CN109354112B - Cleaning equipment - Google Patents
Cleaning equipment Download PDFInfo
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- CN109354112B CN109354112B CN201811196678.6A CN201811196678A CN109354112B CN 109354112 B CN109354112 B CN 109354112B CN 201811196678 A CN201811196678 A CN 201811196678A CN 109354112 B CN109354112 B CN 109354112B
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- unit
- cleaning
- substrate
- ultraviolet irradiation
- water washing
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- 238000004140 cleaning Methods 0.000 title claims abstract description 137
- 238000005406 washing Methods 0.000 claims abstract description 93
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 89
- 230000001590 oxidative effect Effects 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims description 101
- 239000010954 inorganic particle Substances 0.000 claims description 33
- 229910052751 metal Inorganic materials 0.000 claims description 32
- 239000002184 metal Substances 0.000 claims description 32
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 claims description 28
- 229910002091 carbon monoxide Inorganic materials 0.000 claims description 28
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 23
- 229910021645 metal ion Inorganic materials 0.000 claims description 18
- 239000011146 organic particle Substances 0.000 claims description 15
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 14
- 230000001276 controlling effect Effects 0.000 claims description 14
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 11
- 239000001569 carbon dioxide Substances 0.000 claims description 10
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 claims description 8
- 230000001105 regulatory effect Effects 0.000 claims description 7
- 239000003463 adsorbent Substances 0.000 claims description 6
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 5
- 239000005751 Copper oxide Substances 0.000 claims description 5
- 229910000431 copper oxide Inorganic materials 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 4
- NNIYFVYSVUWTOA-UHFFFAOYSA-N copper hydrochloride Chemical compound Cl.[Cu] NNIYFVYSVUWTOA-UHFFFAOYSA-N 0.000 claims description 2
- 239000005416 organic matter Substances 0.000 abstract description 14
- 230000003647 oxidation Effects 0.000 abstract description 4
- 238000007254 oxidation reaction Methods 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 43
- 239000007789 gas Substances 0.000 description 40
- 239000011521 glass Substances 0.000 description 25
- 239000000243 solution Substances 0.000 description 25
- 239000007788 liquid Substances 0.000 description 18
- 238000005507 spraying Methods 0.000 description 17
- 239000000126 substance Substances 0.000 description 17
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 239000010949 copper Substances 0.000 description 10
- 239000003814 drug Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000012530 fluid Substances 0.000 description 5
- 230000007935 neutral effect Effects 0.000 description 5
- 230000002378 acidificating effect Effects 0.000 description 4
- 239000002826 coolant Substances 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 3
- 238000002485 combustion reaction Methods 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- UMVBXBACMIOFDO-UHFFFAOYSA-N [N].[Si] Chemical compound [N].[Si] UMVBXBACMIOFDO-UHFFFAOYSA-N 0.000 description 2
- 235000011089 carbon dioxide Nutrition 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- -1 oxygen free radical Chemical class 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 235000008733 Citrus aurantifolia Nutrition 0.000 description 1
- 241000233866 Fungi Species 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 235000011941 Tilia x europaea Nutrition 0.000 description 1
- GJCXHYNLSNVSQZ-UHFFFAOYSA-L [Cu](Cl)Cl.Cl Chemical compound [Cu](Cl)Cl.Cl GJCXHYNLSNVSQZ-UHFFFAOYSA-L 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009395 breeding Methods 0.000 description 1
- 230000001488 breeding effect Effects 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical group Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000004571 lime Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/30—Treatment of water, waste water, or sewage by irradiation
- C02F1/32—Treatment of water, waste water, or sewage by irradiation with ultraviolet light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/72—Treatment of water, waste water, or sewage by oxidation
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Hydrology & Water Resources (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Water Supply & Treatment (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning In General (AREA)
Abstract
The invention provides a cleaning device, which comprises a cleaning unit, a water washing unit and a cleaning unit, wherein the cleaning unit is used for transmitting oxidizing gas generated by an ultraviolet irradiation unit to the water washing unit when the cleaning device works and oxidizing organic matters precipitated in the water washing unit; the organic matter that can deposit in the washing unit at the cleaning equipment during operation like this carries out oxidation treatment, just can not cause the hypha to grow after these organic matters oxidize, has guaranteed cleaning equipment's cleaning performance, has also avoided simultaneously that the oxidizing gas that the ultraviolet irradiation unit produced directly discharges and lead to the pollution scheduling problem outside the cleaning equipment, does not also need to wash the organic matter that deposits in the washing unit alone, has solved the washing unit that prior art exists in the organic matter deposit lead to the poor technical problem of cleaning performance.
Description
Technical Field
The invention relates to the field of cleaning, in particular to cleaning equipment.
Background
In the industries of flat panel display and the like, array processing mainly comprises film forming, yellow light and etching; the film forming is that metal and other materials are deposited on a glass substrate to form a film layer with a certain thickness; the yellow light is to transfer the pattern on the mask plate to the film layer of the glass substrate, and the pattern is formed by light resistance; finally, the uncovered part of the photoresist pattern is etched by the etching process, and then the corresponding photoresist pattern is left through the photoresist stripping unit.
The yellow light process includes cleaning, dewatering and drying, coating, pre-baking, exposure, developing, post-baking and other steps. The cleaning equipment corresponding to the cleaning process comprises: an EUV (ultraviolet) irradiation unit for irradiating a substrate with ultraviolet rays to remove organic substances, a Brush unit for removing large particles, a BJ/SJ unit for removing inorganic particles, a water washing unit for further removing particles using plasma water to form a uniform water film, and an a/K (air knife removal) unit for removing rinse water and impurities therein.
After the cleaning equipment is used for a long time, a large amount of organic matters such as organic particles and the like are deposited in the chamber body of the DIW unit, so that fungus breeding is caused, and the cleaning effect is poor.
That is, the prior art has the technical problem that the cleaning effect is poor due to the precipitation of organic matters in the water washing unit.
Disclosure of Invention
The invention provides cleaning equipment, which aims to solve the technical problem of poor cleaning effect caused by organic matter precipitation in a water washing unit in the prior art.
In order to solve the above problems, the technical scheme provided by the invention is as follows:
the embodiment of the invention provides cleaning equipment, which comprises a substrate inlet, an ultraviolet irradiation unit, a water washing unit, a cleaning unit and a substrate outlet which are sequentially connected, wherein:
the substrate inlet is used for controlling a substrate to enter the cleaning equipment and transmitting the substrate to the ultraviolet irradiation unit;
the ultraviolet irradiation unit is used for removing the organic particles on the surface of the substrate by using ultraviolet irradiation;
the water washing unit is used for washing inorganic particles on the surface of the substrate and conveying the inorganic particles to the substrate outlet;
the substrate outlet is used for controlling the cleaned substrate to leave the cleaning equipment;
the cleaning unit is used for transmitting the oxidizing gas with oxidizing property generated by the ultraviolet irradiation unit to the water washing unit and oxidizing the organic matters precipitated in the water washing unit.
According to a preferred embodiment of the present invention, the cleaning unit includes an air inlet pipeline, a regulating valve and an air outlet pipeline, the air inlet pipeline is communicated with the chamber of the ultraviolet irradiation unit and is used for guiding the oxidizing gas generated by the ultraviolet irradiation unit, the air outlet pipeline is communicated with the chamber of the water washing unit and is used for introducing the oxidizing gas into the water washing unit, and the regulating valve is used for regulating the rate of introducing the oxidizing gas into the water washing unit.
According to a preferred embodiment of the present invention, the cleaning unit further includes a separator, and the separator is configured to separate the mixed gas generated by the ultraviolet irradiation unit to obtain the oxidizing gas.
According to a preferred embodiment of the present invention, the separator includes a carbon monoxide remover for removing carbon monoxide in the mixed gas.
According to a preferred embodiment of the present invention, the carbon monoxide remover is configured to remove carbon monoxide in the mixed gas using an adsorbent.
According to a preferred embodiment of the present invention, the adsorbent is made of manganese dioxide and copper oxide in a predetermined ratio.
According to a preferred embodiment of the present invention, the carbon monoxide remover is for removing carbon monoxide in the mixed gas using a metal hydrochloric acid solution.
According to a preferred embodiment of the present invention, the metal hydrochloric acid solution comprises a copper hydrochloric acid solution.
According to a preferred embodiment of the present invention, the separator includes a carbon dioxide remover for removing carbon dioxide from the mixed gas.
According to a preferred embodiment of the present invention, the separator further comprises a cooler for cooling the mixed gas and transferring the cooled mixed gas to the carbon monoxide remover.
The invention has the beneficial effects that: the invention provides a novel cleaning device, when the cleaning device works, oxidizing gas generated by an ultraviolet irradiation unit is transmitted to a water washing unit, and organic matters precipitated in the water washing unit are oxidized; the organic matter that can deposit in the washing unit at the cleaning equipment during operation like this carries out oxidation treatment, just can not cause the hypha to grow after these organic matters oxidize, has guaranteed cleaning equipment's cleaning performance, has also avoided simultaneously that the oxidizing gas that the ultraviolet irradiation unit produced directly discharges and lead to the pollution scheduling problem outside the cleaning equipment, does not also need to wash the organic matter that deposits in the washing unit alone, has solved the washing unit that prior art exists in the organic matter deposit lead to the poor technical problem of cleaning performance.
Drawings
In order to illustrate the embodiments or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the invention, and it is obvious for a person skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic view of a first structure of a cleaning apparatus provided by the present invention;
FIG. 2 is a schematic view of a second structure of the cleaning apparatus provided by the present invention;
FIG. 3 is a first flow chart of a cleaning method according to the present invention;
FIG. 4 is a first schematic view of the flow sheet direction provided by the present invention
FIG. 5 is a schematic view of a third structure of the cleaning apparatus provided by the present invention;
FIG. 6 is a schematic view of a fourth structure of the cleaning apparatus provided by the present invention;
FIG. 7 is a second flow chart of the cleaning method provided by the present invention;
FIG. 8 is a second schematic view of the flow sheet direction provided by the present invention.
Detailed Description
The following description of the various embodiments refers to the accompanying drawings that illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as [ upper ], [ lower ], [ front ], [ rear ], [ left ], [ right ], [ inner ], [ outer ], [ side ], are only referring to the directions of the attached drawings. Accordingly, the directional terms used are used for explanation and understanding of the present invention, and are not used for limiting the present invention. In the drawings, elements having similar structures are denoted by the same reference numerals.
In order to solve the technical problem of poor cleaning effect caused by precipitation of organic matters in the water washing unit in the prior art, as shown in fig. 1, the present invention can solve the problem by transferring oxidizing gas, mainly ozone (O3), having oxidizing property, generated by the ultraviolet irradiation unit to the water washing unit to oxidize the organic matters precipitated in the water washing unit.
Specifically, as shown in fig. 1, the cleaning apparatus provided by the present invention includes a substrate inlet 11, an ultraviolet irradiation unit 12, a brush unit 13, a spraying unit 14, a water washing unit 15, an air knife water removing unit 16, a substrate outlet 17, and a cleaning unit 18, which are connected in sequence, wherein:
the substrate inlet 11 is used for controlling the substrate to enter the cleaning device and transmitting the substrate to the ultraviolet irradiation unit 12;
an ultraviolet irradiation unit 12 for removing organic particles on the surface of the substrate using ultraviolet irradiation and transferring to a brush unit 13;
the brush unit 13 is used for removing large inorganic particles on the surface of the substrate and transmitting the large inorganic particles to the spraying unit 14;
the spraying unit 14 is used for removing small inorganic particles on the surface of the substrate and transmitting the small inorganic particles to the water washing unit 15;
the water washing unit 14 is used for washing inorganic particles on the surface of the substrate by using water, and transmitting the inorganic particles to the air knife water removing unit 16;
the air knife dewatering unit 16 is used for removing the water film on the surface of the metal film by adopting an air knife and transmitting the water film to the substrate outlet 17;
the substrate outlet 17 is used for controlling the cleaned substrate to leave the cleaning equipment;
the cleaning unit 18 is configured to transfer the oxidizing gas having oxidizing property generated by the ultraviolet irradiation unit 12 to the water washing unit 15, and oxidize the organic matter precipitated in the water washing unit 15.
Optionally, the cleaning unit 18 includes an air inlet pipeline, an adjusting valve and an air outlet pipeline, the air inlet pipeline is communicated with the chamber body of the ultraviolet irradiation unit and is used for guiding the oxidizing gas generated by the ultraviolet irradiation unit, the air outlet pipeline is communicated with the chamber body of the water washing unit and is used for introducing the oxidizing gas into the water washing unit, and the adjusting valve is used for adjusting the rate of introducing the oxidizing gas into the water washing unit.
Alternatively, the regulating valve can be realized in a rotary opening mode and the like.
Because ozone O3 can remove hyphae, carbon dioxide CO2 can remove static electricity, and carbon monoxide CO does not react with plasma water at normal temperature, the mixed gas generated by the ultraviolet irradiation unit 12, namely the mixed gas of ozone, carbon monoxide and carbon dioxide, can be directly introduced into the water washing unit, thereby not only removing hyphae, but also removing static electricity.
Optionally, in some processes, pure ozone is required, and in this case, the cleaning unit further includes a separator, where the separator is configured to separate the mixed gas generated by the ultraviolet irradiation unit to obtain an oxidizing gas such as ozone.
Alternatively, the carbon monoxide can be converted into carbon dioxide through combustion, so that the carbon monoxide in the mixed gas can be removed through combustion.
Optionally, since the concentration of carbon monoxide in the mixed gas may not meet the combustion requirement, the carbon monoxide may be removed by catalysis or the like, and in this case, the separator includes a carbon monoxide remover for removing carbon monoxide in the mixed gas.
Optionally, the carbon monoxide remover is configured to remove carbon monoxide in the mixed gas using an adsorbent.
Optionally, the adsorbent is made of manganese dioxide and copper oxide according to a preset ratio, for example, the ratio of manganese dioxide to copper oxide is 10-90%: mixing at a ratio of 90-10%.
Optionally, the carbon monoxide remover is used for removing carbon monoxide in the mixed gas by using a metal hydrochloric acid solution.
Optionally, the metal hydrochloric acid solution comprises a copper chloride hydrochloric acid solution, and copper chloride forms crystals with carbon monoxide in hydrochloric acid.
Optionally, the separator includes a carbon dioxide remover for removing carbon dioxide from the mixed gas, and the carbon dioxide remover may be removed using an alkaline solution, such as sodium hydroxide (NaOH), or a drying agent such as lime powder.
Optionally, the separator further comprises a cooler for cooling the mixed gas and then transferring the cooled mixed gas to the carbon monoxide remover, so that the mixed gas with high temperature can be prevented from damaging equipment.
Optionally, the cooler comprises a circulating water cooling device, and the mixed gas is cooled by using circulating water.
Optionally, the cooler comprises a coolant holder and a coolant, and the coolant is volatilized to cool the mixed gas.
Optionally, the coolant comprises dry ice, liquefied nitrogen, or the like.
In the embodiment, when the cleaning equipment works, oxidizing gas generated by the ultraviolet irradiation unit is transmitted to the water washing unit, and organic matters precipitated in the water washing unit are oxidized; the organic matter that can deposit in the washing unit at the cleaning equipment during operation like this carries out oxidation treatment, just can not cause the hypha to grow after these organic matters oxidize, has guaranteed cleaning equipment's cleaning performance, has also avoided simultaneously that the oxidizing gas that the ultraviolet irradiation unit produced directly discharges and lead to the pollution scheduling problem outside the cleaning equipment, does not also need to wash the organic matter that deposits in the washing unit alone, has solved the washing unit that prior art exists in the organic matter deposit lead to the poor technical problem of cleaning performance.
The present invention will be further described with reference to the film as an example of the silicon nitride film.
As shown in fig. 1, the cleaning apparatus provided by the present invention includes a substrate inlet 11, an ultraviolet irradiation unit 12, a brush unit 13, a spraying unit 14, a water washing unit 15, an air knife dewatering unit 16, a substrate outlet 17, and a cleaning unit 18, which are connected in sequence, wherein:
the substrate inlet 11 is used for controlling the substrate to enter the cleaning device and transmitting the substrate to the ultraviolet irradiation unit 12; the substrate is array glass with a nitrogen silicon compound-insulating layer arranged on the surface;
the ultraviolet irradiation unit 12 is used for removing organic particles on the surface of the substrate and transmitting the organic particles to the brush unit 14;
the brush unit 13 is used for removing large inorganic particles on the surface of the substrate and transmitting the large inorganic particles to the spraying unit 14;
the spraying unit 14 is used for removing small inorganic particles on the surface of the substrate and transmitting the small inorganic particles to the water washing unit 15;
the water washing unit 15 is used for washing the inorganic particles on the surface of the substrate by using water, and conveying the inorganic particles to the air knife water removing unit 16;
the air knife dewatering unit 16 is used for removing the water film on the surface of the nitrogen silicon compound film by adopting an air knife and transmitting the water film to the substrate outlet 17;
the substrate outlet 17 is used for controlling the cleaned substrate to leave the cleaning equipment;
the cleaning unit 18 is configured to transmit the oxidizing gas generated by the ultraviolet irradiation unit 12 to the water washing unit 15, and oxidize the organic matters precipitated in the water washing unit 15.
The present invention will be further explained by taking a glass substrate as an example.
As shown in fig. 2, the cleaning apparatus provided in this embodiment includes:
an entry unit 201 corresponding to the substrate entry 11 for controlling the substrate to enter the cleaning apparatus;
an ultraviolet light unit 202 corresponding to the ultraviolet irradiation unit 12 for removing the organic particles on the surface of the substrate;
a brush unit 203 corresponding to the brush unit 13 for removing large inorganic particles on the surface of the substrate;
the two-fluid spraying unit 204 corresponds to the spraying unit 14 and is used for removing small inorganic particles on the surface of the substrate in a two-fluid spraying mode;
a washing unit 205 corresponding to the washing unit 15 for washing the inorganic particles on the surface of the substrate with water;
the air knife dewatering unit 206 corresponds to the air knife dewatering unit 16 and is used for removing the water film on the surface of the metal film by adopting an air knife;
an exit unit 207 corresponding to the substrate outlet 17 for controlling the cleaned substrate to exit the cleaning apparatus;
the ozone unit 208, corresponding to the cleaning unit 18, is used for transmitting the ozone generated by the ultraviolet light unit 202 to the water washing unit 205 so as to oxidize the organic matters precipitated in the water washing unit 205.
As shown in fig. 3 and 4, the cleaning method provided in this embodiment includes the following steps:
s301, the glass substrate enters a cleaning machine.
S302, the ultraviolet irradiation unit irradiates the glass substrate with ultraviolet light to remove the organic particles.
S303, the glass substrate enters a brush unit, and large inorganic particles are removed.
S304, the glass substrate enters a two-fluid spraying unit, and small inorganic particles are removed.
S305, the glass substrate enters a water washing unit, and the surface of the substrate is washed.
And S306, finally cleaning the glass substrate.
And S307, enabling the glass substrate to enter an air knife dewatering unit, and drying the glass substrate.
And S308, the glass substrate leaves the cleaning machine.
S309, the ozone generated by the ultraviolet irradiation unit is transmitted to the water washing unit to oxidize the organic matters precipitated in the water washing unit.
The specific flow sheet direction is shown in fig. 4, and is not described again.
When the film is a metal film, non-neutral substances such as acidic substances and the like can be generated through ultraviolet irradiation, and at the moment, the cleaning equipment further comprises a liquid medicine unit which is used for removing the non-neutral substances on the surface of the film and then transmitting the non-neutral substances to the brush unit.
Meanwhile, part of the metal film, such as copper, may cause the front surface of the metal film to form corrosion spots if EUV and chemical solution are used together in the cleaning process. In order to solve the problem, the prior art only uses EUV or liquid medicine for the metal film layer corresponding to the material, and although occurrence of corrosion stains can be avoided, cleaning effect is not ideal, and adverse effect is caused to subsequent processes.
To solve this problem, as shown in fig. 5, the cleaning apparatus provided by the present invention comprises a substrate inlet 11, an ultraviolet irradiation unit 12, a metal ion cleaning unit 5, a chemical liquid unit 19, a brush unit 13, a spraying unit 14, a water cleaning unit 15, an air knife water removing unit 16, a substrate outlet 17, and a cleaning unit 18, which are connected in sequence, wherein:
the substrate inlet 11 is used for controlling the substrate to enter the cleaning device and transmitting the substrate to the ultraviolet irradiation unit 12; a metal film is arranged on the surface of the substrate;
the ultraviolet irradiation unit 12 is used for removing organic particles on the surface of the substrate and transmitting the organic particles to the metal ion cleaning unit 5;
the metal ion cleaning unit 5 is used for cleaning metal ions on the surface of the metal film and transmitting the metal ions to the liquid medicine unit 19; the metal ions include metal ions formed by the ultraviolet irradiation unit when organic particles are removed;
the liquid medicine unit 19 is used for removing non-neutral substances on the surface of the metal film and transmitting the non-neutral substances to the brush unit 13;
the brush unit 13 is used for removing large inorganic particles on the surface of the substrate and transmitting the large inorganic particles to the spraying unit 14;
the spraying unit 14 is used for removing small inorganic particles on the surface of the substrate and transmitting the small inorganic particles to the water washing unit 15;
the water washing unit 15 is used for washing the inorganic particles on the surface of the substrate by using water, and conveying the inorganic particles to the air knife water removing unit 16;
the air knife dewatering unit 16 is used for removing the water film on the surface of the metal film by adopting an air knife and transmitting the water film to the substrate outlet 17;
the substrate outlet 17 is used for controlling the cleaned substrate to leave the cleaning equipment;
the cleaning unit 18 is configured to transmit the oxidizing gas generated by the ultraviolet irradiation unit 12 to the water washing unit 15, and oxidize the organic matters precipitated in the water washing unit 15.
Alternatively, the material of the metal thin film may be any material, such as copper, which is described with emphasis below.
Optionally, as shown in fig. 5, the metal ion cleaning unit 5 includes a cleaning solution washing unit 51 and a cleaning solution removing unit 52, which are connected in sequence, wherein:
the cleaning solution washing unit 51 is configured to wash the metal ions on the surface of the metal film with a cleaning solution, and transmit the metal ions to the cleaning solution removing unit 52;
the cleaning liquid removing unit 52 is used for removing the cleaning liquid on the surface of the metal film and transmitting the cleaning liquid to the liquid medicine unit 19.
Optionally, the cleaning solution washing unit 51 includes a water washing unit, and the water washing unit is configured to wash the metal ions on the surface of the metal film by using water as a cleaning solution. This embodiment adopts water as the washing liquid, has reduced the washing cost.
Optionally, the water washing unit adopts a spraying mode, and uses water to wash the metal ions on the surface of the metal film. This embodiment adopts the mode that sprays to wash for washing speed.
Optionally, the cleaning solution removing unit 52 includes an air knife dewatering unit, and the air knife dewatering unit is configured to remove the cleaning solution on the surface of the metal film by using an air knife.
Optionally, the liquid medicine unit is used for removing acidic substances on the surface of the metal film by using alkaline liquid medicine.
The present invention will be further explained by taking the substrate as a glass substrate and the metal thin film as a copper film as an example.
The product of EUV irradiation of the glass substrate provided with the copper film is oxygen free radical and ozone, the high-activity oxidizing product not only oxidizes organic particles into organic acid, but also oxidizes simple substance copper into bivalent copper, the organic acid dissociates bivalent copper oxide and the like into Cu2+ (copper ions), and the latter meets OH- (hydroxyl ions) in liquid medicine (alkaline liquid medicine), so that corrosive substances Cu (OH)2 and the like are generated, and then corrosion spots are formed on the metal film layer.
To address this problem, as shown in fig. 6, the cleaning apparatus provided in this embodiment includes:
an entry unit 600 corresponding to the substrate entrance 11 for controlling the substrate to enter the cleaning apparatus;
an ultraviolet irradiation unit 601 corresponding to the ultraviolet irradiation unit 12 for removing the organic particles on the surface of the substrate;
the first water washing unit 602, corresponding to the cleaning solution washing unit 51, uses water as a cleaning solution to clean the metal ions on the surface of the metal film. In the embodiment, water is used as the cleaning liquid, so that the cleaning cost is reduced;
the first air knife dewatering unit 603 corresponds to the cleaning solution removing unit 52 and is used for removing the cleaning solution on the surface of the metal film by adopting an air knife;
a chemical solution unit 604 corresponding to the chemical solution unit 19 for removing acidic substances on the surface of the metal thin film using an alkaline chemical solution;
a brush unit 605 corresponding to the brush unit 13 for removing large inorganic particles on the surface of the substrate;
a two-fluid spraying unit 606 corresponding to the spraying unit 14 for removing small inorganic particles on the surface of the substrate;
a second washing unit 607 corresponding to the washing unit 15 for washing the inorganic particles on the surface of the substrate with water;
a second air knife water removal unit 608, corresponding to the air knife water removal unit 16, for removing the water film on the surface of the metal film by using an air knife;
a leaving unit 609 corresponding to the substrate outlet 17 for controlling the cleaned substrate to leave the cleaning apparatus;
the ozone unit 610, corresponding to the cleaning unit 18, is used for transferring the ozone generated by the ultraviolet irradiation unit 601 to the second washing unit 607 to oxidize the organic matters precipitated in the second washing unit 607.
As shown in fig. 7 and 8, the cleaning method provided in this embodiment includes the following steps:
s701, the glass substrate enters a cleaning machine.
S702, the ultraviolet irradiation unit irradiates the glass substrate with ultraviolet light to remove the organic particles.
And S703, enabling the glass substrate to enter a first washing unit, and washing impurities such as copper ions on the surface of the copper film.
S704, the glass substrate enters a first air knife dewatering unit, and the cleaning liquid containing impurities is removed through an air knife.
S705, the glass substrate enters a chemical solution unit, and acidic substances on the surface of the copper film are removed.
S706, the glass substrate enters a brush unit, and large inorganic particles are removed.
S707, the glass substrate enters a two-fluid spraying unit to remove small inorganic particles.
And S708, the glass substrate enters a second washing unit, and the surface of the substrate is washed.
And S709, enabling the glass substrate to enter a second air knife dewatering unit, and removing the cleaning liquid containing impurities through an air knife.
S710, transmitting the ozone generated by the ultraviolet irradiation unit to a second water washing unit to oxidize organic matters precipitated in the water washing unit;
and S711, the glass substrate leaves the cleaning machine.
The specific flow sheet direction is shown in fig. 8, and is not described again.
The invention can effectively prevent the copper film from being corroded by the synergistic action of ultraviolet rays and liquid medicine in the yellow light cleaning process, and ensures the quality of flat panel display products.
According to the above embodiments:
the invention provides a novel cleaning device, when the cleaning device works, oxidizing gas generated by an ultraviolet irradiation unit is transmitted to a water washing unit, and organic matters precipitated in the water washing unit are oxidized; the organic matter that can deposit in the washing unit at the cleaning equipment during operation like this carries out oxidation treatment, just can not cause the hypha to grow after these organic matters oxidize, has guaranteed cleaning equipment's cleaning performance, has also avoided simultaneously that the oxidizing gas that the ultraviolet irradiation unit produced directly discharges and lead to the pollution scheduling problem outside the cleaning equipment, does not also need to wash the organic matter that deposits in the washing unit alone, has solved the washing unit that prior art exists in the organic matter deposit lead to the poor technical problem of cleaning performance.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.
Claims (10)
1. The utility model provides a cleaning equipment which characterized in that, includes the base plate entry, ultraviolet irradiation unit, metal ion cleaning unit, washing unit, cleaning unit and the base plate export that connect gradually, wherein:
the substrate inlet is used for controlling a substrate to enter the cleaning equipment and transmitting the substrate to the ultraviolet irradiation unit; a metal film is arranged on the surface of the substrate;
the ultraviolet irradiation unit is used for removing the organic particles on the surface of the substrate by using ultraviolet irradiation;
the metal ion cleaning unit is used for cleaning metal ions on the surface of the metal film; the metal ions include metal ions formed by the ultraviolet irradiation unit when organic particles are removed;
the water washing unit is used for washing inorganic particles on the surface of the substrate and conveying the inorganic particles to the substrate outlet;
the substrate outlet is used for controlling the cleaned substrate to leave the cleaning equipment;
the cleaning unit is used for transmitting the oxidizing gas with oxidizing property generated by the ultraviolet irradiation unit to the water washing unit so as to oxidize organic matters precipitated in the water washing unit.
2. The cleaning apparatus according to claim 1, wherein the cleaning unit includes an air inlet pipe, a regulating valve and an air outlet pipe, the air inlet pipe is communicated with the chamber of the ultraviolet irradiation unit and is used for guiding the oxidizing gas generated by the ultraviolet irradiation unit, the air outlet pipe is communicated with the chamber of the water washing unit and is used for introducing the oxidizing gas into the water washing unit, and the regulating valve is used for regulating the rate of introducing the oxidizing gas into the water washing unit.
3. The cleaning apparatus according to claim 2, wherein the cleaning unit further comprises a separator for separating the mixed gas generated by the ultraviolet irradiation unit to obtain the oxidizing gas.
4. The cleaning apparatus according to claim 3, wherein the separator includes a carbon monoxide remover for removing carbon monoxide in the mixed gas.
5. The cleaning apparatus according to claim 4, wherein the carbon monoxide remover is configured to remove carbon monoxide in the mixed gas using an adsorbent.
6. The cleaning apparatus defined in claim 5, wherein the adsorbent is made of manganese dioxide and copper oxide in a predetermined ratio.
7. The cleaning apparatus according to claim 4, wherein the carbon monoxide remover is configured to remove carbon monoxide in the mixed gas using a metal hydrochloric acid solution.
8. The cleaning apparatus defined in claim 7, wherein the metal hydrochloric acid solution comprises a copper hydrochloric acid solution.
9. The cleaning apparatus defined in claim 3, wherein the separator comprises a carbon dioxide remover for removing carbon dioxide from the mixed gas.
10. The cleaning apparatus according to claim 4, wherein the separator further comprises a cooler for cooling the mixed gas and transferring the cooled mixed gas to the carbon monoxide remover.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811196678.6A CN109354112B (en) | 2018-10-15 | 2018-10-15 | Cleaning equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811196678.6A CN109354112B (en) | 2018-10-15 | 2018-10-15 | Cleaning equipment |
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| CN109354112A CN109354112A (en) | 2019-02-19 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1649100A (en) * | 2004-07-23 | 2005-08-03 | 王文 | System and its method for high efficiency ozone water cleaning semiconductor wafer |
| CN103406302A (en) * | 2013-08-23 | 2013-11-27 | 深圳市华星光电技术有限公司 | Ultraviolet-based cleaning method and device |
| CN108212950A (en) * | 2018-01-04 | 2018-06-29 | 京东方科技集团股份有限公司 | A kind of extreme ultraviolet cleaning equipment and base material cleaning method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5954884A (en) * | 1997-03-17 | 1999-09-21 | Fsi International Inc. | UV/halogen metals removal process |
| JP2002018432A (en) * | 2000-07-07 | 2002-01-22 | Shibaura Mechatronics Corp | Device for treating ozonic water and device for washing treatment |
| JP4537134B2 (en) * | 2004-07-12 | 2010-09-01 | セイコーオプティカルプロダクツ株式会社 | Aspheric eyeglass lens design method |
| JP5994239B2 (en) * | 2011-11-29 | 2016-09-21 | 栗田工業株式会社 | Cleaning apparatus and method |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1649100A (en) * | 2004-07-23 | 2005-08-03 | 王文 | System and its method for high efficiency ozone water cleaning semiconductor wafer |
| CN103406302A (en) * | 2013-08-23 | 2013-11-27 | 深圳市华星光电技术有限公司 | Ultraviolet-based cleaning method and device |
| CN108212950A (en) * | 2018-01-04 | 2018-06-29 | 京东方科技集团股份有限公司 | A kind of extreme ultraviolet cleaning equipment and base material cleaning method |
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Address after: 9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province Applicant after: TCL China Star Optoelectronics Technology Co.,Ltd. Address before: 9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province Applicant before: Shenzhen China Star Optoelectronics Technology Co.,Ltd. |
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