CN110610909A - 具有改善的冷却功率的电子构件和具有电子构件的机动车 - Google Patents
具有改善的冷却功率的电子构件和具有电子构件的机动车 Download PDFInfo
- Publication number
- CN110610909A CN110610909A CN201910504876.2A CN201910504876A CN110610909A CN 110610909 A CN110610909 A CN 110610909A CN 201910504876 A CN201910504876 A CN 201910504876A CN 110610909 A CN110610909 A CN 110610909A
- Authority
- CN
- China
- Prior art keywords
- component
- housing section
- cooling
- coolant
- motor vehicle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 93
- 239000002826 coolant Substances 0.000 claims abstract description 66
- 238000000034 method Methods 0.000 claims description 4
- 238000005266 casting Methods 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims description 2
- 238000004891 communication Methods 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 238000003801 milling Methods 0.000 claims description 2
- 239000012530 fluid Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000630 rising effect Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000005381 potential energy Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20872—Liquid coolant without phase change
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102018209586.8 | 2018-06-14 | ||
| DE102018209586.8A DE102018209586A1 (de) | 2018-06-14 | 2018-06-14 | Elektronisches Bauteil mit verbesserter Kühlleistung und Kraftfahrzeug mit zumindest einem elektronischen Bauteil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110610909A true CN110610909A (zh) | 2019-12-24 |
Family
ID=68724636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910504876.2A Pending CN110610909A (zh) | 2018-06-14 | 2019-06-12 | 具有改善的冷却功率的电子构件和具有电子构件的机动车 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110610909A (de) |
| DE (1) | DE102018209586A1 (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102023205611A1 (de) | 2023-06-15 | 2024-05-02 | Zf Friedrichshafen Ag | Kühlanordnung zum Kühlen zumindest einer integrierten Schaltung mit einem Kühlfluidversorgungskreislauf |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5077601A (en) * | 1988-09-09 | 1991-12-31 | Hitachi, Ltd. | Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system |
| CH685140A5 (de) * | 1991-09-24 | 1995-03-31 | Behr Industrietech Gmbh & Co | Kühleinrichtung für elektrische Bauelemente. |
| JPH08191118A (ja) * | 1995-01-09 | 1996-07-23 | Kenwood Corp | 放熱構造 |
| JP2004221315A (ja) * | 2003-01-15 | 2004-08-05 | Mitsubishi Electric Corp | 冷却部材 |
| JP2005244014A (ja) * | 2004-02-27 | 2005-09-08 | Mitsubishi Electric Corp | ヒートシンクおよび冷却装置 |
| US20060011326A1 (en) * | 2004-07-15 | 2006-01-19 | Yassour Yuval | Heat-exchanger device and cooling system |
| DE102006057796A1 (de) * | 2005-12-08 | 2007-06-14 | Sew-Eurodrive Gmbh & Co. Kg | Gerät, Baureihe von Geräten, Vorrichtung mit Gehäuseteilen, Verfahren, Verwendung eines Luftkühlers und Verwendung eines Flüssigkeitskühlers |
| JP2007250753A (ja) * | 2006-03-15 | 2007-09-27 | Mitsubishi Electric Corp | 冷却板 |
| US20080023189A1 (en) * | 2006-07-26 | 2008-01-31 | Furukawa-Sky Aluminum Corp. | Heat exchanger |
| DE102008041892A1 (de) * | 2008-09-09 | 2010-03-11 | Robert Bosch Gmbh | Kühlsystem mit einem Elektronikmodul |
| DE102012102666A1 (de) * | 2011-04-01 | 2012-10-04 | Toyota Jidosha Kabushiki Kaisha | Kühlkörper und mit dem Kühlkörper ausgestattetes Elektronikbauteil |
| EP2701190A2 (de) * | 2012-08-21 | 2014-02-26 | Autokühler GmbH & Co. KG | Kühlkörper für mindestens ein zu kühlendes Bauelement sowie Verfahren zur Herstellung eines Kühlkörpers |
| US20140190669A1 (en) * | 2013-01-10 | 2014-07-10 | Fujitsu Limited | Cooling head and electronic apparatus |
| WO2015094125A1 (en) * | 2013-12-16 | 2015-06-25 | Sieva, Podjetje Za Razvoj In Trženje V Avtomobilski Industriji, D.O.O. | High performance heat exchanger with inclined pin fin aragnement means and a method of producing the same |
| WO2018091233A1 (de) * | 2016-11-15 | 2018-05-24 | Zf Friedrichshafen Ag | Elektronikmodul und verfahren zum herstellen desselben |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4327895A1 (de) * | 1993-08-19 | 1995-02-23 | Abb Management Ag | Stromrichtermodul |
| DE10324152A1 (de) * | 2003-05-22 | 2004-12-30 | Bombardier Transportation (Technology) Germany Gmbh | Gehäuseanordnung zur Aufnahme elektrischer und/oder elektronischer Bauteile |
| JP2005252151A (ja) * | 2004-03-08 | 2005-09-15 | Mitsubishi Electric Corp | 冷却装置 |
| JP4027353B2 (ja) * | 2004-09-28 | 2007-12-26 | 三菱電機株式会社 | 冷却構造 |
| JP4777264B2 (ja) * | 2007-01-11 | 2011-09-21 | 株式会社ティラド | フィンタイプ液冷ヒートシンク |
| JP6026772B2 (ja) * | 2012-05-17 | 2016-11-16 | 株式会社ティラド | ヒートシンク |
| DE102015212722A1 (de) * | 2015-07-08 | 2017-01-12 | Robert Bosch Gmbh | Kühlvorrichtung für ein Leistungshalbleitermodul |
-
2018
- 2018-06-14 DE DE102018209586.8A patent/DE102018209586A1/de active Pending
-
2019
- 2019-06-12 CN CN201910504876.2A patent/CN110610909A/zh active Pending
Patent Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5077601A (en) * | 1988-09-09 | 1991-12-31 | Hitachi, Ltd. | Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system |
| CH685140A5 (de) * | 1991-09-24 | 1995-03-31 | Behr Industrietech Gmbh & Co | Kühleinrichtung für elektrische Bauelemente. |
| DE4131739C2 (de) * | 1991-09-24 | 1996-12-19 | Behr Industrietech Gmbh & Co | Kühleinrichtung für elektrische Bauelemente |
| JPH08191118A (ja) * | 1995-01-09 | 1996-07-23 | Kenwood Corp | 放熱構造 |
| JP2004221315A (ja) * | 2003-01-15 | 2004-08-05 | Mitsubishi Electric Corp | 冷却部材 |
| JP2005244014A (ja) * | 2004-02-27 | 2005-09-08 | Mitsubishi Electric Corp | ヒートシンクおよび冷却装置 |
| US20060011326A1 (en) * | 2004-07-15 | 2006-01-19 | Yassour Yuval | Heat-exchanger device and cooling system |
| DE102006057796A1 (de) * | 2005-12-08 | 2007-06-14 | Sew-Eurodrive Gmbh & Co. Kg | Gerät, Baureihe von Geräten, Vorrichtung mit Gehäuseteilen, Verfahren, Verwendung eines Luftkühlers und Verwendung eines Flüssigkeitskühlers |
| JP2007250753A (ja) * | 2006-03-15 | 2007-09-27 | Mitsubishi Electric Corp | 冷却板 |
| US20080023189A1 (en) * | 2006-07-26 | 2008-01-31 | Furukawa-Sky Aluminum Corp. | Heat exchanger |
| DE102008041892A1 (de) * | 2008-09-09 | 2010-03-11 | Robert Bosch Gmbh | Kühlsystem mit einem Elektronikmodul |
| DE102012102666A1 (de) * | 2011-04-01 | 2012-10-04 | Toyota Jidosha Kabushiki Kaisha | Kühlkörper und mit dem Kühlkörper ausgestattetes Elektronikbauteil |
| EP2701190A2 (de) * | 2012-08-21 | 2014-02-26 | Autokühler GmbH & Co. KG | Kühlkörper für mindestens ein zu kühlendes Bauelement sowie Verfahren zur Herstellung eines Kühlkörpers |
| US20140190669A1 (en) * | 2013-01-10 | 2014-07-10 | Fujitsu Limited | Cooling head and electronic apparatus |
| WO2015094125A1 (en) * | 2013-12-16 | 2015-06-25 | Sieva, Podjetje Za Razvoj In Trženje V Avtomobilski Industriji, D.O.O. | High performance heat exchanger with inclined pin fin aragnement means and a method of producing the same |
| WO2018091233A1 (de) * | 2016-11-15 | 2018-05-24 | Zf Friedrichshafen Ag | Elektronikmodul und verfahren zum herstellen desselben |
| US20200066615A1 (en) * | 2016-11-15 | 2020-02-27 | Zf Friedrichshafen Ag | Electronic module and method for the production thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102018209586A1 (de) | 2019-12-19 |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |