CN109248878A - A kind of cleaning platform and cleaning method - Google Patents
A kind of cleaning platform and cleaning method Download PDFInfo
- Publication number
- CN109248878A CN109248878A CN201811009605.1A CN201811009605A CN109248878A CN 109248878 A CN109248878 A CN 109248878A CN 201811009605 A CN201811009605 A CN 201811009605A CN 109248878 A CN109248878 A CN 109248878A
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- unit
- cleaning
- removal
- metal ion
- substrate
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- 238000004140 cleaning Methods 0.000 title claims abstract description 140
- 238000000034 method Methods 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 77
- 239000002184 metal Substances 0.000 claims abstract description 58
- 229910052751 metal Inorganic materials 0.000 claims abstract description 58
- 229910021645 metal ion Inorganic materials 0.000 claims abstract description 57
- 239000012530 fluid Substances 0.000 claims abstract description 36
- 239000000126 substance Substances 0.000 claims abstract description 10
- 230000007935 neutral effect Effects 0.000 claims abstract description 9
- 239000000243 solution Substances 0.000 claims description 49
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 37
- 238000005406 washing Methods 0.000 claims description 34
- 239000010954 inorganic particle Substances 0.000 claims description 33
- 239000010949 copper Substances 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 238000002347 injection Methods 0.000 claims description 9
- 239000007924 injection Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 239000007921 spray Substances 0.000 claims description 8
- 238000010186 staining Methods 0.000 abstract description 14
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 7
- 239000011521 glass Substances 0.000 description 14
- 239000002245 particle Substances 0.000 description 8
- 230000002378 acidificating effect Effects 0.000 description 4
- 239000003814 drug Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229910001431 copper ion Inorganic materials 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 239000011146 organic particle Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 102100031880 Helicase SRCAP Human genes 0.000 description 1
- 101000704158 Homo sapiens Helicase SRCAP Proteins 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
- B08B5/023—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0057—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Cleaning In General (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The present invention provides a kind of cleaning platform and cleaning method, after the organic granular of removal substrate surface, it is also cleaned for the metal ion formed when removing organic granular, the non-neutral substance of medical fluid unit removal metal film surfaces is just entered after cleaning metal ion；Due to before entering medical fluid unit, the metal ion of metal film surfaces is cleaned, these metal ions cannot generate chemistry with medical fluid and form Staining in this way, i.e. the embodiment of the present invention introduces metal ion cleaning unit and step, remain organic granular removal and medical fluid, while guaranteeing cleaning effect, the technical issues of Staining will not being formed in metallic diaphragm front, existing manufacturing process for cleaning is solved while metallic diaphragm front existing for EUV and medical fluid being used to form Staining.
Description
Technical field
The present invention relates to cleaning field more particularly to a kind of cleaning platforms and cleaning method.
Background technique
In the industries such as FPD, array process mainly includes film forming, yellow light and etching；Film forming is to arrive metal deposit
On glass substrate, certain thickness metallic diaphragm is formed；Yellow light is the metal that the figure on mask is transferred to glass substrate
In film layer, which is made of photoresist；Finally etching processing procedure falls the unlapped partial etching of photoresist figure, then passes through light
Stripping unit is hindered, corresponding metal pattern is left.
Wherein, yellow light process includes cleaning, removes the processing procedures such as water drying, coating, prebake conditions, exposure, development and rear baking.And
The corresponding cleaning platform of manufacturing process for cleaning includes: EUV (ultraviolet light) illumination unit, medical fluid unit, Brush (hairbrush) unit, AAJET
(injection) unit, SWR (washing) unit and A/K (air knife water removal) unit, the effect of EUV are to remove organic matter Particle, medicine
The effect of liquid is that remove acidic materials, Brush be to remove bulky grain Particle, AAJET to remove inorganic matter Particle, washing
It is further removing Particle and forms uniform moisture film, A/K is to remove rinse water and impurity therein.
In the prior art, part metals film layer, such as copper, if will cause simultaneously using EUV and medical fluid in manufacturing process for cleaning
Metallic diaphragm front forms Staining.
In order to solve this problem, EUV or medical fluid is used only for the corresponding metallic diaphragm of this kind of material in the prior art,
Although can be to avoid the appearance of Staining, it be undesirable to will lead to cleaning effect, will cause adverse effect to follow-up process.
Summary of the invention
The present invention provides a kind of cleaning platform and cleaning method, to solve existing manufacturing process for cleaning while use EUV and medicine
Metallic diaphragm front existing for liquid forms the technical issues of Staining.
To solve the above problems, technical solution provided by the invention is as follows:
The embodiment of the invention provides a kind of cleaning platforms comprising sequentially connected substrate entrance, organic granular removal
Unit, metal ion cleaning unit, medical fluid unit, inorganic particle removal unit and substrate outlet, in which:
The substrate entrance enters cleaning platform for control base board, and is sent to the organic granular removal unit；Institute
The surface for stating substrate is provided with metallic film；
The organic granular removal unit is used to remove the organic granular of the substrate surface, and be sent to the metal from
Sub- cleaning unit；
The metal ion cleaning unit is used to clean the metal ion of the metal film surfaces, and is sent to the medicine
Liquid unit；The metal ion includes the metal ion that the organic granular removal unit is formed when removing organic granular；
The medical fluid unit is used to remove the non-neutral substance of the metal film surfaces, and is sent to the inorganic particle
Removal unit；
The inorganic particle removal unit is used to remove the inorganic particle of the substrate surface, and is sent to the substrate and goes out
Mouthful；
Substrate of the substrate outlet for after controlling cleaning leaves cleaning platform.
According to one preferred embodiment of the present invention, the material of the metallic film includes copper.
According to one preferred embodiment of the present invention, the metal ion cleaning unit includes that sequentially connected cleaning solution washing is single
Member and cleaning solution removal unit, in which:
The cleaning solution washing unit is used to clean the metal ion of the metal film surfaces using cleaning solution, and transmits
To the cleaning solution removal unit；
The cleaning solution removal unit is used to remove the cleaning solution of the metal film surfaces, and is sent to the medical fluid list
Member.
According to one preferred embodiment of the present invention, the cleaning solution washing unit includes the first washing unit, first water
Unit is washed for cleaning the metal ions of the metal film surfaces as cleaning solution using water.
According to one preferred embodiment of the present invention, the first washing unit makes to wash with water described by the way of spray
The metal ion of metal film surfaces.
According to one preferred embodiment of the present invention, the cleaning solution removal unit includes that the first air knife removes water unit, and described the
One air knife is used to remove the cleaning solution of the metal film surfaces using air knife except water unit.
According to one preferred embodiment of the present invention, the organic granular removal unit includes ultraviolet light unit, the purple
Outer light irradiation unit is used for using substrate described in ultraviolet light, to remove the organic granular.
According to one preferred embodiment of the present invention, the inorganic particle removal unit includes sequentially connected brush unit, spray
Unit, the second washing unit and the second air knife are penetrated except water unit, in which:
The brush unit is used to remove the big inorganic particle of the substrate surface, and is sent to the injection unit；
The injection unit is used to remove the small inorganic particle of the substrate surface, and it is single to be sent to second washing
Member；
The second washing unit is used to make to wash with water the inorganic particle of the substrate surface, and is sent to described second
Air knife removes water unit；
Second air knife is used to remove the moisture film of the metal film surfaces using air knife except water unit, and is sent to institute
State substrate outlet.
The embodiment of the invention provides a kind of cleaning methods comprising following steps:
Step 1, control base board enter cleaning platform, and the surface of the substrate is provided with metallic film；
The organic granular of step 2, the removal substrate surface；
The metal ion of step 3, the cleaning metal film surfaces；The shape when metal ion includes removal organic granular
At metal ion；
The non-neutral substance of step 4, the removal metal film surfaces；
The inorganic particle of step 5, the removal substrate surface；
Substrate after step 6, control cleaning leaves cleaning platform.
According to one preferred embodiment of the present invention, the step 3 the following steps are included:
Step 31, the metal ion that the metal film surfaces are cleaned using cleaning solution；
The cleaning solution of step 32, the removal metal film surfaces.
The invention has the benefit that the present invention by providing a kind of new manufacturing process for cleaning, is removing having for substrate surface
It after machine particle, is also cleaned for the metal ion formed when removing organic granular, after cleaning metal ion
Just enter the non-neutral substance of medical fluid unit removal metal film surfaces；Due to enter medical fluid unit before, by metallic film
The metal ion on surface is cleaned, these metal ions cannot generate chemistry with medical fluid and form Staining in this way, i.e., originally
Inventive embodiments introduce metal ion cleaning unit and step, remain organic granular removal and medical fluid, are guaranteeing cleaning effect
While fruit, Staining will not be formed in metallic diaphragm front, solve existing manufacturing process for cleaning while being deposited using EUV and medical fluid
Metallic diaphragm front formed Staining the technical issues of.
Detailed description of the invention
It, below will be to embodiment or the prior art in order to illustrate more clearly of embodiment or technical solution in the prior art
Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only some of invention
Embodiment for those of ordinary skill in the art without creative efforts, can also be attached according to these
Figure obtains other attached drawings.
Fig. 1 is the first structural schematic diagram of cleaning platform provided by the invention；
Fig. 2 is second of structural schematic diagram of cleaning platform provided by the invention；
Fig. 3 is the first flow chart of cleaning method provided by the invention；
Fig. 4 is second of flow chart of cleaning method provided by the invention；
Fig. 5 is the schematic diagram in flow direction provided by the invention.
Specific embodiment
The explanation of following embodiment is referred to the additional illustration, the particular implementation that can be used to implement to illustrate the present invention
Example.The direction term that the present invention is previously mentioned, such as [on], [under], [preceding], [rear], [left side], [right side], [interior], [outer], [side]
Deng being only the direction with reference to annexed drawings.Therefore, the direction term used be to illustrate and understand the present invention, rather than to
The limitation present invention.The similar unit of structure is with being given the same reference numerals in the figure.
The present invention uses metallic diaphragm front existing for EUV and medical fluid to form Staining simultaneously for existing manufacturing process for cleaning
Technical problem；The present embodiment is able to solve the defect.
As shown in Figure 1, cleaning platform provided by the invention includes sequentially connected substrate entrance 11, organic granular removal list
Member 12, metal ion cleaning unit 13, medical fluid unit 14, inorganic particle removal unit 15 and substrate outlet 16, in which:
Substrate entrance 11 enters cleaning platform for control base board, and is sent to the organic granular removal unit 12；Institute
The surface for stating substrate is provided with metallic film；
Organic granular removal unit 12 is used to remove the organic granular of the substrate surface, and is sent to the metal ion
Cleaning unit 13；
Metal ion cleaning unit 13 is used to clean the metal ion of the metal film surfaces, and is sent to the medical fluid
Unit 14；The metal ion includes the metal ion that the organic granular removal unit is formed when removing organic granular；
Medical fluid unit 14 is used to remove the non-neutral substance of the metal film surfaces, and is sent to the inorganic particle and goes
Except unit 15；
Inorganic particle removal unit 15 is used to remove the inorganic particle of the substrate surface, and is sent to the substrate outlet
16；
Substrate of the substrate outlet 16 for after controlling cleaning leaves cleaning platform.
Optionally, the material of metallic film can be arbitrary material, such as the hereafter copper of emphasis description.
Optionally, as shown in Figure 1, the metal ion cleaning unit 13 includes sequentially connected cleaning solution washing unit
131 and cleaning solution removal unit 132, in which:
The cleaning solution washing unit 131 is used to clean the metal ion of the metal film surfaces using cleaning solution, and
It is sent to the cleaning solution removal unit 132；
The cleaning solution removal unit 132 is used to remove the cleaning solution of the metal film surfaces, and is sent to the medicine
Liquid unit 14.
Optionally, as shown in Fig. 2, the cleaning solution washing unit 131 includes the first washing cell S WR1, first water
Cell S WR1 is washed for cleaning the metal ions of the metal film surfaces as cleaning solution using water.The present embodiment is made using water
For cleaning solution, cleaning cost is reduced.
Optionally, the first washing unit makes the gold for washing with water the metal film surfaces by the way of spray
Belong to ion.The present embodiment is cleaned by the way of spray, accelerates cleaning speed.
Optionally, as shown in Fig. 2, the cleaning solution removal unit include the first air knife remove water unit A/K1, described first
Air knife is used to remove the cleaning solution of the metal film surfaces using air knife except water unit A/K1.
Optionally, described ultraviolet as shown in Fig. 2, the organic granular removal unit 12 includes ultraviolet light unit EUV
Light irradiation unit is used for using substrate described in ultraviolet light, to remove the organic granular.
Optionally, as shown in Fig. 2, the inorganic particle removal unit 15 includes sequentially connected brush unit 151, injection
Unit 152, second washes unit 153 and the second air knife removes water unit 154, in which:
Brush unit Brush151 is used to remove the big inorganic particle of the substrate surface, and is sent to the injection unit
152；
Injection unit AAJET152 is used to remove the small inorganic particle of the substrate surface, and is sent to second washing
Unit 153；
Second washing cell S WR2153 is used to make to wash with water the inorganic particle of the substrate surface, and is sent to described
Second air knife removes water unit 154；
Second air knife is used to remove the moisture film of the metal film surfaces using air knife except water unit A/K2154, and transmits
To substrate outlet 16.
Optionally, medical fluid unit, for removing the acidic materials of the metal film surfaces using alkaline medical fluid.
Optionally, the second washing unit is used for by the way of spray, makes the inorganic particulate for washing with water the substrate surface
Grain.
As shown in figure 3, cleaning method provided by the invention the following steps are included:
Step 1, control base board enter cleaning platform, and the surface of the substrate is provided with metallic film.
The organic granular of step 2, the removal substrate surface.
Optionally, step 2 includes: using substrate described in ultraviolet light, to remove the organic granular.
The metal ion of step 3, the cleaning metal film surfaces.
The metal ion includes the metal ion formed when removing organic granular.
Optionally, step 3 the following steps are included:
Step 31, the metal ion that the metal film surfaces are cleaned using cleaning solution；
The cleaning solution of step 32, the removal metal film surfaces.
Optionally, the step of using cleaning solution to clean the metal ion of the metal film surfaces include: using water as
Cleaning solution cleans the metal ion of the metal film surfaces.
Optionally, the step of cleaning the metal ion of the metal film surfaces as cleaning solution using water includes: use
The mode of spray makes the metal ion for washing with water the metal film surfaces.
Optionally, the step of removing the cleaning solution of the metal film surfaces includes: to remove the metal foil using air knife
The cleaning solution of film surface.
The non-neutral substance of step 4, the removal metal film surfaces.
Optionally, step 4 includes: the acidic materials that the metal film surfaces are removed using alkaline medical fluid.
The inorganic particle of step 5, the removal substrate surface.
Optionally, step 5 the following steps are included:
The big inorganic particle of step 51, the removal substrate surface；
The small inorganic particle of step 52, the removal substrate surface；
Step 53 makes the inorganic particle for washing with water the substrate surface；
Step 54, the moisture film that the metal film surfaces are removed using air knife.
Optionally, the step of making the inorganic particle for washing with water the substrate surface includes: to be used by the way of spray
Water cleans the inorganic particle of the substrate surface, and forms moisture film in metal film surfaces.
Substrate after step 6, control cleaning leaves cleaning platform.
Now using substrate as glass substrate, metallic film be copper film as an example, the present invention is done and further annotates explanation.
It is provided with the glass substrate of copper film, the product after EUV irradiates is oxygen radical and ozone, such highly reactive form of oxygen
Organic particle is not only oxidized to organic acid by the property changed product, while elemental copper is oxidized to cupric, and organic acid is by divalent
Cu oxide etc. is dissociated into Cu2+ (copper ion), after the latter encounters the OH- (hydroxide ion) in medical fluid (alkaline medical fluid), is just given birth to
At corrosive substance Cu (OH) 2 etc., Staining is then formed on metallic diaphragm.
For this problem, as shown in figs. 4 and 5, cleaning method provided in this embodiment the following steps are included:
S401, glass substrate enter cleaning machine.
S402, EUV (ultraviolet light) irradiate glass substrate, remove organic Particle (particle).
S403, glass substrate enter washing unit (SWR1), clean the impurity such as the copper ion on copper film surface.
S404, glass substrate enter A/K1 unit, and impure cleaning solution is removed through air knife.
S405, glass substrate enter medical fluid unit (Chemical), remove the acidic materials on copper film surface.
S406, glass substrate enter Brush unit, remove bulky grain Particle.
S407, glass substrate enter AAJET unit, remove the inorganic Particle of little particle.
S408, glass substrate enter washing unit (SWR2), cleaning base plate surface.
S409, glass substrate enter A/K2, and impure cleaning solution is removed through air knife.
S410, glass substrate leave cleaning machine.
Specific flow direction is as shown in figure 5, repeat no more.
The present invention can effectively prevent the corrosion that copper film is acted synergistically in yellow light manufacturing process for cleaning by EUV/ medical fluid, guarantee flat
Plate shows product quality.
According to above-described embodiment:
The present invention is by providing a kind of new manufacturing process for cleaning, after the organic granular of removal substrate surface, for going
The metal ion formed when except organic granular is also cleaned, and medical fluid unit removal gold is just entered after cleaning metal ion
Belong to the non-neutral substance of film surface；Since before entering medical fluid unit, the metal ion of metal film surfaces being carried out
Cleaning, in this way these metal ions cannot with medical fluid generate chemistry formed Staining, i.e., the embodiment of the present invention introducing metal from
Sub- cleaning unit and step, remain organic granular removal and medical fluid will not be in metal while guaranteeing cleaning effect
Film layer front forms Staining, solves existing manufacturing process for cleaning while metallic diaphragm front existing for EUV and medical fluid being used to be formed
The technical issues of Staining.
In conclusion although the present invention has been disclosed above in the preferred embodiment, but above preferred embodiment is not to limit
The system present invention, those skilled in the art can make various changes and profit without departing from the spirit and scope of the present invention
Decorations, therefore protection scope of the present invention subjects to the scope of the claims.
Claims (10)
1. a kind of cleaning platform, which is characterized in that including sequentially connected substrate entrance, organic granular removal unit, metal from
Sub- cleaning unit, medical fluid unit, inorganic particle removal unit and substrate outlet, in which:
The substrate entrance enters cleaning platform for control base board, and is sent to the organic granular removal unit；The base
The surface of plate is provided with metallic film；
The organic granular removal unit is used to remove the organic granular of the substrate surface, and it is clear to be sent to the metal ion
Wash unit；
The metal ion cleaning unit is used to clean the metal ion of the metal film surfaces, and is sent to the medical fluid list
Member；The metal ion includes the metal ion that the organic granular removal unit is formed when removing organic granular；
The medical fluid unit is used to remove the non-neutral substance of the metal film surfaces, and is sent to the inorganic particle removal
Unit；
The inorganic particle removal unit is used to remove the inorganic particle of the substrate surface, and is sent to the substrate outlet；
Substrate of the substrate outlet for after controlling cleaning leaves cleaning platform.
2. cleaning platform according to claim 1, which is characterized in that the material of the metallic film includes copper.
3. cleaning platform according to claim 1 or 2, which is characterized in that the metal ion cleaning unit includes successively
The cleaning solution washing unit and cleaning solution removal unit of connection, in which:
The cleaning solution washing unit is used to clean the metal ion of the metal film surfaces using cleaning solution, and is sent to institute
State cleaning solution removal unit；
The cleaning solution removal unit is used to remove the cleaning solution of the metal film surfaces, and is sent to the medical fluid unit.
4. cleaning platform according to claim 3, which is characterized in that the cleaning solution washing unit includes that the first washing is single
Member, the first washing unit are used to clean the metal ion of the metal film surfaces as cleaning solution using water.
5. cleaning platform according to claim 4, which is characterized in that described first washes unit by the way of spray,
Make the metal ion for washing with water the metal film surfaces.
6. cleaning platform according to claim 3, which is characterized in that the cleaning solution removal unit includes that the first air knife removes
Water unit, first air knife are used to remove the cleaning solution of the metal film surfaces using air knife except water unit.
7. cleaning platform according to claim 1 or 2, which is characterized in that the organic granular removal unit includes ultraviolet
Light irradiation unit, the ultraviolet light unit are used for using substrate described in ultraviolet light, to remove the organic granular.
8. cleaning platform according to claim 1 or 2, which is characterized in that the inorganic particle removal unit includes successively
Brush unit, injection unit, the second washing unit and the second air knife of connection remove water unit, in which:
The brush unit is used to remove the big inorganic particle of the substrate surface, and is sent to the injection unit；
The injection unit is used to remove the small inorganic particle of the substrate surface, and is sent to the second washing unit；
The second washing unit is used to make to wash with water the inorganic particle of the substrate surface, and is sent to second air knife
Except water unit；
Second air knife is used to remove the moisture film of the metal film surfaces using air knife except water unit, and is sent to the base
Plate outlet.
9. a kind of cleaning method, which comprises the following steps:
Step 1, control base board enter cleaning platform, and the surface of the substrate is provided with metallic film；
The organic granular of step 2, the removal substrate surface；
The metal ion of step 3, the cleaning metal film surfaces；The metal ion is formed when including removal organic granular
Metal ion；
The non-neutral substance of step 4, the removal metal film surfaces；
The inorganic particle of step 5, the removal substrate surface；
Substrate after step 6, control cleaning leaves cleaning platform.
10. cleaning method according to claim 9, which is characterized in that the step 3 the following steps are included:
Step 31, the metal ion that the metal film surfaces are cleaned using cleaning solution；
The cleaning solution of step 32, the removal metal film surfaces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811009605.1A CN109248878B (en) | 2018-08-31 | 2018-08-31 | Cleaning platform and cleaning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811009605.1A CN109248878B (en) | 2018-08-31 | 2018-08-31 | Cleaning platform and cleaning method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109248878A true CN109248878A (en) | 2019-01-22 |
| CN109248878B CN109248878B (en) | 2020-10-13 |
Family
ID=65049915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811009605.1A Active CN109248878B (en) | 2018-08-31 | 2018-08-31 | Cleaning platform and cleaning method |
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|---|---|
| CN (1) | CN109248878B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110767534A (en) * | 2019-10-28 | 2020-02-07 | 苏师大半导体材料与设备研究院(邳州)有限公司 | Wafer cleaning method |
| CN111341697A (en) * | 2020-03-05 | 2020-06-26 | Tcl华星光电技术有限公司 | Cleaning device and cleaning method |
| CN111399259A (en) * | 2020-03-16 | 2020-07-10 | 深圳市华星光电半导体显示技术有限公司 | Device board processing apparatus and processing method thereof |
| WO2023000459A1 (en) * | 2021-07-19 | 2023-01-26 | 长鑫存储技术有限公司 | Cleaning machine and cleaning method for photomask pellicle |
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| CN111399259B (en) * | 2020-03-16 | 2024-04-09 | 深圳市华星光电半导体显示技术有限公司 | Device board processing apparatus and processing method thereof |
| WO2023000459A1 (en) * | 2021-07-19 | 2023-01-26 | 长鑫存储技术有限公司 | Cleaning machine and cleaning method for photomask pellicle |
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Address after: 9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province Patentee after: TCL China Star Optoelectronics Technology Co.,Ltd. Address before: 9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province Patentee before: Shenzhen China Star Optoelectronics Technology Co.,Ltd. |