CN107565236A - 电连接器 - Google Patents
电连接器 Download PDFInfo
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- CN107565236A CN107565236A CN201710678582.2A CN201710678582A CN107565236A CN 107565236 A CN107565236 A CN 107565236A CN 201710678582 A CN201710678582 A CN 201710678582A CN 107565236 A CN107565236 A CN 107565236A
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- flat part
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Abstract
本发明公开了一种电连接器,用以电性连接一芯片模块至一电路板,包括:一本体,用于向上承载芯片模块,其设有多个收容孔;多个端子,分别对应收容于收容孔,每一端子包括沿竖直方向的一平板部,及与平板部相连接的一连接部,自连接部的至少一端弯折延伸形成一弹性臂用于抵接芯片模块或者电路板,当芯片模块下压端子时,弹性臂的侧边抵接平板部。第一,可简化弹性臂的结构以降低其加工难度;第二,弹性臂与平板部之间的抵接力不是沿上下方向,故芯片模块对端子的压力不影响弹性臂与平板部之间的抵接,故可稳定形成两条并联的导电路径;第三,可以刮擦去除形成在弹性臂和平板部的氧化层,增强了弹性臂与平板部的抵接效果。
Description
技术领域
本发明涉及一种电连接器,尤其是指一种电性连接芯片模块至电路板的电连接器。
背景技术
专利号为CN200420026548.5的中国专利揭示了一种电连接器端子,用以电性连接一芯片模块和一电路板,该电连接器端子包括基部、自基部相对两侧延伸出的第一、第二弹性臂、于第一、第二弹性臂的末端分别凸设形成的第一、第二导接部及分别自第一、第二导接部相向弯折延伸的第一、第二短臂,第一、第二短臂相互正对设置,且彼此隔开,其自由端对称设有相互间隔一定距离的第一、第二接触部。
当芯片模块完全压下时,电连接器端子受挤压作用而发生弹性变形,其第一、第二导接部分别与芯片模块及电路板的导电片导接,第一、第二弹性臂及第一、第二短臂彼此相互靠近,第一、第二短臂的第一、 第二接触部相向移动并相互弹性抵压接触,从而在芯片模块与电路板之间形成依次经由芯片模块、第一导接部、第一弹性臂、基部、 第二弹性臂、第二导接部、电路板的第一导电通路、及依次经由芯片模块、第一导接部、第一短臂、第二短臂、第二导接部、电路板的缩短了的第二导电通路。该缩短了的第二导电通路与第一导电通路为并联设置,具有较小的自感应效应,并减小了芯片模块与电路板间电讯传输时的电阻抗,进而确保了芯片模块与电路板间良好的电性导接及电讯传输性能。
但是,由于第一短臂的板面抵压接触第二短臂的板面,因此第一、第二短臂需要自第一、第二导接部反向弯折较大角度,此种结构加工成型比较困难;并且由于第一、第二短臂弹性抵压接触时相互之间有上下方向的作用力,故需要施加较大的压力使芯片模块下压端子,如果压力不足则会造成第一、第二短臂接触不稳定,从而不能稳定地形成第二导电路径,使得芯片模块与电路板间电讯传输时仍存在较强的电阻抗。
因此,有必要设计一种新的电连接器,以克服上述问题。
发明内容
本发明的创作目的在于提供一种稳定提供两条并联导电路径,以减小芯片模块与电路板间电讯传输时的电阻抗的电连接器。
为了达到上述目的,本发明采用如下技术方案:
一种电连接器,用以电性连接一芯片模块至一电路板,其特征在于,包括:一本体,用于向上承载所述芯片模块,其设有多个收容孔;多个端子,分别对应收容于所述收容孔,每一所述端子包括沿竖直方向的一平板部,及与所述平板部相连接的一连接部,自所述连接部的至少一端弯折延伸形成一弹性臂用于抵接所述芯片模块或者电路板,当所述芯片模块下压所述端子时,所述弹性臂的侧边抵接所述平板部。
进一步,所述平板部自所述连接部一侧延伸形成,自所述连接部的相对另一侧延伸形成一限位部,所述收容孔的一侧面凸伸有一第一凸块位于所述限位部的下方以限制所述端子下移。
进一步,所述平板部、连接部与限位部位于同一竖直平面。
进一步,所述平板部具有一挡止部高于所述平板部与连接部的连接处,所述收容孔具有一挡止面位于挡止部的下方以限制所述端子下移,所述弹性臂抵接于所述平板部远离所述挡止部的一侧。
进一步,所述平板部具有一钩部低于所述平板部与连接部的连接处,所述收容孔的一侧面凸伸有一第二凸块位于钩部的上方以限制所述端子上移,所述弹性臂抵接于所述平板部远离所述钩部的一侧。
进一步,所述弹性臂的侧边凸设一抵接部,所述抵接部的侧边抵接所述平板部。
进一步,所述弹性臂有两个,定义为一第一弹性臂和一第二弹性臂,第一弹性臂自所述连接部的上端向上弯折延伸形成且用于抵接所述芯片模块,第二弹性臂自所述连接部的下端向下弯折延伸形成且用于抵接所述电路板,第一弹性臂的侧边凸设有所述抵接部,当所述芯片模块下压所述第一弹性臂时,所述第一弹性臂和所述第二弹性臂相抵接,且所述抵接部高于所述第一弹性臂与所述第二弹性臂的抵接位置。
进一步,第二弹性臂的侧边也凸设有所述抵接部,第二弹性臂的所述抵接部低于所述第一弹性臂与所述第二弹性臂的抵接位置。
进一步,所述连接部垂直于所述平板部,自所述连接部的相对两端各自弯折延伸形成所述弹性臂,两所述弹性臂位于所述平板部所在竖直平面的同一侧。
进一步,每一所述弹性臂自所述连接部的一端先朝远离所述连接部所在竖直平面的方向延伸再反向弯折延伸越过所述连接部所在竖直平面,且两所述弹性臂对称设置。
进一步,所述弹性臂具有一抵接部抵接所述平板部,通过所述弹性臂的宽度自所述抵接部至其自由端逐渐变小,使得所述弹性臂的侧边形成一导斜面以导引抵接部抵接所述平板部。
进一步,所述平板部包括一基部、自所述基部一侧延伸形成的一延伸部连接所述连接部、及自所述基部相对另一侧凸伸的一止位部,所述收容孔的一侧面凸伸有一第三凸块和一第四凸块对应位于止位部和延伸部的下方以限制所述端子下移。
进一步,所述基部底端的相对两侧形成两倒钩位于所述第三凸块和所述第四凸块的下方,所述第三凸块一侧和所述第四凸块一侧分别具有一倾斜面以导引所述倒钩。
进一步,所述延伸部的高度介于所述止位部的上缘和下缘之间。
进一步,所述弹性臂具有一抵接部,所述抵接部的侧边抵接于所述平板部的板面至其侧缘。
进一步,所述端子还包括一接合部,所述接合部和所述连接部自所述平板部的相对两侧分别弯折延伸形成,所述接合部和连接部位于所述平板部所在竖直平面的同一侧,自所述接合部的顶端向上弯折延伸形成一上臂,所述弹性臂自所述连接部的顶端向上弯折延伸形成且用于向上抵接所述芯片模块,当所述芯片模块下压所述弹性臂时,所述弹性臂与上臂相抵接。
进一步,所述弹性臂的自由端延伸越过所述接合部所在的竖直平面,所述弹性臂的自由端与上臂相抵接。
与现有技术相比,本发明电连接器具有以下有益效果:
当所述芯片模块下压所述端子时,所述弹性臂的侧边抵接所述平板部,可简化所述弹性臂的结构以降低其加工难度;并且所述弹性臂与所述平板部之间的抵接力不是沿上下方向,故所述芯片模块对端子的压力不影响所述弹性臂与所述平板部之间的抵接,故可稳定形成两条并联的导电路径,减小了所述芯片模块与电路板间电讯传输时的电阻抗;并且所述弹性臂的侧边抵接所述平板部,可以刮擦去除形成在所述弹性臂和所述平板部的氧化层,增强了所述弹性臂与所述平板部的抵接效果,从而保证了所述芯片模块与所述电路板之间的良好电性连接。
【附图说明】
图1为本发明第一实施例电连接器在芯片模块下压前的立体图;
图2为图1中的电连接器在竖直方向旋转180°后的立体图;
图3为图1的正视图;
图4为图3中的电连接器在芯片模块下压后的平面图;
图5为图4中a部分的放大图;
图6为图3中的端子在芯片模块下压前后的状态图;
图7为本发明第二实施例电连接器在芯片模块下压前的立体图;
图8为图7中的电连接器在竖直方向旋转180°后的立体图;
图9为图7的侧视图;
图10为图9中b部分的放大图;
图11为图7中的电连接器在芯片模块下压前沿另一角度的剖视图;
图12为图11中c部分的放大图;
图13为图11中的电连接器在芯片模块下压后的平面图;
图14为图13中d部分的放大图;
图15为本发明第三实施例电连接器的端子的立体图;
图16为图15中的电连接器在芯片模块下压后的剖视图;
图17为图16中e部分的放大图;
图18为本发明第四实施例电连接器的端子的立体图;
图19为本发明第五实施例电连接器的端子的立体图;
图20为本发明第六实施例电连接器在芯片模块下压前的立体图;
图21为图20中的电连接器在芯片模块下压后的立体图;
图22为图21的正视图。
具体实施方式的附图标号说明:
电连接器100 | 本体1 | 收容孔11 | 第一凸块111 |
第二凸块112 | 挡止面113 | 第三凸块114 | 第四凸块115 |
倾斜面116 | 端子2 | 平板部21 | 挡止部211 |
钩部212 | 基部213 | 延伸部214 | 止位部215 |
倒钩216 | 连接部22 | 第一弹性臂23A | 第二弹性臂23B |
第一抵接部231A | 第二抵接部231B | 第一导斜面232A | 第二导斜面232B |
限位部24 | 接合部25 | 上臂26 | 下臂27 |
芯片模块3 | 电路板4 |
【具体实施方式】
为便于更好的理解本发明的目的、结构、特征以及功效等,现结合附图和具体实施方式对本发明作进一步说明。
如图1至图6所示,为本发明第一实施例的电连接器100,用以电性连接一芯片模块3至一电路板4,其包括用于向上承载所述芯片模块3的一本体1,及收容于所述本体1的多个端子2。
如图1和图3所示,所述本体1设有多个收容孔11上下贯穿所述本体1,每一所述收容孔11的一侧面凸伸有一第一凸块111,每一所述收容孔11的相对另一侧面凸伸有一第二凸块112,且所述收容孔11还具有一挡止面113位于所述第二凸块112的正上方。
多个所述端子2,分别对应收容于所述收容孔11,每一所述端子2包括沿竖直方向的一平板部21,及与所述平板部21相连接的一连接部22。自所述连接部22一侧延伸形成所述平板部21,自所述连接部22的相对另一侧延伸形成一限位部24,所述平板部21、连接部22与限位部24位于同一竖直平面,所述第一凸块111位于所述限位部24的下方以限制所述端子2下移。
所述平板部21具有一挡止部211高于所述平板部21与连接部22的连接处,所述挡止面113位于所述挡止部211的下方以限制所述端子2下移。所述平板部21具有一钩部212低于所述平板部21与连接部22的连接处,所述第二凸块112位于所述钩部212的上方以限制所述端子2上移。所述平板部21顶端用以连接一料带,且低于所述收容孔11的顶面。
每一所述端子2还包括一第一弹性臂23A自所述连接部22的上端先朝远离所述连接部22所在竖直平面的方向延伸再反向弯折延伸越过所述连接部22所在竖直平面,用于抵接所述芯片模块3,以及一第二弹性臂23B自所述连接部22的下端先朝远离所述连接部22所在竖直平面的方向延伸再反向弯折延伸越过所述连接部22所在竖直平面,用于抵接所述电路板4。所述第二弹性臂23B与第一弹性臂23A对称设置(在其它实施例中,也可仅设有所述第一弹性臂23A,此时所述端子2焊接于所述电路板4)。
如图1、图4和图5所示,所述第一弹性臂23A的侧边凸设有一第一抵接部231A,且所述第一抵接部231A的侧边抵接于所述平板部21远离所述挡止部211的一侧。所述第二弹性臂23B的侧边凸设有一第二抵接部231B,且所述第二抵接部231B的侧边抵接于所述平板部21远离所述钩部212的一侧。
如图6所示,当所述芯片模块3下压所述第一弹性臂23A时,所述第一弹性臂23A和第二弹性臂23B相互靠近,所述第一抵接部231A和第二抵接部231B的侧边抵接所述平板部21的侧边(在其它实施例中,在芯片模块3下压前,所述第一抵接部231A和第二抵接部231B与所述平板部21也可保持接触),从而在芯片模块3与电路板4之间形成依次经由芯片模块3、第一弹性臂23A、连接部22、第二弹性臂23B、电路板4;以及依次经由芯片模块3、第一弹性臂23A、第一抵接部231A、平板部21、第二抵接部231B、第二弹性臂23B、电路板4的两条相互并联的导电路径,降低了讯号传输时的阻抗及自感效应,进而提供芯片模块3与电路板4之间良好的电性导接及讯号传输性能。
如图7至图14所示,为本发明第二实施例的电连接器100,与第一实施例的不同之处在于,本实施例中:
所述第一抵接部231A未凸于所述第一弹性臂23A的侧边,且通过所述第一弹性臂23A的宽度自所述第一抵接部231A至其自由端逐渐变小,使得所述第一弹性臂23A的侧边形成一第一导斜面232A以导引所述第一抵接部231A的侧边抵接所述平板部21的板面至其侧缘。
所述第二抵接部231B未凸于所述第二弹性臂23B的侧边,且通过所述第二弹性臂23B的宽度自所述第二抵接部231B至其自由端逐渐变小,使得所述第二弹性臂23B的侧边形成一第二导斜面232B以导引所述第二抵接部231B的侧边抵接所述平板部21的板面至其侧缘。
所述连接部22垂直于所述平板部21,所述第一弹性臂23A和第二弹性臂23B位于所述平板部21所在竖直平面的同一侧。
所述平板部21包括一基部213、自所述基部213一侧延伸形成的一延伸部214连接所述连接部22、及自所述基部213相对另一侧凸伸的一止位部215,所述收容孔11的一侧面凸伸有一第三凸块114和一第四凸块115对应位于止位部215和延伸部214的下方以限制所述端子2下移,所述延伸部214的高度介于所述止位部215的上缘和下缘之间。
所述基部213底端的相对两侧形成两倒钩216位于所述第三凸块114和所述第四凸块115的下方,所述第三凸块114一侧和所述第四凸块115一侧分别具有一倾斜面116以导引所述倒钩216。
如图15至图17所示,为本发明第三实施例的电连接器100,与第二实施例的不同之处在于,本实施例中:
所述第一弹性臂23A的侧边凸设有所述第一抵接部231A,且所述第二弹性臂23B的侧边凸设有所述第二抵接部231B。
当所述芯片模块3下压所述第一弹性臂23A时,所述第一弹性臂23A的自由端抵接所述第二弹性臂23B的板面,所述第一抵接部231A高于所述第一弹性臂23A与所述第二弹性臂23B的抵接位置,且所述第二抵接部231B低于所述第一弹性臂23A与所述第二弹性臂23B的抵接位置,从而在芯片模块3与电路板4之间形成依次经由芯片模块3、第一弹性臂23A、第二弹性臂23B、电路板4的第三条并联的的导电路径,可进一步降低了讯号传输时的阻抗及自感效应。
如图18所示,为本发明第四实施例的电连接器100,与第三实施例的不同之处在于,本实施例中,所述第二弹性臂23B不设有所述第二抵接部231B。
如图19所示,为本发明第五实施例的电连接器100,与第三实施例的不同之处在于,本实施例中,所述第一弹性臂23A不设有所述第一抵接部231A。
如图20至图22所示,为本发明第六实施例的电连接器100,与第一实施例的不同之处在于,本实施例中:
所述连接部22垂直于所述平板部21,所述第一抵接部231A和第二抵接部231B的侧边抵接所述平板部21的板面。
所述端子2还包括一接合部25,所述接合部25和所述连接部22自所述平板部21的相对两侧分别弯折延伸形成,所述接合部25和连接部22位于所述平板部21所在竖直平面的同一侧。
自所述接合部25的顶端向上弯折延伸形成一上臂26,自所述接合部25的底端向下弯折延伸形成一下臂27,所述上臂26与下臂27对称设置,且所述第一弹性臂23A和第二弹性臂23B的自由端延伸越过所述接合部25所在的竖直平面。
当所述芯片模块3下压所述第一弹性臂23A时,所述第一弹性臂23A的自由端与上臂26相抵接,所述第二弹性臂23B的自由端与下臂27相抵接,从而在芯片模块3与电路板4之间形成依次经由芯片模块3、第一弹性臂23A、上臂26、接合部25、下臂27、第二弹性臂23B、电路板4的第三条并联的的导电路径,可进一步降低了讯号传输时的阻抗及自感效应。
综上所述,本发明电连接器有下列有益效果:
(1)当所述芯片模块3下压所述端子2时,所述第一弹性臂23A和第二弹性臂23B的侧边抵接所述平板部21,可简化所述第一弹性臂23A和第二弹性臂23B的结构以降低其加工难度;并且所述第一弹性臂23A和第二弹性臂23B与所述平板部21之间的抵接力不是沿上下方向,故所述芯片模块3对端子2的压力不影响所述第一弹性臂23A和第二弹性臂23B与所述平板部21之间的抵接,故可稳定形成依次经由芯片模块3、第一弹性臂23A、连接部22、第二弹性臂23B、电路板4;以及依次经由芯片模块3、第一弹性臂23A、第一抵接部231A、平板部21、第二抵接部231B、第二弹性臂23B、电路板4的两条并联的导电路径,减小了所述芯片模块3与电路板4间电讯传输时的电阻抗;并且所述第一弹性臂23A和第二弹性臂23B的侧边抵接所述平板部21,可以刮擦去除形成在所述第一弹性臂23A、所述第二弹性臂23B和所述平板部21的氧化层,增强了所述第一弹性臂23A和第二弹性臂23B与所述平板部21的抵接效果,从而保证了所述芯片模块3与所述电路板4之间的良好电性连接。
(2)当所述芯片模块3下压所述第一弹性臂23A时,所述第一弹性臂23A的自由端抵接所述第二弹性臂23B的板面,从而在芯片模块3与电路板4之间形成依次经由芯片模块3、第一弹性臂23A、第二弹性臂23B、电路板4的第三条并联的导电路径,可进一步降低了讯号传输时的阻抗及自感效应。
(3)当所述芯片模块3下压所述第一弹性臂23A时,所述第一弹性臂23A的自由端与上臂26相抵接,所述第二弹性臂23B的自由端与下臂27相抵接,保证了所述第一臂与上臂26、所述第二臂与下臂27彼此之间的稳定接触,同时增强了所述端子2对于所述芯片模块3的支撑作用,并且在芯片模块3与电路板4之间形成依次经由芯片模块3、第一弹性臂23A、上臂26、接合部25、下臂27、第二弹性臂23B、电路板4的第三条并联的的导电路径,可进一步降低了讯号传输时的阻抗及自感效应。
以上详细说明仅为本发明之较佳实施例的说明,非因此局限本发明之专利范围,所以,凡运用本创作说明书及图示内容所为之等效技术变化,均包含于本创作之专利范围内。
Claims (17)
1.一种电连接器,用以电性连接一芯片模块至一电路板,其特征在于,包括:
一本体,用于向上承载所述芯片模块,其设有多个收容孔;
多个端子,分别对应收容于所述收容孔,每一所述端子包括沿竖直方向的一平板部,及与所述平板部相连接的一连接部,自所述连接部的至少一端弯折延伸形成一弹性臂用于抵接所述芯片模块或者电路板,当所述芯片模块下压所述端子时,所述弹性臂的侧边抵接所述平板部。
2.如权利要求1所述的电连接器,其特征在于:所述平板部自所述连接部一侧延伸形成,自所述连接部的相对另一侧延伸形成一限位部,所述收容孔的一侧面凸伸有一第一凸块位于所述限位部的下方以限制所述端子下移。
3.如权利要求2所述的电连接器,其特征在于:所述平板部、连接部与限位部位于同一竖直平面。
4.如权利要求1所述的电连接器,其特征在于:所述平板部具有一挡止部高于所述平板部与连接部的连接处,所述收容孔具有一挡止面位于挡止部的下方以限制所述端子下移,所述弹性臂抵接于所述平板部远离所述挡止部的一侧。
5.如权利要求1所述的电连接器,其特征在于:所述平板部具有一钩部低于所述平板部与连接部的连接处,所述收容孔的一侧面凸伸有一第二凸块位于钩部的上方以限制所述端子上移,所述弹性臂抵接于所述平板部远离所述钩部的一侧。
6.如权利要求1所述的电连接器,其特征在于:所述弹性臂的侧边凸设一抵接部,所述抵接部的侧边抵接所述平板部。
7.如权利要求6所述的电连接器,其特征在于:所述弹性臂有两个,定义为一第一弹性臂和一第二弹性臂,第一弹性臂自所述连接部的上端向上弯折延伸形成且用于抵接所述芯片模块,第二弹性臂自所述连接部的下端向下弯折延伸形成且用于抵接所述电路板,第一弹性臂的侧边凸设有所述抵接部,当所述芯片模块下压所述第一弹性臂时,所述第一弹性臂和所述第二弹性臂相抵接,且所述抵接部高于所述第一弹性臂与所述第二弹性臂的抵接位置。
8.如权利要求7所述的电连接器,其特征在于:第二弹性臂的侧边也凸设有所述抵接部,第二弹性臂的所述抵接部低于所述第一弹性臂与所述第二弹性臂的抵接位置。
9.如权利要求1所述的电连接器,其特征在于:所述连接部垂直于所述平板部,自所述连接部的相对两端各自弯折延伸形成所述弹性臂,两所述弹性臂位于所述平板部所在竖直平面的同一侧。
10.如权利要求9所述的电连接器,其特征在于:每一所述弹性臂自所述连接部的一端先朝远离所述连接部所在竖直平面的方向延伸再反向弯折延伸越过所述连接部所在竖直平面,且两所述弹性臂对称设置。
11.如权利要求1所述的电连接器,其特征在于:所述弹性臂具有一抵接部抵接所述平板部,通过所述弹性臂的宽度自所述抵接部至其自由端逐渐变小,使得所述弹性臂的侧边形成一导斜面以导引抵接部抵接所述平板部。
12.如权利要求1所述的电连接器,其特征在于:所述平板部包括一基部、自所述基部一侧延伸形成的一延伸部连接所述连接部、及自所述基部相对另一侧凸伸的一止位部,所述收容孔的一侧面凸伸有一第三凸块和一第四凸块对应位于止位部和延伸部的下方以限制所述端子下移。
13.如权利要求12所述的电连接器,其特征在于:所述基部底端的相对两侧形成两倒钩位于所述第三凸块和所述第四凸块的下方,所述第三凸块一侧和所述第四凸块一侧分别具有一倾斜面以导引所述倒钩。
14.如权利要求12所述的电连接器,其特征在于:所述延伸部的高度介于所述止位部的上缘和下缘之间。
15.如权利要求1所述的电连接器,其特征在于:所述弹性臂具有一抵接部,所述抵接部的侧边抵接于所述平板部的板面至其侧缘。
16.如权利要求1所述的电连接器,其特征在于:所述端子还包括一接合部,所述接合部和所述连接部自所述平板部的相对两侧分别弯折延伸形成,所述接合部和连接部位于所述平板部所在竖直平面的同一侧,自所述接合部的顶端向上弯折延伸形成一上臂,所述弹性臂自所述连接部的顶端向上弯折延伸形成且用于向上抵接所述芯片模块,当所述芯片模块下压所述弹性臂时,所述弹性臂与上臂相抵接。
17.如权利要求16所述的电连接器,其特征在于:所述弹性臂的自由端延伸越过所述接合部所在的竖直平面,所述弹性臂的自由端与上臂相抵接。
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Also Published As
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CN108110455A (zh) | 2018-06-01 |
US10199756B2 (en) | 2019-02-05 |
CN108110455B (zh) | 2020-08-28 |
CN107611645A (zh) | 2018-01-19 |
CN107946805A (zh) | 2018-04-20 |
CN107565236B (zh) | 2019-10-01 |
CN108092023B (zh) | 2020-08-28 |
CN107492728A (zh) | 2017-12-19 |
CN107968272B (zh) | 2019-08-30 |
CN108092023A (zh) | 2018-05-29 |
US20180198226A1 (en) | 2018-07-12 |
US20180198223A1 (en) | 2018-07-12 |
CN107968272A (zh) | 2018-04-27 |
CN107799934A (zh) | 2018-03-13 |
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