CN108848660B - Electromagnetic shielding film and manufacturing method thereof - Google Patents
Electromagnetic shielding film and manufacturing method thereof Download PDFInfo
- Publication number
- CN108848660B CN108848660B CN201810780066.5A CN201810780066A CN108848660B CN 108848660 B CN108848660 B CN 108848660B CN 201810780066 A CN201810780066 A CN 201810780066A CN 108848660 B CN108848660 B CN 108848660B
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- conductive layer
- shielding film
- electromagnetic shielding
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 238000004070 electrodeposition Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- -1 polyethylene terephthalate Polymers 0.000 claims description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 3
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 3
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 3
- 238000010345 tape casting Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 9
- 230000001788 irregular Effects 0.000 description 4
- 238000007606 doctor blade method Methods 0.000 description 3
- 238000010923 batch production Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
An electromagnetic shielding film comprises a substrate, a first conductive layer and a second conductive layer, wherein the first conductive layer and the second conductive layer are in a grid structure, the first conductive layer is arranged on the substrate, the second conductive layer is arranged on the first conductive layer, the surface resistance of the second conductive layer is smaller than that of the first conductive layer, and the thickness of the first conductive layer is 1-7 mu m; the thickness of the second conductive layer is larger than 0 mu m and smaller than or equal to 2 mu m, the grid line width of the first conductive layer is 1 mu m-4 mu m, and the grid line width of the second conductive layer is smaller than or equal to the grid line width of the first conductive layer. The electromagnetic shielding film can greatly improve conductivity and shielding effect. The invention also relates to a manufacturing method of the electromagnetic shielding film.
Description
Technical Field
The invention relates to the technical field of electromagnetic shielding, in particular to an electromagnetic shielding film and a manufacturing method thereof.
Background
In recent years, with the rapid development of information society, devices associated with information have rapidly developed and have been spread, and various electronic devices and communication devices such as CRT, liquid crystal, EL, PDP, FED and other display devices have been widely used for guiding display of televisions, personal computers, stations and airports to provide various information. The problem of electromagnetic interference (EMI) generated by these electronic devices is also becoming more serious.
Electromagnetic wave interference not only affects the operation accuracy of surrounding electronic devices, causing misoperation, but also has adverse effects on human health. Accordingly, there is an increasing demand for electromagnetic wave shielding materials, and various electromagnetic shielding films have been developed to shield electromagnetic waves in order to meet such demands, but the effect is not ideal.
Disclosure of Invention
In view of the above, the present invention provides an electromagnetic shielding film that can greatly improve conductivity and shielding effect.
An electromagnetic shielding film comprises a substrate, a first conductive layer and a second conductive layer, wherein the first conductive layer and the second conductive layer are in a grid structure, the first conductive layer is arranged on the substrate, the second conductive layer is arranged on the first conductive layer, the surface resistance of the second conductive layer is smaller than that of the first conductive layer, and the thickness of the first conductive layer is 1-7 mu m; the thickness of the second conductive layer is larger than 0 mu m and smaller than or equal to 2 mu m, the grid line width of the first conductive layer is 1 mu m-4 mu m, and the grid line width of the second conductive layer is smaller than or equal to the grid line width of the first conductive layer.
In an embodiment of the present invention, the substrate includes a transparent base layer and an insulating layer, the insulating layer is disposed on the transparent base layer, a groove is disposed on the insulating layer, and the first conductive layer is disposed in the groove.
In an embodiment of the present invention, the first conductive layer is disposed in the groove by using a nano conductive paste through a doctor blade method.
In an embodiment of the present invention, the transparent base layer is polyethylene terephthalate or polycarbonate or polymethyl methacrylate.
In an embodiment of the present invention, the second conductive layer is disposed on a surface of the first conductive layer by electrodeposition.
In an embodiment of the present invention, the first conductive layer is silver or copper; the second conductive layer is nickel or copper.
The invention also provides a manufacturing method of the electromagnetic shielding film, which is used for manufacturing the electromagnetic shielding film, and comprises the following steps of:
providing a substrate and manufacturing a patterned groove on the substrate;
filling nano conductive paste into the grooves of the substrate in a blade coating mode, and sintering to form a first conductive layer, wherein the first conductive layer is in a grid structure, the thickness of the first conductive layer is 1-7 mu m, and the grid line width of the first conductive layer is 1-4 mu m; and
And forming a second conductive layer on the first conductive layer in an electrodeposition mode, wherein the surface resistance of the second conductive layer is smaller than that of the first conductive layer, the second conductive layer is in a grid structure, the thickness of the second conductive layer is larger than 0 mu m and smaller than or equal to 2 mu m, and the grid line width of the second conductive layer is smaller than or equal to that of the first conductive layer.
In an embodiment of the present invention, the step of fabricating the patterned groove includes:
and imprinting the mould on the insulating layer, and stripping the mould to form the groove.
The electromagnetic shielding film comprises a substrate, and a first conductive layer and a second conductive layer which are in grid structures, wherein the first conductive layer is arranged on the substrate, the second conductive layer is arranged on the first conductive layer, the surface resistance of the second conductive layer is smaller than that of the first conductive layer, and the thickness of the first conductive layer is 1-7 mu m; the thickness of the second conductive layer is larger than 0 mu m and smaller than or equal to 2 mu m, the grid line width of the first conductive layer is 1 mu m-4 mu m, and the grid line width of the second conductive layer is smaller than or equal to the grid line width of the first conductive layer. Because the surface resistance of the second conductive layer is smaller than that of the first conductive layer, namely the conductivity of the second conductive layer is larger than that of the first conductive layer, the conductivity and the shielding effect of the electromagnetic shielding film can be greatly improved.
Drawings
Fig. 1 is a schematic cross-sectional structure of an electromagnetic shielding film of the present invention.
Fig. 2 is a schematic front view of the electromagnetic shielding film of the present invention.
Fig. 3a to 3e are schematic views of a manufacturing process for manufacturing an electromagnetic shielding film according to the present invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be further described with reference to the accompanying drawings.
First embodiment
Fig. 1 is a schematic cross-sectional structure of an electromagnetic shielding film of the present invention. Fig. 2 is a schematic front view of the electromagnetic shielding film of the present invention. As shown in fig. 1 and 2, the electromagnetic shielding film 10 includes a substrate 11, a first conductive layer 14, and a second conductive layer 15.
The substrate 11 includes a transparent base layer 12 and an insulating layer 13, the insulating layer 13 is disposed on the transparent base layer 12, and the insulating layer 13 is provided with a groove 101. The transparent base layer 12 is, for example, polyethylene terephthalate, polycarbonate or polymethyl methacrylate, but not limited thereto. The insulating layer 13 is, for example, a glue layer, for example, a UV glue layer, and the insulating layer 13 is provided with patterned grooves 101, for example, the grooves 101 are formed on the surface of the insulating layer 13 by imprinting, or the grooves 101 are formed on the surface of the insulating layer 13 by photolithography, which can be selected according to practical needs, but not limited thereto.
The first conductive layer 14 is disposed within the recess 101 of the insulating layer 13. The first conductive layer 14 is formed by filling the grooves 101 with a nano conductive paste, such as silver or copper, but not limited thereto, by a doctor blade method, and sintering the nano conductive paste. In the present embodiment, the first conductive layer 14 is a grid structure, which is, for example, a regular hexagon, a square, an irregular shape, etc., but not limited thereto. The thickness of the first conductive layer 14 is 1 μm to 7 μm, preferably 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm. The grid line width L1 of the first conductive layer 14 is 1 μm to 4 μm, preferably 2 μm and 3 μm.
The second conductive layer 15 is disposed on the first conductive layer 14, and the surface resistance of the second conductive layer 15 is smaller than that of the first conductive layer 14, preferably, the surface resistance of the second conductive layer 15 is smaller than 1 Ω/sq, so that the conductive performance of the second conductive layer 15 is larger than that of the first conductive layer 14. The second conductive layer 15 is disposed on the surface of the first conductive layer 14 by adopting an electrodeposition manner, and the deposited metal is, for example, nickel or copper, and can be freely selected according to practical needs, but is not limited thereto. The thickness of the second conductive layer 15 is less than 2 μm. The grid line width L2 of the second conductive layer 15 is smaller than the grid line width L1 of the first conductive layer 14, without decreasing the light transmittance of the electromagnetic shielding film 10. In the present embodiment, the second conductive layer 15 is a grid structure, which is, for example, a regular hexagon, a square, an irregular shape, etc., but not limited thereto.
The second conductive layer 15 of the electromagnetic shielding film 10 is a continuous metal layer, and the first conductive layer 14 is formed by nano particle contact, so that the surface resistance of the second conductive layer 15 is smaller than that of the first conductive layer 14, i.e. the conductivity of the second conductive layer 15 is larger than that of the first conductive layer 14, and the conductivity and shielding effect of the electromagnetic shielding film 10 can be greatly improved. In addition, the manufacturing method of forming the first conductive layer 14 by adopting a knife coating mode and forming the second conductive layer 15 by adopting an electrodeposition mode can effectively improve the manufacturing efficiency of the electromagnetic shielding film 10 and can meet the requirement of large-scale batch production.
It should be noted that the thickness of the first conductive layer 14 is 1 μm to 7 μm and the thickness of the second conductive layer 15 is greater than 0 μm and less than or equal to 2 μm, so that a line which is difficult to be distinguished by naked eyes can be obtained, and the line resistance is low; if the thickness is too large, the resolution is easy to realize by naked eyes, and the process difficulty is high. Moreover, the grid line width of the first conductive layer 14 is 1-4 μm, the grid line width of the second conductive layer 15 is smaller than or equal to the grid line width of the first conductive layer 14, a line which is difficult to distinguish by naked eyes can be obtained, and the light transmission effect is good; if the line width is too thick, the line width is easy to distinguish by naked eyes, the light transmission effect is poor, and the process difficulty is high.
Second embodiment
Fig. 3a to 3e are schematic views of a manufacturing process for manufacturing an electromagnetic shielding film according to the present invention. Referring to fig. 3a to 3e, the present invention further relates to a method for manufacturing an electromagnetic shielding film, wherein the method for manufacturing an electromagnetic shielding film 10 includes the following steps:
step one, a substrate 11 is provided and patterned grooves 101 are formed on the substrate 11. In this embodiment, the substrate 11 includes a transparent base layer 12 and an insulating layer 13, the insulating layer 13 is disposed on the transparent base layer 12, and a patterned groove 101 is embossed on the surface of the insulating layer 13 using an embossing process or a photolithography process, as shown in fig. 3a, 3b and 3 c.
Step two, the nano conductive paste is filled into the groove 101 of the substrate 11 by a doctor blade method, and sintered to form the first conductive layer 14, as shown in fig. 3 d. In the present embodiment, the first conductive layer 14 is a grid structure, which is, for example, regular hexagon, square, irregular, but not limited thereto; the thickness of the first conductive layer 14 is 1 μm to 7 μm, preferably 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm; the grid line width L1 of the first conductive layer 14 is 1 μm to 4 μm, preferably 2 μm and 3 μm.
Step three, forming a second conductive layer 15 on the first conductive layer 14 by electrodeposition, wherein the surface resistance of the second conductive layer 15 is smaller than that of the first conductive layer 14, as shown in fig. 3 e. In the present embodiment, the surface resistance of the second conductive layer 15 is less than 1 Ω/sq; the thickness of the second conductive layer 15 is greater than 0 μm and less than or equal to 2 μm; the grid line width L2 of the second conductive layer 15 is smaller than or equal to the grid line width L1 of the first conductive layer 14; the second conductive layer 15 is a grid structure, which is, for example, a regular hexagon, a square, an irregular shape, etc., but not limited thereto.
The manufacturing method of the electromagnetic shielding film of the invention firstly adopts a knife coating mode to form the first conductive layer 14, and then adopts an electrodeposition mode to form the second conductive layer 15, and the method can effectively improve the manufacturing efficiency of the electromagnetic shielding film 10 and can meet the requirement of large-scale batch production.
The electromagnetic shielding film 10 of the invention comprises a substrate 11, a first conductive layer 14 and a second conductive layer 15 which are in a grid structure, wherein the first conductive layer 14 is arranged on the substrate 11, the second conductive layer 15 is arranged on the first conductive layer 14, the surface resistance of the second conductive layer 15 is smaller than that of the first conductive layer 14, and the thickness of the first conductive layer 14 is 1-7 mu m; the thickness of the second conductive layer 15 is greater than 0 μm and less than or equal to 2 μm, the grid line width of the first conductive layer 14 is 1 μm to 4 μm, and the grid line width of the second conductive layer 15 is less than or equal to the grid line width of the first conductive layer 14. Since the surface resistance of the second conductive layer 15 is smaller than that of the first conductive layer 14, that is, the conductivity of the second conductive layer 15 is greater than that of the first conductive layer 14, the conductivity and shielding effect of the electromagnetic shielding film 10 can be greatly improved.
In addition, the second conductive layer 15 is formed on the first conductive layer 14 by electrodeposition, and the grid line width L2 of the second conductive layer 15 can be controlled according to the electrodeposition time without reducing the light transmittance of the electromagnetic shielding film 10.
The invention is not limited to the specific details of the above embodiments, and various simple modifications can be made to the technical solution of the invention within the scope of the technical concept of the invention, and these simple modifications all belong to the protection scope of the invention. The individual technical features described in the above embodiments may be combined in any suitable manner without contradiction. The various possible combinations of the invention are not described in detail in order to avoid unnecessary repetition.
Claims (5)
1. An electromagnetic shielding film is characterized by comprising a substrate (11), and a first conductive layer (14) and a second conductive layer (15) which are in grid structures, wherein the first conductive layer (14) is arranged on the substrate (11), the second conductive layer (15) is arranged on the first conductive layer (14), the surface resistance of the second conductive layer (15) is smaller than that of the first conductive layer (14), and the thickness of the first conductive layer (14) is 1-7 mu m; the thickness of the second conductive layer (15) is larger than 0 mu m and smaller than or equal to 2 mu m, the grid line width of the first conductive layer (14) is 1 mu m-4 mu m, and the grid line width of the second conductive layer (15) is smaller than or equal to the grid line width of the first conductive layer (14); the substrate (11) comprises a transparent base layer (12) and an insulating layer (13), the insulating layer (13) is arranged on the transparent base layer (12), a groove (101) is formed in the insulating layer (13), and the first conductive layer (14) is arranged in the groove (101); the first conductive layer (14) is arranged in the groove (101) in a doctor-blading mode by adopting nano conductive paste; the second conductive layer (15) is arranged on the surface of the first conductive layer (14) through electrodeposition; the second conductive layer (15) has a surface resistance of less than 1 ohm/sq.
2. The electromagnetic shielding film according to claim 1, wherein the transparent base layer (12) is polyethylene terephthalate or polycarbonate or polymethyl methacrylate.
3. The electromagnetic shielding film according to any one of claims 1 to 2, wherein the first conductive layer (14) is silver or copper; the second conductive layer (15) is nickel or copper.
4. A method for manufacturing an electromagnetic shielding film, characterized in that the method for manufacturing an electromagnetic shielding film according to any one of claims 1 to 3 comprises the steps of:
Providing a substrate (11) and making patterned recesses (101) in said substrate (11);
Filling nano conductive paste into a groove (101) of a substrate (11) in a blade coating mode, and sintering to form a first conductive layer (14), wherein the first conductive layer (14) is of a grid structure, the thickness of the first conductive layer (14) is 1-7 mu m, and the grid line width of the first conductive layer (14) is 1-4 mu m; and
And forming a second conductive layer (15) on the first conductive layer (14) in an electrodeposition mode, wherein the surface resistance of the second conductive layer (15) is smaller than that of the first conductive layer (14), the second conductive layer (15) is in a grid structure, the thickness of the second conductive layer (15) is larger than 0 mu m and smaller than or equal to 2 mu m, and the grid line width of the second conductive layer (15) is smaller than or equal to that of the first conductive layer (14).
5. The method of manufacturing an electromagnetic shielding film according to claim 4, wherein the step of manufacturing the patterned recess (101) includes:
-impressing a mould on the insulating layer (13), and-stripping the mould to form the recess (101).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810780066.5A CN108848660B (en) | 2018-07-16 | 2018-07-16 | Electromagnetic shielding film and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810780066.5A CN108848660B (en) | 2018-07-16 | 2018-07-16 | Electromagnetic shielding film and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN108848660A CN108848660A (en) | 2018-11-20 |
| CN108848660B true CN108848660B (en) | 2024-04-30 |
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| CN201810780066.5A Active CN108848660B (en) | 2018-07-16 | 2018-07-16 | Electromagnetic shielding film and manufacturing method thereof |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109729706A (en) * | 2019-01-28 | 2019-05-07 | 青岛九维华盾科技研究院有限公司 | A kind of preparation method of high light transmission electromagnetic wave shield film |
| CN110047625B (en) * | 2019-03-06 | 2021-03-30 | 苏州蓝沛光电科技有限公司 | Method for manufacturing transparent conductive film structure |
| CN112105247A (en) * | 2019-06-18 | 2020-12-18 | 昇印光电（昆山）股份有限公司 | Electromagnetic shielding film |
| CN110552000A (en) * | 2019-09-04 | 2019-12-10 | 湖南省凯纳方科技有限公司 | method for manufacturing ultrathin single-sided conductive polymer film |
| CN113792516A (en) * | 2021-08-13 | 2021-12-14 | 深圳市志凌伟业光电有限公司 | Method for optimizing electromagnetic shielding member circuit and electromagnetic shielding member |
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