CN113900502A - Thermoelectric refrigeration heat dissipation device for computer chip - Google Patents
Thermoelectric refrigeration heat dissipation device for computer chip Download PDFInfo
- Publication number
- CN113900502A CN113900502A CN202111190238.1A CN202111190238A CN113900502A CN 113900502 A CN113900502 A CN 113900502A CN 202111190238 A CN202111190238 A CN 202111190238A CN 113900502 A CN113900502 A CN 113900502A
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- Prior art keywords
- heat
- thermoelectric
- heat pipe
- evaporator
- silica gel
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- 238000005057 refrigeration Methods 0.000 title claims description 23
- 230000017525 heat dissipation Effects 0.000 title abstract description 17
- 238000001816 cooling Methods 0.000 claims abstract description 25
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000000741 silica gel Substances 0.000 claims abstract description 15
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 15
- 239000007788 liquid Substances 0.000 claims abstract description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 239000003292 glue Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 230000005494 condensation Effects 0.000 abstract description 7
- 238000009833 condensation Methods 0.000 abstract description 7
- 230000009471 action Effects 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000012080 ambient air Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000003570 air Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention belongs to the technical field of integrated circuit chip heat dissipation, and relates to a thermoelectric cooling and heat dissipation device for a computer chip. In the device, the bottom of the evaporator is bonded on a central processor chip of the computer through heat-conducting silica gel; the heat pipe is welded and communicated with the evaporator, the interior of a heat system formed by the evaporator and the heat pipe is pumped into a vacuum state, and liquid working media are filled in the interior. The sealed end of the heat pipe is inserted into the hole of the cooler and is bonded through the heat-conducting silica gel. The cold surface of the thermoelectric device is connected with the top surface of the cooler through the heat-conducting silica gel. The bottom of the radiator is connected with the hot surface of the thermoelectric refrigerating device through heat-conducting silica gel, and the cooling fan is fixed with the radiator through screws. The heat pipe is used for rapidly transferring the heat of the computer chip to the cold end of the thermoelectric refrigerating device, and the heat pipe is used for physically isolating the computer chip from the thermoelectric refrigerating device, so that the pin short circuit accident caused by condensation and dewing of the computer chip due to overhigh refrigerating speed of the thermoelectric refrigerating device is overcome.
Description
Technical Field
The invention belongs to the technical field of integrated circuit chip heat dissipation, and particularly relates to a thermoelectric cooling heat dissipation device for a computer chip.
Background
With the rapid development of computer technology and integrated circuit manufacturing technology, the integration level, performance and clock frequency of a computer CPU are continuously improved. The number of transistors in the CPU is increased sharply, so that the working current of the CPU is increased continuously, and the heat dissipated by the unit volume of the CPU is higher and higher. If the CPU continues to work at high temperature, the internal circuit of the CPU core is short-circuited or broken, and finally the CPU is completely damaged. And the higher the temperature, the faster the speed of thoroughly destroying the CPU and the shorter the life of the CPU. Experimental data show that if the surface temperature of the CPU is over 50 ℃ and the internal temperature is over 80 ℃ during normal operation of the CPU, the CPU can be permanently damaged due to the phenomenon of electron migration.
In order to avoid the CPU from being damaged due to the excessive temperature caused by the heat accumulation, the operating temperature of the CPU is usually reduced by using air cooling, water cooling, thermoelectric cooling and other technologies. The structure adopted by the thermoelectric refrigeration heat dissipation method is shown in figure 1, and the structure has the outstanding advantages of no rotating machinery, no noise, no vibration, high efficiency, small volume, long service life, low cost, simple installation, reliable work and the like, but in the using process, due to the strong refrigeration effect of the thermoelectric refrigeration device, the CPU is easy to refrigerate rapidly, the temperature of the CPU chip is lower than the ambient temperature, so that the phenomenon of condensation and dew condensation appears on the side surface of the CPU chip, and the short circuit occurs between the CPU pins to cause computer damage accidents.
Disclosure of Invention
The invention aims to partially overcome the defects in the prior art and provides a thermoelectric refrigeration heat dissipation device for a computer CPU chip, so as to overcome the defect that the pin short circuit accident caused by condensation and dewing of the CPU chip is easily caused by the over-high refrigeration speed of the conventional thermoelectric refrigeration heat dissipation device.
The invention provides a thermoelectric refrigeration heat dissipation device for a computer chip, which comprises a thermoelectric refrigeration device, a radiator and a cooling fan; it is characterized by also comprising an evaporator, a heat pipe and a cooler; the bottom of the evaporator is bonded on a computer CPU chip through heat conducting silica gel, one end of the heat pipe is sealed, the other end of the heat pipe is welded and communicated with the evaporator, the interior of a heat system formed by the evaporator and the heat pipe is pumped into a vacuum state, liquid working media are filled into the evaporator and the heat pipe, and the sealed end of the heat pipe is inserted into a hole of the cooler and is bonded through the heat conducting silica gel; the cold face of the thermoelectric refrigerating device is connected with the top face of the cooler through the heat-conducting silica gel, and the bottom of the radiator is connected with the hot face of the thermoelectric refrigerating device through the heat-conducting silica gel.
The thermoelectric refrigeration heat abstractor for computer chip that the invention puts forward, its advantage is:
the device of the invention adds the heating pipe between the CPU chip and the thermoelectric refrigerating device, the heat of the CPU chip is rapidly transferred to the cold end of the thermoelectric refrigerating device through the heat pipe, and the heat pipe is utilized to physically isolate the CPU chip and the thermoelectric refrigerating device, so as to overcome the defect that the traditional thermoelectric refrigerating heat radiation device has too high refrigerating speed and is easy to cause the pin short circuit accident caused by condensation and dewing of the CPU chip.
Drawings
Fig. 1 is a schematic structural diagram of a thermoelectric cooling and heat dissipating device of a conventional computer CPU chip.
Fig. 2 is a schematic structural diagram of a thermoelectric cooling heat dissipation device for a computer chip according to the present invention.
In fig. 1 and 2, 1 is a computer chip, 2 is a thermoelectric cooling device, 3 is a heat sink, 4 is a cooling fan, 5 is a cooler, 6 is a heat pipe, and 7 is an evaporator.
Detailed Description
The thermoelectric cooling heat sink for computer chip has the structure shown in fig. 2, and includes thermoelectric cooling device 2, heat sink 3, cooling fan 4, cooler 5, heat pipe 6 and evaporator 7. The bottom surface of the evaporator 7 is bonded on the computer chip 1 through heat-conducting silica gel, one end of the heat pipe 6 is sealed, the other end is welded and communicated with the evaporator 7, and the interior of a heat system formed by the evaporator 7 and the heat pipe 6 is pumped into a vacuum state and is filled with liquid working medium. The sealed end of the heat pipe 6 is inserted into the hole of the cooler 5 and is bonded through the heat-conducting silica gel. The cold side of thermoelectric device 2 is connected with the top surface of cooler 5 through heat conduction silica gel, the bottom of radiator 3 is connected with thermoelectric device 2's hot side through heat conduction silica gel, and cooling fan 4 passes through the screw and is fixed with radiator 3.
In the thermoelectric refrigerating and heat dissipating device for the computer chip, the cooler 5, the heat pipe 6 and the evaporator 7 are used for isolating the CPU chip 1 from the thermoelectric refrigerating device 2, and when the thermoelectric refrigerating device 2 is used for refrigerating rapidly, the CPU chip 1 cannot generate condensation and dewing phenomena along with the rapid temperature reduction of the thermoelectric refrigerating device 2.
The evaporator 7 in the thermoelectric cooling and heat dissipating apparatus is used to absorb heat generated by the CPU chip 1. The liquid working medium in the cavity of the evaporator 7 is heated and quickly vaporized into steam, and the working medium steam enters the other end of the heat pipe 6 under the action of a small pressure difference and takes away a large amount of heat.
The heat pipe 6 in the thermoelectric refrigeration heat dissipation device is used for transmitting the working medium steam in the cavity of the evaporator 7 to the other end of the heat pipe 6, and simultaneously, the condensed and liquefied liquid working medium flows back to the evaporator 7.
The cooler 5 in the thermoelectric refrigeration heat dissipation device is used for condensing, liquefying and releasing heat of the working medium steam in the heat pipe. The heat pipe inserted into the hole of the cooler 5 conducts the steam heat to the cooler 5, the cold surface of the thermoelectric refrigerating device 2 directly absorbs the heat of the cooler 5, the working medium losing the heat is condensed and liquefied, and flows back to the evaporator 7 through the heat pipe 6 under the action of the capillary of the liquid absorption core on the inner wall of the heat pipe 6, and the circulation of the working medium is completed.
The thermoelectric cooling device 2 in the thermoelectric cooling and heat dissipating apparatus is used to cool the cooler 5. When the thermoelectric refrigerating device 2 is driven by current to work, the heat of the cold surface and the cooler 5 is transferred to the hot surface, and the heat absorption is generated on the cold surface and the heat release is generated on the hot surface, so that the cooler 5 is refrigerated.
The radiator 3 in the thermoelectric refrigeration heat dissipation device is used for absorbing heat of the hot surface of the thermoelectric refrigeration device 2.
The cooling fan 4 in the thermoelectric cooling and heat dissipating device is used for blowing the ambient air to the heat sink 3, so that the heat of the heat sink 3 is rapidly dissipated to the ambient air.
In one embodiment of the thermoelectric refrigerating and heat dissipating device for the computer chip, the evaporator 7, the heat pipe 6 and the cooler 5 are all made of copper materials with good heat conductivity, the liquid absorbing core on the inner wall of the heat pipe 6 is made of nickel fiber felt, the interior of a thermal system formed by the evaporator 7 and the heat pipe 6 is vacuumized, and the working medium is water. The thermoelectric refrigerating device 2 adopts a semiconductor refrigerating sheet (the external dimension is 30mm multiplied by 3mm) with the model number of TEC1-07115T125, and the radiator 3 adopts an aluminum profile radiator.
The working principle of the thermoelectric refrigeration heat dissipation device for the computer chip is as follows:
when the CPU chip 1 of the computer starts to work, the temperature of the CPU chip 1 is gradually increased, and the CPU chip 1 transfers heat to the evaporator 7; the interior of a thermal system formed by the evaporator 7 and the heat pipe 6 is pumped into a vacuum state, the boiling point of a liquid working medium in the cavity of the evaporator 7 is very low, the liquid working medium is quickly vaporized into saturated steam after being heated, and the working medium steam enters the other end of the heat pipe 6 under the action of a small pressure difference and takes away a large amount of heat. The heat pipes inserted into the holes of the cooler 5 conduct the heat of the vapor to the cooler 5, and the cold side of the thermoelectric cooling device 2 directly absorbs the heat of the cooler 5. The thermoelectric refrigerating device 2 transfers heat absorbed by the cold surface to the hot surface rapidly under the action of voltage, forms the phenomena of heat absorption of the cold surface and heat release of the hot surface, conducts the heat to the radiator 3, and radiates the heat to the surrounding air through the fins of the radiator 3, so that the heat pipe section inserted into the hole of the cooler 5 is rapidly refrigerated. After the working medium losing heat is condensed and liquefied, the working medium flows back to the evaporator 7 through the heat pipe 6 under the action of the capillary of the liquid absorption core on the inner wall of the heat pipe 6, and the circulation of the working medium is completed. The cooling fan 4 blows ambient air toward the radiator 3, so that the fin heat of the radiator 3 is quickly radiated to the ambient air. In one embodiment of the invention, the cooler is a copper block with holes drilled at both ends and the evaporator is an evacuated copper box.
The thermoelectric refrigeration heat dissipation device for the computer chip quickly transfers the heat of the CPU chip to the cold end of the thermoelectric refrigeration device through the heat pipe, and the heat pipe is utilized to physically isolate the CPU chip of the computer from the thermoelectric refrigeration device, so that the pin short circuit accident caused by the condensation and the dewing of the CPU chip due to the overhigh refrigeration speed of the traditional thermoelectric refrigeration heat dissipation device is overcome.
Claims (2)
1. A thermoelectric refrigeration heat sink for computer chip, including thermoelectric refrigeration device, radiator and cooling fan; it is characterized by also comprising an evaporator, a heat pipe and a cooler; the bottom of the evaporator is adhered to the computer chip by heat-conducting silicon glue; one end of the heat pipe is sealed, the other end of the heat pipe is welded and communicated with the evaporator, the interior of a thermal system formed by the evaporator and the heat pipe is pumped into a vacuum state, and liquid working media are filled in the evaporator and the heat pipe; the sealing end of the heat pipe is inserted into a hole of the cooler and is bonded through heat-conducting silica gel; the cold face of thermoelectric device passes through heat conduction silica gel and is connected with the top surface of cooler, the bottom of radiator is connected with thermoelectric device's hot face through heat conduction silica gel, cooling fan passes through the screw and fixes with the radiator.
2. The thermoelectric cooling heat sink for computer chips of claim 1 wherein said liquid working medium is water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111190238.1A CN113900502A (en) | 2021-10-13 | 2021-10-13 | Thermoelectric refrigeration heat dissipation device for computer chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111190238.1A CN113900502A (en) | 2021-10-13 | 2021-10-13 | Thermoelectric refrigeration heat dissipation device for computer chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113900502A true CN113900502A (en) | 2022-01-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111190238.1A Pending CN113900502A (en) | 2021-10-13 | 2021-10-13 | Thermoelectric refrigeration heat dissipation device for computer chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113900502A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108733185A (en) * | 2018-08-09 | 2018-11-02 | 紫光股份有限公司 | A kind of thermoelectric radiating device for blade server central processing unit |
| CN108762454A (en) * | 2018-08-06 | 2018-11-06 | 紫光股份有限公司 | A kind of central processor core radiator for blade server |
| CN109491484A (en) * | 2019-01-07 | 2019-03-19 | 紫光股份有限公司 | A kind of central processor core air-cooled radiating device for blade server |
| CN110366360A (en) * | 2019-08-06 | 2019-10-22 | 紫光股份有限公司 | A kind of water-cooling heat radiating device for blade server central processing element |
| CN216210884U (en) * | 2021-10-13 | 2022-04-05 | 紫光股份有限公司 | Thermoelectric refrigeration heat dissipation device for computer chip |
-
2021
- 2021-10-13 CN CN202111190238.1A patent/CN113900502A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108762454A (en) * | 2018-08-06 | 2018-11-06 | 紫光股份有限公司 | A kind of central processor core radiator for blade server |
| CN108733185A (en) * | 2018-08-09 | 2018-11-02 | 紫光股份有限公司 | A kind of thermoelectric radiating device for blade server central processing unit |
| CN109491484A (en) * | 2019-01-07 | 2019-03-19 | 紫光股份有限公司 | A kind of central processor core air-cooled radiating device for blade server |
| CN110366360A (en) * | 2019-08-06 | 2019-10-22 | 紫光股份有限公司 | A kind of water-cooling heat radiating device for blade server central processing element |
| CN216210884U (en) * | 2021-10-13 | 2022-04-05 | 紫光股份有限公司 | Thermoelectric refrigeration heat dissipation device for computer chip |
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