TWI703078B - Electronic component conveying device, electronic component inspection device and suction member - Google Patents

Abstract

本發明提供一種吸附構件之更換作業變得容易之電子零件搬送裝置及電子零件檢查裝置。 本發明之電子零件搬送裝置之特徵在於具備搬送部，其搬送電子零件，上述搬送部具有：吸附構件，其可吸附上述電子零件；及安裝部，其可裝卸地安裝上述吸附構件，於上述吸附構件設有第1扣合部，於上述安裝部設有第2扣合部，該第2扣合部可移位至扣合於上述第1扣合部之第1位置，及未扣合於上述第1扣合部之第2位置。The present invention provides an electronic component conveying device and an electronic component inspection device which facilitate the replacement operation of an adsorption member. The electronic component conveying device of the present invention is characterized by having a conveying section for conveying electronic components, and the conveying section has: an adsorbing member capable of adsorbing the electronic component; and a mounting section detachably mounting the adsorbing member to the adsorbing member The component is provided with a first buckling portion, and the mounting portion is provided with a second buckling portion. The second buckling portion can be shifted to the first position of the first buckling portion and not buckled in The second position of the first engaging portion.

Description

電子零件搬送裝置、電子零件檢查裝置及吸附構件Electronic component conveying device, electronic component inspection device and suction member

本發明係關於電子零件搬送裝置及電子零件檢查裝置。The present invention relates to an electronic component conveying device and an electronic component inspection device.

自先前以來，可對IC器件進行電性試驗之IC處理機為已知(例如參照專利文獻1)。專利文獻1所記載之IC處理機中，作為搬送IC器件之搬送部，具有金屬性墊配接器，及安裝於金屬性墊配接器之橡膠墊。且，可以橡膠墊吸附IC器件，直接進行搬送。又，橡膠墊係對應於IC器件之大小或種類而更換成大小等不同者。 [先前技術文獻] [專利文獻]Conventionally, an IC processor capable of performing electrical tests on IC devices has been known (for example, refer to Patent Document 1). The IC processor described in Patent Document 1 has a metallic pad adapter and a rubber pad attached to the metallic pad adapter as a conveyance section for conveying IC devices. In addition, IC devices can be absorbed by rubber pads and transported directly. In addition, the rubber pad is replaced with a different size or the like according to the size or type of the IC device. [Prior Art Document] [Patent Document]

[專利文獻1]日本專利特開平08-267383號公報[Patent Document 1] Japanese Patent Laid-Open No. 08-267383

[發明所欲解決之問題][The problem to be solved by the invention]

於如此構成之IC處理機，例如有藉由金屬性墊配接器與橡膠墊之螺合而安裝者。該情形時，進行橡膠墊之更換作業時，必須使橡膠墊旋轉而緊固於金屬墊配接器，或進行扭矩管理等，其更換作業較繁雜。 [解決問題之技術手段]For the IC processor constructed in this way, there is, for example, one that is installed by screwing a metallic pad adapter and a rubber pad. In this case, when replacing the rubber pad, it is necessary to rotate the rubber pad to fasten it to the metal pad adapter, or perform torque management, and the replacement operation is complicated. [Technical means to solve the problem]

本發明係用以解決上述問題之至少一部分而完成者，可作為以下者實現。The present invention is accomplished to solve at least a part of the above-mentioned problems, and can be realized as the following.

本發明之電子零件搬送裝置之特徵在於具備搬送部，其搬送電子零件， 上述搬送部具有：吸附構件，其可吸附上述電子零件；及安裝部，其可裝卸地安裝上述吸附構件， 於上述吸附構件設有第1扣合部， 於上述安裝部設有第2扣合部，該第2扣合部可移位至與上述第1扣合部扣合而成為安裝有上述吸附構件之安裝狀態之第1位置，及解除上述安裝狀態之第2位置。The electronic component conveying device of the present invention is characterized by having a conveying section for conveying electronic components, and the conveying section has: an adsorbing member capable of adsorbing the electronic component; and a mounting section for detachably mounting the adsorbing member to the adsorbing member The member is provided with a first buckling portion, and the mounting portion is provided with a second buckling portion, and the second buckling portion can be displaced to buckle with the first buckling portion to become an installation state where the suction member is installed The first position, and the second position to release the above installation state.

藉此，藉由拉伸安裝於安裝部之安裝狀態之吸附構件，而可使吸附構件容易且迅速地自安裝部脫離。又，對於尚未安裝吸附構件之狀態之安裝部，可藉由押入吸附構件，而將吸附構件容易且迅速地安裝於安裝部。如上述，吸附構件對於安裝部之裝卸變得迅速且容易。藉此，可對應於電子零件之種類，容易進行更換吸附構件之作業。As a result, the suction member can be easily and quickly detached from the installation part by stretching the suction member installed in the installation state of the installation part. In addition, for the attachment part in the state where the adsorption member has not been attached, the adsorption member can be easily and quickly mounted to the attachment part by pushing in the adsorption member. As described above, the attachment and detachment of the suction member to the mounting part becomes quick and easy. Thereby, it can correspond to the type of electronic parts, and the operation of replacing the suction member can be easily performed.

本發明之電子零件搬送裝置中，較佳為上述吸附構件具有管狀部，其以上述安裝狀態***於上述安裝部， 上述第1扣合部係以設置於上述管狀部之外周部之凹部構成， 上述第2扣合部係以於上述第1位置扣合於上述凹部之凸部構成。In the electronic component conveying device of the present invention, it is preferable that the suction member has a tubular portion inserted into the mounting portion in the mounted state, and the first engaging portion is constituted by a concave portion provided on an outer peripheral portion of the tubular portion, The second engaging portion is constituted by a convex portion that is engaged with the concave portion at the first position.

藉此，可容易進行吸附構件對安裝部之裝卸操作，其結果，對應於電子零件種類之吸附構件之更換作業變容易。Thereby, the attaching and detaching operation of the suction member to the mounting part can be easily performed, and as a result, the replacement operation of the suction member corresponding to the type of electronic component becomes easy.

本發明之電子零件搬送裝置中，較佳為上述凹部係以沿著上述管狀部之外周部之周向而設之槽構成， 上述凸部係以於上述第1位置沿著上述槽複數個配置之球體構成。In the electronic component conveying device of the present invention, it is preferable that the concave portion is formed by a groove formed along the circumferential direction of the outer peripheral portion of the tubular portion, and the convex portion is arranged in plural along the groove at the first position The sphere constitutes.

藉此，可容易進行吸附構件對安裝部之裝卸操作，其結果，對應於電子零件種類之吸附構件之更換作業變容易。Thereby, the attaching and detaching operation of the suction member to the mounting part can be easily performed, and as a result, the replacement operation of the suction member corresponding to the type of electronic component becomes easy.

本發明之電子零件搬送裝置中，較佳為上述安裝部具有操作部，其可進行上述第2扣合部自上述第1位置向上述第2位置之移位之操作。In the electronic component conveying device of the present invention, it is preferable that the mounting portion has an operation portion that can perform an operation for displacing the second engaging portion from the first position to the second position.

藉此，操作操作部時，可使安裝於安裝部之吸附構件脫離，或與此相反地，將吸附構件安裝於尚未被安裝吸附構件之安裝部。Thereby, when the operation part is operated, the suction member mounted on the mounting part can be detached, or, conversely, the suction member can be mounted on the mounting part where the suction member has not yet been mounted.

本發明之電子零件搬送裝置中，較佳為上述安裝部具有彈推部，其對上述操作部彈推，限制上述第2扣合部之移位。In the electronic component conveying device of the present invention, it is preferable that the mounting portion has an elastic pushing portion that elastically pushes the operating portion to restrict the displacement of the second engaging portion.

藉此，可防止處於安裝狀態之吸附構件自安裝部不經意地脫離。Thereby, the suction member in the installed state can be prevented from being accidentally separated from the installation part.

本發明之電子零件搬送裝置中，較佳為上述吸附構件係準備複數個對應於上述電子零件之種類而形狀及大小中之至少一者不同者， 選擇上述複數個吸附構件中之一者，並安裝於上述安裝部。In the electronic component conveying device of the present invention, it is preferable that the adsorption member prepares a plurality of different ones of at least one of shape and size corresponding to the type of the electronic component, and selects one of the plurality of adsorption members, and Install in the above-mentioned mounting part.

藉此，可將適於各種電子零件之吸附構件安裝於安裝部，藉此，可藉由該吸附構件，穩定地吸附電子零件。Thereby, the suction member suitable for various electronic components can be mounted on the mounting part, whereby the electronic component can be stably suctioned by the suction member.

本發明之電子零件搬送裝置中，較佳為上述吸附構件具備：第1構件，其具有以上述安裝狀態***於上述安裝部之管狀部；及第2構件，其與上述第1構件連接使用，具有可吸附上述電子零件之吸附墊。In the electronic component transport device of the present invention, it is preferable that the suction member includes: a first member having a tubular portion inserted into the mounting portion in the mounted state; and a second member used in connection with the first member, It has an adsorption pad that can adsorb the above electronic parts.

藉此，例如若將第1構件設為共通構件，準備複數個形狀或大小不同之第2構件，則可將適於各種電子零件之吸附構件安裝於安裝部。Thereby, for example, if the first member is a common member and a plurality of second members having different shapes or sizes are prepared, the suction member suitable for various electronic components can be attached to the mounting portion.

本發明之電子零件搬送裝置中，較佳為上述第2構件係準備複數個對應於上述電子零件之種類而形狀及大小中之至少一者不同者， 選擇上述複數個第2構件中之一者，並安裝於上述第1構件。In the electronic component transport device of the present invention, it is preferable that the second member prepares a plurality of different ones of at least one of shape and size corresponding to the type of the electronic component, and selects one of the plurality of second members , And installed in the first member above.

藉此，可將適於各種電子零件之吸附構件安裝於安裝部。Thereby, the suction member suitable for various electronic parts can be mounted on the mounting part.

本發明之電子零件搬送裝置中，較佳為上述第2構件對上述第1構件之連接操作，及上述第1構件與上述第2構件之連接解除操作，係於使上述吸附構件自上述安裝部脫離之狀態下進行。In the electronic component conveying device of the present invention, it is preferable that the connection operation of the second member to the first member and the disconnection operation of the first member and the second member are performed by causing the suction member to be removed from the mounting portion Carried out in a state of being separated.

藉此，例如進行連接、脫離作業時，相比於設為安裝狀態之情形，可更容易進行其作業。Thereby, when connecting and disconnecting, for example, the operation can be performed more easily than when it is set in the installed state.

本發明之電子零件搬送裝置中，較佳為於上述第1構件設有內螺紋， 於上述第2構件，設有與上述第1構件連接時與上述內螺紋螺合之外螺紋。In the electronic component transfer device of the present invention, it is preferable that the first member is provided with an internal thread, and the second member is provided with an external thread that is screwed to the internal thread when connected to the first member.

藉此，例如作為第2構件，可將先前之旋入式吸附構件連接於第1構件而使用。Thereby, for example, as the second member, the conventional screw-in suction member can be connected to the first member and used.

本發明之電子零件搬送裝置中，較佳為上述安裝部具有限制部，其限制吸附於上述吸附構件之上述電子零件繞垂直軸之旋轉。In the electronic component conveying device of the present invention, it is preferable that the mounting portion has a restricting portion that restricts the rotation of the electronic component sucked to the suction member about a vertical axis.

藉此，例如電子零件為俯視時呈四角形狀者之情形時，可防止相鄰之電子零件彼此干涉。By this, for example, when the electronic components are quadrangular in plan view, it is possible to prevent adjacent electronic components from interfering with each other.

本發明之電子零件檢查裝置之特徵在於具備搬送部，其搬送電子零件；及 檢查部，其檢查上述電子零件， 上述搬送部具有：吸附構件，其可吸附上述電子零件；及安裝部，其可裝卸地安裝上述吸附構件， 於上述吸附構件設有第1扣合部， 於上述安裝部設有第2扣合部，該第2扣合部可移位至與上述第1扣合部扣合而成為安裝有上述吸附構件之安裝狀態之第1位置，及解除上述安裝狀態之第2位置。The electronic component inspection device of the present invention is characterized in that it includes a conveying part that conveys electronic parts; and an inspection part that inspects the electronic parts. The conveying part has: an adsorption member that can adsorb the electronic parts; and a mounting part that can The suction member is detachably mounted, a first engaging portion is provided on the suction member, and a second engaging portion is provided on the mounting portion, and the second engaging portion can be displaced to engage with the first engaging portion It becomes the first position in the installation state where the suction member is installed, and the second position in the installation state released.

藉此，藉由拉伸安裝於安裝部之安裝狀態之吸附構件，可使吸附構件容易且迅速地自安裝部脫離。又，對於尚未安裝吸附構件之狀態之安裝部，可藉由押入吸附構件，而將吸附構件容易且迅速地安裝於安裝部。如上述，吸附構件對於安裝部之裝卸變得迅速且容易。藉此，可對應於電子零件種類，容易進行更換吸附構件之作業。Thereby, by stretching the suction member installed in the installation state of the installation part, the suction member can be easily and quickly detached from the installation part. In addition, for the attachment part in the state where the adsorption member has not been attached, the adsorption member can be easily and quickly mounted to the attachment part by pushing in the adsorption member. As described above, the attachment and detachment of the suction member to the mounting part becomes quick and easy. Thereby, it can correspond to the type of electronic parts, and the operation of replacing the suction member can be easily performed.

又，可將電子零件搬送至檢查部，藉此，可以檢查部進行對該電子零件之檢查。又，可自檢查部搬送檢查後之電子零件。In addition, the electronic component can be transported to the inspection unit, whereby the inspection unit can inspect the electronic component. In addition, electronic parts after inspection can be transported from the inspection department.

以下，基於隨附圖式所示之較佳實施形態，詳細說明本發明之電子零件搬送裝置及電子零件檢查裝置。Hereinafter, the electronic component transport device and the electronic component inspection device of the present invention will be described in detail based on the preferred embodiments shown in the accompanying drawings.

＜第1實施形態＞以下，參照圖1～圖8，針對本發明之電子零件搬送裝置及電子零件檢查裝置之第1實施形態進行說明。另，於以下，為了便於說明，如圖1所示，將互相正交之3軸設為X軸、Y軸及Z軸。又，包含X軸與Y軸之XY平面成為水平，Z軸成為垂直。又，亦將平行於X軸之方向稱為「X方向(第1方向)」，將平行於Y軸之方向稱為「Y方向(第2方向)」，將平行於Z軸之方向稱為「Z方向(第3方向)」。又，將各方向之箭頭朝向之方向稱為「正」，將其相反方向稱為「負」。又，於本案說明書言及之「水平」並非限定於完全水平，只要不阻礙電子零件之搬送，則亦包含相對於水平略微(例如小於±5°左右)傾斜之狀態。又，有將圖1、圖3～圖8中(關於圖9～圖13亦相同)之上側，即Z軸方向正側稱為「上」或「上方」，將下側，即Z軸方向負側稱為「下」或「下方」之情況。<First Embodiment> Hereinafter, with reference to FIGS. 1 to 8, the first embodiment of the electronic component conveying device and the electronic component inspection device of the present invention will be described. In addition, in the following, for convenience of explanation, as shown in FIG. 1, the three axes orthogonal to each other are referred to as X axis, Y axis, and Z axis. In addition, the XY plane including the X axis and the Y axis becomes horizontal, and the Z axis becomes vertical. In addition, the direction parallel to the X axis is also called "X direction (first direction)", the direction parallel to the Y axis is called "Y direction (second direction)", and the direction parallel to the Z axis is called "Z direction (3rd direction)". In addition, the direction in which the arrows of each direction face is called "positive", and the opposite direction is called "negative". In addition, the "level" mentioned in the specification of this case is not limited to a complete level, as long as it does not hinder the transportation of electronic components, it also includes a state slightly inclined (for example, less than ±5°) relative to the level. In addition, the upper side in FIGS. 1, 3 to 8 (the same as in FIGS. 9 to 13), that is, the positive side in the Z-axis direction is called "upper" or "upper", and the lower side, that is, the Z-axis direction The negative side is called "down" or "down".

本發明之電子零件搬送裝置10係具有圖1所示之外觀者。該電子零件搬送裝置10具備搬送部25，其搬送電子零件即IC器件90。搬送部25具有：吸附構件3，其可吸附IC器件90(電子零件)；及安裝部4，其可裝卸地安裝吸附構件3。於吸附構件3，設有第1扣合部331。於安裝部4，設有第2扣合部42，其移位至與第1扣合部331扣合而成為安裝有吸附構件3之安裝狀態之第1位置，及解除安裝狀態之第2位置。The electronic component conveying device 10 of the present invention has the appearance shown in FIG. 1. The electronic component conveying apparatus 10 includes a conveying unit 25 that conveys an IC device 90 that is an electronic component. The conveying part 25 has an adsorption member 3 which can adsorb an IC device 90 (electronic component), and a mounting part 4 which mounts the adsorption member 3 detachably. The suction member 3 is provided with a first engaging portion 331. The mounting portion 4 is provided with a second buckling portion 42 which is shifted to the first position where the suction member 3 is installed by buckling with the first buckling portion 331 and the second position when the suction member 3 is installed. .

另，本實施形態中，作為吸附並搬送IC器件90者，於搬送部25包含器件搬送頭13、器件搬送頭17、及器件搬送頭20。以下，針對將本發明應用於器件搬送頭13之例進行說明，但應用部位不限於器件搬送頭13，亦可應用於器件搬送頭17或器件搬送頭20。In addition, in this embodiment, as the IC device 90 that is sucked and conveyed, the conveyance section 25 includes the device transfer head 13, the device transfer head 17, and the device transfer head 20. Hereinafter, an example in which the present invention is applied to the device transfer head 13 will be described, but the application location is not limited to the device transfer head 13 and may be applied to the device transfer head 17 or the device transfer head 20.

根據如此之本發明，如後述，藉由拉伸安裝於安裝部4之安裝狀態之吸附構件3，而可使吸附構件3容易且迅速地自安裝部4脫離。又，對於尚未安裝吸附構件3之狀態之安裝部4，可藉由押入吸附構件3，而將吸附構件3容易且迅速地安裝於安裝部4。如上述，吸附構件3對於安裝部4之裝卸變得迅速且容易。藉此，可對應於IC器件90之種類，容易進行更換吸附構件3之作業。According to the present invention in this way, as described later, by stretching the suction member 3 in the mounted state attached to the mounting portion 4, the suction member 3 can be easily and quickly detached from the mounting portion 4. In addition, for the attachment part 4 in the state where the adsorption member 3 has not been attached, the adsorption member 3 can be pushed in, so that the adsorption member 3 can be easily and quickly attached to the attachment part 4. As described above, the attachment and detachment of the suction member 3 to the mounting portion 4 becomes quick and easy. Thereby, it can correspond to the type of IC device 90, and the work of replacing the suction member 3 can be easily performed.

又，如圖2所示，本發明之電子零件檢查裝置1係具有電子零件搬送裝置10，進而具備檢查電子零件之檢查部16之測試系統(test system)。即，電子零件檢查裝置1係具備搬送電子零件即IC器件90之搬送部25，及檢查IC器件90(電子零件)之檢查部16之測試系統。搬送部25具有：吸附構件3，其可吸附IC器件90(電子零件)；及安裝部4，其可裝卸地安裝於吸附構件3。於吸附構件3，設有第1扣合部331。於安裝部4，設有第2扣合部42，其可移位至與第1扣合部331扣合而成為安裝有吸附構件3之安裝狀態之第1位置，及解除安裝狀態之第2位置。Furthermore, as shown in FIG. 2, the electronic component inspection apparatus 1 of the present invention has an electronic component transport device 10 and further includes a test system (test system) of an inspection unit 16 for inspecting electronic components. That is, the electronic component inspection apparatus 1 is a test system provided with the conveyance part 25 which conveys the IC device 90 which is an electronic part, and the inspection part 16 which inspects the IC device 90 (electronic part). The conveying part 25 has an adsorption member 3 which can adsorb an IC device 90 (electronic component), and a mounting part 4 which is detachably mounted to the adsorption member 3. The suction member 3 is provided with a first engaging portion 331. The mounting portion 4 is provided with a second buckling portion 42 which can be displaced to the first position in the mounting state where the suction member 3 is mounted by buckling with the first buckling portion 331, and the second in the dismounting state position.

藉此，獲得具備上述電子零件搬送裝置10之優點之電子零件檢查裝置1。又，可將IC器件90(電子零件)搬送至檢查部16，藉此，可以檢查部16進行對該IC器件90之檢查。又，可自檢查部16搬送檢查後之IC器件90。Thereby, an electronic component inspection device 1 having the advantages of the above-mentioned electronic component conveying device 10 is obtained. In addition, the IC device 90 (electronic component) can be transported to the inspection unit 16, whereby the inspection unit 16 can inspect the IC device 90. In addition, the IC device 90 after the inspection can be transported from the inspection unit 16.

以下，針對各部之構成進行詳細說明。 如圖1、圖2所示，具有電子零件搬送裝置10之電子零件檢查裝置1為如下裝置：例如搬送BGA(Ball Grid Array：球柵格陣列)封裝即IC器件等電子零件，於其搬送過程中檢查、試驗(以下簡稱為「檢查」)電子零件之電性特性。另，於以下，為了便於說明，針對使用IC器件作為上述電子零件之情形，作為代表進行說明，且將該IC器件設為「IC器件90」。IC器件90於本實施形態中成為呈平板狀者(參照圖4)。Hereinafter, the structure of each part will be described in detail. As shown in Figures 1 and 2, the electronic component inspection device 1 with the electronic component transport device 10 is the following device: for example, electronic components such as BGA (Ball Grid Array) packages that are IC devices are transported during the transport process. During inspection and testing (hereinafter referred to as "inspection") the electrical characteristics of electronic parts. In addition, in the following, for convenience of description, the case where an IC device is used as the above-mentioned electronic component is described as a representative, and the IC device is referred to as "IC device 90". The IC device 90 has a flat plate shape in this embodiment (see FIG. 4).

另，作為IC器件，除上述者以外，列舉例如「LSI(Large Scale Integration：大型積體電路)」、「CMOS(Complementary Metal Oxide Semiconductor：互補金屬氧化物半導體)」、「CCD(Charge Coupled Device：電荷耦合器件)」、將IC器件複數個模組化並封裝化之「模組IC」、「石英器件」、「壓力感測器」、「慣性感測器(加速度感測器)」、「陀螺感測器」、「指紋感測器」等。In addition, as IC devices, in addition to the above, for example, "LSI (Large Scale Integration: large integrated circuit)", "CMOS (Complementary Metal Oxide Semiconductor: Complementary Metal Oxide Semiconductor)", "CCD (Charge Coupled Device: Charge-coupled device)”, “Modular IC”, “Quartz Device”, “Pressure Sensor”, “Inertial Sensor (Acceleration Sensor)”, “Module IC”, “Quartz Device”, “Pressure Sensor”, “Inertial Sensor (Acceleration Sensor)”, “ "Gyro Sensor", "Fingerprint Sensor", etc.

電子零件檢查裝置1(電子零件搬送裝置10)具備：托盤供給區域A1、器件供給區域A2、檢查區域A3、器件回收區域A4、及托盤去除區域A5，該等區域如後述，係以各壁部分隔。並且，IC器件90係自托盤供給區域A1至托盤去除區域A5按箭頭α90方向依序經由上述各區域，且於中途之檢查區域A3進行檢查。如此，電子零件檢查裝置1成為具備如下者：電子零件搬送裝置10，其具有以經由各區域之方式搬送IC器件90之搬送部25；檢查部16，其於檢查區域A3內進行檢查；及控制部800。又，此外，電子零件檢查裝置1具備：監視器300、信號燈400、及操作面板700。The electronic component inspection device 1 (electronic component conveying device 10) is provided with: a tray supply area A1, a component supply area A2, an inspection area A3, a component recovery area A4, and a tray removal area A5. These areas are described below, and each wall part Separated. In addition, the IC device 90 passes through the above-mentioned areas from the tray supply area A1 to the tray removal area A5 in the direction of the arrow α90, and is inspected in the inspection area A3 in the middle. In this way, the electronic component inspection device 1 is provided with the following: an electronic component transport device 10 having a transport unit 25 that transports the IC device 90 through each area; an inspection unit 16 that performs inspection in the inspection area A3; and control Department 800. In addition, the electronic component inspection device 1 includes a monitor 300, a signal lamp 400, and an operation panel 700.

另，電子零件檢查裝置1為配置托盤供給區域A1及托盤去除區域A5方，即，圖2中之下側成為正面側，配置檢查區域A3方，即，圖2中之上側作為背面側使用。In addition, the electronic component inspection apparatus 1 arranges the tray supply area A1 and the tray removal area A5, that is, the lower side in FIG. 2 is the front side, and the inspection area A3 is arranged, that is, the upper side in FIG. 2 is used as the back side.

又，電子零件檢查裝置1係預先搭載按IC器件90種類作更換之稱為「更換套件」者而使用。於該更換套件，有載置IC器件90(電子零件)之載置部(電子零件載置部)。本實施形態之電子零件檢查裝置1中，該載置部係設置於複數個部位，例如有後述之溫度調整部12、器件供給部14及器件回收部18。又，於載置IC器件90(電子零件)之載置部(電子零件載置部)，除了如上述之更換套件外，亦有使用者準備之托盤200、回收用托盤19，亦有檢查部16。In addition, the electronic component inspection apparatus 1 is used by pre-installing a so-called "replacement kit" that is replaced by the type of IC device 90. In this replacement kit, there is a mounting portion (electronic component mounting portion) on which an IC device 90 (electronic component) is mounted. In the electronic component inspection apparatus 1 of the present embodiment, the placement portion is provided at a plurality of locations, such as the temperature adjustment portion 12, the component supply portion 14, and the component recovery portion 18 described later. In addition, in the placement section (electronic component placement section) where IC devices 90 (electronic components) are placed, in addition to the above-mentioned replacement kit, there are also trays 200 prepared by the user, trays 19 for recycling, and an inspection section. 16.

托盤供給區域A1係被供給排列有未檢查狀態之複數個IC器件90之托盤200之供材部。托盤供給區域A1亦可說是可重疊複數個托盤200而搭載之搭載區域。另，本實施形態中，於各托盤200，矩陣狀配置有複數個凹部(凹槽)。可於各凹部逐個收納並載置IC器件90。The tray supply area A1 is the material supply part of the tray 200 which is supplied with a plurality of IC devices 90 in an unchecked state. The tray supply area A1 can also be said to be a mounting area where a plurality of trays 200 can be stacked and mounted. In addition, in this embodiment, in each tray 200, a plurality of recesses (grooves) are arranged in a matrix. The IC devices 90 can be housed and placed one by one in each recess.

器件供給區域A2係將自托盤供給區域A1搬送而來之托盤200上之複數個IC器件90分別搬送並供給至檢查區域A3之區域。另，以跨及托盤供給區域A1與器件供給區域A2之方式，設置有於水平方向逐片搬送托盤200之托盤搬送機構11A、11B。托盤搬送機構11A為搬送部25之一部分，可將托盤200連同載置於該托盤200之IC器件90一起，於Y方向正側，即圖2中之箭頭α11A方向移動。藉此，可將IC器件90穩定地送至器件供給區域A2。又，托盤搬送機構11B係可將空的托盤200於Y方向負側，即圖2中之箭頭α11B方向移動之移動部。藉此，可將空的托盤200自器件供給區域A2移動至托盤供給區域A1。The device supply area A2 transports and supplies a plurality of IC devices 90 on the tray 200 from the tray supply area A1 to the inspection area A3. In addition, tray conveying mechanisms 11A and 11B that convey the tray 200 piece by piece in the horizontal direction are provided so as to span the tray supply area A1 and the device supply area A2. The tray transport mechanism 11A is a part of the transport unit 25, and can move the tray 200 together with the IC device 90 placed on the tray 200 on the positive side of the Y direction, that is, in the direction of the arrow α11A in FIG. 2. Thereby, the IC device 90 can be stably sent to the device supply area A2. In addition, the tray transport mechanism 11B is a moving part that can move the empty tray 200 on the negative side of the Y direction, that is, in the direction of the arrow α11B in FIG. 2. Thereby, the empty tray 200 can be moved from the device supply area A2 to the tray supply area A1.

於器件供給區域A2，設有溫度調整部(均溫板(英語記作：soak plate))12、器件搬送頭13、及托盤搬送機構15。又，亦設有以跨及器件供給區域A2與檢查區域A3之方式移動之器件供給部14。In the device supply area A2, a temperature adjustment section (soak plate (English: soak plate)) 12, a device transfer head 13, and a tray transfer mechanism 15 are provided. In addition, a device supply unit 14 that moves so as to span the device supply area A2 and the inspection area A3 is also provided.

溫度調整部12為載置複數個IC器件90之載置部，係可將該載置之IC器件90一起加熱或冷卻之稱為「均溫板」。藉由該均溫板，可預先加熱或冷卻以檢查部16檢查前之IC器件90，並調整至適於該檢查(高溫檢查)之溫度。The temperature adjustment part 12 is a mounting part on which a plurality of IC devices 90 are mounted, and is called a "heating plate" that can heat or cool the mounted IC devices 90 together. With the uniform temperature plate, the IC device 90 before the inspection by the inspection section 16 can be preheated or cooled, and adjusted to a temperature suitable for the inspection (high temperature inspection).

作為如此之載置部之溫度調整部12係被固定。藉此，可對該溫度調整部12上之IC器件90穩定地調整溫度。The temperature adjustment part 12 as such a mounting part is fixed. Thereby, the temperature of the IC device 90 on the temperature adjustment part 12 can be stably adjusted.

又，溫度調整部12經接地(grounded)。 於圖2所示之構成中，溫度調整部12係於Y方向上配置並固定有2個。且，將藉由托盤搬送機構11A自托盤供給區域A1搬入之托盤200上之IC器件90搬送至任一溫度調整部12。In addition, the temperature adjustment unit 12 is grounded. In the structure shown in FIG. 2, the temperature adjustment part 12 is arrange|positioned and fixed to two in the Y direction. In addition, the IC device 90 on the tray 200 carried in from the tray supply area A1 by the tray transport mechanism 11A is transported to any temperature adjustment unit 12.

器件搬送頭13係固持並搬送IC器件90之固持部，於器件供給區域A2內可移動地被支持。該器件搬送頭13亦為搬送部25之一部分，可負責自托盤供給區域A1搬入之托盤200與溫度調整部12間之IC器件90之搬送，及溫度調整部12與後述之器件供給部14間之IC器件90之搬送。另，於圖2中，將器件搬送頭13之X方向之移動以箭頭α13X表示，將器件搬送頭13之Y方向之移動以箭頭α13Y表示。The device transfer head 13 is a holding portion that holds and transfers the IC device 90, and is movably supported in the device supply area A2. The device transfer head 13 is also a part of the transfer section 25, and is responsible for the transfer of IC devices 90 between the tray 200 and the temperature adjustment section 12 carried in from the tray supply area A1, and between the temperature adjustment section 12 and the device supply section 14 described later The transfer of IC device 90. In addition, in FIG. 2, the movement of the component transfer head 13 in the X direction is represented by arrow α13X, and the movement of the component transfer head 13 in the Y direction is represented by arrow α13Y.

器件供給部14為載置經溫度調整之IC器件90之載置部，係可將該IC器件90搬送至檢查部16附近之稱為「供給用梭板」或簡稱為「供給梭」者。該器件供給部14亦可成為搬送部25之一部分。於該器件供給部14，矩陣狀配置有複數個凹部(凹槽)。可於各凹部逐個收納並載置IC器件90。The component supply part 14 is a mounting part where the temperature-adjusted IC component 90 is placed, and it is called a "supply shuttle" or simply a "supply shuttle" that can transport the IC component 90 to the vicinity of the inspection unit 16. The device supply part 14 may also become a part of the conveying part 25. In the device supply section 14, a plurality of recesses (grooves) are arranged in a matrix. The IC devices 90 can be housed and placed one by one in each recess.

又，作為載置部之器件供給部14於X方向，即沿著箭頭α14方向，可於器件供給區域A2與檢查部16之檢查區域A3之間往返移動(可移動)地被支持。藉此，器件供給部14可將IC器件90自器件供給區域A2穩定地搬送至檢查區域A3之檢查部16附近，又，可將IC器件90於檢查區域A3藉由器件搬送頭17卸除後再次返回至器件供給區域A2。In addition, the component supply section 14 as the placement section is supported in the X direction, that is, along the arrow α14 direction, between the component supply area A2 and the inspection area A3 of the inspection section 16 so as to be movable (movable). Thereby, the device supply unit 14 can stably transport the IC device 90 from the device supply area A2 to the vicinity of the inspection unit 16 in the inspection area A3, and can also remove the IC device 90 from the inspection area A3 by the device transfer head 17 Return to the device supply area A2 again.

圖2所示之構成中，器件供給部14於Y方向配置有2個，將Y方向負側之器件供給部14稱為「器件供給部14A」，將Y方向正側之器件供給部14稱為「器件供給部14B」。且，將溫度調整部12上之IC器件90於器件供給區域A2內搬送至器件供給部14A或器件供給部14B。又，器件供給部14與溫度調整部12同樣地，構成為可加熱或冷卻載置於該器件供給部14之IC器件90。藉此，可對經溫度調整部12溫度調整之IC器件90，維持其溫度調整狀態，且將其搬送至檢查區域A3之檢查部16附近。又，器件供給部14亦與溫度調整部12同樣地接地。In the structure shown in FIG. 2, there are two component supply sections 14 arranged in the Y direction. The component supply section 14 on the negative side in the Y direction is called "device supply section 14A", and the component supply section 14 on the positive side in the Y direction is called It is "device supply part 14B". In addition, the IC device 90 on the temperature adjustment portion 12 is transported to the device supply portion 14A or the device supply portion 14B in the device supply area A2. In addition, the device supply unit 14 is configured to be able to heat or cool the IC device 90 placed on the device supply unit 14 similarly to the temperature adjustment unit 12. Thereby, the IC device 90 whose temperature has been adjusted by the temperature adjustment unit 12 can be maintained in its temperature adjustment state, and it can be transported to the vicinity of the inspection unit 16 in the inspection area A3. In addition, the device supply unit 14 is also grounded in the same manner as the temperature adjustment unit 12.

托盤搬送機構15係使已去除所有IC器件90之狀態之空的托盤200於器件供給區域A2內，於X方向正側即箭頭α15方向搬送之機構。且，於該搬送後，將空的托盤200藉由托盤搬送機構11B，自器件供給區域A2返回至托盤供給區域A1。The tray transport mechanism 15 is a mechanism for transporting the empty tray 200 in the device supply area A2 in the state where all the IC devices 90 have been removed, on the positive side of the X direction, that is, in the direction of arrow α15. And after this conveyance, the empty tray 200 is returned from the component supply area A2 to the tray supply area A1 by the tray conveyance mechanism 11B.

檢查區域A3係檢查IC器件90之區域。於該檢查區域A3，設有對IC器件90進行檢查之檢查部16，及器件搬送頭17。The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, an inspection unit 16 for inspecting the IC device 90 and a device transfer head 17 are provided.

器件搬送頭17為搬送部25之一部分，與溫度調整部12同樣地，構成為可加熱或冷卻所固持之IC器件90。藉此，可於固持經維持上述溫度調整狀態之IC器件90，以維持上述溫度調整狀態之狀態，於檢查區域A3內搬送IC器件90。The device transfer head 17 is a part of the transfer section 25, and, like the temperature adjustment section 12, is configured to be able to heat or cool the held IC device 90. Thereby, it is possible to hold the IC device 90 maintained in the aforementioned temperature-adjusted state to maintain the aforementioned temperature-adjusted state, and transport the IC device 90 in the inspection area A3.

如此之器件搬送頭17於檢查區域A3內於Y方向及Z方向可往返移動地被支持，成為稱為「分度臂」之機構之一部分。藉此，器件搬送頭17可將IC器件90從自器件供給區域A2搬入之器件供給部14提起，並將其搬送並載置於檢查部16上。Such a device transfer head 17 is supported reciprocally in the Y direction and the Z direction in the inspection area A3, and becomes a part of a mechanism called an "indexing arm". Thereby, the device transfer head 17 can lift the IC device 90 from the device supply unit 14 carried in from the device supply area A2, and can transfer it and place it on the inspection unit 16.

另，於圖2中，將器件搬送頭17之Y方向之往返移動以箭頭α17Y表示。又，器件搬送頭17於Y方向可往返移動地被支持，但並未限定於此，亦可於X方向可往返移動地被支持。又，圖2所示之構成中，器件搬送頭17於Y方向配置有2個，有將Y方向負側之器件搬送頭17稱為「器件搬送頭17A」，將Y方向正側之器件搬送頭17稱為「器件搬送頭17B」之情況。器件搬送頭17A可負責於檢查區域A3內，使IC器件90自器件供給部14A向檢查部16之搬送，器件搬送頭17B可負責於檢查區域A3內，使IC器件90自器件供給部14B向檢查部16之搬送。In addition, in FIG. 2, the reciprocating movement of the device transfer head 17 in the Y direction is indicated by an arrow α17Y. In addition, the device transfer head 17 is supported reciprocally in the Y direction, but it is not limited to this, and may be supported reciprocally in the X direction. In addition, in the structure shown in FIG. 2, two device transfer heads 17 are arranged in the Y direction. The device transfer head 17 on the negative side of the Y direction is called "device transfer head 17A", and the device on the positive side of the Y direction is transferred. The head 17 is referred to as the "device transfer head 17B". The device transfer head 17A can be in charge of the inspection area A3 to transfer the IC device 90 from the device supply unit 14A to the inspection unit 16, and the device transfer head 17B can be in charge of the inspection area A3, so that the IC device 90 is transferred from the device supply unit 14B to the inspection area A3. Transport of inspection section 16.

檢查部16(插槽)為載置電子零件即IC器件90，檢查該IC器件90之電性特性之載置部(電子零件載置部)。該檢查部16具有收納並載置IC器件90之凹部，於該凹部之底部，設有複數個探針銷。且，藉由將IC器件90之端子與探針銷可導電地連接，即接觸，而可進行IC器件90之檢查。IC器件90之檢查係基於記憶於連接於檢查部16之測試器所具備之檢查控制部之程式而進行。另，如此之檢查部16與溫度調整部12同樣，可將IC器件90加熱或冷卻，而將該IC器件90調整為適於檢查之溫度。The inspection portion 16 (slot) is a mounting portion (electronic component mounting portion) for mounting an IC device 90 that is an electronic component, and inspecting the electrical characteristics of the IC device 90. The inspection part 16 has a recess for storing and placing the IC device 90, and a plurality of probe pins are provided at the bottom of the recess. Furthermore, by electrically connecting the terminals of the IC device 90 and the probe pin, that is, contacting, the inspection of the IC device 90 can be performed. The inspection of the IC device 90 is performed based on a program memorized in the inspection control section of the tester connected to the inspection section 16. In addition, the inspection unit 16 in this manner, like the temperature adjustment unit 12, can heat or cool the IC device 90 and adjust the IC device 90 to a temperature suitable for inspection.

器件回收區域A4係將於檢查區域A3進行檢查，且結束該檢查之複數個IC器件90予以回收之區域。於該器件回收區域A4，設置有回收用托盤19、器件搬送頭20、及托盤搬送機構21。又，亦設有以跨及檢查區域A3與器件回收區域A4之方式移動之器件回收部18。又，於器件回收區域A4亦準備有空的托盤200。The device recovery area A4 is an area where the inspection will be performed in the inspection area A3, and a plurality of IC devices 90 that have completed the inspection will be recovered. In this device collection area A4, a collection tray 19, a device transfer head 20, and a tray transfer mechanism 21 are provided. In addition, there is also a device recovery section 18 that moves across the inspection area A3 and the device recovery area A4. In addition, an empty tray 200 is also prepared in the device recovery area A4.

器件回收部18為載置經檢查部16檢查結束之IC器件90，可將該IC器件90搬送至器件回收區域A4之載置部，稱為「回收用梭板」或簡稱為「回收梭」。該器件回收部18亦可成為搬送部25之一部分。The device recovery part 18 is used to mount the IC device 90 that has been inspected by the inspection part 16, and the IC device 90 can be transported to the placement part of the device recovery area A4, which is called "recycling shuttle" or simply "recycling shuttle" . The device recovery part 18 may also become a part of the conveying part 25.

又，器件回收部18可沿著X方向，即α18方向，於檢查區域A3與器件回收區域A4之間往返移動地被支持。又，圖2所示之構成中，器件回收部18與器件供給部14同樣地，於Y方向配置有2個，有將Y方向負側之器件回收部18稱為「器件回收部18A」，將Y方向正側之器件回收部18稱為「器件回收部18B」之情況。且，將檢查部16上之IC器件90搬送、載置於器件回收部18A或器件回收部18B。另，IC器件90自檢查部16向器件回收部18A之搬送係由器件搬送頭17A負責，自檢查部16向器件回收部18B之搬送係由器件搬送頭17B負責。又，器件回收部18亦與溫度調整部12或器件供給部14同樣經接地。In addition, the device recovery part 18 is supported so as to move back and forth between the inspection area A3 and the device recovery area A4 along the X direction, that is, the α18 direction. In the structure shown in FIG. 2, the device recovery part 18 is arranged in the Y direction as two parts as the device supply part 14, and the device recovery part 18 on the negative side of the Y direction is called the "device recovery part 18A". The device recovery part 18 on the positive side in the Y direction is referred to as "device recovery part 18B". In addition, the IC device 90 on the inspection unit 16 is transported and placed in the device collection unit 18A or the device collection unit 18B. The transfer of the IC device 90 from the inspection unit 16 to the device recovery unit 18A is performed by the device transfer head 17A, and the transfer from the inspection unit 16 to the device recovery unit 18B is performed by the device transfer head 17B. In addition, the device recovery unit 18 is also grounded like the temperature adjustment unit 12 or the device supply unit 14.

回收用托盤19係載置經檢查部16檢查之IC器件90之載置部，以於器件回收區域A4內不移動之方式固定。藉此，即使為配置有較多器件搬送頭20等之各種可動部之回收區域A4，亦於回收用托盤19上，穩定地載置完成檢查之IC器件90。另，於圖2所示之構成中，回收用托盤19沿X方向配置有3個。The tray 19 for recovery is a mounting part where the IC device 90 inspected by the inspection part 16 is placed, and is fixed so as not to move in the device recovery area A4. Thereby, even in the collection area A4 where a large number of various movable parts such as the device transfer head 20 are arranged, the IC device 90 that has been inspected is stably placed on the collection tray 19. In addition, in the configuration shown in FIG. 2, three collection trays 19 are arranged along the X direction.

又，空的托盤200亦沿X方向配置有3個。該空的托盤200亦成為載置經檢查部16檢查之IC器件90之載置部。且，將移動來到器件回收區域A4之器件回收部18上之IC器件90搬送並載置於回收用托盤19及空的托盤200中之任一者。藉此，將IC器件90依檢查結果分類，並回收。In addition, three empty trays 200 are also arranged along the X direction. The empty tray 200 also becomes a placement part where the IC device 90 inspected by the inspection part 16 is placed. In addition, the IC device 90 moved to the device recovery section 18 of the device recovery area A4 is transported and placed on either the recovery tray 19 or the empty tray 200. In this way, the IC devices 90 are classified according to the inspection results and recycled.

器件搬送頭20具有於器件回收區域A4內於X方向及Y方向可移動地被支持，進而於Z方向亦可移動之部分。該器件搬送頭20係搬送部25之一部分，可將IC器件90自器件回收部18搬送至回收用托盤19或空的托盤200。另，於圖2中，將器件搬送頭20之X方向之移動以箭頭α20X表示，將器件搬送頭20之Y方向之移動以箭頭α20Y表示。The device transfer head 20 has a part that is movably supported in the X direction and the Y direction in the device recovery area A4, and is further movable in the Z direction. The device transfer head 20 is a part of the transfer part 25, and can transfer the IC device 90 from the device recovery part 18 to the recovery tray 19 or the empty tray 200. In addition, in FIG. 2, the movement of the component transfer head 20 in the X direction is indicated by arrow α20X, and the movement of the component transfer head 20 in the Y direction is indicated by arrow α20Y.

托盤搬送機構21係於器件回收區域A4內，於X方向即箭頭α21方向，搬送自托盤去除區域A5搬入之空的托盤200之機構。且，於該搬送後，將空的托盤200配置於回收IC器件90之位置，即，可成為上述3個空的托盤200中之任一者。The tray transport mechanism 21 is a mechanism that transports the empty tray 200 carried in from the tray removal area A5 in the X direction, that is, the arrow α21 direction in the device recovery area A4. And, after the conveyance, the empty tray 200 is placed at the position where the IC device 90 is collected, that is, it can be any of the three empty trays 200 described above.

托盤去除區域A5係將排列有完成檢查狀態之複數個IC器件90之托盤200回收並去除之除材部。於托盤去除區域A5，可堆疊多個托盤200。The tray removal area A5 is a removal part for collecting and removing the tray 200 on which a plurality of IC devices 90 in the inspected state are arranged. In the tray removal area A5, a plurality of trays 200 can be stacked.

又，以跨及器件回收區域A4與托盤去除區域A5之方式，設置有於Y方向逐片搬送托盤200之托盤搬送機構22A、托盤搬送機構22B。托盤搬送機構22A係搬送部25之一部分，係可使托盤200於Y方向即箭頭α22A方向往返移動之移動部。藉此，可將完成檢查之IC器件90自器件回收區域A4搬送至托盤去除區域A5。又，托盤搬送機構22B可將用以回收IC器件90之空的托盤200於Y方向正側，即箭頭α22B方向移動。藉此，可將空的托盤200自托盤去除區域A5移動至器件回收區域A4。In addition, a tray transport mechanism 22A and a tray transport mechanism 22B that transport the tray 200 piece by piece in the Y direction are provided so as to span the device recovery area A4 and the tray removal area A5. The tray conveying mechanism 22A is a part of the conveying part 25, and is a moving part that allows the tray 200 to move back and forth in the Y direction, that is, in the direction of the arrow α22A. Thereby, the IC device 90 that has been inspected can be transported from the device recovery area A4 to the tray removal area A5. In addition, the tray conveying mechanism 22B can move the empty tray 200 used to collect the IC device 90 on the positive side of the Y direction, that is, in the direction of the arrow α 22B. Thereby, the empty tray 200 can be moved from the tray removal area A5 to the device recovery area A4.

控制部800具有至少1個處理器，該處理器進行各種判斷或各種命令等。控制部800例如可控制如下各部之作動：托盤搬送機構11A、托盤搬送機構11B、溫度調整部12、器件搬送頭13、器件供給部14、托盤搬送機構15、檢查部16、器件搬送頭17、器件回收部18、器件搬送頭20、托盤搬送機構21、托盤搬送機構22A、及托盤搬送機構22B等。The control unit 800 has at least one processor that performs various judgments, various commands, and the like. The control unit 800 can control the actions of the following parts, for example: the tray transport mechanism 11A, the tray transport mechanism 11B, the temperature adjustment unit 12, the device transfer head 13, the device supply unit 14, the tray transfer mechanism 15, the inspection unit 16, the device transfer head 17, The device collection unit 18, the device transfer head 20, the tray transfer mechanism 21, the tray transfer mechanism 22A, the tray transfer mechanism 22B, and the like.

另，本實施形態中，控制部800係內置於電子零件檢查裝置1，但並不限定於此。例如，控制部800亦可設置於外部之電腦等外部機器。又，該外部機器有例如經由電纜等與電子零件檢查裝置1通信之情形、無線通信之情形、及經由網路(網際網路)與電子零件檢查裝置1連接之情形等。In addition, in this embodiment, the control part 800 is built in the electronic component inspection apparatus 1, but it is not limited to this. For example, the control unit 800 may also be installed in an external device such as an external computer. In addition, the external device includes, for example, a case of communicating with the electronic component inspection device 1 via a cable or the like, a case of wireless communication, and a case of connecting to the electronic component inspection device 1 via a network (Internet).

操作員可經由監視器300，設定並確認電子零件檢查裝置1之動作條件等。該監視器300具有例如以液晶畫面構成之顯示畫面301，並配置於電子零件檢查裝置1之正面側上部。如圖1所示，於托盤去除區域A5之圖中之右側，設有載置滑鼠之滑鼠台600。該滑鼠係於操作顯示於監視器300之畫面時使用。The operator can set and confirm the operating conditions and the like of the electronic component inspection device 1 via the monitor 300. The monitor 300 has a display screen 301 composed of, for example, a liquid crystal screen, and is arranged on the upper part of the front side of the electronic component inspection device 1. As shown in FIG. 1, on the right side of the figure of the tray removal area A5, there is a mouse station 600 on which a mouse is placed. The mouse is used when operating the screen displayed on the monitor 300.

又，對監視器300於圖1之右下方配置有操作面板700。操作面板700係與監視器300分開，對電子零件檢查裝置1命令期望之動作者。In addition, an operation panel 700 is arranged on the lower right of the monitor 300 in FIG. 1. The operation panel 700 is separated from the monitor 300, and commands a desired action to the electronic component inspection device 1.

又，信號燈400可藉由發光之顏色之組合，報知電子零件檢查裝置1之作動狀態等。信號燈400係配置於電子零件檢查裝置1之上部。另，於電子零件檢查裝置1，內置有揚聲器500，亦可藉由該揚聲器500，報知電子零件檢查裝置1之作動狀態等。In addition, the signal lamp 400 can notify the operation status of the electronic component inspection device 1 and the like by the combination of the light-emitting colors. The signal lamp 400 is arranged on the upper part of the electronic component inspection device 1. In addition, the electronic component inspection device 1 has a built-in speaker 500, and the operation state of the electronic component inspection device 1 and the like can also be notified by the speaker 500.

電子零件檢查裝置1中，托盤供給區域A1與器件供給區域A2之間係由第1隔板231分隔，器件供給區域A2與檢查區域A3之間係由第2隔板232分隔，檢查區域A3與器件回收區域A4之間係由第3隔板233分隔，器件回收區域A4與托盤去除區域A5之間係由第4隔板234分隔。又，器件供給區域A2與器件回收區域A4之間亦係由第5隔板235分隔。In the electronic component inspection apparatus 1, the tray supply area A1 and the component supply area A2 are separated by a first partition 231, the component supply area A2 and the inspection area A3 are separated by a second partition 232, and the inspection area A3 is separated from The device recovery area A4 is separated by a third partition 233, and the device recovery area A4 and the tray removal area A5 are separated by a fourth partition 234. In addition, the device supply area A2 and the device recovery area A4 are also separated by a fifth partition 235.

電子零件檢查裝置1最外裝係由蓋覆蓋，該蓋有例如前蓋241、側蓋242、側蓋243、後蓋244及頂蓋245。The outermost of the electronic component inspection device 1 is covered by a cover, which includes, for example, a front cover 241, a side cover 242, a side cover 243, a rear cover 244, and a top cover 245.

如上述，電子零件檢查裝置1係預先搭載按IC器件90之種類作更換之稱為「更換套件」者而使用。As described above, the electronic component inspection device 1 is used by pre-installing a so-called "replacement kit" that is replaced by the type of IC device 90.

於器件搬送頭13，亦有可吸附IC器件90(電子零件)之吸附構件3，作為更換套件。吸附構件3係預先準備複數個對應於IC器件90(電子零件)之種類而形狀及大小中之至少一者(本實施形態中為吸附墊31之大小)不同者(參照圖3)。圖3中作為一例，係圖示吸附構件3A及吸附構件3B。且，選擇該等複數個吸附構件3(吸附構件3A及吸附構件3B)中之一者，將其安裝於安裝部4。藉此，可將適於各種IC器件90之吸附構件3安裝於安裝部4，因此，可以該吸附構件3穩定地吸附IC器件90。本實施形態中，根據IC器件90之大小，而選擇吸附構件3A及吸附構件3B之哪一者。IC器件90為「小」之情形時，選擇吸附構件3A，IC器件90為「大」之情形時，選擇吸附構件3B。以下，將吸附構件3安裝於安裝部4之狀態簡稱為「安裝狀態」。At the device transfer head 13, there is also an adsorption member 3 that can adsorb IC devices 90 (electronic parts) as a replacement kit. The suction member 3 prepares a plurality of different ones in at least one of the shape and size (the size of the suction pad 31 in this embodiment) corresponding to the type of the IC device 90 (electronic component) (see FIG. 3). As an example, FIG. 3 shows the suction member 3A and the suction member 3B. In addition, one of the plurality of suction members 3 (the suction member 3A and the suction member 3B) is selected and mounted on the mounting portion 4. Thereby, the adsorption member 3 suitable for various IC devices 90 can be mounted on the mounting portion 4, and therefore, the adsorption member 3 can stably adsorb the IC device 90. In this embodiment, according to the size of the IC device 90, which of the suction member 3A and the suction member 3B is selected. When the IC device 90 is "small", the suction member 3A is selected, and when the IC device 90 is "large", the suction member 3B is selected. Hereinafter, the state in which the suction member 3 is mounted on the mounting portion 4 is simply referred to as "mounted state".

另，本實施形態中，準備2個吸附構件3，但其數量並未特別限定，例如亦可為3個以上。In addition, in this embodiment, two adsorption members 3 are prepared, but the number is not specifically limited, For example, it may be three or more.

又，複數個吸附構件3於本實施形態中為部分大小不同者，但不限於此，例如可為全體大小不同者，可為部分形狀不同者，可為全體形狀不同者，亦可為形狀(部分、全體均可)及大小(部分、全體均可)之兩者不同者。In addition, in the present embodiment, the plurality of adsorption members 3 are partially different in size, but it is not limited to this. For example, they may have different overall sizes, may have different partial shapes, may have different overall shapes, or may have different shapes ( Part or all is acceptable) and size (part or all is acceptable) is different.

又，複數個吸附構件3於本實施形態中為大小不同者，但不限於此，例如亦可為除了大小不同外，進而形狀(部分、全體均可)不同者，亦可僅形狀(部分、全體均可)不同者。In addition, the plurality of adsorption members 3 are different in size in this embodiment, but it is not limited to this. For example, in addition to the different sizes, the shapes (parts or all of them) may be different, or only the shapes (parts, All can be different).

如圖3所示，吸附構件3A及吸附構件3B除了吸附墊31之大小不同以外，由於為相同構成，故以下針對吸附構件3A代表性說明。As shown in FIG. 3, the suction member 3A and the suction member 3B have the same structure except for the size of the suction pad 31. Therefore, the suction member 3A is representatively described below.

如圖4所示，吸附構件3A具有：吸附墊31，其可吸附IC器件90；支持部(吸附墊支持部)32，其支持吸附墊31；管狀部33，其以安裝狀態***於安裝部4；及支持部(管狀部支持部)34，其支持管狀部33。As shown in FIG. 4, the adsorption member 3A has: an adsorption pad 31 that can adsorb the IC device 90; a support portion (suction pad support portion) 32 that supports the adsorption pad 31; and a tubular portion 33 that is inserted into the mounting portion in a mounted state 4; and the support portion (tubular portion support portion) 34, which supports the tubular portion 33.

吸附墊31為具有於下端面311開口之開口部312之呈圓筒狀(圓管狀)之部分。該吸附墊31下端面311與IC器件90之上表面抵接，可藉由於開口部312產生之吸引力吸附IC器件90。且，保持該吸附狀態下，器件搬送頭13可於器件供給區域A2內，搬送IC器件90。The suction pad 31 is a cylindrical (circular tube) part having an opening 312 opened at the lower end surface 311. The lower end surface 311 of the adsorption pad 31 abuts against the upper surface of the IC device 90, and the IC device 90 can be attracted by the suction force generated by the opening 312. In addition, while maintaining this suction state, the device transfer head 13 can transfer the IC device 90 in the device supply area A2.

另，可藉由使經由安裝部4而連接之泵131作動，而於開口部312產生吸附力。In addition, by operating the pump 131 connected through the mounting portion 4, an adsorption force can be generated in the opening portion 312.

又，吸附墊31之外形形狀於本實施形態中為圓筒狀，但不限於此，例如亦可為角筒狀。如圖3所示，本實施形態中，吸附構件3A之吸附墊31及吸附構件3B之吸附墊31之外徑不同，即下端面311之大小不同。In addition, the outer shape of the suction pad 31 is cylindrical in this embodiment, but it is not limited to this, and may be, for example, a rectangular cylindrical shape. As shown in FIG. 3, in this embodiment, the outer diameter of the suction pad 31 of the suction member 3A and the suction pad 31 of the suction member 3B are different, that is, the size of the lower end surface 311 is different.

又，亦可於吸附墊31之外周側設置遮罩。藉此，可增大與吸附焊墊31之接觸面積，藉此可穩定地吸附IC器件90。對於該遮罩之外形形狀，並未特別限定，例如可設為俯視時成圓形或角形。In addition, a mask may be provided on the outer peripheral side of the suction pad 31. As a result, the contact area with the suction pad 31 can be increased, thereby stably suctioning the IC device 90. The outer shape of the mask is not particularly limited, and for example, it may be round or angular in plan view.

支持部32係支持吸附墊31之上端部，較吸附墊31之外徑更擴徑之部分。藉此，可牢固地支持吸附墊31。又，於支持部32之外周部，形成有板狀突出之凸緣部321。將吸附構件3A安裝於安裝部4時，若以指尖抓住凸緣部321而固持，則可容易進行其安裝作業。The supporting part 32 is a part that supports the upper end of the suction pad 31 and has a larger diameter than the outer diameter of the suction pad 31. Thereby, the suction pad 31 can be firmly supported. In addition, a flange portion 321 protruding in a plate shape is formed on the outer periphery of the support portion 32. When attaching the suction member 3A to the attaching portion 4, if the flange portion 321 is grasped and held by fingertips, the attaching operation can be easily performed.

於與吸附焊墊31之相反側，設有呈圓管狀之管狀部33。該管狀部33係於安裝狀態下***於安裝部4之部分。於管狀部33之外周部332，設有於安裝狀態下供安裝部4之第2扣合部42扣合之第1扣合部331。藉由該扣合，而維持安裝狀態，藉此，防止吸附構件3A自安裝部4不經意地脫離。On the opposite side of the suction pad 31, a tubular portion 33 having a circular tube shape is provided. The tubular portion 33 is a portion inserted into the installation portion 4 in the installed state. The outer peripheral portion 332 of the tubular portion 33 is provided with a first engaging portion 331 for engaging the second engaging portion 42 of the mounting portion 4 in the installed state. By this engagement, the attached state is maintained, thereby preventing the suction member 3A from being accidentally separated from the attaching portion 4.

另，本實施形態中，第1扣合部331係以沿著管狀部33之外周部332之周向形成之環狀槽(凹部)構成，但不限於此，例如亦可根據第2扣合部42之構成(形狀)，例如以於管狀部33之外周部332之複數部位凹陷形成之凹部、沿著管狀部33之外周部332之周向突出形成之凸條、於管狀部33之外周部332之複數部位突出形成之複數個凸部等構成。In addition, in the present embodiment, the first engaging portion 331 is formed with an annular groove (recess) formed along the circumferential direction of the outer peripheral portion 332 of the tubular portion 33, but it is not limited to this, and for example, the second engaging portion The configuration (shape) of the portion 42 is, for example, a recess formed at a plurality of locations on the outer peripheral portion 332 of the tubular portion 33, a protrusion formed along the circumferential direction of the outer peripheral portion 332 of the tubular portion 33, and an outer circumference of the tubular portion 33 The portion 332 is configured by a plurality of convex portions formed by protruding multiple parts of the portion 332.

支持部34係支持管狀部33之下端部，較管狀部33之外徑更擴徑之部分。藉此，可牢固地支持管狀部33。又，亦可限制管狀部33向安裝部4之***界限(參照圖4)。The supporting part 34 is a part that supports the lower end of the tubular part 33 and has a larger diameter than the outer diameter of the tubular part 33. Thereby, the tubular portion 33 can be firmly supported. In addition, the insertion limit of the tubular portion 33 into the mounting portion 4 may be restricted (see FIG. 4).

如上構成之吸附構件3A於內部自上方之管狀部33連通至下方之吸附焊墊31。The suction member 3A constructed as above is connected from the upper tubular portion 33 to the lower suction pad 31 inside.

另，吸附構件3A可為一體形成有吸附墊31、支持部32、管狀部33、支持部34者，亦可為分開構成該等中之至少一部分，將該單獨體接合者。In addition, the adsorption member 3A may be one in which the adsorption pad 31, the support portion 32, the tubular portion 33, and the support portion 34 are integrally formed, or may be one that separately constitutes at least a part of these and joins the separate bodies.

作為吸附構件3A之構成材料，並未特別限定，例如可使用硬質之各種金屬材料或各種樹脂材料等。又，吸附構件3A亦可係以彈性材料構成吸附墊31。The constituent material of the adsorption member 3A is not particularly limited. For example, various hard metal materials or various resin materials can be used. Moreover, the adsorption member 3A can also be made of an elastic material to form the adsorption pad 31.

將如上構成之吸附構件3A裝卸自如地安裝於安裝部4。如圖3所示，安裝部4係設置於器件搬送頭13之基部132之下端部。又，安裝部4之配置數並未特別限定，例如可為1個，亦可為複數個。配置有複數個安裝部4之情形時，對於沿著X方向之配置數，及沿著Y方向之配置數，並未特別限定，例如可相同，亦可不同。The suction member 3A configured as described above is detachably attached to the mounting portion 4. As shown in FIG. 3, the mounting portion 4 is provided at the lower end of the base portion 132 of the device transfer head 13. Moreover, the arrangement number of the mounting part 4 is not specifically limited, For example, it may be one, and may be multiple. When a plurality of mounting parts 4 are arranged, the number of arrangements along the X direction and the number of arrangements along the Y direction are not particularly limited. For example, they may be the same or different.

如圖4～圖8所示，安裝部4具有內側筒狀部41；第2扣合部42，其可移位地支持於內側筒狀部41；操作部43，其進行可移位第2扣合部42之操作；及彈推部44，其對操作部43彈推。又，如圖3所示，安裝部4進而具有限制部45，其限制安裝狀態下之吸附構件3A(針對吸附構件3B亦相同)繞Z軸之旋轉。As shown in Figures 4 to 8, the mounting portion 4 has an inner cylindrical portion 41; a second buckling portion 42 that is displaceably supported on the inner cylindrical portion 41; an operating portion 43 that can be displaced second The operation of the buckling portion 42; and the elastic pushing portion 44, which elastically pushes the operating portion 43. In addition, as shown in FIG. 3, the mounting portion 4 further has a restricting portion 45 that restricts the rotation of the suction member 3A (the same for the suction member 3B) in the mounted state around the Z axis.

內側筒狀部41係自基部132向下方圓管狀突出形成之部分。於該內側筒狀部41之內部空間411，以安裝狀態***吸附構件3A之管狀部33。藉此，內側筒狀部41之內部空間411與吸附構件3A之內部空間35連通。且，於該連通狀態下藉由泵131作動，而可將基部132之連接泵131之部分至吸附構件3A之內部空間35予以減壓。藉此，於吸附構件3A之吸附墊31之開口部312產生吸附力，可吸附IC器件90。The inner cylindrical portion 41 is a portion formed by projecting a circular tube downward from the base portion 132. In the inner space 411 of the inner cylindrical portion 41, the tubular portion 33 of the suction member 3A is inserted in an installed state. Thereby, the internal space 411 of the inner cylindrical portion 41 communicates with the internal space 35 of the adsorption member 3A. In addition, the pump 131 is operated in this communication state, so that the portion of the base 132 connecting the pump 131 to the internal space 35 of the adsorption member 3A can be decompressed. Thereby, the opening 312 of the suction pad 31 of the suction member 3A generates suction force, and the IC device 90 can be suctioned.

如圖4(針對圖5～圖8亦相同)所示，於內側筒狀部41之內周部412，設有沿著其周向呈環狀之密封構件(襯墊)46。密封構件46係以彈性材料構成，於安裝狀態下，於內側管狀部41之內周部412與吸附構件3A之管狀部33之外周部332之間被壓縮，而彈性變形。藉此，將內側筒狀部41之內周部412與吸附構件3A之管狀部33之外周部332之間氣密地密封。因此，泵131作動時，可防止空氣自內側筒狀部41之內周部412與吸附構件3A之管狀部33之外周部332之間洩漏，而使於吸附墊31之開口部312產生之吸附力減少。藉此，可穩定地持續吸附IC器件90。As shown in FIG. 4 (the same for FIGS. 5 to 8), the inner peripheral portion 412 of the inner cylindrical portion 41 is provided with a sealing member (pad) 46 having an annular shape along the circumferential direction. The sealing member 46 is made of an elastic material, and in the installed state, it is compressed between the inner peripheral portion 412 of the inner tubular portion 41 and the outer peripheral portion 332 of the tubular portion 33 of the adsorption member 3A, and is elastically deformed. Thereby, the inner peripheral portion 412 of the inner cylindrical portion 41 and the outer peripheral portion 332 of the tubular portion 33 of the suction member 3A are hermetically sealed. Therefore, when the pump 131 is activated, it is possible to prevent air from leaking between the inner peripheral portion 412 of the inner cylindrical portion 41 and the outer peripheral portion 332 of the tubular portion 33 of the adsorbing member 3A, thereby causing suction to occur in the opening 312 of the adsorbing pad 31 Power reduction. Thereby, the IC device 90 can be sucked stably and continuously.

又，內側筒狀部41於較密封構件46更下方側之部分，具有自內部空間411放射狀形成之槽413。於各槽413，逐個收納有構成第2扣合部42之球體421。該球體421可沿著收納該球體421之槽413所形成之方向，於下述第1位置與第2位置間移動。In addition, the inner cylindrical portion 41 has a groove 413 formed radially from the inner space 411 at a portion lower than the sealing member 46. In each groove 413, the ball 421 constituting the second engaging portion 42 is housed one by one. The ball 421 can move between a first position and a second position described below along the direction formed by the groove 413 that accommodates the ball 421.

第1位置係第2扣合部42(球體421)與吸附構件3(吸附構件3A或吸附構件3B)之第1扣合部331扣合，成為安裝有吸附構件3之安裝狀態之位置(參照圖4)。第2位置係解除安裝狀態之位置(參照圖6)。The first position is when the second engaging portion 42 (sphere 421) is engaged with the first engaging portion 331 of the suction member 3 (the suction member 3A or the suction member 3B), and becomes the position where the suction member 3 is installed (refer to Figure 4). The second position is the position where the installation is released (refer to Figure 6).

如上述，吸附構件3具有以安裝狀態***於安裝部4之管狀部33。又，第1扣合部331(凹部)係以形成於管狀部33之外周部332之周向之槽(凹部)構成。且，第2扣合部42係以於第1位置扣合於第1扣合部331(凹部)之凸部構成。該凸部係以於第1位置沿著第1扣合部331(槽)複數個配置之球體421構成(參照圖4)。如此，藉由以球體421(凸部)構成第2扣合部42，如後述，可容易進行吸附構件3對安裝部4之裝卸操作，其結果，對應於IC器件90種類之吸附構件3之更換作業，即吸附構件3A與吸附構件3B之更換作業變容易。As described above, the suction member 3 has the tubular portion 33 inserted into the mounting portion 4 in the mounted state. In addition, the first engaging portion 331 (recessed portion) is configured by a groove (recessed portion) formed in the circumferential direction of the outer peripheral portion 332 of the tubular portion 33. In addition, the second engaging portion 42 is constituted by a convex portion that is engaged with the first engaging portion 331 (concave portion) at the first position. The convex portion is composed of a plurality of balls 421 arranged along the first engagement portion 331 (groove) at the first position (refer to FIG. 4). In this way, by forming the second engaging portion 42 with the ball 421 (convex portion), as will be described later, the attaching and detaching operation of the suction member 3 to the mounting portion 4 can be easily performed. As a result, the suction member 3 corresponding to the type of IC device 90 The replacement work, that is, the replacement work of the adsorption member 3A and the adsorption member 3B becomes easy.

另，作為球體421之構成材料，並未特別限定，例如可使用如不鏽鋼等各種金屬材料。In addition, the constituent material of the ball 421 is not particularly limited. For example, various metal materials such as stainless steel can be used.

又，第2扣合部42於本實施形態中係構成為可於相對於內側筒狀部41之中心軸正交之方向移動，但不限於此，例如可構成為於內側筒狀部41之中心軸方向可移動，亦可構成為可繞內側筒狀部41之中心軸旋轉。In addition, the second engaging portion 42 is configured to be movable in a direction orthogonal to the central axis of the inner cylindrical portion 41 in this embodiment, but it is not limited to this. For example, it may be configured to be formed on the inner cylindrical portion 41. It is movable in the direction of the central axis, and may be configured to be rotatable around the central axis of the inner cylindrical portion 41.

安裝部4具有操作部43，其進行各球體421(第2扣合部42)可自第1位置向第2位置之移動(移位)之一次操作。操作部43係於內側筒狀部41之外周側，以與內側筒狀部41同心配置之筒體構成。該操作部43可於內側筒狀部41之中心軸方向，即沿著z方向，移動至上位置(參照圖5～圖7)及下位置(參照圖4、圖8)。另，操作部43於上位置，限制再向上方之移動界限，於下位置，亦限制再向下方之移動界限。The mounting portion 4 has an operating portion 43 that performs a single operation for moving (displacement) of each ball 421 (the second engaging portion 42) from the first position to the second position. The operating portion 43 is located on the outer peripheral side of the inner cylindrical portion 41 and is constituted by a cylindrical body arranged concentrically with the inner cylindrical portion 41. The operating portion 43 can be moved to an upper position (refer to FIGS. 5 to 7) and a lower position (refer to FIGS. 4 and 8) in the direction of the central axis of the inner cylindrical portion 41, that is, along the z direction. In addition, the operating portion 43 at the upper position restricts the upper movement limit, and at the lower position, also restricts the lower movement limit.

又，操作部43具有位於下位置時，可一起按壓各球體421之按壓部431。按壓部431係以沿著操作部43之內周部之周向突出形成之環狀之突出部構成。藉此，限制各球體421自第1位置移動至第2位置，藉此，可防止處於安裝狀態之吸附構件3自安裝部4脫離。In addition, the operation portion 43 has a pressing portion 431 that can press the balls 421 together when it is located in the lower position. The pressing portion 431 is constituted by a ring-shaped protrusion formed along the circumferential direction of the inner peripheral portion of the operating portion 43. Thereby, each ball 421 is restricted from moving from the first position to the second position, thereby preventing the suction member 3 in the mounted state from detaching from the mounting portion 4.

又，操作部43位於上位置時，按壓部431自各球體421退避。藉此，解除按壓部431對各球體421之按壓力，藉此，各球體421可自第1位置移動至第2位置。且，該狀態下，例如可使安裝於安裝部4之吸附構件3脫離(參照圖5～圖7)，與此相反地，可將吸附構件3安裝於尚未安裝吸附構件3之安裝部4。In addition, when the operation portion 43 is located at the upper position, the pressing portion 431 is retracted from each ball 421. Thereby, the pressing force of the pressing portion 431 on each ball 421 is released, whereby each ball 421 can be moved from the first position to the second position. And, in this state, for example, the suction member 3 attached to the attachment portion 4 can be detached (see FIGS. 5 to 7). Conversely, the suction member 3 can be attached to the attachment portion 4 where the suction member 3 has not been attached.

安裝部4具有彈推部44，其將操作部43向下方彈推，限制第2扣合部42之移位。彈推部44於本實施形態中，係於內側筒狀部41與操作部43之間，以與該等同心配置之螺旋彈簧441構成。螺旋彈簧441其上端442自下方與突出形成於內側筒狀部41之外周部之突出部414抵接，下端443自上方與內側筒狀部41之按壓部431抵接。又，螺旋彈簧441於突出部414與按壓部413之間成為壓縮狀態。藉此，對操作部43作用向下方之彈推力。藉由該彈推力，維持操作部43位於下位置之狀態。藉此，限制各球體421自第1位置移動至第2位置，藉此，可防止處於安裝狀態之吸附構件3自安裝部4不經意地脫離。The mounting portion 4 has an elastic pushing portion 44 that pushes the operating portion 43 downward to restrict the displacement of the second engaging portion 42. In the present embodiment, the elastic pushing portion 44 is connected between the inner cylindrical portion 41 and the operating portion 43, and is composed of a coil spring 441 arranged concentrically with this. The upper end 442 of the coil spring 441 abuts against the protrusion 414 protrudingly formed on the outer periphery of the inner cylindrical portion 41 from below, and the lower end 443 abuts against the pressing portion 431 of the inner cylindrical portion 41 from above. In addition, the coil spring 441 is in a compressed state between the protruding portion 414 and the pressing portion 413. Thereby, a downward elastic thrust is applied to the operation part 43. With this elastic thrust, the state of the operating portion 43 at the lower position is maintained. Thereby, each ball 421 is restricted from moving from the first position to the second position, thereby preventing the suction member 3 in the mounted state from being inadvertently separated from the mounting portion 4.

如圖3所示，安裝部4具有限制部45，其與吸附構件3一起限制吸附於吸附構件3之IC器件90(電子零件)繞Z軸(垂直軸)之旋轉(關於「IC器件90吸附於吸附構件3之狀態」，參照圖4)。限制部45對於安裝部4設置於Y方向正側，係以自器件搬送頭13之基部132向Z方向負側(下方)棒狀突出形成之棒狀部451構成。該棒狀部451於圖3所示之構成中，外徑(粗度)沿著Z方向(長度方向)為固定，但不限於此，亦可有沿著Z方向變化之部分。As shown in Figure 3, the mounting portion 4 has a restricting portion 45, which, together with the suction member 3, restricts the rotation of the IC device 90 (electronic component) adsorbed to the suction member 3 around the Z axis (vertical axis) (about "IC device 90 suction In the state of the suction member 3", refer to FIG. 4). The restricting portion 45 is provided on the positive side in the Y direction with respect to the mounting portion 4, and is constituted by a rod-shaped portion 451 formed by protruding from the base portion 132 of the device transfer head 13 to the negative side (downward) in the Z direction. In the configuration shown in FIG. 3, the rod-shaped portion 451 has a fixed outer diameter (thickness) along the Z direction (longitudinal direction), but it is not limited to this, and may have a portion that changes along the Z direction.

另一方面，於吸附構件3之凸緣部321，於Y方向正側之部分形成有缺口部322。於安裝狀態下，棒狀部451可插通並扣合於該缺口部322。藉此，限制IC器件90吸附於吸附構件3之狀態下，繞安裝部4(吸附構件3)之中心軸，即繞Z軸連同吸附構件3一起旋轉。藉由如此之旋轉限制，例如IC器件90為於俯視時成四角形狀者之情形時，可防止相鄰之IC器件90彼此干涉。又，由於維持IC器件90之姿勢，故該IC器件90順利地載置於其搬送目的地(例如器件供給部14之收納、載置IC器件90之凹部)。On the other hand, in the flange portion 321 of the suction member 3, a notch portion 322 is formed in the portion on the positive side in the Y direction. In the installed state, the rod-shaped portion 451 can be inserted through and snapped onto the notch portion 322. Thereby, the IC device 90 is restricted from rotating with the suction member 3 around the central axis of the mounting portion 4 (the suction member 3), that is, around the Z axis, in a state where the IC device 90 is adsorbed to the suction member 3. With such a rotation restriction, for example, when the IC device 90 is a quadrangular shape when viewed from above, the adjacent IC devices 90 can be prevented from interfering with each other. In addition, since the posture of the IC device 90 is maintained, the IC device 90 is smoothly placed at its transfer destination (for example, the storage of the device supply portion 14 and the recessed portion where the IC device 90 is placed).

繼而，針對對於安裝部4將吸附構件3A更換為吸附構件3B之作業，參照圖4～圖8進行說明。Next, the operation of replacing the suction member 3A with the suction member 3B for the mounting portion 4 will be described with reference to FIGS. 4 to 8.

如圖4所示，吸附構件3A成為安裝於安裝部4之安裝狀態。該安裝狀態下，如上述，吸附構件3A之內部空間35與安裝部4之內部空間411連通。藉此，成為可藉泵131吸附IC器件90之狀態。As shown in FIG. 4, the adsorption member 3A is in the mounted state to be mounted on the mounting portion 4. In this mounting state, as described above, the internal space 35 of the adsorption member 3A and the internal space 411 of the mounting portion 4 communicate. In this way, the IC device 90 can be sucked by the pump 131.

又，安裝部4之操作部43位於下位置，被螺旋彈簧411(彈推部44)彈推。該操作部43之按壓部431一起按壓位於第1位置之各球體421(第2扣合部42)。藉此，限制各球體421向第2位置之移動，藉此維持安裝狀態。In addition, the operating portion 43 of the mounting portion 4 is located at the lower position and is urged by the coil spring 411 (the urging portion 44). The pressing portion 431 of the operating portion 43 presses each ball 421 (the second engaging portion 42) at the first position together. Thereby, the movement of each ball 421 to the second position is restricted, thereby maintaining the mounted state.

繼而，如圖5所示，與螺旋彈簧411(彈推部44)之彈推力對抗，使操作部43移動至上位置。藉此，各球體421解除按壓部431之按壓力，藉此成為可移動至第2位置之狀態。Then, as shown in FIG. 5, opposing the elastic thrust of the coil spring 411 (the elastic pushing portion 44), the operating portion 43 is moved to the upper position. Thereby, each ball 421 releases the pressing force of the pressing portion 431, thereby becoming a state where it can move to the second position.

繼而，如圖6所示，向下方拉伸吸附構件3A。藉此，各球體421越過吸附構件3A之第1扣合部331之上側之傾斜面331a，移動至第2位置。又，若進而向下方拉伸吸附構件3A，則各球體421於吸附構件3A之管狀部33之外周部332滑動。 因此，如圖7所示，吸附構件3A自安裝部4脫離。Then, as shown in FIG. 6, the suction member 3A is pulled downward. Thereby, each ball 421 moves over the inclined surface 331a on the upper side of the first engaging portion 331 of the suction member 3A and moves to the second position. In addition, when the suction member 3A is further extended downward, each ball 421 slides on the outer peripheral portion 332 of the tubular portion 33 of the suction member 3A. Therefore, as shown in FIG. 7, the suction member 3A is detached from the mounting portion 4.

繼而，若解除使操作部43移動至上位置之力，則如圖8所示，操作部43藉由自重與螺旋彈簧44之彈推力，再次迅速返回至下位置。又，此時，操作部43之按壓部431可一起按壓位於第2位置之各球體421，返回至第1位置。Then, when the force for moving the operating portion 43 to the upper position is released, as shown in FIG. 8, the operating portion 43 quickly returns to the lower position by its own weight and the elastic force of the coil spring 44. In addition, at this time, the pressing portion 431 of the operating portion 43 can press the balls 421 at the second position together and return to the first position.

如此，可於保持將操作部43上提至上位置之狀態下，以向下方拉伸吸附構件3A之簡單操作，使吸附構件3A容易且迅速地自安裝部4脫離。In this way, the suction member 3A can be easily and quickly detached from the mounting portion 4 by the simple operation of pulling the suction member 3A downward while keeping the operation portion 43 raised to the upper position.

又，將吸附構件3B安裝於安裝部4時，可藉由進行上述相反之操作，而進行其安裝。即，可於保持將操作部43上提至上位置之狀態下，以將吸附構件3B***於安裝部4之簡單操作，將吸附構件3B容易且迅速地安裝於安裝部4。又，若於內側筒狀部41，於各球體421之密封構件46側，設置可供各球體421移動之槽，則可不將操作部43向上提起，藉由管狀部33之外周部332押入各球體421。藉此，可不將操作部43向上提起，以將吸附構件3B押入於安裝部4之簡單操作，即可將吸附構件3B容易且迅速地安裝於安裝部4。In addition, when attaching the suction member 3B to the attaching portion 4, the attaching can be performed by performing the above-mentioned reverse operation. That is, the suction member 3B can be easily and quickly mounted to the mounting portion 4 by a simple operation of inserting the suction member 3B into the mounting portion 4 while keeping the operating portion 43 raised to the upper position. In addition, if grooves are provided on the inner cylindrical portion 41 on the sealing member 46 side of each ball 421 to allow each ball 421 to move, it is not necessary to lift the operating portion 43 upward, and the outer peripheral portion 332 of the tubular portion 33 is pushed into each球体421. Thereby, the suction member 3B can be easily and quickly mounted on the mounting portion 4 by a simple operation of pushing the suction member 3B into the mounting portion 4 without lifting the operating portion 43 upward.

如上述，電子零件檢查裝置1(電子零件搬送裝置10)中，可對應於IC器件90之種類，容易進行將吸附構件3A更換成吸附構件3B(或將吸附構件3B更換成吸附構件3A)之作業。藉此，移行至種類不同之IC器件90之檢查時，可迅速且順利地進行其移行。As mentioned above, the electronic component inspection device 1 (electronic component conveying device 10) can correspond to the type of IC device 90, and it is easy to replace the suction member 3A with the suction member 3B (or replace the suction member 3B with the suction member 3A). operation. Thereby, when moving to the inspection of IC devices 90 of different types, the moving can be performed quickly and smoothly.

＜第2實施形態＞以下，參照圖9及圖10，針對本發明之電子零件搬送裝置及電子零件檢查裝置之第2實施形態進行說明，但以與上述實施形態之不同點為中心進行說明，相同事項省略其說明。<Second Embodiment> Hereinafter, referring to Figs. 9 and 10, the second embodiment of the electronic component transport device and the electronic component inspection device of the present invention will be described, but the description will be focused on the differences from the above-mentioned embodiment. The description of the same matters is omitted.

本實施形態除了安裝部省略限制吸附於吸附構件之IC器件之旋轉之限制部外，餘與上述第1實施形態相同。This embodiment is the same as the above-mentioned first embodiment except that the mounting portion omits the restricting portion that restricts the rotation of the IC device adsorbed to the suction member.

如圖9所示，以吸附構件3吸附IC器件90。該圖9所示之狀態下，吸附構件3之中心軸O3與器件供給部14之凹部141之中心軸O141不位於同一直線上，產生位置偏移。As shown in FIG. 9, the IC device 90 is adsorbed by the adsorption member 3. In the state shown in FIG. 9, the central axis O3 of the suction member 3 and the central axis O141 of the concave portion 141 of the device supply portion 14 are not on the same straight line, and positional deviation occurs.

又，本實施形態中，自安裝部4省略限制部45之部分，產生使處於安裝狀態之吸附構件3可於X方向、Y方向、Z方向之任一者稍微移動之「游隙」。藉此，如圖10所示，將IC器件90載置於器件供給部14之凹部141時，IC器件90可沿著凹部141之錐狀之側壁142，以上述遊隙量，抵消中心軸O3與中心軸O141之位置偏移。藉此，可將IC器件90順利地載置於器件供給部14之凹部141。In addition, in the present embodiment, the part of the restricting portion 45 is omitted from the mounting portion 4, and a "clearance" that allows the suction member 3 in the mounted state to move slightly in any of the X direction, Y direction, and Z direction is generated. As a result, as shown in FIG. 10, when the IC device 90 is placed in the recess 141 of the device supply portion 14, the IC device 90 can be along the tapered side wall 142 of the recess 141, offsetting the central axis O3 by the above-mentioned clearance. Offset from the position of the central axis O141. Thereby, the IC device 90 can be smoothly placed in the recess 141 of the device supply part 14.

＜第3實施形態＞以下，參照圖11，針對本發明之電子零件搬送裝置及電子零件檢查裝置之第3實施形態進行說明，但以與上述實施形態之不同點為中心進行說明，相同事項省略其說明。 本實施形態除了吸附構件之構成不同以外，餘與上述第1實施形態相同。<Third Embodiment> Hereinafter, referring to FIG. 11, a third embodiment of the electronic component conveying device and electronic component inspection device of the present invention will be described, but the description will focus on the differences from the above-mentioned embodiment, and the same items will be omitted Its description. This embodiment is the same as the above-mentioned first embodiment except for the difference in the structure of the suction member.

如圖11所示，本實施形態中，吸附構件3構成為具備組裝使用之2個構件。即，吸附構件3具備：第1構件30A，其具有於安裝狀態***於安裝部4之管狀部33，及支持管狀部33之支持部34；及第2構件30B，其係連接於第1構件30A而使用，具有可吸附IC器件90(電子零件)之吸附墊31，及支持吸附墊31之支持部32。As shown in FIG. 11, in this embodiment, the adsorption|suction member 3 is comprised so that it may be equipped with two members for assembly. That is, the adsorption member 3 includes: a first member 30A having a tubular portion 33 inserted into the mounting portion 4 in an installed state, and a supporting portion 34 supporting the tubular portion 33; and a second member 30B connected to the first member 30A, it has an adsorption pad 31 that can adsorb IC devices 90 (electronic components), and a support portion 32 that supports the adsorption pad 31.

又，第2構件30B係準備有複數個對應於IC器件90(電子零件)之種類而形狀及大小中之至少一者(本實施形態中為吸附墊31之大小)不同者。圖11中，作為一例，係圖示第2構件30B1，及吸附墊31之大小大於第2構件30B1之第2構件30B2。且，選擇該等複數個第2構件30B(第2構件30B1及第2構件30B2)中之一者，將其連接於第1構件30A。將第2構件30B1連接於第1構件30A而組裝之吸附構件3成為吸附構件3A。又，將第2構件30B2連接於第1構件30A而組裝之吸附構件3成為吸附構件3B。如此，若將第1構件30A設為共通構件，準備複數種大小之第2構件30B，則可將適於各種IC器件90之吸附構件3(吸附構件3A或吸附構件3B)安裝於安裝部4。In addition, the second member 30B prepares a plurality of different ones in at least one of the shape and size (the size of the suction pad 31 in this embodiment) corresponding to the type of the IC device 90 (electronic component). In FIG. 11, as an example, the second member 30B1 and the second member 30B2 of which the size of the suction pad 31 is larger than the second member 30B1 are shown. Then, one of the plural second members 30B (the second member 30B1 and the second member 30B2) is selected and connected to the first member 30A. The suction member 3 assembled by connecting the second member 30B1 to the first member 30A becomes the suction member 3A. In addition, the suction member 3 assembled by connecting the second member 30B2 to the first member 30A becomes the suction member 3B. In this way, if the first member 30A is a common member and the second members 30B of multiple sizes are prepared, the suction member 3 (the suction member 3A or the suction member 3B) suitable for various IC devices 90 can be mounted on the mounting portion 4 .

另，本實施形態中，準備有2個第2構件30B，但其數量並未特別限定，例如亦可為3個以上。In addition, in this embodiment, two second members 30B are prepared, but the number is not particularly limited, and for example, three or more may be used.

又，複數個第2構件30B於本實施形態中為部分大小不同者，但不限於此，例如可為全體大小不同者，可為部分形狀不同者，可為全體形狀不同者，亦可為形狀(部分、全體均可)及大小(部分、全體均可)兩者不同者。In addition, the plurality of second members 30B in this embodiment are parts of different sizes, but it is not limited to this. For example, they may be of different sizes, parts of shapes may be different, all shapes may be different, or shapes may be different. (Part or all is acceptable) and size (part or all) are different.

又，複數個第2構件30B於本實施形態中為大小不同者，但不限於此，例如可為除了大小不同外，進而形狀(部分、全體均可)亦不同者，亦可為僅形狀(部分、全體均可)不同者。In addition, the plurality of second members 30B are different in size in this embodiment, but it is not limited to this. For example, in addition to the different sizes, they may also have different shapes (partially or entirely), or only the shape ( Some or all of them can be different.

如圖11所示，本實施形態中，於第1構件30A，於支持部34之下部，突出形成有外螺紋36。另一方面，於第2構件30B，於支持部32，形成有與第1構件30A之連接時與外螺紋36螺合之內螺紋37。As shown in FIG. 11, in this embodiment, the male screw 36 is protrudingly formed in the lower part of the support part 34 in 30 A of 1st members. On the other hand, in the second member 30B, the support portion 32 is formed with an internal thread 37 that is screwed to the external thread 36 when connecting with the first member 30A.

又，於外螺紋36與支持部34之邊界部，設有沿著外螺紋36之周向呈環狀之密封構件(襯墊)38。密封構件38係以彈性材料構件，於組裝有第1構件30A與第2構件30B之狀態下，於支持部34與支持部32之間被壓縮，而彈性變形。藉此，將支持部34與支持部32之間氣密地密封。因此，可防止泵131作動時空氣自支持部34與支持部32之間洩漏，而使於吸附墊31之開口312產生之吸附力減少。藉此，可穩定地持續吸附IC器件90。In addition, at the boundary portion between the external thread 36 and the support portion 34, a sealing member (pad) 38 having an annular shape along the circumferential direction of the external thread 36 is provided. The sealing member 38 is an elastic material member, and in a state where the first member 30A and the second member 30B are assembled, the sealing member 38 is compressed between the support portion 34 and the support portion 32 to be elastically deformed. Thereby, the space between the support portion 34 and the support portion 32 is hermetically sealed. Therefore, it is possible to prevent the air from leaking between the supporting portion 34 and the supporting portion 32 when the pump 131 is activated, so that the suction force generated in the opening 312 of the suction pad 31 is reduced. Thereby, the IC device 90 can be sucked stably and continuously.

又，第2構件30B對第1構件30A之連接操作，及第1構件30A與第2構件30B之連接解除操作，較佳為於使吸附構件3自安裝部4脫離之狀態下進行。藉此，例如進行連接、脫離作業時，相比設為安裝狀態之情形，可更容易進行其作業。In addition, the connection operation of the second member 30B to the first member 30A and the connection release operation of the first member 30A and the second member 30B are preferably performed in a state where the suction member 3 is detached from the mounting portion 4. Thereby, when connecting and disconnecting, for example, the operation can be performed more easily than when it is set in the installed state.

＜第4實施形態＞以下，參照圖12，針對本發明之電子零件搬送裝置及電子零件檢查裝置之第4實施形態進行詳細說明，但以與上述實施形態之不同點為中心進行說明，相同事項省略其說明。<Fourth Embodiment> Hereinafter, referring to FIG. 12, the fourth embodiment of the electronic component conveying device and the electronic component inspection device of the present invention will be described in detail, but the description will focus on the differences from the above-mentioned embodiment. The same matters The description is omitted.

本實施形態除了吸附構件所具備之第1構件及第2構件之構成不同以外，餘與上述第3實施形態相同。This embodiment is the same as the above-mentioned third embodiment except that the configuration of the first member and the second member included in the suction member are different.

如圖12所示，在本實施形態中，於第1構件30A，於支持部34形成有內螺紋37。另一方面，於第2構件30B，於支持部32之上部，形成有與第1構件30A之連接時與內螺紋37螺合之外螺紋36。又，第2構件30B成為省略凸緣部321者。As shown in FIG. 12, in this embodiment, the internal thread 37 is formed in the support part 34 in 30 A of 1st members. On the other hand, in the second member 30B, on the upper portion of the support portion 32, an external thread 36 is formed to be screwed with the internal thread 37 when connecting with the first member 30A. In addition, the second member 30B has the flange portion 321 omitted.

藉由如此之構成，例如作為第2構件30B，可將先前之旋入式吸附構件連接於第1構件30A而使用。With such a configuration, for example, as the second member 30B, the conventional screw-in suction member can be connected to the first member 30A and used.

＜第5實施形態＞以下，參照圖13，針對本發明之電子零件搬送裝置及電子零件檢查裝置之第5實施形態進行詳細說明，但以與上述實施形態之不同點為中心進行說明，相同事項省略其說明。<Fifth Embodiment> Hereinafter, referring to FIG. 13, the fifth embodiment of the electronic component conveying device and the electronic component inspection device of the present invention will be described in detail, but the description will focus on the differences from the above-mentioned embodiment, and the same matters The description is omitted.

本實施形態除了吸附構件之吸附墊之形狀不同以外，餘與上述第1實施形態相同。This embodiment is the same as the above-mentioned first embodiment except that the shape of the suction pad of the suction member is different.

如圖13所示，本實施形態中，吸附構件3之吸附墊31具有其內徑經擴徑之擴徑部313。藉此，例如IC器件90為於其上側具有階差部901者之情形是，該IC器件90吸附於吸附構件3時，階差部901收納於擴徑部313內。藉此，IC器件90成為穩定地吸附於吸附構件3之狀態，藉此可防止於搬送途中自吸附構件3脫離。As shown in FIG. 13, in the present embodiment, the suction pad 31 of the suction member 3 has an enlarged diameter portion 313 whose inner diameter is enlarged. Accordingly, for example, when the IC device 90 has the stepped portion 901 on the upper side, the stepped portion 901 is accommodated in the enlarged diameter portion 313 when the IC device 90 is adsorbed to the suction member 3. Thereby, the IC device 90 is stably attracted to the adsorption member 3, thereby preventing it from being separated from the adsorption member 3 during transportation.

以上，基於圖示之實施形態對本發明之電子零件搬送裝置及電子零件檢查裝置加以說明，但本發明並非限定於此，構成電子零件搬送裝置及電子零件檢查裝置之各部可置換成可發揮相同功能之任意構成者。又，亦可附加其他任意之構成物。Above, the electronic component conveying device and the electronic component inspection device of the present invention have been described based on the illustrated embodiment, but the present invention is not limited to this, and the parts constituting the electronic component conveying device and the electronic component inspection device can be replaced to perform the same function Of arbitrary constituents. Moreover, other arbitrary structures may be added.

又，本發明之電子零件搬送裝置及電子零件檢查裝置亦可為組合有上述各實施形態中之任意2個以上之構成(特徵)者。In addition, the electronic component transport device and the electronic component inspection device of the present invention may also be a combination of any two or more configurations (features) of the above-mentioned embodiments.

1‧‧‧電子零件檢查裝置3‧‧‧吸附構件3A‧‧‧吸附構件3B‧‧‧吸附構件4‧‧‧安裝部10‧‧‧電子零件搬送裝置11A‧‧‧托盤搬送機構11B‧‧‧托盤搬送機構12‧‧‧溫度調整部13‧‧‧器件搬送頭14‧‧‧器件供給部14A‧‧‧器件供給部14B‧‧‧器件供給部15‧‧‧托盤搬送機構16‧‧‧檢查部17‧‧‧器件搬送頭17A‧‧‧器件搬送頭17B‧‧‧器件搬送頭18‧‧‧器件回收部18A‧‧‧器件回收部18B‧‧‧器件回收部19‧‧‧回收用托盤20‧‧‧器件搬送頭21‧‧‧托盤搬送機構22A‧‧‧托盤搬送機構22B‧‧‧托盤搬送機構25‧‧‧搬送部30A‧‧‧第1構件30B‧‧‧第2構件30B1‧‧‧第2構件30B2‧‧‧第2構件31‧‧‧吸附墊32‧‧‧支持部(吸附墊支持部)33‧‧‧管狀部34‧‧‧支持部(管狀支持部)35‧‧‧內部空間36‧‧‧外螺紋37‧‧‧內螺紋38‧‧‧密封構件(襯墊)41‧‧‧內側筒狀部42‧‧‧第2扣合部43‧‧‧操作部44‧‧‧彈推部45‧‧‧限制部46‧‧‧密封構件(襯墊)90‧‧‧IC器件131‧‧‧泵132‧‧‧基部141‧‧‧凹部142‧‧‧側壁200‧‧‧托盤231‧‧‧第1隔板232‧‧‧第2隔板233‧‧‧第3隔板234‧‧‧第4隔板235‧‧‧第5隔板241‧‧‧前蓋242‧‧‧側蓋243‧‧‧側蓋244‧‧‧後蓋245‧‧‧頂蓋300‧‧‧監視器301‧‧‧顯示畫面311‧‧‧下端面312‧‧‧開口部313‧‧‧擴徑部321‧‧‧凸緣部322‧‧‧缺口部331‧‧‧第1扣合部331a‧‧‧傾斜面332‧‧‧外周部400‧‧‧信號燈411‧‧‧內部空間412‧‧‧內周部413‧‧‧槽414‧‧‧突出部421‧‧‧球體431‧‧‧按壓部441‧‧‧螺旋彈簧442‧‧‧上端443‧‧‧下端451‧‧‧棒狀部500‧‧‧揚聲器600‧‧‧滑鼠台700‧‧‧操作面板800‧‧‧控制部901‧‧‧階差部A1‧‧‧托盤供給區域A2‧‧‧器件供給區域A3‧‧‧檢查區域A4‧‧‧器件回收區域A5‧‧‧托盤去除區域O3‧‧‧中心軸O141‧‧‧中心軸α11A‧‧‧箭頭α11B‧‧‧箭頭α13X‧‧‧箭頭α13Y‧‧‧箭頭α14‧‧‧箭頭α15‧‧‧箭頭α17Y‧‧‧箭頭α18‧‧‧箭頭α20X‧‧‧箭頭α20Y‧‧‧箭頭α21‧‧‧箭頭α22A‧‧‧箭頭α22B‧‧‧箭頭α90‧‧‧箭頭1‧‧‧Electronic component inspection device 3‧‧‧Adsorption member 3A‧‧‧Adsorption member 3B‧‧‧Adsorption member 4‧‧‧Mounting part 10‧‧‧Electronic component conveying device 11A‧‧‧Tray conveying mechanism 11B‧‧ ‧Tray transport mechanism 12‧‧‧Temperature adjustment unit 13‧‧‧Device transport head 14‧‧‧Device supply unit 14A‧‧‧Device supply unit 14B‧‧‧Device supply unit 15‧‧‧Tray transport mechanism 16‧‧‧ Inspection Department 17‧‧‧Device Transfer Head 17A‧‧‧Device Transfer Head 17B‧‧‧Device Transfer Head 18‧‧‧Device Recycling Section 18A‧‧‧Device Recycling Section 18B‧‧‧Device Recycling Section 19‧‧‧For Recycling Tray 20‧‧‧Device transport head 21‧‧‧Tray transport mechanism 22A‧‧‧Tray transport mechanism 22B‧‧‧Tray transport mechanism 25‧‧‧Transport section 30A‧‧‧First member 30B‧‧‧Second member 30B1 ‧‧‧Second member 30B2‧‧‧Second member 31‧‧‧Adsorption pad 32‧‧‧Support part (suction pad support part) 33‧‧‧Tubular part 34‧‧‧Support part (tubular support part) 35‧ ‧‧Internal space 36‧‧‧External thread 37‧‧‧Internal thread 38‧‧‧Sealing member (liner) 41‧‧‧Inner cylindrical part 42‧‧‧Second engagement part 43‧‧‧Operation part 44 ‧‧‧Pushing part 45‧‧‧Restricting part 46‧‧‧Sealing member (liner) 90‧‧‧IC device 131‧‧‧Pump 132‧‧‧Base 141‧‧‧Concave part 142‧‧‧Side wall 200‧ ‧‧Tray 231‧‧‧The first partition 232‧‧‧The second partition 233‧‧‧The third partition 234‧‧‧The fourth partition 235‧‧‧The fifth partition 241‧‧‧Front cover 242 ‧‧‧Side cover 243‧‧‧Side cover 244‧‧‧Back cover 245‧‧‧Top cover 300‧‧‧Monitor 301‧‧ Display screen 311‧‧‧Lower end surface 312‧‧‧Opening 313‧‧ ‧Expanded part 321‧‧‧Flange part 322‧‧‧Notch part 331‧‧‧First engagement part 331a‧‧‧Slanted surface 332‧‧‧Outer peripheral part 400‧‧‧Signal light 411‧‧‧Internal space 412 ‧‧‧Inner peripheral part 413‧‧‧Slot 414‧‧‧Protrusion part 421‧‧Sphere 431‧‧‧Pressing part 441‧‧Coil spring 442‧‧‧Upper end 443‧‧‧Lower end 451‧‧Bar shape Unit 500‧‧‧Speaker 600‧‧‧Mouse station 700‧‧‧Operation panel 800‧‧‧Control unit 901‧‧‧Step unit A1‧‧‧Tray supply area A2‧‧‧Device supply area A3‧‧‧ Inspection area A4‧‧‧Device recovery area A5‧‧‧Tray removal area O3‧‧‧Center axis O141 ‧‧Arrow α15‧‧‧Arrow α17Y‧‧‧Arrow α18‧‧‧Arrow α20X‧‧‧Arrow α20Y‧‧‧Arrow α21‧ ‧‧Arrow α22A‧‧‧Arrow α22B‧‧‧Arrow α90‧‧‧Arrow

圖1係自正面側觀察本發明之電子零件檢查裝置之第1實施形態之概略立體圖。 圖2係顯示圖1所示之電子零件檢查裝置之動作狀態之概略俯視圖。 圖3係顯示圖1所示之電子零件檢查裝置之器件供給區域內之器件搬送頭之分解立體圖。 圖4係依序顯示使吸附構件自圖1所示之電子零件檢查裝置之器件供給區域內之器件搬送頭之安裝部脫離之過程之垂直剖視圖。 圖5係依序顯示使吸附構件自圖1所示之電子零件檢查裝置之器件供給區域內之器件搬送頭之安裝部脫離之過程之垂直剖視圖。 圖6係依序顯示使吸附構件自圖1所示之電子零件檢查裝置之器件供給區域內之器件搬送頭之安裝部脫離之過程之垂直剖視圖。 圖7係依序顯示使吸附構件自圖1所示之電子零件檢查裝置之器件供給區域內之器件搬送頭之安裝部脫離之過程之垂直剖視圖。 圖8係依序顯示使吸附構件自圖1所示之電子零件檢查裝置之器件供給區域內之器件搬送頭之安裝部脫離之過程之垂直剖視圖。 圖9係依序顯示本發明之電子零件檢查裝置(第2實施形態)之器件供給區域內之器件搬送頭之動作狀態之前視圖。 圖10係依序顯示本發明之電子零件檢查裝置(第2實施形態)之器件供給區域內之器件搬送頭之動作狀態之前視圖。 圖11係顯示本發明之電子零件檢查裝置(第3實施形態)之器件供給區域內之器件搬送頭之吸附構件之分解垂直剖視圖。 圖12係顯示本發明之電子零件檢查裝置(第4實施形態)之器件供給區域內之器件搬送頭之吸附構件之分解垂直剖視圖。 圖13係顯示本發明之電子零件檢查裝置(第5實施形態)之器件供給區域內之器件搬送頭之吸附構件之垂直剖視圖。Fig. 1 is a schematic perspective view of the first embodiment of the electronic component inspection apparatus of the present invention viewed from the front side. FIG. 2 is a schematic plan view showing the operating state of the electronic component inspection device shown in FIG. 1. FIG. FIG. 3 is an exploded perspective view showing the device transfer head in the device supply area of the electronic component inspection apparatus shown in FIG. 1. FIG. 4 is a vertical cross-sectional view showing the process of detaching the suction member from the mounting portion of the device transfer head in the device supply area of the electronic component inspection device shown in FIG. 1 in sequence. 5 is a vertical cross-sectional view sequentially showing the process of detaching the suction member from the mounting portion of the device transfer head in the device supply area of the electronic component inspection device shown in FIG. 1. 6 is a vertical cross-sectional view showing the process of detaching the suction member from the mounting portion of the device transfer head in the device supply area of the electronic component inspection device shown in FIG. 1 in sequence. 7 is a vertical cross-sectional view showing the process of detaching the suction member from the mounting portion of the device transfer head in the device supply area of the electronic component inspection device shown in FIG. 1 in sequence. FIG. 8 is a vertical cross-sectional view showing the process of detaching the suction member from the mounting part of the device transfer head in the device supply area of the electronic component inspection device shown in FIG. 1 in sequence. Fig. 9 is a front view sequentially showing the operating state of the component transfer head in the component supply area of the electronic component inspection apparatus (second embodiment) of the present invention. FIG. 10 is a front view sequentially showing the operating state of the component transfer head in the component supply area of the electronic component inspection apparatus (second embodiment) of the present invention. 11 is an exploded vertical cross-sectional view showing the suction member of the component transfer head in the component supply area of the electronic component inspection apparatus (third embodiment) of the present invention. 12 is an exploded vertical cross-sectional view showing the suction member of the device transfer head in the device supply area of the electronic component inspection apparatus (the fourth embodiment) of the present invention. 13 is a vertical cross-sectional view showing the suction member of the component transfer head in the component supply area of the electronic component inspection apparatus (the fifth embodiment) of the present invention.

1‧‧‧電子零件檢查裝置 1‧‧‧Electronic parts inspection device

3‧‧‧吸附構件 3‧‧‧Adsorption component

3A‧‧‧吸附構件 3A‧‧‧Adsorption component

3B‧‧‧吸附構件 3B‧‧‧Adsorption component

4‧‧‧安裝部 4‧‧‧Installation Department

10‧‧‧電子零件搬送裝置 10‧‧‧Electronic parts handling device

13‧‧‧器件搬送頭 13‧‧‧Device transfer head

31‧‧‧吸附墊 31‧‧‧Adsorption pad

32‧‧‧支持部(吸附墊支持部) 32‧‧‧Support part (adsorption pad support part)

33‧‧‧管狀部 33‧‧‧Tube

34‧‧‧支持部(管狀支持部) 34‧‧‧Support Department (Tube Support Department)

41‧‧‧內側筒狀部 41‧‧‧Inner cylindrical part

43‧‧‧操作部 43‧‧‧Operation Department

45‧‧‧限制部 45‧‧‧Restriction Department

131‧‧‧泵 131‧‧‧Pump

132‧‧‧基部 132‧‧‧Base

311‧‧‧下端面 311‧‧‧lower end surface

312‧‧‧開口部 312‧‧‧Opening

321‧‧‧凸緣部 321‧‧‧Flange

322‧‧‧缺口部 322‧‧‧Notch

331‧‧‧第1扣合部 331‧‧‧The first fastening part

451‧‧‧棒狀部 451‧‧‧Bar

A2‧‧‧器件供給區域 A2‧‧‧Device supply area

Claims (13)

一種電子零件搬送裝置，其具備：搬送部，其搬送電子零件；其中上述搬送部具有：吸附構件，其吸附上述電子零件；及安裝部，其安裝上述吸附構件；於上述吸附構件設有第1扣合部；於上述安裝部設有第2扣合部，該第2扣合部係於上述安裝部內部，移位至扣合於上述第1扣合部之第1位置、及未扣合於上述第1扣合部之第2位置。 An electronic component conveying device, comprising: a conveying part that conveys electronic parts; wherein the conveying part has: an adsorption member that adsorbs the electronic part; and a mounting part that mounts the adsorption member; and the adsorption member is provided with a first Fastening part; a second fastening part is provided on the above-mentioned installation part, and the second fastening part is inside the above-mentioned installation part, shifted to the first position of the first fastening part, and not fastened At the second position of the above-mentioned first engaging part. 如請求項1之電子零件搬送裝置，其中上述吸附構件具有管狀部，其***於上述安裝部；上述第1扣合部係以設置於上述管狀部之外周部之凹部構成；上述第2扣合部係以移位至上述第1位置時扣合於上述凹部之凸部構成。 The electronic component conveying device according to claim 1, wherein the suction member has a tubular portion which is inserted into the mounting portion; the first engaging portion is constituted by a concave portion provided on the outer periphery of the tubular portion; the second engaging The part is constituted by a convex part that is engaged with the concave part when it is displaced to the first position. 如請求項2之電子零件搬送裝置，其中上述凹部係以沿著上述管狀部之外周部之周向而設之槽構成；上述凸部係以移位至上述第1位置時，沿著上述槽配置複數個，並與上述槽扣合之球體構成。 The electronic component conveying device of claim 2, wherein the concave portion is formed by a groove provided along the circumferential direction of the outer periphery of the tubular portion; when the convex portion is displaced to the first position, along the groove A plurality of spheres are arranged and buckled with the above grooves. 如請求項1之電子零件搬送裝置，其中上述安裝部具有操作部，其可 進行將上述第2扣合部限制於上述第1位置之操作。 Such as the electronic component conveying device of claim 1, wherein the mounting part has an operating part, which can Perform an operation to restrict the second engaging portion to the first position. 如請求項4之電子零件搬送裝置，其中上述安裝部具有彈推部，其對上述操作部彈推，將上述第2扣合部限制於上述第1位置。 An electronic component conveying device according to claim 4, wherein the mounting part has an elastic pushing part that pushes the operating part to restrict the second engaging part to the first position. 如請求項1之電子零件搬送裝置，其中具有對應於上述電子零件之種類而形狀及大小中之至少一者不同之複數個上述吸附構件；選擇上述複數個吸附構件中之一者，並安裝於上述安裝部。 For example, the electronic component conveying device of claim 1, which has a plurality of the above-mentioned suction members corresponding to the type of the above-mentioned electronic component but different in at least one of shape and size; select one of the above-mentioned plural suction members and install it in The above installation part. 如請求項1之電子零件搬送裝置，其中上述吸附構件具備：第1構件，其具有***於上述安裝部之管狀部；及第2構件，其具有吸附上述電子零件之吸附墊，並連接於上述第1構件。 The electronic component conveying device of claim 1, wherein the suction member includes: a first member having a tubular portion inserted into the mounting portion; and a second member having a suction pad for adsorbing the electronic component and connected to the The first member. 如請求項7之電子零件搬送裝置，其中具有對應於上述電子零件之種類而形狀及大小中之至少一者不同之複數個上述第2構件；選擇上述複數個第2構件中之一者，並連接於上述第1構件。 For example, the electronic component conveying device of claim 7, which has a plurality of the second members that are different in at least one of shape and size corresponding to the type of the electronic component; select one of the plurality of second members, and Connected to the above-mentioned first member. 如請求項7之電子零件搬送裝置，其中上述第2構件對上述第1構件之連接操作，及上述第1構件與上述第2構件之連接解除操作，係於使上述吸附構件自上述安裝部脫離之狀態下進行。 The electronic component conveying device of claim 7, wherein the connection operation of the second member to the first member, and the connection release operation of the first member and the second member are performed by removing the suction member from the mounting portion Under the state. 如請求項7之電子零件搬送裝置，其中於上述第1構件設有內螺紋，於上述第2構件，設有與上述內螺紋螺合，並連接於上述第1構件之 外螺紋。 Such as the electronic component conveying device of claim 7, wherein the first member is provided with an internal thread, and the second member is provided with a threaded connection with the internal thread and connected to the first member External thread. 如請求項1之電子零件搬送裝置，其中上述安裝部具有限制部，其限制吸附於上述吸附構件之上述電子零件繞垂直軸之旋轉。 The electronic component conveying device according to claim 1, wherein the mounting portion has a restricting portion that restricts the rotation of the electronic component adsorbed to the suction member about a vertical axis. 一種電子零件檢查裝置，其具備：搬送部，其搬送電子零件；及檢查部，其檢查上述電子零件；其中上述搬送部具有：吸附構件，其吸附上述電子零件；及安裝部，其安裝上述吸附構件；於上述吸附構件設有第1扣合部；於上述安裝部設有第2扣合部，該第2扣合部係於上述安裝部內部，移位至扣合於上述第1扣合部之第1位置、及未扣合於上述第1扣合部之第2位置。 An electronic component inspection device, comprising: a conveying part that conveys electronic parts; and an inspection part that inspects the electronic parts; wherein the conveying part has: an adsorption member that adsorbs the electronic part; and a mounting part that mounts the adsorption The first buckling part is provided on the adsorption member; the second buckling part is provided on the mounting part, and the second buckling part is attached to the inside of the mounting part and shifted to be fastened to the first buckling The first position of the part and the second position of the above-mentioned first buckling part. 一種吸附構件，其係安裝於搬送電子零件之搬送部所設置之安裝部，並吸附上述電子零件者；其中於上述吸附構件設有第1扣合部；於上述安裝部設有第2扣合部，該第2扣合部係於上述安裝部內部，移位至扣合於上述第1扣合部之第1位置、及未扣合於上述第1扣合部之第2位置；上述吸附構件具有***於上述安裝部之管狀部；上述第1扣合部係以沿著上述管狀部之外周部之周向而設之槽構成； 上述第2扣合部係以移位至上述第1位置時沿著上述槽配置複數個，並與上述槽扣合之球體構成。 A suction member which is installed in the mounting part provided in the conveying part for conveying electronic parts and sucks the above-mentioned electronic parts; wherein the suction member is provided with a first engaging part; and the mounting part is provided with a second engaging part Part, the second buckling part is inside the installation part, shifted to the first position that is buckled in the first buckling part, and the second position that is not buckled in the first buckling part; The member has a tubular part inserted into the mounting part; the first buckling part is constituted by a groove provided along the circumferential direction of the outer periphery of the tubular part; The second engaging portion is constituted by a plurality of balls arranged along the groove when displaced to the first position and engaging with the groove.

Images