CN110335839B - 一种片盒清洗装置及方法 - Google Patents
一种片盒清洗装置及方法 Download PDFInfo
- Publication number
- CN110335839B CN110335839B CN201910605488.3A CN201910605488A CN110335839B CN 110335839 B CN110335839 B CN 110335839B CN 201910605488 A CN201910605488 A CN 201910605488A CN 110335839 B CN110335839 B CN 110335839B
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- cleaning
- chamber
- wafer box
- drying
- cartridge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201910605488.3A CN110335839B (zh) | 2019-07-05 | 2019-07-05 | 一种片盒清洗装置及方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910605488.3A CN110335839B (zh) | 2019-07-05 | 2019-07-05 | 一种片盒清洗装置及方法 |
Publications (2)
Publication Number | Publication Date |
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CN110335839A CN110335839A (zh) | 2019-10-15 |
CN110335839B true CN110335839B (zh) | 2022-02-22 |
Family
ID=68143802
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201910605488.3A Active CN110335839B (zh) | 2019-07-05 | 2019-07-05 | 一种片盒清洗装置及方法 |
Country Status (1)
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CN (1) | CN110335839B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111219953B (zh) * | 2020-01-16 | 2022-04-01 | 长江存储科技有限责任公司 | 晶片的干燥装置、干燥方法、清洗***及清洗干燥装置 |
CN115213183A (zh) * | 2022-08-03 | 2022-10-21 | 东莞市凯迪微智能装备有限公司 | 一种晶圆盒清洗设备及其清洗工艺 |
CN117066238B (zh) * | 2023-10-17 | 2023-12-15 | 北京青禾晶元半导体科技有限责任公司 | 一种晶圆片盒清洗设备及晶圆片盒清洗方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1194454A (zh) * | 1997-01-24 | 1998-09-30 | 东京电子株式会社 | 清洗装置及清洗方法 |
JP2005277151A (ja) * | 2004-03-25 | 2005-10-06 | Ihito Takahira | 洗浄装置 |
CN103170469A (zh) * | 2011-12-22 | 2013-06-26 | 中芯国际集成电路制造(上海)有限公司 | 用于清洗和干燥晶圆盒的装置及方法 |
CN108212926A (zh) * | 2018-03-23 | 2018-06-29 | 郑州金恒电子技术有限公司 | 一种新型硅片清洗烘干装置 |
CN109304318A (zh) * | 2018-11-30 | 2019-02-05 | 上海华力微电子有限公司 | 一种晶圆清洗装置及清洗方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4554146B2 (ja) * | 2002-09-24 | 2010-09-29 | 忠弘 大見 | 回転式シリコンウエハ洗浄装置 |
JP4219799B2 (ja) * | 2003-02-26 | 2009-02-04 | 大日本スクリーン製造株式会社 | 基板処理装置 |
KR100568103B1 (ko) * | 2003-08-19 | 2006-04-05 | 삼성전자주식회사 | 반도체 기판 세정 장치 및 세정 방법 |
-
2019
- 2019-07-05 CN CN201910605488.3A patent/CN110335839B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1194454A (zh) * | 1997-01-24 | 1998-09-30 | 东京电子株式会社 | 清洗装置及清洗方法 |
JP2005277151A (ja) * | 2004-03-25 | 2005-10-06 | Ihito Takahira | 洗浄装置 |
CN103170469A (zh) * | 2011-12-22 | 2013-06-26 | 中芯国际集成电路制造(上海)有限公司 | 用于清洗和干燥晶圆盒的装置及方法 |
CN108212926A (zh) * | 2018-03-23 | 2018-06-29 | 郑州金恒电子技术有限公司 | 一种新型硅片清洗烘干装置 |
CN109304318A (zh) * | 2018-11-30 | 2019-02-05 | 上海华力微电子有限公司 | 一种晶圆清洗装置及清洗方法 |
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CN110335839A (zh) | 2019-10-15 |
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Effective date of registration: 20211019 Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1323, block a, city gate, No.1 Jinye Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder |