CN109248878B - Cleaning platform and cleaning method - Google Patents
Cleaning platform and cleaning method Download PDFInfo
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- CN109248878B CN109248878B CN201811009605.1A CN201811009605A CN109248878B CN 109248878 B CN109248878 B CN 109248878B CN 201811009605 A CN201811009605 A CN 201811009605A CN 109248878 B CN109248878 B CN 109248878B
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- 238000004140 cleaning Methods 0.000 title claims abstract description 145
- 238000000034 method Methods 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 92
- 239000002184 metal Substances 0.000 claims abstract description 80
- 229910052751 metal Inorganic materials 0.000 claims abstract description 80
- 229910021645 metal ion Inorganic materials 0.000 claims abstract description 70
- 239000007788 liquid Substances 0.000 claims abstract description 59
- 239000011146 organic particle Substances 0.000 claims abstract description 48
- 239000003814 drug Substances 0.000 claims abstract description 38
- 239000000126 substance Substances 0.000 claims abstract description 27
- 230000007935 neutral effect Effects 0.000 claims abstract description 13
- 239000010408 film Substances 0.000 claims description 84
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 65
- 239000010954 inorganic particle Substances 0.000 claims description 46
- 238000005406 washing Methods 0.000 claims description 38
- 238000005507 spraying Methods 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010409 thin film Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 150000007524 organic acids Chemical class 0.000 claims description 4
- 238000010494 dissociation reaction Methods 0.000 claims 2
- 230000005593 dissociations Effects 0.000 claims 2
- 239000008187 granular material Substances 0.000 claims 2
- 229910044991 metal oxide Inorganic materials 0.000 claims 2
- 150000004706 metal oxides Chemical class 0.000 claims 2
- 230000003647 oxidation Effects 0.000 claims 2
- 238000007254 oxidation reaction Methods 0.000 claims 2
- 239000012530 fluid Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 6
- 239000011521 glass Substances 0.000 description 14
- 239000002245 particle Substances 0.000 description 6
- 230000002378 acidificating effect Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- -1 oxygen free radical Chemical class 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
- B08B5/023—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0057—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Cleaning In General (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The invention provides a cleaning platform and a cleaning method, wherein after organic particles on the surface of a substrate are removed, metal ions formed when the organic particles are removed are also cleaned, and after the metal ions are cleaned, the metal ions enter a liquid medicine unit to remove non-neutral substances on the surface of a metal film; the metal ions on the surface of the metal film are cleaned before entering the liquid medicine unit, so that the metal ions cannot generate chemical stain with the liquid medicine, namely, the metal ion cleaning unit and the steps are introduced in the embodiment of the invention, so that the removal of organic particles and the liquid medicine are kept, the stain cannot be formed on the front surface of the metal film layer while the cleaning effect is ensured, and the technical problem that the stain is formed on the front surface of the metal film layer when EUV and the liquid medicine are simultaneously used in the existing cleaning process is solved.
Description
Technical Field
The invention relates to the field of cleaning, in particular to a cleaning platform and a cleaning method.
Background
In the industries of flat panel display and the like, array processing mainly comprises film forming, yellow light and etching; the film forming is to deposit metal on a glass substrate to form a metal film layer with a certain thickness; the yellow light is to transfer the pattern on the mask plate to the metal film layer of the glass substrate, and the pattern is formed by photoresist; finally, the uncovered part of the photoresist pattern is etched by the etching process, and then the corresponding metal pattern is left through the photoresist stripping unit.
The yellow light process includes cleaning, dewatering and drying, coating, pre-baking, exposure, developing, post-baking and other steps. The cleaning platform corresponding to the cleaning process comprises: an EUV (ultraviolet) irradiation unit, a chemical liquid unit, a Brush unit, an AAJET unit, an SWR (water rinse) unit and an A/K (air knife Water removal) unit, wherein the EUV is used for removing organic matter particles, the chemical liquid is used for removing acidic substances, the Brush is used for removing large particles, the AAJET is used for removing inorganic matter particles, the water rinse is used for further removing particles and forming a uniform water film, and the A/K is used for removing rinse water and impurities in the rinse water.
In the prior art, when a part of a metal film, such as copper, is cleaned by using EUV and chemical liquid simultaneously, the front surface of the metal film is stained.
In order to solve the problem, the prior art only uses EUV or liquid medicine for the metal film layer corresponding to the material, and although occurrence of corrosion stains can be avoided, cleaning effect is not ideal, and adverse effect is caused to subsequent processes.
Disclosure of Invention
The invention provides a cleaning platform and a cleaning method, which aim to solve the technical problem that in the existing cleaning process, EUV and liquid medicine are simultaneously used, and the front side of a metal film layer forms corrosion spots.
In order to solve the above problems, the technical scheme provided by the invention is as follows:
the embodiment of the invention provides a cleaning platform, which comprises a substrate inlet, an organic particle removing unit, a metal ion cleaning unit, a liquid medicine unit, an inorganic particle removing unit and a substrate outlet which are sequentially connected, wherein:
the substrate inlet is used for controlling a substrate to enter the cleaning platform and transmitting the substrate to the organic particle removing unit; a metal film is arranged on the surface of the substrate;
the organic particle removing unit is used for removing organic particles on the surface of the substrate and conveying the organic particles to the metal ion cleaning unit;
the metal ion cleaning unit is used for cleaning metal ions on the surface of the metal film and transmitting the metal ions to the liquid medicine unit; the metal ions comprise metal ions formed by the organic particle removing unit when organic particles are removed;
the liquid medicine unit is used for removing non-neutral substances on the surface of the metal film and transmitting the non-neutral substances to the inorganic particle removing unit;
the inorganic particle removing unit is used for removing inorganic particles on the surface of the substrate and conveying the inorganic particles to the substrate outlet;
and the substrate outlet is used for controlling the cleaned substrate to leave the cleaning platform.
According to a preferred embodiment of the present invention, the material of the metal thin film includes copper.
According to a preferred embodiment of the present invention, the metal ion cleaning unit includes a cleaning solution washing unit and a cleaning solution removing unit, which are connected in sequence, wherein:
the cleaning solution washing unit is used for cleaning metal ions on the surface of the metal film by using a cleaning solution and transmitting the metal ions to the cleaning solution removing unit;
the cleaning liquid removing unit is used for removing the cleaning liquid on the surface of the metal film and transmitting the cleaning liquid to the liquid medicine unit.
According to a preferred embodiment of the present invention, the cleaning solution washing unit includes a first water washing unit, and the first water washing unit is configured to wash the metal ions on the surface of the metal film by using water as a cleaning solution.
According to a preferred embodiment of the present invention, the first water washing unit uses water to wash the metal ions on the surface of the metal film in a spraying manner.
According to a preferred embodiment of the present invention, the cleaning solution removing unit includes a first air knife water removing unit, and the first air knife water removing unit is configured to remove the cleaning solution on the surface of the metal film by using an air knife.
According to a preferred embodiment of the present invention, the organic particle removing unit includes an ultraviolet light irradiating unit for irradiating the substrate with ultraviolet light to remove the organic particles.
According to a preferred embodiment of the present invention, the inorganic particle removing unit includes a brush unit, a spraying unit, a second water washing unit, and a second air knife water removing unit, which are connected in sequence, wherein:
the brush unit is used for removing large inorganic particles on the surface of the substrate and conveying the large inorganic particles to the spraying unit;
the spraying unit is used for removing small inorganic particles on the surface of the substrate and conveying the small inorganic particles to the second water washing unit;
the second water washing unit is used for washing inorganic particles on the surface of the substrate by using water and conveying the inorganic particles to the second air knife water removal unit;
and the second air knife water removal unit is used for removing the water film on the surface of the metal film by adopting an air knife and transmitting the water film to the substrate outlet.
The embodiment of the invention provides a cleaning method, which comprises the following steps:
step 1, controlling a substrate to enter a cleaning platform, wherein a metal film is arranged on the surface of the substrate;
step 2, removing the organic particles on the surface of the substrate;
step 3, cleaning metal ions on the surface of the metal film; the metal ions include metal ions formed when organic particles are removed;
step 4, removing non-neutral substances on the surface of the metal film;
step 5, removing inorganic particles on the surface of the substrate;
and 6, controlling the cleaned substrate to leave the cleaning platform.
According to a preferred embodiment of the present invention, the step 3 comprises the steps of:
step 31, cleaning metal ions on the surface of the metal film by using a cleaning solution;
and 32, removing the cleaning liquid on the surface of the metal film.
The invention has the beneficial effects that: the invention provides a new cleaning process, after organic particles on the surface of a substrate are removed, metal ions formed during the removal of the organic particles are also cleaned, and the metal ions enter a liquid medicine unit after being cleaned to remove non-neutral substances on the surface of a metal film; the metal ions on the surface of the metal film are cleaned before entering the liquid medicine unit, so that the metal ions cannot generate chemical stain with the liquid medicine, namely, the metal ion cleaning unit and the steps are introduced in the embodiment of the invention, so that the removal of organic particles and the liquid medicine are kept, the stain cannot be formed on the front surface of the metal film layer while the cleaning effect is ensured, and the technical problem that the stain is formed on the front surface of the metal film layer when EUV and the liquid medicine are simultaneously used in the existing cleaning process is solved.
Drawings
In order to illustrate the embodiments or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the invention, and it is obvious for a person skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic view of a first embodiment of a cleaning platform according to the present invention;
FIG. 2 is a schematic view of a second structure of the cleaning platform provided by the present invention;
FIG. 3 is a first flow chart of a cleaning method according to the present invention;
FIG. 4 is a second flow chart of the cleaning method provided by the present invention;
fig. 5 is a schematic view of the flow sheet direction provided by the present invention.
Detailed Description
The following description of the various embodiments refers to the accompanying drawings that illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as [ upper ], [ lower ], [ front ], [ rear ], [ left ], [ right ], [ inner ], [ outer ], [ side ], are only referring to the directions of the attached drawings. Accordingly, the directional terms used are used for explanation and understanding of the present invention, and are not used for limiting the present invention. In the drawings, elements having similar structures are denoted by the same reference numerals.
The invention aims at the technical problem that the front side of a metal film layer forms corrosion spots when the EUV and the liquid medicine are simultaneously used in the existing cleaning process; the present embodiment can solve this drawback.
As shown in fig. 1, the cleaning platform provided by the present invention comprises a substrate inlet 11, an organic particle removing unit 12, a metal ion cleaning unit 13, a chemical liquid unit 14, an inorganic particle removing unit 15, and a substrate outlet 16, which are connected in sequence, wherein:
the substrate inlet 11 is used for controlling the substrate to enter the cleaning platform and transmitting the substrate to the organic particle removing unit 12; a metal film is arranged on the surface of the substrate;
the organic particle removing unit 12 is used for removing organic particles on the surface of the substrate and transmitting the organic particles to the metal ion cleaning unit 13;
the metal ion cleaning unit 13 is used for cleaning metal ions on the surface of the metal film and transmitting the metal ions to the liquid medicine unit 14; the metal ions comprise metal ions formed by the organic particle removing unit when organic particles are removed;
the liquid medicine unit 14 is used for removing non-neutral substances on the surface of the metal film and transmitting the non-neutral substances to the inorganic particle removing unit 15;
an inorganic particle removing unit 15 for removing inorganic particles on the surface of the substrate and delivering to the substrate outlet 16;
the substrate outlet 16 is used to control the cleaned substrate to exit the cleaning station.
Alternatively, the material of the metal thin film may be any material, such as copper, which is described with emphasis below.
Optionally, as shown in fig. 1, the metal ion cleaning unit 13 includes a cleaning solution washing unit 131 and a cleaning solution removing unit 132 connected in sequence, where:
the cleaning solution washing unit 131 is configured to wash the metal ions on the surface of the metal film with a cleaning solution, and transmit the metal ions to the cleaning solution removing unit 132;
the cleaning liquid removing unit 132 is used for removing the cleaning liquid on the surface of the metal film and transmitting the cleaning liquid to the liquid medicine unit 14.
Alternatively, as shown in fig. 2, the cleaning solution washing unit 131 includes a first water washing unit SWR1, and the first water washing unit SWR1 is configured to wash the metal ions on the surface of the metal film using water as a cleaning solution. This embodiment adopts water as the washing liquid, has reduced the washing cost.
Optionally, the first water washing unit adopts a spraying mode, and uses water to wash the metal ions on the surface of the metal film. This embodiment adopts the mode that sprays to wash for washing speed.
Optionally, as shown in fig. 2, the cleaning solution removing unit includes a first air knife dewatering unit a/K1, and the first air knife dewatering unit a/K1 is configured to remove the cleaning solution on the surface of the metal film by using an air knife.
Optionally, as shown in fig. 2, the organic particle removing unit 12 includes an ultraviolet light irradiation unit EUV, and the ultraviolet light irradiation unit is configured to irradiate the substrate with ultraviolet light to remove the organic particles.
Alternatively, as shown in fig. 2, the inorganic particle removing unit 15 includes a brush unit 151, a spraying unit 152, a second water washing unit 153, and a second air-knife water removing unit 154, which are connected in sequence, wherein:
the Brush unit Brush151 is used to remove large inorganic particles from the surface of the substrate and transfers the particles to the spray unit 152;
the spraying unit AAJET152 is used for removing small inorganic particles on the surface of the substrate and conveying the small inorganic particles to the second water washing unit 153;
a second water washing unit SWR2153 for washing inorganic particles on the surface of the substrate with water and transferring to the second air knife water removal unit 154;
the second air knife water removal unit A/K2154 is used for removing the water film on the surface of the metal film by adopting an air knife and conveying the water film to the substrate outlet 16.
Optionally, the liquid medicine unit is configured to remove acidic substances on the surface of the metal film by using an alkaline liquid medicine.
Optionally, the second washing unit is configured to wash the inorganic particles on the surface of the substrate with water in a spraying manner.
As shown in fig. 3, the cleaning method provided by the present invention comprises the following steps:
step 1, controlling a substrate to enter a cleaning platform, wherein a metal film is arranged on the surface of the substrate.
And 2, removing the organic particles on the surface of the substrate.
Optionally, step 2 includes: irradiating the substrate with ultraviolet light to remove the organic particles.
And 3, cleaning the metal ions on the surface of the metal film.
The metal ions include metal ions formed when removing organic particles.
Optionally, step 3 includes the following steps:
step 31, cleaning metal ions on the surface of the metal film by using a cleaning solution;
and 32, removing the cleaning liquid on the surface of the metal film.
Optionally, the step of cleaning the metal ions on the surface of the metal film with a cleaning solution includes: and cleaning the metal ions on the surface of the metal film by using water as a cleaning solution.
Optionally, the step of using water as a cleaning solution to clean the metal ions on the surface of the metal film includes: and cleaning the metal ions on the surface of the metal film by using water in a spraying mode.
Optionally, the step of removing the cleaning solution on the surface of the metal film includes: and removing the cleaning liquid on the surface of the metal film by using an air knife.
And 4, removing non-neutral substances on the surface of the metal film.
Optionally, step 4 includes: and removing the acidic substances on the surface of the metal film by using an alkaline liquid medicine.
And 5, removing the inorganic particles on the surface of the substrate.
Optionally, step 5 includes the following steps:
step 51, removing large inorganic particles on the surface of the substrate;
step 52, removing small inorganic particles on the surface of the substrate;
step 53, washing the inorganic particles on the surface of the substrate by using water;
and step 54, removing the water film on the surface of the metal film by using an air knife.
Optionally, the step of washing the inorganic particles on the surface of the substrate with water includes: and cleaning the inorganic particles on the surface of the substrate by using water in a spraying mode, and forming a water film on the surface of the metal film.
And 6, controlling the cleaned substrate to leave the cleaning platform.
The present invention will be further explained by taking the substrate as a glass substrate and the metal thin film as a copper film as an example.
The product of EUV irradiation of the glass substrate provided with the copper film is oxygen free radical and ozone, the high-activity oxidizing product not only oxidizes organic particles into organic acid, but also oxidizes simple substance copper into bivalent copper, the organic acid dissociates bivalent copper oxide and the like into Cu2+ (copper ions), and the latter meets OH- (hydroxyl ions) in liquid medicine (alkaline liquid medicine), so that corrosive substances Cu (OH)2 and the like are generated, and then corrosion spots are formed on the metal film layer.
To solve this problem, as shown in fig. 4 and 5, the cleaning method provided in this embodiment includes the following steps:
s401, the glass substrate enters a cleaning machine.
S402, the glass substrate is irradiated with EUV (ultraviolet light) to remove organic particles.
S403, the glass substrate enters a water washing unit (SWR1) to clean impurities such as copper ions on the surface of the copper film.
S404, the glass substrate enters an A/K1 unit, and the cleaning liquid containing impurities is removed through an air knife.
S405, the glass substrate enters a Chemical solution unit (Chemical) to remove the acidic substance on the surface of the copper film.
S406, the glass substrate enters a Brush unit, and large particles are removed.
S407, the glass substrate enters an AAJET unit, and small inorganic particles are removed.
S408, the glass substrate enters a water washing unit (SWR2) to wash the surface of the substrate.
And S409, enabling the glass substrate to enter A/K2, and removing the cleaning liquid containing impurities through an air knife.
S410, the glass substrate leaves the cleaning machine.
The specific flow sheet direction is shown in fig. 5, and is not described again.
The invention can effectively prevent the copper film from being corroded by the synergistic action of EUV/liquid medicine in the yellow light cleaning process, and ensure the quality of flat panel display products.
According to the above embodiments:
the invention provides a new cleaning process, after organic particles on the surface of a substrate are removed, metal ions formed during the removal of the organic particles are also cleaned, and the metal ions enter a liquid medicine unit after being cleaned to remove non-neutral substances on the surface of a metal film; the metal ions on the surface of the metal film are cleaned before entering the liquid medicine unit, so that the metal ions cannot generate chemical stain with the liquid medicine, namely, the metal ion cleaning unit and the steps are introduced in the embodiment of the invention, so that the removal of organic particles and the liquid medicine are kept, the stain cannot be formed on the front surface of the metal film layer while the cleaning effect is ensured, and the technical problem that the stain is formed on the front surface of the metal film layer when EUV and the liquid medicine are simultaneously used in the existing cleaning process is solved.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.
Claims (10)
1. The utility model provides a cleaning platform which characterized in that, gets rid of unit, metal ion cleaning unit, liquid medicine unit, inorganic granule including the base plate entry, organic granule that connect gradually and get rid of unit and base plate export, wherein:
the substrate inlet is used for controlling a substrate to enter the cleaning platform and transmitting the substrate to the organic particle removing unit; a metal film is arranged on the surface of the substrate;
the organic particle removing unit is used for removing organic particles on the surface of the substrate and conveying the organic particles to the metal ion cleaning unit;
the metal ion cleaning unit is used for cleaning metal ions on the surface of the metal film by using water as cleaning liquid and transmitting the metal ions to the liquid medicine unit; the metal ions are formed by dissociation of a normal valence metal oxide formed by oxidation of the metal thin film by the organic particle removing unit by an organic acid formed when the organic particles are removed;
the liquid medicine unit is used for removing non-neutral substances on the surface of the metal film and transmitting the non-neutral substances to the inorganic particle removing unit;
the inorganic particle removing unit is used for removing inorganic particles on the surface of the substrate and conveying the inorganic particles to the substrate outlet;
and the substrate outlet is used for controlling the cleaned substrate to leave the cleaning platform.
2. The cleaning platform of claim 1, wherein the material of the metal thin film comprises copper.
3. The cleaning platform of claim 1 or 2, wherein the metal ion cleaning unit comprises a cleaning solution washing unit and a cleaning solution removing unit connected in sequence, wherein:
the cleaning solution washing unit is used for cleaning metal ions on the surface of the metal film by using a cleaning solution and transmitting the metal ions to the cleaning solution removing unit;
the cleaning liquid removing unit is used for removing the cleaning liquid on the surface of the metal film and transmitting the cleaning liquid to the liquid medicine unit.
4. The cleaning platform of claim 3, wherein the cleaning solution washing unit comprises a first water washing unit for washing metal ions on the surface of the metal film by using water as a cleaning solution.
5. The cleaning platform of claim 4, wherein the first water washing unit uses water to wash the metal ions on the surface of the metal film by spraying.
6. The cleaning platform of claim 3, wherein the cleaning solution removing unit comprises a first air knife water removing unit, and the first air knife water removing unit is used for removing the cleaning solution on the surface of the metal film by using an air knife.
7. The cleaning platform of claim 1 or 2, wherein the organic particle removal unit comprises an ultraviolet light irradiation unit for irradiating the substrate with ultraviolet light to remove the organic particles.
8. The cleaning platform of claim 1 or 2, wherein the inorganic particle removing unit comprises a brush unit, a spraying unit, a second water washing unit and a second air knife water removing unit which are connected in sequence, wherein:
the brush unit is used for removing large inorganic particles on the surface of the substrate and conveying the large inorganic particles to the spraying unit;
the spraying unit is used for removing small inorganic particles on the surface of the substrate and conveying the small inorganic particles to the second water washing unit;
the second water washing unit is used for washing inorganic particles on the surface of the substrate by using water and conveying the inorganic particles to the second air knife water removal unit;
and the second air knife water removal unit is used for removing the water film on the surface of the metal film by adopting an air knife and transmitting the water film to the substrate outlet.
9. A cleaning method applied to the cleaning platform according to any one of claims 1 to 8, wherein the cleaning platform comprises a substrate inlet, an organic particle removing unit, a metal ion cleaning unit, a liquid medicine unit, an inorganic particle removing unit and a substrate outlet which are connected in sequence; the cleaning method comprises the following steps:
step 1, controlling a substrate to enter a cleaning platform through a substrate inlet, wherein a metal film is arranged on the surface of the substrate;
step 2, removing the organic particles on the surface of the substrate by the organic particle removing unit, and conveying the organic particles to the metal ion cleaning unit;
step 3, the metal ion cleaning unit adopts water as cleaning fluid to clean metal ions on the surface of the metal film and transmits the metal ions to the liquid medicine unit; the metal ions are formed by dissociation of a normal valence metal oxide formed by oxidation of the metal thin film by the organic particle removing unit by an organic acid formed when the organic particles are removed;
step 4, the liquid medicine unit removes non-neutral substances on the surface of the metal film and transmits the non-neutral substances to the inorganic particle removing unit;
step 5, removing the inorganic particles on the surface of the substrate by the inorganic particle removing unit, and conveying the inorganic particles to the substrate outlet;
and 6, controlling the cleaned substrate to leave the cleaning platform by the substrate outlet.
10. The cleaning method according to claim 9, wherein the step 3 comprises the steps of:
step 31, cleaning metal ions on the surface of the metal film by using a cleaning solution;
and 32, removing the cleaning liquid on the surface of the metal film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811009605.1A CN109248878B (en) | 2018-08-31 | 2018-08-31 | Cleaning platform and cleaning method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811009605.1A CN109248878B (en) | 2018-08-31 | 2018-08-31 | Cleaning platform and cleaning method |
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| CN109248878A CN109248878A (en) | 2019-01-22 |
| CN109248878B true CN109248878B (en) | 2020-10-13 |
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|---|---|---|---|---|
| CN110767534B (en) * | 2019-10-28 | 2021-12-28 | 江苏晶杰光电科技有限公司 | Wafer cleaning method |
| CN111341697B (en) * | 2020-03-05 | 2023-10-17 | Tcl华星光电技术有限公司 | Cleaning device and cleaning method |
| CN111399259B (en) * | 2020-03-16 | 2024-04-09 | 深圳市华星光电半导体显示技术有限公司 | Device board processing apparatus and processing method thereof |
| CN113560274A (en) * | 2021-07-19 | 2021-10-29 | 长鑫存储技术有限公司 | Cleaning machine table and cleaning method for photomask mask |
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| JP3167625B2 (en) * | 1996-07-29 | 2001-05-21 | 島田理化工業株式会社 | Substrate wet cleaning method |
| JPH11333394A (en) * | 1998-05-27 | 1999-12-07 | Toray Ind Inc | Method for washing substrate and washing apparatus |
| JP4668088B2 (en) * | 2005-10-14 | 2011-04-13 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| JP5045382B2 (en) * | 2007-11-14 | 2012-10-10 | 大日本印刷株式会社 | Mask substrate cleaning method |
| CN102185118B (en) * | 2011-04-02 | 2013-05-22 | 东莞宏威数码机械有限公司 | Organic light emitting diode (OLED) glass substrate cleaning system and cleaning method thereof |
| CN103406302B (en) * | 2013-08-23 | 2015-08-12 | 深圳市华星光电技术有限公司 | Based on ultraviolet cleaning method and cleaning device |
| CN104801523A (en) * | 2015-03-28 | 2015-07-29 | 南京市雨花台区知识产权促进中心 | Method for washing glass base plate |
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Address after: 9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province Patentee after: TCL China Star Optoelectronics Technology Co.,Ltd. Address before: 9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province Patentee before: Shenzhen China Star Optoelectronics Technology Co.,Ltd. |