JPS5892540A - Conductive foam molding body and manufacture therefor - Google Patents
Conductive foam molding body and manufacture thereforInfo
- Publication number
- JPS5892540A JPS5892540A JP56191930A JP19193081A JPS5892540A JP S5892540 A JPS5892540 A JP S5892540A JP 56191930 A JP56191930 A JP 56191930A JP 19193081 A JP19193081 A JP 19193081A JP S5892540 A JPS5892540 A JP S5892540A
- Authority
- JP
- Japan
- Prior art keywords
- particles
- conductive layer
- conductive
- thermoplastic resin
- foamed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/22—After-treatment of expandable particles; Forming foamed products
- C08J9/224—Surface treatment
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B32/00—Artificial stone not provided for in other groups of this subclass
- C04B32/005—Artificial stone obtained by melting at least part of the composition, e.g. metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0067—Devices for protecting against damage from electrostatic discharge
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structural Engineering (AREA)
- Molding Of Porous Articles (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は静電気障害を防止し得る導電性発泡成型体及び
その製造方法に胃する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a conductive foam molded article capable of preventing static electricity damage and a method for manufacturing the same.
！、Ｃ３等の集積ａ路及び集積回路を実装したセラ）製
品等の保管、運搬に当り、静電気により集積回路が破損
、゛故障を起こすという問題があり、そこて集積回路を
静電気から保■するために静電気防止導電性プラスチッ
クが従来から開発されてしする。この従来の導電性プラ
スチックとしては、カーボンを含有したプラスチックが
一般的に知られており、勢にクツシ首ン性を有する導電
性プラスチックとしては、（１）カーボンを練込んだ硬
質若しくは軟質のウレタン７オーム、（２）カーボンを
含浸させた硬質若しくは軟質のウレタン７オーム、（２
））ポリエチレン、スチレンなどの発泡シートの表面に
カーボンを練り込んだプラスチックスフィルムを貼り合
せたもの或いはその表面にカーダン系塗料をコーティン
グしたもの等々が知られてしする。! When storing and transporting integrated circuits such as C3, C3, etc., there is a problem that the integrated circuits may be damaged or malfunction due to static electricity, so it is necessary to protect the integrated circuits from static electricity. Antistatic conductive plastics have been developed for this purpose. As conventional conductive plastics, carbon-containing plastics are generally known, and conductive plastics with excellent stiffness include: (1) hard or soft urethane infused with carbon; 7 ohm, (2) hard or soft urethane impregnated with carbon 7 ohm, (2
)) Foamed sheets made of polyethylene, styrene, etc., with a plastic film in which carbon is kneaded attached to the surface, or those whose surfaces are coated with a cardan-based paint are known.
しかしながら、集積回路を実装した重量物の静電気障害
を防止する目的としたシート状若しく＆ま彼雑な形状の
成形品は実用上、コスＦ上からみて満足のゆくものは見
当らなかりた。However, for practical purposes, no sheet-like or intricately shaped molded products have been found that are intended to prevent electrostatic damage to heavy objects on which integrated circuits are mounted, and are satisfactory from the viewpoint of cost F.
本発明は上記従来の問題点を解消するもので、静電気防
止効果に優れると共に反発弾性、緩衝性、機械約強度等
の物性に優れ、且つ集積回路を含む被保護体を破損、汚
損させることのない導電性発泡成型体を提供することを
目的と−する。更に本発明のいま１つの目的は、そのよ
うに優れた性能を有する導電性発泡成型体を得るための
製造方法を提供することにある。The present invention solves the above-mentioned conventional problems, and has excellent anti-static effects, excellent physical properties such as rebound resilience, cushioning properties, and mechanical strength, and is resistant to damage and staining of protected objects including integrated circuits. The purpose of the present invention is to provide a conductive foam molded product that is free from electrical conductivity. Furthermore, another object of the present invention is to provide a manufacturing method for obtaining a conductive foam molded product having such excellent performance.
即ち本発明は、熱可塑性樹脂予備−泡粒子を金型内で発
泡させて得られる発泡成型体において、該Ｔｔｒ、Ｉｌ
！！体は予備発泡粒子が相互に発泡、融着して形成され
た多数の粒子状体から構成され、該粒子状体の相互融着
面の全部もしくは一部に導電層が形成されていることを
特徴とする導電性発泡成型体を要旨とする。更に本発明
は少なくとも表面の一部に導電層を成層してなる熱可塑
性樹脂予備発泡粒子を、閉鎖し得るが密閉し得ない金型
に充填し、加熱発泡させて型通りの１ｒ＆型体を得るこ
とを特徴とする導電性発泡成型体の製造方法を要旨とす
る。That is, the present invention provides a foam molded article obtained by foaming thermoplastic resin pre-foam particles in a mold, in which the Ttr, Il
! ! The body is composed of a large number of particulate bodies formed by mutually foaming and fusing pre-expanded particles, and a conductive layer is formed on all or part of the mutually fused surfaces of the particulate bodies. The main feature is the conductive foam molded product. Further, in the present invention, pre-expanded thermoplastic resin particles having a conductive layer layered on at least a part of the surface are filled into a mold that can be closed but cannot be sealed, and heated and foamed to form a 1r & mold body according to the shape. The gist of the present invention is a method for producing a conductive foam molded article.
以下、本発明の一実施例を図面に基き説明する。Hereinafter, one embodiment of the present invention will be described based on the drawings.
＠１図において１は導電性発泡成型体を示し、該成型体
１は熱可塑性Ｗ脂予備発泡粒子を金型に充填し、これを
発泡させて得られるもので、該成型体１は予備発泡粒子
が相互に発泡、融着して形成された多数の粒子状体２か
ら構成される。特に図示しないが粒子状体２は内部に無
数の気泡を有している。そ′して１１３図に示すように
粒子状体２の相互融着面に導電層３が形成されている。@1 In the figure, 1 indicates a conductive foam molded product, and the molded product 1 is obtained by filling a mold with thermoplastic W resin pre-expanded particles and foaming them. It is composed of a large number of particulate bodies 2 formed by mutually foaming and fusing particles. Although not particularly illustrated, the particulate material 2 has numerous air bubbles inside. Then, as shown in FIG. 113, a conductive layer 3 is formed on the mutually fused surfaces of the particles 2.
尚、成型体１の＃ｌＢ外表面１ｔ−全面にも導電層３が
形成されている。成型体１内部における導電層３は粒子
状体２の相互融着面に形成される結果、三次元的な広が
りを持つ連続層を構成し、網目状の立体構造を有してい
る。従って、例えば蛛１図に示すように成型体１の一側
面を切除して切断面４を露出させた場合でも、切断面４
において導電層３は上下方向（２方向）、前後方向（ｙ
方向）及び左右方向（１方向）に連続している。更に第
１図に示す２点鎖線に沿って成型体１をスライスし、且
つこのスライスして得られた切断片の周囲外表面１畠を
更に切除して第２図に示す如き全周面に切断面４が露出
している切断片１′を得た場合でも、該切断片１′の全
切断面において同様に導電層３は前記ｔ ｓ ２１ ｓ
ｊ方向に連続している。また成型体１の屑厘外麦面１
ｍの導電層３−と−ｔ＆型体１内部の三次元的網目構造
の導電層３とは相互に連続している（＠３図）。Incidentally, a conductive layer 3 is also formed on the entire #lB outer surface 1t of the molded body 1. The conductive layer 3 inside the molded body 1 is formed on the mutually fused surfaces of the particulate bodies 2, thereby forming a continuous layer with a three-dimensional spread and having a mesh-like three-dimensional structure. Therefore, even if one side of the molded body 1 is cut off to expose the cut surface 4 as shown in Fig. 1, for example, the cut surface 4
, the conductive layer 3 is formed in the vertical direction (two directions) and the front-back direction (y
direction) and the left-right direction (one direction). Furthermore, the molded body 1 is sliced along the two-dot chain line shown in FIG. 1, and the peripheral outer surface of the sliced piece obtained by the slicing is further cut out to form the entire circumferential surface as shown in FIG. Even when a cut piece 1' is obtained in which the cut surface 4 is exposed, the conductive layer 3 is similarly formed on the entire cut surface of the cut piece 1'.
Continuous in the j direction. In addition, the wheat surface 1 outside the scraps of the molded body 1
The conductive layer 3- of m and the conductive layer 3 having a three-dimensional network structure inside the -t& mold body 1 are continuous with each other (Fig. 3).
このように、１ｔ＆型体１はそのままの状態゛で導電性
を有しているが、これを切断して得られた切断片も同様
に導電性を有するものである。しかも水平方向、垂直方
向、斜方向のどの方向に切断しても得られた切断片は全
て導電性を有する。このように切断片又は切断面が導電
性を有するのは全て、成型体内部の導電層３の三次元的
網目構造に基くものである。In this way, the 1t& mold body 1 has conductivity in its original state, but the cut pieces obtained by cutting it also have conductivity. In addition, all cut pieces obtained are electrically conductive regardless of whether the cut piece is cut in a horizontal direction, a vertical direction, or an oblique direction. The electrical conductivity of the cut pieces or cut surfaces is entirely based on the three-dimensional network structure of the conductive layer 3 inside the molded body.
尚、本発明の導電性発泡成型体は１３図に示した如く、
粒子状体の相互融着面の全部に導電層を形成したものに
限らず、１４図に示す如く、粒子状体の相互融着面に導
電層の形成されない部分５を一部含んだものであっても
よい。Incidentally, the conductive foam molded product of the present invention has the following characteristics as shown in Fig. 13:
The conductive layer is not limited to the one in which the conductive layer is formed on the entire mutually fused surface of the particulate bodies, but the particulate body in which the mutually fused surface includes a part 5 on which the conductive layer is not formed, as shown in Fig. 14. There may be.
即ち、全く導電層の形成されていない粒子状体が一部浬
在していたとしても、あるいは、相互融着面の一部に導
電層の形成されていない部分を多少含んでいたとしても
、切断面を全体として見た時、導電層がどこかで連なり
三次元的網目構造を形成したものであれば、切断面が導
電性を有することになり、・本発明の所期の目的を達す
ることになる。That is, even if there are some particulate matter on which no conductive layer is formed, or even if some parts of the mutually fused surface include some portions where no conductive layer is formed, When the cut surface is viewed as a whole, if the conductive layers are connected somewhere to form a three-dimensional network structure, the cut surface has conductivity, and the intended purpose of the present invention is achieved. It turns out.
ｔ＆蓋体１は熱可順性樹脂からなり、この熱可■性樹脂
として、ポリエチレン、エチレン−酢酸ビニル共重合体
°、ボリプ賀ピレン、エチレン５．−プロピレン共重合
体、ボ、リスチレン等が例示されるが、ポリオレアイン
系樹脂が好ましく、なかでも特にメリプ四ピレン系樹脂
が好ましい。ボップリピレン系樹脂の場合、ｔ＆型体の
発泡倍率は一般的に１０〜５０倍であるが、３０倍程度
に発泡したものが特に好適である。The lid body 1 is made of a thermoplastic resin, and examples of the thermoplastic resin include polyethylene, ethylene-vinyl acetate copolymer, pyrene, and ethylene. Examples include propylene copolymers, polyolefins, and listyrene, but polyolein-based resins are preferred, and among them, meliptetrapyrene-based resins are particularly preferred. In the case of Bopplipyrene resin, the expansion ratio of the T& mold body is generally 10 to 50 times, but one expanded to about 30 times is particularly suitable.
本発明の導電性発泡成型体をａｔ造するに当っては、１
５１ｉ１に示す如く、表面に導電層３′を成層してなる
熱可塑性樹脂予備発泡粒子・を用いる。この導電層３′
は、導電性発泡１＆型体における粒子状□ 体の相互融
着面に形成される導電層３を構成する。In manufacturing the conductive foam molded product of the present invention, 1
As shown in 51i1, pre-expanded thermoplastic resin particles having a conductive layer 3' layered on the surface are used. This conductive layer 3'
constitutes the conductive layer 3 formed on the mutually fused surfaces of the particulate bodies in the conductive foam 1 and mold body.
なお、本発明の導電性発泡成型体を製造するに当りて―
、表面の全面に亘って導電層が被覆された熱可塑性樹脂
予備発泡粒子を必ず使用しなければならないわけではな
い。表面の一部、一般には表面積の１／３以上、好まし
くは１７２以上導電層が成層されている熱可塑性樹脂予
備発泡粒子を使用することによっても本発明の導電性発
泡成型体を製造することができる。但し、得られる成型
体の表面抵抗値は】０１Ω・１以下であることが好まし
い。In addition, in manufacturing the conductive foam molded product of the present invention-
However, it is not always necessary to use pre-expanded thermoplastic resin particles whose entire surface is coated with a conductive layer. The conductive foam molded article of the present invention can also be produced by using pre-expanded thermoplastic resin particles on which a part of the surface, generally 1/3 or more of the surface area, preferably 172 or more conductive layers, is laminated. can. However, the surface resistance value of the molded product obtained is preferably 01Ω·1 or less.
又、表面に全く導電層の成層されていない熱可塑性樹脂
予備発泡粒子を、前記した表面の一部又は全部に導電層
を成層してなる熱可塑性樹脂予備発泡粒子に混在させて
成型に供することにより本発明の導電性発泡成型体を製
造することも可能である。その場合、表面に全←１電層
の成層されていない熱可塑性樹脂予備発泡粒子の割合が
多くなり過ぎると得られる威濠体の表面抵抗値が高くな
るので注意を要する。一般には、表面に全く導電層の成
層されていない熱可塑性樹脂予備発泡粒子の割合は、成
型に使用される予備発泡粒子の２／３以下、好ましくは
１／２以下で、ある。但し、得られる成型体の表面抵抗
値は１０６Ω・α以下であることが好ましい。Alternatively, pre-expanded thermoplastic resin particles having no conductive layer layered on their surfaces may be mixed with the pre-expanded thermoplastic resin particles having a conductive layer layered on part or all of the surface, and then subjected to molding. It is also possible to manufacture the conductive foam molded article of the present invention. In this case, care must be taken because if the proportion of pre-expanded thermoplastic resin particles on the surface of which is not laminated with all ← 1 electrical layers becomes too large, the surface resistance value of the resulting moat body will become high. Generally, the proportion of pre-expanded thermoplastic resin particles having no conductive layer formed on their surfaces is 2/3 or less, preferably 1/2 or less, of the pre-expanded particles used for molding. However, it is preferable that the surface resistance value of the molded product obtained is 10 6 Ω·α or less.
さて、少なくとも表面の一部に導電層を成層してなる熱
可塑性樹脂予備発泡粒子を得る方法としては熱可塑性樹
脂予備発泡粒子の表面に導電性物質の分散液を塗布する
方法、導電性物質を真空蒸着法や無電解メッキ法等によ
り熱可塑性樹脂予備発泡粒子の表面に直接固着させて形
成する方法などが適宜選択される。Now, methods for obtaining pre-expanded thermoplastic resin particles having a conductive layer layered on at least a part of the surface include a method of applying a dispersion of a conductive substance to the surface of the pre-expanded thermoplastic resin particles, and a method of applying a dispersion of a conductive substance to the surface of the pre-expanded thermoplastic resin particles. A method of directly adhering to the surface of the pre-expanded thermoplastic resin particles by vacuum evaporation, electroless plating, or the like is appropriately selected.
導電性物質としてはグラファイト、カーボンブラック、
アルミニウム、銅、ニッケル、酸化錫、酸化クロム、酸
化ニッケル等が好ましい。尚、導電性物質としてカーボ
ンブラックを用いた場合、樹脂の耐候性を向上させる利
点もある。Graphite, carbon black,
Aluminum, copper, nickel, tin oxide, chromium oxide, nickel oxide, etc. are preferred. Incidentally, when carbon black is used as the conductive substance, there is also the advantage of improving the weather resistance of the resin.
これらの導電性物質は前記した如く、例えば分散液の状
態で表面に固着されるものであるが、例えば下表の組成
の分散ｔｌｌが使用できる。As described above, these conductive substances are fixed to the surface, for example, in the form of a dispersion, and for example, a dispersion tll having the composition shown in the table below can be used.
分散液の組成例
なお、表中の高分子化合物エマルシヨンとしてはアクリ
ル酸エステル・スチレン共重合物エマルジ璽ン、酢酸ビ
ニルエマルジ璽ン、アクリル酸エステル・エチレン・酢
酸ビニル共重合物工妥ルジ賃ン、エチレン・酢酸ビニル
共重合物エマルジ嘗ン、アクリル酸エステル・塩化ビニ
ル共重合物エマル“ジ璽ン、塩素化ポリプロピレンエマ
ルジ璽ンな′どが好ましい。これらの分散液の塗布方法
としては、混合法、浸漬法、吠き付は法等が好適に使用
できる。Composition examples of dispersion liquids The polymer compound emulsions in the table include acrylic ester/styrene copolymer emulsion, vinyl acetate emulsion, acrylic ester/ethylene/vinyl acetate copolymer emulsion, Ethylene/vinyl acetate copolymer emulsion, acrylic acid ester/vinyl chloride copolymer emulsion, chlorinated polypropylene emulsion, etc. are preferred.The method for applying these dispersions is mixing. Methods such as immersion method, immersion method, and immersion method can be suitably used.
塗布量は後述するように、ビーズを発泡させて成型した
場合に、その抵抗率が１０’〜１０４Ω・α以下となる
程度にすることが好ましく、これは例えば平均粒径５
ｗｍ ｓ発泡倍率３０倍の熱可塑性樹脂予備発泡粒子１
ゆに対して前記分散液を１００〜３００？塗布した場合
にほぼ相当し、このときの粒子表面には１ｗｌ当りａｉ
〜５ｆ、程度の導電性物質が塗布されていることになる
。As will be described later, the coating amount is preferably such that when the beads are foamed and molded, the resistivity is 10' to 104 Ω・α or less, which means, for example, that the average particle size is 5.
wm s Thermoplastic resin pre-expanded particles 1 with expansion ratio of 30 times
100~300? Approximately equivalent to the case of coating, at this time, the particle surface has ai per wl.
This means that a conductive material of about 5 f is coated.
分散液を塗布された熱可塑性樹脂予備発泡粒子τまその
軟化温度以下の温度で乾燥する等の後処理が施される。Post-treatments such as drying at a temperature below the softening temperature of the pre-expanded thermoplastic resin particles τ coated with the dispersion are performed.
尚、上記した方法は予備発泡粒子の表面に分散液を塗布
するものであったが、予備発泡の前段階の粒子、即ち、
未発泡の熱可塑性樹脂粒子の表面に前記分散液を塗布し
、導電層を成層した後、該粒子に揮発性発泡剤を含有さ
せ、加熱して予備発泡を行ない、表面に導電層の成層さ
れた熱可塑性樹脂予備発泡粒子を得ることもできる。In addition, although the above-mentioned method was to apply a dispersion liquid to the surface of pre-foamed particles, the particles at the stage before pre-foaming, i.e.
After applying the dispersion liquid to the surface of unfoamed thermoplastic resin particles to form a conductive layer, the particles are made to contain a volatile foaming agent and pre-foamed by heating to form a conductive layer on the surface. It is also possible to obtain pre-expanded thermoplastic resin particles.
ちなみに、予備発泡粒子に塗布する場合であれ、未発泡
粒子に塗布する場合であれ、予備発泡粒子を得るための
予備発泡方法は公知の方法を採用できる。例えば、揮発
性発泡剤を含有した熱可塑性樹脂粒子を密閉容器内で分
散媒に分散させ、加熱して該粒子と分散媒とを容器内よ
りも低圧の雰囲気下に絞出して粒子を発泡させることに
より予備発泡粒子を得る方法や、−揮発性発泡剤を含有
した熱可塑性樹脂粒子を開放容器内に入れ、該容器内で
加熱して粒子を発泡させることにより予備発泡粒子を得
る方法等を採用できる。Incidentally, whether the coating is applied to pre-expanded particles or unexpanded particles, any known pre-expanding method can be used to obtain pre-expanded particles. For example, thermoplastic resin particles containing a volatile foaming agent are dispersed in a dispersion medium in a closed container, heated, and the particles and dispersion medium are squeezed out under a lower pressure atmosphere than in the container to foam the particles. - A method of obtaining pre-expanded particles by placing thermoplastic resin particles containing a volatile blowing agent in an open container and heating the particles in the container to foam the particles. Can be adopted.
かくして得られた、表面に導電層３′を成層してなる予
備発泡粒子６を必要に応じて無機ガス又は無機ガスと揮
発性発泡剤との混合ガスにより加圧熟成して粒子内に高
められた圧力を付与し、しかる後、予備発泡粒子６を、
閉鎖し得るが密閉し得ない置型に充填し、加熱して該粒
子６を発泡膨張させる。この発泡膨張により粒子６は互
いに融着し、その結果として多数の粒子状体２が形成さ
れ、且つ粒子状体２の相互融着面に導電層３が形成され
る。成型時の熱源は水蒸気が好ましく、通常０．５〜５
ｋｇ／ａｉ（Ｇ）の加圧水蒸気が用いられる。成渭終了
後、成型体を所定温度まで冷却した後、型より取り出し
、゛製品とされる。The thus obtained pre-expanded particles 6 having the conductive layer 3' layered on the surface are aged under pressure with an inorganic gas or a mixed gas of an inorganic gas and a volatile blowing agent as required to increase the volume inside the particles. After that, the pre-expanded particles 6 are
The particles 6 are filled into a stationary mold that can be closed but not sealed, and heated to expand and expand the particles 6. The particles 6 are fused to each other by this foaming expansion, and as a result, a large number of granular bodies 2 are formed, and a conductive layer 3 is formed on the mutually fused surfaces of the granular bodies 2. The heat source during molding is preferably steam, usually 0.5 to 5
kg/ai (G) of pressurized steam is used. After completion of the formation, the molded body is cooled to a predetermined temperature and then removed from the mold to form a product.
本発明の成型体は１． Ｃ，、Ｌ、 Ｓ、 １．等の集
積回路を実装したハーフセット（プリント基板等）交換
部品・最終セット製品（コンビ具−ター、ラジオ、テレ
ビ、テープレコーダーなどのオーディオ製品、ＶＴＩ電
卓、時計、各種計測ａＳ、医療機器、電子レンジ）等を
保管、運搬時に静電気から保護するための静電気防止導
電性プラスチックとして用いることができ、更に電磁波
遮へい材、発熱体としての応用も可能である。The molded product of the present invention is as follows:1. C,,L,S,1. half-set (printed circuit boards, etc.) replacement parts and final set products (combiners, audio products such as radios, televisions, tape recorders, etc., VTI calculators, watches, various measurement AS, medical equipment, electronic It can be used as an anti-static conductive plastic to protect microwave ovens etc. from static electricity during storage and transport, and can also be used as an electromagnetic shielding material and a heating element.
この場合、成型体をそのまま用いてもよく或いは遺宣幅
にスライスして得た切断片を用いてもよい。更には成型
体の周囲外表面を切除した形で用いてもよい。In this case, the molded body may be used as it is, or a cut piece obtained by slicing it to the desired width may be used. Furthermore, the molded body may be used with the peripheral outer surface thereof cut off.
本発明成型体を上記静電気防止導電性プラスチックとし
て用いる態様には種々のものが考えられるが、その−例
を示すと、本発明成型体を平板状に影成し、該平板状成
型体上に集積回路等の被保護体を載置させて接触させる
態様、ｗＳ６図に示すように平板状に形成した本発明成
型体１に集積１路７の端子ビン８を刺し込んで接触させ
る態様、第７図に示すように本発明成型体１をコーナー
パッド９として構成し、集積回路を実装したセット製品
略の被保護体１０をＩｉＩ包容ｌ１１１内に収納梱包す
るに当って被保護体１０のコーナ一部に上記コーナーパ
ッド９を当接配置する態様、第８図に示すように本発明
成型体１を緩衝包装材１２として構成し、梱包容器１３
内において被保護体１０を緩衝包装材１２にて全部又は
一部を包装して接触させる態様、＠９図に示すように本
発明成型体１を、仕切り板１４及び該仕切り板１４によ
って形成される多数の収納室１５を有する箱体１６とし
て構成し、例えば集積回路を実装したプリント基板を収
納室１５に１枚づつ入れて接触させる態様、又は箱体本
体を例えば紙にて作り、仕切り鈑１４を本発明成型体に
て構成し、同様にプリント基板を収納室に入れて接触さ
せる態様等がある。There are various ways in which the molded product of the present invention can be used as the above-mentioned anti-static conductive plastic. For example, the molded product of the present invention is formed into a flat plate, and the molded product is placed on the flat plate-shaped molded product. A mode in which the object to be protected such as an integrated circuit is placed and contacted, a mode in which the terminal pin 8 of the integrated circuit 7 is inserted into the molded body 1 of the present invention formed in a flat plate shape as shown in FIG. As shown in Fig. 7, the molded body 1 of the present invention is configured as a corner pad 9, and when the protected body 10, which is a set product on which an integrated circuit is mounted, is stored and packed in the IiI enclosure 111, the corner of the protected body 10 is As shown in FIG. 8, the molded article 1 of the present invention is configured as a cushioning packaging material 12, and the packaging container 13
A mode in which the object to be protected 10 is wrapped in whole or in part with a buffer packaging material 12 and brought into contact with the inside, as shown in Figure @9, the molded object 1 of the present invention is formed by a partition plate 14 and the partition plate 14 For example, the box body 16 may be configured as a box body 16 having a large number of storage chambers 15, and for example, printed circuit boards mounted with integrated circuits may be put into the storage chambers 15 one by one and brought into contact with each other, or the box body may be made of paper, for example, and partition plates may be used. 14 is made of the molded body of the present invention, and a printed circuit board is similarly placed in the storage chamber and brought into contact with it.
上記いずれの態様においても集積回路等の被保護体は導
電性を有する本発明成型体と接触するので静電気による
集積回路等の破損、故障を防止することができ、る。In any of the above embodiments, the object to be protected, such as an integrated circuit, comes into contact with the conductive molded article of the present invention, so that damage or failure of the integrated circuit or the like due to static electricity can be prevented.
本発明成型体は静電気防止以外にホコリ、塵挨等の付着
防止、感光材料の感光防止等も図れるものである。In addition to preventing static electricity, the molded product of the present invention can also prevent the adhesion of dust, dust, etc., and prevent the exposure of photosensitive materials.
本発明によれば導電性良好で静電防止効果に優れ、しか
も樹脂の物性の劣下はなく、反発弾性、緩衝性、機械的
強度等に優れている。従ワて集積回路等の被保護体を確
実に載置、保持、包装等でき、樹脂層の破壊や荷重負荷
による蛮形、歪の発生の虞れはない。また、樹脂層全体
に導電性物質が含有されているものではないから導電性
物質を余分に用いる必要がなく、その分コスト低減を図
れる。更に成型体表面において導電性物質が剥落する虞
れもなく、従って導電性物質付着による被保護体の汚損
や表面抵抗値の変化という問題を生じる余地は全くない
。According to the present invention, it has good conductivity and excellent antistatic effect, and there is no deterioration in the physical properties of the resin, and it has excellent impact resilience, cushioning properties, mechanical strength, etc. Protected objects such as integrated circuits can be reliably placed, held, and packaged using the follower wire, and there is no risk of damage to the resin layer or deformation or distortion due to loading. Furthermore, since the entire resin layer does not contain a conductive substance, there is no need to use an extra conductive substance, and costs can be reduced accordingly. Furthermore, there is no possibility that the conductive substance will peel off on the surface of the molded body, and therefore there is no possibility of problems such as staining of the protected body or change in surface resistance due to adhesion of the conductive substance.
次に本発明の具体的実施例を述べる。Next, specific examples of the present invention will be described.
実施例及び比較例
第１表に示す基材樹脂からなる粒子とジクロロシフ０ロ
メタン（ｔ１発性発泡剤）、酸化アルミニ９ム（分散剤
）、及び水（分散媒）をそれぞれ適当量密閉容器内に入
れ、前記粒子等を水に分散させ、攪拌しながら所定温度
に加熱して前記粒子内に前記発泡剤を含有させ、その後
容器の一端を開放し、容器内圧力を所定の圧力に一保持
しながら前記粒子と水とを同時に大気下へ放出し、乾燥
して＠１表に示す種々の発泡倍率を有する予備発泡粒子
を得た。Examples and Comparative Examples Appropriate amounts of particles made of the base resin shown in Table 1, dichloromethane (T1 blowing agent), aluminum oxide (dispersant), and water (dispersion medium) were placed in a closed container. The particles, etc. are dispersed in water, heated to a predetermined temperature while stirring to incorporate the foaming agent into the particles, and then one end of the container is opened and the pressure inside the container is maintained at a predetermined pressure. Meanwhile, the particles and water were simultaneously discharged into the atmosphere and dried to obtain pre-expanded particles having various expansion ratios shown in Table 1.
得られた予備発泡粒子を常温常圧にて５０時間紋置後、
該粒子の表面に、第２表に示す組成からなる分散液を導
電性物質の塗布量が１１！１表に示す量となるようスプ
レーにて塗布した。乾燥後、前記粒子を加圧容器に入れ
、空気により２ ｋａ／ｊ （Ｇ）の圧力にて常温下４
８時間加圧熟成を行ない、しかる後、前記粒子を成型用
金型に充填し、水蒸気圧４ｋｆ／ａｊｃＧ）の水蒸気に
より加熱し、発泡させて型通りの成型体を得た。得られ
た成型体（実施例１〜３）及び該成型体を第１図２点鎖
線で示す如く所定幅にスライスしたもの（実施例４〜６
）の物性を測定した。尚、比較のため導電性物質を含ま
ないｌリエチレン発泡ＩＩＬＩＩ体及び従来のカーメン
含有軟質ウレタン７オームについても同様に物性を測定
した。結果を第３表に示す。After storing the obtained pre-expanded particles at room temperature and pressure for 50 hours,
A dispersion having the composition shown in Table 2 was applied to the surface of the particles by spraying so that the amount of conductive material applied was 11!1 as shown in Table 2. After drying, the particles were placed in a pressurized container and heated with air at a pressure of 2 ka/j (G) at room temperature for 4 hours.
After aging under pressure for 8 hours, the particles were filled into a mold, heated with steam at a steam pressure of 4 kf/ajcG), and foamed to obtain a molded product. The obtained molded bodies (Examples 1 to 3) and the molded bodies sliced into predetermined widths as shown by the two-dot chain line in FIG. 1 (Examples 4 to 6)
) were measured. For comparison, the physical properties of a polyethylene foam III II body containing no conductive material and a conventional carmen-containing soft urethane 7 ohm were also measured in the same manner. The results are shown in Table 3.
ｗｉ１表 第 ２ 表 ＠３表wi1 table Table 2 @Table 3
図面は本発明の実施例を示すもので、１１１図は本発明
成型体の一側面を切除して切断面を露出させた状態を示
す斜視図、＠２図は第１図の成型体を適宜幅にスライス
し、更にｗ４囲外表面を切除して全局面に切断面を露出
させた状態の切断片を示す斜視図、１１１３図は１１１
図の成型体の切断面を拡大して示す要部拡大図、１４図
は本発明の他の実施例における成型体の切断面の要部拡
大図、第５図は表面に導電層を成層してなる予備発泡粒
子の縦断面図、Ｔｌ５６図〜ＩＩ９図は本発明成型体の
使用例を示すもので第６図は縦断面図、第７図、第８図
は平断面図、第９図は斜視図である。
１・・・導電性樹脂発泡成型体、２・・・粒子状体、３
・・・導電層、３′・・・導電層、６・・・熱可塑性樹
脂予備発泡粒子
特許出願人 藤森工業株式会社
第１図
第３図
第６図
第２図
第４図
第５図
第７図
手続補正書（−）
１．事件の表示
昭和Ｓ−年特許原第 １９１８１０ 号２、発明の名称
導電ａｍｍ泡層蓋体びそＯＩｌ造方法
３、 補正をする者
事件との関係 特許出願人
五９ｔ 東京都中央区日本橋馬喰町友丁１４豐ｌ＠奇氏
名（名称） ■嚢工業株式金社
代表者 藤 森 費 彦（外１４）４、代理人〒
１・ｌ・
８、補正の内容 別諷Ｏ過−０
α）明細書ｌｌｌ１１頁下１行１露！Ｓ行第４行および
第１６頁腑１表中の「発泡倍率」を「見掛は発泡倍率」
と補正する。
＠同第１１％頁第５行の「・−・・を得た。」の次に以
下の文を挿入する。
「ここで、見掛は発泡倍率とｆｉ １０００ ｅｅのビ
ーカーに、蜜度ρ（１／ｌｘ” ） （ｓ ＩＩ！脂か
ら得られた予備発泡粒子を充填し、ビーカー内の予備発
泡粒子０重量Ｗ（ｉｆ）から次式：１０００ ＸルＷに
よシ求められえもＯである。」
以 上The drawings show embodiments of the present invention, and Figure 111 is a perspective view showing a state in which one side of the molded body of the present invention is removed to expose the cut surface, and Figure 2 is a perspective view of the molded body of Figure 1 as appropriate. 1113 is a perspective view showing the cut piece in a state where it has been sliced into widths and the W4 surrounding surface has been removed to expose the cut surface on all sides.
Figure 14 is an enlarged view of the main part of the cut section of the molded body in another embodiment of the present invention, and Figure 5 is an enlarged view of the main part of the cut section of the molded body in another embodiment of the present invention. FIG. 6 is a longitudinal sectional view, FIG. 7 and FIG. 8 are a plan sectional view, and FIG. 9 is a longitudinal sectional view of pre-expanded particles. is a perspective view. 1... Conductive resin foam molded body, 2... Particulate body, 3
...Conductive layer, 3'...Conductive layer, 6...Thermoplastic resin pre-expanded particles Patent applicant: Fujimori Kogyo Co., Ltd. Figure 1 Figure 3 Figure 6 Figure 2 Figure 4 Figure 5 Figure 7 Procedural Amendment (-) 1. Display of the case Showa S-Year Patent No. 191810 2, Name of the invention Conductive AMM foam layer cover body and OIL manufacturing method 3, Person making the amendment Relationship to the case Patent applicant 59T Tomocho, Bakurocho, Nihonbashi, Chuo-ku, Tokyo 14 豐l @ Mr. Ki Name (Name) ■Fukuro Kogyo Co., Ltd. Representative Kazuhiko Fujimori (Outside 14) 4, Agent 〒
1.l. 8. Contents of the amendment: 1.1, 1.1, 1.1, 1.1, 8. Contents of the amendment. Change the "foaming ratio" in the 4th line of S line and the 1st table on page 16 to "the apparent foaming ratio".
and correct it. @Page 11%, line 5, insert the following sentence next to "I got...". ``Here, a beaker with an apparent expansion ratio of fi 1000 ee is filled with pre-expanded particles obtained from honey density ρ(1/lx'') (s II! fat, and the pre-expanded particles in the beaker are 0 weight From W(if), the following formula: 1000
Claims (1)
て得られる発泡成型体において、該ｔ＆型体は予備発泡
粒子が相互に発泡、融着して形成された多数の粒子状体
から構成され、該粒子状体の相互融着面の全部もしくは
一部に導電層が彫威されていることを特徴とする導電性
発泡成型体。 偉） 少なくとも表面の一部に導電層を成層してなる熱
可霞性樹脂予備発泡粒子を、閉鎖し得るが密閉し得ない
金型に充填し、加熱発泡させて型通りのｒ＆型体を得る
ことを特徴とする導電性発泡成型体の製造方法。(1) In a foamed molded product obtained by foaming thermoplastic resin pre-expanded particles in a mold, the T & shape body is a large number of particles formed by mutually foaming and fusing the pre-expanded particles. 1. A conductive foam molded article, characterized in that a conductive layer is engraved on all or part of the mutually fused surfaces of the particulate bodies. (I) Pre-expanded thermoplastic resin particles having a conductive layer layered on at least a part of the surface are filled into a mold that can be closed but cannot be sealed, and heated and foamed to form an R& shaped body according to the mold. A method for producing a conductive foam molded article, characterized in that:
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56191930A JPS5892540A (en) | 1981-11-30 | 1981-11-30 | Conductive foam molding body and manufacture therefor |
| US06/444,191 US4496627A (en) | 1981-11-25 | 1982-11-24 | Electrical conductive foam beads and molded electrical conductive foamed articles obtained therefrom |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56191930A JPS5892540A (en) | 1981-11-30 | 1981-11-30 | Conductive foam molding body and manufacture therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5892540A true JPS5892540A (en) | 1983-06-01 |
Family
ID=16282806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56191930A Pending JPS5892540A (en) | 1981-11-25 | 1981-11-30 | Conductive foam molding body and manufacture therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5892540A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60195134A (en) * | 1984-03-16 | 1985-10-03 | Kanegafuchi Chem Ind Co Ltd | Electrically-conductive thermoplastic plastic expandable particle and foam consisting thereof |
| JPS6232130A (en) * | 1985-08-05 | 1987-02-12 | Shinto Paint Co Ltd | Expanded plastic bead |
| JPS6236436A (en) * | 1985-08-09 | 1987-02-17 | Shinto Paint Co Ltd | Impartation of electroconductivity to expanded plastic bead |
| JPS63275648A (en) * | 1987-05-06 | 1988-11-14 | Kanegafuchi Chem Ind Co Ltd | Production of surface-modified expandable resin particle |
| JP2012084664A (en) * | 2010-10-08 | 2012-04-26 | Mitsubishi Cable Ind Ltd | Production method of radio wave absorber |
| JP2015033845A (en) * | 2013-07-11 | 2015-02-19 | 山形化成工業株式会社 | Bichrome molding including multilayer carbon nanotube-added foam and method for manufacturing the same |
| JP2018510958A (en) * | 2015-03-13 | 2018-04-19 | ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ | Electrically conductive foamed particles based on thermoplastic elastomers |
| CN108650872A (en) * | 2018-05-15 | 2018-10-12 | 苏州盛达胶粘制品有限公司 | A kind of conductive and heat-conductive foam tape and preparation method thereof |
| CN109291300A (en) * | 2017-07-24 | 2019-02-01 | 中国石油化工股份有限公司 | Compound foamed polystyrene bead and its formed body and preparation method |
| JP2021134332A (en) * | 2020-02-28 | 2021-09-13 | 株式会社ジェイエスピー | Foamed particle and foamed particle molding |
| CN113571244A (en) * | 2021-08-03 | 2021-10-29 | 江苏亨通线缆科技有限公司 | Environment-friendly flame-retardant fire-resistant power cable buffered by aluminum alloy |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52130868A (en) * | 1976-04-23 | 1977-11-02 | Reuter Technologie Gmbh | Molded conductive foam |
-
1981
- 1981-11-30 JP JP56191930A patent/JPS5892540A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52130868A (en) * | 1976-04-23 | 1977-11-02 | Reuter Technologie Gmbh | Molded conductive foam |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60195134A (en) * | 1984-03-16 | 1985-10-03 | Kanegafuchi Chem Ind Co Ltd | Electrically-conductive thermoplastic plastic expandable particle and foam consisting thereof |
| JPH0461895B2 (en) * | 1984-03-16 | 1992-10-02 | Kanegafuchi Chemical Ind | |
| JPS6232130A (en) * | 1985-08-05 | 1987-02-12 | Shinto Paint Co Ltd | Expanded plastic bead |
| JPS6236436A (en) * | 1985-08-09 | 1987-02-17 | Shinto Paint Co Ltd | Impartation of electroconductivity to expanded plastic bead |
| JPS63275648A (en) * | 1987-05-06 | 1988-11-14 | Kanegafuchi Chem Ind Co Ltd | Production of surface-modified expandable resin particle |
| JP2012084664A (en) * | 2010-10-08 | 2012-04-26 | Mitsubishi Cable Ind Ltd | Production method of radio wave absorber |
| JP2015033845A (en) * | 2013-07-11 | 2015-02-19 | 山形化成工業株式会社 | Bichrome molding including multilayer carbon nanotube-added foam and method for manufacturing the same |
| JP2018510958A (en) * | 2015-03-13 | 2018-04-19 | ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ | Electrically conductive foamed particles based on thermoplastic elastomers |
| CN109291300A (en) * | 2017-07-24 | 2019-02-01 | 中国石油化工股份有限公司 | Compound foamed polystyrene bead and its formed body and preparation method |
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| JP2021134332A (en) * | 2020-02-28 | 2021-09-13 | 株式会社ジェイエスピー | Foamed particle and foamed particle molding |
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