CN108650872A - A kind of conductive and heat-conductive foam tape and preparation method thereof - Google Patents
A kind of conductive and heat-conductive foam tape and preparation method thereof Download PDFInfo
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- CN108650872A CN108650872A CN201810462360.1A CN201810462360A CN108650872A CN 108650872 A CN108650872 A CN 108650872A CN 201810462360 A CN201810462360 A CN 201810462360A CN 108650872 A CN108650872 A CN 108650872A
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- conductive
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0092—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive pigments, e.g. paint, ink, tampon printing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
Abstract
The present invention provides a kind of conductive and heat-conductive foam tapes and preparation method thereof, the conductive and heat-conductive foam tape includes frame structure, the frame structure has a plurality of equally distributed grid through-holes, it is disposed with conductive adhesive layer and foam containing conductive and heat-conductive particle from bottom to up in each grid through-hole, the bottom face of the grid through-hole is provided with the release paper bonded with the conductive adhesive layer, conductive and heat-conductive ink layer is attached on the foam, the top end face of the conductive and heat-conductive ink layer and the top end face of the grid through-hole are flush.The present invention can carry out conductive adhesive layer and foam by frame structure the protection of periphery; the conductive and heat-conductive foam tape can be cut into plural conductive heat conduction foam tape fritter along the edge of grid through-hole in cutting; it cuts in the process mainly in frame structure, the problem of stripping of each structure interlayer come so as to avoid cutting belt or heat conduction effect reduce.
Description
Technical field
The present invention relates to conductive and heat-conductive foam tape fields, more particularly to a kind of conductive and heat-conductive foam tape and its making
Method.
Background technology
With greatly improving for chip processing speed, the electromagnetic compatibility problems such as electromagnetic radiation are increasingly severe, conductive rubber,
The materials such as conducting foam are widely used in electronic system to realize electromagnetic shielding, such as in TV, LCD display, liquid crystal
Patch last layer conduction bubble on some internal electronic units such as TV, mobile phone, notebook, MP3, communication cabinet and Medical Instruments
Cotton, to play conductive, antistatic and buffer the effect of antidetonation, this kind of conducting foam needs to have good flexibility, relatively low
Impedance and good heat conductivility.
Traditional conducting foam adhesive tape be on the surface of foam entire coated with conductive heat-conducting layer (such as by Vacuum Deposition
Mode is in the coats of metal or graphite linings such as foam surface plated with nickel), Chinese patent 201520681192.7 discloses one kind and leads
Electric foam, which uses coats the structure of one layer of electrically conductive graphite layer on the surface of foam ontology, although can play
Conductive, antistatic and the effect for buffering antidetonation, but at least have the following defects：1) the adhesive tape finished product directly coats on foam surface
Graphite linings, since foam has high-compressibility, when cutting, foam, which substantially compress, is susceptible to graphite linings the cracking even feelings of peeling
Condition；Even if 2) smoothly complete cutting, the conduction and heat conduction effect of the adhesive tape after cutting also decrease；3) precision cut needs
It just can guarantee by measurer and cutting mechanism.
Invention content
The purpose of the present invention is to provide a kind of conductive and heat-conductive foam tapes and preparation method thereof, to overcome the prior art
It is insufficient.
In order to achieve the above objectives, technical scheme is as follows：
The embodiment of the invention discloses a kind of conductive and heat-conductive foam tape, including frame structure, the frame structure has
A plurality of equally distributed grid through-holes are each disposed with from bottom to up in the grid through-hole containing conductive and heat-conductive particle
Conductive adhesive layer and foam, the bottom face of the grid through-hole is provided with the release paper bonded with the conductive adhesive layer, the bubble
Conductive and heat-conductive ink layer is attached on cotton, the top end face of the conductive and heat-conductive ink layer and the top end face of the grid through-hole are mutually neat
It is flat.
One of preferred embodiment as the present invention, the frame structure include frame structures under action and are bonded in the lower frame
The upper frame structure of superstructure, be evenly equipped with respectively on the frame structures under action and upper frame structure a plurality of lower grid through-holes and
Upper grid through-hole, and the lower grid through-hole and the upper corresponding setting of grid through-hole are provided in the lower grid through-hole described
Conductive adhesive layer, the top end face of the conductive adhesive layer and the top end face of the lower grid through-hole are flush, the lower grid through-hole
Bottom face is provided with the release paper bonded with the conductive adhesive layer, is provided with foam in the upper grid through-hole, the conduction is led
The top end face of deep fat layer of ink is flush with the top end face with the upper grid through-hole.
One of preferred embodiment as the present invention, the conductive and heat-conductive particle are gold particle, graphite particle, nickel particle, lead
Any one in the silver-plated conductive rubber particle of electroceramics particle, copper or two or more combinations.
One of preferred embodiment as the present invention, the frame structure includes conductive plastics frame.
The width of one of preferred embodiment as the present invention, the periphery frame of the frame structure is the frame structure
The half of the width of interior frame.
The embodiment of the present invention additionally provides a kind of production method of conductive and heat-conductive foam tape, includes the following steps：
1) upper frame structure is provided, the upper frame structure has a plurality of equally distributed upper grid through-holes, Xiang Fang
It is placed in and is put into one in the upper grid through-hole of each of described upper frame structure on levels operation platform and is mutually fitted with the upper grid through-hole
The foam answered, and the top end face of the foam and the top end face of the upper grid through-hole are flush；
2) on the foam adhere to conductive and heat-conductive ink layer, the top end face of the conductive and heat-conductive ink layer with it is described on
The top end face of grid through-hole is flush；
3) provide a frame structures under action, the frame structures under action have a plurality of equally distributed lower grid through-holes, will under
Frame structure is positioned in release paper；
4) conductive glue containing conductive and heat-conductive particle is injected into the frame structures under action so that the conductive glue is covered
All grid through-holes of the frame structures under action are covered to form conductive adhesive layer, and the top end face of the conductive adhesive layer and the lower frame
The top end face of frame structure flushes, and the conductive adhesive layer is mutually bonded with the release paper；
5) upper frame structure is bonded in the top of the frame structures under action, and the upper grid through-hole and the lower grid are logical
Hole is corresponding, and the foam is made to be bonded bonding with the conductive adhesive layer；
6) line of symmetry along two adjacent lower grid through-holes/upper grid through-hole cuts the conductive and heat-conductive foam tape
It is cut into plural conductive heat conduction foam tape fritter.
One of preferred embodiment as the present invention, step 1) further include providing a foam jig, and the foam jig includes
A plurality of foam slots are provided with push plate in the foam slot, the air-breathing being connected to vacuum generating device are provided in the push plate
Hole, after foam is placed in the foam slot, foam jig described in left-hand thread make each foam alignment it is each it is described on
Grid through-hole, then so that the suction hole does not generate suction and the foam is pushed into the upper grid through-hole with the push plate
It is interior.
Moved back and forth as one of the preferred embodiment of the present invention, in step 4) with to scrape knife plate on the frame structures under action with
So that the top end face of the conductive adhesive layer is flushed with the top end face of the frame structures under action.
One of preferred embodiment as the present invention, adheres to conductive and heat-conductive in a manner of spraying in step 2) on the foam
Ink layer.
One of preferred embodiment as the present invention, the conductive and heat-conductive particle are gold particle, graphite particle, nickel particle, lead
Any one in the silver-plated conductive rubber particle of electroceramics particle, copper or two or more combinations.
One of preferred embodiment as the present invention, the frame structure includes conductive plastics frame.
One of preferred embodiment as the present invention, the width of the periphery frame of the upper frame structure and lower upper frame structure
For the half of the width of the interior frame of the frame structure.
Compared with the prior art, the advantages of the present invention are as follows：
1) present invention can carry out conductive adhesive layer and foam by frame structure the protection of periphery, can edge in cutting
The conductive and heat-conductive foam tape is cut into plural conductive heat conduction foam tape fritter by the edge of grid through-hole, in the process
Cutting is asked mainly in frame structure so as to avoid what the stripping of the next each structure interlayer of cutting belt or heat conduction effect reduced
Topic；
2) present invention ensure that the strength and stability of the conductive and heat-conductive foam tape fritter after cutting using frame structure；
3) present invention improves it using conductive adhesive layer, the foam for being attached with conductive and heat-conductive ink layer, conductive plastics frame
Electric conductivity；
4) size of frame structure is set as desired, it is ensured that the conductive and heat-conductive foam tape fritter of each well cutting
Size uniformity, be conducive to industrial operations.
Description of the drawings
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described.
Fig. 1 is the schematic front view of the conductive and heat-conductive foam tape disclosed in a preferred embodiment of the present invention；
Fig. 2 is the vertical view signal of the frame structure of the conductive and heat-conductive foam tape disclosed in a preferred embodiment of the present invention
Figure；
Fig. 3 is the schematic top plan view of the conductive and heat-conductive foam tape fritter disclosed in a preferred embodiment of the present invention.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes.
Shown in Fig. 1-2, a preferred embodiment of the present invention discloses a kind of conductive and heat-conductive foam tape, including frame knot
Structure, frame structure have a plurality of equally distributed grid through-holes, be disposed with from bottom to up in each grid through-hole containing
The conductive adhesive layer 3 and foam 4 of conductive and heat-conductive particle, the bottom face of lower grid through-hole be provided with bonded with conductive adhesive layer 3 it is release
Paper 6 is attached with conductive and heat-conductive ink layer 5, the top end face of conductive and heat-conductive ink layer 5 and the top end face phase of grid through-hole on foam 4
It flushes.
Specifically, frame structure includes frame structures under action 1 and the upper frame structure 2 for being bonded in 1 top of frame structures under action, under
Frame structure 1 is evenly equipped with a plurality of lower grid through-holes 11 (as shown in Figure 2), and it is logical that grid on plural number is evenly equipped in upper frame structure 2
Hole (2 structure of upper frame structure is roughly the same with frame structures under action 1), and lower grid through-hole and the upper corresponding setting of grid through-hole,
Conductive adhesive layer 3 is provided in lower grid through-hole, the top end face of conductive adhesive layer 3 and the top end face of lower grid through-hole are flush, lower section
The bottom face of lattice through-hole is provided with the release paper 6 bonded with conductive adhesive layer 3, and foam 4, conductive and heat-conductive are provided in upper grid through-hole
The top end face of ink layer 5 is flush with the top end face with upper grid through-hole.It should be noted that 1/ upper ledge of frame structures under action
The size for the grid through-hole being arranged in frame structure 2 may not be all identical, can design one or more kinds of rulers as needed
Very little grid through-hole, in this way, the conductive and heat-conductive foam tape fritter of plurality of specifications, conductive and heat-conductive foam rubber can be realized disposably
Band fritter is as described below.
Preferably, conductive and heat-conductive particle is gold particle, graphite particle, nickel particle, conductive ceramic particles, the silver-plated conductive rubber of copper
Any one in glue particle or two or more combinations.
Preferably, frame structure includes conductive plastics frame, and injection mold injection molding may be used in frame structure.
Preferably, the width of the periphery frame of frame structure is the half of the width of the interior frame of frame structure.
The production method of above-mentioned conductive and heat-conductive foam tape, includes the following steps：
1) upper frame structure 2 is provided, upper frame structure 2 has a plurality of equally distributed upper grid through-holes, to placement
It is gone up in each of the upper frame structure 2 on levels operation platform and is put into a foam 4 being adapted with upper grid through-hole in grid through-hole,
The highest face of foam 4 is less than the top end face selected distance of upper grid through-hole, which is substantially equal to conduction described below
The thickness of heat conduction ink layer 5；
Specifically, a foam jig can be provided, foam jig includes a plurality of foam slots, is provided with and pushes away in foam slot
The suction hole being connected to vacuum generating device is arranged in push plate for plate, after in the merging foam slot of foam 4, left-hand thread foam jig
So that each foam 4 is directed at each upper grid through-hole, then so that suction hole does not generate suction and foam 4 is pushed into top with push plate
In lattice through-hole；Cause foam 4 unstable to ensure the minim gap between foam 4 and upper grid through-hole, it can be to the two
Glue is squeezed in gap to be bonded；
2) adhere to conductive and heat-conductive ink layer 5 on foam 4 in a manner of spraying so that the top of conductive and heat-conductive ink layer 5
End face and the top end face of upper grid through-hole are flush；
3) provide a frame structures under action 1, frame structures under action 1 have a plurality of equally distributed lower grid through-holes 11, will under
Frame structure 1 is positioned in release paper；
4) conductive glue containing conductive and heat-conductive particle is injected into frame structures under action 1 so that conductive glue covers lower frame
All grid through-holes of frame structure 1 are to form conductive adhesive layer 3, and the top end face of the top end face of conductive adhesive layer 3 and frame structures under action 1
It flushes, the bottom end of conductive adhesive layer 3 is mutually bonded with release paper；
5) upper frame structure 2 is bonded in the top of frame structures under action 1, and upper grid through-hole is opposite with lower grid through-hole 11
It answers, and foam 4 is made to be bonded bonding with conductive adhesive layer 3；
6) along two adjacent lower grid through-holes 11/ the line of symmetry a of grid through-hole by 4 belt cutting of conductive and heat-conductive foam
It is cut into plural conductive heat conduction foam tape fritter b (as Figure 2-3), filament cutter may be used and cut.
By above technical scheme, the present invention can carry out conductive adhesive layer 3 and foam 4 by frame structure the guarantor of periphery
The conductive and heat-conductive foam tape can be cut into plural conductive heat conduction foam rubber by shield in cutting along the edge of grid through-hole
Band fritter is cut in the process mainly in frame structure, so as to avoid the stripping for each structure interlayer that cutting belt is come
Or the problem of heat conduction effect reduction；2) present invention ensure that the conductive and heat-conductive foam tape fritter after cutting using frame structure
Strength and stability；3) present invention is using conductive adhesive layer 3, the foam 4 for being attached with conductive and heat-conductive ink layer 5, conductive plastics frame
Improve its electric conductivity；4) size of frame structure is set as desired, it is ensured that the conductive and heat-conductive of each well cutting steeps
The uniformity of size of the celloidin with fritter, is conducive to industrial operations.
Various modifications to these embodiments will be apparent to those skilled in the art, herein
Defined General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Cause
This, the present invention is not intended to be limited to the embodiments shown herein, and is to fit to and principles disclosed herein and new
The consistent widest range of clever feature.
Claims (10)
1. a kind of conductive and heat-conductive foam tape, it is characterised in that：Including frame structure, the frame structure has a plurality of uniform
The grid through-hole of distribution is each disposed with the conductive adhesive layer containing conductive and heat-conductive particle from bottom to up in the grid through-hole
And foam, the bottom face of the grid through-hole are provided with the release paper bonded with the conductive adhesive layer, are attached on the foam
Conductive and heat-conductive ink layer, the top end face of the conductive and heat-conductive ink layer and the top end face of the grid through-hole are flush.
2. a kind of conductive and heat-conductive foam tape according to claim 1, it is characterised in that：The frame structure includes lower frame
Frame structure and the upper frame structure being bonded in above the frame structures under action, on the frame structures under action and upper frame structure respectively
It is evenly equipped with a plurality of lower grid through-holes and upper grid through-hole, and the lower grid through-hole and the upper corresponding setting of grid through-hole, institute
It states and is provided with the conductive adhesive layer in lower grid through-hole, the top end face of the top end face of the conductive adhesive layer and the lower grid through-hole
It is flush, the bottom face of the lower grid through-hole is provided with the release paper bonded with the conductive adhesive layer, the upper grid through-hole
It is inside provided with foam, the top end face of the conductive and heat-conductive ink layer is flush with the top end face with the upper grid through-hole.
3. a kind of conductive and heat-conductive foam tape according to claim 1, it is characterised in that：The conductive and heat-conductive particle is gold
Any one in the silver-plated conductive rubber particle of particle, graphite particle, nickel particle, conductive ceramic particles, copper or two or more groups
It closes.
4. a kind of conductive and heat-conductive foam tape according to claim 1, it is characterised in that：The frame structure includes conduction
Plastic frame.
5. a kind of conductive and heat-conductive foam tape according to claim 1, it is characterised in that：The outer periphery of the frame structure
The width of frame is the half of the width of the interior frame of the frame structure.
6. a kind of production method of conductive and heat-conductive foam tape, it is characterised in that：Include the following steps：
1) upper frame structure is provided, the upper frame structure has a plurality of equally distributed upper grid through-holes, to being positioned over
One is put into the upper grid through-hole of each of described upper frame structure on levels operation platform to be adapted with the upper grid through-hole
Foam；
2) on the foam adhere to conductive and heat-conductive ink layer, the top end face of the conductive and heat-conductive ink layer with the upper grid
The top end face of through-hole is flush；
3) frame structures under action is provided, the frame structures under action has a plurality of equally distributed lower grid through-holes, by lower frame
Structure is positioned in release paper；
4) conductive glue containing conductive and heat-conductive particle is injected into the frame structures under action so that the conductive glue covers institute
All grid through-holes of frame structures under action are stated to form conductive adhesive layer, and the top end face of the conductive adhesive layer and the lower frame knot
The top end face of structure flushes, and the conductive adhesive layer is mutually bonded with the release paper；
5) upper frame structure, and the upper grid through-hole and the lower grid through-hole phase are bonded in the top of the frame structures under action
It is corresponding, and the foam is made to be bonded bonding with the conductive adhesive layer；
6) line of symmetry along two adjacent lower grid through-holes/upper grid through-hole cuts into the conductive and heat-conductive foam tape
Plural conductive heat conduction foam tape fritter.
7. a kind of production method of conductive and heat-conductive foam tape according to claim 6, it is characterised in that：Step 1) is also wrapped
It includes and a foam jig is provided, the foam jig includes a plurality of foam slots, and push plate, the push plate are provided in the foam slot
On be provided with the suction hole being connected to vacuum generating device, after foam is placed in the foam slot, foam described in left-hand thread is controlled
Tool is so that each foam is directed at each upper grid through-hole, then so that the suction hole is not generated suction and pushed away with described
The foam is pushed into the upper grid through-hole by plate.
8. a kind of production method of conductive and heat-conductive foam tape according to claim 6, it is characterised in that：In step 4) with
Knife plate is scraped to be moved back and forth on the frame structures under action so that the top end face of the conductive adhesive layer and the frame structures under action
Top end face flushes.
9. a kind of production method of conductive and heat-conductive foam tape according to claim 6, it is characterised in that：In step 2) with
The mode of spraying adheres to conductive and heat-conductive ink layer on the foam.
10. a kind of production method of conductive and heat-conductive foam tape according to claim 6, it is characterised in that：The conduction
Heat conduction particle is any one in gold particle, graphite particle, nickel particle, conductive ceramic particles, the silver-plated conductive rubber particle of copper
Or two or more combinations；And/or the frame structure includes conductive plastics frame；And/or the upper frame structure and it is lower on
The width of the periphery frame of frame structure is the half of the width of the interior frame of the frame structure.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810462360.1A CN108650872B (en) | 2018-05-15 | 2018-05-15 | A kind of conductive and heat-conductive foam tape and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810462360.1A CN108650872B (en) | 2018-05-15 | 2018-05-15 | A kind of conductive and heat-conductive foam tape and preparation method thereof |
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| CN108650872B CN108650872B (en) | 2019-09-17 |
Family
ID=63755833
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112210307A (en) * | 2020-10-14 | 2021-01-12 | 苏州盛达飞智能科技股份有限公司 | Conductive foam and manufacturing method thereof |
| CN112210309A (en) * | 2020-10-12 | 2021-01-12 | 苏州盛达飞智能科技股份有限公司 | Method for manufacturing electric-conduction heat-conduction foam adhesive tape |
| CN112233834A (en) * | 2020-10-14 | 2021-01-15 | 苏州盛达飞智能科技股份有限公司 | Preparation method of conductive foam |
| CN115446922A (en) * | 2022-08-22 | 2022-12-09 | 深圳市领略数控设备有限公司 | Graphite wrapping method and equipment |
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| CN112210309A (en) * | 2020-10-12 | 2021-01-12 | 苏州盛达飞智能科技股份有限公司 | Method for manufacturing electric-conduction heat-conduction foam adhesive tape |
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| CN115446922A (en) * | 2022-08-22 | 2022-12-09 | 深圳市领略数控设备有限公司 | Graphite wrapping method and equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108650872B (en) | 2019-09-17 |
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