CN109179037A - It is a kind of for reduce DBC substrate single side sintering after buckling deformation presser device - Google Patents
It is a kind of for reduce DBC substrate single side sintering after buckling deformation presser device Download PDFInfo
- Publication number
- CN109179037A CN109179037A CN201810916538.5A CN201810916538A CN109179037A CN 109179037 A CN109179037 A CN 109179037A CN 201810916538 A CN201810916538 A CN 201810916538A CN 109179037 A CN109179037 A CN 109179037A
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- ceramic wafer
- groove
- slot
- top board
- dbc substrate
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- 239000000758 substrate Substances 0.000 title claims abstract description 57
- 238000005245 sintering Methods 0.000 title abstract description 14
- 239000000919 ceramic Substances 0.000 claims abstract description 71
- 230000007246 mechanism Effects 0.000 claims abstract description 25
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052573 porcelain Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H23/00—Registering, tensioning, smoothing or guiding webs
- B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
- B65H23/34—Apparatus for taking-out curl from webs
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to semiconductor processing technology fields.It is a kind of for reducing the presser device of buckling deformation after the sintering of DBC substrate single side, an including support base；It further include a lower platen, lower platen is mounted in support base, and lower platen is equipped with the lower groove of an opening upwards, and the slot bottom of lower groove is equipped with ceramic wafer, and the outer surface of following ceramic wafer is the contact surface for contacting DBC substrate；It further include a top board, the surface of lower platen is arranged in top board, and a upper groove that Open Side Down is offered on top board, and the slot bottom of upper groove is equipped with ceramic wafer on one, and the outer surface of the above ceramic wafer is the contact surface for contacting DBC substrate；It further include the driving mechanism that a driving top board moves up and down, driving mechanism is connected with top board.This patent drives top board to push by presser device, by driving mechanism, and then realizes that giving DBC substrate applies pressure, convenient for reducing warpage deflection after control single substrate sintering.
Description
Technical field
The present invention relates to semiconductor processing technology fields, and in particular to DBC substrate manufacture equipment.
Background technique
Covering copper ceramic substrate (DBC substrate) is double-sided copper-clad, i.e. two sides copper sheet need to be sintered respectively through twice.Due to copper
Piece is different from ceramic thermal expansion coefficient, when the thickness matching of copper sheet and ceramics has big difference (thick copper and book ceramics are arranged in pairs or groups),
After the completion of single side (the first face copper sheet) sintering, the buckling deformation of substrate can be very big.
Due to the particular/special requirement of sintering process, sintering furnace burner hearth entrance is all narrow, so that because of warpage reason sintering second
When the copper sheet of face, substrate cannot be introduced into burner hearth.
The common method for solving the problems, such as this at present is that the substrate of single side sintering is placed on plate with hand or uses ceramic wafer
It is pressed downward, buckling deformation being made to become smaller, so that the sintered substrate of single side be made to can enter burner hearth.
But there are many problems for this method: 1) pressure size, speed and the depression distance pushed every time is unable to control, and is made
Buckling deformation reduction amount is inconsistent after must pushing, so that the substrate warp amount after two-step sintering is also inconsistent.2) substrate is pressed with
When cross ambassador's ceramics generate crack, cause substrate to scrap.3) pressure spot position is not identical every time, thus the shape of substrate warp
It is possibly different from.
Summary of the invention
In view of the problems of the existing technology, the present invention provides a kind of for reducing warpage change after DBC substrate single side is sintered
The presser device of shape, to solve at least one above-mentioned technical problem.
The technical scheme is that it is a kind of for reducing the presser device of buckling deformation after DBC substrate single side is sintered,
It is characterized in that, including a support base；
It further include a lower platen, the lower platen is mounted in the support base, and the lower platen is equipped with an opening
Upward lower groove, the slot bottom of the lower groove are equipped with ceramic wafer, are for connecing with the outer surface of the lower ceramic wafer
Touch the contact surface of DBC substrate；
It further include a top board, the surface of the lower platen is arranged in the top board, and opens up on the top board
There is a upper groove that Open Side Down, the slot bottom of the upper groove is equipped with ceramic wafer on one, with the outer surface of the upper ceramic wafer
For the contact surface for contacting DBC substrate；
It further include the driving mechanism that a driving top board moves up and down, the driving mechanism is connected with the top board.
This patent drives top board to push by presser device, by driving mechanism, and then realizes and give the application of DBC substrate
Pressure guarantees that substrate can smoothly enter into burner hearth and carry out two-step sintering convenient for reducing warpage deflection after control single substrate sintering.
It reduces simultaneously because of the undesirable generation in large substrates crack that was pressurized, promotes the yield of product.
Single substrate is to contact respectively with upper ceramic wafer and lower ceramic wafer when being pressurized, and not will receive metallic pollution and wiping
Wound.Upper ceramic wafer presses down in parallel from single substrate buckling deformation highest point when top board pushes, by the fortune for controlling top board
Dynamic stroke, and then can effectively control pushing metacoxal plate deformed shape every time and keep identical.
The driving mechanism can be a cylinder driving mechanism, and the cylinder driving mechanism includes a cylinder piston rod, institute
It states cylinder piston rod and the top board is sequentially connected.
It is easy to implement the up and down motion of cylinder driving top board.
Further preferably, the cylinder piston rod is connected with a kinematic link by a shaft coupling；
The center of top of the top board is equipped with a body of rod, and the upper end of the body of rod is plugged under the kinematic link
It holds in socket, and the kinematic link is connected with the body of rod by two screws；
The central axial direction of two screws is in 90 ° of angles.
It is easy to implement driving mechanism and drives top board movement.
Further preferably, the upper slot for being inserted into the upper ceramic wafer is offered on the top board, it is described slotting
Slot includes the upper hopper chute being provided at left and right sides of the upper groove respectively, and the upper hopper chute is located at close to the upper groove slot bottom
Place, rear and front end at least one end of the upper slot are the insert port of upper ceramic wafer；
The lower slot for being inserted into the lower ceramic wafer is offered on the lower platen, the lower slot includes opening up respectively
Gliding groove at left and right sides of the lower groove, the gliding groove are located at the lower groove slot bottom, the lower slot
Rear and front end at least one end is the insert port of lower ceramic wafer.
While being easy to implement detachable setting of the ceramic wafer with lower ceramic wafer, it is easy to implement to upper ceramic wafer and lower pottery
The fixation of porcelain plate.
The width of the upper groove left and right directions is 130mm~160mm, is highly 4mm~8mm；
The width of the lower groove left and right directions is the equivalent width with the upper groove left and right directions, the lower groove
Height is consistent with the height of the upper groove.
It is easy to implement the accommodating to single substrate.
The height of the upper slot be 1.1mm~1.15mm, the upper ceramic wafer with a thickness of 0.95-1.1mm；On described
Width on sliding slot left and right directions is 4mm~8mm；
The height of the lower slot be 1.1mm~1.15mm, the lower ceramic wafer with a thickness of 0.95-1.1mm, under described
Width on sliding slot left and right directions is 4mm~8mm.
Convenient for guaranteeing the fixed effect of upper ceramic wafer and lower ceramic wafer.
The section of at least one upper hopper chute at left and right sides of upper groove is less than the trapezoidal of slot bottom width in width of rebate,
The section of the upper ceramic wafer and the section of the upper slot match；
The section of at least one gliding groove at left and right sides of lower groove is less than the trapezoidal of slot bottom width in width of rebate,
The section of the lower ceramic wafer and the section of the lower slot match.
Left and right displacement convenient for guaranteeing grafting effect, after avoiding ceramic wafer and lower ceramic wafer grafting.
The support base includes a support platform, and the support platform is connected with the lower platen by bolt；
The support leg of an adjustment height, the lower end of the support leg and the support are also equipped with below the lower platen
Platform offsets.
It is easy to implement adjustment of the lower platen relative to longitudinal height of support platform, the demand of different curvature may be implemented
Adjustment.For example, originally designing the movement process of driving mechanism, realize that the difference in height of the top and bottom of substrate is Amm, when need
Want the top and bottom of substrate difference in height change be A+Bmm when, lower platen is moved down into Bmm, can be realized, without change into
Journey；When needing the variation of the difference in height of top and bottom of substrate is A-Bmm, lower platen is moved up into Bmm.
The support leg can be a cushion block.
The bolt includes a head and a screw rod, and the embedding house in the head of the bolt is in the support platform；
The upper end of the screw rod is connect with the nut thread that lower platen or more two sides are arranged in.
Adjustment by nut relative to the screw-in situation of screw rod, is easy to implement the adjustment of lower platen different height.
Detailed description of the invention
Fig. 1 is a kind of cross-sectional view that the present invention is equipped with DBC substrate；
Fig. 2 is a kind of structural schematic diagram of top board of the present invention；
Fig. 3 is another cross-sectional view of top board of the present invention；
Fig. 4 is another partial sectional view of support platform of the present invention and the lower platen junction.
In figure: 1 is top board, and 2 be lower platen, and 3 be bolt, and 4 be support platform, and 5 be support leg, and 6 be ceramics, and 7 be copper
Piece, 8 be lower ceramic wafer, and 9 be upper ceramic wafer, and 10 be kinematic link, and 11 be screw, and 12 be the body of rod, and 13 be nut, and 14 be insertion
Mouthful.
Specific embodiment
Following further describes the present invention with reference to the drawings.
It is a kind of for reducing the presser device of buckling deformation after DBC substrate single side is sintered, including one referring to Fig. 1 and Fig. 2
Support base；It further include a lower platen 2, lower platen 2 is mounted in support base, and lower platen 2 is equipped under an opening upwards
Groove, the slot bottom of lower groove are equipped with ceramic wafer 9, and the outer surface of following ceramic wafer 9 is the contact for contacting DBC substrate
Face；It further include a top board 1, the surface of lower platen 2 is arranged in top board 1, and offer one on top board 1 Open Side Down
Upper groove, the slot bottom of upper groove are equipped with ceramic wafer 8 on one, and the outer surface of the above ceramic wafer 8 is for contacting connecing for DBC substrate
Contacting surface；It further include the driving mechanism that a driving top board 1 moves up and down, driving mechanism is connected with top board 1.This patent passes through pressure
Panel assembly drives top board 1 to push by driving mechanism, and then realizes that giving DBC substrate applies pressure, single convenient for reducing control
Warpage deflection after the sintering of face substrate guarantees that substrate can smoothly enter into burner hearth and carry out two-step sintering.It reduces simultaneously excessive because being pressurized
The undesirable generation in substrate crack, promotes the yield of product.Single substrate be pressurized when be respectively with upper ceramic wafer 8 and lower ceramic wafer
9 contacts, not will receive metallic pollution and scratch.Upper ceramic wafer 8 is flat from single substrate buckling deformation highest point when top board 1 pushes
Row presses down, and by controlling the movement travel of top board 1, and then can effectively control and push metacoxal plate deformed shape guarantor every time
It holds identical.Driving mechanism is mounted on a bracket, and support base is also secured on bracket.
DBC substrate include ceramics 6 and be covered on ceramics 6 on copper sheet 7.
Driving mechanism can be a cylinder driving mechanism, and cylinder driving mechanism includes a cylinder piston rod, cylinder piston rod
It is sequentially connected with top board 1.It is easy to implement the up and down motion of cylinder driving top board 1.Cylinder piston rod and a kinematic link 10
It is connected by a shaft coupling；The center of top of top board 1 is equipped with a body of rod 12, and the upper end of the body of rod 12 is plugged in kinematic link 10
Lower end socket in, and kinematic link 10 and the body of rod 12 are connected by two screws 11；The central axial direction of two screws 11
In 90 ° of angles.Being easy to implement driving mechanism drives top board 1 to move.
The upper slot for being inserted into upper ceramic wafer 8 is offered on top board 1, upper slot includes being provided with a upper groove left side respectively
The upper hopper chute of right two sides, upper hopper chute are located at upper groove slot bottom, and the rear and front end of upper slot at least one end is upper ceramic wafer 8
Insert port 14；The lower slot for being inserted into lower ceramic wafer 9 is offered on lower platen 2, lower slot is recessed including being provided with respectively
Gliding groove at left and right sides of slot, gliding groove are located at lower groove slot bottom, and rear and front end at least one end of lower slot is lower pottery
The insert port of porcelain plate 9.While being easy to implement detachable setting of the ceramic wafer 8 with lower ceramic wafer 9, it is easy to implement to upper ceramics
The fixation of plate 8 and lower ceramic wafer 9.
The width of upper groove left and right directions is 130mm~160mm, is highly 4mm~8mm；The width of lower groove left and right directions
Degree is the equivalent width with upper groove left and right directions, and the height of lower groove and the height of upper groove are consistent.It is easy to implement to single side
The accommodating of substrate.The height of upper slot be 1.1mm~1.15mm, upper ceramic wafer with a thickness of 0.95-1.1mm；Upper hopper chute or so
Width on direction is 4mm~8mm；The height of lower slot be 1.1mm~1.15mm, lower ceramic wafer with a thickness of 0.95-
1.1mm, the width on gliding groove left and right directions are 4mm~8mm.Convenient for guaranteeing the fixed effect of upper ceramic wafer and lower ceramic wafer.
Support base includes a support platform 4, and support platform 4 is connected with lower platen by bolt 3；Also pacify the lower section of lower platen
Support leg 5 equipped with an adjustment height, lower end and the support platform 4 of support leg 5 offset.Lower platen is easy to implement relative to support
The adjustment of longitudinal height of platform, may be implemented the adjustment of the demand of different curvature.For example, originally designing the fortune of driving mechanism
Dynamic process realizes that the difference in height of the top and bottom of substrate is Amm, when the difference in height variation for the top and bottom for needing substrate is
When A+Bmm, lower platen is moved down into Bmm, can be realized, without changing process；When the difference in height for the top and bottom for needing substrate
When variation is A-Bmm, lower platen is moved up into Bmm.Support leg can be a cushion block.
Referring to fig. 4, bolt 3 includes a head and a screw rod, and the embedding house in the head of bolt 3 is in support platform；Screw rod
Upper end is threadedly coupled with the nut 13 that lower platen or more two sides are arranged in.Tune by nut relative to the screw-in situation of screw rod
It is whole, it is easy to implement the adjustment of lower platen different height.
Referring to Fig. 3, the section of at least one upper hopper chute at left and right sides of upper groove is wide less than slot bottom in width of rebate
That spends is trapezoidal, and the section of the section and upper slot of upper ceramic wafer 9 matches；At least one downslide at left and right sides of lower groove
The section of slot is less than the trapezoidal of slot bottom width in width of rebate, and the section of lower ceramic wafer and the section of lower slot match.It is convenient for
Guarantee grafting effect, the left and right displacement after avoiding ceramic wafer and lower ceramic wafer grafting.
The above is only the preferred embodiment of the present invention, it is noted that those skilled in the art are come
It says, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications also should be regarded as
Protection scope of the present invention.
Claims (8)
1. a kind of for reducing the presser device of buckling deformation after DBC substrate single side is sintered, which is characterized in that including a support bottom
Seat；
It further include a lower platen, the lower platen is mounted in the support base, and the lower platen is equipped with an opening upwards
Lower groove, the slot bottom of the lower groove is equipped with ceramic wafer, is for contacting DBC with the outer surface of the lower ceramic wafer
The contact surface of substrate；
It further include a top board, the surface of the lower platen is arranged in the top board, and offers one on the top board
The upper groove that Open Side Down, the slot bottom of the upper groove are equipped with ceramic wafer on one, are to use with the outer surface of the upper ceramic wafer
In the contact surface of contact DBC substrate；
It further include the driving mechanism that a driving top board moves up and down, the driving mechanism is connected with the top board.
2. it is according to claim 1 a kind of for reducing the presser device of buckling deformation after DBC substrate single side is sintered, it is special
Sign is: the driving mechanism is a cylinder driving mechanism, and the cylinder driving mechanism includes a cylinder piston rod, the cylinder
Piston rod and the top board are sequentially connected.
3. it is according to claim 2 a kind of for reducing the presser device of buckling deformation after DBC substrate single side is sintered, it is special
Sign is: the cylinder piston rod is connected with a kinematic link by a shaft coupling；
The center of top of the top board is equipped with a body of rod, and the lower end that the upper end of the body of rod is plugged in the kinematic link is inserted
In mouthful, and the kinematic link is connected with the body of rod by two screws；
The central axial direction of two screws is in 90 ° of angles.
4. it is according to claim 1 a kind of for reducing the presser device of buckling deformation after DBC substrate single side is sintered, it is special
Sign is: the upper slot for being inserted into the upper ceramic wafer is offered on the top board, the upper slot includes opening up respectively
Upper hopper chute at left and right sides of the upper groove, the upper hopper chute are located at the upper groove slot bottom, the upper slot
Rear and front end at least one end is the insert port of upper ceramic wafer；
The lower slot for being inserted into the lower ceramic wafer is offered on the lower platen, the lower slot includes being provided with institute respectively
The gliding groove at left and right sides of lower groove is stated, the gliding groove is located at the lower groove slot bottom, the front and back of the lower slot
Both ends at least one end is the insert port of lower ceramic wafer.
5. it is according to claim 1 a kind of for reducing the presser device of buckling deformation after DBC substrate single side is sintered, it is special
Sign is: the width of the upper groove left and right directions is 130mm~160mm, is highly 4mm~8mm；
The width of the lower groove left and right directions is the equivalent width with the upper groove left and right directions, the height of the lower groove
It is consistent with the height of the upper groove.
6. it is according to claim 4 a kind of for reducing the presser device of buckling deformation after DBC substrate single side is sintered, it is special
Sign is: the height of the upper slot be 1.1mm~1.15mm, the upper ceramic wafer with a thickness of 0.95-1.1mm；On described
Width on sliding slot left and right directions is 4mm~8mm；
The height of the lower slot be 1.1mm~1.15mm, the lower ceramic wafer with a thickness of 0.95-1.1mm, the gliding groove
Width on left and right directions is 4mm~8mm.
7. it is according to claim 4 a kind of for reducing the presser device of buckling deformation after DBC substrate single side is sintered, it is special
Sign is: the section of at least one upper hopper chute at left and right sides of upper groove is less than the trapezoidal of slot bottom width in width of rebate,
The section of the upper ceramic wafer and the section of the upper slot match；
The section of at least one gliding groove at left and right sides of lower groove is less than the trapezoidal of slot bottom width in width of rebate, described
The section of lower ceramic wafer and the section of the lower slot match.
8. it is according to claim 1 a kind of for reducing the presser device of buckling deformation after DBC substrate single side is sintered, it is special
Sign is: the support base includes a support platform, and the support platform is connected with the lower platen by bolt；
The support leg of an adjustment height, the lower end of the support leg and the support platform are also equipped with below the lower platen
It offsets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810916538.5A CN109179037A (en) | 2018-08-13 | 2018-08-13 | It is a kind of for reduce DBC substrate single side sintering after buckling deformation presser device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810916538.5A CN109179037A (en) | 2018-08-13 | 2018-08-13 | It is a kind of for reduce DBC substrate single side sintering after buckling deformation presser device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109179037A true CN109179037A (en) | 2019-01-11 |
Family
ID=64921618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810916538.5A Pending CN109179037A (en) | 2018-08-13 | 2018-08-13 | It is a kind of for reduce DBC substrate single side sintering after buckling deformation presser device |
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| Country | Link |
|---|---|
| CN (1) | CN109179037A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115954314A (en) * | 2023-03-08 | 2023-04-11 | 四川富乐华半导体科技有限公司 | Pressing jig for ceramic copper-clad substrate |
| CN116589298A (en) * | 2023-05-23 | 2023-08-15 | 福建华清电子材料科技有限公司 | Preparation method of thick copper-clad ceramic substrate for improving warpage |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07174467A (en) * | 1993-12-16 | 1995-07-14 | Hitachi Ltd | Actuator, sintering jig of ceramic board and sintering method for the board |
| TW422773B (en) * | 1997-05-28 | 2001-02-21 | Apic Yamada Corp | Electric press machine |
| CN1326824A (en) * | 2000-05-29 | 2001-12-19 | 美蓓亚株式会社 | distortion correcting method and device for plane body |
| CN101239368A (en) * | 2007-09-27 | 2008-08-13 | 骆立波 | Special-shaped cover leveling mold and leveling method thereby |
| CN104446508A (en) * | 2014-11-28 | 2015-03-25 | 电子科技大学 | Method for reducing warping degree of NFC magnetic substrate |
| KR20150105587A (en) * | 2014-03-07 | 2015-09-17 | 매그나칩 반도체 유한회사 | Apparatus for preventing warpage of semiconductor package module |
| CN206464362U (en) * | 2016-12-20 | 2017-09-05 | 山东飞越钢结构工程有限公司 | A kind of new cold press |
| CN207119651U (en) * | 2017-07-18 | 2018-03-20 | 机械科学研究总院（将乐）半固态技术研究所有限公司 | A kind of automobile gear shift support pressure casting deformation apparatus for correcting |
| CN207388517U (en) * | 2017-10-24 | 2018-05-22 | 乾乐欣展新材料技术（上海）有限公司 | A kind of aluminum substrate is cold-pressed system |
| CN207446990U (en) * | 2017-11-13 | 2018-06-05 | 天津利日汽车配件有限公司 | A kind of trimmer convenient for adjusting |
| CN209038703U (en) * | 2018-08-13 | 2019-06-28 | 上海申和热磁电子有限公司 | It is a kind of for reduce DBC substrate single side sintering after buckling deformation presser device |
-
2018
- 2018-08-13 CN CN201810916538.5A patent/CN109179037A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07174467A (en) * | 1993-12-16 | 1995-07-14 | Hitachi Ltd | Actuator, sintering jig of ceramic board and sintering method for the board |
| TW422773B (en) * | 1997-05-28 | 2001-02-21 | Apic Yamada Corp | Electric press machine |
| CN1326824A (en) * | 2000-05-29 | 2001-12-19 | 美蓓亚株式会社 | distortion correcting method and device for plane body |
| CN101239368A (en) * | 2007-09-27 | 2008-08-13 | 骆立波 | Special-shaped cover leveling mold and leveling method thereby |
| KR20150105587A (en) * | 2014-03-07 | 2015-09-17 | 매그나칩 반도체 유한회사 | Apparatus for preventing warpage of semiconductor package module |
| CN104446508A (en) * | 2014-11-28 | 2015-03-25 | 电子科技大学 | Method for reducing warping degree of NFC magnetic substrate |
| CN206464362U (en) * | 2016-12-20 | 2017-09-05 | 山东飞越钢结构工程有限公司 | A kind of new cold press |
| CN207119651U (en) * | 2017-07-18 | 2018-03-20 | 机械科学研究总院（将乐）半固态技术研究所有限公司 | A kind of automobile gear shift support pressure casting deformation apparatus for correcting |
| CN207388517U (en) * | 2017-10-24 | 2018-05-22 | 乾乐欣展新材料技术（上海）有限公司 | A kind of aluminum substrate is cold-pressed system |
| CN207446990U (en) * | 2017-11-13 | 2018-06-05 | 天津利日汽车配件有限公司 | A kind of trimmer convenient for adjusting |
| CN209038703U (en) * | 2018-08-13 | 2019-06-28 | 上海申和热磁电子有限公司 | It is a kind of for reduce DBC substrate single side sintering after buckling deformation presser device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115954314A (en) * | 2023-03-08 | 2023-04-11 | 四川富乐华半导体科技有限公司 | Pressing jig for ceramic copper-clad substrate |
| CN116589298A (en) * | 2023-05-23 | 2023-08-15 | 福建华清电子材料科技有限公司 | Preparation method of thick copper-clad ceramic substrate for improving warpage |
| CN116589298B (en) * | 2023-05-23 | 2024-06-07 | 福建华清电子材料科技有限公司 | Preparation method of thick copper-clad ceramic substrate for improving warpage |
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Effective date of registration: 20201116 Address after: Building 3, 181 Shanlian Road, Baoshan District, Shanghai, 200444 Applicant after: Shanghai fulewa Semiconductor Technology Co.,Ltd. Address before: 200444 Baoshan District, Baoshan City Industrial Park Road, No., Hill Road, No. 181 Applicant before: SHANGHAI SHENHE THERMO-MAGNETICS ELECTRONICS Co.,Ltd. Applicant before: JIANGSU FULEDE SEMICONDUCTOR TECHNOLOGY Co.,Ltd. |
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