TWI277756B - Electronic component test equipment - Google Patents
Electronic component test equipment Download PDFInfo
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- TWI277756B TWI277756B TW095102781A TW95102781A TWI277756B TW I277756 B TWI277756 B TW I277756B TW 095102781 A TW095102781 A TW 095102781A TW 95102781 A TW95102781 A TW 95102781A TW I277756 B TWI277756 B TW I277756B
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- electronic component
- testing device
- component testing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
1277756 九、發明說明: 【發明所屬之技術領域】 本發明係有關於用以測試半導體積體電路元件等各 種電子元件(以下亦代表性地稱為Ic元件)之電子元件測 、試裝置。[Technical Field] The present invention relates to an electronic component measuring and testing apparatus for testing various electronic components (hereinafter also referred to as Ic components) such as a semiconductor integrated circuit component.
【先前技術】 在構成電子元件測試裝置之處理器(handler),將托 盤所收容之複數1C元件搬至處理器内,並使各IC元件以 電氣式接觸測試頭後,使電子元件測試裝置本體(以下亦 稱為測試器)進行測試。然、後,測試完了時從測試頭搬出 各1C元件,藉由換裝至因應於測試結果之托盤,分類成 良品或不良品之種類。 可是,在如上述之電子元件測試裝置,雖然使用一台 處理器可測試複數H:元件,但是為了應付這種被測試^ 元件之種類更換’需要將測試頭之上部更換為因應於其種 類者。 第30圖係表示以往之測試頭的上部構造之概略剖面 圖,第圖及第32圖係各自表示在以往之測試頭的本體 侧板安裝連接器之第一及第二步驟的剖面圖。 在廷種測試頭5之上部構造上,如第3〇圖所示,已 知由:插座板700,安裝IC元件(在圖中以符號Ic表示) 以電氣式接觸的1C插座710 ;及本體側板600,和測試頭 本體(圖上未示)以電氣式連接;構成,並藉由將在本體側 2030—7709—PF 5 1277756 板600之連接器導件66〇所安裝的公側連接器㈣***設 置於插座板700之下面的母側連接器74〇,而以電氣式 接本體側板600和插座板700者。 山更=細說明之,在公側連接器62〇之外殼623所形成 之鳊子甘人入孔(圖上未示),***利用焊接或壓接等手法而 和同軸電纜線624之端部連接的同軸構造之端子621並閂 j保持。一樣地,在母側連接器74〇之外殼所形成之端子 嵌入孔亦***同軸構造的嵌合端子並閂鎖保持,藉由公側 連接器620具有之各端子621各自***母側連接器74〇具 有之肷合端子,本體側板600和插座板7〇〇以電氣式連接。 為了和IC元件之種類對應而對該種類製作專用的該 插座板700。因此,在更換IC元件之種類時,在測試頭5 只是僅將該插座板700更換為和IC元件之種類對應者, 可易於應付IC元件之種類更換。 可疋,在這種測试頭5之上部構造的本體側板6 〇 〇利 用以下所示的方法安裝於公侧連接器62〇。即,首先,如第 31圖所示,在使公側連接器62〇之外殼623轉動約9〇度之 狀態,從間隔架650及連接器導件66〇之下側,***在該 連接器導件660所形成之開口並使通過。接著,如第32圖 所示,將連接器620向上方再額外提高距離L後,如第3〇 圖所示,在其兩端利用螺栓625固定於連接器導件660。 這種組立作業,因在使引出多條同軸電纜線624之公 側連接器6 2 0轉動約9 0度之狀態使通過窄小的開口,所 以組立性極差。此外,在通過後需要對電纜線624進行矯 2030-7709-PF 6 1277756 正成原來之直線狀態的作業。隨著,有為了將全部之連接 器女裝於電路板而需要數十小時之工時的情況。 又’在將公側連接器620***母側連接器740時,過 大之力從電纜線624作用於端子621,公側連接器620之 端子621的中心軸和母側連接器74〇之嵌合端子的中心軸 大為傾斜或橫向偏移時,有引起嵌合不良或該端子本身受 才貝的情況。因而,需要在使公側連接器62〇通過窄小的開 口後預先將電纜線624壓成直線狀態。 此外,在該組立作業,有發生如以下所示之弊病的情況。 第一 ’在第31圖所示之狀態,因從公側連接器62〇 所引出的電纜線624彎曲90度以上,所以應力作用於電 纜線624,因而有端子621被拉至外殼623側、被拉入外 殼623内等之發生製造上的不良之情況。 第一,在第32圖所示之狀態,最長發生多餘距離[, 因在電缓線624之長度發生差異,很可能影響測試性能。 此外,在其他的使用形態上,在被測試電子元件係被 測試晶圓的情況,應用探針,替代IC插座71〇,並使用在 中央具有探針的探針卡,替代插座板7〇〇,和插座板7〇〇 一樣’本體側板600經由連接器620、740和該探針卡連 接。但,關於連接器62〇、740之配置,相對於複數探針 群之中央配置,亦有配置成輻射狀而供使用的情況。 【發明内容】 本發明之目的在於提供組立性及品質優異的電子元 2030-7709-PF 7 1277756 件測試裝置。 (1)為了達成該目的,若依據本發明,提供一種電子 元件测”式裝置,包括:本體侧板,和測試頭本體以電氣式 連接而且具有第一連接器;及連接板,安裝和被測試電 ^元件以電氣式連接的接觸端子,而且具有和該第一連接 器可拆裝的第二連接器;其特徵在於:該本體側板具有將 該第連接器支持成和該連接板相向的支持裝置;在該支 持裝置I成比該第一連接器大,且該第一連接器可通過之 至少包含第一部分的開口部(參照申請專利範圍第1項)。 在本毛明’在構成測試頭之上部的本體側板,包括形 成第連接器可通過之至少包含第一部分的開口部之支 持裝置。因而,在本體侧板之組立時,因不必使第一連接 為轉動,或向上方多餘地拉出電纜線等費人力的作業,所 以電子元件測試裝置之組立性提高。 又’因不必使電纜線接近9〇度地彎曲而可組立,所 以可易於保持電欖、線的直線狀態,又因各端子位於適當之 位置,所以可防止如以往之端子的傾斜或位置偏差等之不 良的發生。此外,因不必使電纜線接近9〇度地彎曲而可 使連接器通過,所以在電纜線之傳送阻抗未發生變動,又 端子或外殼未發生不良之結果,可發揮良好的測試性能。 因此’可提供品質優異的電子元件測試裝置。 又,例如,在使用中因故端子受損或降低至外殼側而 需要更換的情況,亦因組立性提高,可易於僅拆下發生問 題的連接器,在維修性亦很優異。一樣地,在丟棄電子元 2030-7709-PF 8 1277756 件測試裝W η主+ γ n 異,m 、’、易於拆下連接器,因分解作業性亦優 異所二成為顧慮到環境面之構造。 由兮“1^月,雖未特別限定,但是該開口部又包含位於 : 二灸、裝置所支持之該第一連接器的下側之第二部分 照中請專利範圍第2項)。藉由使從支持裝置所支 =:連接器引出之電规線通過開口部的第二部分,而[Prior Art] In the processor constituting the electronic component testing device, the plurality of 1C components housed in the tray are moved into the processor, and the IC components are electrically contacted with the test head, and then the electronic component testing device body is made. (hereinafter also referred to as tester) for testing. Then, after the test is completed, each 1C component is removed from the test head, and is sorted into a good or defective product by being changed to a tray corresponding to the test result. However, in the electronic component testing apparatus as described above, although a single processor can be used to test the plural H: component, in order to cope with the type of the component to be tested, it is necessary to replace the upper part of the test head with the type corresponding to the type. . Fig. 30 is a schematic cross-sectional view showing the upper structure of a conventional test head, and Fig. 32 and Fig. 32 are sectional views each showing a first step and a second step of mounting a connector on a main body side plate of a conventional test head. In the upper structure of the test head 5, as shown in FIG. 3, it is known that: the socket board 700, the IC component (indicated by the symbol Ic in the figure) is electrically connected to the 1C socket 710; and the body The side plate 600 is electrically connected to the test head body (not shown); and is configured by a male connector mounted on the connector guide 66 of the body side 2030-7709-PF 5 1277756 plate 600 (4) Inserting the female side connector 74A disposed under the socket board 700, and electrically connecting the body side panel 600 and the socket board 700. In the case of a mountain, the outer casing of the male side connector 62 is formed into a hole (not shown), and the end of the coaxial cable 624 is inserted by means of welding or crimping. The connected coaxial configuration terminal 621 is held by the latch j. Similarly, the terminal insertion hole formed in the outer casing of the female connector 74 is also inserted into the fitting terminal of the coaxial structure and latch-held, and each terminal 621 of the male connector 620 is inserted into the female connector 74. The body has a mating terminal, and the body side panel 600 and the socket board 7 are electrically connected. This socket board 700 is dedicated to this type in order to correspond to the type of IC component. Therefore, when the type of the IC component is replaced, the test head 5 only replaces the socket board 700 with the type of the IC component, and the type of the IC component can be easily replaced. Alternatively, the main body side panel 6 constructed on the upper portion of the test head 5 is attached to the male side connector 62A by the method shown below. That is, first, as shown in Fig. 31, in a state where the outer casing 623 of the male side connector 62 is rotated by about 9 degrees, the connector 650 and the lower side of the connector guide 66 are inserted into the connector. The opening formed by the guide 660 is passed through. Next, as shown in Fig. 32, after the connector 620 is further increased in the distance L upward, as shown in Fig. 3, the connector guide 660 is fixed to the connector guide 660 at both ends thereof by bolts 625. This grouping operation is extremely poor in the grouping state by causing the narrow side opening to pass through the narrow opening in a state in which the male connector 260 of the plurality of coaxial cables 624 is rotated by about 90 degrees. In addition, after the passage, it is necessary to perform the work of correcting the cable line 624 to the original straight line state of 2030-7709-PF 6 1277756. Along with the fact that it takes dozens of hours to work on all the connectors on the board. Further, when the male connector 620 is inserted into the female connector 740, an excessive force acts on the terminal 621 from the cable 624, and the center shaft of the terminal 621 of the male connector 620 and the female connector 74 are fitted. When the central axis of the terminal is greatly inclined or laterally offset, there is a case where the fitting is poor or the terminal itself is subjected to the ridge. Therefore, it is necessary to press the cable 624 into a straight line state before the male connector 62 is passed through the narrow opening. In addition, in the group work, there is a case where the disadvantages as shown below occur. In the state shown in FIG. 31, since the cable 624 drawn from the male connector 62A is bent by 90 degrees or more, stress acts on the cable 624, and thus the terminal 621 is pulled to the side of the casing 623, It is pulled into the outer casing 623 and the like, which causes a manufacturing failure. First, in the state shown in Fig. 32, the excess distance occurs for the longest [, because the length of the electric slow line 624 is different, it is likely to affect the test performance. In addition, in other forms of use, in the case where the electronic component to be tested is a test wafer, a probe is applied instead of the IC socket 71, and a probe card having a probe in the center is used instead of the socket board 7〇〇 The main body side panel 600 is connected to the probe card via the connectors 620, 740. However, the arrangement of the connectors 62A and 740 may be arranged in a radial shape for use in the center arrangement of the plurality of probe groups. SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component 2030-7709-PF 7 1277756 test device having excellent composition and quality. (1) In order to achieve the object, according to the present invention, there is provided an electronic component measuring device comprising: a body side plate electrically connected to the test head body and having a first connector; and a connecting plate, mounting and being Testing the electrical component to be electrically connected to the contact terminal, and having a second connector detachable from the first connector; wherein the body side plate has a support for the connector to face the connector plate a support device; the support device 1 is larger than the first connector, and the first connector can pass through at least the opening portion of the first portion (refer to the first item of the patent application scope). The body side plate at the upper part of the test head includes a supporting device for forming an opening portion through which the first connector can pass. Therefore, when the body side plates are assembled, the first connection is not required to be rotated, or is upwardly redundant The man-made work such as the cable is pulled out, so the assembly of the electronic component test device is improved. In addition, the cable can be assembled because it is not necessary to bend the cable close to 9 degrees. In order to easily maintain the linear state of the electric ram and the wire, and because the terminals are at appropriate positions, it is possible to prevent the occurrence of defects such as tilting or positional deviation of the conventional terminal, and it is not necessary to make the cable close to 9 degrees. Since the ground is bent and the connector can pass, the transmission impedance of the cable does not change, and the terminal or the casing does not cause a defect, and good test performance can be exhibited. Therefore, an electronic component test device excellent in quality can be provided. For example, in the case where the terminal is damaged due to damage or reduction to the outer casing side during use, the assembly property is improved, and it is easy to remove only the connector in which the problem occurs, and the maintainability is also excellent. Discarding electronic components 2030-7709-PF 8 1277756 pieces of test equipment W η main + γ n different, m, ', easy to remove the connector, because of the excellent workability of decomposition, the second is the structure of the environmental surface. 1^月, although not particularly limited, the opening portion further includes: a second part of the lower side of the first connector supported by the moxibustion and the device. . By passing the electric gauge wire drawn from the support device =: connector through the second portion of the opening
—連接n受到支持裝置支持之狀態錢線不會彎 曲’多餘之應力不會作用於電纜線。 在該發明,雖未特別限^,但是該支持裝置為了可支 夺稷數該第一連接器,具有複數由支持一個該第一連接器 之兩端的一對支柱構成之支柱群,又將該各支柱群配置成 向該連接板側突出,而且具有形成該開口部的基底部;在 S 土底邛的支柱群彼此之間形成該開口部之該第一部分 較佳(參照中請專利範圍第3項);又,在該基底部的該— 對支柱之間形成該開口 # 』风邊開口邛之該第二部分較佳(參照申請專 利範圍第4項)。 在該發明,雖未特別限定,但是該本體側板又具有按 壓裝置,從該第-連接器向下方引出並壓住通過該開口部 之該第二部分的電纜線;該按壓裝置可從上方安裝於該支 持裝置較佳(參照申請專利範圍第5項)。藉由可從上方安 裝按壓裝置,而電子元件測試裝置之組立性更提高,同時 維修性及組立性亦提高。 在該發明,雖未特別限定,但是具有:和該電纜線抵 接之抵接構件;及保持該抵接構件之基底構件;該抵接構 2030-7709—PF 9 1277756 件可從該基底構件拆裝較佳(參照申請專利範圍第6項)。 藉由可從該基底構件拆裝按壓裝置之抵接構件,而電子元 件測試裝置之組立性更提高,同時維修性及組立性亦提 1¾ 〇 在该發明,雖未特別限定,但是又具有固定裝置,防 止該按壓裝置之安裝於該基底構件的該抵接構件脫離該 基底構件;該固定裝置可從上方安裝於該按壓裝置較佳 (參照申睛專利範圍第7項)。藉由包括這種固定裝置,而 _ 可防止可拆裝之抵接構件從基底構件脫落。 在該發明,雖未特別限定,但是該本體側板又具有可 從上方安裝於該支持裝置的間隔架較佳(參照申請專利範 圍第8項)。藉由可從上方安裝間隔架,而電子元件測試 裝置之組立性更提高,同時維修性及組立性亦提高。 在該發明,雖未特別限定,但是該本體侧板包括引導 裝置,在將該連接板安裝於該本體側板時,將該連接板導 向該本體側板;該引導裝置可從上方安裝於該間隔架較佳 ·(參照申請專利範圍第9項)。藉由可從上方安裝引導裝 置,而電子元件測試裝置之組立性更提高,同時維修性及 組立性亦提高。 為了達成該目的,若依據本發明,提供一種電子元件 測试裝置,包括:本體侧板,和測試頭本體以電氣式連接, 而且具有第一連接器;及連接板,安裝和被測試電子元件 以電氣式連接的接觸端子,而且具有和該第一連接器可拆 裝的第二連接器;其特徵在於該本體側板包括:支持裝 2030-7709-PF 10 1277756 置,具有複數在其兩端支持該第一連接器的支柱群,而且 形成開口部,而該開口部含有··第一部分, 該第-連接器可插穿,·及第二部分,在***該第一電= 後使朝向橫向移動,而該電纜線在由該支柱群支持之狀態 通過;按壓裝置,在利用該支持裝置支持該第一連接; 後,塞住該開口部,而且魔住該電镜線;間隔架,收容該 支持裝置’使該支持裝置所收容支持<該第—連接器的一 部分經由開口而露出;及引導裝置,具有用以對相向之該 第二連接器將該第一連接器定位的導銷(參照申請專利範 圍第13項)。- The connection n is supported by the support device. The money line does not bend. The excess stress does not act on the cable. In the invention, although not particularly limited, the support device has a plurality of pillars composed of a pair of pillars supporting one end of the first connector in order to support the first connector, and Each of the pillar groups is disposed to protrude toward the connecting plate side, and has a base portion that forms the opening portion; and the first portion that forms the opening portion between the pillar groups of the S soil bottom is preferable (refer to the patent scope) Further, the second portion of the wind edge opening 形成 is formed between the pair of pillars of the base portion (refer to item 4 of the patent application scope). The invention is not particularly limited, but the main body side plate has a pressing device, and the cable that passes through the second portion of the opening portion is drawn downward from the first connector; the pressing device can be mounted from above Preferably, the support device is provided (refer to item 5 of the patent application scope). By mounting the pressing device from above, the electronic component testing device is improved in composition, and the maintainability and the composition are also improved. The invention is not particularly limited, but has: an abutting member that abuts against the cable; and a base member that holds the abutting member; the abutting structure 2030-7709-PF 9 1277756 can be from the base member It is better to disassemble (refer to item 6 of the patent application scope). The detachable member of the pressing device can be detached from the base member, and the electronic component testing device is improved in composition, and the maintainability and the assemblability are also improved. Although the invention is not particularly limited, it is fixed. The device prevents the abutting member attached to the base member from being detached from the base member; the fixing device can be attached to the pressing device from above (refer to item 7 of the scope of the patent application). By including such a fixing means, the detachable abutment member can be prevented from coming off the base member. Although the invention is not particularly limited, the main body side panel has a spacer which can be attached to the support device from above (see the eighth item of the patent application). By installing the spacer from above, the assembly of the electronic component test apparatus is improved, and the maintainability and the composition are also improved. In the invention, although not particularly limited, the body side panel includes guiding means for guiding the connecting panel to the main body side panel when the connecting panel is mounted to the main body side panel; the guiding device can be mounted to the spacer from above Preferably (refer to item 9 of the patent application scope). By mounting the guiding device from above, the electronic component testing device is more organized, and the maintainability and organization are also improved. In order to achieve the object, according to the present invention, there is provided an electronic component testing apparatus comprising: a body side plate electrically connected to a test head body, and having a first connector; and a connection board, mounting and tested electronic components a contact terminal electrically connected, and having a second connector detachable from the first connector; wherein the body side plate comprises: a support 2030-7709-PF 10 1277756, having a plurality at both ends thereof Supporting the pillar group of the first connector, and forming an opening portion, wherein the opening portion includes a first portion, the first connector can be inserted through, and the second portion is oriented after the first electrical input is inserted Transversely moving, and the cable is passed in a state supported by the strut group; the pressing device supports the first connection by using the supporting device; after that, the opening is plugged, and the electric mirror line is locked; the spacer, Storing the support device 'to support the support device> a portion of the first connector is exposed through the opening; and the guiding device has a second connector for facing the opposite Positioning a first guide pin connector (see Patent Application range of 13).
在該發明,雖未特別限定,但是該間隔架和該引導裝 置形成一體較佳(參照申請專利範圍第1〇項)。 一在該發明,雖未特別限定,但是該第一連接器或該第 連接器之至^ 一者,設置成在安裝該第一連接器和該第 二連接器時在既定之範圍可微小地移動較佳(參照申請專 利範圍第11項)。 在S咨月雖未特別限定,但是該本體側板又具有: 筐體,在使該第—連接器之上部露出下覆蓋該本體侧板的 整體;及連接部,以電氣式插人該第-連接器和該測試頭 本體之Η並可拆裝電路板;該連接部從該筐體露出較佳 ("、’、申咕專利範圍帛J 7項)。在本發明,在本體側板使 可拆裝電路板的連接部以電氣式位於第—連接器和測試 頭本體之間’而且使該連接部從筐體露出。因❿,在使用 者側可易於更換為了使和被測試IC元件之種類對應而調The invention is not particularly limited, but the spacer and the guiding device are integrally formed integrally (refer to the first aspect of the patent application). In the invention, although not particularly limited, the first connector or the first connector is configured to be minutely set within a predetermined range when the first connector and the second connector are mounted. The movement is better (refer to item 11 of the patent application scope). Although the S-contact month is not particularly limited, the body side panel has: a housing that covers the entirety of the main body side panel when the upper portion of the first connector is exposed; and a connecting portion that electrically inserts the first- The connector and the test head body are detachable and detachable from the circuit board; the connecting portion is preferably exposed from the housing (", ', the patent scope 帛 J 7 item). In the present invention, the connection portion of the removable circuit board is electrically placed between the first connector and the test head body on the body side panel and the connection portion is exposed from the housing. Because it is easy to replace on the user side, it is adjusted to match the type of IC component under test.
2030-7709-PF 11 1277756 整從測試頭流向第一連接器的電氣信號等之電路板。 在該發明,雖未特別限定,但是該本體側板又且2030-7709-PF 11 1277756 A circuit board that flows from the test head to the electrical signal of the first connector. In the invention, although not particularly limited, the body side panel is
連接部之該電路板的蓋構件;該蓋構件;從該: 匡體拆裝較佳(參照申請專利範圍第18項)。因而,— 使電路板和連接部易於拆裝,且一面可保護該電路板:面 立在該發明’雖未特別限定’但是該蓋構件具有保持 保持安裝於該底板之該電路板;該保持部設置成對該 盖構件在既定之範圍可微小地移動較佳(參照申請專利範 圍第19項藉由設置這種保持部,而可防止無益之應: 作用於連接部料接之電純,並可防止電路板 受損。 1 …在該發明,雖未特別限定,但是該連接板係安裝和被 測試=元件以電氣式接觸之IC#座的插座板,或安裝和 被測試晶圓以電氣式接觸之探針的探針卡較佳(參照申請 專利範圍第16項)。 一 (2)為了達成該目的,若依據本發明,提供一種電子 元=測試裝置,包括:連接板,安裝該被測試電子元件以 電乳式接觸的接觸端子,而且和測試頭本體以電氣式連 接其特徵在於:又包括支持該連接板之支持裝置;在該 ^裝置形成,比該連接板大,且該連接板可通過之至少 匕a第σ卩分的開口部(參照申請專利範圍第2〇項)。 _在本發明,在連接板和測試頭直接連接之電子元件測 式裝置包括形成連接板可通過之至少包含第一部分的開 4之支持褒置。因而,在電子元件測試裝置之組立時,a cover member of the circuit board of the connecting portion; the cover member; preferably: the body is detachably attached (refer to claim 18 of the patent application). Thus, the circuit board and the connecting portion are easily detachable, and the circuit board can be protected on one side: the invention is not limited to the invention but the cover member has the circuit board that remains mounted to the bottom plate; The portion is arranged to be slightly movable within a predetermined range of the cover member (refer to claim 19 of the patent application scope, by providing such a holding portion, it is possible to prevent the unhelpful effect: the electrical purity acting on the connection portion is connected, The board can be prevented from being damaged. 1 ... In the invention, although not particularly limited, the connecting board is mounted and tested = the socket board of the IC# seat electrically connected to the component, or the mounted and tested wafer The probe card of the probe for electrical contact is preferred (refer to claim 16 of the patent application). (2) In order to achieve the object, according to the present invention, an electronic element=test device is provided, including: a connection plate, installation The electronic component to be tested is electrically contacted by a contact terminal, and electrically connected to the test head body, characterized in that it further comprises a supporting device for supporting the connecting plate; The connecting plate is large, and the connecting plate can pass at least the opening portion of the 卩a σ 卩 (refer to the second item of the patent application scope). _ In the invention, the electronic component directly connected between the connecting plate and the test head The device includes a support member that forms an opening 4 through which the connecting plate can include at least a first portion. Thus, when the electronic component testing device is assembled,
2030-7709-PF 12 1277756 因不必使連接板轉動,或向上方多餘地拉出電纔線等費人 力的作業,所以電子元件測試裝置之組立性提高。 又,因不必使電纜線接近90度地彎曲而可組立,所 以可易於保持電纜線的直線狀態,又因各端子位於適當之 位置,所以可防止如以往之端子的傾斜或位置偏差等之不 良的發生。此外,因不必使電纜線接近9〇度地彎曲而可 使連接板通過,所以在電纜線之傳送阻抗未發生變動,又 端子或外殼未發生不良之結果,可發揮良好的測試性能。 • 因此,可提供品質優異的電子元件測試裝置。此外,因組 立性提高,所以維修性及組立性亦提高。 在該發明,雖未特別限定,但是該開口部又包含位於 由該支持裝置所支持的該連接板之下側的第二部分較佳 (參照申請專利範圍第21項)。藉由使從支持裝置所支持 之連接板引㈣電緵線通㈣口部之第二部分,而在連接 板由支持裝置支持之狀態魏線不f曲,多餘之應力不會 作用於電纜線。2030-7709-PF 12 1277756 The assembly of the electronic component tester is improved because it is not necessary to rotate the connecting plate or to pull out the power line and other laborious work. Moreover, since it is not necessary to bend the cable line by approximately 90 degrees, it can be easily assembled, so that the straight line state of the cable can be easily maintained, and since each terminal is located at an appropriate position, it is possible to prevent the inclination of the terminal or the positional deviation such as the conventional terminal. happened. Further, since the connecting plate can be passed without bending the cable close to 9 degrees, the transmission impedance of the cable does not fluctuate, and the terminal or the casing is not defective, and good test performance can be exhibited. • Therefore, an electronic component test device with excellent quality can be provided. In addition, due to improved organization, maintainability and organization have also improved. In the invention, although not particularly limited, the opening portion further includes a second portion located on the lower side of the connecting plate supported by the supporting device (refer to claim 21 of the patent application). By causing the connecting plate supported by the supporting device to lead the fourth portion of the (4) electric wire to the fourth port, and the state in which the connecting plate is supported by the supporting device is not curved, the excess stress does not act on the cable. .
在該發明,雖未特別限定,但是該支持裝置為了可支 ㈣數該連接板,具有複數由支持—㈣連接板之兩端的 一對支柱構成之支柱群’又將該各支柱群配置成向該連接 =出’而且具有形成該開口部的基底部;在該基底部 申=群:皮此之間形成該開口部之該第-部分較佳(參照 ^專利_第22項)°又,在該基底部的該-對支柱之 該開口部之該第二部分較佳(參照申請專利範圍第 2030-7709-PF 13 1277756 "在心^ _未特別限冑,但是該本體側板又具有可 從上方安裝於該支持裝置的間隔架較佳(參照申請專利範 圍第24項)。藉由可從上方安裝間隔架,而電子元件測試 裝置之組立性更提高,同時維修性及組立性亦提高。 在違發明,^未特別限定,γ旦是該連接板係安裝和被 貝J 4 IC元件以電氣式接觸之丨c插座的插座板,或安裝和 被測試晶圓以電氣式接觸之探㈣探針卡較佳(參照申請 專利範圍第25項)。 【實施方式】 以下依照圖面說明本發明之實施形態。 第1圖係表示本發明之實施形態的電子元件測試裝置 之整體立體圖,第2岡係沿著第1圖之n — π線的剖面圖, 第3圖係表示1C元件之處理方法的托盤之流程圖。首先, 參照第1圖及第2圖概略說明本實施形態之電子元件測試 裝置。此外’第3圖係用以理解在本實施形態之電子元件 鲁測試裝置的1C元件之處理方法的圖,亦有在平面上表示 實際上在上下方向排列配置的構件之部分。 本實施形態之電子元件測試裝置如該圖所示,由:用 以處理1C元件元件之處理器1 ;和iC元件以電氣式連觸 的測試頭5 ;及測試器9,向該測試頭5傳送測試信號, 並執行IC元件之測試;構成。 其中之處理器1由:室部1〇〇 ; 1C儲存部2〇〇,儲存 今後測試之電子元件,又將測試完之IC元件分類並儲存; 2030-7709-PF 14 1277756 裝 部 元件邊刀類至IC儲存部邊搬搬出;構成 載部將測試前之1C元件從1C儲存部送入室 1〇〇;及卸載部4〇〇,將在室部100測試之測試完的ic 該處理器1係在對IC元件施加高溫或低溫之溫度應 力的狀態測試(檢查)該1C元件是否適當地動作後,因應 於該測試結果们C元件分類之裝置,這種在施加溫度應 4 ㈣㈣試係# 1(:元件從裝載複數成為測試對Although the invention is not particularly limited, the support device has a plurality of pillars which are formed by a pair of pillars supporting both ends of the (four) connecting plate in order to support the number of the connecting plates, and the pillar groups are arranged to The connection = 'and has a base portion forming the opening portion; and the first portion forming the opening portion between the base portion and the skin portion is preferably (refer to ^ patent - item 22) The second portion of the opening portion of the pair of struts of the base portion is preferably (refer to the patent application No. 2030-7709-PF 13 1277756 " in the heart _ _ not particularly limited, but the body side panel has The spacer mounted on the support device from above is preferably (refer to claim 24). By installing the spacer from above, the assembly of the electronic component test device is improved, and the maintainability and the composition are improved. In the case of a violation of the invention, ^ is not particularly limited, and γ den is a socket board in which the connection board is mounted and electrically connected by a J 4 IC component, or an electrical contact between the mounted and tested wafers. (4) The probe card is better (see [Embodiment] The embodiment of the present invention will be described below with reference to the drawings. Fig. 1 is a perspective view showing an entire electronic component testing device according to an embodiment of the present invention. 1 is a cross-sectional view of a π line, and Fig. 3 is a flow chart showing a tray for processing a 1C element. First, an electronic component testing apparatus according to the present embodiment will be schematically described with reference to Figs. 1 and 2 . Fig. 3 is a view for explaining a method of processing a 1C element of the electronic component test apparatus of the present embodiment, and a part of a member which is actually arranged in the vertical direction on a plane. The electronic component of the embodiment The test device is as shown in the figure, consisting of: a processor 1 for processing 1C component components; a test head 5 electrically connected to the iC component; and a tester 9, transmitting test signals to the test head 5, and executing The test of the IC component; the composition of the processor 1 consists of: the chamber 1〇〇; the 1C storage unit 2〇〇, stores the electronic components tested in the future, and classifies and stores the tested IC components; 2030-770 9-PF 14 1277756 The component parts are moved to the IC storage section; the carrier part is sent from the 1C storage unit to the chamber 1〇〇; and the unloading unit 4〇〇 is placed in the room. 100 tested test ic The processor 1 is a device that tests the temperature of the high or low temperature stress on the IC component (checks) whether the 1C component is properly operated, and the device is classified according to the test result. This application temperature should be 4 (four) (four) test system # 1 (: components from the load complex into a test pair
象之1C元件的托盤(以下亦稱為訂製托盤)換裝至在該處 理态1内搬運之測試用托盤TST後實施。 該測試用托盤TST如筮q同& - 扣迻Ιύΐ如第3圖所不,用裝載部3〇〇裝入 1C元件後被送入室部1GG,以裝載於該測試用托盤TST之 狀態在室冑m藉由將各κ元件壓在測試頭5並使以電 氣式接觸(嚴格上將化元件之輸出入端子遷找插座71〇 之接觸腳而使以電氣式接觸)’而完成測試。測試完了之 IC元件被搬至卸載部4〇〇德,尤知# a ,秋丨俊在卸載部4〇〇因應於測試結 果,換裝至訂製托盤。 室部10":恒溫槽10卜對在測試用托盤TST所裝 入之ic元件施加目標之高溫或低溫之溫度應力;測試室 1〇2,使賴頭5接觸用該恒溫槽m施加熱應力之狀態 的1C元件;及除熱槽103,從在測試室1〇2所測試之Ic 元件除去所施加的熱應力;構成。 將恒溫槽101配置成比測試室1〇2向上方突出。而 且,如第3圖之不意圖所示,在該恒溫槽1〇1之内部嗖置 垂直搬運裝置’至測試室102變成空為止之期間二測 2030-7709-PF 15 1277756 試用托盤TST在由該垂直搬運裝置支撐下等待。主要在該 等待中對1C元件施加高溫或低溫之溫度應力。 在測試室1 0 2,在其中央配置測試頭5,將測試用托 盤TST搬到測試頭5之上,藉著使測試頭5之插座71 〇的 接觸腳以電氣式接觸IC元件之輸出入端子,而測試仄元 件。此外,關於測試頭5,將在後面詳述。 除熱槽1 0 3亦和恒溫槽1 〇 1 一樣,配置成比測試室1 〇 2 向上方突出’如第3圖之示意圖所示設置垂直搬運裝置。 而’在該除熱槽103,在用恒溫槽101施加高溫的情況, 利用送風將ic元件冷卻而回到室溫,又,在用恒溫槽1〇1 靶加低溫的情況,用暖風或加熱器等將丨c元件加熱而回 到不會發生結露之溫度為止後,將該已除熱之Ic元件搬 至卸載部400。 在恒溫槽101之上部,形成用以從裝置基板1〇5搬入 測試用托盤TST的入口側開口部。又,在除熱槽i〇3之上 部,形成用以將測試用托盤TST搬至裝置基板1〇5的出口 側開口部。而且,在裝置基板i〇5,設置用以使測試用托 盤TST經由這些開口部出入的測試用托盤搬運裝置i 。 該測試用托盤搬運裝置108例如由轉動滚輪等構成。利用 該測試用托盤搬運裝置108,將從除熱槽103所搬出之測 試用托盤TST,經由卸載部400及襄載部3〇〇向恒溫槽1〇1 送回。 在1C儲存部200設置儲存測試前之IC元件的測試前 1C儲存器201 ·,儲存因應於測試結果所分類之κ元件的 2030-7709-PF 16 1277756 測試完1C儲存器202 ;及托盤移送臂205,在測試前IC 儲存器201和測試完1C儲存器202之排列方向的整個範 圍可移動。 測試前1C儲存器201及測試完1C儲存器202在構造 上包括:框形之托盤支撐框2〇3 ;及升降機2〇4,使從該 托盤支撐框203之下部進入後可向上部升降。在托盤支撐 框203,堆積並支持圖外之訂製托盤,該堆積之訂製托盤 利用升降機204可上下地移動。 而,在測试刖I c儲存器2 01,堆積並保持儲存今後測 «式之I c元件的叮製托盤。另一方面,在測試完丨c儲存器 2 0 2堆積並保持將測試完之I c元件適當地分類之訂製托 盤。 上述之訂製托盤利用昇降工作台(未圖示)被搬至裝 载。卩3 0 0,使經由在裝置基板丨〇 5所開設之窗部3⑽面臨The tray of the 1C component (hereinafter also referred to as a custom pallet) is replaced by the test tray TST conveyed in the physical state 1. The test tray TST is loaded with the 1C component by the loading unit 3, and is loaded into the chamber portion 1GG to be loaded on the test tray TST, as shown in Fig. 3. The test is completed in the chamber by pressing each of the κ elements against the test head 5 and electrically contacting them (strictly placing the output of the element into the terminal to the contact of the socket 71 to make electrical contact). . After the test, the IC component was moved to the unloading section 4, and the # a, Qiu Junjun was replaced in the unloading section 4 to the custom pallet in response to the test results. The chamber portion 10": the thermostatic chamber 10 applies a target high temperature or low temperature stress to the ic element loaded in the test tray TST; the test chamber 1〇2 causes the vertical head 5 to contact with the thermostatic bath m to apply thermal stress The 1C element in the state and the heat removal groove 103 are configured to remove the applied thermal stress from the Ic element tested in the test chamber 1〇2. The constant temperature bath 101 is disposed to protrude upward from the test chamber 1〇2. Further, as shown in FIG. 3, the test tray TST is in the period of the inside of the constant temperature tank 1〇1, when the vertical conveyance device is installed until the test chamber 102 becomes empty, and the second test 2030-7709-PF 15 1277756 The vertical handling device is waiting under the support. Mainly during this waiting, a high temperature or low temperature stress is applied to the 1C element. In the test chamber 102, the test head 5 is disposed at the center thereof, and the test tray TST is moved onto the test head 5, and the contact of the socket of the test head 5 is electrically connected to the input and output of the IC component. Terminal, and test the 仄 component. Further, regarding the test head 5, it will be described in detail later. The heat removal tank 103 is also arranged to protrude upward from the test chamber 1 〇 2 as with the constant temperature bath 1 〇 1 '. The vertical conveyance device is provided as shown in the schematic view of Fig. 3. On the other hand, in the heat removal tank 103, when the high temperature is applied by the constant temperature bath 101, the ic element is cooled by the air supply to return to the room temperature, and in the case where the target temperature is lowered by the constant temperature bath 1〇1, warm air or After the heater or the like heats the 丨c element and returns to the temperature at which dew condensation does not occur, the heat-removed Ic element is transferred to the unloading unit 400. An inlet-side opening for carrying the test tray TST from the device substrate 1A is formed in the upper portion of the constant temperature bath 101. Further, an outlet-side opening for transporting the test tray TST to the device substrate 1〇5 is formed in the upper portion of the heat removal tank i〇3. Further, on the device substrate i5, a test tray transporting device i for allowing the test tray TST to enter and exit through the openings is provided. The test tray transport device 108 is constituted by, for example, a rotating roller or the like. The test tray transporting device 108 transports the test tray TST carried out from the heat removing tank 103 to the constant temperature bath 1〇1 via the unloading unit 400 and the load carrying unit 3〇〇. The 1C storage unit 200 is provided with a pre-test 1C storage 201 for storing the IC components before the test, and 2030-7709-PF 16 1277756 for storing the κ components classified according to the test results. The 1C storage 202 is tested; and the tray transfer arm 205. The entire range of the arrangement direction of the IC storage 201 and the tested 1C storage 202 before the test can be moved. The pre-test 1C reservoir 201 and the tested 1C reservoir 202 are constructed to include a frame-shaped tray support frame 2〇3 and an elevator 2〇4 so as to be lifted up and down from the lower portion of the tray support frame 203. In the tray support frame 203, the custom tray outside the drawing is stacked and supported, and the stacked custom tray can be moved up and down by the elevator 204. However, in the test 刖I c storage 2 01, the tamping tray for storing the I-c elements of the future type is stacked and kept. On the other hand, after the test, the 丨c reservoir 202 is stacked and the custom tray for properly classifying the tested Ic components is maintained. The above-mentioned custom tray is moved to the loading by a lifting table (not shown).卩300, facing through the window portion 3(10) opened on the device substrate 丨〇5
上面。然後,將該訂製托盤所裝入之IC元件換裝至停在 裝載部300之測試用托盤TST。 在將1C元件從訂製托盤換裝至測試用托盤丁灯之Ic 移動裝置上,如圖1所示,使用χ_γ搬運裝置3〇4,包括: 架設於基板105之上部的2條軌道3〇1;可動臂3〇2,利 用該2條軌道3〇lT在測試用托盤m和訂製托盤之間往 设(設此方向為γ方向);及可動頭3〇3,利用該可動臂 支持,並可沿著可動臂3〇2在x方向移動。Above. Then, the IC component loaded in the order tray is replaced with the test tray TST stopped at the loading unit 300. In the Ic moving device for replacing the 1C component from the customized tray to the test tray, as shown in FIG. 1, the χ_γ handling device 3〇4 is used, including: two tracks 3 erected on the upper portion of the substrate 105. 1; a movable arm 3〇2, which is disposed between the test tray m and the custom tray by using the two rails 3〇lT (the direction is γ direction); and the movable head 3〇3, which is supported by the movable arm And can move in the x direction along the movable arm 3〇2.
在該X-Y搬運裝置304之可動頭3()3,將吸附頭裝成 朝下’利用該吸附頭自訂製托盤吸附IC元件,並將該1CIn the movable head 3 () 3 of the X-Y conveying device 304, the adsorption head is mounted downwardly. The IC is adsorbed by the customizing tray of the adsorption head, and the 1C is attached.
2030-7709-PF 1277756 元件換裝至測試用托盤tst。這種吸附頭,對於可動頭3〇3 例如安裝約8# ’可同時將8個le元件換裝至測 盤 TST。 此外,在本實施形態,在訂製托盤和測試用托盤 之間設置位置修正器305。該位置修正器3〇5未特別圖 示,具有比較深之凹部,作成由傾斜面包圍該凹部之周緣 的形狀。因此,藉由在將從訂製托盤換裝至測試用托盤tst 之ic元件放置於測試用托盤TST之前一度落入該位置修 正器305,而正確地決定8個Ic元件之相互位置可將該 IC元件咼精度地換裝至測試用托盤tst。 將訂製托盤所裝入之全部的IC元件換裝於測試用托 盤TST後,昇降工作台使該空的訂製托盤下降,並將該空 托盤交給托盤移送臂2 0 5。 在卸載部400,亦設置構造和設置於裝載部3〇〇之X一γ 搬運裝置304 —樣的X —γ搬運裝置4〇4,由執道4〇1、可 動臂402及可動頭403構成,利用該該χ — γ搬運裝置4〇4, 將測试元之IC元件從被搬到卸載部4〇 〇之測試托盤TST 換裝至a丁製托盤。利用昇降工作台將該訂製托盤搬至卸載 部400 ’使經由在裝置基板1〇5所開設之窗部4〇6面臨上 面0 換裝測試完之1C元件而訂製托盤變滿時,昇降工作 台使該滿的訂製托盤下降,並將該滿的訂製托盤交給托盤 移送臂205。 順便地’在本實施形態,雖然在裝置基板1 〇5僅形成 2030-7709-PF 18 1277756 4個自部406,但是藉由將分類為發生頻次少之種類的a 疋件暫時儲存於在裝置基板1G5所設置之暫存部邮,而 可分類成最多8種種類。 其次,說明測試頭q。筮/ m b第4圖係表示第2圖之測試頭 的上部構造之立體圖’ “圖係第4圖之v部的放大平面 圖’第6圖係沿著第5圖之線的剖面圖,第7圖係 沿著第5圖之VH -νπ線的剖面圖。2030-7709-PF 1277756 The components are replaced to the test tray tst. Such a squeezing head can be loaded to the test tray TST at the same time for the movable head 3〇3, for example, by mounting about 8#'. Further, in the present embodiment, the position corrector 305 is provided between the order tray and the test tray. The position corrector 3〇5 is not particularly illustrated, and has a relatively deep recessed portion, and is formed in a shape in which the inclined surface surrounds the periphery of the recessed portion. Therefore, by directly placing the ic element that has been replaced from the customized tray to the test tray tst before the test tray TST, the position corrector 305 is once dropped, and the mutual position of the eight Ic elements can be correctly determined. The IC component is accurately mounted to the test tray tst. After all the IC components loaded in the custom tray are replaced with the test tray TST, the lifting table lowers the empty custom tray and delivers the empty tray to the tray transfer arm 205. The unloading unit 400 is also provided with an X-γ conveying device 4〇4 having a structure similar to that of the X-γ conveying device 304 provided in the loading unit 3, and is constituted by the trajectory 4〇1, the movable arm 402, and the movable head 403. By using the χ-γ carrier device 4〇4, the IC element of the test unit is replaced from the test tray TST moved to the unloading unit 4 to the a-made tray. The customized tray is transported to the unloading unit 400' by the elevating table. When the customized tray is replaced by the window portion 4〇6 opened on the device substrate 1〇5, the 1C component is replaced by the top 0. The table lowers the full custom tray and hands the full custom tray to the tray transfer arm 205. By the way, in the present embodiment, only the self-parts 406 of 2030-7709-PF 18 1277756 are formed on the device substrate 1 〇 5, but the a-pieces classified as having a less frequent occurrence are temporarily stored in the device. The temporary storage unit provided on the substrate 1G5 can be classified into a maximum of eight types. Next, the test head q will be explained.筮 / mb Fig. 4 is a perspective view showing the upper structure of the test head of Fig. 2''. Fig. 6 is a cross-sectional view taken along line 5 of the figure, Fig. 7 The figure is a cross-sectional view taken along line VH-νπ of Fig. 5.
測試頭5包括:測試頭本體500,經由電緵線10(參 照第2圖)和測試11 9以電氣式連接;本體侧板600,;和 該測試頭本體500以電氣式連接;及插座板7〇〇,在上面 安裝1C插座710,插座板7〇〇經由連接器62〇、74〇和本 體側板600連接成可拆裝。 在插座板700之上面,如第6圖所示,設置·· Ic插座 71 〇,具有係測試對象之IC元件(在第6圖中以符號丨c表 示)的各輸出入端子以電氣式接觸之接觸腳;及插座導件 720,位於該1C插座710之周圍並引導推壓ic元件之推 桿(圖上未示)。各1C插座710和被測試1C元件之種類對 應,將既定量之1C插座710設置於插座板700的上面。 另一方面,不僅測試頭本體5 0 0,而且本體側板6 0 0亦基 本上未受到IC元件之種類限定,而可由共用於複數。因 此,在更換被測試IC元件之種類時,藉由在測試頭5僅 更換插座板700,而用一台測試頭5可易於應付複數1C 元件。 在插座板700之下面,如第6圖所示,設置:導孔730, 2030-7709-PF 19 1277756 可***在本體側板600之連接器導件660所形成的導鎖 6 62 ;及母側連接器740,可和在本體側板6〇〇所設置之公 側連接器620連接。在更換被測試ic元件之種類時利用 連接器620、740將插座板700和本體側板600以電氣式 連接的情況,藉由導銷662受到導孔730導引,而在既定 之範圍内可游動之公側連接器620邊微小地移動邊被導向 母側連接器740而定位。結果,因多支端子621和對應之 母側連接器740的銷之嵌合軸一致,所以公側連接器62〇 _ 之端子621和母侧連接器740之端子適當地嵌合。因此, 組立變動或溫度變化所伴隨之熱膨漲存在,複數(例如48 個)公側連接器620亦可和母側連接器74〇安定地一起連 接。 本體側板600如第5圖〜第7圖所示,包括:公側連 接器620’和在插座板700之下面所設置之母側連接器 可拆裝;連接器基底610,以和插座板7〇〇相向之姿勢支 持該公侧連接器620 ;按壓構件63〇,按壓從公側連接器 _ 620所引出的電纜線624 ;蓋構件640,防止該按壓構件 630之蓋構件640,防止該按壓構件63〇之抵接構件632 的脫落;間隔架650;連接器導件66〇,在將插座板7〇〇 安裝於本體側板600時,將插座板7〇〇導向本體侧板6〇〇; 及筐體670,在使各公側連接器62〇之上部露出下覆蓋本 體側板600之整體。此外,在如第5圖〜第8圖未圖示筐 體,又在第5圖未圖示間隔架65〇及連接器導件66〇。又, 在第8圖省略公側連接器62〇之詳細的内部構造之圖示。 2030-7709-PF 20 1277756 在本實施形態,連接器基底610相當於在本發明之支 持裳置’按壓構件630相當於在本發明之按壓裝置,蓋構 件640相當於在本發明之固定裝置,連接器導件66〇相當 於在本發明之引導裝置。此外,在本實施形態,如第6圖 所不,本體側板600亦利用連接器對測試頭本體5〇〇可拆 裝。 第9圖係表示在第4圖之本體側板使用的連接器基底 之整體的立體圖,第10圖係第9圖之X部的放大平面圖, 第11圖係沿著第1 〇圖之X I — X I線的剖面圖,第J 2圖 係沿著第10圖之X Π~Χ Π線的剖面圖,第13圖係表示 在第4圖之本體侧板使用的公侧連接器之立體圖,第14 圖係表示將連接器***連接器基底之開口部的第一步驟 之剖面圖,第丨5圖係表示使***連接器基底之開口的連 接器朝向橫向移動之第二步驟的剖面圖。 連接器基底610如第9圖〜第12圖所示,具有複數由 支持一個公侧連接器620之兩端的一對支柱6Ua、6Ub 構成的支柱群611,能以和插座板7 〇 〇相向之姿勢支持複 數公側連接器620。在各支柱6Ua、611b之上面,形成用 以利用螺栓6 2 5固定公側連接器6 2 0之兩端的固定部6 2 6 之螺栓固定孔611c。又,連接器基底610具有基底部612, 將支柱群611配置成向插座板700側突出部。在本實施形 態’為了可配置48個連接器,如第9圖所示,按照4列 12行之排列將48組支柱群611配置於基底部612上。 在该基底部612’形成含有第一部分613a和第二部分 2030-7709-PF 21 1277756The test head 5 includes: a test head body 500 electrically connected via an electric wire 10 (refer to FIG. 2) and a test 11 9; a body side plate 600; and the test head body 500 are electrically connected; and a socket board 7A, the 1C socket 710 is mounted thereon, and the socket board 7 is detachably connected via the connectors 62A, 74A and the body side panel 600. On the upper surface of the socket board 700, as shown in Fig. 6, the Ic socket 71 is provided, and each of the input and output terminals of the IC component (indicated by symbol 丨c in Fig. 6) having the test object is electrically contacted. The contact pin; and the socket guide 720 are located around the 1C socket 710 and guide a push rod (not shown) that pushes the ic element. Each of the 1C sockets 710 corresponds to the type of the tested 1C component, and a predetermined amount of the 1C socket 710 is placed on the upper surface of the socket board 700. On the other hand, not only the test head body 500, but also the body side plate 600 is not substantially limited by the type of the IC component, but may be commonly used for the plural. Therefore, when the type of the IC component to be tested is replaced, by replacing only the socket board 700 in the test head 5, it is easy to cope with the plural 1C element by using one test head 5. Below the socket board 700, as shown in Fig. 6, a guide hole 730, 2030-7709-PF 19 1277756 can be inserted into the guide guide 6 62 formed by the connector guide 660 of the body side panel 600; The connector 740 is connectable to the male side connector 620 provided on the body side panel 6A. When the socket board 700 and the body side panel 600 are electrically connected by the connectors 620 and 740 when the type of the tested IC component is replaced, the guide pin 662 is guided by the guide hole 730, and can be navigated within a predetermined range. The movable male side connector 620 is positioned while being slightly moved while being guided to the female side connector 740. As a result, since the fitting shafts of the pins of the plurality of terminals 621 and the corresponding female connector 740 match, the terminals of the male connector 62〇_ and the terminals of the female connector 740 are appropriately fitted. Therefore, there is a thermal expansion accompanying the variation or temperature change, and a plurality (e.g., 48) of the male connector 620 can also be stably connected together with the female connector 74. As shown in FIGS. 5 to 7 , the body side panel 600 includes: a male side connector 620 ′ and a female side connector disposed under the socket board 700 detachable; a connector base 610, and a socket board 7 The male connector 620 is supported by the opposite side; the pressing member 63 is pressed to press the cable 624 drawn from the male connector 620; the cover member 640 prevents the cover member 640 of the pressing member 630 from being pressed. The member 63 is detached from the abutting member 632; the spacer 650; the connector guide 66 〇, when the socket plate 7 is mounted on the body side plate 600, the socket plate 7 〇〇 is guided to the body side plate 6 〇〇; The housing 670 covers the entire body side panel 600 with the upper portion of each of the male connector 62s exposed. Further, the casing is not shown in Figs. 5 to 8 and the spacer 65 and the connector guide 66 are not shown in Fig. 5. Further, the detailed internal structure of the male connector 62A is omitted in FIG. 2030-7709-PF 20 1277756 In the present embodiment, the connector base 610 corresponds to the supporting device of the present invention. The pressing member 630 corresponds to the pressing device of the present invention, and the cover member 640 corresponds to the fixing device of the present invention. The connector guide 66 is equivalent to the guiding device of the present invention. Further, in the present embodiment, as shown in Fig. 6, the main body side plate 600 is also detachably attached to the test head main body 5 by a connector. Fig. 9 is a perspective view showing the entirety of a connector base used in the main body side plate of Fig. 4, and Fig. 10 is an enlarged plan view showing a portion X of Fig. 9, and Fig. 11 is a XI-XI along the first drawing. A cross-sectional view of the line, a cross-sectional view taken along line X Π Χ Χ 第 of Fig. 10, and a third view showing a male side connector used in the side plate of the main body of Fig. 4, the 14th The figure shows a cross-sectional view of a first step of inserting the connector into the opening of the connector base, and Fig. 5 is a cross-sectional view showing a second step of moving the connector inserted into the opening of the connector base toward the lateral direction. As shown in FIGS. 9 to 12, the connector base 610 has a plurality of pillars 611 composed of a pair of pillars 6Ua and 6Ub supporting both ends of one male connector 620, and can be opposed to the socket board 7 The posture supports a plurality of male side connectors 620. On the upper surfaces of the respective pillars 6Ua and 611b, bolt fixing holes 611c for fixing the fixing portions 6 2 6 at both ends of the male side connector 620 are fixed by bolts 6 25 . Further, the connector base 610 has a base portion 612, and the strut group 611 is disposed to protrude toward the socket board 700 side. In the present embodiment, in order to arrange 48 connectors, as shown in Fig. 9, 48 sets of strut groups 611 are arranged on the base portion 612 in an arrangement of four rows and twelve rows. Forming the first portion 613a and the second portion 2030-7709-PF 21 1277756 at the base portion 612'
之間形 L2(後述參照第13 之長度 转一部分613a。將該第一部分613a之 圖)形成為比公側連接器620之長度 圖)長(L!> L2),且將該第一部分613a 之寬度W〆參照第1〇圖)形成為比公侧連接器62〇之寬度 W2(後述參照第13圖)長^> ^)。因而,可使公側連接2 620不會轉動地固定於連接器基底61〇。 在基底部612之一對支柱611a、611b之間形成開口 籲部613的第二部分613b,並位於一對支柱611a、6Ub所 支持的公側連接器620之下側。 此外’在本實施形態,為了在***公側連接器6 2 〇時 用位於兩側之2組支柱群611共用一個開口部61 3之第一 部分613a,僅在支柱群611之一側形成第一部分613a, 而在另一侧未形成第一部分613a,其他的支柱群611相 鄰。該相鄰的支柱群611之間,其一方之支柱6lla之間 形成一體’又另一方之支柱611b之間亦形成一體。 _ 公侧連接器6 2 0如第13圖所示,包括:外殼6 2 3,在 兩端之固定部626形成利用螺栓625安裝於連接器基底 610之支柱611a、611b所需之螺栓貫穿孔623a;多支端 子621,從該外殼之上面向上方突出;導銷622,一樣地 從該外殼之上面向上方突出;及多條電纔線624,從該外 殼之下面向下方引出。 這種構造的公側連接器6 2 0如以下所示安裝於上述之 連接器基底610。即,首先,如第14圖所示,將公側連接 2030-7709-PF 22 1277756 器6 2 0從下側***在連接器基底61 0所形成之開口部613 的第一部分613a。 此時,因該第一部分613a以比公側連接器620大的 開口形成,所以電纜線624可依然是直線狀態。因此,不 必使公側連接器620轉動,或向上方多餘地拉出電纜線 624等費人力的作業,而可使公側連接器620易於通過連 接為基底610之開口部613。因此’本體側板β〇〇之組立 性大為提高。此外,電纜線624之長度變成更短的結果, _ 可減少多餘之電纟覽線的配線空間,且可在測試頭本體5 0 0 和1C元件之間收發更高速的電氣信號。 又,因不必使公側連接器6 2 0轉動而可使該公側連接 器620通過連接器基底610之開口部613,所以不會賦與 電繞線不要之應力,或在電纜線624之長度難發生差異。 此外,例如,在使用中因故端子621受損或降至外殼 623側而需要更換的情況,亦因組立性提高,而可易於僅 拆下有問題的公側連接器62〇,在維修性或丟棄時之分解 _作業性亦很優異。 將公側連接器620之外殼623的下面拉至比連接器基 底610之支柱glib南後,如第15圖所示,使公側連接器 620朝向橫向移動,而使從受到連接器基底61 〇支持之狀 態的公側連接器620所引出之電纜線624位於開口部613 之第二部分613b。然後,將螺栓625(參照第6圖)***公 側連接器620之各螺栓貫穿孔623a和在連接器基底61〇 之支柱611a、611b所形成的各螺栓固定孔611c,並利用 2030-7709-PF 23 1277756 該螺检625將公側連接器620可游動地固定於連接器基底 610。因此,將公側連接器62〇之螺栓貫穿孔形成為比螺 栓625之直徑大,安裝於連接器基底61〇之狀態的公側連 接為620可朝向含有第6圖中之箭號A方向的本體側板 600之平面方向微小地移動。因而,在將插座板7〇〇安裝 於本體側板600時,因邊仿傚母側連接器74〇邊***複數 公侧連接器620,所以作業性優異。此外,依據所要,亦 可作成使公側連接器62〇不僅朝向本體側板6〇〇之平面方 _向’而且可沿著插座板7 〇 〇侧微小地移動。 如此’藉由使從公側連接器620所引出之電纜線624 位於開口部613之第二部分613b,而可在公側連接器62〇 受到連接器基底610支持之狀態防止電纜線624彎曲,並 防止多餘的應力作用於電纜線624。 第16圖係表示在本實施形態安裝連接器之連接器基 底和按壓構件的立體圖,第17圖係表示在本實施形態的 按壓構件之分解立體圖,第18圖係表示在安裝連接器之 •連接器基底安裝按壓構件的基底構件之第三步驟的剖面 圖,第1 9圖係表示將抵接構件***在連接器基底所安裝 之按壓構件的基底構件之第四步驟的剖面圖。 按壓構件630係塞住成為開口之第一部分613a的構 件’如第16圖及第17圖所示,包括··抵接構件632,和 攸受到連接器基底61 0支持之狀態的公側連接器6 2 〇所引 出的電纟覽線624抵接,及支持該抵接構件632的基底構件 631 〇 2030-7709-PF 24 1277756 抵接構件6 3 2如第17圖所示,具有和公側連接器6 2 〇 之電纜線624抵接的圓筒部633 ;及軸634,構成該圓筒 部633的軸。圓筒部633例如由海綿等柔軟的材料構成, 使和電纜線624抵接時可變形。 基底構件6 31如第17圖所示,係在側面形成複數凹 部631a之角柱形的構件,凹部631a彼此之間的間距實質 上和在連接器基底610所形成之開口部613的第二部分 61 3b彼此之間的間距相等。又,在各凹部63丨a之相向的 _壁面各自形成槽部631b。 各凹部631a之長度方向的長度比抵接構件632之轴 向的長度長’可在各凹部631a内各自***抵接構件632 之圓筒部633。此時,從圓筒部633之兩端所引出的軸634 進入凹部631a之槽部631b,並被其底面保持成自由轉動。 在女裝公侧連接器620之連接器基底610如以下所示 安裝這種構造之按壓構件63〇。即,首先,如第18圖所示, 在連接器基底61 0所形成之開口部613的第一部分613a, 從上側***按壓構件630之基底構件631,並利用螺栓固 定等將基底構件631固定於連接器基底610。此時,在基 底構件631所形成之各凹部63 la***基底構件63卜而使 各自和在連接器基底61 〇所形成之開口部613的第二部分 61 3b相向。 接著’如第19圖所示,在所***之基底構件631所 形成的各凹部631a,如推入般從上側***抵接構件632, 結果’抵接構件632之圓筒部633和從公側連接器620所 2030-7709-PF 25 1277756 引出的電I線624抵接並推壓。因而,對端子62i直線地 引導電I線624之結果,可防止過大的大作用於端子 621,而可防止端子621或外殼發生不良。 在本實施形態,藉由使從上方可安裝按壓構件63〇, 又’從基底構件63i可拆裝按壓構件63〇之抵接構件⑽, 可更提高本體側板_之組立性,同時亦可提高維修性或 分解作業性。 帛2G圖係表示在本實施形態安裝按壓構件之連接器 基底和蓋構件的立體圖,第21圖係表示在本實施形㈣ 按,構件及蓋構件之立體圖,第22圖係表示利用蓋構件 固定在連接H基底所安裝之按㈣件的第五步驟之剖面 圖。 蓋構件640係固疋所安裝之抵接構件632的軸之 構件’如帛20圖及帛21圖所示,係在側面形成複數凹部 641之平板形的構件。各凹部641之大小實質上和在按塵 構件630之基底構件631所形成之凹部6仏相同。又, 凹部641彼此之間距亦實質上和在基底構件631所形成之 凹部6 31 a彼此之間距相等。 在安裝公側連接器620及按壓構件630之連接器基底 61〇如以下所示安裝這種構造之蓋構件64〇。即,如第22 圖所不’從上側利用%栓固定等安裝於在連接器基底㈣ 所***之按壓構件630的上面。此時,將蓋構件64〇安裝 於按壓構件630,而使在蓋構件64Q所形成之各凹部641 和在基底構件631所形成之各凹部63ia —致。 2030-7709-PF 26 1277756 因而□將在按壓構件63〇之基底構件咖所形成之 各槽口P 631b的上部密封,可防止可拆襄之抵接構件632 從按壓構件630之基底構件631脫落。 第23圖係表不在本實施形態安裝按壓構件及蓋構件 的連接器基底和連接器導件之立體圖,第24圖係表示在 本實施幵九悲安裝於連接II基底之間隔架和連接器導件的 立體圖,第25圖係表示將間隔架安裝於連接器基底之第 六步驟,和將連接器導件安裝於該間隔架之第七步驟的剖 鲁 面圖。 在本實施形態,間隔架650如第23圖及第25圖所示, 具有覆蓋安裝於公側連接器62〇之連接器基底61〇的上面 之形狀,形成可***公側連接器62〇之開口部651。該開 口邓6 51為了和連接器基底6丨〇所支持之公側連接器6 2 〇 的排列對應’按照4列12行之排列配置48個。 連接器導件660如第24圖及第25圖所示,係形成可 ***公側連接器62〇之開口部661的平板形之構件。各開 春口部661亦為了和連接器基底61〇所支持之公側連接器 620的排列對應,而按照4列12行之排列配置48個。 此外’在該連接器導件660之上面,如第24圖所示, 形成向上方突出之導銷662。如上述所示,在將插座板7〇〇 安裝於本體側板600時,藉由該導銷662如仿傚在插座板 700之下面所設置的導孔73〇般***,而可將插座板7〇〇 導向本體側板6 0 〇並定位。 在安裝公側連接器620、按壓構件630及蓋構件640 2030-7709-PF 27 1277756 之連接器基底610,如以下所示安裝這種構造之間隔架65〇 及連接器導件660。即,首先,如第23圖及第25圖所示, 將安裝於連接器基底610之各公側連接器62〇邊***在'間 ,架650所形成之各開口部651,邊從上方將間隔架 安裝於公側連接器620並利用螺栓固定等固定。 接著,如第24圖及第25圖所示,邊將公側連接器62〇 ***在連接器導件66〇所形成之各開口部661,邊從上方 將連接器導件660安裝於在連接器基底61〇所安裝的間隔 架,並利用螺栓固定等固定。 如以上所示,藉由使可從上方安裝間隔架65〇及連接 器導件660,而本體侧板6〇〇之組立性更提高,同時維修 性及分解作業性亦提高。 此外’在本實施形態,如第6圖所示,在從公側連接 器620引出並和測試頭本體5〇〇以電氣式連接之多條的電 纜線624之中的一部分,有經由Pc〇n板連接部691和測 忒頭本體500連接者。在該pc〇n板連接部691,利用中繼 連接器等可拆裝pcon板(Pc〇n board)81〇。The intermediate shape L2 (described later with reference to the length of the thirteenth portion is turned to a portion 613a. The map of the first portion 613a is formed to be longer than the length map of the male side connector 620) (L! > L2), and the first portion 613a is formed. The width W 〆 is referred to as a width W2 (refer to FIG. 13 described later) which is longer than the width of the male connector 62 (refer to FIG. 13). Thus, the male side connection 2 620 can be fixed to the connector base 61 without being rotationally fixed. A second portion 613b of the opening portion 613 is formed between one of the base portions 612 and the pair of pillars 611a, 611b, and is located on the lower side of the male side connector 620 supported by the pair of pillars 611a, 6Ub. Further, in the present embodiment, in order to insert the first portion 613a of one opening portion 61 3 by the two sets of the column groups 611 located on both sides when the male connector 6 2 is inserted, the first portion is formed only on one side of the column group 611. 613a, while the first portion 613a is not formed on the other side, and the other pillar groups 611 are adjacent. Between the adjacent pillar groups 611, one of the pillars 611a is integrally formed with each other, and the other pillars 611b are also integrally formed. The male connector 6 2 0 includes a housing 632 as shown in FIG. 13 , and the fixing portions 626 at both ends form a bolt through hole required for the pillars 611 a and 611 b of the connector base 610 to be attached by bolts 625 . 623a; a plurality of terminals 621 projecting upward from the upper surface of the outer casing; the guide pins 622 projecting upward from the upper surface of the outer casing; and a plurality of electric wires 624 extending downward from the lower surface of the outer casing. The male connector 205 of this configuration is mounted to the above-described connector base 610 as shown below. That is, first, as shown in Fig. 14, the male side connection 2030-7709-PF 22 1277756 620 is inserted from the lower side into the first portion 613a of the opening portion 613 formed by the connector base 61 0 . At this time, since the first portion 613a is formed with a larger opening than the male connector 620, the cable 624 can remain in a straight line state. Therefore, it is not necessary to rotate the male-side connector 620 or excessively pull out the cable 624 and the like, and the male-side connector 620 can be easily connected to the opening portion 613 of the base 610. Therefore, the group standing of the body side plate β〇〇 is greatly improved. In addition, the length of the cable 624 becomes a shorter result, _ can reduce the wiring space of the excess power cable, and can transmit and receive higher speed electrical signals between the test head body 500 and the 1C component. Moreover, since the male connector 620 can be passed through the opening 613 of the connector base 610 without rotating the male connector 602, the stress of the electrical winding is not imparted, or the cable 624 is It is difficult to make a difference in length. Further, for example, in the case where the terminal 621 is damaged or lowered to the side of the outer casing 623 during use, it is necessary to replace it, and since the grouping property is improved, it is easy to remove only the problematic male side connector 62, in the maintenance property. Or decomposition when discarded _ workability is also excellent. Pulling the lower surface of the outer casing 623 of the male side connector 620 to the south of the post glib of the connector base 610, as shown in Fig. 15, the male side connector 620 is moved laterally, and the slave base substrate 61 is 〇 The cable 624 drawn from the male connector 620 in the supported state is located in the second portion 613b of the opening 613. Then, the bolts 625 (refer to FIG. 6) are inserted into the bolt through holes 623a of the male connector 620 and the bolt fixing holes 611c formed by the pillars 611a and 611b of the connector base 61, and 2030-7709- PF 23 1277756 The thread check 625 securely secures the male connector 620 to the connector base 610. Therefore, the bolt through hole of the male connector 62 is formed to be larger than the diameter of the bolt 625, and the male side connection 620 attached to the connector base 61 is oriented toward the direction of the arrow A in FIG. The plane direction of the body side plate 600 moves minutely. Therefore, when the socket board 7 is attached to the main body side panel 600, since the plurality of male side connectors 620 are inserted while emulating the female side connector 74, the workability is excellent. Further, it is also possible to make the male connector 62 〇 not only move toward the plane of the main body side plate 6 but also slightly along the side of the socket plate 7 〇 。. Thus, by causing the cable 624 drawn from the male connector 620 to be located at the second portion 613b of the opening 613, the cable 624 can be prevented from being bent in a state where the male connector 62 is supported by the connector base 610. And to prevent excess stress from acting on the cable 624. Fig. 16 is a perspective view showing a connector base and a pressing member for mounting a connector in the embodiment, Fig. 17 is an exploded perspective view showing the pressing member of the embodiment, and Fig. 18 is a view showing a connection at the mounting connector. A cross-sectional view of a third step of attaching the base member of the pressing member to the base member, and Fig. 19 is a cross-sectional view showing a fourth step of inserting the abutting member into the base member of the pressing member to which the connector base is attached. The pressing member 630 is a member that plugs the first portion 613a of the opening as shown in Figs. 16 and 17, including the abutting member 632, and the male connector in a state where the crucible is supported by the connector base 61 0 6 2 〇 the electric cable 624 is abutted, and the base member 631 〇 2030-7709-PF 24 1277756 supporting the abutting member 632 is abutting member 6 3 2 as shown in FIG. The cylindrical portion 633 where the connector 6 2 is connected by the cable 624 and the shaft 634 constitute the shaft of the cylindrical portion 633. The cylindrical portion 633 is made of, for example, a soft material such as a sponge, and is deformable when it comes into contact with the cable wire 624. As shown in Fig. 17, the base member 6 31 is a prism-shaped member in which a plurality of concave portions 631a are formed on the side surface, and the distance between the concave portions 631a is substantially the same as the second portion 61 of the opening portion 613 formed in the connector base 610. 3b are equally spaced from each other. Further, a groove portion 631b is formed in each of the opposing wall faces of the recessed portions 63A. The length of each of the recessed portions 631a in the longitudinal direction is longer than the axial length of the abutting member 632, and the cylindrical portion 633 of the abutting member 632 is inserted into each of the recessed portions 631a. At this time, the shaft 634 drawn from both ends of the cylindrical portion 633 enters the groove portion 631b of the concave portion 631a, and is held freely rotated by the bottom surface thereof. The connector base 610 of the female male side connector 620 is attached to the pressing member 63 of this configuration as shown below. That is, first, as shown in Fig. 18, the base member 631 of the pressing member 630 is inserted into the first portion 613a of the opening portion 613 formed by the connector base 610, and the base member 631 is fixed to the base member 631 by bolting or the like. Connector base 610. At this time, the respective recessed portions 63 la formed in the base member 631 are inserted into the base member 63 so as to face each other with the second portion 61 3b of the opening portion 613 formed by the connector base 61 。. Then, as shown in Fig. 19, the recessed portions 631a formed by the inserted base member 631 are inserted into the abutting member 632 from the upper side as pushed, and as a result, the cylindrical portion 633 of the abutting member 632 and the male side are Connector 620 2030-7709-PF 25 1277756 The drawn electrical I line 624 abuts and pushes. Therefore, as a result of linearly guiding the electric wire 624 to the terminal 62i, it is possible to prevent an excessively large amount from acting on the terminal 621, and it is possible to prevent the terminal 621 or the casing from being defective. In the present embodiment, the pressing member 63 can be attached from above, and the abutting member (10) of the pressing member 63 can be detached from the base member 63i, whereby the composition of the main body side plate can be further improved and the composition can be improved. Maintainability or decomposition workability. The 帛2G diagram shows a perspective view of the connector base and the cover member to which the pressing member is attached in the present embodiment, and Fig. 21 shows a perspective view of the member and the cover member in the fourth embodiment, and Fig. 22 shows the fixing by the cover member. A cross-sectional view of the fifth step of the (4) piece attached to the H substrate. The cover member 640 is a member of a shaft which is fixed to the shaft of the abutting member 632 to be mounted, as shown in Figs. 20 and 21, and is a flat member having a plurality of recesses 641 formed on the side. Each of the recesses 641 is substantially the same size as the recess 6' formed by the base member 631 of the dust member 630. Further, the distance between the concave portions 641 is substantially equal to the distance between the concave portions 631 a formed by the base member 631. In the connector base 61 on which the male connector 620 and the pressing member 630 are attached, the cover member 64 of this configuration is mounted as shown below. That is, it is attached to the upper surface of the pressing member 630 inserted in the connector base (4) by the % bolt fixing or the like from the upper side as shown in Fig. 22. At this time, the cover member 64 is attached to the pressing member 630, and the respective concave portions 641 formed in the cover member 64Q and the respective concave portions 63ia formed in the base member 631 are made uniform. 2030-7709-PF 26 1277756 Thus, the upper portion of each notch P 631b formed by the base member of the pressing member 63 is sealed, and the detachable abutting member 632 is prevented from coming off the base member 631 of the pressing member 630. . Fig. 23 is a perspective view showing the connector base and the connector guide for mounting the pressing member and the cover member in the present embodiment, and Fig. 24 is a view showing the spacer and the connector guide which are attached to the base of the connection II in the present embodiment. Fig. 25 is a perspective view showing a sixth step of mounting the spacer to the connector base, and a seventh step of mounting the connector guide to the spacer. In the present embodiment, as shown in Figs. 23 and 25, the spacer 650 has a shape covering the upper surface of the connector base 61A of the male connector 62, and is formed to be insertable into the male connector 62. Opening portion 651. The opening Deng 6 51 is arranged in accordance with the arrangement of the male side connectors 6 2 支持 supported by the connector base 6 ’ in accordance with the arrangement of four rows and twelve rows. As shown in Figs. 24 and 25, the connector guide 660 is formed into a flat plate-shaped member that can be inserted into the opening portion 661 of the male connector 62. Each of the opening portions 661 also has 48 rows arranged in four rows and 12 rows in order to correspond to the arrangement of the male-side connectors 620 supported by the connector base 61. Further, on the upper side of the connector guide 660, as shown in Fig. 24, a guide pin 662 which protrudes upward is formed. As shown in the above, when the socket board 7 is mounted on the body side panel 600, the socket pin 662 can be inserted by embedding the guide hole 73 provided under the socket board 700. 〇 Guide the body side plate 6 0 〇 and position. In the connector base 610 on which the male side connector 620, the pressing member 630, and the cover member 640 2030-7709-PF 27 1277756 are mounted, the spacer 65 这种 and the connector guide 660 of this configuration are mounted as shown below. That is, first, as shown in Figs. 23 and 25, the male connector 62 attached to the connector base 610 is inserted into the opening 651 formed between the brackets 650, and is opened from above. The spacer is attached to the male connector 620 and fixed by bolting or the like. Next, as shown in Figs. 24 and 25, the male connector 62 is inserted into each of the opening portions 661 formed by the connector guide 66, and the connector guide 660 is attached to the connector from above. The spacers mounted on the base 61 are fixed by bolts or the like. As described above, by mounting the spacer 65 and the connector guide 660 from above, the assembly of the main body side panel 6 is improved, and the maintainability and the disassembly workability are also improved. Further, in the present embodiment, as shown in Fig. 6, a part of the plurality of cable wires 624 which are taken out from the male connector 620 and electrically connected to the test head body 5 are via Pc. The n-plate connecting portion 691 and the test head body 500 are connected. In the pc〇n board connecting portion 691, a pcon board (Pc〇n board) 81 is detachably mounted by a relay connector or the like.
Peon板810係主要在IC元件之電源端子和電路接地 之間連接和ic元件的種類對應之所要的電容(例如1〇“ F〜2000 //F)之電解電容器等的電路板,選定和κ元件的 種類或測試條件對應之Pc〇n板81〇並和Pc〇n板連接部 691連接。 一樣地,雖未特別圖示,將從公側連接器62〇引出並 和測試頭本體500以電氣式連接之多條的電纜線624之中 2030-7709-PF 28 1277756 的一部分,經由應用板連接部692和測試頭本體500連 接。在該應用板連接部692,利用中繼連接器等可拆裝萬 用板820。 萬用板820係在使用者側可安褒所要之電路的泛用 板’選定和IC元件的種類或測試條件對應之萬用板8 2 〇 並和應用板連接部692連接。 這些板連接部691、692如第4圖及第24圖所示,設 置成向本體側板6 0 0之側面部露出。 ’此外,在本實施形態,該pc〇n板81〇及萬用板820 相當於在本發明之電路板。又,在本實施形態,Pc〇n板連 接部6 91及應用板連接部6 9 2相當於在本發明之連接部。 第26圖係表示利用筐體覆蓋本體側板之第八步驟的 剖面圖,第27圖係表示在本實施形態的蓋構件之分解立 體圖。 筐體670係可覆蓋包含有連接器基底610、公側連接 器620、按壓構件630、蓋構件640、間隔架650及連接器 ^導件660之本體側板600整體的構件。在該筐體67〇,如 第26圖所不’在其上面形成使全部之公側連接器620向 外部露出的第一開口部671,而且在其側面形成使用以拆 裝Peon板810或萬用板820之板連接部691、692向外部 露出的第二開口部672。 如此’藉由使板連接部69J、692從筐體670露出, 而在使用者側可易於更換所要之pc〇n板810或萬用板The Peon board 810 is mainly connected between the power supply terminal of the IC component and the circuit ground and the required capacitor corresponding to the type of the ic component (for example, a circuit board of an electrolytic capacitor such as 1 〇 "F~2000 //F", selected and κ The type of the component or the test condition corresponds to the Pc〇n board 81〇 and is connected to the Pc〇n board connection part 691. Similarly, although not specifically illustrated, the male connector 62〇 is taken out and the test head body 500 is A part of 2030-7709-PF 28 1277756 among the plurality of electrically connected cables 624 is connected to the test head body 500 via the application board connection portion 692. The application board connection portion 692 can be connected by a relay connector or the like. The universal board 820 is disassembled and assembled. The universal board 820 is a universal board that can be installed on the user side to select the desired board and the type of the IC component or the test condition corresponding to the universal board 8 2 and the application board connection part. The board connecting portions 691 and 692 are provided to be exposed to the side surface portion of the main body side plate 600 as shown in Figs. 4 and 24. Further, in the present embodiment, the pc〇n board 81 and The universal board 820 is equivalent to the circuit board of the present invention. In the embodiment, the Pc〇n board connecting portion 691 and the application board connecting portion 691 correspond to the connecting portion of the present invention. Fig. 26 is a cross-sectional view showing the eighth step of covering the main body side panel with the housing, Fig. 27 An exploded perspective view of the cover member of the present embodiment is shown. The housing 670 can cover the connector base 610, the male connector 620, the pressing member 630, the cover member 640, the spacer 650, and the connector guide 660. The main body side member 600 is a member of the entire body side panel 600. The first opening portion 671 is formed on the upper surface of the housing 67, and the male opening connector 620 is exposed to the outside. The second opening portion 672 which is exposed to the outside by the board connecting portions 691 and 692 of the Peon board 810 or the universal board 820 is detached. Thus, the board connecting portions 69J and 692 are exposed from the housing 670, and are on the user side. Easy to replace the desired pc〇n board 810 or universal board
820 〇 2030-7709-PF 29 1277756 又’在本實施形態之筐體670,如第4圖及第27圖所 示’將覆蓋和板連接部691、692連接之Peon板810的蓋 構件6 8 0設置成利用彈簧鎖等可拆裝。 該蓋構件680如第27圖所示,具有:蓋本體681,覆 蓋和板連接部691、692連接之板810、820;及保持該板 810、820之保持部682。在各保持部682形成缺口 682g, 可將板810、820***該缺口 682g。又,各保持部682對 蓋本體681安裝成可朝向第27圖之箭號方向微小地移 ® 動。因而’可防止對和板連接部691、692連接之Peon板 810或萬用板820施加無益之應力,並可防止板連接部 691、692及各板810、820受損。 以上所說明之測試頭,雖然係藉由使本體側板600介 於插座板7 0 0和測試頭本體5 〇 〇之間而可易於應付被測試 1C元件之種類的更換,但是亦可使插座板7〇〇和測試頭本 體500直接連接之型式包括連接器基底610。 第28圖係表示在本發明之第2實施形態的測試頭之 鲁上部構造的分解立體圖,第29圖係表示在本發明之第2 實施形態將插座板***連接器基底的狀態之平面圖。 在本發明之第2實施形態的測試頭如第28圖所示, 利用焊接等將電纜線624和插座板700直接連接,係該插 座板700經由電纜線624和測試頭本體直接連接之型式。 在這種型式之測試頭,如第29圖所示,亦包括連接 器基底610,形成比插座板700大並具有插座板700可通 過之第一部分613a的開口部613。因而,在測試頭5之上 2030-7709-PF 30 1277756 部的組立時,因不需要使插座板700轉動或向上方多餘地 拉出電纟覽線624等費人力的作業,所以測試頭5之組立性 提高。 又,因可使插座板700不必轉動地進行組立,所以對 電纜線624未施加多餘的應力,難發生製造上的不良。此 外,因可使插座板700不必轉動地進行組立,所以在電纜 線624之長度難發生差異,可發揮良好的測試性能。此外, 因組立性提高,所以維修性或分解作業性亦提高。 _ 在連接器基底61 〇所形成之開口部613,又含有第二 部分613b,位於由該連接器基底61〇之支柱6Ua、6ub 所支持的狀態之插座板700的下側。在該第二部分6Ub, 藉由使從插座板700向下方所引出之電纜線624通過,而 在插座板700夂到連接器基底〇支持之狀態,電纜線 不彎曲,且無益之應力不作用於電纜線624。 此外,在本實施形態,在將公側連接器62〇安裝於連 接器基底610後,可從其上方安裝間隔架65〇。因而,測 試頭5之組立性提高,同時維修性或分解作業性亦提高。 此外,以上所說明之實施形態係為了易於理解本發明 而纪載者,不是為了限制本發明而記載者。因此,在上述 之實施形態所揭示的各元件,係亦包含屬於本發明之技術 性範圍的全部之設計變更或相當物的主旨。 口例如,在上述之實施形態,雖然為間隔架650和連接 器導件660分離之構造,但是將間隔架65〇和連接器導件 660形成一體亦可。 2030-7709-PF 31 1277756 又,在上述之實施形態,雖然將公側連接器620設置 於本體側板600,並將母側連接器740設置於插座板700, 但是亦可使公/母之關係變成相反。 又,在上述之實施形態,雖然使公側連接器620可游 動’但是亦可使母側連接器740可游動,或使雙方的連接 器620、740可游動。 又’在其他的實施形態上,在經由連接器和在被測試 曰曰圓的測,式使用之探針卡連接的本體側板,亦可用如上述 所不之連接器基底610、公側連接器620、按壓構件630、 蓋構件640、Pa,隔架65〇及連接器導件66〇構成。此時, 在公側連接器620之排列上,除了第16圖所示之格子狀 排列以夕卜’亦可採用未特別圖示之輻射狀的排列。 L圖式簡單說明】 梦署!i圖係表示本發明之第1實施形態的電子元件測試 裝置之整體立體圖。 第2圖係沿著第 卜 百弟丄圖之π π線的剖面圖。 件之!表示在第1圖之電子元件測試裝置的1C元 件之處理方法的托盤之流程圖。 第4圖係表干# 第5心 圖之測試頭的上部構造之立體圖。 弟b圖你笙da ^ 糸第4圖之V部的放大平面圖。 第6圖係沿莫 5 ®之νι-νι線的剖面圖。 弟(圖係沿荽隹 耆第5圖之w -通線的剖面圖。 弟8圖係沿莫货e μ ϋ耆第5圖之μ_μ線的剖面圖。820 〇 2030-7709-PF 29 1277756 Further, in the casing 670 of the present embodiment, as shown in FIGS. 4 and 27, the cover member 6 of the Peon plate 810 that covers the board connecting portions 691 and 692 is attached. 0 is set to be detachable using a spring lock or the like. As shown in Fig. 27, the cover member 680 has a cover body 681, plates 810 and 820 which are connected to the plate connecting portions 691 and 692, and holding portions 682 for holding the plates 810 and 820. A notch 682g is formed in each of the holding portions 682, and the plates 810 and 820 can be inserted into the notches 682g. Further, each of the holding portions 682 is attached to the lid body 681 so as to be slightly movable toward the arrow direction of Fig. 27. Therefore, it is possible to prevent undesired stress from being applied to the Peon plate 810 or the universal board 820 to which the board connecting portions 691 and 692 are connected, and to prevent the board connecting portions 691, 692 and the boards 810, 820 from being damaged. The test head described above, although the body side plate 600 is interposed between the socket board 700 and the test head body 5 而, can easily cope with the replacement of the type of the tested 1C component, but can also make the socket board The type in which the test head body 500 is directly connected includes a connector base 610. Fig. 28 is an exploded perspective view showing the upper structure of the test head according to the second embodiment of the present invention, and Fig. 29 is a plan view showing a state in which the socket board is inserted into the connector base in the second embodiment of the present invention. In the test head according to the second embodiment of the present invention, as shown in Fig. 28, the cable 624 and the socket board 700 are directly connected by soldering or the like, and the socket board 700 is directly connected to the test head body via the cable 624. In this type of test head, as shown in Fig. 29, a connector base 610 is also included, forming an opening 613 that is larger than the socket plate 700 and has a first portion 613a through which the socket plate 700 can pass. Therefore, when the test head 5 is assembled 2030-7709-PF 30 1277756, the test head 5 is not required because the socket board 700 is not required to be rotated or the power line 624 is excessively pulled upward. The group's standing is improved. Further, since the socket board 700 can be assembled without being rotated, unnecessary stress is not applied to the cable 624, and manufacturing defects are less likely to occur. Further, since the socket board 700 can be assembled without being rotated, the length of the cable 624 is hard to vary, and good test performance can be exhibited. In addition, since the grouping property is improved, the maintainability or the decomposing workability are also improved. The opening portion 613 formed in the connector base 61 is further provided with a second portion 613b located on the lower side of the socket board 700 in a state supported by the pillars 6Ua, 6ub of the connector base 61. In the second portion 6Ub, by passing the cable 624 drawn downward from the socket board 700, and the socket board 700 is supported by the connector base, the cable is not bent, and the unfavorable stress does not function. On cable 624. Further, in the present embodiment, after the male connector 62 is attached to the connector base 610, the spacer 65 can be attached from above. Therefore, the testability of the test head 5 is improved, and the maintainability or the decomposing workability is also improved. The embodiments described above are intended to facilitate the understanding of the present invention and are not intended to limit the invention. Therefore, the respective elements disclosed in the above embodiments are intended to include all design changes or equivalents of the technical scope of the invention. For example, in the above embodiment, the spacer 650 and the connector guide 660 are separated from each other, but the spacer 65 〇 and the connector guide 660 may be integrally formed. 2030-7709-PF 31 1277756 Further, in the above embodiment, the male connector 620 is provided on the main body side plate 600, and the female connector 740 is provided on the socket board 700. Become the opposite. Further, in the above embodiment, the male connector 620 can be moved "but the female connector 740 can be moved or the connectors 620, 740 can be moved. In addition, in other embodiments, the connector side plate connected by the probe card and the probe card used in the test, the connector base 610 and the male connector may be used as described above. 620, the pressing member 630, the cover member 640, Pa, the spacer 65 〇 and the connector guide 66 〇 are formed. At this time, in the arrangement of the male connector 620, in addition to the lattice arrangement shown in Fig. 16, a radial arrangement not shown in the drawings may be employed. Simple description of L schema] Dream Department! The figure is an overall perspective view of the electronic component testing device according to the first embodiment of the present invention. Fig. 2 is a cross-sectional view taken along the line π π of the drawing of the drawing. Pieces! A flow chart showing the tray of the processing method of the 1C element of the electronic component testing apparatus of Fig. 1. Figure 4 is a perspective view of the upper structure of the test head of the fifth heart diagram. Brother b picture you 笙da ^ 放大 Figure 4 is an enlarged plan view of the V part. Figure 6 is a cross-sectional view taken along line νι-νι of Mo 5 ® . Brother (the figure is a cross-sectional view of the w-pass line along the 图 耆 5 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。.
2030-7709-PF 32 1277756 第 Q pj 111 1糸表示在第4圖之本體側板使用的連接器基底 之整體的立體圖。 第10圖係第9圖之X部的放大平面圖。 第11圖係沿著第1 〇圖之X I - X I線的剖面圖。 第12圖係沿著第1 〇圖之X π - X π線的剖面圖。 第1 3圖係表示在第4圖之本體側板使用的公側連接 器之立體圖。2030-7709-PF 32 1277756 The second pj 111 1 糸 shows a perspective view of the entirety of the connector base used in the body side panel of Fig. 4. Fig. 10 is an enlarged plan view showing a portion X of Fig. 9. Figure 11 is a cross-sectional view taken along the line X I - X I of the first figure. Figure 12 is a cross-sectional view taken along line X π - X π of the first figure. Fig. 13 is a perspective view showing the male side connector used in the body side panel of Fig. 4.
第14圖係表示將連接器***連接器基底之開口部的 第一步驟之剖面圖。 第1 5圖係表示使***連接器基底之開口的連接器朝 向橫向移動之第二步驟的剖面圖。 ^第16圖係表不在本發明之第1實施形態的安裝連接 為之連接器基底和按壓構件的立體圖。 第1 7圖係表示在本發明之第1實施形態的按壓構件 之分解立體圖。 第18圖係表示在安裝連接器之連接器基底安裝按壓 構件的基底構件之第三步驟的剖面圖。 第1 9 _係、表不將抵接構件***在連接器基底所安裝 之按壓構件的基底構件之第四步驟的剖面圖。 第20圖係表不在本發明之第i實施形態安裝按壓構 件之連接器基底和蓋構件的立體圖。 第21圖係表示本發明夕哲 &月之第1實施形態的按壓構件及 蓋構件之立體圖。 第22圖係表不利用蓋構件固定在連接器基底所安裝Fig. 14 is a cross-sectional view showing the first step of inserting the connector into the opening of the connector base. Fig. 15 is a cross-sectional view showing a second step of moving the connector inserted into the opening of the connector base toward the lateral direction. Fig. 16 is a perspective view showing the connector base and the pressing member which are not attached to the first embodiment of the present invention. Fig. 17 is an exploded perspective view showing the pressing member according to the first embodiment of the present invention. Fig. 18 is a cross-sectional view showing the third step of mounting the base member of the pressing member on the connector base on which the connector is mounted. The ninth embodiment is a cross-sectional view showing a fourth step of inserting the abutting member into the base member of the pressing member to which the connector base is attached. Fig. 20 is a perspective view showing the connector base and the cover member to which the pressing member is attached, which is not the i-th embodiment of the present invention. Fig. 21 is a perspective view showing a pressing member and a lid member according to the first embodiment of the present invention. Figure 22 is not attached to the connector base by the cover member.
2030-7709-PF 33 1277756 之按壓構件的第五步驟之剖面圖。 第23圖係表示在本發明之第丨實施形態,安裝按壓 構件及蓋構件的連接器基底和連接器導件之立體圖。 第24圖係表示在本發明之第丨實施形態,安農於連 接器基底之間隔架和連接器導件的立體圖。 第25圖係表示將間隔架安裝於連接器基底之第六步 驟,和將連接器導件安裝於該間隔架之第七步驟的剖 圖。2030-7709-PF 33 1277756 A cross-sectional view of the fifth step of the pressing member. Fig. 23 is a perspective view showing a connector base and a connector guide for attaching a pressing member and a cover member in a third embodiment of the present invention. Fig. 24 is a perspective view showing a spacer and a connector guide of Annon's base of the connector in the third embodiment of the present invention. Figure 25 is a cross-sectional view showing the sixth step of mounting the spacer to the connector base and the seventh step of mounting the connector guide to the spacer.
第26圖係表示利用筐體覆蓋本體側板之第八步驟的 剖面圖。 第27圖係表示在本發明之第1實施形態的蓋構件之 分解立體圖。 第2 8圖係表示在本發明之第2實施形態的測試頭之 上部構造的分解立體圖。 第29圖係表示在本發明之第2實施形態將插座板插 入連接器基底的狀態之平面圖。 第30圖係表示以往之測試頭的上部構造之概略剖面 圖0 第31 ®係表示在以往之測試頭的本體側板安裝連接 器之第一步驟的剖面圖。 第 32圖将矣-‘ 表不在以往之測試頭的本體側板安裝連接 器之第二步驟的剖面圖。Figure 26 is a cross-sectional view showing the eighth step of covering the body side panel with the casing. Fig. 27 is an exploded perspective view showing the cover member according to the first embodiment of the present invention. Fig. 28 is an exploded perspective view showing the structure of the upper portion of the test head according to the second embodiment of the present invention. Figure 29 is a plan view showing a state in which a socket board is inserted into a connector base in a second embodiment of the present invention. Fig. 30 is a schematic cross-sectional view showing the upper structure of a conventional test head. Fig. 0 is a cross-sectional view showing a first step of mounting a connector on a main body side plate of a conventional test head. Figure 32 is a cross-sectional view showing the second step of the connector mounting of the body side panel of the conventional test head.
【主要元件符號說明】 2030-7709-PF 34 1277756[Main component symbol description] 2030-7709-PF 34 1277756
i處理器、 100室部、 101恒溫槽、 108測試用托盤搬運裝 200 1C儲存部、 201測試前1C儲存器、 202測試完1C儲存器、 203托盤支撐框、 204升降機、 205托盤移送臂、 300裝載部、 401供給托盤用儲存器 402可動臂、 403可動頭、 404托盤搬運裝置、 405暫存部、 406窗部、 500測試頭本體、 600本體側板、 102測試室、 103除熱槽、 105裝置基板、 置、 301軌道、 302可動臂、 303可動頭、 304 X-Y搬運裝置、 305位置修正器、 306窗部、 4 0 0卸載部、 610連接器基底、 613開口部、 620公側連接器、 7 0 0插座板、 740母側連接器、 TST測試用托盤。i processor, 100 compartment, 101 thermostat, 108 test pallet handling 200 1C storage, 201 pre-test 1C storage, 202 test 1C storage, 203 pallet support frame, 204 elevator, 205 pallet transfer arm, 300 loading unit, 401 supply tray storage 402 movable arm, 403 movable head, 404 tray conveying device, 405 temporary storage unit, 406 window portion, 500 test head body, 600 body side plate, 102 test chamber, 103 heat removal groove, 105 device substrate, set, 301 rail, 302 movable arm, 303 movable head, 304 XY transport device, 305 position corrector, 306 window portion, 400 unloading portion, 610 connector base, 613 opening, 620 male side connection , 700 socket board, 740 female connector, TST test tray.
2030-7709-PF 352030-7709-PF 35
Claims (1)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2005/001942 WO2006085364A1 (en) | 2005-02-09 | 2005-02-09 | Electronic component test equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200632345A TW200632345A (en) | 2006-09-16 |
TWI277756B true TWI277756B (en) | 2007-04-01 |
Family
ID=36792939
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095102781A TWI277756B (en) | 2005-02-09 | 2006-01-25 | Electronic component test equipment |
Country Status (2)
Country | Link |
---|---|
TW (1) | TWI277756B (en) |
WO (1) | WO2006085364A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI405970B (en) * | 2008-10-09 | 2013-08-21 | Advantest Corp | Interface elements, test unit and electronic components test device |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5193934B2 (en) * | 2009-04-28 | 2013-05-08 | 株式会社日本マイクロニクス | Inspection method of electrical parts |
JP5631020B2 (en) * | 2009-05-01 | 2014-11-26 | 株式会社日本マイクロニクス | Test equipment for flat specimen |
JP7143201B2 (en) | 2018-12-14 | 2022-09-28 | 株式会社アドバンテスト | sensor test equipment |
TWI724482B (en) * | 2019-08-01 | 2021-04-11 | 迅得機械股份有限公司 | Probe module |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH083516B2 (en) * | 1988-11-01 | 1996-01-17 | 三菱電機株式会社 | Test head for semiconductor device and test method |
JPH0735334Y2 (en) * | 1990-06-27 | 1995-08-09 | エスエムケイ株式会社 | Connector mounting structure on the mounting board |
JP2544486Y2 (en) * | 1991-05-30 | 1997-08-20 | 第一電子工業株式会社 | Connector with lock mechanism |
JPH11326448A (en) * | 1998-05-20 | 1999-11-26 | Advantest Corp | Ic testing device |
US6312285B1 (en) * | 1999-02-25 | 2001-11-06 | Molex Incorporated | Panel mounting system for electrical connectors |
-
2005
- 2005-02-09 WO PCT/JP2005/001942 patent/WO2006085364A1/en not_active Application Discontinuation
-
2006
- 2006-01-25 TW TW095102781A patent/TWI277756B/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI405970B (en) * | 2008-10-09 | 2013-08-21 | Advantest Corp | Interface elements, test unit and electronic components test device |
Also Published As
Publication number | Publication date |
---|---|
WO2006085364A1 (en) | 2006-08-17 |
TW200632345A (en) | 2006-09-16 |
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