest process, but these are merely examples. That is, the moving flow of the electronic component is varied depending on how the loading device 120, the unloading device 160, and the buffer device 190 are controlled, and the contribution of the loading buffer plate 130, the unloading buffer plate 170, and the buffer stage 191 to the moving flow of the electronic component is also varied.

Identifying various examples of bar code structures

In the above example, the case where the barcode is printed on one side surface (front surface or rear surface) of the electronic component is taken as an example, but as shown in fig. 9, the barcode B may be printed on the front surface and the rear surface of the electronic component D. In this case, it is necessary to read all the barcodes B located on both sides of the electronic component D. Thus, two barcode readers BR (which may be cameras) are provided between the two electronic components D.

On the other hand, fig. 10 shows an example in which two mirrors M are provided between two electronic components D, and one camera CM is used to simultaneously capture barcodes B printed on both sides of the electronic components D. In such a configuration of fig. 10, two adjacent mirrors M that reflect the barcode B to the camera CM side correspond to one camera CM, and therefore, the respective cameras CM simultaneously photograph two barcodes B printed on adjacent electronic components D reflected by the two mirrors M.

As described above, various barcode recognition structures are used in the present invention to simultaneously perform recognition of barcodes related to a plurality of electronic components in a state of being held by the loader 120. For example, when the electronic component is laid out horizontally and the bar code is exposed in the planar direction, a plurality of bar codes can be simultaneously recognized by one camera, but when a plurality of electronic components are held in a standing state by the loading device 120 of the present invention, a plurality of bar codes cannot be simultaneously recognized by one camera. When the barcodes are recognized one by one, the processing becomes complicated and the processing time becomes long, and therefore, a plurality of barcode recognition structures as described above are required.

Of course, as shown in fig. 11, it is also possible to sufficiently consider a configuration in which a plurality of barcodes related to a plurality of electronic components held by the loader 120 are simultaneously recognized by arranging a plurality of cameras CM such that the barcodes B of the electronic components D are inclined at a fixed angle.

As described above, although the present invention has been described by way of examples with reference to the accompanying drawings, the above-described examples are merely preferred examples for illustrating the present invention, and therefore, the present invention is not limited to the above-described examples, and the scope of the present invention should be understood as being defined by the scope of the present invention and its equivalents.

Claims

1. A sorter for testing electronic components is characterized in that,

the method comprises the following steps:

a test tray circulating along a circulating path passing through the loading position, the test position, and the unloading position and then connected to the loading position;

a loading device for loading a plurality of electronic components to be tested from a supply tray to the test tray located at the loading position;

a connecting device for electrically connecting the plurality of electronic components loaded on the test tray to a tester when the test tray loaded with the plurality of electronic components reaches the test position by the loading device;

an unloading device for unloading the electronic components from the test tray reaching the unloading position after the test of the loaded electronic components is completed at the test position, classifying the electronic components according to the test result, and moving the electronic components to a recovery tray;

a first stacker for receiving a plurality of supply trays loaded with a plurality of electronic components to be tested; and

a second stacker for storing a plurality of trays for collection for collecting a plurality of electronic components subjected to a test,

wherein, above-mentioned second stacker includes:

a lifting frame capable of loading a plurality of trays for recovery along the vertical direction with a predetermined interval;

a lifter for lifting the lifting frame; and

a plurality of driving and reversing devices for selectively driving and reversing the plurality of collecting trays loaded on the lifting frame to make the plurality of collecting trays positioned at the collecting position or returned to the storing position,

the plurality of advancing and retreating devices are arranged on the lifting frame which can be lifted and descended, the plurality of advancing and retreating devices can be lifted and descended together with the lifting frame,

a plurality of driving and reversing devices which are the same as the collecting tray and are loaded along the vertical direction with a predetermined interval, and are arranged corresponding to the collecting tray along the vertical direction with a predetermined interval;

the buffer table moves between the working area of the loading device and the working area of the unloading device;

when the loading amount of the buffer table is filled by a fixed percentage, the unloading device moves the plurality of electronic components determined to be retested from the buffer table to the tray for recovery supplied to the first recovery position.