CN110252685A - Sorting machine is used in electronic component test - Google Patents
Sorting machine is used in electronic component test Download PDFInfo
- Publication number
- CN110252685A CN110252685A CN201910446858.3A CN201910446858A CN110252685A CN 110252685 A CN110252685 A CN 110252685A CN 201910446858 A CN201910446858 A CN 201910446858A CN 110252685 A CN110252685 A CN 110252685A
- Authority
- CN
- China
- Prior art keywords
- mentioned
- test
- electronic component
- pallet
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 150
- 230000007246 mechanism Effects 0.000 claims abstract description 45
- 238000004064 recycling Methods 0.000 claims abstract description 38
- 238000013102 re-test Methods 0.000 description 31
- 238000000034 method Methods 0.000 description 29
- 230000008569 process Effects 0.000 description 24
- 238000011084 recovery Methods 0.000 description 15
- 230000003139 buffering effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 239000008186 active pharmaceutical agent Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000007726 management method Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 235000013399 edible fruits Nutrition 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/3412—Sorting according to other particular properties according to a code applied to the object which indicates a property of the object, e.g. quality class, contents or incorrect indication
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/06009—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code with optically detectable marking
- G06K19/06018—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code with optically detectable marking one-dimensional coding
- G06K19/06028—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code with optically detectable marking one-dimensional coding using bar codes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
- G06K7/10009—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
- G06K2007/10485—Arrangement of optical elements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Environmental & Geological Engineering (AREA)
- Electromagnetism (AREA)
- General Health & Medical Sciences (AREA)
- Artificial Intelligence (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The present invention relates to electronic component test sorting machines.Electronic component test sorting machine of the invention includes: loading device, for multiple electronic components to be tested to be loaded onto test pallet with pallet from supply;Attachment device, for being electrically connected the multiple electronic components for being loaded into above-mentioned test pallet with tester;Discharge mechanism, for unloading the multiple electronic components for completing to test from test pallet and keeping electronic component mobile to recycling pallet;And buffer unit, there is the buffer table that can be moved between the working region of above-mentioned loading device and the working region of above-mentioned discharge mechanism.And, as needed, buffer unit moves above-mentioned buffer table between the working region of above-mentioned loading device and the working region of above-mentioned discharge mechanism, so that above-mentioned buffer table be made to be flexibly applied to the load work carried out by above-mentioned loading device and the unloaded operation carried out by above-mentioned discharge mechanism.
Description
The application be the applying date be on 2 24th, 2017, application No. is 201710102266.0, entitled " electronics
The divisional application of the patent application of unit test sorting machine ".
Technical field
The present invention relates to the sorting machine of the electrical characteristics for testing the electronic component produced (handler).In particular, being related to
In the mobile technology for the electronic component that sorting machine carries out.
Background technique
Multiple electronic components such as semiconductor element or module storage after manufacture, are delivered after electrical characteristics are tested.This
When, it needs using the sorting machine for being electrically connected electronic component to be tested with tester.
In general, sorting machine includes test pallet, the first piler, loading device, attachment device, discharge mechanism and
Two pilers.
Test pallet is along the circulation for being then connected to loading position after loading position, test position and unloading position
Path and recycle.
First piler loads multiple multiple supply pallets for having electronic component to be tested for storing.By successively
The supply for being accommodated in this first piler is supplied with pallet to supply position, everything goes well with your work for the load for making by loading device
It carries out.
Multiple electronic components to be tested for being loaded onto the survey positioned at loading position by loading device from supply with pallet
Try pallet.
Attachment device is working as the test pallet arrival test position made by loading device to the completion load of multiple electronic components
When setting, it is electrically connected the multiple electronic components for being loaded into test pallet with tester.
Discharge mechanism is used for after test position is completed to the test for the multiple electronic components being loaded, and unloads position from reaching
The test pallet set unloads multiple electronic components, carries out classification according to test result and moves to recycling pallet.
Second piler is used to store the multiple recycling pallets for recycling the multiple electronic components for completing test.
This multiple recycling, by successively supplying to recovery position, make to go on smoothly by the unloaded operation of discharge mechanism with pallet.
But such as KR published patent the 10-2009-0063542nd, re-test is classified as after completing primary test
Multiple electronic components are supplied again to sorting machine and are needed by secondary re-test (Retest) process.It is used at this point, being loaded into recycling
The multiple electronic components for being classified as re-test of pallet are manually fed by operator to sorting machine.
Therefore, once the operating of the sorting machine between test and secondary re-test is terminated, this makes the operation ratio of sorting machine
Decline.
It on the other hand, such as KR published patent the 10-2009-0008062nd, is to help by the suitable of loading device
When load work, buffer table is set in sorting machine.
In general, buffer table has when can temporarily be loaded in load by the closing etc. for the test jack for being located at tester
The electronic component that necessity temporarily removes.Load work as a result, becomes smoothly, and loading velocity is improved.Wherein, it closes to extinguish
(OUT) whether test jack is the object closed for fc-specific test FC socket, can be changed according to the intention of designer.For example,
In the case that the improper judgement of setting number or more occurs in fc-specific test FC socket, it may be set to close the test jack.Moreover,
In the case where having the test jack closed, the ministry of electronics industry is not loaded on the position of the corresponding test jack of test pallet
Part, but the electronic component wait be loaded into the position is gathered, set to it is a certain amount of when remove to test pallet.The present invention
It is related to the flexible Application of this buffer table.
Summary of the invention
Technical problems to be solved
It is a first object of the present invention to provide making to load work, unloaded operation and again by flexible Application buffer table
Test jobs are gone on smoothly.
It is a second object of the invention to provide correctly holding flexible Application buffer table by identifying electronic component individually
Electronic component process technology.
The technical solution solved the problems, such as
Electronic component test sorting machine according to the first embodiment of the present invention includes: test pallet, along process
It is then connected to the circulating path of loading position after loading position, test position and unloading position and recycles;Loading device is used for
Multiple electronic components to be tested are loaded into pallet from supply to the above-mentioned test pallet positioned at above-mentioned loading position;Connection dress
It sets, when making the test pallet that multiple electronic components are completed with load reach above-mentioned test position by above-mentioned loading device, makes
The multiple electronic components for being loaded into above-mentioned test pallet are electrically connected with tester;Discharge mechanism, in the completion pair of above-mentioned test position
After the test for the multiple electronic components being loaded, multiple ministrys of electronics industry are unloaded from the above-mentioned test pallet for reaching above-mentioned unloading position
Part carries out classification according to test result and moves to recycling pallet;And buffer unit, having can be in above-mentioned loading device
Working region and above-mentioned discharge mechanism working region between the buffer table that moves, as needed, above-mentioned buffer unit makes
It states buffer table to make to move between region in the working region of above-mentioned loading device and above-mentioned discharge mechanism, to make above-mentioned buffering
Platform is flexibly applied to the load work carried out by above-mentioned loading device and the unloaded operation carried out by above-mentioned discharge mechanism.
The specific electronic components being classified as by test result re-test are loaded into and unload positioned at above-mentioned by above-mentioned discharge mechanism
Carry the above-mentioned buffer table for the working region set, above-mentioned loading device makes from the working region of above-mentioned discharge mechanism to above-mentioned load
Specific electronic components on the mobile above-mentioned buffer table in the working region of device are moved to the test pallet for being located at above-mentioned loading position
It is dynamic.
Above-mentioned electronic component test sorting machine further include: the first piler is mounted with multiple electricity to be tested for storing
Multiple supply pallets of subassembly;And second piler, the multiple electronic components for completing test are returned for storing
The multiple recycling pallets received, above-mentioned second piler, comprising: lifting frame, it can be by mutually there are in a manner of specified interval
Multiple recycling pallets are loaded along up and down direction;Lifter, for going up and down above-mentioned lifting frame;And multiple advance and retreat devices,
The multiple recycling for being loaded into above-mentioned lifting frame are made selectively to be retreated with pallet, so that multiple recycling pallets be made to be located at recycling
Position is retracted into reception position.
Electronic component test sorting machine according to the second embodiment of the present invention includes: test pallet, along process
Circulating path circulation is then connected to after loading position, test position and unloading position;Loading device, for will be to be tested more
A electronic component is loaded onto the above-mentioned test pallet positioned at above-mentioned loading position from supply with pallet;Attachment device, when by upper
When stating loading device makes the test pallet for completing multiple electronic components load reach above-mentioned test position, make to be loaded into above-mentioned survey
Multiple electronic components of examination pallet are electrically connected with tester;Discharge mechanism is completed multiple to what is be loaded in above-mentioned test position
After the test of electronic component, multiple electronic components are unloaded from the above-mentioned test pallet for reaching above-mentioned unloading position, are tied according to test
Fruit carries out classification and moves to recycling pallet;And identification device, it is loaded onto is located at by above-mentioned loading device for identification
Multiple electronic components of the above-mentioned test pallet of above-mentioned loading position, above-mentioned loading device will make the multiple electronic components held
It is mobile to the above-mentioned test pallet for being located at above-mentioned loading position by above-mentioned identification device, make it possible to by above-mentioned identification device
Identify the multiple electronic components held, above-mentioned identification device, comprising: camera, for shooting the item for being printed in electronic component
Shape code;And reader, for reading the bar code on the picture by the shooting of above-mentioned camera.
Above-mentioned identification device further includes reflecting mirror, corresponding with above-mentioned camera, will be printed in the bar code of electronic component
Reflex to above-mentioned camera.
Above-mentioned loading device identifies bar code in the state of holding electronic component.
Above-mentioned identification device further includes foreign matter removal mechanism, for removing the foreign matter of electronic component.
Above-mentioned loading device can hold multiple electronic components, and above-mentioned identification device is for identification and in by above-mentioned load
The bar code of multiple electronic components in the state of device holding.
Above-mentioned reader also reads the loading side of above-mentioned electronic component together by the picture shot by above-mentioned camera
To.
The identification and electronic component that carry out bar code together by above-mentioned identification device load the reading in direction.
Advantageous effect of the invention
According to present invention as described above, have the following effects that.
The first, since buffer table to be flexibly applied to load work, unloaded operation and re-test operation, so that with minimum
Additional structure carrys out the mobile process of optimization of electronic component, to have the effect for the operation ratio for being finally greatly improved sorting machine
Fruit.
The second, electronic component is identified individually by using identification device, so as to support the ministry of electronics industry for utilizing buffer table
The mobile process of part.
Third, identification device are by the additional identification function for identifying electronic component, to obtain the loading direction of electronic component
Read functions and electronic component foreign matter remove function, so that the effective use and design of identification device can be realized.
Detailed description of the invention
Fig. 1 is the conceptual top view according to the electronic component test sorting machine of one embodiment of the invention.
Fig. 2 and Fig. 3 is the attached drawing for illustrating the identification device of the sorting machine suitable for Fig. 1.
Fig. 4 is example relevant to electronic component to be tested view.
Fig. 5 is schematic top relevant to the buffer unit of sorting machine of Fig. 1 is suitable for.
Fig. 6 be for illustrate be suitable for Fig. 1 sorting machine load buffer board/between unloading buffer board and buffer table
Difference in height attached drawing.
Fig. 7 and Fig. 8 is for illustrating to make recycling pallet be located at recovery position in the second piler for being suitable for sorting machine
Technology attached drawing.
Fig. 9 to Figure 11 is the example for showing the bar code for shooting electronic component.
The explanation of appended drawing reference
100: sorting machine is used in electronic component test
TT: test pallet
120: loading device
130: buffer board is used in load
140: identification device
150: attachment device
160: discharge mechanism
170: buffer board is used in unloading
190: buffer unit
191: buffer table
192: shifter
Specific embodiment
As described above, multiple preferred embodiments according to the present invention illustrate by referring to accompanying drawing, but succinct to illustrate
Property, repeat description is omitted or compressed as far as possible.
Fig. 1 is the (hereinafter referred to as " sorting of electronic component test sorting machine 100 according to one embodiment of the invention
Machine ") conceptual top view.
The sorting machine of Fig. 1 include test pallet TT, the first piler 110, loading device 120, load buffer board 130,
Identification device 140, discharge mechanism 160, unloads with buffer board 170, the second piler 181,182,183 and delays attachment device 150
Flushing device 190.
Test pallet TT is loaded along LP is then connected to after loading position LP, test position TP and unloading position UP
The circulating path C of position and recycle.This test pallet TT is for connecting loading position LP, test position TP and unloading position UP
Electronic component movement.That is, multiple electronic components are loaded into the state of test pallet TT in loading position LP, by test
After the TP of position, it is moved to unloading position UP.
In the first piler 110, it is accommodated with the multiple supply pallet ST for loading multiple electronic components to be tested.Storage
Passed through in multiple supplies of this first piler 110 with pallet ST and successively supplied to supply position SP, can make to fill by load
Set 120 load everything goes well with your work carry out.The knot that this first piler 110 directly can be loaded supply pallet ST by operator
Structure is constituted, and can also be made of multiple supplies with the structure that pallet ST accommodates the trolley loaded.
As reference, supply position SP upside or supply with pallet ST waited before entering supply position SP etc.
Waiting may be provided with camera CM on the upside of the WP of position.In the case, confirmed in advance since camera CM can be passed through and be loaded into confession
It, can suitable control loading device 120 to (" loaded " position or quantity) whether the loading of multiple electronic component D of pallet ST.When
So, since supply position SP belongs to the working region of loading device 120, it is preferable that such as the present embodiment, waiting the upper of position WP
Side's setting camera CM.
Loading device 120 makes multiple electronic components to be tested be loaded onto position with pallet ST from the supply positioned at supply position SP
In loading position LP test pallet TT.
Load is with buffer board 130 for temporarily loading multiple electronic components to be tested according to demand.This load buffering
Plate 130 is fixed setting.Therefore, above-mentioned loading device 120 executes following operation according to control situation, that is, by the multiple of holding
Electronic component is loaded into load buffer board 130, or the multiple electronic components for being loaded into load buffer board 130 are moved to position
In the test pallet TT of loading position LP.
Identification device 140 is for identification in the case where being in gripping state by loading device 120, and from supply position, ST is moved to
Multiple electronic components of the process of loading position LP.As long as this identification device 140 can identify individually multiple electronic components
?.Therefore, it can be made of bar code reader or camera, in this case it is necessary to which being printed in electronic component can be by
Bar code or the identification code of camera identification.Moreover, when plane is overlooked, the multiple ministrys of electronics industry of the loading device 120 will hold
Mode control of the part by being moved to the test pallet TT positioned at loading position LP after the identification position RP for being provided with identification device 140
System, so that identifying electronic component by identification device 140.Also, thus it is necessary to when, loading device 120 can be held more
A electronic component temporarily stops at identification position RP, in turn, more or less retreats multiple electronic components in identification position RP, thus
The electronic component correctly identified by identification device 140.
An example related with identification device 140 is shown in FIG. 2.Identification device 140 is by four bar code reader BR structures
At four bar code reader BR are separated at predetermined intervals.This bar code reader BR can be camera, and have by anti-
Mirror M is penetrated to shoot the structure of bar code B.Certainly, loading device 120 can hold simultaneously four ministrys of electronics industry with state spaced apart from each other
The side of part D, electronic component D need printed bar code.In the example of Fig. 2, loading device 120 can be by four ministrys of electronics industry of holding
Part D temporarily declines, as shown in figure 3, after multiple electronic component D are placed in multiple reflecting mirror M, it, will for correct identification bar code
Multiple electronic component D more or less advance and retreat forward and backward, make multiple bar code reader BR identify multiple electronic component D's
Bar code.Certainly, when completing the identification bar code by multiple bar code reader BR, reader DA is read by bar code
Bar code on the picture of reader BR shooting.In the case where the bar code reader BR of such as the present embodiment is camera, read
Whether can by bar code reflect picture to confirm the loading direction of electronic component D, can also be whole by flexible Application if taking device DA
Body picture reads the form (direction flute profile state of Fig. 4 etc.) in the region other than bar code, to confirm the loading of electronic component D
Direction.
Also, the flow path L for being blown into wind to electronic component D is formed in identification device 140.Therefore, because can pass through
Flow path L is blown into wind to electronic component D, can be out of the foreign matter of electronic component D.That is, flow path L has as removing electronic component
The function of the foreign matter removal mechanism of the foreign matter of D.It is of course also possible to using attracting or stroking tool (brush) out of the structure structure of foreign matter
At.Moreover, needing in addition to be arranged the space of trapping foreign matter in the case where attraction.
In the present embodiment, identification device 140 can identify that four electronic component D, loading device 120 can also be by simultaneously simultaneously
The structure of mobile four electronic component D is constituted, although quantity or mobile quantity can be identified according to implementing to increase or decrease.
As reference, in the present embodiment, read using the bar code reader BR being made of camera with reflecting mirror M
The loading direction of the bar code of electronic component and confirmation electronic component, but can be by being divided into two functions according to specific implementation
Mutually different structure executes.For example, being formed with multiple directions slot DS in electronic component D as shown in Figure 4.It is this multiple
Direction slot DS can be used in the loading direction for reading electronic component D.That is, by utilizing light-emitting component and light receiving element, by hair
Whether the light of optical element direction slot DS irradiation identifies by light receiving element, to read the loading direction of electronic component D.And
And the bar code of electronic component D can be identified by camera or reader.
When completing to load the test pallet TT arrival test position TP of multiple electronic components by loading device 120, even
The multiple electronic components for being loaded into test pallet TT are electrically connected by connection device 150 with tester.
Discharge mechanism 160 is unloaded after loading multiple electronic components that test position TP is loaded and completing test from reaching
The test pallet TT of position UP unloads multiple electronic components, classifies according to test result to it, and be moved to positioned at recovery position
DP1To DP3Recycling pallet DT1To DT3。
Unloading is with buffer board 170 for temporarily loading the multiple electronic components for completing test according to demand.This unloading is used
Buffer board 170 is fixed setting.Therefore, above-mentioned discharge mechanism 160 executes following operation according to control situation, that is, will unload
Position UP or recovery position DP1To DP3The multiple electronic components held are loaded into unloading buffer board 170, or will be loaded into unloading
It is moved to multiple electronic components of buffer board 170 positioned at recovery position DP1To DP3Recycling pallet DT1To DT3。
Multiple recycling support of multiple electronic components of test is completed in the storage of second piler 181,182,183 for recycling
Disk DT1To DT3.This multiple recycling pallet DT1To DT3By successively supplying to recovery position DP1To DP3, so that by unloading
It carries and sets 160 unloaded operation and go on smoothly.Wherein, as shown in fig. 7, being stored in the second piler that appended drawing reference is 181
It is mounted with the recycling pallet DTb for being judged as undesirable electronic component, or storage is mounted with the electronic component for being judged as re-test
Recycling pallet DTa.Moreover, storage, which is mounted with, is judged as good in the second piler that appended drawing reference is 182 and 183
Electronic component recycling pallet DT2And DT3。
Buffer unit 190 is used to help the appropriate movement by the electronic component of loading device 120 and discharge mechanism 160,
As shown in figure 5, including buffer table 191, shifter 192 and guide rail 193.
Buffer table 191 can move between the working region A of loading device 120 and the working region B of discharge mechanism 160.
According to demand electronic component to be tested, or the interim multiple electronics for loading completion test can be temporarily loaded in this buffer table 191
It is classified as the electronic component in test in component.That is, buffer table 191 is due to the alternative work for being located at loading device 120
The working region B of region A and discharge mechanism 160, can prevent the interference of loading device 120 and discharge mechanism 160, and according to demand
It is flexibly applied to by the load work of loading device 120 and by the unloaded operation of discharge mechanism 160.Certainly, it is flexibly answering
In the case where loading procedure, buffer table 191 is moved to 120 side of loading device, in the feelings for being flexibly applied to uninstall process
Under condition, buffer table 191 is moved to 160 side of discharge mechanism.In addition, design loading device 120 and discharge mechanism can be fully considered
The 160 mutually shared communal spaces, instead of buffer table 191 is fixed on the corresponding communal space or stops at the corresponding communal space,
By the accurate work for controlling loading device 120 and discharge mechanism 160, so that not conflicting with each other interference in the communal space.
Shifter 192 makes buffer table 191 be selectively located at the working region A of loading device 120 and the work of discharge mechanism 160
Make region B.That is, shifter 192 is to avoid loading device 120 to interfere with the mutual work of discharge mechanism 160, load can be made to fill
120 working region A is set to separate with the working region B of discharge mechanism 160.Certainly, although Basic Design policy is according to work
Mistake prevents the interference between loading device 120 and discharge mechanism 160, but as described above, according to circumstances makes loading device 120
With the mutually shared working region of discharge mechanism 160, the settable buffer table 191 for being fixed on corresponding shared region, in the case,
Conflict interference of the loading device 120 with discharge mechanism 160 can be prevented by control.
On the other hand, buffer table 191 is located at as shown in the Fig. 6 observed in side compared to load buffer board 130 and unloading
With the position of 170 top of buffer board.Therefore, when overlooking, buffer table 191 can be with load buffer board 130 or unloading buffering
Plate 170 is overlapped.Because can be by the operating distance of minimum loading device 120 and discharge mechanism 160, to have the effect of driving
Forthright and stability.That is, since buffer table 191 can be located at compared to 170 top of load buffer board 130 and unloading buffer board
Position, therefore can be easy to design the overlapping for the working region for preventing loading device 120 and discharge mechanism 160, it can also minimize
By the moving distance of loading device 120 and the electronic component of discharge mechanism 160.
Guide rail 193 is for guiding moving left and right for buffer table 191.
With continued reference to Fig. 1, it is known that the first piler 110 is located in front of left side, and the second piler 181,182,183 is configured at
The right side and front of first piler 110.Moreover, in the first piler 110 and the second piler 181,182,183 and load position
It sets between LP and unloading position UP configured with buffer area BZ.This buffer area BZ includes load buffer board 130, unloading use
Buffer board 170 and buffer table 191.Moreover, being provided with identification device 140 with the left side of buffer board 130 in load.
Hereinafter, being illustrated for sorting machine 100 as described above.
Groundwork
The multiple supplies for being located at the first piler 110 are successively supplied with pallet ST to supply position SP.
After loading device 120 holds four electronic components at the same time, by multiple electronic components of holding by identification position
RP is moved to the test pallet TT positioned at loading position LP.In the process, when electronic component is located at identification position RP, pass through
Flow path L, which is blown into wind to the two sides of electronic component, to be come after foreign matter, by bar code reader BR for 120 institute of loading device
The multiple electronic components held are identified individually.Certainly, the loading direction of multiple electronic components is also judged while identification.
It wherein, can be according to need out of the operation that the operation of foreign matter, identification operation and the judgement sequence of operation related with direction is loaded carry out
Random transformation is asked, identification operation can also be carried out simultaneously and judges operation.On the other hand, in the process, loading device 120 is in handle
In the state of holding four electronic components, identification bar code and the loading direction for judging electronic component.If with by multiple electronic components
Identify that the structure of bar code is constituted after being placed on other pallet or shuttle, though then readable bar code, due to that can confirm loading
The partial insertion in direction is difficult to confirm and loads direction in pallet or shuttle.Also, even if in the shape for being loaded into pallet or shuttle
It is able to confirm that a certain extent under state and loads direction, premise is necessary for electronic component and is correctly inserted on pallet or shuttle.
That is, electronic component is relative to pallet or the inclined mode of shuttle is installed or, amesiality mode is installed, or is being not fully inserted into
In the case where, therefore bar code recognition position or loading walking direction position, reduce its correctness each time with change.Moreover,
It can need to confirm improper loading condition, handle the problem of corresponding mistake etc..Therefore, in the present embodiment, loading device
120 in the state of holding electronic component, carries out identification bar code and judges the operation in the loading direction of electronic component.
In turn, in the present embodiment, the bar code for the electronic component that not identification loading device 120 is held one by one, and
It is to identify four (at least two) electronic components simultaneously.That is, in the state of can hold more than two excess electron components,
Identification bar code is carried out simultaneously by identification device 140 and judges the loading direction of electronic component.
On the other hand, analyze identified bar code data be used for confirm by electronic component identifier and with corresponding electricity
The related information of subassembly.Therefore, can confirm corresponding electronic component is raw under which kind of working condition according to the information inputted
It produces.
As reference, it is sent to tester side by the identifier and information related with electronic component of electronic component,
Tester side is stored by the way that the test result of specific electronic components is connected with the identifier of specific electronic components.And
And information related with the test result of particular semiconductor element is sent to sorting machine 100 by tester.Sorting machine is logical as a result,
The information related with test result for transmitting tester is crossed to be connected with the identifier of specific electronic components to record and store.
Sorting machine can the multiple electronic components of individual management as a result,.Certainly, the ministry of electronics industry can be flexibly applied to when the information for recording and storing
Re-test result can be also used as resume to manage by the re-test of part in the case where carrying out re-test.
It, can be for corresponding electronic component, by being provided previously by identifying multiple electronic components individually as reference
The test result of corresponding electronic component is bundled in resume to record.Therefore, it can be achieved that individual record managements of each electronic component.
When completing to load multiple electronic components on the test pallet TT positioned at loading position LP, position is loaded using being located at
The laser and camera of setting the side LP confirm the loading condition of multiple electronic components.Moreover, being surveyed by transfer device (not shown)
It tries pallet TT and is transferred to test position TP from loading position LP.
In test position TP, multiple electronic components of test pallet TT are loaded by attachment device 150 and tester
Electrical connection carries out the electrical characteristics test of the multiple electronic components carried out by tester later.
After the multiple electronic components test being loaded, test pallet TT is by transfer device (not shown) from test
Position TP is transferred to unloading position UP.
Discharge mechanism 160 is unloaded the multiple electronic components for being located at the test pallet TT of unloading position UP are loaded into,
And it is moved to according to test result classification positioned at recovery position DP1To DP3Recycling pallet DT.Certainly, it is located at the second piler
181,182,183 recycling is also successively supplied with pallet DT to recovery position DP1To DP3。
When terminate above-mentioned first it is basic when, carry out work as the re-test of the aftermentioned buffer table 191 of flexible Application the
Two work.
It next it will be described for the load buffer board 130 contributed during loading procedure, uninstall process and re-test, unload
Carry the function with buffer board 170 and buffer table 191.
Loading procedure
Load buffer board 130 and buffer table 191 can use during loading.
For example, being mounted with 50 electronic components with pallet ST in supply, four electronics can be held simultaneously in loading device 120
In the case where component, when being moved to test pallet TT with 48 electronic components of pallet ST positioned at supply, only there are two electronics
Component stays in supply pallet ST.In the case, loading device 120 is by holding remaining two electronic components come by identification
It is moved to test pallet TT after process, but in the present embodiment, to increase operating efficiency, two electronic components of residue are loaded into
After load buffer board 130, being first carried out will move in multiple electronic components of the newly supplied supply pallet ST of supply position SP
It moves to the operation of the test pallet TT positioned at loading position LP.With this, carrying out will be in remaining two electronic component of specified period
It is loaded into the operation of load buffer board 130, is four or more in the multiple electronic components for being loaded into load buffer board 130
When, the operation for identifying bar code together, being moved to test pallet TT is executed as one group by four.Moreover, being located at
In the case that the test jack of tester is closed situations such as (socket-off), also can be used as load load be retained
The purposes of electronic component carrys out flexible Application load buffer board 130.Certainly, loading device 120 can be hereafter necessary subsequent, passes through
Holding four is loaded into load and is moved to the test pallet positioned at loading position LP with multiple electronic components of buffer board 130
TT.In the process, the sequence of multiple electronic components can change, but due to multiple by 140 individual management of identification device
Electronic component, therefore the change of the sequence without the concern for multiple electronic components.
On the other hand, in load work, load buffer board 130 retains the electronic component of the quantity that can be accommodated or more
In the case of, flexible Application buffer table 191.Therefore, when load is with full electronic component is filled in buffer board 130, pass through buffer table
191 are moved to the working region A of loading device 120 to help the load work by loading device 120.
It can be carried out when the test pallet TT positioned at loading position LP completes load electronic component using sharp as reference
Light and camera confirm whether electronic component is suitably loaded into the process of test pallet TT.
Uninstall process
Unloading buffer board 170 and buffer table 191 can use in uninstall process.
It is judged as good multiple electricity for example, holding in discharge mechanism 160 from the test pallet TT positioned at unloading position UP
In the case where subassembly, multiple electronic components are moved to positioned at the second recovery position DP2Or third recovery position DP3Recycling
With pallet DT.But for example, in multiple electronic components of holding one for it is bad judgement, one be re-test judgement, two
In the case where well judging, it will be deemed as a undesirable electronic component and be loaded into unloading buffer board 170, be judged as and survey again
After one electronic component of examination is loaded into buffer table 191, it will be deemed as good two electronic components and be moved to positioned at second time
Receive position DP2Or third recovery position DP3Recycling pallet DT.
The following are the processing methods for the re-test quantity that explanation carries out in uninstall process.
It is judged as the few situation of the quantity of re-test
When can load the quantity of whole re-tests in buffer table 191 due to the quantity because being judged as re-test is few, tying
After Shu Suoyou primary test related with multiple electronic components, the existing buffer table for carrying the working region A for setting 160 will be located at
191 are moved to the working region B of loading device 120.Moreover, by the work of loading device 120, by re-test quantity from buffering
Platform 191 is moved to the test pallet TT positioned at loading position LP.Certainly, it is moved to test pallet TT again positioned at loading position LP
Multiple electronic components moved together with test pallet TT, and pass through re-test process.Therefore, buffer area BZ can be named as by
It is judged as that the electronic component of re-test is moved to the return area (return zone) of loading position LP by buffer table 191 again.
It is judged as the situation more than the quantity of re-test
In a test process, because be judged as the quantity of re-test compared to buffer table 191 struck capacity more than due to make
Buffer table 191 is filled full, or in view of the relation of interdependence between buffer table 191 and loading device 120, fills buffer table
When fixed percentage (%) of 191 useful load, discharge mechanism 160 will be deemed as multiple electronic components of re-test from buffer table
191 are moved to and are supplied to the first recovery position DP now1Recycling pallet DT.Moreover, being hereafter loaded into recycling pallet DT
Re-test quantity move to unloading buffer board 170 by discharge mechanism 160 after, then be moved to buffer table 191, filled by load
It sets 120 and is successively moved to test pallet TT positioned at loading position LP again after load buffer board 130 and buffer table 191.
Certainly, in the mobile process of this re-test quantity, load buffering is omitted according to the degree alternative of re-test quantity
Plate 130 or the unloading use of buffer board 170.
It on the other hand, is the appropriate mobile process of re-test quantity, it is preferable that in the first recovery position DP1Selectivity is set
The recycling for loading re-test quantity is set with pallet DT and for the recycling pallet DT of improper stowage quantity.For example, such as Fig. 7
And shown in the side view of Fig. 8, the second piler 181 includes lifter 181a, lifting frame 181b, multiple advance and retreat device 181c.
Lifter 181a is for going up and down lifting frame 181b.
Multiple recycling pallets are vertically loaded in the mode that lifting frame 181b can be spaced from each other constant spacing
DTa、DTb。
Multiple advance and retreat device 181c make multiple recycling selectively be retreated forward and backward with pallet DT, so that multiple recycling be made to use
Pallet DTa, DTb are located at recovery position DP1Or it is retracted into reception position.
Therefore, because multiple recycling of the second piler 181 are gone up and down with pallet DTa, DTb and are selectively moved to first time
Receive position DP1, for loading the recycling of re-test quantity with pallet DTa and for the recycling pallet DTb of improper stowage quantity
Alternative is located at recovery position DP1。
Although as described above, observed during loading procedure, uninstall process and re-test load buffer board 130,
The effect of unloading buffer board 170 and buffer table 191, but this is only that simple part illustrates.That is, according to how to control load
Device 120, discharge mechanism 160, buffer unit 190 come make the mobile process of electronic component become multiplicity, load use buffer board
130, unloading buffer board 170 and buffer table 191 can also change the contribution of the mobile process of electronic component.
Identify a variety of examples of Structure of Bar-code
In above-mentioned example, it will be lifted the case where the one side of electronic component (forward face or rear) is printed with bar code and be
Example, but as shown in figure 9, bar code B can print the forward face and rear in electronic component D.In the case, it is necessary to read
Whole bar code B positioned at the two sides of electronic component D.Two bar code reader BR are set between two electronic component D as a result,
(can be camera).
On the other hand, Figure 10 is that two reflecting mirror M are arranged between two electronic component D, thus with a camera CM
Shooting is respectively printed at the example of the bar code B of the two sides electronic component D simultaneously.In the structure of this Figure 10, bar code B is reflected
Adjacent two reflecting mirror M to the side camera CM is corresponding with a camera CM, and therefore, corresponding camera CM is shot simultaneously
Two bar code B for being printed in adjacent electronic component D of two reflecting mirror M reflections.
As described above, a variety of bar code recognition structures are used for the present invention in the state of holding by loading device 120, together
The identification of Shi Zhihang bar code relevant to multiple electronic components.For example, when electronic component by traverse, bar code to in-plane
When exposure, multiple bar codes can be identified simultaneously with a camera, but in loading device 120 such as of the invention with standing state
In the case where holding multiple electronic components, multiple bar codes can not be identified simultaneously with a camera.If identifying bar shaped one by one
Code then makes processing become complicated, and the processing time also can be elongated, and therefore, it is necessary to a variety of bar code recognition structures as described above.
Certainly, as shown in figure 11, can also fully consider by making the bar code B of multiple electronic component D incline with fixed angle
Oblique mode configures multiple camera CM, to identify simultaneously related with the multiple electronic components held by loading device 120
Multiple bar codes structure.
Although above-described embodiment is only as described above, present invention embodiment by referring to accompanying drawing is illustrated
For illustrating preference of the invention, therefore, the present invention is not limited to the above embodiment, and range is claimed in invention of the invention
It is interpreted as invention of the invention and range and its equivalents is claimed.
Claims (11)
1. a kind of electronic component test sorting machine, which is characterized in that
Include:
Test pallet, along the circulating path for being then connected to loading position after loading position, test position and unloading position
Circulation;
Loading device, for being loaded onto multiple electronic components to be tested with pallet positioned at above-mentioned loading position from supply
State test pallet;
Attachment device, when making the test pallet that multiple electronic components are completed with load reach above-mentioned test by above-mentioned loading device
When position, it is electrically connected the multiple electronic components for being loaded into above-mentioned test pallet with tester;
Discharge mechanism, after above-mentioned test position is completed to the test for the multiple electronic components being loaded, from the above-mentioned unloading of arrival
The above-mentioned test pallet of position unloads multiple electronic components, carries out classification according to test result and moves to recycling pallet;With
And
Identification device is loaded onto the more of the above-mentioned test pallet positioned at above-mentioned loading position by above-mentioned loading device for identification
A electronic component,
Above-mentioned loading device makes the multiple electronic components caught by above-mentioned identification device to positioned at the upper of above-mentioned loading position
Test pallet movement is stated, makes it possible to identify the multiple electronic components caught by above-mentioned identification device,
Above-mentioned identification device, comprising:
Camera, for shooting the bar code for being printed in electronic component;And
Reader, for reading the bar code on the picture by the shooting of above-mentioned camera.
2. electronic component test sorting machine according to claim 1, which is characterized in that
Above-mentioned identification device is arranged to be inclined at an angle, to identify the bar code for being printed in above-mentioned electronic component.
3. electronic component test sorting machine according to claim 1, which is characterized in that caught in above-mentioned loading device
Bar code is identified in the state of electronic component.
4. electronic component test sorting machine according to claim 1, which is characterized in that
Above-mentioned loading device can catch multiple electronic components,
Above-mentioned identification device is for once identifying the item of multiple electronic components in the state of being caught by above-mentioned loading device
Shape code.
5. electronic component according to claim 1 test sorting machine, which is characterized in that above-mentioned reader also by by
The picture of above-mentioned camera shooting reads the loading direction of above-mentioned electronic component together.
6. electronic component test sorting machine according to claim 5, which is characterized in that together by above-mentioned identification device
The identification and electronic component that carry out bar code load the reading in direction.
7. electronic component test sorting machine according to claim 1, which is characterized in that above-mentioned identification device further includes different
Object removal mechanism, for removing the foreign matter of electronic component.
8. a kind of electronic component test sorting machine, which is characterized in that
Include:
Test pallet, along the circulating path for being then connected to loading position after loading position, test position and unloading position
Circulation;
Loading device, for being loaded onto multiple electronic components to be tested with pallet positioned at above-mentioned loading position from supply
State test pallet;
Attachment device, when making the test pallet that multiple electronic components are completed with load reach above-mentioned test by above-mentioned loading device
When position, it is electrically connected the multiple electronic components for being loaded into above-mentioned test pallet with tester;
Discharge mechanism, after above-mentioned test position is completed to the test for the multiple electronic components being loaded, from the above-mentioned unloading of arrival
The above-mentioned test pallet of position unloads multiple electronic components, carries out classification according to test result and moves to recycling pallet;With
And
Identification device is loaded onto the more of the above-mentioned test pallet positioned at above-mentioned loading position by above-mentioned loading device for identification
A electronic component,
Above-mentioned loading device makes the multiple electronic components caught by above-mentioned identification device to positioned at the upper of above-mentioned loading position
Test pallet movement is stated, makes it possible to identify the multiple electronic components caught by above-mentioned identification device,
Above-mentioned identification device, comprising:
Barcode reader, for shooting the bar code for being printed in electronic component;And
Reading device, for reading the bar code shot by above-mentioned barcode reader.
9. electronic component test sorting machine according to claim 8, which is characterized in that
Above-mentioned identification device is arranged to be inclined at an angle, to identify the bar code for being printed in above-mentioned electronic component.
10. electronic component test sorting machine according to claim 8, which is characterized in that grabbed in above-mentioned loading device
Firmly bar code is identified in the state of electronic component.
11. electronic component test sorting machine according to claim 8, which is characterized in that
Above-mentioned loading device can catch multiple electronic components,
Above-mentioned identification device is for once identifying the item of multiple electronic components in the state of being caught by above-mentioned loading device
Shape code.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020160033011A KR102656451B1 (en) | 2016-03-18 | 2016-03-18 | Handler for testing electronic components |
KR10-2016-0033011 | 2016-03-18 | ||
CN201710102266.0A CN107199183B (en) | 2016-03-18 | 2017-02-24 | sorter for testing electronic components |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710102266.0A Division CN107199183B (en) | 2016-03-18 | 2017-02-24 | sorter for testing electronic components |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110252685A true CN110252685A (en) | 2019-09-20 |
CN110252685B CN110252685B (en) | 2021-09-28 |
Family
ID=59904863
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910446858.3A Active CN110252685B (en) | 2016-03-18 | 2017-02-24 | Sorter for testing electronic components |
CN201910926484.5A Active CN110653174B (en) | 2016-03-18 | 2017-02-24 | Sorter for testing electronic components |
CN201710102266.0A Active CN107199183B (en) | 2016-03-18 | 2017-02-24 | sorter for testing electronic components |
CN201910925100.8A Active CN110653173B (en) | 2016-03-18 | 2017-02-24 | Sorter for testing electronic components |
Family Applications After (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910926484.5A Active CN110653174B (en) | 2016-03-18 | 2017-02-24 | Sorter for testing electronic components |
CN201710102266.0A Active CN107199183B (en) | 2016-03-18 | 2017-02-24 | sorter for testing electronic components |
CN201910925100.8A Active CN110653173B (en) | 2016-03-18 | 2017-02-24 | Sorter for testing electronic components |
Country Status (3)
Country | Link |
---|---|
KR (5) | KR102656451B1 (en) |
CN (4) | CN110252685B (en) |
TW (1) | TWI611195B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112642752A (en) * | 2019-10-10 | 2021-04-13 | 泰克元有限公司 | Sorting machine for processing electronic parts |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102432981B1 (en) * | 2017-11-03 | 2022-08-18 | (주)테크윙 | Picking apparatus for handler supporting test of electronic components |
EP3502020B1 (en) * | 2017-12-19 | 2020-06-10 | Fives Intralogistics S.p.A. Con Socio Unico | Sorting machine |
KR102549942B1 (en) * | 2018-04-09 | 2023-07-03 | (주)테크윙 | Bar code recognition device of handler for processing electronic component |
KR20190124132A (en) * | 2018-04-25 | 2019-11-04 | (주)테크윙 | Test handler for testing electronic component |
KR102581147B1 (en) * | 2018-07-12 | 2023-09-25 | (주)테크윙 | Apparatus for relocating electronic components |
KR102631908B1 (en) * | 2018-08-21 | 2024-01-31 | (주)테크윙 | Handler and automation system comprising the same |
KR102663462B1 (en) * | 2018-11-07 | 2024-05-09 | (주)테크윙 | Handler |
KR20200071357A (en) * | 2018-12-11 | 2020-06-19 | (주)테크윙 | Handler for testing electronic components |
KR102249304B1 (en) | 2019-04-15 | 2021-05-07 | 주식회사 아테코 | Electronic device test handler having flying scan function |
KR20200144385A (en) * | 2019-06-18 | 2020-12-29 | (주)제이티 | Device handler and digital code recognition system used therefor |
CN111220892A (en) * | 2020-03-04 | 2020-06-02 | 长江存储科技有限责任公司 | Component testing method and structure thereof |
KR20210156053A (en) * | 2020-06-17 | 2021-12-24 | (주)테크윙 | Handling system for testing electronic component |
JP2022021241A (en) * | 2020-07-21 | 2022-02-02 | 株式会社アドバンテスト | Electronic component handling device and electronic component testing device |
CN114472191A (en) * | 2020-11-12 | 2022-05-13 | 泰克元有限公司 | Sorter for processing electronic parts and method for confirming whether insert has defect |
KR20220113097A (en) * | 2021-02-05 | 2022-08-12 | (주)테크윙 | Handler for testing electronic components |
KR102670188B1 (en) * | 2021-06-11 | 2024-05-29 | 주식회사 케이아이 | The automatic inspection system for pcb |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000329809A (en) * | 1999-05-17 | 2000-11-30 | Advantest Corp | Testing device for electronic part substrate and testing method therefor |
CN1837841A (en) * | 2005-03-22 | 2006-09-27 | 未来产业株式会社 | Handler for testing semiconductor devices |
CN102214549A (en) * | 2010-04-12 | 2011-10-12 | 宰体有限公司 | Semiconductor device testing device and testing method therefor |
JP2012039001A (en) * | 2010-08-10 | 2012-02-23 | Renesas Electronics Corp | Semiconductor device |
CN102755964A (en) * | 2011-04-29 | 2012-10-31 | 未来产业株式会社 | Testing and classifying machine for memory cards |
CN103569624A (en) * | 2012-07-20 | 2014-02-12 | 精工爱普生株式会社 | Electronic component carrying device and electronic component testing device |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5845002A (en) * | 1994-11-03 | 1998-12-01 | Sunkist Growers, Inc. | Method and apparatus for detecting surface features of translucent objects |
US7161175B2 (en) * | 1997-09-30 | 2007-01-09 | Jeng-Jye Shau | Inter-dice signal transfer methods for integrated circuits |
KR100487066B1 (en) * | 2000-10-20 | 2005-05-03 | 미래산업 주식회사 | Multi-stacker for stacking trays for handler |
DE112004002826T5 (en) * | 2004-06-08 | 2007-04-26 | Advantest Corporation | Image sensor test system |
WO2006105352A1 (en) * | 2005-03-30 | 2006-10-05 | Delta Design, Inc. | Process for handling semiconductor devices and transport media in automated sorting equipment |
WO2007007406A1 (en) * | 2005-07-13 | 2007-01-18 | Advantest Corporation | Test equipment of electronic component |
US7973259B2 (en) * | 2007-05-25 | 2011-07-05 | Asm Assembly Automation Ltd | System for testing and sorting electronic components |
KR100876292B1 (en) * | 2007-08-23 | 2008-12-31 | 에버테크노 주식회사 | A solid state disk test handler |
KR101327455B1 (en) * | 2007-09-19 | 2013-11-11 | 세메스 주식회사 | Test handler and semiconductor device loading and unloading method thereof the same |
KR100914219B1 (en) * | 2007-09-19 | 2009-08-27 | 세크론 주식회사 | Test handler |
KR101133188B1 (en) * | 2009-03-27 | 2012-04-09 | (주)제이티 | Sorting Apparatus for Semiconductor Device and Sorting Method for the Same |
JP5278122B2 (en) * | 2009-04-06 | 2013-09-04 | ソニー株式会社 | Tray feeder |
CN102189082B (en) * | 2010-03-10 | 2013-06-26 | 鸿劲科技股份有限公司 | Electronic component test classifier |
CN102240644A (en) * | 2010-05-11 | 2011-11-16 | 中山天贸电池有限公司 | Test sorting machine for battery product and sorting method for test sorting machine |
KR20120027580A (en) * | 2010-09-13 | 2012-03-22 | 삼성전자주식회사 | Test handler for semiconductor package and the test method using the same |
KR20140020967A (en) * | 2011-03-21 | 2014-02-19 | 유니버시티 오브 윈저 | Apparatus for the automated testing and validation of electronic components |
KR101333426B1 (en) * | 2011-12-28 | 2013-12-02 | 세메스 주식회사 | Apparatus for sorting semiconductor packages |
WO2014049767A1 (en) * | 2012-09-27 | 2014-04-03 | 富士機械製造株式会社 | Component feeder |
KR101391704B1 (en) * | 2012-10-24 | 2014-05-30 | 한미반도체 주식회사 | Handler for semiconductor package, and operating method thereof |
TWI456213B (en) * | 2013-01-18 | 2014-10-11 | Hon Tech Inc | Electronic component working unit, working method and working equipment thereof |
KR20140119243A (en) * | 2013-03-27 | 2014-10-10 | (주)제이티 | Semiconductor device inspection apparatus |
KR101999623B1 (en) * | 2013-05-10 | 2019-07-16 | (주)테크윙 | Tray stacker of handler for testing semiconductor |
KR102043633B1 (en) * | 2014-01-21 | 2019-11-13 | (주)테크윙 | Handler for semiconductor device test |
KR101811662B1 (en) * | 2014-03-07 | 2017-12-26 | (주)테크윙 | Handler for testing semiconductor device and test supportion method of the same |
-
2016
- 2016-03-18 KR KR1020160033011A patent/KR102656451B1/en active IP Right Grant
-
2017
- 2017-02-24 CN CN201910446858.3A patent/CN110252685B/en active Active
- 2017-02-24 CN CN201910926484.5A patent/CN110653174B/en active Active
- 2017-02-24 CN CN201710102266.0A patent/CN107199183B/en active Active
- 2017-02-24 CN CN201910925100.8A patent/CN110653173B/en active Active
- 2017-03-06 TW TW106107197A patent/TWI611195B/en active
-
2023
- 2023-03-28 KR KR1020230040722A patent/KR20230047989A/en not_active Application Discontinuation
- 2023-03-28 KR KR1020230040717A patent/KR20230045002A/en active Application Filing
- 2023-03-28 KR KR1020230040724A patent/KR20230046290A/en not_active Application Discontinuation
-
2024
- 2024-02-26 KR KR1020240027529A patent/KR20240031993A/en active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000329809A (en) * | 1999-05-17 | 2000-11-30 | Advantest Corp | Testing device for electronic part substrate and testing method therefor |
CN1837841A (en) * | 2005-03-22 | 2006-09-27 | 未来产业株式会社 | Handler for testing semiconductor devices |
CN102214549A (en) * | 2010-04-12 | 2011-10-12 | 宰体有限公司 | Semiconductor device testing device and testing method therefor |
JP2012039001A (en) * | 2010-08-10 | 2012-02-23 | Renesas Electronics Corp | Semiconductor device |
CN102755964A (en) * | 2011-04-29 | 2012-10-31 | 未来产业株式会社 | Testing and classifying machine for memory cards |
CN103569624A (en) * | 2012-07-20 | 2014-02-12 | 精工爱普生株式会社 | Electronic component carrying device and electronic component testing device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112642752A (en) * | 2019-10-10 | 2021-04-13 | 泰克元有限公司 | Sorting machine for processing electronic parts |
CN112642752B (en) * | 2019-10-10 | 2024-05-24 | 泰克元有限公司 | Sorting machine for electronic component processing |
Also Published As
Publication number | Publication date |
---|---|
TW201734482A (en) | 2017-10-01 |
CN110653173B (en) | 2022-04-19 |
CN107199183B (en) | 2019-12-10 |
CN107199183A (en) | 2017-09-26 |
CN110653174A (en) | 2020-01-07 |
CN110653174B (en) | 2022-04-12 |
KR20230045002A (en) | 2023-04-04 |
KR102656451B1 (en) | 2024-04-12 |
CN110653173A (en) | 2020-01-07 |
KR20230047989A (en) | 2023-04-10 |
KR20240031993A (en) | 2024-03-08 |
KR20230046290A (en) | 2023-04-05 |
TWI611195B (en) | 2018-01-11 |
KR20170108703A (en) | 2017-09-27 |
CN110252685B (en) | 2021-09-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN110252685A (en) | Sorting machine is used in electronic component test | |
TWI620943B (en) | Sorting machine for testing semiconductor devices | |
EP2916638A1 (en) | Nozzle management device | |
CN101644622B (en) | Apparatus of detecting lens, controlling method thereof, apparatus and method for separating lens | |
US10420266B2 (en) | Nozzle management device and control method of nozzle management device | |
US11639942B2 (en) | Sample analyzer | |
KR20230165173A (en) | Device handler | |
KR100802435B1 (en) | Method for teaching working posiotion in semiconductor test handler | |
KR101637493B1 (en) | Apparatus for Inspecting Lead Frame of LED | |
KR100705645B1 (en) | Method for a classifying semiconductor device | |
KR100973189B1 (en) | Test handler | |
KR100973188B1 (en) | Test handler | |
CN102389876A (en) | Apparatus for lens sorting and method of lens sorting using the same | |
JPH09318703A (en) | Ic handler | |
US7501809B2 (en) | Electronic component handling and testing apparatus and method for electronic component handling and testing | |
KR101814702B1 (en) | Apparatus for ejecting tray from semiconductor test equipment | |
JPS6123002A (en) | Manufacturing system of printed board unit | |
JP2023029969A (en) | Nozzle management machine | |
JP2001235512A (en) | Electronic part testing device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |