CN203179570U - Transparent conductive film - Google Patents
Transparent conductive film Download PDFInfo
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- CN203179570U CN203179570U CN 201320148295 CN201320148295U CN203179570U CN 203179570 U CN203179570 U CN 203179570U CN 201320148295 CN201320148295 CN 201320148295 CN 201320148295 U CN201320148295 U CN 201320148295U CN 203179570 U CN203179570 U CN 203179570U
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Abstract
A transparent conductive film comprises a substrate, a transparent conducting layer and a lead wire electrode. The substrate comprises a first area and a second area located on an edge of the substrate. The transparent conducting layer comprises a first grid groove and a first conductive grid formed by a conductive material which is filled in the first grid groove. The lead wire electrode comprises a second conductive grid containing the conductive material. A node is formed on an end portion of the conductive material located on an intersection position of the transparent conducting layer and the second area and is directly electrically connected with an end point of the corresponding lead wire electrode. Through arranging the first grid groove in the first area of the substrate, the conductive material is filled in the first grid groove so as to form the first conductive and form the transparent conducting layer. And the lead wire electrode is arranged in the second area. At the same time, the node is formed on the end portion of the conductive material located on the intersection position of the transparent conducting layer and the second area and is directly electrically connected with the end point of the conductive material of the lead wire electrode. A manufacturing technology is simplified. Conductive performance of the conductive film is good and a yield is increased.
Description
Technical field
The utility model relates to electronic technology field, particularly relates to a kind of nesa coating.
Background technology
Touch-screen (touch screen) is called " touch screen ", " contact panel " again, it is a kind of induction type liquid crystal display systems that receives input signals such as contact, can be in order to the push button panel of dessert machine tool formula, and produce lively visual and sound effects by liquid crystal display picture.
At present, conductive layer is vital part in the touch-screen.Traditional touch-screen generally adopts tin-doped indium oxide (Indium Tin Oxides, ITO) conductive layer.When preparation ITO layer, always inevitably need plated film, graphical, the electrode silver wire is made.And need carry out etching to the ITO film when ITO is patterned, this traditional making flow process is complicated and tediously long, makes the poorly conductive of conductive layer, thereby causes yields not high.
The utility model content
Based on this, be necessary the poorly conductive at conductive layer, the problem that yields is not high provides a kind of nesa coating.
A kind of nesa coating comprises:
Substrate comprises the first area, and is positioned at the second area of described basal edge;
Transparency conducting layer is imbedded and is arranged at described first area, and described transparency conducting layer comprises the first grid groove, and first conductive grid that is formed by the electric conducting material that is filled in the described first grid groove;
The lead-in wire electrode is formed at the second area of described substrate, and described lead-in wire electrode comprises second conductive grid that contains electric conducting material;
The end of the electric conducting material of described transparency conducting layer and described second area intersection forms node, and directly is electrically connected with the end points of corresponding described lead-in wire conductive material of electrodes.
Among embodiment, the density of the grid line of described second conductive grid is not less than the density of the grid line of described first conductive grid therein.
Among embodiment, described lead-in wire electrode comprises the second grid groove that is opened in described second area therein, and the electric conducting material of described second conductive grid is contained in the described second grid groove.
Therein among embodiment, the degree of depth of the described first grid groove and the ratio of width are not less than 1, the degree of depth of the described second grid groove and the ratio of width are not less than 1, and the width of the width of the described first grid groove and the described second grid groove all is not more than 10 μ m.
Among embodiment, described lead-in wire electrode is convexly set in the surface of described second area therein.
Among embodiment, the minimum widith of described lead-in wire electrode is 2 μ m～20 μ m therein, and the height of described lead-in wire electrode is 5 μ m～10 μ m.
Among embodiment, described substrate also comprises the hypothallus that is arranged on the described substrate therein, and described first area and described second area all are positioned at described hypothallus.
Among embodiment, also comprise light shield layer therein, described light shield layer is positioned at the edge of described substrate, and described lead-in wire electrode is formed at described hypothallus away from a side of described light shield layer.
Among embodiment, the mesh shape of described first conductive grid and/or described second conductive grid is regular grid or random grid therein.
Above-mentioned nesa coating, offer the first grid groove in the first area of substrate, electric conducting material is filled in the first grid groove forms first conductive grid, constitute transparency conducting layer, form the lead-in wire electrode at the second area that is positioned at basal edge, the node that forms in the end of the electric conducting material of transparency conducting layer and second area intersection, and the end points of this node with the electrode conductive material that goes between directly be electrically connected.So, by offer the first grid groove in the first area of substrate, electric conducting material is filled in the first grid groove to form first conductive grid, thereby the formation transparency conducting layer is laid the lead-in wire electrode at second area again, and meanwhile the end of the electric conducting material of transparency conducting layer and second area intersection can form node, and directly be electrically connected with the end points of lead-in wire electrode conductive material, simplify manufacture craft, conducting electricity very well of conducting film improves yields.
Description of drawings
Fig. 1 is the structural representation of the nesa coating among the utility model embodiment one;
Fig. 2 is the structure for amplifying schematic diagram at A place among Fig. 1;
Fig. 3 is another visual angle structural representation of nesa coating shown in Figure 1;
Fig. 4 is the structural representation of the nesa coating among the utility model embodiment two;
Fig. 5 is the structural representation of the nesa coating among the utility model embodiment three;
Fig. 6 is the structural representation of the nesa coating among the utility model embodiment four;
Fig. 7 is the structural representation of the alignment mark of nesa coating shown in Figure 1;
Fig. 8 is the enlarged diagram at B place among Fig. 7.
Embodiment
Below in conjunction with the drawings and specific embodiments the utility model is described further.
As Fig. 1, Fig. 2 and shown in Figure 3, in embodiment one, a kind of nesa coating comprises substrate 110, transparency conducting layer 120 and lead-in wire electrode 130.Substrate 110 comprises first area 112 and the second area 114 that is positioned at substrate 110 edges, and transparency conducting layer 120 is imbedded and is arranged at first area 112, and lead-in wire electrode 130 is formed at second area 114.Wherein, transparency conducting layer 120 comprises the first grid groove, and first conductive grid 122 that is formed by the electric conducting material that is filled in the first grid groove; Lead-in wire electrode 130 comprises second conductive grid 132 that contains electric conducting material.Transparency conducting layer 120 forms node 124 with the end of the electric conducting material of second area 114 intersections, and directly is electrically connected with the end points of the electric conducting material of corresponding lead-in wire electrode 130.Specifically as shown in Figure 3, first area 112 is positioned at the zone line of substrate 110 tops, and second area 114 is positioned at the fringe region on substrate 110 both sides.
Above-mentioned nesa coating, offer the first grid groove in the first area 112 of substrate 110, electric conducting material is filled in the first grid groove forms first conductive grid 122, constitute transparency conducting layer 120, form lead-in wire electrode 130 at the second area 114 that is positioned at substrate 110 edges, meanwhile the end of the electric conducting material of transparency conducting layer 120 forms node 124, and the end points of this node 124 with the electric conducting material of lead-in wire electrode 130 directly is electrically connected.Particularly, provide a substrate 110; Lay first conductive grid 122, offer the first grid groove in the first area 112 of substrate 110, electric conducting material is filled in the first grid groove forming first conductive grid 122, thereby constitute transparency conducting layer 120; Lay second conductive grid 132, form second conductive grid 132 that is constituted by electric conducting material at the second area 114 of substrate 110, constitute lead-in wire electrode 130; End at transparency conducting layer 120 and the electric conducting material of second area 114 intersections forms node 124, and directly is electrically connected with the end points of the electric conducting material of corresponding lead-in wire electrode 130.
So, by 112 offering the first grid groove in the first area, electric conducting material is filled in the first grid groove, to form transparency conducting layer 120, lay second conductive grid 132 at second area 114 again and form lead-in wire electrode 130, meanwhile transparency conducting layer 120 can be connected with the end points of lead-in wire electrode 130 electric conducting materials with the formed node 124 in the end of second area 114 intersections.Wherein, lead-in wire electrode 130 comprises second conductive grid 132 that is made of electric conducting material, adopts the lead-in wire electrode 130 of grid type, can strengthen the bond strength of lead-in wire electrode 130 and flexible PCB, improves the conductivity of conducting film.Form node 124 by the end at transparency conducting layer 120, and the end points of this node 124 with the electric conducting material of lead-in wire electrode 130 directly is electrically connected, the good conductivity of conducting film has improved yields, and connected mode is easy, and manufacture craft is easy, reduces cost.
As shown in Figure 2, transparency conducting layer 120 can form a virtual boundary line with lead-in wire electrode 130 junctions, the end points of electric conducting material that is positioned at the transparency conducting layer 120 at place, this line of demarcation can form node 124, and this node 124 can be connected with the end points of the electric conducting material of corresponding lead-in wire electrode 130.
Wherein, the electric conducting material of transparency conducting layer 120 and lead-in wire electrode 130 all can be selected gold, silver, copper, aluminium, nickel, zinc or a kind of in the alloy of the two at least wherein for use.The material that wherein is appreciated that preparation transparency conducting layer 120 can be realized corresponding function for the conductor of electricity, as carbon nano-tube, and Graphene, conducting polymer etc.In the present embodiment, the material of lead-in wire electrode 130 is Nano Silver.Wherein, the material of substrate 110 can be Polyethyleneglycol Terephthalate.In other embodiments, this substrate 110 can also be other material, and for example polybutylene terephthalate, polymethyl methacrylate, polycarbonate plastic and glass etc. are good with transparent insulation material.
See also Fig. 2, in embodiment one, the density of the grid line of second conductive grid 132 is greater than the density of the grid line of first conductive grid 122.This grid line is to form by electric conducting material is set, and namely the density of grid line refers to the dense degree of electric conducting material.First conductive grid 122 of transparency conducting layer 120 is electrically connected with second conductive grid 132 of lead-in wire electrode 130, to realize the purpose of nesa coating conduction, first conductive grid 122 and second conductive grid 132 constitute by electric conducting material again, be to form node 124 by the end at the electric conducting material of first conductive grid 122 in the present embodiment, again the end points of this node 124 with the electric conducting material of corresponding second conductive grid 132 directly be electrically connected.So, for guarantee transparency conducting layer 120 be positioned at virtual boundary line the formed node 124 of electric conducting material can both with the lead-in wire electrode 130 be electrically connected, guarantee the conductivity of conducting film, the density of grid line of second conductive grid 132 then rationally is set greater than the density of the grid line of first conductive grid 122, thereby make the transmitance of second conductive grid 132 less than first conductive grid, 122 transmitances, the transmitance of described second conductive grid is less than 70%.
See also Fig. 3, in embodiment one, the first grid groove of transparency conducting layer 120 is opened in first area 112, and lead-in wire electrode 130 comprises the second grid groove that is opened in second area 114, and the electric conducting material of second conductive grid 132 is contained in the second grid groove.Mode in the first area 112 of substrate 110 by impression forms the first grid groove, electric conducting material is filled in the first grid groove forming first conductive grid 122 again, and obtains transparency conducting layer 120 by sintering process.Second area 114 in substrate 110 forms the second grid groove by the modes of impression equally, electric conducting material is filled in the second grid groove forming second conductive grid 132 again, and by the sintering process electrode 130 that obtains going between.Because the first grid groove and the second grid groove all are positioned at the same side of substrate 110, can pass through an imprinting moulding, simplify manufacture craft, with the purpose that realizes reducing cost.Simultaneously electric conducting material is contained in the second grid groove and forms second conductive grid 132, constitute lead-in wire electrode 130, but the bonding force of reinforced leads electrode 130 during with the circuit board bonding further improves the conductivity of conducting film.
As shown in Figure 7 and Figure 8, in embodiment one, nesa coating also is provided with alignment mark 150,, adopt alignment mark 150 conveniently the accurate contraposition of conducting film to be installed on touch-screen, guarantee the conductivity of conducting film.Alignment mark 150 can constitute for the grid line of quadrature, and the live width of this alignment mark 150 can be 2.2 μ m, and the grid cycle is 8 μ m, and transmitance can be 53.5% relatively.
Also see also Fig. 3, in embodiment one, for after the material that guarantees transparency conducting layer 120 and lead-in wire electrode 130 is filled in groove, do not rupture through in the process of sinter molding, and in order to guarantee the conductivity of conducting film, the degree of depth of the first grid groove and the ratio of width can rationally be set to be not less than 1, the degree of depth of the second grid groove and the ratio of width can rationally be set to be not less than the width of 1, the first grid groove and the width of the second grid groove all rationally is set to be not more than 10 μ m.
See also Fig. 4, in embodiment two, lead-in wire electrode 130 is convexly set in the surface of second area 114.Particularly, the material of lead-in wire electrode 130 can be formed at second area 114 surfaces by inkjet printing, forms lead-in wire electrode 130.When guaranteeing conducting film conductivity, this manufacture craft is easy, saves cost.
Particularly, in embodiment two as shown in Figure 4, lead-in wire electrode 130 is formed at substrate 110 second areas 114 upper surfaces.The end of the electric conducting material of transparency conducting layer 120 is forming node 124 with lead-in wire electrode 130 intersections, and directly is electrically connected with the electric conducting material of corresponding lead-in wire electrode 130.
See also Fig. 4, in embodiment two, in order to guarantee the conductivity of conducting film, the minimum widith of described lead-in wire electrode 130 can rationally be set to 2 μ m～20 μ m, and the height of described lead-in wire electrode 130 rationally is set to 5 μ m～10 μ m.
See also Fig. 3, in embodiment one, described substrate 110 comprises hypothallus 116, and described first area 112 and described second area 114 all are positioned at described hypothallus 116.Wherein, can pass through to apply jelly in substrate 110 1 sides, and make jelly solidify to form hypothallus 116, first area 112 and second area 114 all are positioned at hypothallus 116.In the present embodiment, in the centre of the upper surface of hypothallus 116, namely first area 112 is provided with transparency conducting layer 120; At the edge of the upper surface of hypothallus 116, namely second area 114 is provided with lead-in wire electrode 130, light shield layer 140 is arranged at the lower surface of hypothallus 116 second areas 114.This hypothallus 116 can be used for insulation and moulding.Wherein, the material of hypothallus 116 can be OCA glue, UV glue, hot-setting adhesive or dried glue etc. certainly.
It is pointed out that first area 112 and second area 114 all can also directly be arranged at substrate 110 1 sides, so hypothallus 116 not necessarily, see also Fig. 5 and specific embodiment shown in Figure 6.
See also Fig. 3, in embodiment one, also comprise light shield layer 140, described light shield layer 140 is positioned at the edge of described substrate 110, and described lead-in wire electrode 130 is formed at described hypothallus 116 away from a side of described light shield layer 140.At the material of the surface of substrate 110 corresponding hypothallus 116 second areas 114 spraying light shield layer 140, to form light shield layer 140.Because the first area 112 that is formed with transparency conducting layer 120 is transparent region, also have Presentation Function, just second area 114 arranges light shield layer 140 at the edge of substrate 110, can make the contrast of viewing area stronger, strengthens display effect.Also can block simultaneously the lead-in wire electrode 130 that is positioned at light shield layer 140, improve visual effect in use.Wherein the material of light shield layer 140 can be selected printing ink for use, and in order to guarantee the shaded effect of light shield layer 140, the width of light shield layer 140 can rationally be set to 1～5mm.
See also Fig. 1, in embodiment one, the mesh shape of first conductive grid 122 is random grid.First conductive grid 122 comprises a plurality of first grid cells, with nesa coating and the applying of other display unit the time, generation for fear of Moire fringe, the mesh shape of first conductive grid 122 is random grid, namely the grid cycle of at least two first grid cells inequality, be distributed with first grid cell in all angles of transparency conducting layer 120.Wherein, the grid cycle is the size of each grid cell.Moire fringe is a kind of optical phenomena, it is the visual results that interferes with constant angles and frequency between two lines or two objects, when human eye can't be differentiated these two lines or two objects, can only see the decorative pattern of interference, this optical phenomena is exactly Moire fringe.Wherein, the shape of first grid cell can be rhombus, rectangle, parallelogram, curvilinear boundary quadrilateral or polygon, and curvilinear boundary quadrilateral has four bent limits, and two relative bent limits are of similar shape and the curve trend.
In other embodiments, the mesh shape of first conductive grid 122 is regular grid, and namely the grid cycle of the first all grid cells is all identical.So, with nesa coating and the applying of other display unit the time, particularly for the less display unit of display screen, the phenomenon that can avoid Shows Picture gets muddled.
See also Fig. 2, in embodiment one, the mesh shape of second conductive grid 132 is regular grid.Second conductive grid 132 comprises a plurality of second grid cells, the mesh shape of second conductive grid 132 is regular grid, namely the grid cycle of the second all grid cells all identical, the grid cycle refers to the size of each grid cell, namely second conductive grid 132 is shaped as regular grid.So, second conductive grid 132 adopts regular grids, when the electrode 130 of will going between is connected with circuit board, can improve the stability of lead-in wire electrode 130 conductions, namely improved the electric conductivity of conducting film, and manufacturing process be simple, improve the convenience that connects, saved cost.In other embodiments, the mesh shape of second conductive grid 132 can also be random grid.Wherein, the shape of second grid cell can be rhombus, rectangle, parallelogram, curvilinear boundary quadrilateral or polygon, and curvilinear boundary quadrilateral has four bent limits, and two relative bent limits are of similar shape and the curve trend.
The above embodiment has only expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model claim.Should be pointed out that for the person of ordinary skill of the art under the prerequisite that does not break away from the utility model design, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (9)
1. a nesa coating is characterized in that, comprising:
Substrate comprises the first area, and is positioned at the second area of described basal edge;
Transparency conducting layer is imbedded and is arranged at described first area, and described transparency conducting layer comprises the first grid groove, and first conductive grid that is formed by the electric conducting material that is filled in the described first grid groove;
The lead-in wire electrode is formed at the second area of described substrate, and described lead-in wire electrode comprises second conductive grid that contains electric conducting material;
The end of the electric conducting material of described transparency conducting layer and described second area intersection forms node, and directly is electrically connected with the end points of corresponding described lead-in wire conductive material of electrodes.
2. nesa coating according to claim 1 is characterized in that, the density of the grid line of described second conductive grid is greater than the density of the grid line of described first conductive grid.
3. nesa coating according to claim 1 is characterized in that, described lead-in wire electrode comprises the second grid groove that is opened in described second area, and the electric conducting material of described second conductive grid is contained in the described second grid groove.
4. nesa coating according to claim 3, it is characterized in that, the degree of depth of the described first grid groove and the ratio of width are not less than 1, the degree of depth of the described second grid groove and the ratio of width are not less than 1, and the width of the width of the described first grid groove and the described second grid groove all is not more than 10 μ m.
5. nesa coating according to claim 1 is characterized in that, described lead-in wire electrode is convexly set in the surface of described second area.
6. nesa coating according to claim 5 is characterized in that, the minimum widith of described lead-in wire electrode is 2 μ m～20 μ m, and the height of described lead-in wire electrode is 5 μ m～10 μ m.
7. nesa coating according to claim 1 is characterized in that, described substrate also comprises the hypothallus that is arranged on the described substrate, and described first area and described second area all are positioned at described hypothallus.
8. nesa coating according to claim 7 is characterized in that, also comprises light shield layer, and described light shield layer is positioned at the edge of described substrate, and described lead-in wire electrode is formed at described hypothallus away from a side of described light shield layer.
9. according to any described nesa coating of claim 1～8, it is characterized in that the mesh shape of described first conductive grid and/or described second conductive grid is regular grid or random grid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320148295 CN203179570U (en) | 2013-03-28 | 2013-03-28 | Transparent conductive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320148295 CN203179570U (en) | 2013-03-28 | 2013-03-28 | Transparent conductive film |
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| CN203179570U true CN203179570U (en) | 2013-09-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201320148295 Expired - Fee Related CN203179570U (en) | 2013-03-28 | 2013-03-28 | Transparent conductive film |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103165227A (en) * | 2013-03-28 | 2013-06-19 | 南昌欧菲光科技有限公司 | Transparent conductive film and connection method thereof |
| CN106654605A (en) * | 2015-11-04 | 2017-05-10 | 金瑟姆股份有限公司 | Crimp connection for mesh shielding material used in steering wheel with capacitive sensing |
| CN110164853A (en) * | 2019-04-22 | 2019-08-23 | 中山市木林森电子有限公司 | A kind of curved surface LED light source |
-
2013
- 2013-03-28 CN CN 201320148295 patent/CN203179570U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103165227A (en) * | 2013-03-28 | 2013-06-19 | 南昌欧菲光科技有限公司 | Transparent conductive film and connection method thereof |
| CN103165227B (en) * | 2013-03-28 | 2014-09-17 | 南昌欧菲光科技有限公司 | Transparent conductive film and connection method thereof |
| CN106654605A (en) * | 2015-11-04 | 2017-05-10 | 金瑟姆股份有限公司 | Crimp connection for mesh shielding material used in steering wheel with capacitive sensing |
| CN106654605B (en) * | 2015-11-04 | 2020-02-07 | 金瑟姆股份有限公司 | Assembly with crimp connection and crimp connection method used therein |
| CN110164853A (en) * | 2019-04-22 | 2019-08-23 | 中山市木林森电子有限公司 | A kind of curved surface LED light source |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130904 Termination date: 20160328 |