CN109219238A - Using silica gel plate as the circuit board of substrate and its manufacturing method - Google Patents
Using silica gel plate as the circuit board of substrate and its manufacturing method Download PDFInfo
- Publication number
- CN109219238A CN109219238A CN201710532129.0A CN201710532129A CN109219238A CN 109219238 A CN109219238 A CN 109219238A CN 201710532129 A CN201710532129 A CN 201710532129A CN 109219238 A CN109219238 A CN 109219238A
- Authority
- CN
- China
- Prior art keywords
- silica gel
- substrate
- circuit board
- circuit
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0162—Silicon containing polymer, e.g. silicone
Abstract
It is a kind of using silica gel plate as the circuit board of substrate and its manufacturing method, the circuit board includes: a silica gel substrate, material using silica gel as circuit board, silica gel compared to previously used PET sheet ductility with higher and can flexility, and can be with resistance to 200 DEG C or more of high temperature；One adhesion layer is attached on the silica gel substrate；And a metal layer, it is attached to above the adhesion layer.Silica gel is advanced low-k materials, is very suitable to be fabricated to the wireless interlock circuit substrate such as antenna.In addition, silica gel substrate can be used in an environment of high temperature with resistance to 200 DEG C or more of high temperature.In addition, silica gel substrate can be with waterproof, solar heat protection, so being adaptable to different operating environments.Silica gel substrate has quite high chemical stability, is not easy physiological tissue's generation with arround and reacts, therefore can readily be used in the application of biology, the especially manufacture of biochip.Wherein, which can be that etched circuit is formed by circuit board or printed circuit is formed by circuit board.
Description
Technical field
It can be etched circuit the present invention relates to a kind of circuit board, especially one kind to be formed by using silica gel plate as substrate
Circuit board and its manufacturing method.
Background technique
Printed circuit board in the prior art, as shown in Figure 1, it is used as substrate using PET sheet (film) or PI plate (film)
10 ', a metal layer 30 ' is sticked together by an adhesion layer 20 ' thereon, wherein the material of the metal layer 30 ' can be copper, silver,
Gold.Therefore printed circuit board can be formed.When if necessary to encapsulate, then in above-mentioned printed circuit board upper and lower sides packaging silicon rubber
40’。
General printed circuit board can be divided into hardboard and soft board, and hardboard material has FR4, aluminium or ceramics etc., and soft board material has
PET, PI etc..In general hardboard is not available on flexible circuit, and applications many at present is to need flexible circuit board.And
There are certain disadvantages in practical application for the structure of soft board.Main reasons is that PET sheet or PI plate can not high temperature resistant, general PET
Plate or the unbearable high temperature for being higher than 130 DEG C of PI plate, so the printed circuit board will be unable to bear when operation environment temperature is high
High temperature, less serious case lead to the deformation of circuit, so that the electrical offset of the component on circuit board, if impedance changes, so being not allowed
True data.The entire circuit of severe one be destroyed lead to not using.
Also, the poor ductility of PET sheet or PI plate, so in many applications, such as the use of biochip, such electricity
Road plate will lead to since retractility difference can not adapt to environment and use upper puzzlement.In addition the bio-compatibility of PET sheet or PI plate
It is low, thus the application in terms of biology can physiological tissue with arround generate and react, this is undesirable in design.
Therefore the present invention wishes to propose that one kind is brand-new using silica gel plate as the circuit board of substrate and its manufacturing method, to solve
Defect on above-mentioned prior art.
Summary of the invention
So proposing one kind with silica gel in the present invention the purpose of the present invention is to solve the problem in the above-mentioned prior art
Plate is the circuit board and its manufacturing method of substrate, replaces conventionally used PET sheet or PI plate, silica gel using silica gel substrate
Compared to previously used PET sheet ductility with higher and can flexility, and can flexing, it is possible to used as around
Curved circuit board, and convenient for applying in many different environment.Silica gel is advanced low-k materials, is very suitable to be fabricated to
Antenna etc. is wireless interlock circuit substrate.In addition, silica gel substrate can be with resistance to 200 DEG C or more of high temperature, so in an environment of high temperature
It can be used, such as use medically, when needing to carry out high-temperature sterilization, temperature is often higher than 160 DEG C, and traditional
PET sheet or this unbearable high temperature of PI plate, but silica gel substrate of the invention can bear the high temperature.In addition, silica gel substrate can
With waterproof, solar heat protection, so different operating environments is adaptable to, so quite convenient when production.Silica gel substrate has quite high
Chemical stability, be not easy physiological tissue with arround and generate react, therefore can readily be used in the application of biology, especially give birth to
The manufacture of object chip.In the present invention, which can be etched circuit and is formed by circuit board or printed circuit institute shape
At circuit board.
In order to achieve the above objectives, it is proposed in the present invention a kind of using silica gel plate as the circuit board of substrate, comprising: a silica gel base
Plate, the material using silica gel as circuit board；One adhesion layer is attached on the silica gel substrate；And a metal layer, it is a metal
Former material or metallic circuit；The metal layer is attached to above the adhesion layer.
The present invention also proposes a kind of using silica gel plate as the manufacturing method of the etched circuit board of substrate, including the following steps:
Step A: taking a metal layer to be used in case of in formation circuit backward, and by metal layer importing adhesion material coater unit, and incite somebody to action
The one side that adhesion material is coated on the metal layer forms an adhesion layer；Step B: again by the metal layer guiding one with the adhesion layer
First bakes and banks up with earth unit, and the metal layer and the adhesion layer are toasted；Step C: by the silica gel former material in silica gel former material charging basket
The thickness needed for being formed between two idler wheels of film-discharging machine by rolling is imported, and forms silica gel substrate；Step D: again should
Silica gel substrate imports metal material by idler wheel and attaches unit, while by the metal layer with the adhesion layer of toasted mistake
It imports the metal material and attaches unit, and the metal layer is pasted with being attached to above silica gel substrate on one side of the adhesion layer, it is whole
Body forms a prototype circuit plate；Step E: baking and banking up with earth unit for prototype circuit plate guiding one second again, and by the prototype circuit plate
It is toasted；Step F: the prototype circuit plate toasted is then entered into etching groove and is etched；Step G: then again will erosion
The prototype circuit plate after quarter carries out other circuit forming step.
Wherein, entering used etching solution when etching groove is etched in the prototype circuit plate is alkaline etching liquid or acid
Property etching solution.
Wherein, which is the copper chloride of alkalinity or the copper chloride of acidity.
Wherein, the material of the adhesion layer includes: organosilicon polyester, copolymer resins, ethyl acetate and organic siliconresin.
Wherein, the material of the metal layer is selected from copper, aluminium, silver or gold.
It is of the invention using silica gel plate as the manufacturing method of the etched circuit board of substrate, further include step are as follows:
Step H: it when needing to encapsulate, is then formed on the metal layer above the functional circuit of other electronic components through an envelope
Mounting mechanism application silica gel is packaged, to form a packaging silicon rubber layer above the functional circuit.
The invention has the benefit that silica gel substrate ductility with higher of the invention and can flexility, Ke Yinai
200 DEG C or more of high temperature can have quite high chemical stability with waterproof, solar heat protection, be not easy the physiological tissue with arround and generate
Reaction, can be used in different working environments.
Detailed description of the invention
Fig. 1 shows the schematic cross-section of the printed circuit board of the prior art；
Fig. 2A shows the schematic cross-section of component combination of the invention；
Fig. 2 B shows the stereoscopic schematic diagram of component combination of the invention；
Fig. 3 shows the manufacturing method flow chart of application etching of the invention；
Fig. 4 shows the manufacture schematic diagram of application etching of the invention；
Fig. 5 shows the manufacturing method flow chart of the invention using screen painting；
Fig. 6 shows the manufacture schematic diagram of the invention using screen painting.
Description of symbols
(prior art)
10 ' substrates
20 ' adhesion layers
30 ' metal layers
40 ' silica gel
(present invention)
1 idler wheel
2 idler wheels
10 silica gel substrates
20 adhesion layers
30 metal layers
35 electronic components
37 functional circuits
40 packaging silicon rubber layers
50 prototype circuit plates
60 integrated sheets
100 silica gel former material charging baskets
110 material coater units
121 first bake and bank up with earth unit
122 second bake and bank up with earth unit
130 metal materials attach unit
140 etching grooves
150 packaging mechanisms
160 web plate extra cells
161 web plates
165 hollow parts
170 ink units
171 metal inks.
Specific embodiment
Now careful just structure composition and the effect and advantage of can be generated of the invention, cooperation attached drawing, according to the present invention one
Detailed description are as follows for preferred embodiment.
Please refer to shown in Fig. 2A to Fig. 4, show it is of the invention using silica gel plate as the circuit board of substrate, including following group
Part:
One silica gel substrate 10 (as shown in Figure 2 A and 2 B), the material using silica gel as circuit board.Silica gel was compared to previously making
PET sheet ductility with higher and can flexility, and can be with resistance to 200 DEG C or more of high temperature.
One adhesion layer 20 is attached on the silica gel substrate 10, wherein the material of the adhesion layer 20 include: organosilicon polyester,
Copolymer resins, ethyl acetate and organic siliconresin.
One metal layer 30 is a metal former material or metallic circuit, wherein can then lead to when the metal layer 30 is metal former material
Overetch and form the metallic circuit of etching or form the metallic circuit of printing by screen painting, which is attached to
20 top of adhesion layer.Wherein, the material of the metal layer 30 is the metals such as copper, aluminium, silver, gold.It, can be in the gold when practical application
Belong to other electronic components 35 (what is shown in Fig. 2A is only used as signal) required for configuration on layer 30, and is integrally formed one
Functional circuit 37.
When if necessary to encapsulate, then the invention also includes a packaging silicon rubber layers 40, are located at the metal layer 30 and associated electrical
Part 35 is formed by 37 top of functional circuit, is formed by circuit to encapsulate the metal layer 30.
As shown in Figures 3 and 4, using silica gel rectangular description of the process at etched circuit board thereon for substrate in the present invention
It is as follows:
It takes a metal layer 30 to be used in case of in formation circuit backward, and the metal layer 30 is imported into adhesion material coater unit 110,
And the one side that adhesion material is coated on the metal layer 30 is formed into 20 (step 802) of an adhesion layer；
The guiding of metal layer 30 one first with the adhesion layer 20 is baked and banked up with earth into unit 121 again, and by the metal layer 30 and this stick together
Layer 20 is toasted (step 804)；
Silica gel former material in silica gel former material charging basket 100 is imported between two idler wheels 1 of film-discharging machine, needed for being formed by rolling
Thickness, and form 10 (step 806) of silica gel substrate；
The silica gel substrate 10 is imported into metal material by the guiding of idler wheel 2 and conveyer belt (not shown) again and attaches unit
130, while the metal layer 30 by toasted mistake with the adhesion layer 20 imports the metal material and attaches unit 130, and by the gold
Belong to that layer 30 is pasted with the adhesion layer 20 attaches to 10 top of the silica gel substrate on one side, and 50 (step of a prototype circuit plate is integrally formed
It is rapid 810)；
The prototype circuit plate 50 guiding one second is baked and banked up with earth into unit 122 again, and the prototype circuit plate 50 is toasted into (step
820)；
Wherein, the prototype circuit plate 50 can plate-like or web-like form be used as storage or transport, drawn again when needing
It puts down to carry out the processes such as subsequent circuit formation or encapsulation.
The prototype circuit plate 50 toasted is then etched (step 840) into etching groove 140, wherein made
Etching solution is alkaline etching liquid or acidic etching liquid, such as copper chloride of alkalinity or the copper chloride of acidity；
The prototype circuit plate 50 after etching is then subjected to other circuit forming step (steps 850) again, this is existing skill
Known in art, the present invention repeats no more its details；
When needing to encapsulate, then other electronic components 35 are formed on the metal layer 30, and (what is shown in figure is only used as signal
With) functional circuit 37 above be packaged using silica gel by a packaging mechanism 150, to be formed above the functional circuit 37
One packaging silicon rubber layer, 40 (step 860).
As shown in Figures 5 and 6, using silica gel rectangular description of the process at printed circuit board thereon for substrate in the present invention
It is as follows:
Silica gel former material in silica gel former material charging basket 100 is imported between two idler wheels 1 of film-discharging machine, needed for being formed by rolling
Thickness, and form 10 (step 906) of silica gel substrate；
The silica gel substrate 10 is imported into adhesion material coater unit by the guiding of idler wheel 2 and conveyer belt (not shown) again
110, and adhesion material is coated on the silica gel substrate 10 and forms 20 (step 907) of an adhesion layer；
The guiding of silica gel substrate 10 one first with the adhesion layer 20 is baked and banked up with earth into unit 121 again, and by the silica gel substrate 10 and is somebody's turn to do
Adhesion layer 20 is toasted (step 908)；
Again by the silica gel substrate 10 and the adhesion layer 20 one web plate extra cell 160 of importing through overbaking, and in the adhesion layer
20 tops attach Internet tablet 161, form an integrated sheet 60；Wherein, there is hollow part 165 on the web plate 161, the hollow part 165
As circuit configuration (the step 909) of back segment circuit to be formed.
The integrated sheet 60 with web plate 161 is then transported to an ink unit 170, in the hollow out of the web plate 161
Metal ink 171 in place 165, then removes the web plate 161, and the metal ink 171 left forms a metal layer 30, as
The circuit of printing；Wherein, the metal layer 30 and the silica gel substrate 10 and the adhesion layer 20 form 50 (step of a prototype circuit plate
910).Wherein, which can be copper, aluminium, silver, gold etc. and is suitable for doing the metal material of circuit.
The prototype circuit plate 50 guiding one second is baked and banked up with earth into unit 122 again, and the prototype circuit plate 50 is toasted into (step
It is rapid 911)；
When needing to encapsulate, then other electronic components 35 are formed on the metal layer 30, and (what is shown in figure is only used as signal
With) functional circuit 37 above be packaged using silica gel by a packaging mechanism 150, to be formed above the functional circuit 37
One packaging silicon rubber layer, 40 (step 912).
In the present invention, conventionally used PET sheet or PI plate are replaced using silica gel substrate, silica gel is compared to previously used
PET sheet ductility with higher and can flexility, and can flexing, it is possible to used as around curved circuit board, and
Just it applies in many different environment.Silica gel is advanced low-k materials, is very suitable to be fabricated to the wireless interlock circuit such as antenna
Substrate.In addition, silica gel substrate can be with resistance to 200 DEG C or more of high temperature, so can be used in an environment of high temperature, such as in medicine
On use, when needing to carry out high-temperature sterilization, temperature is often higher than 160 DEG C, and traditional PET sheet or PI plate is unbearable
This high temperature, but silica gel substrate of the invention can bear the high temperature.In addition, silica gel substrate can be with waterproof, solar heat protection, so can fit
It should be in different operating environments, so quite convenient when production.Silica gel substrate has quite high chemical stability, is not easy and week
The physiological tissue of incident generates reaction, therefore can readily be used in the application of biology, the especially manufacture of biochip.
In conclusion the design of consideration of present invention hommization, quite meets actual demand.Its specific improvement prior art
Disadvantage obviously has the advantages that breakthrough progress compared to the prior art, the enhancement that has effects that really, and non-is easy to reach.
The present invention be not disclosed in domestic and external document in the market, had met patent statute.
Above-mentioned detailed description is illustrating for a possible embodiments of the invention, and still, which not uses
It is all without departing from equivalence enforcement made by technical spirit of the present invention or change to limit scope of patent protection of the invention, it should all wrap
It includes in the scope of the patents of the invention.
Claims (11)
1. a kind of using silica gel plate as the circuit board of substrate characterized by comprising
One silica gel substrate, the material using silica gel as circuit board；
One adhesion layer is attached on the silica gel substrate；And
One metal layer is a metal former material or metallic circuit；The metal layer is attached to above the adhesion layer.
2. as described in claim 1 using silica gel plate as the circuit board of substrate, which is characterized in that the metal layer passes through etching
Form the metallic circuit of etching.
3. as claimed in claim 2 using silica gel plate as the circuit board of substrate, which is characterized in that form institute on the metal layer
The other electronic components needed, and a functional circuit is integrally formed.
4. as claimed in claim 1 or 2 using silica gel plate as the circuit board of substrate, which is characterized in that the material of the adhesion layer
It include: organosilicon polyester, copolymer resins, ethyl acetate and organic siliconresin.
5. as claimed in claim 3 using silica gel plate as the circuit board of substrate, which is characterized in that further include a packaging silicon rubber
Layer, is formed by above functional circuit positioned at the metal layer and associated electrical part, is formed by circuit to encapsulate the metal layer.
6. a kind of using silica gel plate as the manufacturing method of the etched circuit board of substrate, characterized in that it comprises the following steps:
Step A: taking a metal layer to be used in case of in formation circuit backward, and the metal layer imported adhesion material coater unit,
And the one side that adhesion material is coated on the metal layer is formed into an adhesion layer；
Step B: baking and banking up with earth unit for the metal layer guiding one first with the adhesion layer again, and by the metal layer and the adhesion layer into
Row baking；
Step C: the silica gel former material in silica gel former material charging basket is imported between two idler wheels of film-discharging machine, institute is formed by rolling
The thickness needed, and form silica gel substrate；
Step D: the silica gel substrate is imported into metal material by idler wheel again and attaches unit, while having toasted mistake
The metal layer of the adhesion layer imports the metal material and attaches unit, and attaches to this on one side for what the metal layer was pasted with the adhesion layer
Above silica gel substrate, a prototype circuit plate is integrally formed；
Step E: prototype circuit plate guiding one second is baked and banked up with earth into unit again, and the prototype circuit plate is toasted；
Step F: the prototype circuit plate toasted is then entered into etching groove and is etched；
Step G: the prototype circuit plate after etching is then subjected to other circuit forming step again.
7. as claimed in claim 6 using silica gel plate as the manufacturing method of the etched circuit board of substrate, which is characterized in that at this
It is alkaline etching liquid or acidic etching liquid that prototype circuit plate, which enters used etching solution when etching groove is etched,.
8. as claimed in claim 7 using silica gel plate as the manufacturing method of the etched circuit board of substrate, which is characterized in that the erosion
Carve the copper chloride of the copper chloride that liquid is alkalinity or acidity.
9. as claimed in claim 6 using silica gel plate as the manufacturing method of the etched circuit board of substrate, which is characterized in that this is glutinous
The material of layer include: organosilicon polyester, copolymer resins, ethyl acetate and organic siliconresin.
10. as claimed in claim 6 using silica gel plate as the manufacturing method of the etched circuit board of substrate, which is characterized in that should
The material of metal layer is selected from copper, aluminium, silver or gold.
11. as claimed in claim 6 using silica gel plate as the manufacturing method of the etched circuit board of substrate, which is characterized in that also
Including step are as follows:
Step H: it when needing to encapsulate, is then formed on the metal layer above the functional circuit of other electronic components through an envelope
Mounting mechanism application silica gel is packaged, to form a packaging silicon rubber layer above the functional circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710532129.0A CN109219238A (en) | 2017-07-03 | 2017-07-03 | Using silica gel plate as the circuit board of substrate and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710532129.0A CN109219238A (en) | 2017-07-03 | 2017-07-03 | Using silica gel plate as the circuit board of substrate and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109219238A true CN109219238A (en) | 2019-01-15 |
Family
ID=64991784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710532129.0A Pending CN109219238A (en) | 2017-07-03 | 2017-07-03 | Using silica gel plate as the circuit board of substrate and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109219238A (en) |
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Application publication date: 20190115 |