CN103260333A - PCB capable of being bent by 360 degrees and preparation method thereof - Google Patents
PCB capable of being bent by 360 degrees and preparation method thereof Download PDFInfo
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- CN103260333A CN103260333A CN 201310148274 CN201310148274A CN103260333A CN 103260333 A CN103260333 A CN 103260333A CN 201310148274 CN201310148274 CN 201310148274 CN 201310148274 A CN201310148274 A CN 201310148274A CN 103260333 A CN103260333 A CN 103260333A
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Abstract
The invention discloses a PCB capable of being bent by 360 degrees and a preparation method of the PCB capable of being bent by 360 degrees. The PCB capable of being bent by 360 degrees comprises a first layer, a second layer, a third layer, a fourth layer and a fifth layer, wherein the second layer is arranged at the lower end of the first layer, the third layer is arranged at the lower end of the second layer, the fourth layer is arranged at the lower end of the third layer, the fifth layer is arranged at the lower end of the fourth layer, the first layer is silica gel, the second layer is high temperature resistance cloth, the third layer is silica gel, surface mount devices are mounted at the upper end of the fourth layer after coating and circuit printing are carried out at the upper end of the fourth layer, and the fifth layer is silica gel. Materials of the PCB capable of being bent by 360 degrees are all soft materials, the PCB capable of being bent by 360 degrees has good deformability, the high temperature resistance cloth mainly has the advantages of being low in density, and large in longitude and latitude, and having a certain malleability. Meanwhile, the PCB capable of being bent by 360 degrees is pulling-resistant, free of any breakage situation, and good in attaching performance, and meets the requirement for electrification, and therefore the PCB capable of being bent by 360 degrees can achieve bending by 360 degrees.
Description
Technical field
The present invention relates to a kind of can 360 pcb board of curving of degree and preparation method thereof, belong to the electronic circuit board field.
Background technology
Existing P CB plate is mainly with Copper Foil version or PET manufacture of materials, and its ductility extreme difference is non-deformable, the requirement of incompatible three-dimensional conduction, and stickiness is poor.
Summary of the invention
Technical problem to be solved by this invention provide a kind of have good deformability a kind of can 360 pcb board of curving of degree and preparation method thereof.
The present invention is achieved through the following technical solutions: a kind of can 360 the pcb board that curves of degree, mainly comprise ground floor, and be arranged on the second layer of ground floor lower end, and be arranged on the 3rd layer of second layer lower end, and be arranged on the 4th layer of the 3rd layer of lower end, and be arranged on the layer 5 of the 4th layer of lower end, described ground floor is silicone (silica gel), the described second layer is high temperature resistant cloth, described the 3rd layer is silicone, described the 4th layer is carried out paster after coating and printed wire are carried out in the upper end, described layer 5 is silicone.
As a kind of preferred version, spilt conductive metal powder on described the 3rd layer.
A kind of can 360 the manufacture method of the pcb board that curves of degree, may further comprise the steps:
Step 1 is handled the advanced electroplating of pcb board;
Step 2 is carried out polish-brush to each laminate material, and it is carried out clean;
Step 3 after having cleaned, is carried out pressing with five laminate material, to form pcb board;
Step 4 is made outer-layer circuit on the plate of ground floor, and the pcb board after pressing attaches one deck dry film etching resistance agent;
Step 5 is carried out drying operation to pcb board, and its bake out temperature is generally at 120 ℃.
The invention has the beneficial effects as follows: material of the present invention is all flexible material, has good deformability, and its main feature density of high temperature resistant cloth is little, longitude and latitude big, have certain ductility.Simultaneously anti-pull, can not
Any crack conditions occurs, stickiness is good, satisfies the demand of energising, curves so can realize 360 degree.
Description of drawings
In order to be easy to explanation, the present invention is done to describe in detail by following specific embodiment and accompanying drawing.
Fig. 1 for the present invention can 360 the internal structure schematic diagram of the pcb board that curves of degree.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment this outbreak is further described in detail, but can not limit protection scope of the present invention with this.
With reference to shown in Figure 1, of the present invention a kind of can 360 the pcb board that curves of degree, mainly comprise ground floor 1, and be arranged on the second layer 2 of ground floor 1 lower end, and be arranged on the 3rd layer 3 of the second layer 2 lower ends, and be arranged on the 4th layer 4 of the 3rd layer of 3 lower end, and be arranged on the layer 55 of the 4th layer of 4 lower end, described ground floor 1 is silicone (silica gel), the described second layer 2 is high temperature resistant cloth, described the 3rd layer 3 is silicone, and described the 4th layer 4 is carried out paster after coating and printed wire are carried out in the upper end, and described layer 55 is silicone.
Silicone is more stable under less than 150 ℃ situation, dissolving can not occur, and the temperature of printing back oven dry is generally at 120 ℃, so have feasibility.
Spilt conductive metal powder on described the 3rd layer.
The pcb board manufacture method may further comprise the steps:
Step 1 is handled the advanced electroplating of pcb board;
Step 2 is carried out polish-brush to each laminate material, and it is carried out clean;
Step 3 after having cleaned, is carried out pressing with five laminate material, to form pcb board;
Step 4 is made outer-layer circuit on the plate of ground floor, and the pcb board after pressing attaches one deck dry film etching resistance agent;
Step 5 is carried out drying operation to pcb board, and its bake out temperature is generally at 120 ℃.
The invention has the beneficial effects as follows: material of the present invention is all flexible material, has good deformability, and its main feature density of high temperature resistant cloth is little, longitude and latitude big, have certain ductility.Simultaneously anti-pull, any crack conditions can not appear, and stickiness is good, satisfies the demand of energising, curves so can realize 360 degree.
The above only is the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, and any variation or replacement of expecting without creative work all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range that claims were limited.
Claims (3)
- One kind can 360 the pcb board that curves of degree, it is characterized in that: mainly comprise ground floor, and be arranged on the second layer of ground floor lower end, and be arranged on the 3rd layer of second layer lower end, and be arranged on the 4th layer of the 3rd layer of lower end, and be arranged on the layer 5 of the 4th layer of lower end, described ground floor is silicone (silica gel), and the described second layer is high temperature resistant cloth, and described the 3rd layer is silicone, described the 4th layer is carried out paster after coating and printed wire are carried out in the upper end, described layer 5 is silicone.
- According to claim 1 can 360 the pcb board that curves of degree, it is characterized in that: spilt conductive metal powder on described the 3rd layer.
- One kind can 360 the manufacture method of the pcb board that curves of degree, it is characterized in that: may further comprise the steps:Step 1 is handled the advanced electroplating of pcb board;Step 2 is carried out polish-brush to each laminate material, and it is carried out clean;Step 3 after having cleaned, is carried out pressing with five laminate material, to form pcb board;Step 4 is made outer-layer circuit on the plate of ground floor, and the pcb board after pressing attaches one deck dry film etching resistance agent;Step 5 is carried out drying operation to pcb board, and its bake out temperature is generally at 120 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201310148274 CN103260333A (en) | 2013-04-24 | 2013-04-24 | PCB capable of being bent by 360 degrees and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201310148274 CN103260333A (en) | 2013-04-24 | 2013-04-24 | PCB capable of being bent by 360 degrees and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103260333A true CN103260333A (en) | 2013-08-21 |
Family
ID=48963948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201310148274 Pending CN103260333A (en) | 2013-04-24 | 2013-04-24 | PCB capable of being bent by 360 degrees and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103260333A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109219238A (en) * | 2017-07-03 | 2019-01-15 | 张文耀 | Using silica gel plate as the circuit board of substrate and its manufacturing method |
| CN109219237A (en) * | 2017-07-03 | 2019-01-15 | 张文耀 | Using silica gel plate as the circuit board of substrate and its manufacturing method |
-
2013
- 2013-04-24 CN CN 201310148274 patent/CN103260333A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109219238A (en) * | 2017-07-03 | 2019-01-15 | 张文耀 | Using silica gel plate as the circuit board of substrate and its manufacturing method |
| CN109219237A (en) * | 2017-07-03 | 2019-01-15 | 张文耀 | Using silica gel plate as the circuit board of substrate and its manufacturing method |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130821 |
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| RJ01 | Rejection of invention patent application after publication |