CN209312792U - A kind of eutectic machine - Google Patents
A kind of eutectic machine Download PDFInfo
- Publication number
- CN209312792U CN209312792U CN201920031747.1U CN201920031747U CN209312792U CN 209312792 U CN209312792 U CN 209312792U CN 201920031747 U CN201920031747 U CN 201920031747U CN 209312792 U CN209312792 U CN 209312792U
- Authority
- CN
- China
- Prior art keywords
- semi
- conductive support
- chip
- positioning device
- plate body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Die Bonding (AREA)
Abstract
The utility model discloses a kind of eutectic machines, including rack, dispenser, positioning device, heating device, chip carrier and manipulator, semi-conductive support is positioned by positioning device, semi-conductive support can be moved along direction as defined in positioning device, heating device is installed in positioning device and synchronizes and heats to semi-conductive support, it is provided with an exposed division on the positioning device, exposed division can manifest semi-conductive support, it is moved on semi-conductive support to allow manipulator to clamp chip from chip carrier, then chip is pressed on semi-conductive support, pass through the heating of heating device, semi-conductive support is set to reach eutectic temperature, then under the pressure of manipulator, chip and semi-conductive support is set to form eutectic reaction, chip and semi-conductive support is set to be incorporated into one, this mode, heating is synchronous existing with clamping, subtract The step of few brush coating water, and lead to hypereutectic mode, chip and semi-conductive support are more difficult to separate, and structure is more stable.
Description
Technical field
The utility model relates to manufacture field, especially a kind of eutectic machine.
Background technique
LED lamp etc. is that now very common product needs for LED chip to be installed on semi-conductive support during fabrication,
Existing manufacture is to first pass through a gum brush to paint one layer of glue on semi-conductive support, is then incited somebody to action by manipulator
Chip is pasted on semi-conductive support, this mode, is needed by brush coating water and is pasted two procedures, and passes through stickup
LED chip due to largely distributing for its heat, is easy that bond effect is made to fail, to be detached from after prolonged use.
Utility model content
In order to solve the above technical problems, the purpose of this utility model is to provide a kind of more simple and effects preferably to give birth to
Produce equipment.
The utility model is that technical solution used by solving the problems, such as is:
A kind of eutectic machine, comprising:
Rack；
Dispenser, the dispenser are set in rack, and the dispenser is for placing semi-conductive support；
Positioning device, for the positioning device for positioning to semi-conductive support, semi-conductive support can be along the positioning
Direction as defined in device is mobile, is provided with exposed division in the positioning device, the exposed division can appear the semiconductor branch
Frame；
Heating device, the heating device are set in positioning device, and heating device to semi-conductive support for being added
Heat；
Chip carrier, the chip carrier are located in rack, and chip placement is used on the chip carrier；
Manipulator, the manipulator is for clamping the chip on chip carrier and being moved to the exposed division, to be placed in
On the semi-conductive support manifested.
As a further improvement of the above technical scheme, the positioning device includes the first plate body and the second plate body, described
First plate body and the second plate body mutually cover conjunction, are formed between first plate body and the second plate body together through slot, the semiconductor
Bracket can be moved along described through slot, and the exposed division is a through-hole for being set to the first plate body surface, the through-hole with pass through
Wears groove is connected to manifest the semi-conductive support.
As a further improvement of the above technical scheme, first plate body is made into integration with the second plate body.
As a further improvement of the above technical scheme, perforation, the perforation and through-hole are provided on second plate body
Position is corresponding, and the perforation is connected with described through slot, thrustor is additionally provided in the rack, the thrustor can
To pass through the perforation to semi-conductive support described in pushing tow.
As a further improvement of the above technical scheme, the positioning device bottom is additionally provided with driving device, the drive
Dynamic device is used to drive the position of positioning device, to adjust the position of semi-conductive support.
As a further improvement of the above technical scheme, the chip carrier bottom is also equipped with driving mechanism, the driving
Mechanism is used to adjust the position of bogie to adjust the position of chip.
As a further improvement of the above technical scheme, camera is provided with above the exposed division and above chip carrier
Guiding device.
As a further improvement of the above technical scheme, the manipulator includes mechanical arm and clamping jaw, and the clamping jaw is true
Suction disk.
It as a further improvement of the above technical scheme, further include a pedestal, the pedestal is set in rack, described
One end of mechanical arm is installed on the pedestal and can move up and down relative to pedestal, and the mechanical arm can be revolved relative to installation point
Turn, so that vacuum chuck be made to move back and forth between exposed division from chip carrier.
As a further improvement of the above technical scheme, air-guiding hole is additionally provided on the mechanical arm, the air-guiding hole is used
In reduction air drag.
The beneficial effects of the utility model are: being positioned by positioning device to semi-conductive support, semi-conductive support can
The direction as defined in the positioning device is moved, and heating device synchronizes heat to semi-conductive support at this time, in positioning device
On be provided with an exposed division, exposed division can manifest semi-conductive support, be moved to so that manipulator be allow to clamp chip
On semi-conductive support, then chip is pressed on semi-conductive support, by the heating of heating device, reaches semi-conductive support altogether
Brilliant temperature makes chip and semi-conductive support form eutectic reaction, to make chip and semiconductor then under the pressure of manipulator
The step of bracket is incorporated into one, and this mode, it is synchronous existing for heating with clamping, the brush coating water of reduction, and by altogether
Brilliant mode, chip and semi-conductive support are more difficult to separate, and structure is more stable.
Detailed description of the invention
Explanation and specific embodiment are further explained explanation to the utility model with reference to the accompanying drawing.
Fig. 1 is the structural schematic diagram of the preferred embodiments of the present invention；
Fig. 2 is partial enlargement structural representation at the A of Fig. 1；
Fig. 3 is the preferred structure schematic diagram of positioning device in the utility model；
Fig. 4 is the structural schematic diagram of manipulator in the preferred embodiments of the present invention；
Fig. 5 is a kind of existing structural schematic diagram of semi-conductive support.
Specific embodiment
Referring to figs. 1 to Fig. 5, a kind of eutectic machine, comprising:
Rack 10；
Dispenser 20, the dispenser 20 are set in rack 10, and the dispenser 20 is for placing semi-conductive support 70；
Positioning device 30, for the positioning device 30 for positioning to semi-conductive support 70, semi-conductive support 70 can edge
Direction as defined in the positioning device 30 is mobile, is provided with exposed division in the positioning device 30, the exposed division can appear
The semi-conductive support 70；
Heating device, the heating device are set in positioning device 30, heating device be used for semi-conductive support 70 into
Row heating；
Chip carrier 40, the chip carrier 40 are located in rack 10, and chip placement is used on the chip carrier 40；
Manipulator 50, the manipulator 50 are used to clamp the chip on chip carrier 40 and be moved to the exposed division, thus
It is placed on the semi-conductive support 70 manifested.
Semi-conductive support 70 is positioned by positioning device 30, semi-conductive support 70 can be advised along the positioning device 30
Fixed direction is mobile, and heating device, which synchronizes, at this time heats semi-conductive support 70, and one is provided in positioning device 30
Exposed division, exposed division can manifest semi-conductive support 70, so that so that manipulator 50 is clamped chip is moved to semiconductor branch
On frame 70, then chip is pressed on semi-conductive support 70, by the heating of heating device, semi-conductive support 70 is made to reach eutectic
Temperature makes chip and semi-conductive support 70 form eutectic reaction, to make chip and partly lead then under the pressure of manipulator 50
The step of body support frame 70 is incorporated into one, and this mode, it is synchronous existing for heating with clamping, the brush coating water of reduction, Er Qietong
Hypereutectic mode, chip and semi-conductive support 70 are more difficult to separate, and structure is more stable.
The positioning device 30 can be able to be one piece of positioning plate, be equipped on the positioning plate there are many embodiment
Locating slot, semi-conductive support 70 are located in the locating slot, and are moved along the direction that locating slot limits, but such as Fig. 5 institute
The semi-conductive support 70 shown, very thin thickness, whole more soft, this mode is easy to run, and further progress is improved, described
Positioning device 30 includes the first plate body 31 and the second plate body 33, and first plate body 31 and 33 phase lid of the second plate body close, and described the
It is formed between one plate body 31 and the second plate body 33 together through slot 34, the semi-conductive support 70 can be moved along described through slot 34
Dynamic, the exposed division is a through-hole 32 for being set to 31 surface of the first plate body, the through-hole 32 with run through slot 34 be connected from
And manifest the semi-conductive support 70.By the mating reaction of the first plate body 31 and the second plate body 33, so as to further
The deformation of limitation semi-conductive support 70 is run.Certainly, first plate body 31 and the second plate body 33 may be to be made into integration.
When manipulator 50 pushes in order to prevent, insufficient pressure, further progress is improved, and is provided on second plate body 33
Perforation, the perforation is corresponding with 32 position of through-hole, and the perforation is connected with described through slot 34, also sets up in the rack 10
There is thrustor 35, the thrustor 35 can pass through the perforation to semi-conductive support 70 described in pushing tow.Work as manipulator
50, which clamp chip, brakes to 70 surface of semi-conductive support, and when chip is pressed on semi-conductive support 70, thrustor 35
Synchronize and push away, by thrustor 35 above push away and the suppressing action of manipulator 50, so that chip and semiconductor be effectively ensured
Pressure between bracket 70, to complete eutectic reaction.
Further progress is improved, and 30 bottom of positioning device is additionally provided with driving device 81, and the driving device 81 is used
In the position of driving positioning device 30, to adjust the position of semi-conductive support 70, and then when in use can be according to practical feelings
Condition is adjusted.Similarly, it is also equipped with driving mechanism 80 in 40 bottom of chip carrier, the driving mechanism 80 is driven for adjusting
The position of moving frame is to adjust the position of chip.The driving device 81 and driving mechanism 80 are preferably two-dimensional movement device.
Further progress is improved, in order to enable manipulator 50 accurately to clamp chip and accurately be moved to semi-conductive support
70 the characteristics of position, be provided with camera guiding device above the exposed division and above chip carrier 40, guided by camera,
So that the position on 70 surface of position and semi-conductive support of chip is accurately positioned, to control the movement of manipulator 50.
The manipulator 50 includes mechanical arm 51 and clamping jaw 52, since existing most of chip volume is all more small and exquisite,
Common clamping jaw 52 is difficult to clamp it, and further progress is improved, and the clamping jaw 52 is vacuum chuck, passes through vacuum chuck
Clamping jaw 52 is drawn, to can effectively solve this problem.
Further progress is improved, and further includes a pedestal 60, the pedestal 60 is set in rack 10, the mechanical arm 51
One end be installed on the pedestal 60 and can be moved up and down relative to pedestal 60, the mechanical arm 51 can be revolved relative to installation point
Turn, so that vacuum chuck be made to move back and forth between exposed division from chip carrier 40, this mode is filled in conjunction with above-mentioned driving
81 and driving structure are set, move mechanical arm 51 only in fixed range, and are led by camera guiding to chip and partly
Body support frame 70 is positioned, later by driver 81 and driving structure, to adjust semi-conductive support 70 and chip
The position of frame 40 enables chip or semi-conductive support 70 to be directed at the position of gripper, and such purpose, which is further to control, to be missed
Difference is not easy to control because gripper bring error is larger on tiny position.
Further progress is improved, and is additionally provided with air-guiding hole 53 on the mechanical arm 51, and the air-guiding hole 53 is for reducing sky
Atmidometer, to further reduce gripper bring error.
The dispenser 20 can be existing disc type dispenser 20, because of semi-conductive support 70 as shown in Figure 5, go out
It is most of all to be packed in rolls when factory.Certainly, can also be also according to the difference of semi-conductive support 70, it is of different shapes fixed to replace
Position device 30 and dispenser 20.
The above is only the preferred embodiments of the utility model, and therefore it does not limit the scope of the patent of the utility model, all
Under the utility model design of the utility model, equivalent structure made based on the specification and figures of the utility model becomes
It changes, is similarly included in other related technical fields in the scope of patent protection for being included in the utility model.
Claims (10)
1. a kind of eutectic machine characterized by comprising
Rack (10)；
Dispenser (20), the dispenser (20) are set on rack (10), and the dispenser (20) is for placing semiconductor branch
Frame (70)；
Positioning device (30), the positioning device (30) is for positioning semi-conductive support (70), semi-conductive support (70)
The direction as defined in the positioning device (30) is mobile, is provided with exposed division, the exposed division on the positioning device (30)
The semi-conductive support (70) can be appeared；
Heating device, the heating device are set on positioning device (30), heating device be used for semi-conductive support (70) into
Row heating；
Chip carrier (40), the chip carrier (40) are located on rack (10), and chip placement is used on the chip carrier (40)；
Manipulator (50), the manipulator (50) are used to clamp the chip on chip carrier (40) and be moved to the exposed division, from
And it is placed on the semi-conductive support (70) manifested.
2. a kind of eutectic machine as described in claim 1, it is characterised in that:
The positioning device (30) includes the first plate body (31) and the second plate body (33), first plate body (31) and the second plate body
(33) mutually lid closes, and is formed between first plate body (31) and the second plate body (33) and runs through slot (34) together, the semiconductor branch
Frame (70) can be along described through slot (34) movement, and the exposed division is a through-hole for being set to the first plate body (31) surface
(32), the through-hole (32) is connected with through slot (34) to manifest the semi-conductive support (70).
3. a kind of eutectic machine as claimed in claim 2, it is characterised in that:
First plate body (31) is made into integration with the second plate body (33).
4. a kind of eutectic machine as claimed in claim 2, it is characterised in that:
Perforation is provided on second plate body (33), the perforation is corresponding with through-hole (32) position, and the perforation is passed through with described
Wears groove (34) is connected, and is additionally provided with thrustor (35) on the rack (10), and the thrustor (35) can pass through institute
Perforation is stated to semi-conductive support (70) described in pushing tow.
5. a kind of eutectic machine as described in claim 1, it is characterised in that:
Positioning device (30) bottom is additionally provided with driving device (81), and the driving device (81) is for driving positioning device
(30) position, to adjust the position of semi-conductive support (70).
6. a kind of eutectic machine as claimed in claim 5, it is characterised in that:
Chip carrier (40) bottom is also equipped with driving mechanism (80), and the driving mechanism (80) is used to adjust the position of bogie
It sets to adjust the position of chip.
7. a kind of eutectic machine as described in claim 1 or 6, it is characterised in that:
Camera guiding device is provided with above the exposed division and above chip carrier (40).
8. a kind of eutectic machine as described in claim 1, it is characterised in that:
The manipulator (50) includes mechanical arm (51) and clamping jaw (52), and the clamping jaw (52) is vacuum chuck.
9. a kind of eutectic machine as claimed in claim 8, it is characterised in that:
It further include a pedestal (60), the pedestal (60) is set on rack (10), one end installation of the mechanical arm (51)
In that can move up and down on the pedestal (60) and relative to pedestal (60), the mechanical arm (51) can rotate relative to installation point,
To make vacuum chuck move back and forth between exposed division from chip carrier (40).
10. a kind of eutectic machine as claimed in claim 8, it is characterised in that:
It is additionally provided with air-guiding hole (53) on the mechanical arm (51), the air-guiding hole (53) is for reducing air drag.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920031747.1U CN209312792U (en) | 2019-01-08 | 2019-01-08 | A kind of eutectic machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920031747.1U CN209312792U (en) | 2019-01-08 | 2019-01-08 | A kind of eutectic machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209312792U true CN209312792U (en) | 2019-08-27 |
Family
ID=67680780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920031747.1U Expired - Fee Related CN209312792U (en) | 2019-01-08 | 2019-01-08 | A kind of eutectic machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209312792U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109873068A (en) * | 2019-01-08 | 2019-06-11 | 王耀村 | A kind of eutectic machine |
-
2019
- 2019-01-08 CN CN201920031747.1U patent/CN209312792U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109873068A (en) * | 2019-01-08 | 2019-06-11 | 王耀村 | A kind of eutectic machine |
| CN109873068B (en) * | 2019-01-08 | 2024-03-15 | 王耀村 | Eutectic machine |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2018176842A1 (en) | Adhesive sticking device | |
| CN209312792U (en) | A kind of eutectic machine | |
| CN206028080U (en) | Transfusion system pipe adds mucilage binding outward and puts | |
| CN109648329A (en) | A kind of water pump valve component assembling equipment | |
| CN109873068A (en) | A kind of eutectic machine | |
| CN111681970A (en) | Patch device for solid wax | |
| CN205731840U (en) | A kind of transistor assembling point glue continuous processing equipment | |
| CN110931836B (en) | Battery film wrapping device | |
| CN213974814U (en) | Packing carton pastes mark positioner | |
| CN212759433U (en) | Optical module packaging device | |
| US3379601A (en) | Arrangement for pasting metal foils on bottles in tin-foiling machines and the like | |
| CN202384299U (en) | Wafer bonding device | |
| CN208855102U (en) | A kind of facial tissue feeder of carton forming | |
| CN209908927U (en) | T5LED integrated support lamp gluing and strip pasting device | |
| CN209493144U (en) | A kind of strip sticking device for curved surface | |
| CN108688309B (en) | Automatic gilding press | |
| CN204916411U (en) | Automatic labeller | |
| CN220444291U (en) | Frock fixed establishment of semiconductor spreading machine | |
| CN111755558A (en) | Jacking rotary mechanism and rubberizing system | |
| CN216054587U (en) | Third bearing table of pressure attaching device | |
| CN214515738U (en) | High-precision gluing equipment | |
| CN215904834U (en) | Automatic packagine machine equipment of carousel formula | |
| JP2015035452A (en) | Sheet sticking apparatus and sheet sticking method | |
| CN218769457U (en) | Wafer centering device and rubber coating developing machine | |
| CN206898573U (en) | A kind of brake backing plate dust cover mash welder indexing mechanism |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190827 Termination date: 20220108 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |