CN110383804A - 摄像模组及其电路板组件和制造方法以及带有摄像模组的电子设备 - Google Patents
摄像模组及其电路板组件和制造方法以及带有摄像模组的电子设备 Download PDFInfo
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- 238000000429 assembly Methods 0.000 title claims abstract description 192
- 230000000712 assembly Effects 0.000 title claims abstract description 192
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 161
- 239000000758 substrate Substances 0.000 claims abstract description 1746
- 238000000465 moulding Methods 0.000 claims abstract description 422
- 230000003287 optical effect Effects 0.000 claims description 506
- 239000012530 fluid Substances 0.000 claims description 50
- 238000005516 engineering process Methods 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 33
- 239000011265 semifinished product Substances 0.000 claims description 30
- 230000033001 locomotion Effects 0.000 claims description 21
- 241000283080 Proboscidea <mammal> Species 0.000 claims description 15
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 238000002955 isolation Methods 0.000 claims description 7
- 238000001914 filtration Methods 0.000 claims description 3
- 230000002829 reductive effect Effects 0.000 abstract description 28
- 238000010586 diagram Methods 0.000 description 43
- 239000000047 product Substances 0.000 description 22
- 239000000463 material Substances 0.000 description 20
- 239000011324 bead Substances 0.000 description 18
- 239000003292 glue Substances 0.000 description 18
- 230000011218 segmentation Effects 0.000 description 17
- 230000000007 visual effect Effects 0.000 description 14
- 239000003344 environmental pollutant Substances 0.000 description 13
- 231100000719 pollutant Toxicity 0.000 description 13
- 230000002787 reinforcement Effects 0.000 description 13
- 230000004308 accommodation Effects 0.000 description 10
- 238000007493 shaping process Methods 0.000 description 9
- 229920001187 thermosetting polymer Polymers 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 8
- 230000003247 decreasing effect Effects 0.000 description 7
- 230000018109 developmental process Effects 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 230000002452 interceptive effect Effects 0.000 description 7
- 239000007788 liquid Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 230000006870 function Effects 0.000 description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 241000218202 Coptis Species 0.000 description 4
- 235000002991 Coptis groenlandica Nutrition 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 4
- 230000004313 glare Effects 0.000 description 4
- 230000001771 impaired effect Effects 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000000356 contaminant Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 230000001788 irregular Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 238000001429 visible spectrum Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 238000007596 consolidation process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000012634 optical imaging Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
- G01N15/06—Investigating concentration of particle suspensions
- G01N15/0656—Investigating concentration of particle suspensions using electric, e.g. electrostatic methods or magnetic methods
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/28—Locating light-sensitive material within camera
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Dispersion Chemistry (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Lens Barrels (AREA)
- Blocking Light For Cameras (AREA)
Abstract
本发明提供一摄像模组及其电路板组件和制造方法以及带有摄像模组的电子设备,其中所述电路板组件包括至少一电子元器件、一基板以及一模塑单元,至少一个所述电子元器件在所述基板的基板背面被导通地连接于所述基板,所述模塑单元包括一背面模塑部和一模塑基座,其中在所述背面模塑部一体地结合于所述基板的基板背面的至少一部分区域时,所述模塑基座一体地结合于所述基板的基板正面,其中在所述基板的基板正面可以不需要预留用于导通地连接所述电子元器件的位置,以能够减小所述摄像模组的长宽尺寸,从而减小所述摄像模组的体积。
Description
PCT国内申请,说明书已公开。
Claims (181)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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CN2016112073939 | 2016-12-23 | ||
CN201611207393 | 2016-12-23 | ||
PCT/CN2017/118336 WO2018113794A2 (zh) | 2016-12-23 | 2017-12-25 | 摄像模组及其电路板组件和制造方法以及带有摄像模组的电子设备 |
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CN110383804A true CN110383804A (zh) | 2019-10-25 |
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ID=61875223
Family Applications (12)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201720344605.1U Active CN207251755U (zh) | 2016-12-23 | 2017-04-01 | 电路板组件和摄像模组以及带有摄像模组的电子设备 |
CN201720344964.7U Active CN207251756U (zh) | 2016-12-23 | 2017-04-01 | 摄像模组及其电路板组件以及带有摄像模组的电子设备 |
CN201710214887.8A Active CN108243298B (zh) | 2016-12-23 | 2017-04-01 | 摄像模组及其模塑电路板组件和制造方法以及带有摄像模组的电子设备 |
CN201710214811.5A Pending CN108243296A (zh) | 2016-12-23 | 2017-04-01 | 电路板组件和摄像模组及其制造方法以及带有摄像模组的电子设备 |
CN201710214886.3A Pending CN108243297A (zh) | 2016-12-23 | 2017-04-01 | 摄像模组及其电路板组件和制造方法以及带有摄像模组的电子设备 |
CN201720346336.2U Active CN208353433U (zh) | 2016-12-23 | 2017-04-01 | 摄像模组及其模塑电路板组件及带有摄像模组的电子设备 |
CN201721839803.1U Active CN208210099U (zh) | 2016-12-23 | 2017-12-25 | 电路板组件、阵列摄像模组及其电子设备 |
CN201711424165.1A Active CN108243301B (zh) | 2016-12-23 | 2017-12-25 | 电路板组件和阵列摄像模组及其制造方法以及带有阵列摄像模组的电子设备 |
CN201721837587.7U Active CN207897033U (zh) | 2016-12-23 | 2017-12-25 | 电路板组件、阵列摄像模组和电子设备 |
CN201780069711.6A Active CN110326280B (zh) | 2016-12-23 | 2017-12-25 | 阵列摄像模组及其应用 |
CN201780069732.8A Pending CN110383804A (zh) | 2016-12-23 | 2017-12-25 | 摄像模组及其电路板组件和制造方法以及带有摄像模组的电子设备 |
CN201711422922.1A Pending CN108243300A (zh) | 2016-12-23 | 2017-12-25 | 阵列摄像模组及其应用 |
Family Applications Before (10)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201720344605.1U Active CN207251755U (zh) | 2016-12-23 | 2017-04-01 | 电路板组件和摄像模组以及带有摄像模组的电子设备 |
CN201720344964.7U Active CN207251756U (zh) | 2016-12-23 | 2017-04-01 | 摄像模组及其电路板组件以及带有摄像模组的电子设备 |
CN201710214887.8A Active CN108243298B (zh) | 2016-12-23 | 2017-04-01 | 摄像模组及其模塑电路板组件和制造方法以及带有摄像模组的电子设备 |
CN201710214811.5A Pending CN108243296A (zh) | 2016-12-23 | 2017-04-01 | 电路板组件和摄像模组及其制造方法以及带有摄像模组的电子设备 |
CN201710214886.3A Pending CN108243297A (zh) | 2016-12-23 | 2017-04-01 | 摄像模组及其电路板组件和制造方法以及带有摄像模组的电子设备 |
CN201720346336.2U Active CN208353433U (zh) | 2016-12-23 | 2017-04-01 | 摄像模组及其模塑电路板组件及带有摄像模组的电子设备 |
CN201721839803.1U Active CN208210099U (zh) | 2016-12-23 | 2017-12-25 | 电路板组件、阵列摄像模组及其电子设备 |
CN201711424165.1A Active CN108243301B (zh) | 2016-12-23 | 2017-12-25 | 电路板组件和阵列摄像模组及其制造方法以及带有阵列摄像模组的电子设备 |
CN201721837587.7U Active CN207897033U (zh) | 2016-12-23 | 2017-12-25 | 电路板组件、阵列摄像模组和电子设备 |
CN201780069711.6A Active CN110326280B (zh) | 2016-12-23 | 2017-12-25 | 阵列摄像模组及其应用 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711422922.1A Pending CN108243300A (zh) | 2016-12-23 | 2017-12-25 | 阵列摄像模组及其应用 |
Country Status (3)
Country | Link |
---|---|
US (4) | US11165941B2 (zh) |
JP (2) | JP2020502586A (zh) |
CN (12) | CN207251755U (zh) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6968884B2 (ja) * | 2016-12-20 | 2021-11-17 | ▲寧▼波舜宇光▲電▼信息有限公司 | 高度差のあるアレイカメラモジュール、回路基板組立体及びその製造方法並びに電子デバイス |
CN207251755U (zh) * | 2016-12-23 | 2018-04-17 | 宁波舜宇光电信息有限公司 | 电路板组件和摄像模组以及带有摄像模组的电子设备 |
US11049898B2 (en) | 2017-04-01 | 2021-06-29 | Ningbo Sunny Opotech Co., Ltd. | Systems and methods for manufacturing semiconductor modules |
WO2018210337A1 (zh) * | 2017-05-18 | 2018-11-22 | 宁波舜宇光电信息有限公司 | 摄像模组及其模塑电路板组件和阵列摄像模组以及电子设备 |
WO2019242421A1 (zh) * | 2018-06-21 | 2019-12-26 | 宁波舜宇光电信息有限公司 | 感光组件、摄像模组及相应的终端设备和制作方法 |
US10914869B2 (en) | 2018-08-14 | 2021-02-09 | Samsung Electro-Mechanics Co., Ltd. | Lens assembly and portable electronic device |
CN110876003A (zh) * | 2018-09-04 | 2020-03-10 | 宁波舜宇光电信息有限公司 | Tof摄像模组和电子设备以及组装方法 |
WO2020063236A1 (zh) * | 2018-09-27 | 2020-04-02 | 宁波舜宇光电信息有限公司 | 多群组镜头、摄像模组以及电子设备和组装方法 |
EP3637466A1 (en) * | 2018-10-11 | 2020-04-15 | STMicroelectronics (Research & Development) Limited | Electronic device comprising a chip having an optical sensor |
CN111277734B (zh) * | 2018-12-04 | 2023-10-27 | 宁波舜宇光电信息有限公司 | 摄像模组及其制造方法 |
CN112073598A (zh) * | 2019-06-10 | 2020-12-11 | 宁波舜宇光电信息有限公司 | 一种投射模组以及3d 摄像模组 |
CN112333350A (zh) * | 2019-07-30 | 2021-02-05 | 宁波舜宇光电信息有限公司 | 摄像模组、复合基板、感光组件及其制作方法 |
WO2021017752A1 (zh) * | 2019-07-30 | 2021-02-04 | 宁波舜宇光电信息有限公司 | 摄像模组、电子设备、复合基板、感光组件及其制作方法 |
WO2021017743A1 (zh) * | 2019-07-31 | 2021-02-04 | 宁波舜宇光电信息有限公司 | 模塑线路板和摄像模组及其制造方法和电子设备 |
CN112399037B (zh) * | 2019-08-15 | 2022-04-05 | 宁波舜宇光电信息有限公司 | 感光组件、摄像模组及其制作方法 |
CN110602363A (zh) * | 2019-09-23 | 2019-12-20 | Oppo广东移动通信有限公司 | 一种摄像头模组以及电子设备 |
CN112074078A (zh) * | 2020-09-14 | 2020-12-11 | 福建中科光芯光电科技有限公司 | 一种用于200g光接收器件的软硬结合电路板 |
CN114650345B (zh) * | 2020-12-17 | 2024-04-02 | 宁波舜宇光电信息有限公司 | 电路板组件、感光组件和摄像模组 |
CN112565579B (zh) * | 2020-12-17 | 2022-10-28 | 维沃移动通信有限公司 | 摄像头组件和电子设备 |
CN112751957B (zh) * | 2020-12-28 | 2023-08-08 | 维沃移动通信有限公司 | 电子设备 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030025825A1 (en) * | 2000-03-02 | 2003-02-06 | Olympus Optical Co., Ltd. | Small image pickup module |
CN101075603A (zh) * | 2006-05-17 | 2007-11-21 | 大瀚光电股份有限公司 | 取像模组封装结构及其封装方法 |
CN105681637A (zh) * | 2016-03-15 | 2016-06-15 | 宁波舜宇光电信息有限公司 | 阵列摄像模组及其感光组件和制造方法 |
Family Cites Families (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6795120B2 (en) * | 1996-05-17 | 2004-09-21 | Sony Corporation | Solid-state imaging apparatus and camera using the same |
FR2800911B1 (fr) | 1999-11-04 | 2003-08-22 | St Microelectronics Sa | Boitier semi-conducteur optique et procede de fabrication d'un tel boitier |
JP3651580B2 (ja) * | 2000-04-07 | 2005-05-25 | 三菱電機株式会社 | 撮像装置及びその製造方法 |
JP4143304B2 (ja) | 2002-01-24 | 2008-09-03 | 富士通株式会社 | カメラモジュールの製造方法 |
US7005310B2 (en) * | 2002-08-14 | 2006-02-28 | Renesas Technology Corporation | Manufacturing method of solid-state image sensing device |
JP2005072978A (ja) | 2003-08-25 | 2005-03-17 | Renesas Technology Corp | 固体撮像装置およびその製造方法 |
US6680525B1 (en) | 2003-01-09 | 2004-01-20 | Kingpak Technology Inc. | Stacked structure of an image sensor |
EP1471730A1 (en) * | 2003-03-31 | 2004-10-27 | Dialog Semiconductor GmbH | Miniature camera module |
KR100539234B1 (ko) * | 2003-06-11 | 2005-12-27 | 삼성전자주식회사 | 투명 고분자 소재를 적용한 씨모스형 이미지 센서 모듈 및그 제조방법 |
JP2005101711A (ja) | 2003-09-22 | 2005-04-14 | Renesas Technology Corp | 固体撮像装置およびその製造方法 |
JP2005223716A (ja) * | 2004-02-06 | 2005-08-18 | Rohm Co Ltd | イメージセンサモジュールおよびイメージセンサモジュール用レンズユニット |
JP2005317745A (ja) * | 2004-04-28 | 2005-11-10 | Renesas Technology Corp | 固体撮像装置およびその製造方法 |
US7045888B2 (en) * | 2004-06-29 | 2006-05-16 | Macronix International Co., Ltd. | Ultra thin dual chip image sensor package structure and method for fabrication |
TWI240556B (en) * | 2004-06-29 | 2005-09-21 | Creative Sensor Inc | Contact image scanner with multiple focal distances and multiple resolutions |
JP2006018473A (ja) * | 2004-06-30 | 2006-01-19 | Toshiba Corp | 携帯可能電子装置 |
CN2725916Y (zh) * | 2004-09-15 | 2005-09-14 | 华泰电子股份有限公司 | 镜头模块改良结构 |
JP2006148473A (ja) | 2004-11-18 | 2006-06-08 | Shinko Electric Ind Co Ltd | カメラモジュール及びその製造方法 |
JP2007214441A (ja) * | 2006-02-10 | 2007-08-23 | Dainippon Printing Co Ltd | 複合センサーパッケージ |
JP2007306282A (ja) * | 2006-05-11 | 2007-11-22 | Citizen Electronics Co Ltd | カメラモジュール |
JP2009188828A (ja) | 2008-02-07 | 2009-08-20 | Panasonic Corp | 固体撮像装置とその製造方法 |
JP2010050771A (ja) * | 2008-08-22 | 2010-03-04 | Kyocera Corp | 撮像装置モジュール |
KR101488831B1 (ko) | 2009-02-23 | 2015-02-04 | 게리 에드윈 서튼 | 곡면 센서 카메라를 갖는 이동통신장치, 이동형 광학부를 갖는 곡면 센서 카메라, 및 실리콘 섬유로 제작되는 곡면 센서 |
US8248499B2 (en) | 2009-02-23 | 2012-08-21 | Gary Edwin Sutton | Curvilinear sensor system |
CN101877944B (zh) * | 2009-04-29 | 2012-06-27 | 鸿骐新技股份有限公司 | 印刷电路板的全植板及其接合方法 |
JP5324667B2 (ja) * | 2009-12-24 | 2013-10-23 | 京セラ株式会社 | 撮像装置 |
JP2011204797A (ja) * | 2010-03-24 | 2011-10-13 | Sony Corp | 固体撮像装置とその製造方法、及び電子機器 |
CN102593116A (zh) * | 2011-01-12 | 2012-07-18 | 陈淑姿 | 薄化的影像撷取模组及其制作方法 |
JP2013017125A (ja) * | 2011-07-06 | 2013-01-24 | Ricoh Co Ltd | 撮像装置及び撮像装置のモニタリング画像の表示方法 |
JP5982380B2 (ja) * | 2011-08-19 | 2016-08-31 | 富士フイルム株式会社 | 撮像素子モジュール及びその製造方法 |
CN202617250U (zh) * | 2012-06-04 | 2012-12-19 | 美细耐斯(上海)电子有限公司 | 照相机模块 |
JP6077952B2 (ja) * | 2013-07-01 | 2017-02-08 | 富士フイルム株式会社 | 近赤外線吸収性組成物、近赤外線カットフィルタおよびその製造方法、並びに、カメラモジュールおよびその製造方法 |
US9313389B2 (en) * | 2013-11-08 | 2016-04-12 | Htc Corporation | Camera assembly and electronic device |
KR102380064B1 (ko) * | 2014-02-18 | 2022-03-28 | 에이엠에스 센서스 싱가포르 피티이. 리미티드. | 초점 길이 조정 및/또는 기울기의 축소를 위한 고객 맞춤화 가능한 스페이서를 포함하는 광학 모듈, 및 광학 모듈의 제조 |
US9896039B2 (en) * | 2014-05-09 | 2018-02-20 | Magna Electronics Inc. | Vehicle vision system with forward viewing camera |
CN104486465A (zh) | 2014-12-08 | 2015-04-01 | 上海斐讯数据通信技术有限公司 | 一种移动终端 |
US9794522B2 (en) * | 2015-02-06 | 2017-10-17 | Google Inc. | Systems, methods, and devices for managing coexistence of multiple transceiver devices by optimizing component layout |
US9681032B1 (en) * | 2015-03-17 | 2017-06-13 | Amazon Technologies, Inc. | Imager module with molded packaging |
CN205017678U (zh) * | 2015-06-23 | 2016-02-03 | 深圳市汇联时代科技有限公司 | 移动电子设备的印刷电路板及移动电子设备 |
US10523854B2 (en) * | 2015-06-25 | 2019-12-31 | Intel Corporation | Array imaging system having discrete camera modules and method for manufacturing the same |
CN105187697B (zh) | 2015-08-04 | 2019-12-31 | 宁波舜宇光电信息有限公司 | 多镜头摄像模组连体支架和多镜头摄像模组及其应用 |
US10475830B2 (en) * | 2015-08-06 | 2019-11-12 | Ams Sensors Singapore Pte. Ltd. | Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules |
CN105472219B (zh) * | 2015-12-01 | 2019-11-29 | 宁波舜宇光电信息有限公司 | 集成驱动线圈的电气支架和摄像模组及其应用 |
CN105763780A (zh) * | 2016-04-07 | 2016-07-13 | 宁波舜宇光电信息有限公司 | 具有补强线路板的感光装置和阵列摄像模组及其制造方法 |
CN105744131B (zh) | 2016-03-15 | 2019-07-05 | 宁波舜宇光电信息有限公司 | 阵列摄像模组及其线路板组件和制造方法 |
CN105611134B (zh) * | 2016-02-18 | 2018-11-23 | 宁波舜宇光电信息有限公司 | 基于模塑工艺的摄像模组及其模塑线路板组件及制造方法 |
CN206272704U (zh) * | 2016-03-15 | 2017-06-20 | 宁波舜宇光电信息有限公司 | 阵列摄像模组和双摄像模组及其线路板组件和电子设备 |
TWI611248B (zh) * | 2016-07-18 | 2018-01-11 | 實盈光電股份有限公司 | 360度全景相機模組及裝置 |
CN106131386A (zh) * | 2016-08-10 | 2016-11-16 | 北京小米移动软件有限公司 | 摄像头模组和电子设备 |
CN106229325A (zh) * | 2016-09-21 | 2016-12-14 | 苏州科阳光电科技有限公司 | 传感器模组及其制作方法 |
CN207251755U (zh) * | 2016-12-23 | 2018-04-17 | 宁波舜宇光电信息有限公司 | 电路板组件和摄像模组以及带有摄像模组的电子设备 |
-
2017
- 2017-04-01 CN CN201720344605.1U patent/CN207251755U/zh active Active
- 2017-04-01 CN CN201720344964.7U patent/CN207251756U/zh active Active
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- 2017-12-25 CN CN201711424165.1A patent/CN108243301B/zh active Active
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030025825A1 (en) * | 2000-03-02 | 2003-02-06 | Olympus Optical Co., Ltd. | Small image pickup module |
CN101075603A (zh) * | 2006-05-17 | 2007-11-21 | 大瀚光电股份有限公司 | 取像模组封装结构及其封装方法 |
CN105681637A (zh) * | 2016-03-15 | 2016-06-15 | 宁波舜宇光电信息有限公司 | 阵列摄像模组及其感光组件和制造方法 |
Also Published As
Publication number | Publication date |
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CN108243297A (zh) | 2018-07-03 |
US20190364184A1 (en) | 2019-11-28 |
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US20200382683A1 (en) | 2020-12-03 |
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CN108243300A (zh) | 2018-07-03 |
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US12041335B2 (en) | 2024-07-16 |
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US11165941B2 (en) | 2021-11-02 |
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