CN108650872B - A kind of conductive and heat-conductive foam tape and preparation method thereof - Google Patents
A kind of conductive and heat-conductive foam tape and preparation method thereof Download PDFInfo
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- CN108650872B CN108650872B CN201810462360.1A CN201810462360A CN108650872B CN 108650872 B CN108650872 B CN 108650872B CN 201810462360 A CN201810462360 A CN 201810462360A CN 108650872 B CN108650872 B CN 108650872B
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- conductive
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0092—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive pigments, e.g. paint, ink, tampon printing
Abstract
The present invention provides a kind of conductive and heat-conductive foam tapes and preparation method thereof, the conductive and heat-conductive foam tape includes including frame structure, the frame structure has a plurality of equally distributed grid through-holes, it is disposed with conductive adhesive layer and foam containing conductive and heat-conductive particle from bottom to up in each grid through-hole, the bottom face of the grid through-hole is provided with the release paper with conductive adhesive layer bonding, conductive and heat-conductive ink layer is attached on the foam, the top end face of the conductive and heat-conductive ink layer and the top end face of the grid through-hole are flush.The present invention can carry out the protection of periphery by frame structure to conductive adhesive layer and foam; the conductive and heat-conductive foam tape can be cut into the thermally conductive foam tape fritter of plural conductive along the edge of grid through-hole in cutting; the problem of being cut in the process mainly for being reduced so as to avoid the removing of cutting each structure interlayer of bring or thermally conductive effect in frame structure.
Description
Technical field
The present invention relates to conductive and heat-conductive foam tape fields, more particularly to a kind of conductive and heat-conductive foam tape and its production
Method.
Background technique
With greatly improving for chip processing speed, the electromagnetic compatibility problems such as electromagnetic radiation are increasingly severe, conductive rubber,
The materials such as conducting foam are widely used in electronic system to realize electromagnetic shielding, such as in TV, LCD display, liquid crystal
One layer of conductive bubble is sticked on internal some electronic components such as TV, mobile phone, notebook, MP3, communication cabinet and Medical Instruments
Cotton, to play conductive, antistatic and buffer the effect of antidetonation, this kind of conducting foam needs to have good flexibility, lower
Impedance and good heating conduction.
Traditional conducting foam adhesive tape be on the surface of foam entire coated with conductive heat-conducting layer (such as by Vacuum Deposition
Mode is in the coats of metal or graphite linings such as foam surface plated with nickel), Chinese patent 201520681192.7 discloses one kind and leads
Electric foam, which, which uses, coats the structure of one layer of electrically conductive graphite layer on the surface of foam ontology, although can play
Conductive, antistatic and the effect for buffering antidetonation, but at least have the following deficiencies: that 1) the adhesive tape finished product directly coats on foam surface
Graphite linings, since foam has high-compressibility, when cutting, foam, which substantially compress, is easy to appear graphite linings the cracking even feelings of peeling
Condition；Even if 2) smoothly complete cutting, conductive and thermally conductive effect of the adhesive tape after cutting also decreases；3) precision cut needs
It just can guarantee by measurer and cutting mechanism.
Summary of the invention
The purpose of the present invention is to provide a kind of conductive and heat-conductive foam tapes and preparation method thereof, to overcome the prior art
It is insufficient.
In order to achieve the above objectives, technical scheme is as follows:
The embodiment of the invention discloses a kind of conductive and heat-conductive foam tape, including frame structure, the frame structure has
A plurality of equally distributed grid through-holes are disposed with from bottom to up containing conductive and heat-conductive particle in each grid through-hole
Conductive adhesive layer and foam, the bottom face of the grid through-hole be provided with the conductive adhesive layer bonding release paper, the bubble
Conductive and heat-conductive ink layer is attached on cotton, the top end face of the conductive and heat-conductive ink layer and the top end face of the grid through-hole are mutually neat
It is flat.
One of as a preferred solution of the present invention, the frame structure includes frame structures under action and is bonded in the lower frame
The upper frame structure of superstructure, be evenly equipped on the frame structures under action and upper frame structure respectively a plurality of lower grid through-holes and
Upper grid through-hole, and the lower grid through-hole and the upper corresponding setting of grid through-hole are provided in the lower grid through-hole described
Conductive adhesive layer, the top end face of the conductive adhesive layer and the top end face of the lower grid through-hole are flush, the lower grid through-hole
Bottom face is provided with the release paper with conductive adhesive layer bonding, is provided with foam in the upper grid through-hole, the conduction is led
The top end face of hot oil layer of ink is flush with the top end face with the upper grid through-hole.
One of as a preferred solution of the present invention, the conductive and heat-conductive particle is gold particle, graphite particle, nickel particle, leads
Any one in the silver-plated conductive rubber particle of electroceramics particle, copper or two or more combinations.
One of as a preferred solution of the present invention, the frame structure includes conductive plastics frame.
One of as a preferred solution of the present invention, the width of the periphery frame of the frame structure is the frame structure
The half of the width of interior frame.
The embodiment of the invention also provides a kind of production methods of conductive and heat-conductive foam tape, comprising the following steps:
1) upper frame structure is provided, the upper frame structure has a plurality of equally distributed upper grid through-holes, Xiang Fang
It is placed in and is put into one in the upper grid through-hole of each of described upper frame structure on levels operation platform and is mutually fitted with the upper grid through-hole
The foam answered；
2) on the foam adhere to conductive and heat-conductive ink layer, the top end face of the conductive and heat-conductive ink layer with it is described on
The top end face of grid through-hole is flush；
3) provide a frame structures under action, the frame structures under action have a plurality of equally distributed lower grid through-holes, will under
Frame structure is placed in release paper；
4) conductive glue containing conductive and heat-conductive particle is injected in Xiang Suoshu frame structures under action, so that the conductive glue is covered
All grid through-holes of the frame structures under action are covered to form conductive adhesive layer, and the top end face of the conductive adhesive layer and the lower frame
The top end face of frame structure flushes, and the conductive adhesive layer is mutually bonded with the release paper；
5) upper frame structure is bonded in the top of the frame structures under action, and the upper grid through-hole and the lower grid are logical
Hole is corresponding, and the foam is made to be bonded bonding with the conductive adhesive layer；
6) the conductive and heat-conductive foam tape is cut along two adjacent lower grid through-holes/upper grid through-hole line of symmetry
It is cut into the thermally conductive foam tape fritter of plural conductive.
One of as a preferred solution of the present invention, step 1) further includes providing a foam jig, and the foam jig includes
A plurality of foam slots are provided with push plate in the foam slot, the air-breathing being connected to vacuum generating device are provided in the push plate
Hole, after foam is placed in the foam slot, foam jig described in left-hand thread make each foam alignment it is each it is described on
Grid through-hole then makes the suction hole not generate suction and the foam is pushed into the upper grid through-hole with the push plate
It is interior.
One of as a preferred solution of the present invention, moved back and forth in step 4) with to scrape knife plate on the frame structures under action with
So that the top end face of the conductive adhesive layer is flushed with the top end face of the frame structures under action.
One of as a preferred solution of the present invention, adhere to conductive and heat-conductive on the foam in a manner of spraying in step 2)
Ink layer.
One of as a preferred solution of the present invention, the conductive and heat-conductive particle is gold particle, graphite particle, nickel particle, leads
Any one in the silver-plated conductive rubber particle of electroceramics particle, copper or two or more combinations.
One of as a preferred solution of the present invention, the frame structure includes conductive plastics frame.
One of as a preferred solution of the present invention, the width of the periphery frame of the upper frame structure and lower upper frame structure
For the half of the width of the interior frame of the frame structure.
Compared with the prior art, the advantages of the present invention are as follows:
1) present invention can carry out the protection of periphery by frame structure to conductive adhesive layer and foam, can edge in cutting
The conductive and heat-conductive foam tape is cut into the thermally conductive foam tape fritter of plural conductive by the edge of grid through-hole, in the process
Cutting is asked mainly in frame structure so as to avoid what the removing of cutting each structure interlayer of bring or thermally conductive effect reduced
Topic；
2) present invention ensure that the strength and stability of the conductive and heat-conductive foam tape fritter after cutting using frame structure；
3) present invention improves it using conductive adhesive layer, the foam for being attached with conductive and heat-conductive ink layer, conductive plastics frame
Electric conductivity；
4) size of frame structure is set as desired, it is ensured that the conductive and heat-conductive foam tape fritter of each well cutting
Size uniformity, be conducive to industrial operations.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described.
Fig. 1 is the schematic front view of conductive and heat-conductive foam tape disclosed in a preferred embodiment of the present invention；
Fig. 2 is the vertical view signal of the frame structure of conductive and heat-conductive foam tape disclosed in a preferred embodiment of the present invention
Figure；
Fig. 3 is the schematic top plan view of conductive and heat-conductive foam tape fritter disclosed in a preferred embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description.
Referring to shown in Fig. 1-2, a preferred embodiment of the present invention discloses a kind of conductive and heat-conductive foam tape, including frame knot
Structure, frame structure have a plurality of equally distributed grid through-holes, be disposed in each grid through-hole from bottom to up containing
The conductive adhesive layer 3 and foam 4 of conductive and heat-conductive particle, the bottom face of lower grid through-hole are provided with release with the bonding of conductive adhesive layer 3
Paper 6 is attached with conductive and heat-conductive ink layer 5, the top end face phase of the top end face and grid through-hole of conductive and heat-conductive ink layer 5 on foam 4
It flushes.
Specifically, frame structure includes frame structures under action 1 and the upper frame structure 2 for being bonded in the top of frame structures under action 1, under
Frame structure 1 is evenly equipped with a plurality of lower grid through-holes 11 (as shown in Figure 2), and it is logical that grid on plural number is evenly equipped in upper frame structure 2
Hole (2 structure of upper frame structure is roughly the same with frame structures under action 1), and lower grid through-hole and the upper corresponding setting of grid through-hole,
Conductive adhesive layer 3 is provided in lower grid through-hole, the top end face of conductive adhesive layer 3 and the top end face of lower grid through-hole are flush, lower section
The bottom face of lattice through-hole is provided with the release paper 6 bonded with conductive adhesive layer 3, is provided with foam 4, conductive and heat-conductive in upper grid through-hole
The top end face of ink layer 5 is flush with the top end face with upper grid through-hole.It should be noted that 1/ upper ledge of frame structures under action
The size for the grid through-hole being arranged in frame structure 2 may not be all identical, can according to need the one or more kinds of ruler of design
Very little grid through-hole, in this way, the conductive and heat-conductive foam tape fritter of plurality of specifications, conductive and heat-conductive foam rubber can be realized disposably
Band fritter is as described below.
Preferably, conductive and heat-conductive particle is gold particle, graphite particle, nickel particle, conductive ceramic particles, the silver-plated conductive rubber of copper
Any one in glue particle or two or more combinations.
Preferably, frame structure includes conductive plastics frame, and frame structure can use injection mold injection molding.
Preferably, the width of the periphery frame of frame structure is the half of the width of the interior frame of frame structure.
The production method of above-mentioned conductive and heat-conductive foam tape, comprising the following steps:
1) upper frame structure 2 is provided, upper frame structure 2 has a plurality of equally distributed upper grid through-holes, to placement
It is gone up in each of the upper frame structure 2 on levels operation platform and is put into a foam 4 being adapted with upper grid through-hole in grid through-hole,
The highest face of foam 4 is lower than the top end face selected distance of upper grid through-hole, which is substantially equal to conduction described below
The thickness of thermally conductive ink layer 5；
Specifically, a foam jig can be provided, foam jig includes a plurality of foam slots, is provided with and pushes away in foam slot
The suction hole being connected to vacuum generating device is arranged in push plate for plate, after in the merging foam slot of foam 4, left-hand thread foam jig
So that each foam 4 is directed at each upper grid through-hole, then makes suction hole not generate suction and foam 4 is pushed by top with push plate
In lattice through-hole；Cause foam 4 unstable to guarantee the minim gap between foam 4 and upper grid through-hole, it can be to the two
Glue is squeezed in gap to be bonded；
2) adhere to conductive and heat-conductive ink layer 5 on foam 4 in a manner of spraying, so that the top of conductive and heat-conductive ink layer 5
End face and the top end face of upper grid through-hole are flush；
3) provide a frame structures under action 1, frame structures under action 1 have a plurality of equally distributed lower grid through-holes 11, will under
Frame structure 1 is placed in release paper；
4) conductive glue containing conductive and heat-conductive particle is injected into frame structures under action 1, so that conductive glue covers lower frame
All grid through-holes of frame structure 1 are to form conductive adhesive layer 3, and the top end face of the top end face of conductive adhesive layer 3 and frame structures under action 1
It flushes, the bottom end of conductive adhesive layer 3 is mutually bonded with release paper；
5) upper frame structure 2 is bonded in the top of frame structures under action 1, and upper grid through-hole and lower grid through-hole 11 are opposite
It answers, and foam 4 is made to be bonded bonding with conductive adhesive layer 3；
6) along two adjacent lower grid through-holes 11/ the line of symmetry a of grid through-hole by 4 belt cutting of conductive and heat-conductive foam
It is cut into the thermally conductive foam tape fritter b (as Figure 2-3) of plural conductive, can be cut using filament cutter.
By above technical scheme, the present invention can carry out the guarantor of periphery by frame structure to conductive adhesive layer 3 and foam 4
The conductive and heat-conductive foam tape can be cut into the thermally conductive foam rubber of plural conductive along the edge of grid through-hole in cutting by shield
Band fritter is cut in the process mainly in frame structure, so as to avoid the removing of cutting each structure interlayer of bring
Or thermally conductive effect the problem of reducing；2) present invention ensure that the conductive and heat-conductive foam tape fritter after cutting using frame structure
Strength and stability；3) present invention uses conductive adhesive layer 3, the foam 4 for being attached with conductive and heat-conductive ink layer 5, conductive plastics frame
Improve its electric conductivity；4) size of frame structure is set as desired, it is ensured that the conductive and heat-conductive of each well cutting steeps
The uniformity of size of the celloidin with fritter, is conducive to industrial operations.
Various modifications to these embodiments will be readily apparent to those skilled in the art, herein
Defined General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Cause
This, the present invention will not be limited to the embodiments shown herein, and is to fit to and principles disclosed herein and new
The consistent widest scope of clever feature.
Claims (5)
1. a kind of production method of conductive and heat-conductive foam tape, it is characterised in that: the following steps are included:
1) upper frame structure is provided, the upper frame structure has a plurality of equally distributed upper grid through-holes, to being placed in
One is put into the upper grid through-hole of each of described upper frame structure on levels operation platform to be adapted with the upper grid through-hole
Foam；
2) adhere to conductive and heat-conductive ink layer on the foam, the top end face of the conductive and heat-conductive ink layer and the upper grid are logical
The top end face in hole is flush；
3) frame structures under action is provided, the frame structures under action has a plurality of equally distributed lower grid through-holes, by lower frame
Structure is placed in release paper；
4) conductive glue containing conductive and heat-conductive particle is injected in Xiang Suoshu frame structures under action, so that the conductive glue covers institute
All grid through-holes of frame structures under action are stated to form conductive adhesive layer, and the top end face of the conductive adhesive layer and the lower frame knot
The top end face of structure flushes, and the conductive adhesive layer is mutually bonded with the release paper；
5) upper frame structure, and the upper grid through-hole and the lower grid through-hole phase are bonded in the top of the frame structures under action
It is corresponding, and the foam is made to be bonded bonding with the conductive adhesive layer；
6) the conductive and heat-conductive foam tape is cut into along two adjacent lower grid through-holes/upper grid through-hole line of symmetry
The thermally conductive foam tape fritter of plural conductive.
2. a kind of production method of conductive and heat-conductive foam tape according to claim 1, it is characterised in that: step 1) is also wrapped
It includes and a foam jig is provided, the foam jig includes a plurality of foam slots, and push plate, the push plate are provided in the foam slot
On be provided with the suction hole being connected to vacuum generating device, after foam is placed in the foam slot, foam described in left-hand thread is controlled
Tool is then made the suction hole not generate suction and is pushed away with described so that each upper grid through-hole of each foam alignment
The foam is pushed into the upper grid through-hole by plate.
3. a kind of production method of conductive and heat-conductive foam tape according to claim 1, it is characterised in that: in step 4) with
Knife plate is scraped to be moved back and forth on the frame structures under action so that the top end face of the conductive adhesive layer and the frame structures under action
Top end face flushes.
4. a kind of production method of conductive and heat-conductive foam tape according to claim 1, it is characterised in that: in step 2) with
The mode of spraying adheres to conductive and heat-conductive ink layer on the foam.
5. a kind of production method of conductive and heat-conductive foam tape according to claim 1, it is characterised in that: the conduction is led
Hot particle be gold particle, graphite particle, nickel particle, conductive ceramic particles, in the silver-plated conductive rubber particle of copper any one or
Two or more combinations；And/or the frame structure includes conductive plastics frame；And/or the upper frame structure and lower frame
The width of the periphery frame of structure is the half of the width of the interior frame of the frame structure.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810462360.1A CN108650872B (en) | 2018-05-15 | 2018-05-15 | A kind of conductive and heat-conductive foam tape and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810462360.1A CN108650872B (en) | 2018-05-15 | 2018-05-15 | A kind of conductive and heat-conductive foam tape and preparation method thereof |
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| CN108650872A CN108650872A (en) | 2018-10-12 |
| CN108650872B true CN108650872B (en) | 2019-09-17 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112210309A (en) * | 2020-10-12 | 2021-01-12 | 苏州盛达飞智能科技股份有限公司 | Method for manufacturing electric-conduction heat-conduction foam adhesive tape |
| CN112210307B (en) * | 2020-10-14 | 2022-06-17 | 苏州盛达飞智能科技股份有限公司 | Conductive foam and manufacturing method thereof |
| CN112233834B (en) * | 2020-10-14 | 2022-07-12 | 苏州贝克诺斯电子科技股份有限公司 | Preparation method of conductive foam |
| CN115446922A (en) * | 2022-08-22 | 2022-12-09 | 深圳市领略数控设备有限公司 | Graphite wrapping method and equipment |
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|---|---|---|---|---|
| CN1655284A (en) * | 2004-02-10 | 2005-08-17 | 日本捷力有限公司 | Electromagnetic wave shield gasket and its manufacturing method |
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| JPS5892540A (en) * | 1981-11-30 | 1983-06-01 | Fujimori Kogyo Kk | Conductive foam molding body and manufacture therefor |
| CN103680683B (en) * | 2013-01-18 | 2017-02-08 | 隆扬电子（昆山）有限公司 | Conductive sponge |
| US10483449B2 (en) * | 2013-03-15 | 2019-11-19 | Avx Corporation | Thermoelectric generator |
| CN204929546U (en) * | 2015-09-16 | 2015-12-30 | 江苏元京电子科技有限公司 | A it is cotton to paste electrically conductive bubble of cloth that is used for big screen display to show module buffering and electrically conduct |
| CN205408388U (en) * | 2016-02-22 | 2016-07-27 | 深圳市欣恒坤科技有限公司 | It is cotton to inhale waveguide electricity bubble |
| CN105774132B (en) * | 2016-04-20 | 2017-07-25 | 衡山县佳诚新材料有限公司 | A kind of thermal conductivity foam tape |
| CN107105586A (en) * | 2017-05-21 | 2017-08-29 | 昆山佑威光电材料有限公司 | A kind of shockproof foam piece of heat conduction |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1655284A (en) * | 2004-02-10 | 2005-08-17 | 日本捷力有限公司 | Electromagnetic wave shield gasket and its manufacturing method |
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