TW202005006A - Singulated electronic substrates on a flexible or rigid carrier and related methods - Google Patents

Abstract

Embodiments of the disclosure relate to a method for creating a strip of electronic substrates. In the method, a ribbon of ceramic substrate is provided. The ceramic substrate defines a thickness of no more than 200 [mu]m between a first outer surface and a second outer surface opposite of the first outer surface. A conductive layer is applied to at least one of the first outer surface or the second outer surface of the ceramic substrate. The electronic substrate can then either be singulated into individual slabs and attached to a flexible carrier in a roll-to-roll fashion or divided into panels and attached to a rigid carrier where the electronic substrate is singluated into individual slabs. Additionally, embodiments of a roll of electronic substrates and embodiments of a carrier system for electronic substrates are provided.

Description

在撓性或剛性載具上的單分電子基板及相關方法Single-division electronic substrate on flexible or rigid carrier and related method

本申請案主張在2018年5月17日申請之美國臨時申請案第62/672,844號之優先權權益，該案之內容係本文之依據且以全文引用之方式併入本文中，如同下文所全面闡述的。This application claims the priority interest in US Provisional Application No. 62/672,844 filed on May 17, 2018. The content of this case is the basis of this article and is incorporated by reference in its entirety, as fully described below Elaborated.

本發明大體上係關於一用於製造電子基板之方法，且特定而言，係關於一種以捲對捲格式生產一電子基板條帶的方法，及一連續地形成電子基板且將面板中之電子基板附接至一剛性載具的方法。The present invention generally relates to a method for manufacturing an electronic substrate, and in particular, relates to a method for producing an electronic substrate strip in a roll-to-roll format, and a method of continuously forming an electronic substrate and converting electrons in a panel A method of attaching a substrate to a rigid carrier.

具有聚合基板之個別電子基板常常形成為一圓形晶圓上所含之大群組之部分，該圓形晶圓通常具有在200 mm至300 mm範圍內之一直徑。接著將包含該晶圓的電子基板之該群組切塊成該等個別電子基板。在需要大量電子基板之應用中，該等電子基板經附接至一捲式條帶以易於在消費端分配。然而，自晶圓產生電子基板係一批式程序，而將電子基板附接至一條帶通常係一連續程序。由於處理技術及速度上之差異，常常出現整個程序中之破壞。另外，提供電子基板之晶圓或面板中所涉及之材料及程序限制可生產的晶圓及面板之大小，由此藉由限制可形成於晶圓或基板上或形成晶圓或基板的電子基板之數目來進一步阻礙處理速度。Individual electronic substrates with polymeric substrates are often formed as part of a large group contained on a round wafer, which usually has a diameter in the range of 200 mm to 300 mm. Then, the group of electronic substrates including the wafer is diced into the individual electronic substrates. In applications requiring a large number of electronic substrates, these electronic substrates are attached to a roll of tape for easy distribution at the consumer end. However, generating an electronic substrate from a wafer is a batch process, and attaching an electronic substrate to a strip is usually a continuous process. Due to differences in processing techniques and speeds, destruction throughout the program often occurs. In addition, the materials and procedures involved in providing wafers or panels for electronic substrates limit the size of the wafers and panels that can be produced, thereby limiting the electronic substrates that can be formed on or forming the wafers or substrates by limiting Number to further hinder processing speed.

在一個態樣中，本發明之實施例係關於一產生一電子基板條帶之方法。在該方法中，提供陶瓷基板之一帶狀物，其中該陶瓷基板界定一第一外表面與一第二外表面之間的不超過200 μm之一厚度，該第二外表面與該第一外表面相反。貫穿該陶瓷基板之該厚度形成至少一個通孔。此外，將一第一導電層塗覆至該第一外表面，且將一第二導電層塗覆至該第二外表面，使得經由該至少一個通孔在該第一外表面與該第二外表面之間建立電連通。在該方法中，以一連續方式執行提供、形成及塗覆之該等步驟。In one aspect, an embodiment of the invention relates to a method of generating an electronic substrate strip. In this method, a ribbon of a ceramic substrate is provided, wherein the ceramic substrate defines a thickness of not more than 200 μm between a first outer surface and a second outer surface, the second outer surface and the first The outer surface is opposite. At least one through hole is formed through the thickness of the ceramic substrate. In addition, a first conductive layer is applied to the first outer surface, and a second conductive layer is applied to the second outer surface, so that the first outer surface and the second Electrical communication is established between the outer surfaces. In this method, the steps of providing, forming, and coating are performed in a continuous manner.

在另一態樣中，本發明之實施例係關於一種電子基板之卷狀物。該卷狀物包括複數個電子基板，該複數個電子基板各自具有一陶瓷基板。該卷狀物亦包括一聚合載具條帶，該複數個電子基板係黏附在該聚合載具上。每一陶瓷基板具有一第一厚度及一第一撓曲剛性，且該聚合載具條帶具有一第二厚度及一第二撓曲剛性。該第一厚度小於該第二厚度，且該第一撓曲剛性係該第二撓曲剛性之至少五倍。In another aspect, the embodiments of the present invention relate to a roll of electronic substrates. The roll includes a plurality of electronic substrates, each of which has a ceramic substrate. The roll also includes a polymeric carrier strip, and the plurality of electronic substrates are adhered to the polymeric carrier. Each ceramic substrate has a first thickness and a first flexural rigidity, and the polymeric carrier strip has a second thickness and a second flexural rigidity. The first thickness is smaller than the second thickness, and the first flexural rigidity is at least five times the second flexural rigidity.

在另一態樣中，本發明之實施例係關於一種用於電子基板之載具系統。該載具系統包括一載具及複數個板條，該複數個板條經由一黏著劑層附接至該載具。該複數個板條中之每一者包括一陶瓷基板，該陶瓷基板具有小於200 µm之一厚度。此外，該複數個板條係自具有一矩形形狀之一面板單分，該面板具有大於200 mm之一長度或一寬度中之至少一者。In another aspect, the embodiments of the present invention relate to a carrier system for electronic substrates. The carrier system includes a carrier and a plurality of slats, which are attached to the carrier via an adhesive layer. Each of the plurality of slats includes a ceramic substrate having a thickness of less than 200 µm. In addition, the plurality of slats are divided from a panel having a rectangular shape, the panel having at least one of a length or a width greater than 200 mm.

額外特徵及優點將在隨後之詳細描述中闡述，且將自說明書部分地對熟習此項技術者顯而易見或藉由實踐如所寫之說明書及其申請專利範圍以及隨附圖式中所描述的實施例而認可。Additional features and advantages will be set forth in the detailed description that follows, and will be partially apparent to those skilled in the art from the description or by practicing the description as written and its patent application scope and implementation described in the accompanying drawings Routinely recognized.

將理解，先前一般描述及下文的詳細描述兩者僅為例示性的，且意欲提供概述或架構以理解技術方案之性質及特性。It will be understood that both the previous general description and the detailed description below are merely exemplary, and are intended to provide an overview or architecture to understand the nature and characteristics of the technical solutions.

提供附圖以提供進一步理解，且該等附圖係併入本說明書中且構成本說明書之一部分。該等圖圖示一或多個實例，且與描述一起用以解釋各種實施例之原理及操作。The drawings are provided to provide further understanding, and these drawings are incorporated in and constitute a part of this specification. The drawings illustrate one or more examples, and together with the description serve to explain the principles and operations of various embodiments.

本發明之實施例係關於一種準備單分電子基板之條帶的方法。在特定實施例中，該方法係以一捲對捲方式執行。換言之，每一製造步驟係按連續且順序之步驟自原材料之初始卷(諸如陶瓷基板之帶狀物)執行至最後的單分電子基板，該等電子基板附接至一條帶且捲在一捲軸上，該捲軸經交付至消費者。捲對捲製造方法具有降低特定電子基板、尤其習知地利用聚合基板之電子基板(諸如印刷電路板)之封裝成本的可能。特定而言，捲對捲製造方法消除對分批生產之電子基板之較大基板進行切塊的需要。在另一特定實施例中，電子基板之形成係以連續方式執行，其中諸如陶瓷基板之帶狀物的原材料之初始卷經連續處理，以添加功能元件，諸如通孔、圖案化之導電層、焊料連接等。接著，將陶瓷基板切割成面板，且將陶瓷基板附接至一剛性載具，且在該剛性載具上，該等面板經單分成個別電子基板。電子基板係設置在剛性面板上的實施例可利用用於自此等電子基板製造電子基板的特定現有技術更好地操作。在本文中提供該方法及根據該方法生產之電子基板的多種實施例。此等實施例僅以舉例之方式而非限制方式呈現。The embodiment of the invention relates to a method for preparing a strip of a single-division electronic substrate. In certain embodiments, the method is performed on a roll-to-roll basis. In other words, each manufacturing step is performed in a continuous and sequential step from the initial roll of raw materials (such as a ribbon of ceramic substrates) to the final single-division electronic substrate, which are attached to a strip and wound on a reel On, the reel is delivered to consumers. The roll-to-roll manufacturing method has the potential to reduce the packaging cost of certain electronic substrates, especially electronic substrates (such as printed circuit boards) that conventionally utilize polymer substrates. In particular, the roll-to-roll manufacturing method eliminates the need to dice larger substrates of electronic substrates produced in batches. In another particular embodiment, the formation of the electronic substrate is performed in a continuous manner, where the initial roll of raw material such as a ribbon of ceramic substrate is continuously processed to add functional elements such as through holes, patterned conductive layers, Solder connection, etc. Next, the ceramic substrate is cut into panels, and the ceramic substrate is attached to a rigid carrier, and on the rigid carrier, the panels are singulated into individual electronic substrates. The embodiment in which the electronic substrate is provided on the rigid panel can be better operated using the specific existing technology for manufacturing electronic substrates from such electronic substrates. Various embodiments of the method and the electronic substrate produced according to the method are provided herein. These embodiments are presented by way of example only and not limitation.

為了介紹處理步驟，將首先描述安裝在載具上的完成之電子部件。特定而言，第1圖描繪包括載具12之條帶10，數個板條14安置於該載具上。如本文中所使用，「板條」係指單分的薄陶瓷基板材料。此等板條可包括沉積在陶瓷材料之一側或兩側上之功能添加件，諸如導電性電路圖案、電阻器、電容器等。因此，該等板條係上面可建造電子部件之電子基板。一般而言，此等板條在厚度上小於200 μm，具有小於100 mm之長度，且具有小於100 mm之寬度。該等板條14由陶瓷基板16組成，該陶瓷基板具有安置於陶瓷基板16之頂側及/或底側上的圖案化之導電層18。在實施例中，該等導電層18係使用充滿導電材料22之通孔20連接。因此，在實施例中，在陶瓷基板16之頂側上的圖案化之導電層18與在陶瓷基板16之底側上的圖案化之導電層18電連通。該等板條14係用臨時黏著劑24附接至載具12。在特定實施例中，該等板條14被保護膜26覆蓋。To introduce the processing steps, the completed electronic components mounted on the carrier will be described first. In particular, Figure 1 depicts a strip 10 including a carrier 12, on which a number of slats 14 are placed. As used herein, "slat" refers to a monolithic thin ceramic substrate material. These slats may include functional additions deposited on one or both sides of the ceramic material, such as conductive circuit patterns, resistors, capacitors, etc. Therefore, the slats are electronic substrates on which electronic components can be built. Generally speaking, these slats are less than 200 μm in thickness, have a length of less than 100 mm, and have a width of less than 100 mm. The slats 14 are composed of a ceramic substrate 16 having a patterned conductive layer 18 disposed on the top side and/or bottom side of the ceramic substrate 16. In an embodiment, the conductive layers 18 are connected using vias 20 filled with conductive material 22. Therefore, in the embodiment, the patterned conductive layer 18 on the top side of the ceramic substrate 16 is in electrical communication with the patterned conductive layer 18 on the bottom side of the ceramic substrate 16. These slats 14 are attached to the carrier 12 with a temporary adhesive 24. In certain embodiments, the slats 14 are covered by a protective film 26.

如在描繪條帶10 (無保護膜26)之俯視圖的第2圖中可見，該等板條14係沿著載具12之長度L配置。在實施例中，長度L為數公尺或數百公尺。舉例而言，長度L可為至少10 m長、至少50 m長或至少100 m長，且此外，在實施例中，長度L可為至多500 m長。多個板條14亦可跨載具12之寬度W定位(如第1圖中亦圖示)。在實施例中，寬度W為至少25 mm寬，且在實施例中，寬度W為至多48 mm寬、至多75 mm寬、至多100 mm寬，或至多150 mm寬，或至多300 mm寬。在一特定實施例中，載具12之寬度W為100 mm寬。載具12上之該等板條14以一預定量彼此間隔。在實施例中，空間之預定量為0.1 mm或更小，且在其他實施例中，空間之預定量為20 µm或更小。以具有寬度25 mm之載具12、具有1.2 mm之長度及寬度之板條14及板條14之間的0.1 mm的間距作為一實例，條帶10將每公尺具有14,611個板條(跨寬度之19個板條 × 沿著長度之769 = 14,611個板條)。因此，長100 m之條帶10可固持1.46百萬個板條。As can be seen in the second diagram depicting the top view of the strip 10 (without the protective film 26), the slats 14 are arranged along the length L of the carrier 12. In the embodiment, the length L is several meters or hundreds of meters. For example, the length L may be at least 10 m long, at least 50 m long, or at least 100 m long, and further, in an embodiment, the length L may be at most 500 m long. The plurality of slats 14 can also be positioned across the width W of the carrier 12 (as also shown in Figure 1). In an embodiment, the width W is at least 25 mm wide, and in an embodiment, the width W is at most 48 mm wide, at most 75 mm wide, at most 100 mm wide, or at most 150 mm wide, or at most 300 mm wide. In a specific embodiment, the width W of the carrier 12 is 100 mm wide. The slats 14 on the carrier 12 are spaced apart from each other by a predetermined amount. In an embodiment, the predetermined amount of space is 0.1 mm or less, and in other embodiments, the predetermined amount of space is 20 µm or less. Taking the carrier 12 having a width of 25 mm, the slats 14 having a length and width of 1.2 mm, and the 0.1 mm spacing between the slats 14 as an example, the strip 10 will have 14,611 slats (span 19 slats of width × 769 = 14,611 slats along the length). Therefore, a strip 10 with a length of 100 m can hold 1.46 million slats.

條帶10可固持的板條14之數目取決於該等板條14之大小。此外，該大小可視特定應用而大範圍變化，且因此，該等板條14可按批大小來量化。在條帶10上，可做出標記以表明板條14之每一批次，此使生產追蹤更容易。下文的表1提供用於含有各種類型之板條14的各種大小之條帶10的例示性批大小。 表1.關於撓性載具配置之例示性板條

The number of slats 14 that the strip 10 can hold depends on the size of the slats 14. In addition, the size can vary widely depending on the specific application, and therefore, the slats 14 can be quantified by batch size. On the strip 10, marks can be made to indicate each batch of slats 14, which makes production tracking easier. Table 1 below provides exemplary batch sizes for strips 10 of various sizes containing various types of slats 14. Table 1. Exemplary slats for flexible vehicle configuration

在已描述條帶10之部件後，現在提供用於建構條帶之方法的實施例。在特定實施例中，在單一處理線上以「捲對捲」形式建構條帶10；換言之，在一連續製程中建構板條14且將板條14附接至載具12，該連續製程以陶瓷基板16之帶狀物開始且以完成之條帶10的卷結束。然而，在其他實施例中，該方法並不連續，且可跨兩個或更多個處理線進行該方法之特定步驟。After the components of the strip 10 have been described, an embodiment of a method for constructing a strip is now provided. In a particular embodiment, the strip 10 is constructed in a "roll-to-roll" form on a single processing line; in other words, the slats 14 are constructed and attached to the carrier 12 in a continuous process that uses ceramic The webbing of the substrate 16 starts and ends with the finished roll of tape 10. However, in other embodiments, the method is not continuous, and specific steps of the method can be performed across two or more processing lines.

如所提及，該方法以自陶瓷基板16之一帶狀物建構板條14開始。在實施例中，陶瓷基板16係燒結型氧化鋁、部分穩定或完全穩定之氧化鋯、鈦酸鹽類(尤其針對電容器應用)、鐵酸鹽類(尤其針對涉及磁屏蔽之應用)或另一陶瓷材料。應注意，在製造期間，多個板條14可跨陶瓷基板16之寬度以及沿著陶瓷基板16之長度形成。如下文將論述，個別板條14係自陶瓷基板16之帶狀物單分。在實施例中，陶瓷基板16之帶狀物具有不超過200 µm之厚度。在另一實施例中，陶瓷基板16之帶狀物具有不超過100 µm之厚度，且在又一實施例中，陶瓷基板16之帶狀物具有至少10 µm之厚度。在一特定實施例中，陶瓷基板16具有40 µm之厚度。As mentioned, the method starts by constructing the slat 14 from a ribbon of the ceramic substrate 16. In an embodiment, the ceramic substrate 16 is sintered alumina, partially stabilized or fully stabilized zirconia, titanates (especially for capacitor applications), ferrites (especially for applications involving magnetic shielding), or another Ceramic material. It should be noted that during manufacturing, a plurality of slats 14 may be formed across the width of the ceramic substrate 16 and along the length of the ceramic substrate 16. As will be discussed below, the individual slats 14 are separated from the ribbon of the ceramic substrate 16. In an embodiment, the ribbon of the ceramic substrate 16 has a thickness not exceeding 200 µm. In another embodiment, the ribbon of the ceramic substrate 16 has a thickness not exceeding 100 µm, and in yet another embodiment, the ribbon of the ceramic substrate 16 has a thickness of at least 10 µm. In a specific embodiment, the ceramic substrate 16 has a thickness of 40 µm.

在諸如第3圖之流程圖中所示之實施例的方法100之實施例中，在第一步驟101中，在陶瓷基板16中形成通孔20。在實施例中，通孔20係使用一雷射剝蝕製程形成。在特定實施例中，該雷射剝蝕製程使用奈秒或更快的雷射脈衝，此提供清潔(即，表面光滑之)孔且對陶瓷基板16之強度沒有顯著影響。在其他實施例中，諸如液體蝕刻或反應離子蝕刻之化學製程可在藉由雷射破壞製程或藉由光微影術判定孔的位置之後使用。在形成通孔20之後，可視情況用一黏合層(未示出)塗佈該陶瓷基板。該黏合層係幫助將導電層18黏附至陶瓷基板16的薄層(例如，厚度為100 nm至500 nm)。在實施例中，該黏合層係鈦、鎢、鈦-鎢合金、氮化鈦、鉭、氮化鉭、鉻或鉻-銅合金中之一者。在此可選第二步驟102中，可使用一連續濺鍍製程來塗覆該黏合層，在該連續濺鍍製程中，陶瓷基板16行進穿過一濺鍍腔室，陶瓷基板16之頂側及/或底側在該濺鍍腔室中經濺鍍塗佈而具有黏合層。在一些實施例中，該黏合層繼之以一薄的無電銅鍍層，以便提高鍍銅之效率。若執行塗覆該黏合層之可選步驟102，則該等通孔20經大小設定，以解釋黏合材料之保形塗佈(例如，經大小設定以在回流焊接期間將焊料吸至該等通孔20中)。In an embodiment of the method 100 such as the embodiment shown in the flowchart of FIG. 3, in the first step 101, a through hole 20 is formed in the ceramic substrate 16. In the embodiment, the through hole 20 is formed using a laser ablation process. In certain embodiments, the laser ablation process uses nanosecond or faster laser pulses, which provide clean (ie, smooth surface) holes and have no significant effect on the strength of the ceramic substrate 16. In other embodiments, chemical processes such as liquid etching or reactive ion etching may be used after determining the position of the hole by laser destruction process or by photolithography. After forming the through hole 20, the ceramic substrate is coated with an adhesive layer (not shown) as appropriate. The adhesive layer helps to adhere the conductive layer 18 to the thin layer of the ceramic substrate 16 (for example, with a thickness of 100 nm to 500 nm). In an embodiment, the adhesive layer is one of titanium, tungsten, titanium-tungsten alloy, titanium nitride, tantalum, tantalum nitride, chromium, or chromium-copper alloy. In this optional second step 102, a continuous sputtering process may be used to apply the adhesive layer, during which the ceramic substrate 16 travels through a sputtering chamber, the top side of the ceramic substrate 16 And/or the bottom side is sputter coated in the sputtering chamber to have an adhesive layer. In some embodiments, the adhesion layer is followed by a thin electroless copper plating layer in order to increase the efficiency of copper plating. If the optional step 102 of applying the adhesive layer is performed, the through holes 20 are sized to explain the conformal coating of the adhesive material (for example, sized to attract solder to the through holes during reflow soldering Hole 20).

在第三步驟103中，將該導電層18或該等導電層18鍍覆至陶瓷基板16 (或黏合層，若已塗覆)上。在實施例中，該等導電層18係選擇為銅、銀、錫或鎳中之至少一者，且在實施例中，該等導電層18之厚度為厚2 µm至20 µm。在一特定實施例中，該等導電層18係由銅形成且具有10 µm至12 µm之厚度。在實施例中，該等導電層18係藉由將銅電鍍至陶瓷基板16 (或黏合層)上而塗覆。在電鍍銅之第三步驟103之後，接著在界定用於導電層18之一電路圖案的位置中用一遮罩覆蓋該銅鍍層，且在第四步驟104中，塗覆一蝕刻劑以溶解在該電路圖案外的銅板之區域。隨後移除該遮罩。在實施例中，該遮罩係藉由以下操作塗覆：在陶瓷基板16或黏合層上方層壓一乾燥膜，隨後將乾燥膜曝露於紫外光以產生該電路圖案。在電鍍之後，該遮罩之移除可使用一苛性鹼溶液來完成。在一替代實施例中，該遮罩係在電鍍之前塗覆，使得銅僅鍍覆在界定該電路圖案之區域中。In the third step 103, the conductive layer 18 or the conductive layers 18 are plated onto the ceramic substrate 16 (or adhesive layer, if coated). In an embodiment, the conductive layers 18 are selected to be at least one of copper, silver, tin, or nickel, and in an embodiment, the thickness of the conductive layers 18 is 2 μm to 20 μm thick. In a specific embodiment, the conductive layers 18 are formed of copper and have a thickness of 10 µm to 12 µm. In an embodiment, the conductive layers 18 are coated by electroplating copper onto the ceramic substrate 16 (or adhesive layer). After the third step 103 of electroplating copper, the copper plating layer is covered with a mask in a position defining a circuit pattern for the conductive layer 18, and in the fourth step 104, an etchant is applied to dissolve in The area of the copper plate outside the circuit pattern. The mask is subsequently removed. In an embodiment, the mask is applied by laminating a dry film on the ceramic substrate 16 or the adhesive layer, and then exposing the dry film to ultraviolet light to generate the circuit pattern. After electroplating, the mask can be removed using a caustic solution. In an alternative embodiment, the mask is applied before electroplating, so that copper is only plated in the area defining the circuit pattern.

在第四步驟104之後，在第五步驟105中，在該等導電層18上或鄰近該等導電層18形成焊接墊(未示出)。在實施例中，在經鍍覆之陶瓷基板16之表面上方塗覆另一乾燥膜遮罩以界定該等焊接墊將定位所在的打開區域。在實施例中，鎳及/或金沉積在該等打開區域中以形成該等焊接墊。在特定實施例中，該等焊接墊係經由無電鍍覆形成。此外，在實施例中，視需要重複步驟103、104、105，以在陶瓷基板16之兩側上提供一或多個層的導電層18。After the fourth step 104, in a fifth step 105, solder pads (not shown) are formed on or adjacent to the conductive layers 18. In an embodiment, another dry film mask is applied over the surface of the plated ceramic substrate 16 to define the open area where the solder pads will be positioned. In an embodiment, nickel and/or gold are deposited in the open areas to form the solder pads. In certain embodiments, the solder pads are formed by electroless plating. Furthermore, in an embodiment, steps 103, 104, 105 are repeated as necessary to provide one or more layers of conductive layer 18 on both sides of ceramic substrate 16.

在第4圖之流程圖中所示的一替代實施例中，利用厚膜技術來替代先前所描述之薄膜濺鍍及鍍覆技術。如同第3圖之實施例，第4圖之方法自在陶瓷基板16中鑽出通孔20之第一步驟201開始。此後，在第二步驟202中，使用一捲對捲印刷技術(諸如凹版印刷、噴墨印刷、快乾印刷或壓印微影術及其他)在陶瓷基板16之第一側上印刷諸如導電層18之功能層。在第二步驟202期間，該等功能層亦燒結成乾燥之固體層。可視需要重複第二步驟202以在陶瓷基板16之第一側上產生一分層結構。此後，在可選第三步驟203中，可將一功能層印刷且燒結至陶瓷基板16之第二側上。如同第二步驟202，可視需要重複第三步驟203，以在陶瓷基板16之第二側上建造一分層結構。此外，步驟202、203可以一替代方式執行。在此等實施例中，在陶瓷基板16之兩側上的功能層能夠在單個步驟中燒結。In an alternative embodiment shown in the flowchart of FIG. 4, thick film technology is used to replace the previously described thin film sputtering and plating technology. Like the embodiment of FIG. 3, the method of FIG. 4 begins with the first step 201 of drilling a through hole 20 in the ceramic substrate 16. Thereafter, in a second step 202, a roll-to-roll printing technique (such as gravure printing, inkjet printing, quick-drying printing, or imprint lithography and others) is used to print a conductive layer such as a conductive layer on the first side of the ceramic substrate 16 18 functional layers. During the second step 202, the functional layers are also sintered into a dry solid layer. The second step 202 can be repeated as necessary to create a layered structure on the first side of the ceramic substrate 16. Thereafter, in an optional third step 203, a functional layer may be printed and sintered onto the second side of the ceramic substrate 16. Like the second step 202, the third step 203 may be repeated as necessary to build a layered structure on the second side of the ceramic substrate 16. In addition, steps 202, 203 may be performed in an alternative manner. In these embodiments, the functional layers on both sides of the ceramic substrate 16 can be sintered in a single step.

有利地，經由在陶瓷基板16上印刷，具有各種功能性之部件能夠在該陶瓷基板上形成。舉例而言，印刷技術可用於塗覆各種功能層，諸如導電層18、電阻器、由介電層隔開的多層導電電路、壓電電阻器、電位計電阻器、加熱器電阻器及或負溫度係數(negative temperature coefficient；NTC)熱阻器以及其他。在實施例中，至多二十個層可塗覆至陶瓷基板16一或多個側。每一層或層之部分將經歷步驟202。舉例而言，若需要電阻器及電容器，則藉由步驟202塗覆該等電阻器。在下一步驟中，使用步驟202印刷介電部件。在此之後，亦可藉由步驟202塗覆導電電路。在所塗覆之該等元件上方亦可需要一絕緣層，該絕緣層亦藉由步驟202塗覆。如同先前實施例，在第四步驟204中亦沉積焊料墊以提供連接點。Advantageously, by printing on the ceramic substrate 16, components having various functionalities can be formed on the ceramic substrate. For example, printing techniques can be used to coat various functional layers, such as conductive layer 18, resistors, multilayer conductive circuits separated by dielectric layers, piezo resistors, potentiometer resistors, heater resistors and or negative Temperature coefficient (negative temperature coefficient; NTC) thermal resistor and others. In an embodiment, up to twenty layers may be applied to one or more sides of the ceramic substrate 16. Each layer or part of a layer will undergo step 202. For example, if resistors and capacitors are needed, these resistors are coated by step 202. In the next step, the dielectric component is printed using step 202. After this, the conductive circuit can also be coated by step 202. An insulating layer may also be needed over the coated elements, and the insulating layer is also applied by step 202. As in the previous embodiment, solder pads are also deposited in the fourth step 204 to provide connection points.

在形成該等焊接墊(在第3圖之步驟105或第4圖之步驟204中)之後，該等板條14已基本上建構且僅需要單分成個別部件。為了利於單分，將在特定上下文中可被稱為「切塊帶」之臨時載具(未示出)層壓至陶瓷基板16之帶狀物(第3圖之步驟106；第4圖之步驟205)。雷射接著將陶瓷基板16之帶狀物單分成藉由該臨時載具固持在一起之個別板條14。在一實施例中，該臨時載具係聚氯乙烯(polyvinyl chloride; PVC)、聚烯、聚乙烯、聚對苯二甲酸乙二酯(polyethylene terephthalate; PET)，或例如具有用於固持板條14之黏合表面的另一類似聚合膜。在第3圖之步驟107或第4圖之步驟206中，接著跨該臨時載具之寬度及長度拉伸該臨時載具(例如，在牽引與拉幅製程中)以在雷射單分之板條14之間產生空間。After forming the soldering pads (in step 105 of FIG. 3 or step 204 of FIG. 4), the slats 14 have basically been constructed and only need to be divided into individual parts. To facilitate singulation, a temporary carrier (not shown), which may be referred to as "diced tape" in a specific context, is laminated to the ribbon of the ceramic substrate 16 (step 106 in FIG. 3; FIG. 4 in FIG. 4) Step 205). The laser then divides the ribbon of the ceramic substrate 16 into individual slats 14 held together by the temporary carrier. In an embodiment, the temporary carrier is polyvinyl chloride (polyvinyl chloride; PVC), polyene, polyethylene, polyethylene terephthalate (PET), or, for example, is used to hold slats 14 is another adhesive film on the bonding surface. In step 107 of Figure 3 or step 206 of Figure 4, the temporary carrier is then stretched across the width and length of the temporary carrier (for example, in the traction and stentering process) to separate the laser There is space between the slats 14.

在第3圖之步驟108或第4圖之步驟207中，接著將該等隔開之板條14層壓至載具12。在實施例中，載具12係由聚合物製成之撓性基板，該聚合物諸如聚醯亞胺、PET或聚萘二甲酸乙二酯(polyethylene naphthalate; PEN)。在另一實施例中，載具12係金屬之帶狀物，金屬諸如鋁、不銹鋼或其他金屬。在實施例中，載具12具有至少25 µm之厚度，而在其他實施例中，載具12具有至少50 µm之厚度。在實施例中，載具12具有至多125 µm之厚度。如上文所提及，載具12之寬度W為25 mm至150 mm。在一特定實施例中，該厚度為40 µm，且寬度W為25 mm，且長度L為至少100 m。In step 108 of FIG. 3 or step 207 of FIG. 4, the equally spaced slats 14 are then laminated to the carrier 12. In an embodiment, the carrier 12 is a flexible substrate made of a polymer, such as polyimide, PET, or polyethylene naphthalate (PEN). In another embodiment, the carrier 12 is a ribbon of metal, such as aluminum, stainless steel, or other metals. In an embodiment, the carrier 12 has a thickness of at least 25 µm, while in other embodiments, the carrier 12 has a thickness of at least 50 µm. In an embodiment, the carrier 12 has a thickness of at most 125 µm. As mentioned above, the width W of the carrier 12 is 25 mm to 150 mm. In a particular embodiment, the thickness is 40 µm, the width W is 25 mm, and the length L is at least 100 m.

為了將該等板條14層壓至載具12，將黏著劑24噴塗、塗佈、沉積或以其他方式塗覆至該等板條14及/或載具12。用於塗覆黏著劑之例示性方法包括狹縫模塗佈、印刷、化學氣相沉積或物理氣相沉積。在實施例中，黏著劑24之非限制性實例包括環氧化物、矽氧橡膠、聚醯亞胺、伸苯基苯并雙噁唑(phenylenebenzobisoxazole; PBO)或苯并環丁烯(benzocyclobutene; BCB)中之至少一者。在實施例中，選擇黏著劑24及載具12以使得能夠在各種操作中始終保持其性質。舉例而言，黏著劑24及載具12應分別能夠承受回流焊接溫度(例如，高達250℃)及固化循環(例如，高達150℃)而不損失黏著強度或不使機械性質實質上降級。To laminate the slats 14 to the carrier 12, the adhesive 24 is sprayed, coated, deposited, or otherwise applied to the slats 14 and/or the carrier 12. Exemplary methods for applying the adhesive include slot die coating, printing, chemical vapor deposition, or physical vapor deposition. In the embodiment, non-limiting examples of the adhesive 24 include epoxy, silicone rubber, polyimide, phenylenebenzobisoxazole (PBO) or benzocyclobutene (BCB) ) At least one of them. In an embodiment, the adhesive 24 and the carrier 12 are selected to enable their properties to be maintained throughout various operations. For example, the adhesive 24 and the carrier 12 should be able to withstand reflow soldering temperatures (eg, up to 250°C) and curing cycles (eg, up to 150°C) without losing adhesion strength or substantially degrading mechanical properties.

此外，因為該等板條14意欲可自載具12移除以便利於板條14在電子部件中之使用，所以選擇黏著劑24，使得該黏著劑足夠強而將板條14牢固地固持至載具12，但不會過強而使使用者難以將其移除。在一特定實施例中，板條14至載具12之黏結強度為至少1.6 N/cm，如藉由如ASTM D6862所定義之90°剝離測試特性化。特定而言，黏結強度在解除結合時減小至小於0.5 N/cm。如下文將更全面地論述，關於解除結合的黏結強度之減小可經由以下操作來實現：將帶加熱至一高溫度；應用區域超音波能；應用光激發(例如，紫外線輻射)、化學活化或溶劑膨脹或雷射活化以及其他手段。In addition, because the slats 14 are intended to be removable from the carrier 12 to facilitate the use of the slats 14 in electronic components, the adhesive 24 is selected so that the adhesive is strong enough to hold the slats 14 firmly to the carrier Tool 12, but it will not be too strong to make it difficult for the user to remove it. In a particular embodiment, the bond strength of the slat 14 to the carrier 12 is at least 1.6 N/cm, as characterized by a 90° peel test as defined by ASTM D6862. In particular, the bond strength is reduced to less than 0.5 N/cm when the bond is released. As will be discussed more fully below, the reduction in bond strength for debonding can be achieved by: heating the tape to a high temperature; applying area ultrasonic energy; applying light excitation (eg, ultraviolet radiation), chemical activation Or solvent swelling or laser activation and other means.

在將該等板條14層壓至載具12之後，在實施例中，該等板條14被保護膜26覆蓋(第3圖之步驟109或第4圖之步驟208)。在實施例中，保護膜26係一聚合物，諸如PET。此外，在實施例中，保護膜26具有12.5 μm至100 μm之厚度。在一更特別實施例中，保護膜26具有25 µm之厚度。保護膜26經配置以在使用之前自該等板條14剝離。在用保護膜26覆蓋之後，將條帶10捲繞至一捲盤上(第3圖之步驟110或第4圖之步驟209)。After laminating the slats 14 to the carrier 12, in an embodiment, the slats 14 are covered with a protective film 26 (step 109 in FIG. 3 or step 208 in FIG. 4). In an embodiment, the protective film 26 is a polymer, such as PET. In addition, in the embodiment, the protective film 26 has a thickness of 12.5 μm to 100 μm. In a more specific embodiment, the protective film 26 has a thickness of 25 µm. The protective film 26 is configured to peel from the slats 14 before use. After being covered with the protective film 26, the tape 10 is wound onto a reel (step 110 in FIG. 3 or step 209 in FIG. 4).

已描述了用於以捲對捲格式生產電子基板之方法之一實例，現在論述對整體方法的效應有貢獻之特定屬性。此等屬性對該方法之總體效率以及最終產品之品質作出貢獻。An example of a method for producing electronic substrates in a roll-to-roll format has been described, and specific attributes that contribute to the effect of the overall method are now discussed. These attributes contribute to the overall efficiency of the method and the quality of the final product.

在特定情形下，在實施例中按卷提供之條帶10在後續操作期間(諸如在將部件表面黏著至陶瓷基板16上期間)可輸送經過各種滾筒。在此等實例中，剝離應力可在陶瓷基板16及載具12之撓曲剛性不同時產生。所產生之剝離應力之量值係條帶10行進經過之曲率半徑的函數。較大的曲率半徑將比較小的曲率半徑產生較低之剝離應力。剝離應力之量值亦取決於陶瓷基板16與載具12之間的撓曲剛性之差。材料之撓曲剛性係藉由下式定義：

其中D係撓曲剛性，E係楊氏模數，d係層厚度，且v係帕松比。陶瓷基板16及載具12之撓曲剛性之較高差將引起較高的剝離應力。若剝離應力超過臨時黏著劑層24之黏著強度，則陶瓷基板16 (或完成之板條14)可自載具12剝落。此剝落可藉由針對特定應用選擇具有足夠高之剝離應力的黏著劑來避免。然而，在不可能選擇此黏著劑之情形下，剝落可藉由降低陶瓷基板16及載具12之撓曲剛性之間的差或藉由增大條帶10行進經過的滾筒之曲率半徑來避免。Under certain circumstances, the strips 10 provided in rolls in embodiments may be transported through various rollers during subsequent operations, such as during the adhesion of the component surface to the ceramic substrate 16. In these examples, the peeling stress may be generated when the flexural rigidity of the ceramic substrate 16 and the carrier 12 are different. The magnitude of the peel stress generated is a function of the radius of curvature through which the strip 10 travels. A larger radius of curvature will produce a lower peel stress than a smaller radius of curvature. The magnitude of the peel stress also depends on the difference in flexural rigidity between the ceramic substrate 16 and the carrier 12. The flexural rigidity of the material is defined by the following formula:

Among them, D is the flexural rigidity, E is the Young's modulus, d is the layer thickness, and v is the Passon ratio. The higher difference in the flexural rigidity of the ceramic substrate 16 and the carrier 12 will cause higher peel stress. If the peeling stress exceeds the adhesive strength of the temporary adhesive layer 24, the ceramic substrate 16 (or the finished lath 14) can peel off from the carrier 12. This peeling can be avoided by selecting an adhesive with a sufficiently high peeling stress for a specific application. However, in cases where it is not possible to choose this adhesive, peeling can be avoided by reducing the difference between the flexural rigidity of the ceramic substrate 16 and the carrier 12 or by increasing the radius of curvature of the roller through which the strip 10 travels .

此外，在實施例中，陶瓷基板16之厚度經選擇為小於載具12之厚度。如此，載具12能夠加以更有效地搬運，此係因為當載具12經歷腹板搬運製程時，在載具12上存在均勻之應力。第二，在實施例中，該等板條14之彈性模數應為高，使得具有精細線及空間之電路可圖案化在基板上。第三，在實施例中，陶瓷基板16經設計以便具有係載具12之撓曲剛性至少五倍的撓曲剛性。在另外實施例中，陶瓷基板16之撓曲剛性係載具12之撓曲剛性的至少十倍，且在更另外之實施例中，陶瓷基板16之撓曲剛性係載具12之撓曲剛性的至少二十倍。Furthermore, in the embodiment, the thickness of the ceramic substrate 16 is selected to be smaller than the thickness of the carrier 12. In this way, the carrier 12 can be transported more effectively because there is uniform stress on the carrier 12 when the carrier 12 undergoes the web transport process. Second, in the embodiment, the elastic modulus of the slats 14 should be high, so that circuits with fine lines and spaces can be patterned on the substrate. Third, in the embodiment, the ceramic substrate 16 is designed so as to have a flexural rigidity that is at least five times the flexural rigidity of the carrier 12. In another embodiment, the flexural rigidity of the ceramic substrate 16 is at least ten times the flexural rigidity of the carrier 12, and in yet another embodiment, the flexural rigidity of the ceramic substrate 16 is the flexural rigidity of the carrier 12 At least twenty times.

第三屬性特別地增強按卷搬運的該等板條之能力。特定而言，難以搬運該等板條14且將該等板條與載具12分開，除非板條14之陶瓷基板16係剛性的。如與習知聚醯亞胺基板相比，下文的表2提供氧化鋁陶瓷基板16之撓曲剛性。表1亦提供針對不同厚度之聚醯亞胺載具12的陶瓷基板16與載具12之剛性比。 表2.板條及載具材料之撓曲剛性性質

The third attribute specifically enhances the ability of these slats to be transported by roll. In particular, it is difficult to transport the slats 14 and separate them from the carrier 12 unless the ceramic substrate 16 of the slats 14 is rigid. As compared with the conventional polyimide substrate, Table 2 below provides the flexural rigidity of the alumina ceramic substrate 16. Table 1 also provides the rigidity ratio of the ceramic substrate 16 and the carrier 12 for the polyimide carrier 12 with different thicknesses. Table 2. Flexural rigidity properties of slats and carrier materials

如自表1可見，40 μm氧化鋁陶瓷基板16具有與更厚之聚醯亞胺基板(205 μm)近似相同之撓曲剛性。特定而言，陶瓷基板16之厚度及撓曲剛性能夠使陶瓷基板16在與載具12分開之後經歷後續部件安裝製程及模組搬運製程。As can be seen from Table 1, the 40 μm alumina ceramic substrate 16 has approximately the same flexural rigidity as the thicker polyimide substrate (205 μm). In particular, the thickness and flexural rigidity of the ceramic substrate 16 enable the ceramic substrate 16 to undergo a subsequent component mounting process and a module handling process after being separated from the carrier 12.

下文的表3提供載具12之厚度經操控以使得載具12具有與陶瓷基板16相同的撓曲剛性之實例。如在表3中可見，為了達成與具有40 μm之厚度之氧化鋁陶瓷基板16相同的撓曲剛性(即，剛性比1)，聚醯亞胺之載具12應必須厚205 μm，鋁6061之載具12應必須厚68 μm，且不銹鋼304之載具12應必須厚50 μm。若剛性比升高至5，則此等材料之厚度可降低更多。然而，如上文所論述，在實施例中，陶瓷基板16之厚度比載具12之厚度薄，以利於條帶10的後續搬運及處理。 表3.載具材料之厚度及相關聯剛性比

Table 3 below provides an example in which the thickness of the carrier 12 is manipulated so that the carrier 12 has the same flexural rigidity as the ceramic substrate 16. As can be seen in Table 3, in order to achieve the same flexural rigidity as the alumina ceramic substrate 16 having a thickness of 40 μm (ie, a rigidity ratio of 1), the polyimide carrier 12 must be 205 μm thick and aluminum 6061 The carrier 12 must be 68 μm thick, and the carrier 12 of stainless steel 304 must be 50 μm thick. If the rigidity ratio is increased to 5, the thickness of these materials can be reduced even more. However, as discussed above, in the embodiment, the thickness of the ceramic substrate 16 is thinner than the thickness of the carrier 12 to facilitate the subsequent handling and processing of the strip 10. Table 3. Thickness of vehicle materials and associated rigidity ratio

現在描述條帶10之一特定實施例。在此實施例中，載具12係具有75 µm之厚度的撓性聚合物。一層黏著劑24經塗覆至載具12且具有6 μm之厚度。該等板條14各自包括具有厚度40 µm之陶瓷基板16，及在頂側及底側兩者上之導電層18，其中該等導電層18厚10 μm。該等板條14被具有25 µm之厚度之保護膜26覆蓋。因此，條帶10具有166 μm之總厚度。在捲盤上帶系統中的用於封裝電子基板之標準捲盤具有150 mm之輪轂直徑及330 mm的外徑。使用前述之條帶10及標準捲盤，400 m之條帶10可儲存在捲盤上，此利於電子基板之低成本大量生產。實際上，如上文在表1中所表明，數百萬個板條14可設置在400 m長(部分地取決於電子部件之特定類型)之條帶10上。A specific embodiment of the strip 10 will now be described. In this embodiment, the carrier 12 is a flexible polymer having a thickness of 75 µm. A layer of adhesive 24 is applied to the carrier 12 and has a thickness of 6 μm. The slats 14 each include a ceramic substrate 16 having a thickness of 40 μm, and conductive layers 18 on both the top and bottom sides, where the conductive layers 18 are 10 μm thick. The slats 14 are covered with a protective film 26 having a thickness of 25 µm. Therefore, the strip 10 has a total thickness of 166 μm. The standard reel for packaging electronic substrates in the reel tape system has a hub diameter of 150 mm and an outer diameter of 330 mm. Using the aforementioned tape 10 and standard reel, a 400 m tape 10 can be stored on the reel, which facilitates mass production of electronic substrates at low cost. In fact, as indicated in Table 1 above, millions of slats 14 can be placed on a strip 10 that is 400 m long (partly depending on the particular type of electronic component).

在剩餘圖式中，提供能夠使用上述捲對捲方法製造及/或可使用上述捲對捲方法利用電子基板製造的電子部件之實施例。在第5圖中，板條14係形成至發光二極體(light emitting diode; LED)晶片27中。特定而言，LED 28係在板條14之頂側上安裝至導電層18。此外，磷光體30塗佈在LED 28上以提供一或多個特定色彩之光。在實施例中，在無電鍍覆焊料墊的步驟之後或在單分該等板條14的步驟之後，LED晶片27在捲對捲製造方法期間形成。在其他實施例中，條帶10之產品捲盤係用於在單獨處理線上產生LED晶片。在任一實施例中，該等LED晶片可關於線上的LED效能有利地進行測試。包括LED晶片27之條帶10接著可運輸至消費者，消費者在組裝如照明器具之產品時拆離該模組。此外，因為條帶10使用具有陶瓷基板16之板條14，所以板條14更加能夠帶走自高功率LED封裝產生之熱。In the remaining figures, embodiments are provided of electronic components that can be manufactured using the roll-to-roll method described above and/or that can be manufactured using an electronic substrate using the roll-to-roll method described above. In FIG. 5, the slat 14 is formed into a light emitting diode (LED) chip 27. In particular, the LED 28 is mounted to the conductive layer 18 on the top side of the slat 14. In addition, the phosphor 30 is coated on the LED 28 to provide one or more specific colors of light. In an embodiment, the LED wafer 27 is formed during the roll-to-roll manufacturing method after the step of electroless plating of solder pads or after the step of singulating the slats 14 individually. In other embodiments, the product reel of the strip 10 is used to produce LED chips on a separate processing line. In either embodiment, the LED chips can be advantageously tested with respect to the LED performance on the line. The strip 10 including the LED chip 27 can then be transported to the consumer, who detaches the module when assembling products such as lighting fixtures. In addition, because the strip 10 uses a slat 14 having a ceramic substrate 16, the slat 14 is more capable of removing heat generated from a high-power LED package.

在第6A圖中，板條14係加熱器31。特定而言，電阻性加熱元件32沉積在陶瓷基板16上。如第6A圖所示，電阻性加熱元件32具有在每一末端具有導電元件34a、34b之蛇形形狀。諸如NTR熱阻器之感測器36係靠近陶瓷基板16之頂面的中心設置。兩個額外導電元件34c、34d係與導電跡線37一起設置以提供與感測器36之電連通。如第6B圖所示，電阻性加熱元件32及感測器36被介電層38覆蓋。然而，在其他實施例中，感測器36可定位在與電阻性加熱元件32不同之平面中及/或藉由介電層38與電阻性加熱元件32分開。In FIG. 6A, the slat 14 is a heater 31. In particular, the resistive heating element 32 is deposited on the ceramic substrate 16. As shown in FIG. 6A, the resistive heating element 32 has a serpentine shape with conductive elements 34a, 34b at each end. A sensor 36 such as an NTR thermistor is provided near the center of the top surface of the ceramic substrate 16. Two additional conductive elements 34c, 34d are provided along with the conductive trace 37 to provide electrical communication with the sensor 36. As shown in FIG. 6B, the resistive heating element 32 and the sensor 36 are covered by the dielectric layer 38. However, in other embodiments, the sensor 36 may be positioned in a different plane from the resistive heating element 32 and/or separated from the resistive heating element 32 by the dielectric layer 38.

第7圖提供作為晶片電阻器39之板條14之一實施例。導電條帶40沉積在陶瓷基板16之頂面及底面上。該等導電條帶40係藉由充滿導電材料22之通孔20連接。在陶瓷基板16之頂面上，電阻元件42沉積在該等導電條帶40之間。此外，介電層38沉積在電阻元件42上方。此外，在實施例中，電阻元件42之值44係印刷在介電層32上。如第7圖所示，電阻器值44為47 Ω。有利地，所圖示且描述之晶片電阻器39具有低高度剖面。在一特定實施例中，該等導電條帶40、電阻元件42、介電層38及電阻器值44全部印刷在陶瓷基板16上(例如，如上文關於第4圖所論述)。FIG. 7 provides an embodiment of the lath 14 as a chip resistor 39. The conductive strip 40 is deposited on the top and bottom surfaces of the ceramic substrate 16. The conductive strips 40 are connected by through holes 20 filled with conductive material 22. On the top surface of the ceramic substrate 16, a resistive element 42 is deposited between the conductive strips 40. In addition, a dielectric layer 38 is deposited above the resistance element 42. In addition, in the embodiment, the value 44 of the resistance element 42 is printed on the dielectric layer 32. As shown in Figure 7, the resistor value 44 is 47 Ω. Advantageously, the illustrated and described chip resistor 39 has a low height profile. In a particular embodiment, the conductive strips 40, resistive element 42, dielectric layer 38, and resistor value 44 are all printed on the ceramic substrate 16 (eg, as discussed above with respect to FIG. 4).

在第8A圖及第8B圖中，圖示了多層電容器51。在第8A圖中，該等陶瓷基板16已經網版印刷有導電層48及絕緣層50。該等陶瓷基板16充當多層電容器46之個別電容器52之介電材料。如可見，該等導電層48及該等絕緣層50係以將該等電容器52串聯地結合之方式配置。在第8B圖中，多層電容器51之該等導電層48及該等絕緣層50係以將該等電容器52並聯地結合之方式配置。有利地，如與習知共燒陶瓷電容器相比，此設計之多層電容器51可製造成大小較大、電容較高且更加能夠承受較高擊穿電壓。In FIGS. 8A and 8B, the multilayer capacitor 51 is shown. In FIG. 8A, the ceramic substrate 16 has been screen-printed with a conductive layer 48 and an insulating layer 50. These ceramic substrates 16 serve as the dielectric material of the individual capacitors 52 of the multilayer capacitor 46. As can be seen, the conductive layers 48 and the insulating layers 50 are arranged in such a manner that the capacitors 52 are connected in series. In FIG. 8B, the conductive layers 48 and the insulating layers 50 of the multilayer capacitor 51 are arranged in such a manner that the capacitors 52 are combined in parallel. Advantageously, as compared with conventional co-fired ceramic capacitors, the multilayer capacitor 51 of this design can be made larger in size, higher in capacitance, and more able to withstand higher breakdown voltages.

在未描繪之其他實施例中，可產生額外之複雜電路元件。舉例而言，板條可包括印刷在陶瓷基板上之天線。電阻器、電感器、電容器及其他可調諧元件亦可圖案化在陶瓷基板上。板條之底側可包括充當接地平面之導電層。在其他實施例中，板條之頂側可具有安裝於其上之積體電路及其他被動部件。板條亦可含有感測例如溫度、電容、壓力(壓電)、濕度及/或氣體之印刷感測器。In other embodiments not depicted, additional complex circuit elements can be created. For example, the slat may include an antenna printed on a ceramic substrate. Resistors, inductors, capacitors and other tunable components can also be patterned on the ceramic substrate. The bottom side of the slat may include a conductive layer that serves as a ground plane. In other embodiments, the top side of the slats may have integrated circuits and other passive components mounted thereon. The slats may also contain printed sensors that sense eg temperature, capacitance, pressure (piezoelectricity), humidity and/or gas.

參考如上所述之該等板條14，第9圖提供可自載具12移除該等板條14之方式之一例示性實施例。在所有部件已安裝在陶瓷基板16上之後，隨著載具12經由滾筒62彎曲，成品板條14藉由拾取工具60自頂部固持。在此實施例中，特定因素對成功分離板條14與載具12作出貢獻：陶瓷基板16之強度、陶瓷基板16中之彎曲應力及剝離力。Referring to the slats 14 as described above, FIG. 9 provides an exemplary embodiment of the manner in which the slats 14 can be removed from the carrier 12. After all the components have been mounted on the ceramic substrate 16, as the carrier 12 is bent by the roller 62, the finished slat 14 is held from the top by the pick-up tool 60. In this embodiment, certain factors contribute to the successful separation of the slats 14 and the carrier 12: the strength of the ceramic substrate 16, the bending stress in the ceramic substrate 16, and the peel force.

陶瓷基板16之強度受材料中之瑕疵及/或缺陷影響，在一些情形下，該等瑕疵及/或缺陷可在製造製程期間(諸如在通孔鑽出、金屬化、單分或部件組裝期間的搬運期間)引入。此等瑕疵及/或缺陷可藉由在通孔鑽出及單分期間使用高速雷射(諸如飛秒雷射)及藉由在陶瓷基板16經歷各種處理步驟時防止陶瓷基板16接觸諸如其他陶瓷或金屬之硬質材料來減少。舉例而言，如第10圖所示，載具12可使用具有用於與鏈輪之齒嚙合之孔72的鏈輪軌道70來更精確地移動。以此方式，載具12可以精確方式移動通過一滾筒，諸如第9圖之滾筒62，從而減小條帶10在處理線上將碰撞或刮擦一硬質部件的可能性。另外，此鏈輪軌道70可用於在將電子基板組裝在板條14上時精確地定位載具12。The strength of the ceramic substrate 16 is affected by defects and/or defects in the material. In some cases, these defects and/or defects may be during the manufacturing process (such as during through-hole drilling, metallization, singulation or component assembly) During transportation). Such defects and/or defects can be achieved by using high-speed lasers (such as femtosecond lasers) during through-hole drilling and single-minute division and by preventing the ceramic substrate 16 from contacting other ceramics such as when the ceramic substrate 16 undergoes various processing steps Or metal hard materials to reduce. For example, as shown in FIG. 10, the carrier 12 may use a sprocket track 70 having holes 72 for meshing with sprocket teeth to move more accurately. In this way, the carrier 12 can be moved through a roller in a precise manner, such as the roller 62 of FIG. 9, thereby reducing the likelihood that the strip 10 will hit or scratch a hard component on the processing line. In addition, this sprocket track 70 can be used to accurately position the carrier 12 when assembling the electronic substrate on the slat 14.

彎曲應力受陶瓷基板16之彈性模數、陶瓷基板16之厚度、板條14之大小及將板條14與載具12分離所用之速度影響。一般而言，較高的彈性模數將導致彎曲應力之較高量值。此外，一般而言，較薄陶瓷基板16將比同一材料之較厚陶瓷基板16產生更大的彎曲應力。此外，一般而言，較大板條及較高分離速度將導致較高的彎曲應力。藉由考慮陶瓷基板16之彈性模數、陶瓷基板16之厚度、該等板條14之大小及分離速度，可管理彎曲應力以避免超過陶瓷基板14之強度。The bending stress is affected by the modulus of elasticity of the ceramic substrate 16, the thickness of the ceramic substrate 16, the size of the slats 14, and the speed used to separate the slats 14 from the carrier 12. Generally speaking, a higher modulus of elasticity will result in a higher magnitude of bending stress. In addition, generally speaking, the thinner ceramic substrate 16 will generate greater bending stress than the thicker ceramic substrate 16 of the same material. In addition, in general, larger slats and higher separation speeds will result in higher bending stresses. By considering the elastic modulus of the ceramic substrate 16, the thickness of the ceramic substrate 16, the size and separation speed of the slats 14, the bending stress can be managed to avoid exceeding the strength of the ceramic substrate 14.

關於剝離力，對陶瓷基板16之損害可藉由在處理步驟期間使用一黏著劑(高或中等黏性)來減少。然而，為了利於自載具12移除該等板條14，該黏著劑可恰在分離之前弱化。舉例而言，視黏著劑之類型而定，條帶可曝露於UV光、高溫、濕度、磁場、超音波能及/或靜電力。在實施例中，用於弱化黏著劑之特定技術將在分離之後使留在板條14上之黏著劑殘餘減至最少或消除。在實施例中，如藉由ASTM D6862中定義之90°剝離測試量測之黏著劑強度大於每25 mm寬載具4 N，且在執行弱化技術之後減小至小於每25 mm寬載具0.4 N。Regarding the peel force, damage to the ceramic substrate 16 can be reduced by using an adhesive (high or medium viscosity) during the processing step. However, to facilitate removal of the slats 14 from the carrier 12, the adhesive may be weakened just before separation. For example, depending on the type of adhesive, the strip may be exposed to UV light, high temperature, humidity, magnetic fields, ultrasonic energy, and/or electrostatic forces. In an embodiment, specific techniques for weakening the adhesive will minimize or eliminate the adhesive residue left on the slats 14 after separation. In an embodiment, the adhesive strength as measured by the 90° peel test defined in ASTM D6862 is greater than 4 N per 25 mm wide carrier and is reduced to less than 0.4 per 25 mm wide carrier after performing the weakening technique N.

因此，陶瓷基板16之強度、陶瓷基板16中之彎曲應力及剝離力之操縱及/或最佳化可增強在必要時由製造商或最終使用者將該等板條14與載具12分離的能力。Therefore, the manipulation and/or optimization of the strength of the ceramic substrate 16, the bending stress and the peel force in the ceramic substrate 16 can enhance the separation of the slats 14 from the carrier 12 by the manufacturer or end user when necessary ability.

在另一實施例中，該等板條附接至一剛性載具而非如上所述之撓性聚合載具。在此等實施例中，基板在形成通孔、電鍍、蝕刻及附接焊料墊的連續處理步驟之後經分割成面板。該等面板接著經附接至平坦之剛性載具，在該剛性載具上，陶瓷基板之面板經單分成個別板條。因此，如與先前實施例相比，該等板條不含於捲繞成卷狀物之長條帶上。實情為，該等板條含於可由特定消費者使用之板上，該等消費者之當前製造設置不允許使用自捲起之條帶得到之板條。In another embodiment, the slats are attached to a rigid carrier instead of the flexible polymeric carrier as described above. In these embodiments, the substrate is divided into panels after successive processing steps of forming through holes, plating, etching, and attaching solder pads. The panels are then attached to a flat rigid carrier on which the panel of the ceramic substrate is singulated into individual slats. Therefore, as compared with the previous embodiment, the slats are not included on the long strip wound into a roll. The fact is that these slats are contained on boards that can be used by specific consumers, and the current manufacturing settings of these consumers do not allow the use of slats obtained from rolled strips.

第11圖描繪以所描述之方法製造板條之方法300的一實施例。一般而言，方法300實質上類似於上文所描述且第3圖中所示之方法。特定而言，該方法自在陶瓷基板中鑽出通孔之第一步驟301開始，該陶瓷基板係燒結型氧化鋁、部分穩定或完全穩定之氧化鋯、鈦酸鹽類、鐵酸鹽類或另一陶瓷材料之帶狀物。因此，如上所述，陶瓷基板之帶狀物經展開或另外連續地饋送至連續處理線中。在一第二可選步驟302中，在一側或兩側上對該陶瓷基板塗佈例如鈦、鎢、鈦-鎢合金、氮化鈦、鉭、氮化鉭、鉻或鉻-銅合金之一黏合層，以利於導電層之黏著。此後，在第三步驟103中，將該導電層電鍍至該陶瓷基板(或黏合層)上，且在第四步驟104中，將一電路圖案蝕刻至該導電層中。在其他實施例中，可將該遮罩塗覆至該基板(或黏合層)，使得導電材料僅塗覆在界定該電路圖案之區域中。在第五步驟305中，沉積焊料墊以用於形成電連接。在實施例中，使用無電鍍覆來塗覆該等焊料墊。Figure 11 depicts an embodiment of a method 300 of manufacturing a slat in the described method. In general, the method 300 is substantially similar to the method described above and shown in FIG. 3. Specifically, the method starts with the first step 301 of drilling a through hole in a ceramic substrate, which is sintered alumina, partially stabilized or fully stabilized zirconia, titanates, ferrite or another A ribbon of ceramic material. Therefore, as described above, the ribbon of the ceramic substrate is unrolled or otherwise continuously fed into the continuous processing line. In a second optional step 302, the ceramic substrate is coated with, for example, titanium, tungsten, titanium-tungsten alloy, titanium nitride, tantalum, tantalum nitride, chromium, or chromium-copper alloy on one or both sides An adhesive layer to facilitate the adhesion of the conductive layer. Thereafter, in a third step 103, the conductive layer is electroplated onto the ceramic substrate (or adhesive layer), and in a fourth step 104, a circuit pattern is etched into the conductive layer. In other embodiments, the mask may be applied to the substrate (or adhesive layer) so that the conductive material is applied only in the area defining the circuit pattern. In a fifth step 305, solder pads are deposited for forming electrical connections. In an embodiment, electroless plating is used to coat the solder pads.

至此處理點，第11圖之方法300實質上類似於第3圖之方法100。然而，在第五步驟之後，該等方法出現差異。在第11圖之方法300中，在第六步驟306中，將基板切割成面板。接著在第七步驟307中將該等面板附接至一載具。該載具可為多種合適材料，包括玻璃或金屬片材。在實施例中，該載具可為0.5 mm至0.7 mm厚之玻璃片材。在其他實施例中，該載具可為亦係0.5 mm至0.7 mm厚之金屬(諸如鋁或不銹鋼)之片材。特定而言，該載具可經選擇以便能夠藉由組裝設備來搬運、在例如260℃或更高溫度下發送穿過一焊料回流爐、對用於解除結合製程之UV輻射透明及/或係平坦的，且具有相對低之厚度變化。當在該載具上時，在第八步驟308中，將該等面板單分成板條，且在第九步驟309中，用一保護膜覆蓋該等板條。在其他實施例中，製造板條之初始步驟類似於第4圖之步驟201、202、203及204，功能層係在該等步驟中印刷至陶瓷基板上。如上文所論述，該等功能層可使用例如彈性印刷、凹版輥及/或噴墨印刷來塗覆。所塗覆之每一功能層可在塗覆之後在例如800℃下燒結。如上文所提供，該等功能層可包括一或多個層，該一或多個層係導電、電阻、介電、溫度感測(熱阻器)及/或絕緣的。在塗覆該等功能層之後，該方法之實施例根據第11圖之步驟306、307、308及309進行。So far, the method 300 of FIG. 11 is substantially similar to the method 100 of FIG. 3. However, after the fifth step, these methods differ. In the method 300 of FIG. 11, in a sixth step 306, the substrate is cut into panels. Then in a seventh step 307 the panels are attached to a vehicle. The carrier can be a variety of suitable materials, including glass or metal sheets. In an embodiment, the carrier may be a glass sheet 0.5 mm to 0.7 mm thick. In other embodiments, the carrier may be a sheet of metal (such as aluminum or stainless steel) that is also 0.5 mm to 0.7 mm thick. In particular, the carrier can be selected so as to be able to be transported by assembly equipment, sent through a solder reflow oven at, for example, 260°C or higher, transparent to UV radiation used for debonding processes and/or Flat, with relatively low thickness variation. When on the carrier, in an eighth step 308, the panels are singly divided into slats, and in a ninth step 309, the slats are covered with a protective film. In other embodiments, the initial steps of manufacturing the slats are similar to steps 201, 202, 203, and 204 of FIG. 4, in which the functional layers are printed onto the ceramic substrate. As discussed above, these functional layers can be applied using, for example, elastic printing, gravure rolls, and/or inkjet printing. Each functional layer applied may be sintered at 800°C, for example, after coating. As provided above, the functional layers may include one or more layers that are electrically conductive, resistive, dielectric, temperature sensing (thermistor), and/or insulating. After coating the functional layers, the method embodiment is performed according to steps 306, 307, 308, and 309 of FIG.

根據第11圖之方法300，第12圖提供載具412上之面板400的示意性表示，其中面板400已單分成個別板條414 (儘管為清楚起見，未圖示保護膜)。如在第12圖中可見，載具412具有長度L及寬度W，該兩者界定該等板條414所附接之一表面區域。特定而言，該等板條414覆蓋載具412的實質上整個表面區域，可選邊界區域415除外。在一例示性實施例中，該等板條414中之每一者具有2 mm乘以2 mm之大小。載具412具有200 mm之長度L及100 mm之寬度W，且該等板條414配置在載具412上，使得邊界區域415具有圍繞載具412之周邊的2 mm之寬度。在此實施例中，4704個板條414可設置在載具412上。提供此實施例以說明可裝在給定大小之載具412上的給定大小之板條414的數目。According to the method 300 of FIG. 11, FIG. 12 provides a schematic representation of the panel 400 on the carrier 412, where the panel 400 has been singulated into individual slats 414 (although for clarity, the protective film is not shown). As can be seen in FIG. 12, the carrier 412 has a length L and a width W, both of which define a surface area to which the slats 414 are attached. In particular, the slats 414 cover substantially the entire surface area of the carrier 412, except for the optional boundary area 415. In an exemplary embodiment, each of the slats 414 has a size of 2 mm by 2 mm. The carrier 412 has a length L of 200 mm and a width W of 100 mm, and the slats 414 are arranged on the carrier 412 so that the boundary area 415 has a width of 2 mm around the periphery of the carrier 412. In this embodiment, 4704 slats 414 can be provided on the carrier 412. This embodiment is provided to illustrate the number of slats 414 of a given size that can be mounted on a carrier 412 of a given size.

單分出該等板條414之面板400可與載具412大小相同(即，未提供邊界區域415)。在實施例中，面板可為至少200 mm長、至少300 mm長或至少500 mm長，且此外，在實施例中，面板可為至多800 mm長。在實施例中，面板400為至少100 mm寬、至少200 mm寬或至多300 mm寬。先前，矩形陶瓷面板在大小上限於約115 mm乘以175 mm之最大值，且圓形晶圓大小限於300 mm之最大半徑。因此，如本文中所描述之該等面板400具有能夠以比先前可用之大小大得多的大小製成之優點。在實施例中，該等板條414大小可自小至0.5 mm之尺寸改變至大至50 mm之尺寸。在實施例中，該等板條414可為任何形狀，包括正方形、矩形、圓形、三角形或其他彎曲或線角度形狀。因此，尺寸可為半徑、邊緣長度、高度等。在各種實施例中，載具412在大小上可自小至100 mm之尺寸改變至大至800 mm之尺寸。在實施例中，載具412係矩形的且具有100 mm乘以300 mm至300 mm乘以800 mm之大小。The panel 400 that separates the slats 414 may be the same size as the vehicle 412 (ie, the boundary area 415 is not provided). In an embodiment, the panel may be at least 200 mm long, at least 300 mm long, or at least 500 mm long, and in addition, in an embodiment, the panel may be at most 800 mm long. In an embodiment, the panel 400 is at least 100 mm wide, at least 200 mm wide, or at most 300 mm wide. Previously, rectangular ceramic panels were limited in size to a maximum of approximately 115 mm by 175 mm, and the size of a round wafer was limited to a maximum radius of 300 mm. Therefore, the panels 400 as described herein have the advantage that they can be made in a much larger size than previously available. In an embodiment, the size of the slats 414 can be changed from a size as small as 0.5 mm to a size as large as 50 mm. In an embodiment, the slats 414 can be any shape, including square, rectangular, circular, triangular, or other curved or line-angle shapes. Therefore, the dimensions may be radius, edge length, height, etc. In various embodiments, the carrier 412 can vary in size from as small as 100 mm to as large as 800 mm. In an embodiment, the carrier 412 is rectangular and has a size of 100 mm by 300 mm to 300 mm by 800 mm.

第13圖提供在載具412上之板條414之側視圖。如可見，板條414包括具有一或多個導電層418之陶瓷基板416。在實施例中，該等導電層418界定電路圖案，且陶瓷基板416上之導電層418可經由通孔(未示出)連接至在陶瓷基板416之底部上的導電層418。板條414係使用圖示為黏著劑層424之一黏著劑附接至載具412。有利地，該等板條414不必使其100%之底面結合至載具412。特定而言，該等板條414可使其小於100%之底面結合至載具412，且在實施例中，百分比可低至40%。實際上，如第13圖所示，僅板條414之底面上之該等導電層418與黏著劑層424接觸。此性質允許在稍後處理期間更容易自載具412移除板條414。Figure 13 provides a side view of the slats 414 on the carrier 412. As can be seen, the slats 414 include a ceramic substrate 416 with one or more conductive layers 418. In an embodiment, the conductive layers 418 define a circuit pattern, and the conductive layer 418 on the ceramic substrate 416 may be connected to the conductive layer 418 on the bottom of the ceramic substrate 416 through vias (not shown). The slats 414 are attached to the carrier 412 using an adhesive shown as an adhesive layer 424. Advantageously, the slats 414 need not have their 100% bottom surface bonded to the carrier 412. In particular, the slats 414 may have less than 100% of the bottom surface bonded to the carrier 412, and in embodiments, the percentage may be as low as 40%. In fact, as shown in FIG. 13, only the conductive layers 418 on the bottom surface of the strip 414 are in contact with the adhesive layer 424. This property allows easier removal of the slats 414 from the carrier 412 during later processing.

在實施例中，該等板條414與載具412之間的結合係藉由將黏著劑層424曝露於例如UV-A及/或UV-B輻射之UV光而鬆弛。適合用作黏著劑層424之例示性黏著劑包括LC-3200及LC-4200 (可自3M (St. Paul, MN)公司購得)及BrewerBOND® 305 (可自Brewer Science, Inc. (Rolla, MO)購得)。特定而言，載具412係由諸如玻璃的對UV光(至少在一特定波長範圍內)透明之材料製成。UV光照進載具412，且黏著劑層424響應於曝露於UV光而降級。在實施例中，黏著劑層424未完全釋放板條414，且實情為，該黏著劑層保持例如50%、30%、10%或5%的原始強度(此可使用ASTM D6862中所定義之剝離測試)判定。在藉由黏著劑層424產生之結合鬆弛後，板條414可藉由一表面黏著機器自載具412移除。In an embodiment, the bonding between the slats 414 and the carrier 412 is relaxed by exposing the adhesive layer 424 to UV light such as UV-A and/or UV-B radiation. Exemplary adhesives suitable for use as the adhesive layer 424 include LC-3200 and LC-4200 (available from 3M (St. Paul, MN)) and BrewerBOND® 305 (available from Brewer Science, Inc. (Rolla, MO) purchased). Specifically, the carrier 412 is made of a material that is transparent to UV light (at least in a specific wavelength range) such as glass. UV light enters the carrier 412, and the adhesive layer 424 degrades in response to exposure to UV light. In an embodiment, the adhesive layer 424 does not completely release the slats 414, and the fact is that the adhesive layer maintains, for example, 50%, 30%, 10% or 5% of the original strength (this can be defined in ASTM D6862 Peel test) judgment. After the bond created by the adhesive layer 424 is relaxed, the slats 414 can be removed from the carrier 412 by a surface bonding machine.

第14A圖及第14B圖提供可自該等板條414產生之電氣部件之另一實施例。具體言之，第14A圖及第14B圖分別描繪扇出***件450之俯視圖及仰視圖。首先參看第14A圖，扇出***件450包括複數個第一觸點452，該複數個第一觸點嚙合一積體電路之對應觸點(未示出)。自複數個第一觸點452中之每一者延伸的係連接至複數個通孔456之第一引線454。以此方式，***件450有效地分散在積體電路之觸點上，從而根本上增大用於連接至印刷電路板(printed circuit board; PCB)的積體電路之表面積。如第14B圖所示，每一通孔456連接至在***件450之底面上的複數個第二引線458中之一者。該等第二引線458各自依次連接至複數個第二觸點460。如自第14A圖與第14B圖之比較可見，第二觸點460向外分散至比第一觸點452更大之範圍。在第14A圖及第14B圖所示之實施例中，存在44個第一及第二觸點452、460。Figures 14A and 14B provide another embodiment of electrical components that can be produced from the slats 414. Specifically, FIGS. 14A and 14B depict a top view and a bottom view of the fan-out insert 450, respectively. Referring first to FIG. 14A, the fan-out insert 450 includes a plurality of first contacts 452 that engage corresponding contacts (not shown) of an integrated circuit. The first lead 454 extending from each of the plurality of first contacts 452 is connected to the plurality of through holes 456. In this way, the interposer 450 is effectively dispersed on the contacts of the integrated circuit, thereby fundamentally increasing the surface area of the integrated circuit for connection to a printed circuit board (PCB). As shown in FIG. 14B, each through hole 456 is connected to one of the plurality of second leads 458 on the bottom surface of the insert 450. Each of the second leads 458 is connected to a plurality of second contacts 460 in sequence. As can be seen from the comparison between FIGS. 14A and 14B, the second contacts 460 are spread outward to a larger range than the first contacts 452. In the embodiment shown in FIGS. 14A and 14B, there are 44 first and second contacts 452 and 460.

第15圖描繪***件450，積體電路470安裝在該***件上。積體電路470係經由微凸塊或銅柱472連接至***件450。底部填充聚合物474包圍微凸塊472，且幫助將積體電路470結合至***件450。***件450係經由凸塊482連接至一PCB 480。底部填充聚合物474亦用於包圍凸塊482及將***件470結合至PCB 480。有利地，第一及第二引線454、458 (即，導電層418)可使用如方法300中所描述之光微影術塗覆至陶瓷基板416。使用例如氧化鋁作為陶瓷基板意味著板條414可承受高溫，諸如與鉛-錫焊料回流相關聯之溫度。Figure 15 depicts an interposer 450 on which an integrated circuit 470 is mounted. The integrated circuit 470 is connected to the interposer 450 via micro bumps or copper pillars 472. The underfill polymer 474 surrounds the micro bumps 472 and helps to bond the integrated circuit 470 to the interposer 450. The insert 450 is connected to a PCB 480 via bumps 482. The underfill polymer 474 is also used to surround the bump 482 and bond the interposer 470 to the PCB 480. Advantageously, the first and second leads 454, 458 (ie, the conductive layer 418) can be applied to the ceramic substrate 416 using photolithography as described in the method 300. Using, for example, aluminum oxide as the ceramic substrate means that the slats 414 can withstand high temperatures, such as those associated with lead-tin solder reflow.

第16圖描繪具有多個導電層418之板條414之截面。特定而言，通孔420係貫穿陶瓷基板416之厚度提供，以連接在陶瓷基板416之頂部及底部上的導電層418。在陶瓷基板416之頂側上，額外的導電層418在彼此上方建造，使得每一層界定其自身之電路圖案。每一層中之導電材料之間的區域充滿一介電材料490。在所描繪之實施例中，多層式板條將連接件自頂面上的高密度側面重新分佈至底部上的低密度側面。在實施例中，板條414亦可含有其他電路元件，諸如電阻器、電容器、電感器等。Figure 16 depicts a cross-section of a lath 414 having multiple conductive layers 418. Specifically, the through hole 420 is provided through the thickness of the ceramic substrate 416 to connect the conductive layer 418 on the top and bottom of the ceramic substrate 416. On the top side of the ceramic substrate 416, additional conductive layers 418 are built on top of each other so that each layer defines its own circuit pattern. The area between the conductive materials in each layer is filled with a dielectric material 490. In the depicted embodiment, the multi-layer slats redistribute the connectors from the high density side on the top surface to the low density side on the bottom. In an embodiment, the slats 414 may also contain other circuit elements, such as resistors, capacitors, inductors, etc.

在實施例中，陶瓷基板16、416經選擇以使得該陶瓷基板具有更高的熱導率、低介電損耗正切及/或高介電擊穿電壓。在實施例中，陶瓷基板16、416之熱導率為至少10 W/mK。在另外實施例中，陶瓷基板16、416之熱導率為至少20 W/mK，且在更另外的實施例中，陶瓷基板16、416之熱導率為至少30 W/mK。在實施例中，介電損耗正切在5 GHz或更高之頻率下為至多0.00008。在其他實施例中，介電損耗正切在10至60 GHz之頻率下為至多0.0001。另外，在實施例中，介電擊穿電壓在40 µm之基板厚度下為至少125 kV/mm。在實施例中，除了上述的低厚度及高抗撓剛度之外，還提供熱導率、介電損耗正切及/或介電擊穿電壓的前述性質。In an embodiment, the ceramic substrates 16, 416 are selected so that the ceramic substrates have higher thermal conductivity, low dielectric loss tangent, and/or high dielectric breakdown voltage. In an embodiment, the thermal conductivity of the ceramic substrate 16, 416 is at least 10 W/mK. In another embodiment, the thermal conductivity of the ceramic substrate 16, 416 is at least 20 W/mK, and in a further embodiment, the thermal conductivity of the ceramic substrate 16, 416 is at least 30 W/mK. In an embodiment, the dielectric loss tangent is at most 0.00008 at 5 GHz or higher. In other embodiments, the dielectric loss tangent is at most 0.0001 at a frequency of 10 to 60 GHz. In addition, in the embodiment, the dielectric breakdown voltage is at least 125 kV/mm at a substrate thickness of 40 µm. In an embodiment, in addition to the aforementioned low thickness and high flexural rigidity, the aforementioned properties of thermal conductivity, dielectric loss tangent, and/or dielectric breakdown voltage are also provided.

在本文中所描述之實施例中之每一者中，以捲對捲方式由陶瓷基板16、416製成之該等板條14、414提供優於可用作板條之基板材料的其他製造技術及材料的數個優點。舉例而言，使用結合撓曲剛性之帶狀基板允許在較大載具上置放更多板條。實際上，在實施例中，該等載具412超過諸如氧化鋁載具的習知載具之兩倍，此允許提高之封裝效率。此外，陶瓷基板16、416在製造期間不收縮，此允許與低溫及高溫共燒陶瓷相比併入更高精度之特徵。此外，與需要多個層之低溫共燒陶瓷相比，部件(包括高密度部件)可安裝在單一板上。與矽基板相比，本文中所揭示之該等板條14、414中所用之陶瓷基板16、416係具有較高擊穿電壓之實際電介質。In each of the embodiments described herein, the slats 14,414 made of ceramic substrates 16,416 in a roll-to-roll manner provide advantages over other manufacturing of substrate materials that can be used as slats Several advantages of technology and materials. For example, the use of a strip substrate combined with flexural rigidity allows more slats to be placed on a larger carrier. In fact, in an embodiment, these carriers 412 exceed twice that of conventional carriers such as alumina carriers, which allows for improved packaging efficiency. In addition, the ceramic substrates 16, 416 do not shrink during manufacturing, which allows the feature of incorporating higher accuracy than low-temperature and high-temperature co-fired ceramics. In addition, components (including high-density components) can be mounted on a single board compared to low-temperature co-fired ceramics that require multiple layers. Compared to silicon substrates, the ceramic substrates 16, 416 used in the slats 14, 414 disclosed herein are actual dielectrics with higher breakdown voltages.

另外，如下文的表4中所示，本文中所描述且由氧化鋁形成之陶瓷基板16、416具有所提供一般基板材料中的最高撓曲剛性。儘管出於比較目的使用了40 µm，但帶狀氧化鋁係所列出的可實際上以彼厚度製造、同時達成高撓曲剛性之材料中的唯一材料。舉例而言，聚醯亞胺可以低至12.5 µm之厚度獲得，但即使在125 µm之厚度下，聚醯亞胺仍具有小於帶狀氧化鋁的四分之一之撓曲剛性。此外，矽可在厚度上磨至小於100 µm，但如此使良率損失增加。最後，玻璃環氧物實際上不能以低至40 µm之厚度生產。表4之最後一行提供氧化鋁對其他基板之剛性比，以表明氧化鋁與其他基板材料相比剛性高多少。 表4 與其他基板材料的撓曲剛性比較

In addition, as shown in Table 4 below, the ceramic substrates 16, 416 described herein and formed of alumina have the highest flexural rigidity among the general substrate materials provided. Although 40 µm was used for comparison purposes, the only material listed in the ribbon alumina series that can actually be manufactured at that thickness while achieving high flexural rigidity. For example, polyimide can be obtained with a thickness as low as 12.5 µm, but even at a thickness of 125 µm, polyimide still has a flexural rigidity less than a quarter of that of ribbon alumina. In addition, silicon can be ground to a thickness of less than 100 µm, but this increases yield loss. Finally, glass epoxy cannot actually be produced with a thickness as low as 40 µm. The last row of Table 4 provides the rigidity ratio of alumina to other substrates to show how much alumina is more rigid than other substrate materials. Table 4 Comparison of flexural rigidity with other substrate materials

除外另有明確說明，否則本文中所闡述之任何方法絕不意欲被解釋為方法之步驟必須以特定次序執行。因此，在方法項未實際引用方法之步驟應遵循之次序或在申請專利範圍或描述中未另外特定地說明該等步驟限於特定次序的情況下，絕不意欲推斷任何特別次序。另外，如本文中所使用，詞「一」意欲包括一個或多於一個部件或元件，且不欲解釋為意味僅一個。Unless expressly stated otherwise, any method set forth in this article is by no means intended to be interpreted as the steps of the method must be performed in a specific order. Therefore, in the case where the method steps do not actually cite the steps of the method or the patent application scope or description does not specifically state that these steps are limited to a specific order, it is by no means intended to infer any particular order. In addition, as used herein, the word "a" is intended to include one or more components or elements, and is not to be construed as meaning only one.

熟習此項技術者將瞭解，在不背離所揭示實施例之精神或範疇的情況下可作出各種修改及變化。由於併有所揭示實施例之精神及物質的該等實施例之修改、組合、子組合及變化可被熟習此項技術者想到，因此該等所揭示實施例應解釋為包括在所附申請專利範圍及其等效物之範疇內的一切。Those skilled in the art will understand that various modifications and changes can be made without departing from the spirit or scope of the disclosed embodiments. Since the spirit and substance of the disclosed embodiments and the modifications, combinations, sub-combinations and changes of the embodiments can be thought of by those skilled in the art, the disclosed embodiments should be interpreted as being included in the attached patent application Everything within the scope of scope and its equivalents.

10‧‧‧條帶 12‧‧‧載具 14‧‧‧板條 16‧‧‧陶瓷基板 18‧‧‧導電層 20‧‧‧通孔 22‧‧‧導電材料 24‧‧‧臨時黏合劑 26‧‧‧保護膜 27‧‧‧發光二極體(LED)晶片 28‧‧‧發光二極體(LED) 30‧‧‧磷光體 31‧‧‧加熱器 32‧‧‧電阻性加熱元件 34a‧‧‧導電元件 34b‧‧‧導電元件 34c‧‧‧導電元件 34d‧‧‧導電元件 36‧‧‧感測器 37‧‧‧導電跡線 38‧‧‧介電層 39‧‧‧晶片電阻器 40‧‧‧導電條帶 42‧‧‧電阻元件 44‧‧‧電阻器值 48‧‧‧導電層 50‧‧‧絕緣層 51‧‧‧多層電容器 52‧‧‧電容器 60‧‧‧拾取工具 62‧‧‧滾筒 70‧‧‧鏈輪軌道 72‧‧‧孔 100‧‧‧方法 101‧‧‧步驟 102‧‧‧步驟 103‧‧‧步驟 104‧‧‧步驟 105‧‧‧步驟 106‧‧‧步驟 107‧‧‧步驟 108‧‧‧步驟 109‧‧‧步驟 110‧‧‧步驟 200‧‧‧方法 201‧‧‧步驟 202‧‧‧步驟 203‧‧‧步驟 204‧‧‧步驟 205‧‧‧步驟 206‧‧‧步驟 207‧‧‧步驟 208‧‧‧步驟 209‧‧‧步驟 300‧‧‧方法 301‧‧‧步驟 302‧‧‧步驟 303‧‧‧步驟 304‧‧‧步驟 305‧‧‧步驟 306‧‧‧步驟 307‧‧‧步驟 308‧‧‧步驟 309‧‧‧步驟 400‧‧‧面板 412‧‧‧載具 414‧‧‧板條 415‧‧‧邊界區域 416‧‧‧陶瓷基板 418‧‧‧導電層 420‧‧‧通孔 424‧‧‧黏著劑層 450‧‧‧扇出***件 452‧‧‧第一觸點 454‧‧‧第一引線 456‧‧‧通孔 458‧‧‧第二引線 460‧‧‧第二觸點 470‧‧‧積體電路 472‧‧‧微凸塊或銅柱 474‧‧‧底部填充聚合物 480‧‧‧PCB 482‧‧‧凸塊 490‧‧‧介電材料 L‧‧‧長度 W‧‧‧寬度10‧‧‧ Strip 12‧‧‧Vehicle 14‧‧‧Slat 16‧‧‧ceramic substrate 18‧‧‧conductive layer 20‧‧‧Through hole 22‧‧‧Conductive material 24‧‧‧Temporary adhesive 26‧‧‧Protection film 27‧‧‧ LED chip 28‧‧‧Light Emitting Diode (LED) 30‧‧‧ phosphor 31‧‧‧ Heater 32‧‧‧Resistance heating element 34a‧‧‧Conducting element 34b‧‧‧Conducting element 34c‧‧‧Conducting element 34d‧‧‧Conducting element 36‧‧‧Sensor 37‧‧‧ conductive trace 38‧‧‧Dielectric layer 39‧‧‧chip resistor 40‧‧‧ conductive strip 42‧‧‧Resistance element 44‧‧‧resistor value 48‧‧‧conductive layer 50‧‧‧Insulation 51‧‧‧Multilayer capacitor 52‧‧‧Capacitor 60‧‧‧ Picking tool 62‧‧‧Roller 70‧‧‧Sprocket track 72‧‧‧hole 100‧‧‧Method 101‧‧‧Step 102‧‧‧Step 103‧‧‧Step 104‧‧‧Step 105‧‧‧Step 106‧‧‧Step 107‧‧‧Step 108‧‧‧Step 109‧‧‧Step 110‧‧‧Step 200‧‧‧Method 201‧‧‧Step 202‧‧‧Step 203‧‧‧Step 204‧‧‧Step 205‧‧‧Step 206‧‧‧Step 207‧‧‧Step 208‧‧‧Step 209‧‧‧Step 300‧‧‧Method 301‧‧‧Step 302‧‧‧Step 303‧‧‧Step 304‧‧‧Step 305‧‧‧Step 306‧‧‧Step 307‧‧‧Step 308‧‧‧Step 309‧‧‧Step 400‧‧‧Panel 412‧‧‧vehicle 414‧‧‧Slat 415‧‧‧Border area 416‧‧‧Ceramic substrate 418‧‧‧conductive layer 420‧‧‧Through hole 424‧‧‧Adhesive layer 450‧‧‧Fan-out insert 452‧‧‧First contact 454‧‧‧First lead 456‧‧‧Through hole 458‧‧‧Second lead 460‧‧‧second contact 470‧‧‧Integrated circuit 472‧‧‧Micro bumps or copper pillars 474‧‧‧ Underfill polymer 480‧‧‧PCB 482‧‧‧Bump 490‧‧‧dielectric material L‧‧‧Length W‧‧‧Width

第1圖係根據一例示性實施例的用於利用捲對捲製造方法產生之電子基板之板條的條帶。FIG. 1 is a strip for a lath of an electronic substrate produced using a roll-to-roll manufacturing method according to an exemplary embodiment.

第2圖係根據一例示性實施例的第1圖之條帶之俯視圖。Figure 2 is a top view of the strip of Figure 1 according to an exemplary embodiment.

第3圖係根據一例示性實施例的用於準備用於電子基板之板條之條帶的第一捲對捲製造方法之流程圖。FIG. 3 is a flowchart of a first roll-to-roll manufacturing method for preparing a strip of lath for an electronic substrate according to an exemplary embodiment.

第4圖係根據一例示性實施例的用於準備用於電子基板之板條之條帶的第二捲對捲製造方法之流程圖。FIG. 4 is a flowchart of a second roll-to-roll manufacturing method for preparing a strip of lath for an electronic substrate according to an exemplary embodiment.

第5圖係根據一例示性實施例的利用捲對捲製造方法形成之發光二極體。FIG. 5 is a light emitting diode formed using a roll-to-roll manufacturing method according to an exemplary embodiment.

第6A圖係根據一例示性實施例的經由捲對捲製造方法產生之板條加熱器之俯視圖。FIG. 6A is a top view of a slat heater produced by a roll-to-roll manufacturing method according to an exemplary embodiment.

第6B圖係根據一例示性實施例的添加了介電元件之第6A圖之板條加熱器的側視圖。FIG. 6B is a side view of the slat heater of FIG. 6A to which a dielectric element is added according to an exemplary embodiment.

第7圖係根據一例示性實施例的利用捲對捲製造方法形成之晶片電阻器。FIG. 7 is a chip resistor formed using a roll-to-roll manufacturing method according to an exemplary embodiment.

第8A圖係根據一例示性實施例的利用捲對捲製造方法產生之多層電容器，其中該等層以串聯方式連接。FIG. 8A is a multilayer capacitor produced using a roll-to-roll manufacturing method according to an exemplary embodiment, in which the layers are connected in series.

第8B圖係根據一例示性實施例的利用捲對捲製造方法產生之多層電容器，其中該等層以並聯方式連接。FIG. 8B is a multilayer capacitor produced using a roll-to-roll manufacturing method according to an exemplary embodiment, in which the layers are connected in parallel.

第9圖根據一例示性實施例描繪板條隨著載具前進經過滾筒而與載具分離。Figure 9 depicts the slats being separated from the carrier as the carrier advances past the drum, according to an exemplary embodiment.

第10圖根據一例示性實施例描繪具有軌道之條帶，該等軌道經配置以跟隨鏈輪以用於在處理期間精確地移動條帶。Figure 10 depicts strips with rails configured to follow sprockets for accurately moving the strips during processing according to an exemplary embodiment.

第11圖係根據一例示性實施例的用於準備面板之第一捲對捲製造方法之流程圖，該等面板附接至載具且在載具上單分成板條。FIG. 11 is a flowchart of a first roll-to-roll manufacturing method for preparing panels according to an exemplary embodiment, the panels are attached to a carrier and singulated into slats on the carrier.

第12圖描繪根據一例示性實施例的含有複數個單分板條之面板。Figure 12 depicts a panel containing a plurality of single sub-slats according to an exemplary embodiment.

第13圖係根據一例示性實施例的在載具上之板條之側視圖。FIG. 13 is a side view of the slats on the carrier according to an exemplary embodiment.

第14A圖及第14B圖根據一例示性實施例分別描繪經由捲對捲製造方法製造之扇出板條之頂側及底側。FIGS. 14A and 14B depict the top and bottom sides of the fan-out slats manufactured by the roll-to-roll manufacturing method, respectively, according to an exemplary embodiment.

第15圖根據一例示性實施例描繪連接至第14A圖及第14B圖之扇出板條之晶片的側視圖。FIG. 15 depicts a side view of a wafer connected to the fan-out slats of FIGS. 14A and 14B according to an exemplary embodiment.

第16圖根據一例示性實施例描繪具有多個導電層之板條的截面圖。Figure 16 depicts a cross-sectional view of a slat with multiple conductive layers according to an exemplary embodiment.

國內寄存資訊 (請依寄存機構、日期、號碼順序註記) 無Domestic storage information (please note in order of storage institution, date, number) no

國外寄存資訊 (請依寄存國家、機構、日期、號碼順序註記) 無Overseas hosting information (please note in order of hosting country, institution, date, number) no

10‧‧‧條帶 10‧‧‧ Strip

12‧‧‧載具 12‧‧‧Vehicle

14‧‧‧板條 14‧‧‧Slat

16‧‧‧陶瓷基板 16‧‧‧ceramic substrate

18‧‧‧導電層 18‧‧‧conductive layer

20‧‧‧通孔 20‧‧‧Through hole

22‧‧‧導電材料 22‧‧‧Conductive material

L‧‧‧長度 L‧‧‧Length

W‧‧‧寬度 W‧‧‧Width

Claims (35)

一種用於建立一電子基板條帶之方法，該方法包含以下步驟： 提供一陶瓷基板之一帶狀物，該陶瓷基板界定一第一外表面與一第二外表面之間的不超過200 μm之一厚度，該第二外表面與該第一外表面相反； 貫穿該陶瓷基板之該厚度形成至少一個通孔； 將一第一導電層塗覆至該第一外表面且將一第二導電層塗覆至該第二外表面，使得經由該至少一個通孔在該第一導電層與該第二導電層之間建立電連通；以及 將該陶瓷基板單分成個別板條。A method for creating an electronic substrate strip, the method includes the following steps: Providing a ribbon of a ceramic substrate that defines a thickness between a first outer surface and a second outer surface that does not exceed 200 μm, the second outer surface being opposite to the first outer surface; Forming at least one through hole through the thickness of the ceramic substrate; Applying a first conductive layer to the first outer surface and applying a second conductive layer to the second outer surface so that the first conductive layer and the second conductive layer pass through the at least one through hole Establish electrical connection between; and The ceramic substrate is divided into individual slats. 如請求項1所述之方法，該方法進一步包含以下步驟：選擇該陶瓷基板以包含氧化鋁、氧化鋯、鈦酸鹽類或鐵酸鹽類中之至少一者。The method of claim 1, further comprising the step of selecting the ceramic substrate to include at least one of alumina, zirconia, titanates or ferrite. 如請求項1或請求項2所述之方法，該方法進一步包含以下步驟：在塗覆該第一導電層或該第二導電層之該步驟之前沉積一黏合層。The method according to claim 1 or claim 2, further comprising the step of depositing an adhesive layer before the step of applying the first conductive layer or the second conductive layer. 如請求項3所述之方法，其中該黏合層具有100 nm至500 nm之一厚度。The method according to claim 3, wherein the adhesive layer has a thickness of 100 nm to 500 nm. 如請求項4所述之方法，其中該黏合層包含鈦、鎢、鈦-鎢合金、氮化鈦、鉭、氮化鉭、鉻或鉻-銅合金中之至少一者。The method of claim 4, wherein the adhesive layer comprises at least one of titanium, tungsten, titanium-tungsten alloy, titanium nitride, tantalum, tantalum nitride, chromium, or chromium-copper alloy. 如請求項1或請求項2所述之方法，其中貫穿該陶瓷基板之該厚度形成至少一個通孔之該步驟進一步包含貫穿該陶瓷基板之該厚度雷射剝蝕25 µm至125 µm之孔。The method of claim 1 or claim 2, wherein the step of forming at least one through hole through the thickness of the ceramic substrate further comprises laser ablating a hole of 25 µm to 125 µm through the thickness of the ceramic substrate. 如請求項1所述之方法，該方法進一步包含以下步驟： 將該等個別板條層壓至一聚合載具之一條帶，該聚合載具具有小於該陶瓷基板之該撓曲剛性的一撓曲剛性。The method according to claim 1, further comprising the following steps: The individual laths are laminated to a strip of a polymeric carrier having a flexural rigidity that is less than the flexural rigidity of the ceramic substrate. 如請求項7所述之方法，該方法進一步包含以下步驟：在該單分步驟之前將一臨時載具層壓至該陶瓷基板，其中，在該單分步驟期間，該臨時載具保持該等個別板條。The method according to claim 7, further comprising the step of: laminating a temporary carrier to the ceramic substrate before the single sub-step, wherein during the single sub-step, the temporary carrier holds the Individual slats. 如請求項8所述之方法，該方法進一步包含以下步驟：在該單分步驟之後拉伸該臨時載具，以便在該等個別板條之間產生一預先界定之空間。The method as recited in claim 8, the method further comprising the step of stretching the temporary carrier after the single sub-step to create a predefined space between the individual slats. 如請求項7所述之方法，該方法進一步包含以下步驟：在該層壓步驟之後將該聚合載具捲繞成一卷狀物。The method according to claim 7, further comprising the step of winding the polymerization carrier into a roll after the laminating step. 如請求項7所述之方法，該方法進一步包含以下步驟：在該層壓步驟之後在該等個別板條上方提供一保護膜。The method of claim 7, further comprising the step of providing a protective film over the individual slats after the laminating step. 如請求項1所述之方法，其中塗覆一導電層之該步驟進一步包含將該導電層印刷至該陶瓷基板之該第一外表面或該第二外表面中之至少一者上。The method of claim 1, wherein the step of applying a conductive layer further comprises printing the conductive layer on at least one of the first outer surface or the second outer surface of the ceramic substrate. 如請求項12所述之方法，其中經由凹版印刷、噴墨印刷、快乾印刷或壓印微影術中之至少一者來實現該印刷步驟。The method of claim 12, wherein the printing step is achieved via at least one of gravure printing, inkjet printing, quick-drying printing, or imprint lithography. 如請求項12所述之方法，該方法進一步包含以下步驟：將一電阻器、一絕緣層、一介電層、一功能層、一電位計電阻器、一加熱器電阻器或一負溫度係數熱阻器中之至少一者印刷至該導電層上，或印刷至該陶瓷基板之該第一外表面及該第二外表面中之至少一者上。The method according to claim 12, further comprising the steps of: applying a resistor, an insulating layer, a dielectric layer, a functional layer, a potentiometer resistor, a heater resistor or a negative temperature coefficient At least one of the thermal resistors is printed on the conductive layer or on at least one of the first outer surface and the second outer surface of the ceramic substrate. 如請求項1所述之方法，其中，在將該陶瓷基板單分成個別板條的該步驟之前，該方法進一步包含以下步驟： 將該陶瓷基板之該帶切割成面板；以及 將每一面板附接至一載具； 其中該單分步驟包含在將每一面板附接至該載具時將該面板單分成個別板條。The method according to claim 1, wherein before the step of singulating the ceramic substrate into individual slats, the method further includes the following steps: Cutting the tape of the ceramic substrate into panels; and Attach each panel to a vehicle; The singulation step includes singulating the panel into individual slats when attaching each panel to the carrier. 如請求項15所述之方法，其中每一面板係矩形的且具有大於200 mm之一長度或一寬度中之至少一者。The method of claim 15, wherein each panel is rectangular and has at least one of a length or a width greater than 200 mm. 如請求項15所述之方法，其中該載具包含一玻璃或一金屬中之至少一者。The method of claim 15, wherein the vehicle includes at least one of a glass or a metal. 如請求項15所述之方法，其中該載具對紫外光譜中之光的至少一部分係透明的，其中將每一面板附接至該載具的該步驟進一步包含用一黏合層將每一面板結合至一載具，且其中該方法進一步包含以下步驟：藉由將該黏合層曝露於透射穿過該載具之紫外光來弱化該面板與該載具之間的該結合。The method of claim 15, wherein the carrier is transparent to at least a portion of light in the ultraviolet spectrum, wherein the step of attaching each panel to the carrier further includes attaching each panel with an adhesive layer Bonding to a carrier, and wherein the method further includes the step of weakening the bond between the panel and the carrier by exposing the adhesive layer to ultraviolet light transmitted through the carrier. 一種電子基板卷狀物，該卷狀物包含： 複數個電子基板，該等電子基板中之每一者包含一陶瓷基板；以及 一聚合載具條帶，該複數個電子基板黏附至該聚合載具條帶之一表面； 其中每一陶瓷基板具有一第一厚度及一第一撓曲剛性，且該聚合載具條帶具有一第二厚度及一第二撓曲剛性； 其中該第一厚度小於該第二厚度；且 其中該第一撓曲剛性係該第二撓曲剛性的至少五倍。An electronic substrate roll, the roll contains: A plurality of electronic substrates, each of which includes a ceramic substrate; and A polymer carrier strip, the plurality of electronic substrates are adhered to a surface of the polymer carrier strip; Each ceramic substrate has a first thickness and a first flexural rigidity, and the polymer carrier strip has a second thickness and a second flexural rigidity; Where the first thickness is less than the second thickness; and The first flexural rigidity is at least five times the second flexural rigidity. 如請求項19所述之電子基板卷狀物，其中該陶瓷基板包含氧化鋁、氧化鋯、鈦酸鹽類或鐵酸鹽類中之至少一者。The electronic substrate roll of claim 19, wherein the ceramic substrate includes at least one of alumina, zirconia, titanates or ferrite. 如請求項19或請求項20所述之電子基板卷狀物，其中該複數個電子基板中之每一者的該陶瓷基板之該第一厚度小於200 µm。The electronic substrate roll of claim 19 or claim 20, wherein the first thickness of the ceramic substrate of each of the plurality of electronic substrates is less than 200 µm. 如請求項19或請求項20所述之電子基板卷狀物，其中該聚合載具條帶之該第二厚度小於125 µm。The electronic substrate roll of claim 19 or claim 20, wherein the second thickness of the polymeric carrier strip is less than 125 µm. 如請求項19所述之電子基板卷狀物，其中該複數個電子基板係以根據ASTM D6862量測的不超過0.5 N/cm之一黏附強度黏附至該聚合載具條帶之該表面。The electronic substrate roll of claim 19, wherein the plurality of electronic substrates are adhered to the surface of the polymeric carrier strip with an adhesive strength measured according to ASTM D6862 of not more than 0.5 N/cm. 如請求項19所述之電子基板卷狀物，其中該聚合載具條帶長100 m至400 m。The electronic substrate roll of claim 19, wherein the polymeric carrier strip is 100 m to 400 m long. 如請求項19所述之電子基板卷狀物，其中該複數個電子基板包含發光二極體。The electronic substrate roll of claim 19, wherein the plurality of electronic substrates include light emitting diodes. 如請求項19所述之電子基板卷狀物，其中該複數個電子基板包含板條加熱器。The electronic substrate roll of claim 19, wherein the plurality of electronic substrates include a slat heater. 如請求項19所述之電子基板卷狀物，其中該複數個電子基板包含晶片電阻器。The electronic substrate roll of claim 19, wherein the plurality of electronic substrates include chip resistors. 如請求項19所述之電子基板卷狀物，其中該複數個電子基板包含多層電容器。The electronic substrate roll of claim 19, wherein the plurality of electronic substrates include multilayer capacitors. 如請求項28所述之電子基板卷狀物，其中該等多層電容器包含並聯地分層之電容器。The electronic substrate roll of claim 28, wherein the multilayer capacitors include capacitors layered in parallel. 如請求項28所述之電子基板卷狀物，其中該等多層電容器包含串聯地分層之電容器。The electronic substrate roll of claim 28, wherein the multilayer capacitors include capacitors layered in series. 如請求項19所述之電子基板卷狀物，其中該複數個電子基板包含扇出***件。The electronic substrate roll of claim 19, wherein the plurality of electronic substrates include fan-out inserts. 一種用於電子基板之載具系統，該載具系統包含： 一載具；以及 複數個板條，該複數個板條經由一黏合層附接至該載具，該複數個板條中之每一者包含一陶瓷基板，該陶瓷基板具有小於200 µm之一厚度； 其中該複數個板條係自具有一矩形形狀之一面板單分，該面板具有大於200 mm之一長度或一寬度中之至少一者。A carrier system for an electronic substrate. The carrier system includes: A vehicle; and A plurality of slats, the plurality of slats being attached to the carrier via an adhesive layer, each of the plurality of slats including a ceramic substrate having a thickness of less than 200 µm; The plurality of slats are divided from a panel having a rectangular shape, the panel having at least one of a length or a width greater than 200 mm. 如請求項32所述之載具系統，其中該載具包含一玻璃或一金屬中之至少一者。The vehicle system of claim 32, wherein the vehicle includes at least one of a glass or a metal. 如請求項32所述之載具系統，其中該陶瓷基板包含氧化鋁、氧化鋯、鈦酸鹽類或鐵酸鹽類中之至少一者。The carrier system according to claim 32, wherein the ceramic substrate comprises at least one of alumina, zirconia, titanates or ferrite. 如請求項32所述之載具系統，其中該複數個板條中之每一者的該陶瓷基板之該厚度小於200 µm。The carrier system according to claim 32, wherein the thickness of the ceramic substrate of each of the plurality of slats is less than 200 µm.

Images