CN101169556A - Side-light type backlight module group using LED light source - Google Patents
Side-light type backlight module group using LED light source Download PDFInfo
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- CN101169556A CN101169556A CNA2007101709725A CN200710170972A CN101169556A CN 101169556 A CN101169556 A CN 101169556A CN A2007101709725 A CNA2007101709725 A CN A2007101709725A CN 200710170972 A CN200710170972 A CN 200710170972A CN 101169556 A CN101169556 A CN 101169556A
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Abstract
The invention discloses a sidelight-typed blacklight module which adopts an LED light-source, which comprises a PCB substrate, LED chips, and a light guide plate. A plurality of LED chips are fixed in equal interval at the PBC substrate; a sealing structure can be used for sealing all LED chips arranged on the PBC substrate; the shape of the sealing structure is a rectangular with length and width same to that of the light guide plate. Except the light-outlet surface of the sealing structure, contacting the light guide plate, rest surfaces of the sealing structure are coated or pasted with reflective material. At the position of each LED chip in the sealing structure, a cavity for containing the LED chip is arranged. The sidelight-typed blacklight module of the invention, which adopts the LED light-source, changes the distribution-type point light into the rectangular panel light which matches with the light inlet surface of the light guide plate, so that the invention can lighten like a CCFL light source at the light inlet side of the light guide plate.
Description
Technical field
The present invention relates to a kind of side-light type module backlight of LCD, particularly a kind of side-light type module backlight that uses led light source.
Background technology
At present, LCD has been the main flow in flat pannel display field.Module backlight is one of key part and component of LCD, because LCDs itself is not luminous, the function of module backlight just provides enough brightness and the light source that is evenly distributed, and makes its normally show image.Compare with other back light, the most significant advantage of led light source is that unprecedented color reducibility can be provided.By LED that selects suitable wavelength and the color film that is complementary with it, the color rendition scope in LED-backlit source can reach more than 105% even 120% of NTSC (NTSC) standard.Comparatively speaking, traditional cathode ray tube (CRT) TV has only about 85%, and the LCD TV of CCFL backlight has only 65%～75% especially.In image quality is exactly the demonstration industry of life, and having more, gay colours will be an overwhelming advantage.On serviceable life, LED can reach more than 100,000 hours.To contain fatal mercuryvapour different with CCFL, and LED is a semiconductor solid-state optical source, is a kind of ideal green light source fully.
The side-light type module backlight of the use led light source of prior art is equidistantly to arrange many packaged led light sources (can be approximated to be pointolite) and form a row pointolite at the incidence surface of light guide plate (LGP), when forming module backlight, make the exiting surface of LED corresponding with the incidence surface of light guide plate, will on light guide plate, produce a clear zone like this with the corresponding position of LED, and the position between two adjacent LED can produce a leg-of-mutton dark space, will form light and dark zone at the incidence surface of light guide plate like this.In order to improve this light and dark areal distribution, at present main solution has light guide plate mesh point to arrange to adjust and in incidence surface and the corresponding position of LED particle of light guide plate prism structure or groove structure or the like is set, and above method all is difficult to the phenomenon that this clear zone of elimination and dark space distribute alternately.
Summary of the invention
The purpose of this invention is to provide a kind of side-light type module backlight that uses led light source, the problem that clear zone that exists when solving the use led light source and dark space distribute alternately.
For achieving the above object, the side-light type of use led light source of the present invention module backlight, mainly comprise PCB substrate, led chip and light guide plate, a plurality of led chips equidistantly are fixed on the PCB substrate, adopt encapsulating structure that all led chips on the described PCB substrate are carried out overall package, be shaped as and the light guide plate of encapsulating structure has the rectangular parallelepiped of equal length and width, encapsulating structure except with exiting surface that light guide plate contacts other each faces coatings or paste reflective material; All there is a cavity that can hold described led chip at each led chip place in described encapsulating structure.
Described led chip adopts White-light LED chip or RGB mixed light led chip.
Described encapsulating structure adopts epoxy resin or silica gel material.
Described reflective material is the silverskin or the tunica albuginea of high reflectance.
On the exiting surface of described encapsulating structure the coating or etch the site, the position of described site is corresponding with the position of led chip.
Described cavity is semisphere or taper shape.
The surface of described cavity constitutes the semisphere microstructure for the rhombus microstructure that is made of a plurality of rhombuses or by a plurality of semispheres.
The side-light type of use led light source of the present invention module backlight becomes the distributed dot light source of led light source and rectangle area source that the light guide plate incidence surface coincide, makes it can be luminous equably in light guide plate light inlet side as the CCFL light source.
Description of drawings
Fig. 1 is the perspective diagram of the side-light type module backlight of use led light source of the present invention;
Fig. 2 is the schematic top plan view of the side-light type module backlight of the use led light source among Fig. 1;
Fig. 3 is the synoptic diagram that adopts the side-light type module backlight of RGB mixed light led chip;
Fig. 4 is the site synoptic diagram on the exiting surface of encapsulating structure;
Fig. 5 is the surface structure synoptic diagram of cavity.
Embodiment
Below in conjunction with accompanying drawing invention is further described:
Fig. 1 is the perspective diagram of the side-light type module backlight of use led light source of the present invention, Fig. 2 is the schematic top plan view of the side-light type module backlight of the use led light source among Fig. 1, omitted light guide plate 14 among Fig. 2, as shown in the figure, the side-light type of use led light source of the present invention module backlight mainly comprises PCB (printed circuit board (PCB)) substrate 10, encapsulating structure 11, cavity 12, led chip 13 and light guide plate 14.
A plurality of led chips 13 equidistantly are fixed on the PCB substrate 10 by adhesive or scolder, pass through the electrical interconnection of 10 of lead-in wire bonding realization led chip 13 and PCB substrates again, and promptly COB (Chip On Board) chip on board is directly adorned encapsulation technology.PCB substrate 10 adopts heat conductivility good metal base or ceramic matric composites, as aluminium base or cover copper ceramic substrate etc.The face at led chip 13 places applies reflective material on PCB substrate 10, the silverskin or the tunica albuginea of the high reflectance that uses as present CCFL fluorescent tube reflex housing.Adopt then that all led chips 13 carry out overall package on 11 pairs of PCB substrates 10 of encapsulating structure of materials such as epoxy resin or silica gel.Encapsulating structure 11 be shaped as the rectangular parallelepiped that has equal length and width with light guide plate 14.The one side that encapsulating structure 11 contacts with light guide plate 14 is the exiting surface of encapsulating structure 11, encapsulating structure 11 except with exiting surface that light guide plate 14 contacts other each faces coatings or paste the silverskin or the tunica albuginea of reflective material such as high reflectance, make luminous energy concentrate on the exiting surface outgoing of encapsulating structure 11.
All there is a cavity 12 that can hold led chip 13 at each led chip 13 place in encapsulating structure 11, and cavity 12 can be semisphere, taper shape etc.The luminous energy that cavity 12 is sent led chip 13 spreads more equably.In the cavity 12 can be that vacuum also can charge into inert gas, and cavity 12 is that encapsulating structure 11 is by emptying or caving in formed.
What the led chip 13 shown in Fig. 2 adopted is White-light LED chip, and at the inside surface coating of cavity 12 and the corresponding phosphor material powder of spectrum of led chip 13, the light excitated fluorescent powder that is sent by led chip 13 sends white light.Thereby make led light source launch needed spectrum and corresponding color domain by certain requirement.
Fig. 3 is the synoptic diagram that adopts the side-light type module backlight of RGB mixed light led chip.Led chip 13 can also adopt the form of RGB mixed light led chip to be integrated in respectively on the PCB substrate 10, then it is carried out overall package.The array mode of RGB mixed light led chip can be adjusted as required, as RGGB, RGGBB etc., to obtain needed spectrum and corresponding color domain.
Fig. 4 is the site synoptic diagram on the exiting surface of encapsulating structure 11.As shown in the figure, on the exiting surface of encapsulating structure 11, be coated with or etch site 110.The position of site 110 is corresponding with the position of led chip 13, and arranging for around the middle mind-set with led chip 13 in site 110, arranges density by height on earth.Make on the encapsulating structure 11 that luminous energy further spreads on the led chip 13 pairing positions, light is scattered more equably.
For the luminous energy that makes led chip 13 further spreads, can do various multi-form microstructures to the surface of cavity 12 and handle, as shown in Figure 5, Fig. 5 is the surface structure synoptic diagram of cavity 12.Provided the synoptic diagram of two kinds of microstructures among Fig. 5, the surface that is cavity 12 constitutes semisphere microstructure 122 for the rhombus microstructure 121 that is made of a plurality of rhombuses with by a plurality of semispheres, the surface of the cavity 12 of each led chip 13 can be adopted wherein a kind of microstructure simultaneously, also can adopt different microstructures respectively.
The foregoing description only is used to illustrate the present invention, and those skilled in the art can make various modifications or replacement to embodiments of the invention, and does not depart from spirit of the present invention, and these modifications or replacement should be considered as dropping in protection scope of the present invention.
Claims (8)
1. side-light type module backlight that uses led light source, mainly comprise PCB substrate, led chip and light guide plate, a plurality of led chips equidistantly are fixed on the PCB substrate, it is characterized in that, adopt encapsulating structure that all led chips on the described PCB substrate are carried out overall package, be shaped as and the light guide plate of encapsulating structure has the rectangular parallelepiped of equal length and width, encapsulating structure except with exiting surface that light guide plate contacts other each faces coatings or paste reflective material; All there is a cavity that can hold described led chip at each led chip place in described encapsulating structure.
2. the side-light type of use led light source as claimed in claim 1 module backlight is characterized in that, described led chip adopts White-light LED chip or RGB mixed light led chip.
3. the side-light type of use led light source as claimed in claim 2 module backlight is characterized in that, when described led chip adopted White-light LED chip, the inside surface of described cavity applied the corresponding phosphor material powder of spectrum with described led chip.
4. the side-light type of use led light source as claimed in claim 1 module backlight is characterized in that, described encapsulating structure adopts epoxy resin or silica gel material.
5. the side-light type of use led light source as claimed in claim 1 module backlight is characterized in that, described reflective material is the silverskin or the tunica albuginea of high reflectance.
6. the side-light type of use led light source as claimed in claim 1 module backlight is characterized in that, on the exiting surface of described encapsulating structure the coating or etch the site, the position of described site is corresponding with the position of led chip.
7. the side-light type of use led light source as claimed in claim 1 module backlight is characterized in that, described cavity is semisphere or taper shape.
8. the side-light type of use led light source as claimed in claim 1 module backlight is characterized in that, the surface of described cavity constitutes the semisphere microstructure for the rhombus microstructure that is made of a plurality of rhombuses or by a plurality of semispheres.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101709725A CN101169556A (en) | 2007-11-26 | 2007-11-26 | Side-light type backlight module group using LED light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101709725A CN101169556A (en) | 2007-11-26 | 2007-11-26 | Side-light type backlight module group using LED light source |
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| CN101169556A true CN101169556A (en) | 2008-04-30 |
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| CNA2007101709725A Pending CN101169556A (en) | 2007-11-26 | 2007-11-26 | Side-light type backlight module group using LED light source |
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Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101902877A (en) * | 2010-06-08 | 2010-12-01 | 深圳市瑞丰光电子股份有限公司 | PCB board, chip type LED and LED lighting device |
| CN102235643A (en) * | 2010-04-22 | 2011-11-09 | 富士迈半导体精密工业（上海）有限公司 | Backlight module |
| CN102367936A (en) * | 2011-12-01 | 2012-03-07 | 南京中电熊猫液晶显示科技有限公司 | LED (light emitting diode) light source used for sidelight type backlight source module |
| CN102483485A (en) * | 2009-08-03 | 2012-05-30 | 高通Mems科技公司 | Microstructures For Light Guide Illumination |
| WO2012155365A1 (en) * | 2011-05-16 | 2012-11-22 | 深圳市华星光电技术有限公司 | Backlight module and display device |
| CN102809100A (en) * | 2012-08-09 | 2012-12-05 | 京东方科技集团股份有限公司 | Backlight and production method thereof |
| CN103047584A (en) * | 2012-12-07 | 2013-04-17 | 京东方科技集团股份有限公司 | Backlight module, production method thereof and display device |
| CN103047583A (en) * | 2012-12-07 | 2013-04-17 | 康佳集团股份有限公司 | Side light direct type backlight module |
| WO2013143158A1 (en) * | 2012-03-30 | 2013-10-03 | 深圳市华星光电技术有限公司 | Light-emitting diode light strip structure |
| CN103901665A (en) * | 2012-12-26 | 2014-07-02 | 乐金显示有限公司 | Backlight unit and liquid crystal display device including the same |
| CN104534417A (en) * | 2014-12-24 | 2015-04-22 | 安徽芯瑞达电子科技有限公司 | PCB and direct type backlight module with PCB |
| CN107816640A (en) * | 2016-09-13 | 2018-03-20 | 赛尔富电子有限公司 | A kind of ultra-thin area source LED surface mounted lights |
| CN109219238A (en) * | 2017-07-03 | 2019-01-15 | 张文耀 | Using silica gel plate as the circuit board of substrate and its manufacturing method |
| CN109283721A (en) * | 2018-08-31 | 2019-01-29 | 合肥泰沃达智能装备有限公司 | A kind of In-cell touch panel and preparation method thereof |
| CN110596951A (en) * | 2018-05-23 | 2019-12-20 | 青岛海信电器股份有限公司 | Mini LED lamp panel, preparation method and display device |
| WO2020125152A1 (en) * | 2018-12-21 | 2020-06-25 | 南京杰迈视讯科技有限公司 | Led electronic display screen protection and adjustment device using electrochromic glass |
| CN112309243A (en) * | 2020-11-06 | 2021-02-02 | 武汉华星光电技术有限公司 | Backlight module and display device |
| CN117008377A (en) * | 2023-10-08 | 2023-11-07 | 合肥泰沃达智能装备有限公司 | Direct type backlight source with zero light mixing distance and display equipment using direct type backlight source |
-
2007
- 2007-11-26 CN CNA2007101709725A patent/CN101169556A/en active Pending
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102483485A (en) * | 2009-08-03 | 2012-05-30 | 高通Mems科技公司 | Microstructures For Light Guide Illumination |
| CN102235643A (en) * | 2010-04-22 | 2011-11-09 | 富士迈半导体精密工业（上海）有限公司 | Backlight module |
| CN101902877A (en) * | 2010-06-08 | 2010-12-01 | 深圳市瑞丰光电子股份有限公司 | PCB board, chip type LED and LED lighting device |
| WO2012155365A1 (en) * | 2011-05-16 | 2012-11-22 | 深圳市华星光电技术有限公司 | Backlight module and display device |
| CN102367936A (en) * | 2011-12-01 | 2012-03-07 | 南京中电熊猫液晶显示科技有限公司 | LED (light emitting diode) light source used for sidelight type backlight source module |
| CN102367936B (en) * | 2011-12-01 | 2013-11-20 | 南京中电熊猫液晶显示科技有限公司 | LED (light emitting diode) light source used for sidelight type backlight source module |
| WO2013143158A1 (en) * | 2012-03-30 | 2013-10-03 | 深圳市华星光电技术有限公司 | Light-emitting diode light strip structure |
| CN102809100A (en) * | 2012-08-09 | 2012-12-05 | 京东方科技集团股份有限公司 | Backlight and production method thereof |
| CN103047584B (en) * | 2012-12-07 | 2015-10-14 | 京东方科技集团股份有限公司 | A kind of backlight module and preparation method thereof, display device |
| CN103047584A (en) * | 2012-12-07 | 2013-04-17 | 京东方科技集团股份有限公司 | Backlight module, production method thereof and display device |
| CN103047583A (en) * | 2012-12-07 | 2013-04-17 | 康佳集团股份有限公司 | Side light direct type backlight module |
| CN103901665A (en) * | 2012-12-26 | 2014-07-02 | 乐金显示有限公司 | Backlight unit and liquid crystal display device including the same |
| CN103901665B (en) * | 2012-12-26 | 2016-08-17 | 乐金显示有限公司 | Back light unit and include the liquid crystal display of this back light unit |
| CN104534417A (en) * | 2014-12-24 | 2015-04-22 | 安徽芯瑞达电子科技有限公司 | PCB and direct type backlight module with PCB |
| CN104534417B (en) * | 2014-12-24 | 2018-06-26 | 安徽芯瑞达科技股份有限公司 | A kind of PCB and its down straight aphototropism mode set of application |
| CN107816640A (en) * | 2016-09-13 | 2018-03-20 | 赛尔富电子有限公司 | A kind of ultra-thin area source LED surface mounted lights |
| CN109219238A (en) * | 2017-07-03 | 2019-01-15 | 张文耀 | Using silica gel plate as the circuit board of substrate and its manufacturing method |
| CN110596951A (en) * | 2018-05-23 | 2019-12-20 | 青岛海信电器股份有限公司 | Mini LED lamp panel, preparation method and display device |
| CN109283721A (en) * | 2018-08-31 | 2019-01-29 | 合肥泰沃达智能装备有限公司 | A kind of In-cell touch panel and preparation method thereof |
| WO2020125152A1 (en) * | 2018-12-21 | 2020-06-25 | 南京杰迈视讯科技有限公司 | Led electronic display screen protection and adjustment device using electrochromic glass |
| CN112309243A (en) * | 2020-11-06 | 2021-02-02 | 武汉华星光电技术有限公司 | Backlight module and display device |
| CN117008377A (en) * | 2023-10-08 | 2023-11-07 | 合肥泰沃达智能装备有限公司 | Direct type backlight source with zero light mixing distance and display equipment using direct type backlight source |
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Open date: 20080430 |