CN104363743A - Electromagnetic wave radiation shield cover for printed circuit board - Google Patents
Electromagnetic wave radiation shield cover for printed circuit board Download PDFInfo
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- CN104363743A CN104363743A CN201410699291.8A CN201410699291A CN104363743A CN 104363743 A CN104363743 A CN 104363743A CN 201410699291 A CN201410699291 A CN 201410699291A CN 104363743 A CN104363743 A CN 104363743A
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- electromagnetic wave
- wave radiation
- radiation shielding
- printed circuit
- circuit board
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Abstract
The invention relates to an electromagnetic wave radiation shield cover for a printed circuit board. The electromagnetic wave radiation shield cover is formed by combining electromagnetic wave radiation shielding boards of a sandwich structure. The bottom layer of the electromagnetic wave radiation shielding boards of the sandwich structure is a 0Cr18Ni9 stainless steel plate, the face layer is a C7521 copper-nickel alloy plate, and the middle is an electromagnetic wave radiation shielding functional layer. Holes are evenly formed in the stainless steel plate and the copper-nickel alloy plate. The electromagnetic wave radiation shielding functional layer is formed by pure swnt/bi-component addition type room temperature vulcanized silicon rubber combined materials. The electromagnetic wave radiation shield cover has the advantages that the 0Cr18Ni9 stainless steel and C7521 copper-nickel alloy are superior conductors, heat can be effectively dissipated through holes formed in the upper faces of the 0Cr18Ni9 stainless steel and C7521 copper-nickel alloy, electromagnetic radiation can be prevented, and it can be prevented that the overhigh temperature of the printed circuit board affects the performance. The electromagnetic wave radiation shielding functional layer prepared through the pure swnt/ silicon rubber combined materials can effectively restrain electromagnetic radiation, and extremely high practical value is achieved.
Description
Technical field
The present invention relates to a kind of electromagnetic wave radiation shielding cover, be specifically related to a kind of electromagnetic wave radiation shielding cover used for printed circuit board.
Background technology
Along with the development of electronic science and technology and a large amount of uses of printed circuit board (printed circuit board, PCB), the electromagnetic compatibility problem that high-frequency harmonic causes electronic product and equipment is more and more serious.Because the electronic device integrated level on PCB is increasing, cabling is more and more narrow, and operating frequency is also more and more higher, inevitably introduces the problem of electromagnetic compatibility (CEMC).The miniaturization of PCB product and Highgrade integration and high-speed high frequencyization design, make the electromagnetic Compatibility Design of PCB product become more and more important.Along with the rising of PCB product work frequency, its electromagnetic radiation ability also strengthens gradually, produces radiation field, is converted into far field electromagnetic interference.Electric and magnetic fields in far field all can not be left in the basket, so will consider simultaneously to Electric and magnetic fields shielding and electromagnetic shielding.When PCB product work frequency is very high, its inside also may produce the electromagnetic interference in far field, therefore needs electromagnetic shielding.
Close at the outside screening conductive material of printed circuit board to one of effective measures that electromagnetic radiation shields.Screening conductive material is good with metal, but its shortcoming to be quality large, expensive, and not easily machine-shaping.Along with the development of macromolecular material, the conductive rubber material of electromagnetic radiation shielding constantly obtains development and application, just progressively replaces simple metal shielding material.Electromagnetic shield rubber is added in the rubber matrix of insulation at conduction or magnetic conductive substance, and adds appropriate coupling agent and vulcanizing agent etc., and the shielding properties obtained by series of process such as mixing, sulfurations is good and have the composite material of rubber flexible nature.But single electromagnetic shield rubber can not meet the needs of current printed circuit board electromagnetic shielding, therefore design one and can be used in printed circuit board, manufacturing cost is lower, and the electromagnetic wave radiation shielding cover being applicable to large-scale production popularization is necessary.
For this reason, designer of the present invention is because above-mentioned technological deficiency, and by concentrating on studies and designing, comprehensive experience and the achievement being engaged in related industry for a long time for many years, research and design goes out a kind of electromagnetic wave radiation shielding cover used for printed circuit board, to overcome above-mentioned technological deficiency.
Summary of the invention
The technical problem to be solved in the present invention is: design a kind of electromagnetic wave radiation shielding cover used for printed circuit board, to expect the electromagnetic wave radiation shielding that can be used in printed circuit board, and manufacturing cost is lower, is applicable to large-scale production and promotes.
In order to solve the problems of the technologies described above, present invention employs following technical scheme:
A kind of electromagnetic wave radiation shielding cover used for printed circuit board, described electromagnetic wave radiation shielding cover is combined by sandwich structure electromagnetic wave radiation shielding plate; It is characterized in that: described sandwich structure electromagnetic wave radiation shielding plate bottom is corrosion resistant plate, and surface layer is foreign copper-nickel alloy plate, and centre is electromagnetic wave radiation shielding functional layer; Uniform pore openings on described corrosion resistant plate and described foreign copper-nickel alloy plate, the diameter in hole is 5 ~ 10mm; In the middle of described corrosion resistant plate and described foreign copper-nickel alloy plate, electromagnetic wave radiation shielding functional layer is set, described electromagnetic wave radiation shielding functional layer is prepared from by pure Single Walled Carbon Nanotube/silicon rubber composite material, thickness is 2-4mm, the draw ratio of described pure Single Walled Carbon Nanotube is greater than 1000, and mass fraction is 3 ~ 7%.
Above-mentioned electromagnetic wave radiation shielding cover used for printed circuit board, is characterized in that: described stainless steel is 0Cr18Ni9 stainless steel, and described foreign copper-nickel alloy is C7521 ocean copper-nickel alloy.
Above-mentioned electromagnetic wave radiation shielding cover used for printed circuit board, is characterized in that: described silicon rubber is two-component addition type room temperature vulcanized silicone rubber.
Above-mentioned electromagnetic wave radiation shielding cover used for printed circuit board, is characterized in that: the thickness of described electromagnetic wave radiation shielding functional layer is 3mm, and the mass fraction of described pure Single Walled Carbon Nanotube is 5%.
Known by technique scheme, one of the present invention electromagnetic wave radiation shielding used for printed circuit board cover has following technique effect:
1, electromagnetic wave radiation shielding cover used for printed circuit board of the present invention adopts sandwich electromagnetic armouring structure, 0Cr18Ni9 stainless steel and C7521 ocean copper-nickel alloy are excellence conductor, perforate in the above can be dispelled the heat effectively, and printed circuit plate temperature is too high affects performance can to prevent electromagnetic radiation from can prevent again.
2, the electromagnetic wave radiation shielding functional layer that the pure Single Walled Carbon Nanotube/silicon rubber composite material being arranged on 0Cr18Ni9 corrosion resistant plate and copper-nickel alloy plate centre, C7521 ocean is prepared from can suppress electromagnetic radiation effectively, prevent external electromagnetic radiation to the interference of printed circuit board simultaneously, there is great practical value.
Detailed content of the present invention obtains by following detailed description and Figure of description.
Accompanying drawing explanation
Fig. 1 is the structural representation of electromagnetic wave radiation shielding cover sandwich structure electromagnetic wave radiation shielding plate used for printed circuit board of the present invention.
In figure: 1 be surface layer, 2 be electromagnetic wave radiation shielding functional layer, 3 for bottom.
Embodiment
Electromagnetic wave radiation shielding cover used for printed circuit board of the present invention is described in detail below in conjunction with Figure of description.
See Fig. 1, show electromagnetic wave radiation shielding cover used for printed circuit board of the present invention.
One of the present invention electromagnetic wave radiation shielding cover used for printed circuit board, described electromagnetic wave radiation shielding cover is combined by sandwich structure electromagnetic wave radiation shielding plate; Described sandwich structure electromagnetic wave radiation shielding plate bottom 3 is corrosion resistant plate, and surface layer 1 is foreign copper-nickel alloy plate, and centre is electromagnetic wave radiation shielding functional layer 2; Uniform pore openings on described corrosion resistant plate and described foreign copper-nickel alloy plate, the diameter in hole is 7.5mm; In the middle of described corrosion resistant plate and described foreign copper-nickel alloy plate, electromagnetic wave radiation shielding functional layer 3 is set, described electromagnetic wave radiation shielding functional layer 3 is prepared from by pure Single Walled Carbon Nanotube/two-component addition type room temperature vulcanized silicone rubber composite material, thickness is 3mm, the draw ratio of described pure Single Walled Carbon Nanotube is greater than 1000, and mass fraction is 5%; Described stainless steel is 0Cr18Ni9 stainless steel, and described foreign copper-nickel alloy is C7521 ocean copper-nickel alloy.
Known by said structure, electromagnetic wave radiation shielding cover tool used for printed circuit board of the present invention has the following advantages:
1, electromagnetic wave radiation shielding cover used for printed circuit board of the present invention adopts sandwich electromagnetic armouring structure, 0Cr18Ni9 stainless steel and C7521 ocean copper-nickel alloy are excellence conductor, perforate in the above can be dispelled the heat effectively, and printed circuit plate temperature is too high affects performance can to prevent electromagnetic radiation from can prevent again.
2, the electromagnetic wave radiation shielding functional layer that the pure Single Walled Carbon Nanotube/silicon rubber composite material being arranged on 0Cr18Ni9 corrosion resistant plate and copper-nickel alloy plate centre, C7521 ocean is prepared from can suppress electromagnetic radiation effectively, prevent external electromagnetic radiation to the interference of printed circuit board simultaneously, there is great practical value.
It is evident that, above description and record be only citing instead of in order to limit content disclosed by the invention, application or use.Although described in an embodiment and described embodiment with reference to the accompanying drawings, but the present invention do not limit by accompanying drawing example and describe in an embodiment as the optimal mode thought at present to implement the specific examples of instruction of the present invention, scope of the present invention will comprise any embodiment of specification and the appended claim fallen into above.
Claims (4)
1. an electromagnetic wave radiation shielding cover used for printed circuit board, described electromagnetic wave radiation shielding cover is combined by sandwich structure electromagnetic wave radiation shielding plate; It is characterized in that: described sandwich structure electromagnetic wave radiation shielding plate bottom is corrosion resistant plate, and surface layer is foreign copper-nickel alloy plate, and centre is electromagnetic wave radiation shielding functional layer; Uniform pore openings on described corrosion resistant plate and described foreign copper-nickel alloy plate, the diameter in hole is 5 ~ 10mm; In the middle of described corrosion resistant plate and described foreign copper-nickel alloy plate, electromagnetic wave radiation shielding functional layer is set, described electromagnetic wave radiation shielding functional layer is prepared from by pure Single Walled Carbon Nanotube/silicon rubber composite material, thickness is 2-4mm, the draw ratio of described pure Single Walled Carbon Nanotube is greater than 1000, and mass fraction is 3 ~ 7%.
2. electromagnetic wave radiation shielding cover used for printed circuit board as claimed in claim 1, is characterized in that: described stainless steel is 0Cr18Ni9 stainless steel, and described foreign copper-nickel alloy is C7521 ocean copper-nickel alloy.
3. electromagnetic wave radiation shielding cover used for printed circuit board as claimed in claim 1, is characterized in that: described silicon rubber is two-component addition type room temperature vulcanized silicone rubber.
4. electromagnetic wave radiation shielding cover used for printed circuit board as claimed in claim 1, is characterized in that: the thickness of described electromagnetic wave radiation shielding functional layer is 3mm, and the mass fraction of described pure Single Walled Carbon Nanotube is 5%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410699291.8A CN104363743A (en) | 2014-11-27 | 2014-11-27 | Electromagnetic wave radiation shield cover for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410699291.8A CN104363743A (en) | 2014-11-27 | 2014-11-27 | Electromagnetic wave radiation shield cover for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104363743A true CN104363743A (en) | 2015-02-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201410699291.8A Pending CN104363743A (en) | 2014-11-27 | 2014-11-27 | Electromagnetic wave radiation shield cover for printed circuit board |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104902733A (en) * | 2015-06-24 | 2015-09-09 | 郑建春 | PCB board shielding cover |
| CN106793730A (en) * | 2016-12-28 | 2017-05-31 | 深圳天珑无线科技有限公司 | A kind of mobile phone composite shielding lid and preparation method |
| CN107040147A (en) * | 2017-05-02 | 2017-08-11 | 中国核动力研究设计院 | A kind of rectifier cabinet shielding cabinet under high current dynamic operating condition |
| CN107148205A (en) * | 2017-05-09 | 2017-09-08 | 昆山湘北精密金属有限公司 | A kind of Mobile phone shielding case intelligence manufacture production method |
| CN114786453A (en) * | 2022-04-02 | 2022-07-22 | 昆明理工大学 | Mg-Li alloy/silicon steel plate electromagnetic shielding material and preparation method thereof |
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| CN1723748A (en) * | 2003-03-25 | 2006-01-18 | 信越聚合物株式会社 | Electromagnetic noise suppressor, article with electromagnetic noise suppression function, and their manufacturing methods |
| CN101626676A (en) * | 2008-07-10 | 2010-01-13 | 深圳富泰宏精密工业有限公司 | Soft shielding cover, use method thereof and electronic device using soft shielding |
| CN102461362A (en) * | 2009-05-28 | 2012-05-16 | 3M创新有限公司 | Electromagnetic shielding article |
| CN202979570U (en) * | 2012-11-26 | 2013-06-05 | 华为终端有限公司 | Shielding case and electronic product thereof |
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2014
- 2014-11-27 CN CN201410699291.8A patent/CN104363743A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1723748A (en) * | 2003-03-25 | 2006-01-18 | 信越聚合物株式会社 | Electromagnetic noise suppressor, article with electromagnetic noise suppression function, and their manufacturing methods |
| CN101626676A (en) * | 2008-07-10 | 2010-01-13 | 深圳富泰宏精密工业有限公司 | Soft shielding cover, use method thereof and electronic device using soft shielding |
| CN102461362A (en) * | 2009-05-28 | 2012-05-16 | 3M创新有限公司 | Electromagnetic shielding article |
| CN202979570U (en) * | 2012-11-26 | 2013-06-05 | 华为终端有限公司 | Shielding case and electronic product thereof |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104902733A (en) * | 2015-06-24 | 2015-09-09 | 郑建春 | PCB board shielding cover |
| CN106793730A (en) * | 2016-12-28 | 2017-05-31 | 深圳天珑无线科技有限公司 | A kind of mobile phone composite shielding lid and preparation method |
| CN107040147A (en) * | 2017-05-02 | 2017-08-11 | 中国核动力研究设计院 | A kind of rectifier cabinet shielding cabinet under high current dynamic operating condition |
| CN107148205A (en) * | 2017-05-09 | 2017-09-08 | 昆山湘北精密金属有限公司 | A kind of Mobile phone shielding case intelligence manufacture production method |
| CN107148205B (en) * | 2017-05-09 | 2023-09-15 | 昆山湘北精密金属有限公司 | Intelligent manufacturing and production method for mobile phone shielding case |
| CN114786453A (en) * | 2022-04-02 | 2022-07-22 | 昆明理工大学 | Mg-Li alloy/silicon steel plate electromagnetic shielding material and preparation method thereof |
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Application publication date: 20150218 |
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