CN209038703U - It is a kind of for reduce DBC substrate single side sintering after buckling deformation presser device - Google Patents
It is a kind of for reduce DBC substrate single side sintering after buckling deformation presser device Download PDFInfo
- Publication number
- CN209038703U CN209038703U CN201821297469.6U CN201821297469U CN209038703U CN 209038703 U CN209038703 U CN 209038703U CN 201821297469 U CN201821297469 U CN 201821297469U CN 209038703 U CN209038703 U CN 209038703U
- Authority
- CN
- China
- Prior art keywords
- ceramic wafer
- groove
- slot
- top board
- dbc substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to semiconductor processing technology fields.It is a kind of for reducing the presser device of buckling deformation after the sintering of DBC substrate single side, an including support base；It further include a lower platen, lower platen is mounted in support base, and lower platen is equipped with the lower groove of an opening upwards, and the slot bottom of lower groove is equipped with ceramic wafer, and the outer surface of following ceramic wafer is the contact surface for contacting DBC substrate；It further include a top board, the surface of lower platen is arranged in top board, and a upper groove that Open Side Down is offered on top board, and the slot bottom of upper groove is equipped with ceramic wafer on one, and the outer surface of the above ceramic wafer is the contact surface for contacting DBC substrate；It further include the driving mechanism that a driving top board moves up and down, driving mechanism is connected with top board.This patent drives top board to push by presser device, by driving mechanism, and then realizes that giving DBC substrate applies pressure, convenient for reducing warpage deflection after control single substrate sintering.
Description
Technical field
The utility model relates to semiconductor processing technology fields, and in particular to DBC substrate manufacture equipment.
Background technique
Covering copper ceramic substrate (DBC substrate) is double-sided copper-clad, i.e. two sides copper sheet need to be sintered respectively through twice.Due to copper
Piece is different from ceramic thermal expansion coefficient, when the thickness matching of copper sheet and ceramics has big difference (thick copper and book ceramics are arranged in pairs or groups),
After the completion of single side (the first face copper sheet) sintering, the buckling deformation of substrate can be very big.
Due to the particular/special requirement of sintering process, sintering furnace burner hearth entrance is all narrow, so that because of warpage reason sintering second
When the copper sheet of face, substrate cannot be introduced into burner hearth.
The common method for solving the problems, such as this at present is that the substrate of single side sintering is placed on plate with hand or uses ceramic wafer
It is pressed downward, buckling deformation being made to become smaller, so that the sintered substrate of single side be made to can enter burner hearth.
But there are many problems for this method: 1) pressure size, speed and the depression distance pushed every time is unable to control, and is made
Buckling deformation reduction amount is inconsistent after must pushing, so that the substrate warp amount after two-step sintering is also inconsistent.2) substrate is pressed with
When cross ambassador's ceramics generate crack, cause substrate to scrap.3) pressure spot position is not identical every time, thus the shape of substrate warp
It is possibly different from.
Utility model content
In view of the problems of the existing technology, the utility model provides a kind of for reducing DBC substrate single side sintering hind wing
The presser device of song deformation, to solve at least one above-mentioned technical problem.
The technical solution of the utility model is: a kind of for reducing the pressing plate dress of buckling deformation after DBC substrate single side is sintered
It sets, which is characterized in that including a support base；
It further include a lower platen, the lower platen is mounted in the support base, and the lower platen is equipped with an opening
Upward lower groove, the slot bottom of the lower groove are equipped with ceramic wafer, are for connecing with the outer surface of the lower ceramic wafer
Touch the contact surface of DBC substrate；
It further include a top board, the surface of the lower platen is arranged in the top board, and opens up on the top board
There is a upper groove that Open Side Down, the slot bottom of the upper groove is equipped with ceramic wafer on one, with the outer surface of the upper ceramic wafer
For the contact surface for contacting DBC substrate；
It further include the driving mechanism that a driving top board moves up and down, the driving mechanism is connected with the top board.
This patent drives top board to push by presser device, by driving mechanism, and then realizes and give the application of DBC substrate
Pressure guarantees that substrate can smoothly enter into burner hearth and carry out two-step sintering convenient for reducing warpage deflection after control single substrate sintering.
It reduces simultaneously because of the undesirable generation in large substrates crack that was pressurized, promotes the yield of product.
Single substrate is to contact respectively with upper ceramic wafer and lower ceramic wafer when being pressurized, and not will receive metallic pollution and wiping
Wound.Upper ceramic wafer presses down in parallel from single substrate buckling deformation highest point when top board pushes, by the fortune for controlling top board
Dynamic stroke, and then can effectively control pushing metacoxal plate deformed shape every time and keep identical.
The driving mechanism can be a cylinder driving mechanism, and the cylinder driving mechanism includes a cylinder piston rod, institute
It states cylinder piston rod and the top board is sequentially connected.
It is easy to implement the up and down motion of cylinder driving top board.
Further preferably, the cylinder piston rod is connected with a kinematic link by a shaft coupling；
The center of top of the top board is equipped with a body of rod, and the upper end of the body of rod is plugged under the kinematic link
It holds in socket, and the kinematic link is connected with the body of rod by two screws；
The central axial direction of two screws is in 90 ° of angles.
It is easy to implement driving mechanism and drives top board movement.
Further preferably, the upper slot for being inserted into the upper ceramic wafer is offered on the top board, it is described slotting
Slot includes the upper hopper chute being provided at left and right sides of the upper groove respectively, and the upper hopper chute is located at close to the upper groove slot bottom
Place, rear and front end at least one end of the upper slot are the insert port of upper ceramic wafer；
The lower slot for being inserted into the lower ceramic wafer is offered on the lower platen, the lower slot includes opening up respectively
Gliding groove at left and right sides of the lower groove, the gliding groove are located at the lower groove slot bottom, the lower slot
Rear and front end at least one end is the insert port of lower ceramic wafer.
While being easy to implement detachable setting of the ceramic wafer with lower ceramic wafer, it is easy to implement to upper ceramic wafer and lower pottery
The fixation of porcelain plate.
The width of the upper groove left and right directions is 130mm~160mm, is highly 4mm~8mm；
The width of the lower groove left and right directions is the equivalent width with the upper groove left and right directions, the lower groove
Height is consistent with the height of the upper groove.
It is easy to implement the accommodating to single substrate.
The height of the upper slot be 1.1mm~1.15mm, the upper ceramic wafer with a thickness of 0.95-1.1mm；On described
Width on sliding slot left and right directions is 4mm~8mm；
The height of the lower slot be 1.1mm~1.15mm, the lower ceramic wafer with a thickness of 0.95-1.1mm, under described
Width on sliding slot left and right directions is 4mm~8mm.
Convenient for guaranteeing the fixed effect of upper ceramic wafer and lower ceramic wafer.
The section of at least one upper hopper chute at left and right sides of upper groove is less than the trapezoidal of slot bottom width in width of rebate,
The section of the upper ceramic wafer and the section of the upper slot match；
The section of at least one gliding groove at left and right sides of lower groove is less than the trapezoidal of slot bottom width in width of rebate,
The section of the lower ceramic wafer and the section of the lower slot match.
Left and right displacement convenient for guaranteeing grafting effect, after avoiding ceramic wafer and lower ceramic wafer grafting.
The support base includes a support platform, and the support platform is connected with the lower platen by bolt；
The support leg of an adjustment height, the lower end of the support leg and the support are also equipped with below the lower platen
Platform offsets.
It is easy to implement adjustment of the lower platen relative to longitudinal height of support platform, the demand of different curvature may be implemented
Adjustment.For example, originally designing the movement process of driving mechanism, realize that the difference in height of the top and bottom of substrate is Amm, when need
Want the top and bottom of substrate difference in height change be A+Bmm when, lower platen is moved down into Bmm, can be realized, without change into
Journey；When needing the variation of the difference in height of top and bottom of substrate is A-Bmm, lower platen is moved up into Bmm.
The support leg can be a cushion block.
The bolt includes a head and a screw rod, and the embedding house in the head of the bolt is in the support platform；
The upper end of the screw rod is connect with the nut thread that lower platen or more two sides are arranged in.
Adjustment by nut relative to the screw-in situation of screw rod, is easy to implement the adjustment of lower platen different height.
Detailed description of the invention
Fig. 1 is a kind of cross-sectional view that the utility model is equipped with DBC substrate；
Fig. 2 is a kind of structural schematic diagram of the utility model top board；
Fig. 3 is another cross-sectional view of the utility model top board；
Fig. 4 is another partial sectional view of the utility model support platform and the lower platen junction.
In figure: 1 is top board, and 2 be lower platen, and 3 be bolt, and 4 be support platform, and 5 be support leg, and 6 be ceramics, and 7 be copper
Piece, 8 be lower ceramic wafer, and 9 be upper ceramic wafer, and 10 be kinematic link, and 11 be screw, and 12 be the body of rod, and 13 be nut, and 14 be insertion
Mouthful.
Specific embodiment
The utility model is described further with reference to the accompanying drawing.
It is a kind of for reducing the presser device of buckling deformation after DBC substrate single side is sintered, including one referring to Fig. 1 and Fig. 2
Support base；It further include a lower platen 2, lower platen 2 is mounted in support base, and lower platen 2 is equipped under an opening upwards
Groove, the slot bottom of lower groove are equipped with ceramic wafer 9, and the outer surface of following ceramic wafer 9 is the contact for contacting DBC substrate
Face；It further include a top board 1, the surface of lower platen 2 is arranged in top board 1, and offer one on top board 1 Open Side Down
Upper groove, the slot bottom of upper groove are equipped with ceramic wafer 8 on one, and the outer surface of the above ceramic wafer 8 is for contacting DBC substrate
Contact surface；It further include the driving mechanism that a driving top board 1 moves up and down, driving mechanism is connected with top board 1.This patent passes through
Presser device drives top board 1 to push by driving mechanism, and then realizes that giving DBC substrate applies pressure, convenient for reducing control
Warpage deflection after single substrate sintering guarantees that substrate can smoothly enter into burner hearth and carry out two-step sintering.It reduces simultaneously because being pressed through
The undesirable generation in large substrates crack, promotes the yield of product.Single substrate be pressurized when be respectively with upper ceramic wafer 8 and lower ceramics
Plate 9 contacts, and not will receive metallic pollution and scratch.Ceramic wafer 8 is gone up when top board 1 pushes from single substrate buckling deformation highest point
It presses down in parallel, by controlling the movement travel of top board 1, and then can effectively control and push metacoxal plate deformed shape every time
Keep identical.Driving mechanism is mounted on a bracket, and support base is also secured on bracket.
DBC substrate include ceramics 6 and be covered on ceramics 6 on copper sheet 7.
Driving mechanism can be a cylinder driving mechanism, and cylinder driving mechanism includes a cylinder piston rod, cylinder piston rod
It is sequentially connected with top board 1.It is easy to implement the up and down motion of cylinder driving top board 1.Cylinder piston rod and a kinematic link 10
It is connected by a shaft coupling；The center of top of top board 1 is equipped with a body of rod 12, and the upper end of the body of rod 12 is plugged in kinematic link 10
Lower end socket in, and kinematic link 10 and the body of rod 12 are connected by two screws 11；The central axial direction of two screws 11
In 90 ° of angles.Being easy to implement driving mechanism drives top board 1 to move.
The upper slot for being inserted into upper ceramic wafer 8 is offered on top board 1, upper slot includes being provided with a upper groove left side respectively
The upper hopper chute of right two sides, upper hopper chute are located at upper groove slot bottom, and the rear and front end of upper slot at least one end is upper ceramic wafer 8
Insert port 14；The lower slot for being inserted into lower ceramic wafer 9 is offered on lower platen 2, lower slot is recessed including being provided with respectively
Gliding groove at left and right sides of slot, gliding groove are located at lower groove slot bottom, and rear and front end at least one end of lower slot is lower pottery
The insert port of porcelain plate 9.While being easy to implement detachable setting of the ceramic wafer 8 with lower ceramic wafer 9, it is easy to implement to upper pottery
The fixation of porcelain plate 8 and lower ceramic wafer 9.
The width of upper groove left and right directions is 130mm~160mm, is highly 4mm~8mm；The width of lower groove left and right directions
Degree is the equivalent width with upper groove left and right directions, and the height of lower groove and the height of upper groove are consistent.It is easy to implement to single side
The accommodating of substrate.The height of upper slot be 1.1mm~1.15mm, upper ceramic wafer with a thickness of 0.95-1.1mm；Upper hopper chute or so
Width on direction is 4mm~8mm；The height of lower slot be 1.1mm~1.15mm, lower ceramic wafer with a thickness of 0.95-
1.1mm, the width on gliding groove left and right directions are 4mm~8mm.Convenient for guaranteeing the fixed effect of upper ceramic wafer and lower ceramic wafer.
Support base includes a support platform 4, and support platform 4 is connected with lower platen by bolt 3；The lower section of lower platen is also
The support leg 5 of one adjustment height is installed, lower end and the support platform 4 of support leg 5 offset.Lower platen is easy to implement relative to branch
The adjustment for supportting longitudinal height of platform, may be implemented the adjustment of the demand of different curvature.For example, originally designing driving mechanism
Movement process realizes that the difference in height of the top and bottom of substrate is Amm, when the difference in height for the top and bottom for needing substrate changes
When for A+Bmm, lower platen is moved down into Bmm, can be realized, without changing process；When the height for the top and bottom for needing substrate
When difference variation is A-Bmm, lower platen is moved up into Bmm.Support leg can be a cushion block.
Referring to fig. 4, bolt 3 includes a head and a screw rod, and the embedding house in the head of bolt 3 is in support platform；Screw rod
Upper end is threadedly coupled with the nut 13 that lower platen or more two sides are arranged in.Tune by nut relative to the screw-in situation of screw rod
It is whole, it is easy to implement the adjustment of lower platen different height.
Referring to Fig. 3, the section of at least one upper hopper chute at left and right sides of upper groove is wide less than slot bottom in width of rebate
That spends is trapezoidal, and the section of the section and upper slot of upper ceramic wafer 9 matches；At least one downslide at left and right sides of lower groove
The section of slot is less than the trapezoidal of slot bottom width in width of rebate, and the section of lower ceramic wafer and the section of lower slot match.It is convenient for
Guarantee grafting effect, the left and right displacement after avoiding ceramic wafer and lower ceramic wafer grafting.
Above are merely preferred embodiments of the utility model, it is noted that for the ordinary skill people of the art
For member, without departing from the principle of this utility model, several improvements and modifications can also be made, these improvements and modifications
Also it should be regarded as the protection scope of the utility model.
Claims (8)
1. a kind of for reducing the presser device of buckling deformation after DBC substrate single side is sintered, which is characterized in that including a support bottom
Seat；
It further include a lower platen, the lower platen is mounted in the support base, and the lower platen is equipped with an opening upwards
Lower groove, the slot bottom of the lower groove is equipped with ceramic wafer, is for contacting DBC with the outer surface of the lower ceramic wafer
The contact surface of substrate；
It further include a top board, the surface of the lower platen is arranged in the top board, and offers one on the top board
The upper groove that Open Side Down, the slot bottom of the upper groove are equipped with ceramic wafer on one, are to use with the outer surface of the upper ceramic wafer
In the contact surface of contact DBC substrate；
It further include the driving mechanism that a driving top board moves up and down, the driving mechanism is connected with the top board.
2. it is according to claim 1 a kind of for reducing the presser device of buckling deformation after DBC substrate single side is sintered, it is special
Sign is: the driving mechanism is a cylinder driving mechanism, and the cylinder driving mechanism includes a cylinder piston rod, the cylinder
Piston rod and the top board are sequentially connected.
3. it is according to claim 2 a kind of for reducing the presser device of buckling deformation after DBC substrate single side is sintered, it is special
Sign is: the cylinder piston rod is connected with a kinematic link by a shaft coupling；
The center of top of the top board is equipped with a body of rod, and the lower end that the upper end of the body of rod is plugged in the kinematic link is inserted
In mouthful, and the kinematic link is connected with the body of rod by two screws；
The central axial direction of two screws is in 90 ° of angles.
4. it is according to claim 1 a kind of for reducing the presser device of buckling deformation after DBC substrate single side is sintered, it is special
Sign is: the upper slot for being inserted into the upper ceramic wafer is offered on the top board, the upper slot includes opening up respectively
Upper hopper chute at left and right sides of the upper groove, the upper hopper chute are located at the upper groove slot bottom, the upper slot
Rear and front end at least one end is the insert port of upper ceramic wafer；
The lower slot for being inserted into the lower ceramic wafer is offered on the lower platen, the lower slot includes being provided with institute respectively
The gliding groove at left and right sides of lower groove is stated, the gliding groove is located at the lower groove slot bottom, the front and back of the lower slot
Both ends at least one end is the insert port of lower ceramic wafer.
5. it is according to claim 1 a kind of for reducing the presser device of buckling deformation after DBC substrate single side is sintered, it is special
Sign is: the width of the upper groove left and right directions is 130mm~160mm, is highly 4mm~8mm；
The width of the lower groove left and right directions is the equivalent width with the upper groove left and right directions, the height of the lower groove
It is consistent with the height of the upper groove.
6. it is according to claim 4 a kind of for reducing the presser device of buckling deformation after DBC substrate single side is sintered, it is special
Sign is: the height of the upper slot be 1.1mm~1.15mm, the upper ceramic wafer with a thickness of 0.95-1.1mm；On described
Width on sliding slot left and right directions is 4mm~8mm；
The height of the lower slot be 1.1mm~1.15mm, the lower ceramic wafer with a thickness of 0.95-1.1mm, the gliding groove
Width on left and right directions is 4mm~8mm.
7. it is according to claim 4 a kind of for reducing the presser device of buckling deformation after DBC substrate single side is sintered, it is special
Sign is: the section of at least one upper hopper chute at left and right sides of upper groove is less than the trapezoidal of slot bottom width in width of rebate,
The section of the upper ceramic wafer and the section of the upper slot match；
The section of at least one gliding groove at left and right sides of lower groove is less than the trapezoidal of slot bottom width in width of rebate, described
The section of lower ceramic wafer and the section of the lower slot match.
8. it is according to claim 1 a kind of for reducing the presser device of buckling deformation after DBC substrate single side is sintered, it is special
Sign is: the support base includes a support platform, and the support platform is connected with the lower platen by bolt；
The support leg of an adjustment height, the lower end of the support leg and the support platform are also equipped with below the lower platen
It offsets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821297469.6U CN209038703U (en) | 2018-08-13 | 2018-08-13 | It is a kind of for reduce DBC substrate single side sintering after buckling deformation presser device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821297469.6U CN209038703U (en) | 2018-08-13 | 2018-08-13 | It is a kind of for reduce DBC substrate single side sintering after buckling deformation presser device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209038703U true CN209038703U (en) | 2019-06-28 |
Family
ID=67030686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821297469.6U Active CN209038703U (en) | 2018-08-13 | 2018-08-13 | It is a kind of for reduce DBC substrate single side sintering after buckling deformation presser device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209038703U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109179037A (en) * | 2018-08-13 | 2019-01-11 | 上海申和热磁电子有限公司 | It is a kind of for reduce DBC substrate single side sintering after buckling deformation presser device |
-
2018
- 2018-08-13 CN CN201821297469.6U patent/CN209038703U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109179037A (en) * | 2018-08-13 | 2019-01-11 | 上海申和热磁电子有限公司 | It is a kind of for reduce DBC substrate single side sintering after buckling deformation presser device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109179037A (en) | It is a kind of for reduce DBC substrate single side sintering after buckling deformation presser device | |
| CN209038703U (en) | It is a kind of for reduce DBC substrate single side sintering after buckling deformation presser device | |
| CN103219630B (en) | For assembling the automatic assembling of binding post | |
| CN215729274U (en) | Telescopic pressing plate mechanism and exposure machine with same | |
| CN210705117U (en) | Perforating device is used in backup pad production | |
| CN110913610A (en) | A supplementary compression fittings for soft or hard board | |
| CN112138948A (en) | Display screen back frame production line | |
| CN218550307U (en) | Board warping and flattening device | |
| TWM599241U (en) | Automatic in-die feeding mechanism for continuous stamping die | |
| CN210548682U (en) | Flexible circuit board soldering equipment | |
| CN206967945U (en) | PC light sheet material apparatus for bending | |
| CN210655156U (en) | Mould input/output mechanism | |
| CN1511688A (en) | Ceramic tile forming equipment and forming method | |
| CN210062096U (en) | Flattening device for computer keyboard plastic shell deformation correction equipment | |
| KR102116323B1 (en) | The bus bar forming apparatus for panel board | |
| CN206918182U (en) | Travel mechanism for fine adjustments | |
| CN211437759U (en) | Metal stamping precision adjusting structure | |
| CN112474905A (en) | Metal plate bending equipment | |
| CN114269077B (en) | PCB hard board bending method and bending equipment used by same | |
| CN210677702U (en) | Assembly mechanism for combining computer rear shell and computer shell | |
| CN216888796U (en) | Transport mechanism for ceramic machining | |
| CN215850229U (en) | Printed dispensing device for circuit board | |
| KR20190043672A (en) | Press forming machine | |
| KR20030076314A (en) | Press-forming apparatus | |
| CN106898584B (en) | For covering the anti-dislocation apparatus of copper ceramic substrate sintering |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201118 Address after: Building 3, 181 Shanlian Road, Baoshan District, Shanghai, 200444 Patentee after: Shanghai fulewa Semiconductor Technology Co., Ltd Address before: 200444 Baoshan District, Baoshan City Industrial Park Road, No., Hill Road, No. 181 Patentee before: SHANGHAI SHENHE THERMO-MAGNETICS ELECTRONICS Co.,Ltd. Patentee before: JIANGSU FULEDE SEMICONDUCTOR TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right |