TWI703078B - Electronic component conveying device, electronic component inspection device and suction member - Google Patents
Electronic component conveying device, electronic component inspection device and suction member Download PDFInfo
- Publication number
- TWI703078B TWI703078B TW107137935A TW107137935A TWI703078B TW I703078 B TWI703078 B TW I703078B TW 107137935 A TW107137935 A TW 107137935A TW 107137935 A TW107137935 A TW 107137935A TW I703078 B TWI703078 B TW I703078B
- Authority
- TW
- Taiwan
- Prior art keywords
- electronic component
- mounting
- suction
- suction member
- inspection
- Prior art date
Links
Images
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Manipulator (AREA)
Abstract
本發明提供一種吸附構件之更換作業變得容易之電子零件搬送裝置及電子零件檢查裝置。 本發明之電子零件搬送裝置之特徵在於具備搬送部,其搬送電子零件,上述搬送部具有:吸附構件,其可吸附上述電子零件;及安裝部,其可裝卸地安裝上述吸附構件,於上述吸附構件設有第1扣合部,於上述安裝部設有第2扣合部,該第2扣合部可移位至扣合於上述第1扣合部之第1位置,及未扣合於上述第1扣合部之第2位置。The present invention provides an electronic component conveying device and an electronic component inspection device which facilitate the replacement operation of an adsorption member. The electronic component conveying device of the present invention is characterized by having a conveying section for conveying electronic components, and the conveying section has: an adsorbing member capable of adsorbing the electronic component; and a mounting section detachably mounting the adsorbing member to the adsorbing member The component is provided with a first buckling portion, and the mounting portion is provided with a second buckling portion. The second buckling portion can be shifted to the first position of the first buckling portion and not buckled in The second position of the first engaging portion.
Description
本發明係關於電子零件搬送裝置及電子零件檢查裝置。The present invention relates to an electronic component conveying device and an electronic component inspection device.
自先前以來,可對IC器件進行電性試驗之IC處理機為已知(例如參照專利文獻1)。專利文獻1所記載之IC處理機中,作為搬送IC器件之搬送部,具有金屬性墊配接器,及安裝於金屬性墊配接器之橡膠墊。且,可以橡膠墊吸附IC器件,直接進行搬送。又,橡膠墊係對應於IC器件之大小或種類而更換成大小等不同者。 [先前技術文獻] [專利文獻]Conventionally, an IC processor capable of performing electrical tests on IC devices has been known (for example, refer to Patent Document 1). The IC processor described in
[專利文獻1]日本專利特開平08-267383號公報[Patent Document 1] Japanese Patent Laid-Open No. 08-267383
[發明所欲解決之問題][The problem to be solved by the invention]
於如此構成之IC處理機,例如有藉由金屬性墊配接器與橡膠墊之螺合而安裝者。該情形時,進行橡膠墊之更換作業時,必須使橡膠墊旋轉而緊固於金屬墊配接器,或進行扭矩管理等,其更換作業較繁雜。 [解決問題之技術手段]For the IC processor constructed in this way, there is, for example, one that is installed by screwing a metallic pad adapter and a rubber pad. In this case, when replacing the rubber pad, it is necessary to rotate the rubber pad to fasten it to the metal pad adapter, or perform torque management, and the replacement operation is complicated. [Technical means to solve the problem]
本發明係用以解決上述問題之至少一部分而完成者,可作為以下者實現。The present invention is accomplished to solve at least a part of the above-mentioned problems, and can be realized as the following.
本發明之電子零件搬送裝置之特徵在於具備搬送部,其搬送電子零件, 上述搬送部具有:吸附構件,其可吸附上述電子零件;及安裝部,其可裝卸地安裝上述吸附構件, 於上述吸附構件設有第1扣合部, 於上述安裝部設有第2扣合部,該第2扣合部可移位至與上述第1扣合部扣合而成為安裝有上述吸附構件之安裝狀態之第1位置,及解除上述安裝狀態之第2位置。The electronic component conveying device of the present invention is characterized by having a conveying section for conveying electronic components, and the conveying section has: an adsorbing member capable of adsorbing the electronic component; and a mounting section for detachably mounting the adsorbing member to the adsorbing member The member is provided with a first buckling portion, and the mounting portion is provided with a second buckling portion, and the second buckling portion can be displaced to buckle with the first buckling portion to become an installation state where the suction member is installed The first position, and the second position to release the above installation state.
藉此,藉由拉伸安裝於安裝部之安裝狀態之吸附構件,而可使吸附構件容易且迅速地自安裝部脫離。又,對於尚未安裝吸附構件之狀態之安裝部,可藉由押入吸附構件,而將吸附構件容易且迅速地安裝於安裝部。如上述,吸附構件對於安裝部之裝卸變得迅速且容易。藉此,可對應於電子零件之種類,容易進行更換吸附構件之作業。As a result, the suction member can be easily and quickly detached from the installation part by stretching the suction member installed in the installation state of the installation part. In addition, for the attachment part in the state where the adsorption member has not been attached, the adsorption member can be easily and quickly mounted to the attachment part by pushing in the adsorption member. As described above, the attachment and detachment of the suction member to the mounting part becomes quick and easy. Thereby, it can correspond to the type of electronic parts, and the operation of replacing the suction member can be easily performed.
本發明之電子零件搬送裝置中,較佳為上述吸附構件具有管狀部,其以上述安裝狀態***於上述安裝部, 上述第1扣合部係以設置於上述管狀部之外周部之凹部構成, 上述第2扣合部係以於上述第1位置扣合於上述凹部之凸部構成。In the electronic component conveying device of the present invention, it is preferable that the suction member has a tubular portion inserted into the mounting portion in the mounted state, and the first engaging portion is constituted by a concave portion provided on an outer peripheral portion of the tubular portion, The second engaging portion is constituted by a convex portion that is engaged with the concave portion at the first position.
藉此,可容易進行吸附構件對安裝部之裝卸操作,其結果,對應於電子零件種類之吸附構件之更換作業變容易。Thereby, the attaching and detaching operation of the suction member to the mounting part can be easily performed, and as a result, the replacement operation of the suction member corresponding to the type of electronic component becomes easy.
本發明之電子零件搬送裝置中,較佳為上述凹部係以沿著上述管狀部之外周部之周向而設之槽構成, 上述凸部係以於上述第1位置沿著上述槽複數個配置之球體構成。In the electronic component conveying device of the present invention, it is preferable that the concave portion is formed by a groove formed along the circumferential direction of the outer peripheral portion of the tubular portion, and the convex portion is arranged in plural along the groove at the first position The sphere constitutes.
藉此,可容易進行吸附構件對安裝部之裝卸操作,其結果,對應於電子零件種類之吸附構件之更換作業變容易。Thereby, the attaching and detaching operation of the suction member to the mounting part can be easily performed, and as a result, the replacement operation of the suction member corresponding to the type of electronic component becomes easy.
本發明之電子零件搬送裝置中,較佳為上述安裝部具有操作部,其可進行上述第2扣合部自上述第1位置向上述第2位置之移位之操作。In the electronic component conveying device of the present invention, it is preferable that the mounting portion has an operation portion that can perform an operation for displacing the second engaging portion from the first position to the second position.
藉此,操作操作部時,可使安裝於安裝部之吸附構件脫離,或與此相反地,將吸附構件安裝於尚未被安裝吸附構件之安裝部。Thereby, when the operation part is operated, the suction member mounted on the mounting part can be detached, or, conversely, the suction member can be mounted on the mounting part where the suction member has not yet been mounted.
本發明之電子零件搬送裝置中,較佳為上述安裝部具有彈推部,其對上述操作部彈推,限制上述第2扣合部之移位。In the electronic component conveying device of the present invention, it is preferable that the mounting portion has an elastic pushing portion that elastically pushes the operating portion to restrict the displacement of the second engaging portion.
藉此,可防止處於安裝狀態之吸附構件自安裝部不經意地脫離。Thereby, the suction member in the installed state can be prevented from being accidentally separated from the installation part.
本發明之電子零件搬送裝置中,較佳為上述吸附構件係準備複數個對應於上述電子零件之種類而形狀及大小中之至少一者不同者, 選擇上述複數個吸附構件中之一者,並安裝於上述安裝部。In the electronic component conveying device of the present invention, it is preferable that the adsorption member prepares a plurality of different ones of at least one of shape and size corresponding to the type of the electronic component, and selects one of the plurality of adsorption members, and Install in the above-mentioned mounting part.
藉此,可將適於各種電子零件之吸附構件安裝於安裝部,藉此,可藉由該吸附構件,穩定地吸附電子零件。Thereby, the suction member suitable for various electronic components can be mounted on the mounting part, whereby the electronic component can be stably suctioned by the suction member.
本發明之電子零件搬送裝置中,較佳為上述吸附構件具備:第1構件,其具有以上述安裝狀態***於上述安裝部之管狀部;及第2構件,其與上述第1構件連接使用,具有可吸附上述電子零件之吸附墊。In the electronic component transport device of the present invention, it is preferable that the suction member includes: a first member having a tubular portion inserted into the mounting portion in the mounted state; and a second member used in connection with the first member, It has an adsorption pad that can adsorb the above electronic parts.
藉此,例如若將第1構件設為共通構件,準備複數個形狀或大小不同之第2構件,則可將適於各種電子零件之吸附構件安裝於安裝部。Thereby, for example, if the first member is a common member and a plurality of second members having different shapes or sizes are prepared, the suction member suitable for various electronic components can be attached to the mounting portion.
本發明之電子零件搬送裝置中,較佳為上述第2構件係準備複數個對應於上述電子零件之種類而形狀及大小中之至少一者不同者, 選擇上述複數個第2構件中之一者,並安裝於上述第1構件。In the electronic component transport device of the present invention, it is preferable that the second member prepares a plurality of different ones of at least one of shape and size corresponding to the type of the electronic component, and selects one of the plurality of second members , And installed in the first member above.
藉此,可將適於各種電子零件之吸附構件安裝於安裝部。Thereby, the suction member suitable for various electronic parts can be mounted on the mounting part.
本發明之電子零件搬送裝置中,較佳為上述第2構件對上述第1構件之連接操作,及上述第1構件與上述第2構件之連接解除操作,係於使上述吸附構件自上述安裝部脫離之狀態下進行。In the electronic component conveying device of the present invention, it is preferable that the connection operation of the second member to the first member and the disconnection operation of the first member and the second member are performed by causing the suction member to be removed from the mounting portion Carried out in a state of being separated.
藉此,例如進行連接、脫離作業時,相比於設為安裝狀態之情形,可更容易進行其作業。Thereby, when connecting and disconnecting, for example, the operation can be performed more easily than when it is set in the installed state.
本發明之電子零件搬送裝置中,較佳為於上述第1構件設有內螺紋, 於上述第2構件,設有與上述第1構件連接時與上述內螺紋螺合之外螺紋。In the electronic component transfer device of the present invention, it is preferable that the first member is provided with an internal thread, and the second member is provided with an external thread that is screwed to the internal thread when connected to the first member.
藉此,例如作為第2構件,可將先前之旋入式吸附構件連接於第1構件而使用。Thereby, for example, as the second member, the conventional screw-in suction member can be connected to the first member and used.
本發明之電子零件搬送裝置中,較佳為上述安裝部具有限制部,其限制吸附於上述吸附構件之上述電子零件繞垂直軸之旋轉。In the electronic component conveying device of the present invention, it is preferable that the mounting portion has a restricting portion that restricts the rotation of the electronic component sucked to the suction member about a vertical axis.
藉此,例如電子零件為俯視時呈四角形狀者之情形時,可防止相鄰之電子零件彼此干涉。By this, for example, when the electronic components are quadrangular in plan view, it is possible to prevent adjacent electronic components from interfering with each other.
本發明之電子零件檢查裝置之特徵在於具備搬送部,其搬送電子零件;及 檢查部,其檢查上述電子零件, 上述搬送部具有:吸附構件,其可吸附上述電子零件;及安裝部,其可裝卸地安裝上述吸附構件, 於上述吸附構件設有第1扣合部, 於上述安裝部設有第2扣合部,該第2扣合部可移位至與上述第1扣合部扣合而成為安裝有上述吸附構件之安裝狀態之第1位置,及解除上述安裝狀態之第2位置。The electronic component inspection device of the present invention is characterized in that it includes a conveying part that conveys electronic parts; and an inspection part that inspects the electronic parts. The conveying part has: an adsorption member that can adsorb the electronic parts; and a mounting part that can The suction member is detachably mounted, a first engaging portion is provided on the suction member, and a second engaging portion is provided on the mounting portion, and the second engaging portion can be displaced to engage with the first engaging portion It becomes the first position in the installation state where the suction member is installed, and the second position in the installation state released.
藉此,藉由拉伸安裝於安裝部之安裝狀態之吸附構件,可使吸附構件容易且迅速地自安裝部脫離。又,對於尚未安裝吸附構件之狀態之安裝部,可藉由押入吸附構件,而將吸附構件容易且迅速地安裝於安裝部。如上述,吸附構件對於安裝部之裝卸變得迅速且容易。藉此,可對應於電子零件種類,容易進行更換吸附構件之作業。Thereby, by stretching the suction member installed in the installation state of the installation part, the suction member can be easily and quickly detached from the installation part. In addition, for the attachment part in the state where the adsorption member has not been attached, the adsorption member can be easily and quickly mounted to the attachment part by pushing in the adsorption member. As described above, the attachment and detachment of the suction member to the mounting part becomes quick and easy. Thereby, it can correspond to the type of electronic parts, and the operation of replacing the suction member can be easily performed.
又,可將電子零件搬送至檢查部,藉此,可以檢查部進行對該電子零件之檢查。又,可自檢查部搬送檢查後之電子零件。In addition, the electronic component can be transported to the inspection unit, whereby the inspection unit can inspect the electronic component. In addition, electronic parts after inspection can be transported from the inspection department.
以下,基於隨附圖式所示之較佳實施形態,詳細說明本發明之電子零件搬送裝置及電子零件檢查裝置。Hereinafter, the electronic component transport device and the electronic component inspection device of the present invention will be described in detail based on the preferred embodiments shown in the accompanying drawings.
<第1實施形態>以下,參照圖1~圖8,針對本發明之電子零件搬送裝置及電子零件檢查裝置之第1實施形態進行說明。另,於以下,為了便於說明,如圖1所示,將互相正交之3軸設為X軸、Y軸及Z軸。又,包含X軸與Y軸之XY平面成為水平,Z軸成為垂直。又,亦將平行於X軸之方向稱為「X方向(第1方向)」,將平行於Y軸之方向稱為「Y方向(第2方向)」,將平行於Z軸之方向稱為「Z方向(第3方向)」。又,將各方向之箭頭朝向之方向稱為「正」,將其相反方向稱為「負」。又,於本案說明書言及之「水平」並非限定於完全水平,只要不阻礙電子零件之搬送,則亦包含相對於水平略微(例如小於±5°左右)傾斜之狀態。又,有將圖1、圖3~圖8中(關於圖9~圖13亦相同)之上側,即Z軸方向正側稱為「上」或「上方」,將下側,即Z軸方向負側稱為「下」或「下方」之情況。<First Embodiment> Hereinafter, with reference to FIGS. 1 to 8, the first embodiment of the electronic component conveying device and the electronic component inspection device of the present invention will be described. In addition, in the following, for convenience of explanation, as shown in FIG. 1, the three axes orthogonal to each other are referred to as X axis, Y axis, and Z axis. In addition, the XY plane including the X axis and the Y axis becomes horizontal, and the Z axis becomes vertical. In addition, the direction parallel to the X axis is also called "X direction (first direction)", the direction parallel to the Y axis is called "Y direction (second direction)", and the direction parallel to the Z axis is called "Z direction (3rd direction)". In addition, the direction in which the arrows of each direction face is called "positive", and the opposite direction is called "negative". In addition, the "level" mentioned in the specification of this case is not limited to a complete level, as long as it does not hinder the transportation of electronic components, it also includes a state slightly inclined (for example, less than ±5°) relative to the level. In addition, the upper side in FIGS. 1, 3 to 8 (the same as in FIGS. 9 to 13), that is, the positive side in the Z-axis direction is called "upper" or "upper", and the lower side, that is, the Z-axis direction The negative side is called "down" or "down".
本發明之電子零件搬送裝置10係具有圖1所示之外觀者。該電子零件搬送裝置10具備搬送部25,其搬送電子零件即IC器件90。搬送部25具有:吸附構件3,其可吸附IC器件90(電子零件);及安裝部4,其可裝卸地安裝吸附構件3。於吸附構件3,設有第1扣合部331。於安裝部4,設有第2扣合部42,其移位至與第1扣合部331扣合而成為安裝有吸附構件3之安裝狀態之第1位置,及解除安裝狀態之第2位置。The electronic
另,本實施形態中,作為吸附並搬送IC器件90者,於搬送部25包含器件搬送頭13、器件搬送頭17、及器件搬送頭20。以下,針對將本發明應用於器件搬送頭13之例進行說明,但應用部位不限於器件搬送頭13,亦可應用於器件搬送頭17或器件搬送頭20。In addition, in this embodiment, as the
根據如此之本發明,如後述,藉由拉伸安裝於安裝部4之安裝狀態之吸附構件3,而可使吸附構件3容易且迅速地自安裝部4脫離。又,對於尚未安裝吸附構件3之狀態之安裝部4,可藉由押入吸附構件3,而將吸附構件3容易且迅速地安裝於安裝部4。如上述,吸附構件3對於安裝部4之裝卸變得迅速且容易。藉此,可對應於IC器件90之種類,容易進行更換吸附構件3之作業。According to the present invention in this way, as described later, by stretching the
又,如圖2所示,本發明之電子零件檢查裝置1係具有電子零件搬送裝置10,進而具備檢查電子零件之檢查部16之測試系統(test system)。即,電子零件檢查裝置1係具備搬送電子零件即IC器件90之搬送部25,及檢查IC器件90(電子零件)之檢查部16之測試系統。搬送部25具有:吸附構件3,其可吸附IC器件90(電子零件);及安裝部4,其可裝卸地安裝於吸附構件3。於吸附構件3,設有第1扣合部331。於安裝部4,設有第2扣合部42,其可移位至與第1扣合部331扣合而成為安裝有吸附構件3之安裝狀態之第1位置,及解除安裝狀態之第2位置。Furthermore, as shown in FIG. 2, the electronic
藉此,獲得具備上述電子零件搬送裝置10之優點之電子零件檢查裝置1。又,可將IC器件90(電子零件)搬送至檢查部16,藉此,可以檢查部16進行對該IC器件90之檢查。又,可自檢查部16搬送檢查後之IC器件90。Thereby, an electronic
以下,針對各部之構成進行詳細說明。 如圖1、圖2所示,具有電子零件搬送裝置10之電子零件檢查裝置1為如下裝置:例如搬送BGA(Ball Grid Array:球柵格陣列)封裝即IC器件等電子零件,於其搬送過程中檢查、試驗(以下簡稱為「檢查」)電子零件之電性特性。另,於以下,為了便於說明,針對使用IC器件作為上述電子零件之情形,作為代表進行說明,且將該IC器件設為「IC器件90」。IC器件90於本實施形態中成為呈平板狀者(參照圖4)。Hereinafter, the structure of each part will be described in detail. As shown in Figures 1 and 2, the electronic
另,作為IC器件,除上述者以外,列舉例如「LSI(Large Scale Integration:大型積體電路)」、「CMOS(Complementary Metal Oxide Semiconductor:互補金屬氧化物半導體)」、「CCD(Charge Coupled Device:電荷耦合器件)」、將IC器件複數個模組化並封裝化之「模組IC」、「石英器件」、「壓力感測器」、「慣性感測器(加速度感測器)」、「陀螺感測器」、「指紋感測器」等。In addition, as IC devices, in addition to the above, for example, "LSI (Large Scale Integration: large integrated circuit)", "CMOS (Complementary Metal Oxide Semiconductor: Complementary Metal Oxide Semiconductor)", "CCD (Charge Coupled Device: Charge-coupled device)”, “Modular IC”, “Quartz Device”, “Pressure Sensor”, “Inertial Sensor (Acceleration Sensor)”, “Module IC”, “Quartz Device”, “Pressure Sensor”, “Inertial Sensor (Acceleration Sensor)”, “ "Gyro Sensor", "Fingerprint Sensor", etc.
電子零件檢查裝置1(電子零件搬送裝置10)具備:托盤供給區域A1、器件供給區域A2、檢查區域A3、器件回收區域A4、及托盤去除區域A5,該等區域如後述,係以各壁部分隔。並且,IC器件90係自托盤供給區域A1至托盤去除區域A5按箭頭α90方向依序經由上述各區域,且於中途之檢查區域A3進行檢查。如此,電子零件檢查裝置1成為具備如下者:電子零件搬送裝置10,其具有以經由各區域之方式搬送IC器件90之搬送部25;檢查部16,其於檢查區域A3內進行檢查;及控制部800。又,此外,電子零件檢查裝置1具備:監視器300、信號燈400、及操作面板700。The electronic component inspection device 1 (electronic component conveying device 10) is provided with: a tray supply area A1, a component supply area A2, an inspection area A3, a component recovery area A4, and a tray removal area A5. These areas are described below, and each wall part Separated. In addition, the
另,電子零件檢查裝置1為配置托盤供給區域A1及托盤去除區域A5方,即,圖2中之下側成為正面側,配置檢查區域A3方,即,圖2中之上側作為背面側使用。In addition, the electronic
又,電子零件檢查裝置1係預先搭載按IC器件90種類作更換之稱為「更換套件」者而使用。於該更換套件,有載置IC器件90(電子零件)之載置部(電子零件載置部)。本實施形態之電子零件檢查裝置1中,該載置部係設置於複數個部位,例如有後述之溫度調整部12、器件供給部14及器件回收部18。又,於載置IC器件90(電子零件)之載置部(電子零件載置部),除了如上述之更換套件外,亦有使用者準備之托盤200、回收用托盤19,亦有檢查部16。In addition, the electronic
托盤供給區域A1係被供給排列有未檢查狀態之複數個IC器件90之托盤200之供材部。托盤供給區域A1亦可說是可重疊複數個托盤200而搭載之搭載區域。另,本實施形態中,於各托盤200,矩陣狀配置有複數個凹部(凹槽)。可於各凹部逐個收納並載置IC器件90。The tray supply area A1 is the material supply part of the
器件供給區域A2係將自托盤供給區域A1搬送而來之托盤200上之複數個IC器件90分別搬送並供給至檢查區域A3之區域。另,以跨及托盤供給區域A1與器件供給區域A2之方式,設置有於水平方向逐片搬送托盤200之托盤搬送機構11A、11B。托盤搬送機構11A為搬送部25之一部分,可將托盤200連同載置於該托盤200之IC器件90一起,於Y方向正側,即圖2中之箭頭α11A方向移動。藉此,可將IC器件90穩定地送至器件供給區域A2。又,托盤搬送機構11B係可將空的托盤200於Y方向負側,即圖2中之箭頭α11B方向移動之移動部。藉此,可將空的托盤200自器件供給區域A2移動至托盤供給區域A1。The device supply area A2 transports and supplies a plurality of
於器件供給區域A2,設有溫度調整部(均溫板(英語記作:soak plate))12、器件搬送頭13、及托盤搬送機構15。又,亦設有以跨及器件供給區域A2與檢查區域A3之方式移動之器件供給部14。In the device supply area A2, a temperature adjustment section (soak plate (English: soak plate)) 12, a
溫度調整部12為載置複數個IC器件90之載置部,係可將該載置之IC器件90一起加熱或冷卻之稱為「均溫板」。藉由該均溫板,可預先加熱或冷卻以檢查部16檢查前之IC器件90,並調整至適於該檢查(高溫檢查)之溫度。The
作為如此之載置部之溫度調整部12係被固定。藉此,可對該溫度調整部12上之IC器件90穩定地調整溫度。The
又,溫度調整部12經接地(grounded)。 於圖2所示之構成中,溫度調整部12係於Y方向上配置並固定有2個。且,將藉由托盤搬送機構11A自托盤供給區域A1搬入之托盤200上之IC器件90搬送至任一溫度調整部12。In addition, the
器件搬送頭13係固持並搬送IC器件90之固持部,於器件供給區域A2內可移動地被支持。該器件搬送頭13亦為搬送部25之一部分,可負責自托盤供給區域A1搬入之托盤200與溫度調整部12間之IC器件90之搬送,及溫度調整部12與後述之器件供給部14間之IC器件90之搬送。另,於圖2中,將器件搬送頭13之X方向之移動以箭頭α13X表示,將器件搬送頭13之Y方向之移動以箭頭α13Y表示。The
器件供給部14為載置經溫度調整之IC器件90之載置部,係可將該IC器件90搬送至檢查部16附近之稱為「供給用梭板」或簡稱為「供給梭」者。該器件供給部14亦可成為搬送部25之一部分。於該器件供給部14,矩陣狀配置有複數個凹部(凹槽)。可於各凹部逐個收納並載置IC器件90。The
又,作為載置部之器件供給部14於X方向,即沿著箭頭α14方向,可於器件供給區域A2與檢查部16之檢查區域A3之間往返移動(可移動)地被支持。藉此,器件供給部14可將IC器件90自器件供給區域A2穩定地搬送至檢查區域A3之檢查部16附近,又,可將IC器件90於檢查區域A3藉由器件搬送頭17卸除後再次返回至器件供給區域A2。In addition, the
圖2所示之構成中,器件供給部14於Y方向配置有2個,將Y方向負側之器件供給部14稱為「器件供給部14A」,將Y方向正側之器件供給部14稱為「器件供給部14B」。且,將溫度調整部12上之IC器件90於器件供給區域A2內搬送至器件供給部14A或器件供給部14B。又,器件供給部14與溫度調整部12同樣地,構成為可加熱或冷卻載置於該器件供給部14之IC器件90。藉此,可對經溫度調整部12溫度調整之IC器件90,維持其溫度調整狀態,且將其搬送至檢查區域A3之檢查部16附近。又,器件供給部14亦與溫度調整部12同樣地接地。In the structure shown in FIG. 2, there are two
托盤搬送機構15係使已去除所有IC器件90之狀態之空的托盤200於器件供給區域A2內,於X方向正側即箭頭α15方向搬送之機構。且,於該搬送後,將空的托盤200藉由托盤搬送機構11B,自器件供給區域A2返回至托盤供給區域A1。The
檢查區域A3係檢查IC器件90之區域。於該檢查區域A3,設有對IC器件90進行檢查之檢查部16,及器件搬送頭17。The inspection area A3 is an area where the
器件搬送頭17為搬送部25之一部分,與溫度調整部12同樣地,構成為可加熱或冷卻所固持之IC器件90。藉此,可於固持經維持上述溫度調整狀態之IC器件90,以維持上述溫度調整狀態之狀態,於檢查區域A3內搬送IC器件90。The
如此之器件搬送頭17於檢查區域A3內於Y方向及Z方向可往返移動地被支持,成為稱為「分度臂」之機構之一部分。藉此,器件搬送頭17可將IC器件90從自器件供給區域A2搬入之器件供給部14提起,並將其搬送並載置於檢查部16上。Such a
另,於圖2中,將器件搬送頭17之Y方向之往返移動以箭頭α17Y表示。又,器件搬送頭17於Y方向可往返移動地被支持,但並未限定於此,亦可於X方向可往返移動地被支持。又,圖2所示之構成中,器件搬送頭17於Y方向配置有2個,有將Y方向負側之器件搬送頭17稱為「器件搬送頭17A」,將Y方向正側之器件搬送頭17稱為「器件搬送頭17B」之情況。器件搬送頭17A可負責於檢查區域A3內,使IC器件90自器件供給部14A向檢查部16之搬送,器件搬送頭17B可負責於檢查區域A3內,使IC器件90自器件供給部14B向檢查部16之搬送。In addition, in FIG. 2, the reciprocating movement of the
檢查部16(插槽)為載置電子零件即IC器件90,檢查該IC器件90之電性特性之載置部(電子零件載置部)。該檢查部16具有收納並載置IC器件90之凹部,於該凹部之底部,設有複數個探針銷。且,藉由將IC器件90之端子與探針銷可導電地連接,即接觸,而可進行IC器件90之檢查。IC器件90之檢查係基於記憶於連接於檢查部16之測試器所具備之檢查控制部之程式而進行。另,如此之檢查部16與溫度調整部12同樣,可將IC器件90加熱或冷卻,而將該IC器件90調整為適於檢查之溫度。The inspection portion 16 (slot) is a mounting portion (electronic component mounting portion) for mounting an
器件回收區域A4係將於檢查區域A3進行檢查,且結束該檢查之複數個IC器件90予以回收之區域。於該器件回收區域A4,設置有回收用托盤19、器件搬送頭20、及托盤搬送機構21。又,亦設有以跨及檢查區域A3與器件回收區域A4之方式移動之器件回收部18。又,於器件回收區域A4亦準備有空的托盤200。The device recovery area A4 is an area where the inspection will be performed in the inspection area A3, and a plurality of
器件回收部18為載置經檢查部16檢查結束之IC器件90,可將該IC器件90搬送至器件回收區域A4之載置部,稱為「回收用梭板」或簡稱為「回收梭」。該器件回收部18亦可成為搬送部25之一部分。The
又,器件回收部18可沿著X方向,即α18方向,於檢查區域A3與器件回收區域A4之間往返移動地被支持。又,圖2所示之構成中,器件回收部18與器件供給部14同樣地,於Y方向配置有2個,有將Y方向負側之器件回收部18稱為「器件回收部18A」,將Y方向正側之器件回收部18稱為「器件回收部18B」之情況。且,將檢查部16上之IC器件90搬送、載置於器件回收部18A或器件回收部18B。另,IC器件90自檢查部16向器件回收部18A之搬送係由器件搬送頭17A負責,自檢查部16向器件回收部18B之搬送係由器件搬送頭17B負責。又,器件回收部18亦與溫度調整部12或器件供給部14同樣經接地。In addition, the
回收用托盤19係載置經檢查部16檢查之IC器件90之載置部,以於器件回收區域A4內不移動之方式固定。藉此,即使為配置有較多器件搬送頭20等之各種可動部之回收區域A4,亦於回收用托盤19上,穩定地載置完成檢查之IC器件90。另,於圖2所示之構成中,回收用托盤19沿X方向配置有3個。The
又,空的托盤200亦沿X方向配置有3個。該空的托盤200亦成為載置經檢查部16檢查之IC器件90之載置部。且,將移動來到器件回收區域A4之器件回收部18上之IC器件90搬送並載置於回收用托盤19及空的托盤200中之任一者。藉此,將IC器件90依檢查結果分類,並回收。In addition, three
器件搬送頭20具有於器件回收區域A4內於X方向及Y方向可移動地被支持,進而於Z方向亦可移動之部分。該器件搬送頭20係搬送部25之一部分,可將IC器件90自器件回收部18搬送至回收用托盤19或空的托盤200。另,於圖2中,將器件搬送頭20之X方向之移動以箭頭α20X表示,將器件搬送頭20之Y方向之移動以箭頭α20Y表示。The
托盤搬送機構21係於器件回收區域A4內,於X方向即箭頭α21方向,搬送自托盤去除區域A5搬入之空的托盤200之機構。且,於該搬送後,將空的托盤200配置於回收IC器件90之位置,即,可成為上述3個空的托盤200中之任一者。The
托盤去除區域A5係將排列有完成檢查狀態之複數個IC器件90之托盤200回收並去除之除材部。於托盤去除區域A5,可堆疊多個托盤200。The tray removal area A5 is a removal part for collecting and removing the
又,以跨及器件回收區域A4與托盤去除區域A5之方式,設置有於Y方向逐片搬送托盤200之托盤搬送機構22A、托盤搬送機構22B。托盤搬送機構22A係搬送部25之一部分,係可使托盤200於Y方向即箭頭α22A方向往返移動之移動部。藉此,可將完成檢查之IC器件90自器件回收區域A4搬送至托盤去除區域A5。又,托盤搬送機構22B可將用以回收IC器件90之空的托盤200於Y方向正側,即箭頭α22B方向移動。藉此,可將空的托盤200自托盤去除區域A5移動至器件回收區域A4。In addition, a
控制部800具有至少1個處理器,該處理器進行各種判斷或各種命令等。控制部800例如可控制如下各部之作動:托盤搬送機構11A、托盤搬送機構11B、溫度調整部12、器件搬送頭13、器件供給部14、托盤搬送機構15、檢查部16、器件搬送頭17、器件回收部18、器件搬送頭20、托盤搬送機構21、托盤搬送機構22A、及托盤搬送機構22B等。The
另,本實施形態中,控制部800係內置於電子零件檢查裝置1,但並不限定於此。例如,控制部800亦可設置於外部之電腦等外部機器。又,該外部機器有例如經由電纜等與電子零件檢查裝置1通信之情形、無線通信之情形、及經由網路(網際網路)與電子零件檢查裝置1連接之情形等。In addition, in this embodiment, the
操作員可經由監視器300,設定並確認電子零件檢查裝置1之動作條件等。該監視器300具有例如以液晶畫面構成之顯示畫面301,並配置於電子零件檢查裝置1之正面側上部。如圖1所示,於托盤去除區域A5之圖中之右側,設有載置滑鼠之滑鼠台600。該滑鼠係於操作顯示於監視器300之畫面時使用。The operator can set and confirm the operating conditions and the like of the electronic
又,對監視器300於圖1之右下方配置有操作面板700。操作面板700係與監視器300分開,對電子零件檢查裝置1命令期望之動作者。In addition, an
又,信號燈400可藉由發光之顏色之組合,報知電子零件檢查裝置1之作動狀態等。信號燈400係配置於電子零件檢查裝置1之上部。另,於電子零件檢查裝置1,內置有揚聲器500,亦可藉由該揚聲器500,報知電子零件檢查裝置1之作動狀態等。In addition, the
電子零件檢查裝置1中,托盤供給區域A1與器件供給區域A2之間係由第1隔板231分隔,器件供給區域A2與檢查區域A3之間係由第2隔板232分隔,檢查區域A3與器件回收區域A4之間係由第3隔板233分隔,器件回收區域A4與托盤去除區域A5之間係由第4隔板234分隔。又,器件供給區域A2與器件回收區域A4之間亦係由第5隔板235分隔。In the electronic
電子零件檢查裝置1最外裝係由蓋覆蓋,該蓋有例如前蓋241、側蓋242、側蓋243、後蓋244及頂蓋245。The outermost of the electronic
如上述,電子零件檢查裝置1係預先搭載按IC器件90之種類作更換之稱為「更換套件」者而使用。As described above, the electronic
於器件搬送頭13,亦有可吸附IC器件90(電子零件)之吸附構件3,作為更換套件。吸附構件3係預先準備複數個對應於IC器件90(電子零件)之種類而形狀及大小中之至少一者(本實施形態中為吸附墊31之大小)不同者(參照圖3)。圖3中作為一例,係圖示吸附構件3A及吸附構件3B。且,選擇該等複數個吸附構件3(吸附構件3A及吸附構件3B)中之一者,將其安裝於安裝部4。藉此,可將適於各種IC器件90之吸附構件3安裝於安裝部4,因此,可以該吸附構件3穩定地吸附IC器件90。本實施形態中,根據IC器件90之大小,而選擇吸附構件3A及吸附構件3B之哪一者。IC器件90為「小」之情形時,選擇吸附構件3A,IC器件90為「大」之情形時,選擇吸附構件3B。以下,將吸附構件3安裝於安裝部4之狀態簡稱為「安裝狀態」。At the
另,本實施形態中,準備2個吸附構件3,但其數量並未特別限定,例如亦可為3個以上。In addition, in this embodiment, two
又,複數個吸附構件3於本實施形態中為部分大小不同者,但不限於此,例如可為全體大小不同者,可為部分形狀不同者,可為全體形狀不同者,亦可為形狀(部分、全體均可)及大小(部分、全體均可)之兩者不同者。In addition, in the present embodiment, the plurality of
又,複數個吸附構件3於本實施形態中為大小不同者,但不限於此,例如亦可為除了大小不同外,進而形狀(部分、全體均可)不同者,亦可僅形狀(部分、全體均可)不同者。In addition, the plurality of
如圖3所示,吸附構件3A及吸附構件3B除了吸附墊31之大小不同以外,由於為相同構成,故以下針對吸附構件3A代表性說明。As shown in FIG. 3, the
如圖4所示,吸附構件3A具有:吸附墊31,其可吸附IC器件90;支持部(吸附墊支持部)32,其支持吸附墊31;管狀部33,其以安裝狀態***於安裝部4;及支持部(管狀部支持部)34,其支持管狀部33。As shown in FIG. 4, the
吸附墊31為具有於下端面311開口之開口部312之呈圓筒狀(圓管狀)之部分。該吸附墊31下端面311與IC器件90之上表面抵接,可藉由於開口部312產生之吸引力吸附IC器件90。且,保持該吸附狀態下,器件搬送頭13可於器件供給區域A2內,搬送IC器件90。The
另,可藉由使經由安裝部4而連接之泵131作動,而於開口部312產生吸附力。In addition, by operating the
又,吸附墊31之外形形狀於本實施形態中為圓筒狀,但不限於此,例如亦可為角筒狀。如圖3所示,本實施形態中,吸附構件3A之吸附墊31及吸附構件3B之吸附墊31之外徑不同,即下端面311之大小不同。In addition, the outer shape of the
又,亦可於吸附墊31之外周側設置遮罩。藉此,可增大與吸附焊墊31之接觸面積,藉此可穩定地吸附IC器件90。對於該遮罩之外形形狀,並未特別限定,例如可設為俯視時成圓形或角形。In addition, a mask may be provided on the outer peripheral side of the
支持部32係支持吸附墊31之上端部,較吸附墊31之外徑更擴徑之部分。藉此,可牢固地支持吸附墊31。又,於支持部32之外周部,形成有板狀突出之凸緣部321。將吸附構件3A安裝於安裝部4時,若以指尖抓住凸緣部321而固持,則可容易進行其安裝作業。The supporting
於與吸附焊墊31之相反側,設有呈圓管狀之管狀部33。該管狀部33係於安裝狀態下***於安裝部4之部分。於管狀部33之外周部332,設有於安裝狀態下供安裝部4之第2扣合部42扣合之第1扣合部331。藉由該扣合,而維持安裝狀態,藉此,防止吸附構件3A自安裝部4不經意地脫離。On the opposite side of the
另,本實施形態中,第1扣合部331係以沿著管狀部33之外周部332之周向形成之環狀槽(凹部)構成,但不限於此,例如亦可根據第2扣合部42之構成(形狀),例如以於管狀部33之外周部332之複數部位凹陷形成之凹部、沿著管狀部33之外周部332之周向突出形成之凸條、於管狀部33之外周部332之複數部位突出形成之複數個凸部等構成。In addition, in the present embodiment, the first engaging
支持部34係支持管狀部33之下端部,較管狀部33之外徑更擴徑之部分。藉此,可牢固地支持管狀部33。又,亦可限制管狀部33向安裝部4之***界限(參照圖4)。The supporting
如上構成之吸附構件3A於內部自上方之管狀部33連通至下方之吸附焊墊31。The
另,吸附構件3A可為一體形成有吸附墊31、支持部32、管狀部33、支持部34者,亦可為分開構成該等中之至少一部分,將該單獨體接合者。In addition, the
作為吸附構件3A之構成材料,並未特別限定,例如可使用硬質之各種金屬材料或各種樹脂材料等。又,吸附構件3A亦可係以彈性材料構成吸附墊31。The constituent material of the
將如上構成之吸附構件3A裝卸自如地安裝於安裝部4。如圖3所示,安裝部4係設置於器件搬送頭13之基部132之下端部。又,安裝部4之配置數並未特別限定,例如可為1個,亦可為複數個。配置有複數個安裝部4之情形時,對於沿著X方向之配置數,及沿著Y方向之配置數,並未特別限定,例如可相同,亦可不同。The
如圖4~圖8所示,安裝部4具有內側筒狀部41;第2扣合部42,其可移位地支持於內側筒狀部41;操作部43,其進行可移位第2扣合部42之操作;及彈推部44,其對操作部43彈推。又,如圖3所示,安裝部4進而具有限制部45,其限制安裝狀態下之吸附構件3A(針對吸附構件3B亦相同)繞Z軸之旋轉。As shown in Figures 4 to 8, the mounting
內側筒狀部41係自基部132向下方圓管狀突出形成之部分。於該內側筒狀部41之內部空間411,以安裝狀態***吸附構件3A之管狀部33。藉此,內側筒狀部41之內部空間411與吸附構件3A之內部空間35連通。且,於該連通狀態下藉由泵131作動,而可將基部132之連接泵131之部分至吸附構件3A之內部空間35予以減壓。藉此,於吸附構件3A之吸附墊31之開口部312產生吸附力,可吸附IC器件90。The inner
如圖4(針對圖5~圖8亦相同)所示,於內側筒狀部41之內周部412,設有沿著其周向呈環狀之密封構件(襯墊)46。密封構件46係以彈性材料構成,於安裝狀態下,於內側管狀部41之內周部412與吸附構件3A之管狀部33之外周部332之間被壓縮,而彈性變形。藉此,將內側筒狀部41之內周部412與吸附構件3A之管狀部33之外周部332之間氣密地密封。因此,泵131作動時,可防止空氣自內側筒狀部41之內周部412與吸附構件3A之管狀部33之外周部332之間洩漏,而使於吸附墊31之開口部312產生之吸附力減少。藉此,可穩定地持續吸附IC器件90。As shown in FIG. 4 (the same for FIGS. 5 to 8), the inner
又,內側筒狀部41於較密封構件46更下方側之部分,具有自內部空間411放射狀形成之槽413。於各槽413,逐個收納有構成第2扣合部42之球體421。該球體421可沿著收納該球體421之槽413所形成之方向,於下述第1位置與第2位置間移動。In addition, the inner
第1位置係第2扣合部42(球體421)與吸附構件3(吸附構件3A或吸附構件3B)之第1扣合部331扣合,成為安裝有吸附構件3之安裝狀態之位置(參照圖4)。第2位置係解除安裝狀態之位置(參照圖6)。The first position is when the second engaging portion 42 (sphere 421) is engaged with the first engaging
如上述,吸附構件3具有以安裝狀態***於安裝部4之管狀部33。又,第1扣合部331(凹部)係以形成於管狀部33之外周部332之周向之槽(凹部)構成。且,第2扣合部42係以於第1位置扣合於第1扣合部331(凹部)之凸部構成。該凸部係以於第1位置沿著第1扣合部331(槽)複數個配置之球體421構成(參照圖4)。如此,藉由以球體421(凸部)構成第2扣合部42,如後述,可容易進行吸附構件3對安裝部4之裝卸操作,其結果,對應於IC器件90種類之吸附構件3之更換作業,即吸附構件3A與吸附構件3B之更換作業變容易。As described above, the
另,作為球體421之構成材料,並未特別限定,例如可使用如不鏽鋼等各種金屬材料。In addition, the constituent material of the
又,第2扣合部42於本實施形態中係構成為可於相對於內側筒狀部41之中心軸正交之方向移動,但不限於此,例如可構成為於內側筒狀部41之中心軸方向可移動,亦可構成為可繞內側筒狀部41之中心軸旋轉。In addition, the second engaging
安裝部4具有操作部43,其進行各球體421(第2扣合部42)可自第1位置向第2位置之移動(移位)之一次操作。操作部43係於內側筒狀部41之外周側,以與內側筒狀部41同心配置之筒體構成。該操作部43可於內側筒狀部41之中心軸方向,即沿著z方向,移動至上位置(參照圖5~圖7)及下位置(參照圖4、圖8)。另,操作部43於上位置,限制再向上方之移動界限,於下位置,亦限制再向下方之移動界限。The mounting
又,操作部43具有位於下位置時,可一起按壓各球體421之按壓部431。按壓部431係以沿著操作部43之內周部之周向突出形成之環狀之突出部構成。藉此,限制各球體421自第1位置移動至第2位置,藉此,可防止處於安裝狀態之吸附構件3自安裝部4脫離。In addition, the
又,操作部43位於上位置時,按壓部431自各球體421退避。藉此,解除按壓部431對各球體421之按壓力,藉此,各球體421可自第1位置移動至第2位置。且,該狀態下,例如可使安裝於安裝部4之吸附構件3脫離(參照圖5~圖7),與此相反地,可將吸附構件3安裝於尚未安裝吸附構件3之安裝部4。In addition, when the
安裝部4具有彈推部44,其將操作部43向下方彈推,限制第2扣合部42之移位。彈推部44於本實施形態中,係於內側筒狀部41與操作部43之間,以與該等同心配置之螺旋彈簧441構成。螺旋彈簧441其上端442自下方與突出形成於內側筒狀部41之外周部之突出部414抵接,下端443自上方與內側筒狀部41之按壓部431抵接。又,螺旋彈簧441於突出部414與按壓部413之間成為壓縮狀態。藉此,對操作部43作用向下方之彈推力。藉由該彈推力,維持操作部43位於下位置之狀態。藉此,限制各球體421自第1位置移動至第2位置,藉此,可防止處於安裝狀態之吸附構件3自安裝部4不經意地脫離。The mounting
如圖3所示,安裝部4具有限制部45,其與吸附構件3一起限制吸附於吸附構件3之IC器件90(電子零件)繞Z軸(垂直軸)之旋轉(關於「IC器件90吸附於吸附構件3之狀態」,參照圖4)。限制部45對於安裝部4設置於Y方向正側,係以自器件搬送頭13之基部132向Z方向負側(下方)棒狀突出形成之棒狀部451構成。該棒狀部451於圖3所示之構成中,外徑(粗度)沿著Z方向(長度方向)為固定,但不限於此,亦可有沿著Z方向變化之部分。As shown in Figure 3, the mounting
另一方面,於吸附構件3之凸緣部321,於Y方向正側之部分形成有缺口部322。於安裝狀態下,棒狀部451可插通並扣合於該缺口部322。藉此,限制IC器件90吸附於吸附構件3之狀態下,繞安裝部4(吸附構件3)之中心軸,即繞Z軸連同吸附構件3一起旋轉。藉由如此之旋轉限制,例如IC器件90為於俯視時成四角形狀者之情形時,可防止相鄰之IC器件90彼此干涉。又,由於維持IC器件90之姿勢,故該IC器件90順利地載置於其搬送目的地(例如器件供給部14之收納、載置IC器件90之凹部)。On the other hand, in the
繼而,針對對於安裝部4將吸附構件3A更換為吸附構件3B之作業,參照圖4~圖8進行說明。Next, the operation of replacing the
如圖4所示,吸附構件3A成為安裝於安裝部4之安裝狀態。該安裝狀態下,如上述,吸附構件3A之內部空間35與安裝部4之內部空間411連通。藉此,成為可藉泵131吸附IC器件90之狀態。As shown in FIG. 4, the
又,安裝部4之操作部43位於下位置,被螺旋彈簧411(彈推部44)彈推。該操作部43之按壓部431一起按壓位於第1位置之各球體421(第2扣合部42)。藉此,限制各球體421向第2位置之移動,藉此維持安裝狀態。In addition, the operating
繼而,如圖5所示,與螺旋彈簧411(彈推部44)之彈推力對抗,使操作部43移動至上位置。藉此,各球體421解除按壓部431之按壓力,藉此成為可移動至第2位置之狀態。Then, as shown in FIG. 5, opposing the elastic thrust of the coil spring 411 (the elastic pushing portion 44), the operating
繼而,如圖6所示,向下方拉伸吸附構件3A。藉此,各球體421越過吸附構件3A之第1扣合部331之上側之傾斜面331a,移動至第2位置。又,若進而向下方拉伸吸附構件3A,則各球體421於吸附構件3A之管狀部33之外周部332滑動。 因此,如圖7所示,吸附構件3A自安裝部4脫離。Then, as shown in FIG. 6, the
繼而,若解除使操作部43移動至上位置之力,則如圖8所示,操作部43藉由自重與螺旋彈簧44之彈推力,再次迅速返回至下位置。又,此時,操作部43之按壓部431可一起按壓位於第2位置之各球體421,返回至第1位置。Then, when the force for moving the operating
如此,可於保持將操作部43上提至上位置之狀態下,以向下方拉伸吸附構件3A之簡單操作,使吸附構件3A容易且迅速地自安裝部4脫離。In this way, the
又,將吸附構件3B安裝於安裝部4時,可藉由進行上述相反之操作,而進行其安裝。即,可於保持將操作部43上提至上位置之狀態下,以將吸附構件3B***於安裝部4之簡單操作,將吸附構件3B容易且迅速地安裝於安裝部4。又,若於內側筒狀部41,於各球體421之密封構件46側,設置可供各球體421移動之槽,則可不將操作部43向上提起,藉由管狀部33之外周部332押入各球體421。藉此,可不將操作部43向上提起,以將吸附構件3B押入於安裝部4之簡單操作,即可將吸附構件3B容易且迅速地安裝於安裝部4。In addition, when attaching the
如上述,電子零件檢查裝置1(電子零件搬送裝置10)中,可對應於IC器件90之種類,容易進行將吸附構件3A更換成吸附構件3B(或將吸附構件3B更換成吸附構件3A)之作業。藉此,移行至種類不同之IC器件90之檢查時,可迅速且順利地進行其移行。As mentioned above, the electronic component inspection device 1 (electronic component conveying device 10) can correspond to the type of
<第2實施形態>以下,參照圖9及圖10,針對本發明之電子零件搬送裝置及電子零件檢查裝置之第2實施形態進行說明,但以與上述實施形態之不同點為中心進行說明,相同事項省略其說明。<Second Embodiment> Hereinafter, referring to Figs. 9 and 10, the second embodiment of the electronic component transport device and the electronic component inspection device of the present invention will be described, but the description will be focused on the differences from the above-mentioned embodiment. The description of the same matters is omitted.
本實施形態除了安裝部省略限制吸附於吸附構件之IC器件之旋轉之限制部外,餘與上述第1實施形態相同。This embodiment is the same as the above-mentioned first embodiment except that the mounting portion omits the restricting portion that restricts the rotation of the IC device adsorbed to the suction member.
如圖9所示,以吸附構件3吸附IC器件90。該圖9所示之狀態下,吸附構件3之中心軸O3與器件供給部14之凹部141之中心軸O141不位於同一直線上,產生位置偏移。As shown in FIG. 9, the
又,本實施形態中,自安裝部4省略限制部45之部分,產生使處於安裝狀態之吸附構件3可於X方向、Y方向、Z方向之任一者稍微移動之「游隙」。藉此,如圖10所示,將IC器件90載置於器件供給部14之凹部141時,IC器件90可沿著凹部141之錐狀之側壁142,以上述遊隙量,抵消中心軸O3與中心軸O141之位置偏移。藉此,可將IC器件90順利地載置於器件供給部14之凹部141。In addition, in the present embodiment, the part of the restricting
<第3實施形態>以下,參照圖11,針對本發明之電子零件搬送裝置及電子零件檢查裝置之第3實施形態進行說明,但以與上述實施形態之不同點為中心進行說明,相同事項省略其說明。 本實施形態除了吸附構件之構成不同以外,餘與上述第1實施形態相同。<Third Embodiment> Hereinafter, referring to FIG. 11, a third embodiment of the electronic component conveying device and electronic component inspection device of the present invention will be described, but the description will focus on the differences from the above-mentioned embodiment, and the same items will be omitted Its description. This embodiment is the same as the above-mentioned first embodiment except for the difference in the structure of the suction member.
如圖11所示,本實施形態中,吸附構件3構成為具備組裝使用之2個構件。即,吸附構件3具備:第1構件30A,其具有於安裝狀態***於安裝部4之管狀部33,及支持管狀部33之支持部34;及第2構件30B,其係連接於第1構件30A而使用,具有可吸附IC器件90(電子零件)之吸附墊31,及支持吸附墊31之支持部32。As shown in FIG. 11, in this embodiment, the adsorption|
又,第2構件30B係準備有複數個對應於IC器件90(電子零件)之種類而形狀及大小中之至少一者(本實施形態中為吸附墊31之大小)不同者。圖11中,作為一例,係圖示第2構件30B1,及吸附墊31之大小大於第2構件30B1之第2構件30B2。且,選擇該等複數個第2構件30B(第2構件30B1及第2構件30B2)中之一者,將其連接於第1構件30A。將第2構件30B1連接於第1構件30A而組裝之吸附構件3成為吸附構件3A。又,將第2構件30B2連接於第1構件30A而組裝之吸附構件3成為吸附構件3B。如此,若將第1構件30A設為共通構件,準備複數種大小之第2構件30B,則可將適於各種IC器件90之吸附構件3(吸附構件3A或吸附構件3B)安裝於安裝部4。In addition, the
另,本實施形態中,準備有2個第2構件30B,但其數量並未特別限定,例如亦可為3個以上。In addition, in this embodiment, two
又,複數個第2構件30B於本實施形態中為部分大小不同者,但不限於此,例如可為全體大小不同者,可為部分形狀不同者,可為全體形狀不同者,亦可為形狀(部分、全體均可)及大小(部分、全體均可)兩者不同者。In addition, the plurality of
又,複數個第2構件30B於本實施形態中為大小不同者,但不限於此,例如可為除了大小不同外,進而形狀(部分、全體均可)亦不同者,亦可為僅形狀(部分、全體均可)不同者。In addition, the plurality of
如圖11所示,本實施形態中,於第1構件30A,於支持部34之下部,突出形成有外螺紋36。另一方面,於第2構件30B,於支持部32,形成有與第1構件30A之連接時與外螺紋36螺合之內螺紋37。As shown in FIG. 11, in this embodiment, the
又,於外螺紋36與支持部34之邊界部,設有沿著外螺紋36之周向呈環狀之密封構件(襯墊)38。密封構件38係以彈性材料構件,於組裝有第1構件30A與第2構件30B之狀態下,於支持部34與支持部32之間被壓縮,而彈性變形。藉此,將支持部34與支持部32之間氣密地密封。因此,可防止泵131作動時空氣自支持部34與支持部32之間洩漏,而使於吸附墊31之開口312產生之吸附力減少。藉此,可穩定地持續吸附IC器件90。In addition, at the boundary portion between the
又,第2構件30B對第1構件30A之連接操作,及第1構件30A與第2構件30B之連接解除操作,較佳為於使吸附構件3自安裝部4脫離之狀態下進行。藉此,例如進行連接、脫離作業時,相比設為安裝狀態之情形,可更容易進行其作業。In addition, the connection operation of the
<第4實施形態>以下,參照圖12,針對本發明之電子零件搬送裝置及電子零件檢查裝置之第4實施形態進行詳細說明,但以與上述實施形態之不同點為中心進行說明,相同事項省略其說明。<Fourth Embodiment> Hereinafter, referring to FIG. 12, the fourth embodiment of the electronic component conveying device and the electronic component inspection device of the present invention will be described in detail, but the description will focus on the differences from the above-mentioned embodiment. The same matters The description is omitted.
本實施形態除了吸附構件所具備之第1構件及第2構件之構成不同以外,餘與上述第3實施形態相同。This embodiment is the same as the above-mentioned third embodiment except that the configuration of the first member and the second member included in the suction member are different.
如圖12所示,在本實施形態中,於第1構件30A,於支持部34形成有內螺紋37。另一方面,於第2構件30B,於支持部32之上部,形成有與第1構件30A之連接時與內螺紋37螺合之外螺紋36。又,第2構件30B成為省略凸緣部321者。As shown in FIG. 12, in this embodiment, the
藉由如此之構成,例如作為第2構件30B,可將先前之旋入式吸附構件連接於第1構件30A而使用。With such a configuration, for example, as the
<第5實施形態>以下,參照圖13,針對本發明之電子零件搬送裝置及電子零件檢查裝置之第5實施形態進行詳細說明,但以與上述實施形態之不同點為中心進行說明,相同事項省略其說明。<Fifth Embodiment> Hereinafter, referring to FIG. 13, the fifth embodiment of the electronic component conveying device and the electronic component inspection device of the present invention will be described in detail, but the description will focus on the differences from the above-mentioned embodiment, and the same matters The description is omitted.
本實施形態除了吸附構件之吸附墊之形狀不同以外,餘與上述第1實施形態相同。This embodiment is the same as the above-mentioned first embodiment except that the shape of the suction pad of the suction member is different.
如圖13所示,本實施形態中,吸附構件3之吸附墊31具有其內徑經擴徑之擴徑部313。藉此,例如IC器件90為於其上側具有階差部901者之情形是,該IC器件90吸附於吸附構件3時,階差部901收納於擴徑部313內。藉此,IC器件90成為穩定地吸附於吸附構件3之狀態,藉此可防止於搬送途中自吸附構件3脫離。As shown in FIG. 13, in the present embodiment, the
以上,基於圖示之實施形態對本發明之電子零件搬送裝置及電子零件檢查裝置加以說明,但本發明並非限定於此,構成電子零件搬送裝置及電子零件檢查裝置之各部可置換成可發揮相同功能之任意構成者。又,亦可附加其他任意之構成物。Above, the electronic component conveying device and the electronic component inspection device of the present invention have been described based on the illustrated embodiment, but the present invention is not limited to this, and the parts constituting the electronic component conveying device and the electronic component inspection device can be replaced to perform the same function Of arbitrary constituents. Moreover, other arbitrary structures may be added.
又,本發明之電子零件搬送裝置及電子零件檢查裝置亦可為組合有上述各實施形態中之任意2個以上之構成(特徵)者。In addition, the electronic component transport device and the electronic component inspection device of the present invention may also be a combination of any two or more configurations (features) of the above-mentioned embodiments.
1‧‧‧電子零件檢查裝置3‧‧‧吸附構件3A‧‧‧吸附構件3B‧‧‧吸附構件4‧‧‧安裝部10‧‧‧電子零件搬送裝置11A‧‧‧托盤搬送機構11B‧‧‧托盤搬送機構12‧‧‧溫度調整部13‧‧‧器件搬送頭14‧‧‧器件供給部14A‧‧‧器件供給部14B‧‧‧器件供給部15‧‧‧托盤搬送機構16‧‧‧檢查部17‧‧‧器件搬送頭17A‧‧‧器件搬送頭17B‧‧‧器件搬送頭18‧‧‧器件回收部18A‧‧‧器件回收部18B‧‧‧器件回收部19‧‧‧回收用托盤20‧‧‧器件搬送頭21‧‧‧托盤搬送機構22A‧‧‧托盤搬送機構22B‧‧‧托盤搬送機構25‧‧‧搬送部30A‧‧‧第1構件30B‧‧‧第2構件30B1‧‧‧第2構件30B2‧‧‧第2構件31‧‧‧吸附墊32‧‧‧支持部(吸附墊支持部)33‧‧‧管狀部34‧‧‧支持部(管狀支持部)35‧‧‧內部空間36‧‧‧外螺紋37‧‧‧內螺紋38‧‧‧密封構件(襯墊)41‧‧‧內側筒狀部42‧‧‧第2扣合部43‧‧‧操作部44‧‧‧彈推部45‧‧‧限制部46‧‧‧密封構件(襯墊)90‧‧‧IC器件131‧‧‧泵132‧‧‧基部141‧‧‧凹部142‧‧‧側壁200‧‧‧托盤231‧‧‧第1隔板232‧‧‧第2隔板233‧‧‧第3隔板234‧‧‧第4隔板235‧‧‧第5隔板241‧‧‧前蓋242‧‧‧側蓋243‧‧‧側蓋244‧‧‧後蓋245‧‧‧頂蓋300‧‧‧監視器301‧‧‧顯示畫面311‧‧‧下端面312‧‧‧開口部313‧‧‧擴徑部321‧‧‧凸緣部322‧‧‧缺口部331‧‧‧第1扣合部331a‧‧‧傾斜面332‧‧‧外周部400‧‧‧信號燈411‧‧‧內部空間412‧‧‧內周部413‧‧‧槽414‧‧‧突出部421‧‧‧球體431‧‧‧按壓部441‧‧‧螺旋彈簧442‧‧‧上端443‧‧‧下端451‧‧‧棒狀部500‧‧‧揚聲器600‧‧‧滑鼠台700‧‧‧操作面板800‧‧‧控制部901‧‧‧階差部A1‧‧‧托盤供給區域A2‧‧‧器件供給區域A3‧‧‧檢查區域A4‧‧‧器件回收區域A5‧‧‧托盤去除區域O3‧‧‧中心軸O141‧‧‧中心軸α11A‧‧‧箭頭α11B‧‧‧箭頭α13X‧‧‧箭頭α13Y‧‧‧箭頭α14‧‧‧箭頭α15‧‧‧箭頭α17Y‧‧‧箭頭α18‧‧‧箭頭α20X‧‧‧箭頭α20Y‧‧‧箭頭α21‧‧‧箭頭α22A‧‧‧箭頭α22B‧‧‧箭頭α90‧‧‧箭頭1‧‧‧Electronic component inspection device 3‧‧‧Adsorption member 3A‧‧‧Adsorption member 3B‧‧‧Adsorption member 4‧‧‧Mounting part 10‧‧‧Electronic component conveying device 11A‧‧‧Tray conveying mechanism 11B‧‧ ‧Tray transport mechanism 12‧‧‧Temperature adjustment unit 13‧‧‧Device transport head 14‧‧‧Device supply unit 14A‧‧‧Device supply unit 14B‧‧‧Device supply unit 15‧‧‧Tray transport mechanism 16‧‧‧ Inspection Department 17‧‧‧Device Transfer Head 17A‧‧‧Device Transfer Head 17B‧‧‧Device Transfer Head 18‧‧‧Device Recycling Section 18A‧‧‧Device Recycling Section 18B‧‧‧Device Recycling Section 19‧‧‧For Recycling Tray 20‧‧‧Device transport head 21‧‧‧Tray transport mechanism 22A‧‧‧Tray transport mechanism 22B‧‧‧Tray transport mechanism 25‧‧‧Transport section 30A‧‧‧First member 30B‧‧‧Second member 30B1 ‧‧‧Second member 30B2‧‧‧Second member 31‧‧‧Adsorption pad 32‧‧‧Support part (suction pad support part) 33‧‧‧Tubular part 34‧‧‧Support part (tubular support part) 35‧ ‧‧Internal space 36‧‧‧External thread 37‧‧‧Internal thread 38‧‧‧Sealing member (liner) 41‧‧‧Inner cylindrical part 42‧‧‧Second engagement part 43‧‧‧Operation part 44 ‧‧‧Pushing part 45‧‧‧Restricting part 46‧‧‧Sealing member (liner) 90‧‧‧IC device 131‧‧‧Pump 132‧‧‧Base 141‧‧‧Concave part 142‧‧‧Side wall 200‧ ‧‧Tray 231‧‧‧The first partition 232‧‧‧The second partition 233‧‧‧The third partition 234‧‧‧The fourth partition 235‧‧‧The fifth partition 241‧‧‧Front cover 242 ‧‧‧Side cover 243‧‧‧Side cover 244‧‧‧Back cover 245‧‧‧Top cover 300‧‧‧Monitor 301‧‧ Display screen 311‧‧‧Lower end surface 312‧‧‧Opening 313‧‧ ‧Expanded part 321‧‧‧Flange part 322‧‧‧Notch part 331‧‧‧First engagement part 331a‧‧‧Slanted surface 332‧‧‧Outer peripheral part 400‧‧‧Signal light 411‧‧‧Internal space 412 ‧‧‧Inner peripheral part 413‧‧‧Slot 414‧‧‧Protrusion part 421‧‧Sphere 431‧‧‧Pressing part 441‧‧Coil spring 442‧‧‧Upper end 443‧‧‧Lower end 451‧‧Bar shape Unit 500‧‧‧Speaker 600‧‧‧Mouse station 700‧‧‧Operation panel 800‧‧‧Control unit 901‧‧‧Step unit A1‧‧‧Tray supply area A2‧‧‧Device supply area A3‧‧‧ Inspection area A4‧‧‧Device recovery area A5‧‧‧Tray removal area O3‧‧‧Center axis O141 ‧‧Arrow α15‧‧‧Arrow α17Y‧‧‧Arrow α18‧‧‧Arrow α20X‧‧‧Arrow α20Y‧‧‧Arrow α21‧ ‧‧Arrow α22A‧‧‧Arrow α22B‧‧‧Arrow α90‧‧‧Arrow
圖1係自正面側觀察本發明之電子零件檢查裝置之第1實施形態之概略立體圖。 圖2係顯示圖1所示之電子零件檢查裝置之動作狀態之概略俯視圖。 圖3係顯示圖1所示之電子零件檢查裝置之器件供給區域內之器件搬送頭之分解立體圖。 圖4係依序顯示使吸附構件自圖1所示之電子零件檢查裝置之器件供給區域內之器件搬送頭之安裝部脫離之過程之垂直剖視圖。 圖5係依序顯示使吸附構件自圖1所示之電子零件檢查裝置之器件供給區域內之器件搬送頭之安裝部脫離之過程之垂直剖視圖。 圖6係依序顯示使吸附構件自圖1所示之電子零件檢查裝置之器件供給區域內之器件搬送頭之安裝部脫離之過程之垂直剖視圖。 圖7係依序顯示使吸附構件自圖1所示之電子零件檢查裝置之器件供給區域內之器件搬送頭之安裝部脫離之過程之垂直剖視圖。 圖8係依序顯示使吸附構件自圖1所示之電子零件檢查裝置之器件供給區域內之器件搬送頭之安裝部脫離之過程之垂直剖視圖。 圖9係依序顯示本發明之電子零件檢查裝置(第2實施形態)之器件供給區域內之器件搬送頭之動作狀態之前視圖。 圖10係依序顯示本發明之電子零件檢查裝置(第2實施形態)之器件供給區域內之器件搬送頭之動作狀態之前視圖。 圖11係顯示本發明之電子零件檢查裝置(第3實施形態)之器件供給區域內之器件搬送頭之吸附構件之分解垂直剖視圖。 圖12係顯示本發明之電子零件檢查裝置(第4實施形態)之器件供給區域內之器件搬送頭之吸附構件之分解垂直剖視圖。 圖13係顯示本發明之電子零件檢查裝置(第5實施形態)之器件供給區域內之器件搬送頭之吸附構件之垂直剖視圖。Fig. 1 is a schematic perspective view of the first embodiment of the electronic component inspection apparatus of the present invention viewed from the front side. FIG. 2 is a schematic plan view showing the operating state of the electronic component inspection device shown in FIG. 1. FIG. FIG. 3 is an exploded perspective view showing the device transfer head in the device supply area of the electronic component inspection apparatus shown in FIG. 1. FIG. 4 is a vertical cross-sectional view showing the process of detaching the suction member from the mounting portion of the device transfer head in the device supply area of the electronic component inspection device shown in FIG. 1 in sequence. 5 is a vertical cross-sectional view sequentially showing the process of detaching the suction member from the mounting portion of the device transfer head in the device supply area of the electronic component inspection device shown in FIG. 1. 6 is a vertical cross-sectional view showing the process of detaching the suction member from the mounting portion of the device transfer head in the device supply area of the electronic component inspection device shown in FIG. 1 in sequence. 7 is a vertical cross-sectional view showing the process of detaching the suction member from the mounting portion of the device transfer head in the device supply area of the electronic component inspection device shown in FIG. 1 in sequence. FIG. 8 is a vertical cross-sectional view showing the process of detaching the suction member from the mounting part of the device transfer head in the device supply area of the electronic component inspection device shown in FIG. 1 in sequence. Fig. 9 is a front view sequentially showing the operating state of the component transfer head in the component supply area of the electronic component inspection apparatus (second embodiment) of the present invention. FIG. 10 is a front view sequentially showing the operating state of the component transfer head in the component supply area of the electronic component inspection apparatus (second embodiment) of the present invention. 11 is an exploded vertical cross-sectional view showing the suction member of the component transfer head in the component supply area of the electronic component inspection apparatus (third embodiment) of the present invention. 12 is an exploded vertical cross-sectional view showing the suction member of the device transfer head in the device supply area of the electronic component inspection apparatus (the fourth embodiment) of the present invention. 13 is a vertical cross-sectional view showing the suction member of the component transfer head in the component supply area of the electronic component inspection apparatus (the fifth embodiment) of the present invention.
1‧‧‧電子零件檢查裝置 1‧‧‧Electronic parts inspection device
3‧‧‧吸附構件 3‧‧‧Adsorption component
3A‧‧‧吸附構件 3A‧‧‧Adsorption component
3B‧‧‧吸附構件 3B‧‧‧Adsorption component
4‧‧‧安裝部 4‧‧‧Installation Department
10‧‧‧電子零件搬送裝置 10‧‧‧Electronic parts handling device
13‧‧‧器件搬送頭 13‧‧‧Device transfer head
31‧‧‧吸附墊 31‧‧‧Adsorption pad
32‧‧‧支持部(吸附墊支持部) 32‧‧‧Support part (adsorption pad support part)
33‧‧‧管狀部 33‧‧‧Tube
34‧‧‧支持部(管狀支持部) 34‧‧‧Support Department (Tube Support Department)
41‧‧‧內側筒狀部 41‧‧‧Inner cylindrical part
43‧‧‧操作部 43‧‧‧Operation Department
45‧‧‧限制部 45‧‧‧Restriction Department
131‧‧‧泵 131‧‧‧Pump
132‧‧‧基部 132‧‧‧Base
311‧‧‧下端面 311‧‧‧lower end surface
312‧‧‧開口部 312‧‧‧Opening
321‧‧‧凸緣部 321‧‧‧Flange
322‧‧‧缺口部 322‧‧‧Notch
331‧‧‧第1扣合部 331‧‧‧The first fastening part
451‧‧‧棒狀部 451‧‧‧Bar
A2‧‧‧器件供給區域 A2‧‧‧Device supply area
Claims (13)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017208898A JP2019082350A (en) | 2017-10-30 | 2017-10-30 | Electronic component conveyance device and electronic component inspection device |
JP2017-208898 | 2017-10-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201917086A TW201917086A (en) | 2019-05-01 |
TWI703078B true TWI703078B (en) | 2020-09-01 |
Family
ID=66294997
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107137935A TWI703078B (en) | 2017-10-30 | 2018-10-26 | Electronic component conveying device, electronic component inspection device and suction member |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2019082350A (en) |
CN (1) | CN109720860A (en) |
TW (1) | TWI703078B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110307939A (en) * | 2019-07-01 | 2019-10-08 | 常州星宇车灯股份有限公司 | Light fixture detection device |
KR200493234Y1 (en) * | 2019-11-05 | 2021-02-23 | 주식회사 코엠에스 | Barrel Picking Device |
TWI705930B (en) * | 2019-12-12 | 2020-10-01 | 鴻勁精密股份有限公司 | Work tools and their application equipment |
JP7143273B2 (en) * | 2019-12-26 | 2022-09-28 | 株式会社ミスミ | SERVER DEVICE AND CONTROL METHOD OF SELECTION SYSTEM, AND COMPUTER PROGRAM |
TWI733318B (en) * | 2020-01-22 | 2021-07-11 | 台灣福雷電子股份有限公司 | Press testing mechanism, testing apparatus and testing method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1774166A (en) * | 2004-11-08 | 2006-05-17 | 雅马哈发动机株式会社 | Suction nozzle receptacle structure of suction nozzle change unit and surface mounting machine |
TW201341822A (en) * | 2012-02-29 | 2013-10-16 | Jt Corp | Semiconductor device inspection apparatus |
CN204716700U (en) * | 2015-05-22 | 2015-10-21 | 东莞东舜自动化有限公司 | A kind of quick-acting joint of special-shaped inserter |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6085891A (en) * | 1983-10-18 | 1985-05-15 | 富士通株式会社 | General-purpose sucker |
JPS63306890A (en) * | 1987-06-08 | 1988-12-14 | 株式会社日立製作所 | Part sucker |
JP3064368B2 (en) * | 1990-09-25 | 2000-07-12 | 松下電器産業株式会社 | Electronic component suction nozzle |
JPH06196896A (en) * | 1992-12-24 | 1994-07-15 | Matsushita Electric Ind Co Ltd | Component installation head |
JPH1013092A (en) * | 1996-06-26 | 1998-01-16 | Matsushita Electric Ind Co Ltd | Part mounting head |
JP3720480B2 (en) * | 1996-09-02 | 2005-11-30 | ヤマハ発動機株式会社 | Mounting device for electronic component mounting machine |
KR100926534B1 (en) * | 2009-07-02 | 2009-11-12 | 한국뉴매틱(주) | Vacuum-gripper device capable of angle- dispacement |
CN106829359A (en) * | 2015-09-30 | 2017-06-13 | 精工爱普生株式会社 | Electronic component handling apparatus and electronic component inspection device |
-
2017
- 2017-10-30 JP JP2017208898A patent/JP2019082350A/en active Pending
-
2018
- 2018-10-26 TW TW107137935A patent/TWI703078B/en not_active IP Right Cessation
- 2018-10-29 CN CN201811266820.XA patent/CN109720860A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1774166A (en) * | 2004-11-08 | 2006-05-17 | 雅马哈发动机株式会社 | Suction nozzle receptacle structure of suction nozzle change unit and surface mounting machine |
TW201341822A (en) * | 2012-02-29 | 2013-10-16 | Jt Corp | Semiconductor device inspection apparatus |
CN204716700U (en) * | 2015-05-22 | 2015-10-21 | 东莞东舜自动化有限公司 | A kind of quick-acting joint of special-shaped inserter |
Also Published As
Publication number | Publication date |
---|---|
JP2019082350A (en) | 2019-05-30 |
TW201917086A (en) | 2019-05-01 |
CN109720860A (en) | 2019-05-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI703078B (en) | Electronic component conveying device, electronic component inspection device and suction member | |
TWI567402B (en) | Electronic component testing device and electronic component transport method | |
CN107064570B (en) | Probe card case and probe card conveying method | |
JP5187112B2 (en) | Electronic component inspection equipment | |
JP2011029456A (en) | Wafer prober for semiconductor inspection, and inspection method | |
CN107884700B (en) | Electronic component conveying device and electronic component inspection device | |
JP2010202392A (en) | Ic automatic handler | |
TW201702617A (en) | Electronic component conveyance device and electronic component inspection device | |
TW201932793A (en) | Electronic component handler and electronic component tester | |
TW201634942A (en) | Electronic component transfer device and electronic component inspection device | |
TWI711112B (en) | Electronic component conveying device, electronic component conveying unit, and electronic component inspection device | |
TW201913863A (en) | Electronic component conveying device and electronic component inspection device | |
JP2019164099A (en) | Electronic component conveyance device and electronic component inspection device | |
TW201916232A (en) | Electronic part conveying device and electronic part inspection device can enable the inspection portion executing inspection to be in contact with the electronic part conductively while performing electric inspection for parts | |
TWI685052B (en) | Electronic parts conveying device and electronic parts inspection device | |
KR101864327B1 (en) | Package Carrier Assembly | |
TWI671839B (en) | Electronic component conveying device and inspection device, positioning device and method, and component conveying device | |
TW201827838A (en) | Electronic component conveying device and electronic component inspection device comprising a first carrying member with a first recessed portion, a second carrying member with a second recessed portion, and a conveying portion | |
TWI642134B (en) | Electronic component conveying device and electronic component inspection device | |
TW201834127A (en) | Electrical component conveying device and electrical component inspection device for performing the inspection for the electrical component at the inspection portion | |
JP6994338B2 (en) | Electronic component transfer device and electronic component inspection device | |
KR20180104032A (en) | Method for attaching and detaching a semiconductor device and method for attaching and detaching a semiconductor device using the method | |
JP6790768B2 (en) | Electronic component transfer device and electronic component inspection device | |
TWI476854B (en) | Apparatus and method for supplying lightemitting diode (led) wafer | |
KR20240030664A (en) | Substrate support apparatus and method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |