CN114093793A - Automatic chip testing device and method - Google Patents
Automatic chip testing device and method Download PDFInfo
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- CN114093793A CN114093793A CN202111562543.9A CN202111562543A CN114093793A CN 114093793 A CN114093793 A CN 114093793A CN 202111562543 A CN202111562543 A CN 202111562543A CN 114093793 A CN114093793 A CN 114093793A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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Abstract
The invention provides an automatic chip testing device and a method, wherein the automatic chip testing device comprises: move and carry the module, move and carry the module and include: the vision mechanism obtains the position information of the chip to be tested; the moving mechanism is connected with the vision mechanism, receives the position information sent by the vision mechanism, and moves the chip to be tested to a testing station according to the position information; and the test module is connected with the transfer module and is used for testing the chip to be tested on the test station. According to the technical scheme, the position information of the chip to be detected is obtained by providing the transfer module with the vision mechanism and the moving mechanism, the chip to be detected is moved to the testing station according to the position information, the transfer speed of the chip to be detected is increased, and the detection efficiency is improved. The full-automatic chip test is realized by providing a test module, and the chip test efficiency is improved.
Description
Technical Field
The invention relates to the field of semiconductor manufacturing, in particular to an automatic chip testing device and method.
Background
With the widespread use of semiconductor integrated circuits, the degree of integration of chips is increasing, and the complexity of the chip manufacturing process is increasing. Since chips inevitably have defects during the manufacturing process, the chips need to be tested to identify and reject the failed chips. In some cases of the specific process, the chip must be tested after dicing and before packaging.
However, at present, chips are manually loaded, and the steps of probe and chip pin alignment, testing, classification and the like are required, so that the testing efficiency is low, and the requirement of large-scale automatic testing cannot be met.
Therefore, it is a technical problem to be solved to provide an automatic chip testing apparatus and method to improve the chip testing efficiency.
Disclosure of Invention
The invention aims to provide a device and a method for automatically testing a chip, so as to improve the testing efficiency of the chip.
In order to solve the above problems, the present invention provides an automatic chip testing apparatus, comprising: move and carry the module, move and carry the module and include: the vision mechanism obtains the position information of the chip to be tested; the moving mechanism is connected with the vision mechanism, receives the position information sent by the vision mechanism, and moves the chip to be tested to a testing station according to the position information; and the test module is connected with the transfer module and is used for testing the chip to be tested on the test station.
In some embodiments, the automatic chip testing apparatus further includes: and the loading module is connected with the transferring module and is provided with coding information.
In some embodiments, the loading module comprises: the tray, the tray has a plurality of chip stations, the chip station is used for placing the chip that awaits measuring.
In some embodiments, the loading module further comprises: the lifting basket is provided with a plurality of clamping grooves, and the clamping grooves are used for fixing the tray.
In some embodiments, the automatic chip testing apparatus further includes: and the storage module is connected with the test module and the loading module and is used for storing the test result obtained by the test module and the coding information of the loading module in a correlation manner so as to form a correlation record.
In some embodiments, the automatic chip testing apparatus further includes: and the sorting module is connected to the storage module and sorts the chips to be detected according to the association records.
In some embodiments, the automatic chip testing apparatus further includes: the identification module is connected to the loading module and identifies the coded information on the loading module.
In some embodiments, the test module comprises: and the test board card drives the chip to work and collects the output signal of the chip.
In some embodiments, the test module further comprises: the probe in-place detection mechanism is connected to the test board card, and when the probe in-place detection mechanism detects that the probe is in contact with the pin of the chip, the probe in-place detection mechanism outputs a signal to enable the test board card to drive the chip to work.
The invention also provides an automatic chip testing method, which comprises the following steps: providing a transfer module, wherein the transfer module comprises: the vision mechanism obtains the position information of the chip to be tested; the moving mechanism is connected with the vision mechanism, receives the position information sent by the vision mechanism, and moves the chip to be tested to a testing station according to the position information; and providing a test module which is connected with the transfer module and used for testing the chip to be tested on the test station.
According to the technical scheme, the position information of the chip to be tested is obtained by providing the transfer module with the vision mechanism and the moving mechanism, the chip to be tested is moved to the testing station according to the position information, the transfer speed of the chip to be tested is increased, automatic alignment is completed, and the detection efficiency is improved. The full-automatic chip test is realized by providing a test module, and the chip test efficiency is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic diagram of an automatic chip testing apparatus according to an embodiment of the present invention.
Fig. 2 is a schematic view of a grasping mechanism in an embodiment of the present invention.
Fig. 3 is a schematic view of a tray in an embodiment of the invention.
Fig. 4 is a schematic view of a basket in an embodiment of the present invention.
Fig. 5 is a schematic view of a moving mechanism in an embodiment of the invention.
FIG. 6 is a diagram of a test module according to an embodiment of the invention.
Fig. 7 is a schematic diagram of a radiation source transfer mechanism in an embodiment of the invention.
FIG. 8 is a diagram illustrating an exemplary method for automatically testing a chip according to an embodiment of the present invention.
Detailed Description
The following describes in detail specific embodiments of the automatic chip testing apparatus and method according to the present invention with reference to the accompanying drawings. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. That is, those skilled in the art will appreciate that they are merely illustrative of exemplary ways that may be implemented, and not exhaustive. Furthermore, the relative arrangement of the components and steps set forth in these embodiments does not limit the scope of the present invention unless specifically stated otherwise.
Fig. 1 is a schematic diagram of an automatic chip testing apparatus according to an embodiment of the present invention. Referring to fig. 1, the automatic chip testing apparatus includes: a transfer module M2, the transfer module M2 comprising: a vision mechanism 23 (see fig. 2) that obtains position information of the chip to be tested; a moving mechanism 5 (please refer to fig. 5) connected to the vision mechanism, for receiving the position information sent by the vision mechanism and moving the chip to be tested to a testing station according to the position information; and the test module M3 is connected with the transfer module M2 and is used for testing the chip to be tested on the test station.
In some embodiments, the transfer module M2 further includes a gripping mechanism 56 (see fig. 5). Fig. 2 is a schematic view of a grasping mechanism in an embodiment of the present invention. The grasping mechanism 56 includes: a 4-axis robot 21 and an end effector 22. In this embodiment, the vision mechanism 23 is mounted on the end effector 22, and the vision mechanism 23 is a vision camera for taking a picture of the chip surface. The end effector 22 is provided with a suction nozzle, the surface of the suction nozzle is provided with vacuum holes for sucking chips, and the suction nozzle is in contact with the blank area of the chip to avoid damaging the chip. In order to provide efficiency, a plurality of suction nozzles can be installed at the same time, and the number of times of movement of the gripping mechanism is reduced.
In this embodiment, the automatic chip testing apparatus further includes: and a loading module M1 connected to the transfer module M2, the loading module having encoded information. Fig. 3 is a schematic view of a tray in an embodiment of the invention. Referring now to fig. 3, the load module includes: the tray, the tray has a plurality of chip stations 31, chip station 31 is used for placing the chip that awaits measuring. In this embodiment, the line spacing and the column spacing of the chip station 31 are fixed, so that the moving mechanism can rapidly move the first chip to be tested on the line according to the sum of the moving distance of the first chip to be tested and the column spacing between the chips after the first chip to be tested is moved to the test station, the moving speed of the chip to be tested is increased, and the detection efficiency is improved. As shown in fig. 3, the tray has 5 rows and 5 columns of chip stations, and can be used for placing 25 chips, after the chips to be tested in the first row and the first column are transferred, the transfer distance of the moving mechanism to the chips to be tested in the first row and the second column is the sum of the transfer distance and the column pitch of the chips to be tested in the first row and the first column. In some embodiments, the bottom of the tray has a two-dimensional code, and the two-dimensional code of the tray is the coded information for recording the number information of the tray. In other embodiments, the tray number information may be recorded with an icon having an identification function, which is displayed on an area of the tray that is not covered.
Fig. 4 is a schematic view of a basket in an embodiment of the present invention. Referring now to fig. 4, the load module further includes: a basket having a plurality of slots 42, the slots 42 for securing the tray. In this embodiment, a two-dimensional code is arranged on the side surface of the basket, and the two-dimensional code is the coding information and is used for recording the number information of the basket. In this embodiment, the encoded information includes a two-dimensional code of the basket and a two-dimensional code of the tray. A tray can be placed into each clamping groove of the lifting basket, the distance between the clamping grooves is fixed, and the moving mechanism can accurately and quickly operate the next tray.
In some embodiments, the transfer module M2 further comprises: the tray clamping mechanism, the tray positioning mechanism and the tray conveying mechanism. The tray clamp is used for taking out the tray clamp in the lifting basket, conveying the tray to a material taking position through the conveying belt, and then controlling the tray clamp to press down the mechanism through the cylinder to fix the tray.
Referring to fig. 1, the automatic chip testing apparatus further includes: an identification module M6, connected to the loading module M1, that identifies the coded information on the loading module M1.
In this embodiment, the identification module M6 includes a code scanning gun for scanning code identification of the coded information on the baskets and/or trays.
With continuing reference to fig. 1, the automatic chip testing apparatus further includes: the storage module M4, the storage module M4 is connected with the test module M3 and the loading module M1, and stores the test result obtained by the test module and the coding information of the loading module in an associated manner to form an associated record. In this embodiment, the automatic chip testing apparatus further includes: the sorting module M5, the sorting module M5 is connected to the storage module M4, the sorting module M5 sorts the chips to be tested according to the association records, and the chips in a batch are uniformly sorted after all the chips are detected, so that the sorting efficiency is improved.
Fig. 5 is a schematic view of a moving mechanism in an embodiment of the invention. Referring now to fig. 5, the moving mechanism includes: a horizontal transfer mechanism 51, a guide rail mechanism 52, a vertical lifting mechanism 53, and a bin 54. The magazine 54 is used for placing the trays. In this embodiment, the code scanning gun 55 of the identification module M6 is connected to the moving mechanism to scan the bottom of the tray to obtain the coded information of the tray. In some embodiments, the grabbing mechanism 56 is disposed on the moving mechanism, so as to grab the chip, and the chip to be tested is moved to the testing station through cooperation of the horizontal transfer mechanism 51, the guide rail mechanism 52 and the vertical lifting mechanism 53 in the moving mechanism.
FIG. 6 is a diagram of a test module according to an embodiment of the invention. Referring now to fig. 6, the test module includes: and the test board card 61 drives the chip to work and collects the output signal of the chip by the test board card 61. In this embodiment, the test board 61 includes: the test system comprises a direct current source, a time sequence editor and a data acquisition card, wherein direct current voltage and time sequence are loaded on a chip through the direct current source and the time sequence editor to drive the chip to work, and output signals of the chip are acquired through the data acquisition card so as to test the chip.
In some embodiments, the test module further comprises: the probe in-place detection mechanism is connected to the test board card, and when the probe in-place detection mechanism detects that the probe is in contact with the pin of the chip, the probe in-place detection mechanism outputs a signal to enable the test board card to drive the chip to work. The test module further comprises: and the calculating mechanism is used for outputting a signal to the transferring module when the probe in-place detecting mechanism detects that the probe is not in contact with the pin of the chip, so that the vision camera is moved above the chip to photograph the surface of the photoelectric chip, calculating the position deviation between the pin position on the surface of the photoelectric chip and the probe corresponding to the pin through the calculating mechanism, and adjusting the position of the chip through the 4-axis robot 21 and the end effector 22 to align the pin of the chip and the probe.
In other embodiments, the test module further comprises: the device comprises an X-axis adjusting mechanism 62, a Y-axis adjusting mechanism 63, a Z-axis adjusting mechanism 64 and a rotary adjusting mechanism 65, and the position of the chip to be tested on the testing station is adjusted through the mechanisms. The test module further comprises: the vacuum platform 66 can be used for detecting the chip to be detected under the vacuum condition.
In some embodiments, the test module further comprises: radiation source transfer mechanism. Fig. 7 is a schematic diagram of a radiation source transfer mechanism in an embodiment of the invention. The radiation source transfer mechanism comprises: a horizontal transfer system 71, a vision system 72, a vertical transfer system 73, and a test radiation source 74. The test radiation source is used as an excitation light source of the chip in the optical test, and when the chip needs to be subjected to the optical test, the radiation source transfer mechanism moves the test radiation source to the upper side of the chip through a horizontal transfer system 71 and a vertical transfer system 73, and confirms the position of the chip through a vision system 72. In some embodiments, multiple test radiation sources may be provided, each as an excitation light source for the chip in different optical conditions, to more fully detect the optical performance of the optical chip. For example, the temperature of the first test radiation source is set to 20 deg.c and the temperature of the second test radiation source is set to 35 deg.c.
According to the technical scheme, the loading module M1 and the identification module M6 with the coded information are arranged, so that the chips to be detected are accurately identified, the transferring module M2 with the vision mechanism and the moving mechanism is used for accelerating the transferring speed of the chips to be detected, and the detection efficiency is improved. The alignment of chip pins and probes is realized through the probes of the test module M3 and the in-place probe detection mechanism, and the chip is tested by driving the chip to work and acquiring the output signals of the chip through the test board card of the test module M3. Through the storage module M4, the test result obtained by the test module and the coding information of the loading module are stored in an associated manner to form an associated record, so that the sorting module M5 can sort the chips to be tested according to the associated record, and the sorting efficiency is improved. The full-automatic chip testing is realized, and the chip testing efficiency is improved.
FIG. 8 is a diagram illustrating an exemplary method for automatically testing a chip according to an embodiment of the present invention. The chip automatic test method comprises the following steps: step S101, providing a transferring module, wherein the transferring module comprises: the vision mechanism obtains the position information of the chip to be tested; the moving mechanism is connected with the vision mechanism, receives the position information sent by the vision mechanism, and moves the chip to be tested to a testing station according to the position information; and step S102, providing a test module which is connected with the transfer module and used for testing the chip to be tested on the test station.
Fig. 1 is a schematic diagram of an automatic chip testing apparatus according to an embodiment of the present invention. Referring to fig. 1, the automatic chip testing apparatus includes: a transfer module M2, the transfer module M2 comprising: a vision mechanism (not shown) that obtains positional information of the chip to be tested; the moving mechanism (not shown) is connected with the vision mechanism, receives the position information sent by the vision mechanism, and moves the chip to be tested to a testing station according to the position information; and the test module M3 is connected with the transfer module M2 and is used for testing the chip to be tested on the test station.
In some embodiments, the transfer module M2 further comprises a gripping mechanism. Fig. 2 is a schematic view of a grasping mechanism in an embodiment of the present invention. The grabbing mechanism comprises: a 4-axis robot 21 and an end effector 22. In this embodiment, the vision mechanism 23 is mounted on the end effector 22, and the vision mechanism 23 is a vision camera for taking a picture of the chip surface. The end effector 22 is provided with a suction nozzle, the surface of the suction nozzle is provided with vacuum holes for sucking chips, and the suction nozzle is in contact with the blank area of the chip to avoid damaging the chip.
In this embodiment, the automatic chip testing apparatus further includes: and a loading module M1 connected to the transfer module M2, the loading module having encoded information. Fig. 3 is a schematic view of a tray in an embodiment of the invention. Referring now to fig. 3, the load module includes: the tray, the tray has a plurality of chip stations 31, chip station 31 is used for placing the chip that awaits measuring. In this embodiment, the line spacing and the column spacing of the chip station 31 are fixed, so that the moving mechanism can rapidly move the first chip to be tested on the line according to the sum of the moving distance of the first chip to be tested and the column spacing between the chips after the first chip to be tested is moved to the test station, the moving speed of the chip to be tested is increased, and the detection efficiency is improved. As shown in fig. 3, the tray has 5 rows and 5 columns of chip stations, and can be used for placing 25 chips, after the chips to be tested in the first row and the first column are transferred, the transfer distance of the moving mechanism to the chips to be tested in the first row and the second column is the sum of the transfer distance and the column pitch of the chips to be tested in the first row and the first column. In some embodiments, the bottom of the tray has a two-dimensional code for recording the number information of the tray. In other embodiments, the tray number information may be recorded with an icon having an identification function, which is displayed on an area of the tray that is not covered.
Fig. 4 is a schematic view of a basket in an embodiment of the present invention. Referring now to fig. 4, the load module further includes: a basket having a plurality of slots 42, the slots 42 for securing the tray. In this embodiment, a two-dimensional code is arranged on the side surface of the basket and used for recording the number information of the basket. A tray can be placed into each clamping groove of the lifting basket, the distance between the clamping grooves is fixed, and the moving mechanism can accurately and quickly operate the next tray.
In some embodiments, the transfer module M2 further comprises: comprises a tray clamping mechanism, a tray positioning mechanism and a tray conveying mechanism. The tray clamp is used for taking out the tray clamp in the lifting basket, conveying the tray to a material taking position through the conveying belt, and then controlling the tray clamp to press down the mechanism through the cylinder to fix the tray.
Referring to fig. 1, the automatic chip testing apparatus further includes: an identification module M6, connected to the loading module M1, that identifies the coded information on the loading module M1.
In this embodiment, the identification module M6 includes a code scanning gun for scanning code identification of the coded information on the baskets and/or trays.
With continuing reference to fig. 1, the automatic chip testing apparatus further includes: the storage module M4, the storage module M4 is connected with the test module M3 and the loading module M1, and stores the test result obtained by the test module and the coding information of the loading module in an associated manner to form an associated record. In this embodiment, the automatic chip testing apparatus further includes: the sorting module M5, the sorting module M5 is connected to the storage module M4, the sorting module M5 sorts the chips to be tested according to the association records, and the chips in a batch are uniformly sorted after all the chips are detected, so that the sorting efficiency is improved.
Fig. 5 is a schematic view of a moving mechanism in an embodiment of the invention. Referring now to fig. 5, the moving mechanism includes: a horizontal transfer mechanism 51, a guide rail mechanism 52, a vertical lifting mechanism 53, and a bin 54. The magazine 54 is used for placing the trays. In this embodiment, the code scanning gun 55 of the identification module M6 is connected to the moving mechanism to scan the bottom of the tray to obtain the coded information of the tray. In some embodiments, the grabbing mechanism 56 is disposed on the moving mechanism, so as to grab the chip, and the chip to be tested is moved to the testing station through cooperation of the horizontal transfer mechanism 51, the guide rail mechanism 52 and the vertical lifting mechanism 53 in the moving mechanism.
FIG. 6 is a diagram of a test module according to an embodiment of the invention. Referring now to fig. 6, the test module includes: and the test board card 61 drives the chip to work and collects an output signal of the chip. In this embodiment, the test board includes: the test system comprises a direct current source, a time sequence editor and a data acquisition card, wherein direct current voltage and time sequence are loaded on a chip through the direct current source and the time sequence editor to drive the chip to work, and output signals of the chip are acquired through the data acquisition card so as to test the chip.
In some embodiments, the test module further comprises: the probe in-place detection mechanism is connected to the test board card, and when the probe in-place detection mechanism detects that the probe is in contact with the pin of the chip, the probe in-place detection mechanism outputs a signal to enable the test board card to drive the chip to work. The test module further comprises: and the calculating mechanism is used for outputting a signal to the transferring module when the probe in-place detecting mechanism detects that the probe is not in contact with the pin of the chip, so that the vision camera is moved above the chip to photograph the surface of the photoelectric chip, calculating the position deviation between the pin position on the surface of the photoelectric chip and the probe corresponding to the pin through the calculating mechanism, and adjusting the position of the chip through the 4-axis robot 21 and the end effector 22 to align the pin of the chip and the probe.
In other embodiments, the test module further comprises: the device comprises an X-axis adjusting mechanism 62, a Y-axis adjusting mechanism 63, a Z-axis adjusting mechanism 64 and a rotary adjusting mechanism 65, wherein the positions of the chips to be tested on the testing station are adjusted through the mechanisms. The test module further comprises: the vacuum platform 66 can be used for detecting the chip to be detected under the vacuum condition.
In some embodiments, the test module further comprises: radiation source transfer mechanism. Fig. 7 is a schematic diagram of a radiation source transfer mechanism in an embodiment of the invention. The radiation source transfer mechanism comprises: a horizontal transfer system 71, a vision system 72, a vertical transfer system 73, and a test radiation source 74. The test radiation source 74 is used as an excitation light source for the chip in the optical test, and when the chip needs to be optically tested, the radiation source transfer mechanism moves the test radiation source 74 to the upper side of the chip through the horizontal transfer system 71 and the vertical transfer system 73, and confirms the position of the chip through the vision system 72. In some implementations, multiple test radiation sources may be provided, each as an excitation light source for the optical chip in different optical conditions, to improve test efficiency and more fully detect optical performance of the optical chip. For example, the temperature of the first test radiation source is set to 20 deg.c and the temperature of the second test radiation source is set to 35 deg.c.
According to the technical scheme, the position information of the chip to be tested is obtained by providing the transfer module with the vision mechanism and the moving mechanism, and the chip to be tested is moved to the testing station according to the position information, so that the transfer speed of the chip to be tested is increased. Through setting up loading module M1 and identification module M6 that have the coding information, realize the accurate discernment to the chip that awaits measuring, move the module M2 through moving that has vision mechanism and moving mechanism for the speed of moving the year to the chip that awaits measuring, improve detection efficiency. The alignment of chip pins and probes is realized through the probes of the test module M3 and the in-place probe detection mechanism, and the chip is tested by driving the chip to work and acquiring the output signals of the chip through the test board card of the test module M3. Through the storage module M4, the test result obtained by the test module and the coding information of the loading module are stored in an associated manner to form an associated record, so that the sorting module M5 can sort the chips to be tested according to the associated record, and the sorting efficiency is improved. The full-automatic chip testing is realized, and the chip testing efficiency is improved.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. An automatic chip testing device, comprising:
move and carry the module, move and carry the module and include:
the vision mechanism obtains the position information of the chip to be tested;
the moving mechanism is connected with the vision mechanism, receives the position information sent by the vision mechanism, and moves the chip to be tested to a testing station according to the position information;
and the test module is connected with the transfer module and is used for testing the chip to be tested on the test station.
2. The automatic chip test device according to claim 1, further comprising:
and the loading module is connected with the transferring module and is provided with coding information.
3. The automatic chip test apparatus according to claim 2, wherein the loading module comprises:
the tray, the tray has a plurality of chip stations, the chip station is used for placing the chip that awaits measuring.
4. The automatic chip test device according to claim 3, wherein the loading module further comprises:
the lifting basket is provided with a plurality of clamping grooves, and the clamping grooves are used for fixing the tray.
5. The automatic chip test device according to claim 2, further comprising:
and the storage module is connected with the test module and the loading module and is used for storing the test result obtained by the test module and the coding information of the loading module in a correlation manner so as to form a correlation record.
6. The automatic chip test device according to claim 5, further comprising: and the sorting module is connected to the storage module and sorts the chips to be detected according to the association records.
7. The automatic chip test device according to claim 2, further comprising: the identification module is connected to the loading module and identifies the coded information on the loading module.
8. The automatic chip test device according to claim 1, wherein the test module comprises: and the test board card drives the chip to work and collects the output signal of the chip.
9. The automatic chip test device according to claim 8, wherein the test module further comprises: the probe in-place detection mechanism is connected to the test board card, and when the probe in-place detection mechanism detects that the probe is in contact with the pin of the chip, the probe in-place detection mechanism outputs a signal to enable the test board card to drive the chip to work.
10. An automatic chip testing method is characterized by comprising the following steps:
providing a transfer module, wherein the transfer module comprises:
the vision mechanism obtains the position information of the chip to be tested;
the moving mechanism is connected with the vision mechanism, receives the position information sent by the vision mechanism, and moves the chip to be tested to a testing station according to the position information;
and providing a test module which is connected with the transfer module and used for testing the chip to be tested on the test station.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111562543.9A CN114093793A (en) | 2021-12-20 | 2021-12-20 | Automatic chip testing device and method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2023216568A1 (en) * | 2022-05-12 | 2023-11-16 | 中兴通讯股份有限公司 | Test device and test method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2023216568A1 (en) * | 2022-05-12 | 2023-11-16 | 中兴通讯股份有限公司 | Test device and test method |
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