CN109873068A - A kind of eutectic machine - Google Patents
A kind of eutectic machine Download PDFInfo
- Publication number
- CN109873068A CN109873068A CN201910014348.9A CN201910014348A CN109873068A CN 109873068 A CN109873068 A CN 109873068A CN 201910014348 A CN201910014348 A CN 201910014348A CN 109873068 A CN109873068 A CN 109873068A
- Authority
- CN
- China
- Prior art keywords
- semi
- conductive support
- chip
- plate body
- positioning device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005496 eutectics Effects 0.000 title claims abstract description 23
- 238000010438 heat treatment Methods 0.000 claims abstract description 24
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 14
- 230000007246 mechanism Effects 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 4
- 230000010354 integration Effects 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 4
- 230000001360 synchronised effect Effects 0.000 abstract description 3
- 230000006872 improvement Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Landscapes
- Die Bonding (AREA)
Abstract
The invention discloses a kind of eutectic machines, including rack, dispenser, positioning device, heating device, chip carrier and manipulator, semi-conductive support is positioned by positioning device, semi-conductive support can be moved along direction as defined in positioning device, heating device is installed in positioning device and synchronizes and heats to semi-conductive support, it is provided with an exposed division on the positioning device, exposed division can manifest semi-conductive support, it is moved on semi-conductive support to allow manipulator to clamp chip from chip carrier, then chip is pressed on semi-conductive support, pass through the heating of heating device, semi-conductive support is set to reach eutectic temperature, then under the pressure of manipulator, chip and semi-conductive support is set to form eutectic reaction, chip and semi-conductive support is set to be incorporated into one, this mode, heating is synchronous existing with clamping, it reduces The step of brush coating water, and lead to hypereutectic mode, chip and semi-conductive support are more difficult to separate, and structure is more stable.
Description
Technical field
The present invention relates to manufacture field, especially a kind of eutectic machine.
Background technique
LED lamp etc. is that now very common product needs for LED chip to be installed on semi-conductive support during fabrication,
Existing manufacture is to first pass through a gum brush to paint one layer of glue on semi-conductive support, is then incited somebody to action by manipulator
Chip is pasted on semi-conductive support, this mode, is needed by brush coating water and is pasted two procedures, and passes through stickup
LED chip due to largely distributing for its heat, is easy that bond effect is made to fail, to be detached from after prolonged use.
Summary of the invention
It is set in order to solve the above technical problems, preferably being produced the purpose of the present invention is to provide a kind of more simple and effect
It is standby.
The present invention is that technical solution used by solving the problems, such as is:
A kind of eutectic machine, comprising:
Rack；
Dispenser, the dispenser are set in rack, and the dispenser is for placing semi-conductive support；
Positioning device, for the positioning device for positioning to semi-conductive support, semi-conductive support can be along the positioning
Direction as defined in device is mobile, is provided with exposed division in the positioning device, the exposed division can appear the semiconductor branch
Frame；
Heating device, the heating device are set in positioning device, and heating device to semi-conductive support for being added
Heat；
Chip carrier, the chip carrier are located in rack, and chip placement is used on the chip carrier；
Manipulator, the manipulator is for clamping the chip on chip carrier and being moved to the exposed division, to be placed in
On the semi-conductive support manifested.
As a further improvement of the above technical scheme, the positioning device includes the first plate body and the second plate body, described
First plate body and the second plate body mutually cover conjunction, are formed between first plate body and the second plate body together through slot, the semiconductor
Bracket can be moved along described through slot, and the exposed division is a through-hole for being set to the first plate body surface, the through-hole with pass through
Wears groove is connected to manifest the semi-conductive support.
As a further improvement of the above technical scheme, first plate body is made into integration with the second plate body.
As a further improvement of the above technical scheme, perforation, the perforation and through-hole are provided on second plate body
Position is corresponding, and the perforation is connected with described through slot, thrustor is additionally provided in the rack, the thrustor can
To pass through the perforation to semi-conductive support described in pushing tow.
As a further improvement of the above technical scheme, the positioning device bottom is additionally provided with driving device, the drive
Dynamic device is used to drive the position of positioning device, to adjust the position of semi-conductive support.
As a further improvement of the above technical scheme, the chip carrier bottom is also equipped with driving mechanism, the driving
Mechanism is used to adjust the position of bogie to adjust the position of chip.
As a further improvement of the above technical scheme, camera is provided with above the exposed division and above chip carrier
Guiding device.
As a further improvement of the above technical scheme, the manipulator includes mechanical arm and clamping jaw, and the clamping jaw is true
Suction disk.
It as a further improvement of the above technical scheme, further include a pedestal, the pedestal is set in rack, described
One end of mechanical arm is installed on the pedestal and can move up and down relative to pedestal, and the mechanical arm can be revolved relative to installation point
Turn, so that vacuum chuck be made to move back and forth between exposed division from chip carrier.
As a further improvement of the above technical scheme, air-guiding hole is additionally provided on the mechanical arm, the air-guiding hole is used
In reduction air drag.
The beneficial effects of the present invention are: being positioned by positioning device to semi-conductive support, semi-conductive support can be along institute
It is mobile to state direction as defined in positioning device, heating device synchronizes heat to semi-conductive support at this time, sets on the positioning device
It is equipped with an exposed division, exposed division can manifest semi-conductive support, partly lead so that manipulator be allow to clamp chip and be moved to
On body support frame, then chip is pressed on semi-conductive support, by the heating of heating device, semi-conductive support is made to reach eutectic temperature
Degree makes chip and semi-conductive support form eutectic reaction, to make chip and semi-conductive support then under the pressure of manipulator
Be incorporated into one, this mode, heating with clamping be it is synchronous existing, the step of the brush coating water of reduction, and lead to hypereutectic
Mode, chip and semi-conductive support are more difficult to separate, and structure is more stable.
Detailed description of the invention
Explanation and specific embodiment are further explained explanation to the present invention with reference to the accompanying drawing.
Fig. 1 is the structural schematic diagram of the preferred embodiment for the present invention；
Fig. 2 is partial enlargement structural representation at the A of Fig. 1；
Fig. 3 is the preferred structure schematic diagram of positioning device in the present invention；
Fig. 4 is the structural schematic diagram of manipulator in the preferred embodiment for the present invention；
Fig. 5 is a kind of existing structural schematic diagram of semi-conductive support.
Specific embodiment
Referring to figs. 1 to Fig. 5, a kind of eutectic machine, comprising:
Rack 10；
Dispenser 20, the dispenser 20 are set in rack 10, and the dispenser 20 is for placing semi-conductive support 70；
Positioning device 30, for the positioning device 30 for positioning to semi-conductive support 70, semi-conductive support 70 can edge
Direction as defined in the positioning device 30 is mobile, is provided with exposed division in the positioning device 30, the exposed division can appear
The semi-conductive support 70；
Heating device, the heating device are set in positioning device 30, heating device be used for semi-conductive support 70 into
Row heating；
Chip carrier 40, the chip carrier 40 are located in rack 10, and chip placement is used on the chip carrier 40；
Manipulator 50, the manipulator 50 are used to clamp the chip on chip carrier 40 and be moved to the exposed division, thus
It is placed on the semi-conductive support 70 manifested.
Semi-conductive support 70 is positioned by positioning device 30, semi-conductive support 70 can be advised along the positioning device 30
Fixed direction is mobile, and heating device, which synchronizes, at this time heats semi-conductive support 70, and one is provided in positioning device 30
Exposed division, exposed division can manifest semi-conductive support 70, so that so that manipulator 50 is clamped chip is moved to semiconductor branch
On frame 70, then chip is pressed on semi-conductive support 70, by the heating of heating device, semi-conductive support 70 is made to reach eutectic
Temperature makes chip and semi-conductive support 70 form eutectic reaction, to make chip and partly lead then under the pressure of manipulator 50
The step of body support frame 70 is incorporated into one, and this mode, it is synchronous existing for heating with clamping, the brush coating water of reduction, Er Qietong
Hypereutectic mode, chip and semi-conductive support 70 are more difficult to separate, and structure is more stable.
The positioning device 30 can be able to be one piece of positioning plate, be equipped on the positioning plate there are many embodiment
Locating slot, semi-conductive support 70 are located in the locating slot, and are moved along the direction that locating slot limits, but such as Fig. 5 institute
The semi-conductive support 70 shown, very thin thickness, whole more soft, this mode is easy to run, and further progress is improved, described
Positioning device 30 includes the first plate body 31 and the second plate body 33, and first plate body 31 and 33 phase lid of the second plate body close, and described the
It is formed between one plate body 31 and the second plate body 33 together through slot 34, the semi-conductive support 70 can be moved along described through slot 34
Dynamic, the exposed division is a through-hole 32 for being set to 31 surface of the first plate body, the through-hole 32 with run through slot 34 be connected from
And manifest the semi-conductive support 70.By the mating reaction of the first plate body 31 and the second plate body 33, so as to further
The deformation of limitation semi-conductive support 70 is run.Certainly, first plate body 31 and the second plate body 33 may be to be made into integration.
When manipulator 50 pushes in order to prevent, insufficient pressure, further progress is improved, and is provided on second plate body 33
Perforation, the perforation is corresponding with 32 position of through-hole, and the perforation is connected with described through slot 34, also sets up in the rack 10
There is thrustor 35, the thrustor 35 can pass through the perforation to semi-conductive support 70 described in pushing tow.Work as manipulator
50, which clamp chip, brakes to 70 surface of semi-conductive support, and when chip is pressed on semi-conductive support 70, thrustor 35
Synchronize and push away, by thrustor 35 above push away and the suppressing action of manipulator 50, so that chip and semiconductor be effectively ensured
Pressure between bracket 70, to complete eutectic reaction.
Further progress is improved, and 30 bottom of positioning device is additionally provided with driving device 81, and the driving device 81 is used
In the position of driving positioning device 30, to adjust the position of semi-conductive support 70, and then when in use can be according to practical feelings
Condition is adjusted.Similarly, it is also equipped with driving mechanism 80 in 40 bottom of chip carrier, the driving mechanism 80 is driven for adjusting
The position of moving frame is to adjust the position of chip.The driving device 81 and driving mechanism 80 are preferably two-dimensional movement device.
Further progress is improved, in order to enable manipulator 50 accurately to clamp chip and accurately be moved to semi-conductive support
70 the characteristics of position, be provided with camera guiding device above the exposed division and above chip carrier 40, guided by camera,
So that the position on 70 surface of position and semi-conductive support of chip is accurately positioned, to control the movement of manipulator 50.
The manipulator 50 includes mechanical arm 51 and clamping jaw 52, since existing most of chip volume is all more small and exquisite,
Common clamping jaw 52 is difficult to clamp it, and further progress is improved, and the clamping jaw 52 is vacuum chuck, passes through vacuum chuck
Clamping jaw 52 is drawn, to can effectively solve this problem.
Further progress is improved, and further includes a pedestal 60, the pedestal 60 is set in rack 10, the mechanical arm 51
One end be installed on the pedestal 60 and can be moved up and down relative to pedestal 60, the mechanical arm 51 can be revolved relative to installation point
Turn, so that vacuum chuck be made to move back and forth between exposed division from chip carrier 40, this mode is filled in conjunction with above-mentioned driving
81 and driving structure are set, move mechanical arm 51 only in fixed range, and are led by camera guiding to chip and partly
Body support frame 70 is positioned, later by driver 81 and driving structure, to adjust semi-conductive support 70 and chip
The position of frame 40 enables chip or semi-conductive support 70 to be directed at the position of gripper, and such purpose, which is further to control, to be missed
Difference is not easy to control because gripper bring error is larger on tiny position.
Further progress is improved, and is additionally provided with air-guiding hole 53 on the mechanical arm 51, and the air-guiding hole 53 is for reducing sky
Atmidometer, to further reduce gripper bring error.
The dispenser 20 can be existing disc type dispenser 20, because of semi-conductive support 70 as shown in Figure 5, go out
It is most of all to be packed in rolls when factory.Certainly, can also be also according to the difference of semi-conductive support 70, it is of different shapes fixed to replace
Position device 30 and dispenser 20.
The above is only a preferred embodiment of the present invention, is not intended to limit the scope of the invention, all in the present invention
Inventive concept under, using equivalent structure transformation made by description of the invention and accompanying drawing content, be applied directly or indirectly in
Other related technical areas are included in scope of patent protection of the invention.
Claims (10)
1. a kind of eutectic machine characterized by comprising
Rack (10)；
Dispenser (20), the dispenser (20) are set on rack (10), and the dispenser (20) is for placing semiconductor branch
Frame (70)；
Positioning device (30), the positioning device (30) is for positioning semi-conductive support (70), semi-conductive support (70)
The direction as defined in the positioning device (30) is mobile, is provided with exposed division, the exposed division on the positioning device (30)
The semi-conductive support (70) can be appeared；
Heating device, the heating device are set on positioning device (30), heating device be used for semi-conductive support (70) into
Row heating；
Chip carrier (40), the chip carrier (40) are located on rack (10), and chip placement is used on the chip carrier (40)；
Manipulator (50), the manipulator (50) are used to clamp the chip on chip carrier (40) and be moved to the exposed division, from
And it is placed on the semi-conductive support (70) manifested.
2. a kind of eutectic machine as described in claim 1, it is characterised in that:
The positioning device (30) includes the first plate body (31) and the second plate body (33), first plate body (31) and the second plate body
(33) mutually lid closes, and is formed between first plate body (31) and the second plate body (33) and runs through slot (34) together, the semiconductor branch
Frame (70) can be along described through slot (34) movement, and the exposed division is a through-hole for being set to the first plate body (31) surface
(32), the through-hole (32) is connected with through slot (34) to manifest the semi-conductive support (70).
3. a kind of eutectic machine as claimed in claim 2, it is characterised in that:
First plate body (31) is made into integration with the second plate body (33).
4. a kind of eutectic machine as claimed in claim 2, it is characterised in that:
Perforation is provided on second plate body (33), the perforation is corresponding with through-hole (32) position, and the perforation is passed through with described
Wears groove (34) is connected, and is additionally provided with thrustor (35) on the rack (10), and the thrustor (35) can pass through institute
Perforation is stated to semi-conductive support (70) described in pushing tow.
5. a kind of eutectic machine as described in claim 1, it is characterised in that:
Positioning device (30) bottom is additionally provided with driving device (81), and the driving device (81) is for driving positioning device
(30) position, to adjust the position of semi-conductive support (70).
6. a kind of eutectic machine as claimed in claim 5, it is characterised in that:
Chip carrier (40) bottom is also equipped with driving mechanism (80), and the driving mechanism (80) is used to adjust the position of bogie
It sets to adjust the position of chip.
7. a kind of eutectic machine as described in claim 1 or 6, it is characterised in that:
Camera guiding device is provided with above the exposed division and above chip carrier (40).
8. a kind of eutectic machine as described in claim 1, it is characterised in that:
The manipulator (50) includes mechanical arm (51) and clamping jaw (52), and the clamping jaw (52) is vacuum chuck.
9. a kind of eutectic machine as claimed in claim 8, it is characterised in that:
It further include a pedestal (60), the pedestal (60) is set on rack (10), one end installation of the mechanical arm (51)
In that can move up and down on the pedestal (60) and relative to pedestal (60), the mechanical arm (51) can rotate relative to installation point,
To make vacuum chuck move back and forth between exposed division from chip carrier (40).
10. a kind of eutectic machine as claimed in claim 8, it is characterised in that:
It is additionally provided with air-guiding hole (53) on the mechanical arm (51), the air-guiding hole (53) is for reducing air drag.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910014348.9A CN109873068B (en) | 2019-01-08 | 2019-01-08 | Eutectic machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910014348.9A CN109873068B (en) | 2019-01-08 | 2019-01-08 | Eutectic machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109873068A true CN109873068A (en) | 2019-06-11 |
| CN109873068B CN109873068B (en) | 2024-03-15 |
Family
ID=66917527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910014348.9A Active CN109873068B (en) | 2019-01-08 | 2019-01-08 | Eutectic machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109873068B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113808976A (en) * | 2021-11-22 | 2021-12-17 | 武汉琢越光电有限公司 | Automatic eutectic machine of semiconductor chip |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009194234A (en) * | 2008-02-15 | 2009-08-27 | Renesas Technology Corp | Methods of manufacturing semiconductor device and semiconductor electronic component, and semiconductor electronic component |
| JP2013030607A (en) * | 2011-07-28 | 2013-02-07 | Nissan Motor Co Ltd | Method of manufacturing semiconductor apparatus and semiconductor apparatus |
| JP2015185689A (en) * | 2014-03-24 | 2015-10-22 | 日産自動車株式会社 | Packaging method of semiconductor and manufacturing device for semiconductor component |
| CN205406943U (en) * | 2016-02-26 | 2016-07-27 | 深圳市锐博自动化设备有限公司 | Full -automatic LD chip eutectic device |
| CN207116382U (en) * | 2017-09-05 | 2018-03-16 | 深圳市锐博自动化设备有限公司 | A kind of full-automatic eutectic machine |
| CN209312792U (en) * | 2019-01-08 | 2019-08-27 | 王耀村 | A kind of eutectic machine |
-
2019
- 2019-01-08 CN CN201910014348.9A patent/CN109873068B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009194234A (en) * | 2008-02-15 | 2009-08-27 | Renesas Technology Corp | Methods of manufacturing semiconductor device and semiconductor electronic component, and semiconductor electronic component |
| JP2013030607A (en) * | 2011-07-28 | 2013-02-07 | Nissan Motor Co Ltd | Method of manufacturing semiconductor apparatus and semiconductor apparatus |
| JP2015185689A (en) * | 2014-03-24 | 2015-10-22 | 日産自動車株式会社 | Packaging method of semiconductor and manufacturing device for semiconductor component |
| CN205406943U (en) * | 2016-02-26 | 2016-07-27 | 深圳市锐博自动化设备有限公司 | Full -automatic LD chip eutectic device |
| CN207116382U (en) * | 2017-09-05 | 2018-03-16 | 深圳市锐博自动化设备有限公司 | A kind of full-automatic eutectic machine |
| CN209312792U (en) * | 2019-01-08 | 2019-08-27 | 王耀村 | A kind of eutectic machine |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113808976A (en) * | 2021-11-22 | 2021-12-17 | 武汉琢越光电有限公司 | Automatic eutectic machine of semiconductor chip |
| CN113808976B (en) * | 2021-11-22 | 2022-03-01 | 武汉琢越光电有限公司 | Automatic eutectic machine of semiconductor chip |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109873068B (en) | 2024-03-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2009295847A (en) | Mounting device and mounting method | |
| CN209312792U (en) | A kind of eutectic machine | |
| CN109873068A (en) | A kind of eutectic machine | |
| CN105283941A (en) | Apparatus and method for taping adhesive film on semiconductor substrate | |
| CN104934351B (en) | Material binding appts | |
| CN111681970A (en) | Patch device for solid wax | |
| CN109599355B (en) | Wafer closes frame and tears mucilage binding and put | |
| JP2017059582A (en) | Sheet sticking device and sheet sticking method | |
| CN215356747U (en) | Laser cutting equipment | |
| CN105952748A (en) | Transistor continuous assembling and dispensing device | |
| CN205731840U (en) | A kind of transistor assembling point glue continuous processing equipment | |
| CN110931836B (en) | Battery film wrapping device | |
| JP4417824B2 (en) | Film sticking apparatus and film sticking method | |
| WO2016186192A1 (en) | Device for bonding film | |
| JP2006111006A (en) | Edge adhering method and edge adhering device | |
| WO2002001612A3 (en) | Mechanical clamper for heated substrates at die attach | |
| CN213974814U (en) | Packing carton pastes mark positioner | |
| US3379601A (en) | Arrangement for pasting metal foils on bottles in tin-foiling machines and the like | |
| CN212759433U (en) | Optical module packaging device | |
| JP2004296907A (en) | Substrate laminating apparatus | |
| CN209493144U (en) | A kind of strip sticking device for curved surface | |
| JP3652906B2 (en) | Automatic labeling machine | |
| CN108688309B (en) | Automatic gilding press | |
| CN209908927U (en) | T5LED integrated support lamp gluing and strip pasting device | |
| JP2015035452A (en) | Sheet sticking apparatus and sheet sticking method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240326 Address after: One of the first floors, No. 6 Yongxiang 6th Lane, Guangfeng South Road, Leixi 1st Community, Xiaolan Town, Zhongshan City, Guangdong Province, 528415 Patentee after: Zhongshan Xiliang Technology Co.,Ltd. Country or region after: China Address before: 6th Floor, No. 13, Guangle North Road, Lianfeng, Xiaolan Town, Zhongshan City, Guangdong Province, 528400 Patentee before: Wang Yaocun Country or region before: China |