CN107119274A - The electroplating technology and its equipment of a kind of ni-based foam silver - Google Patents
The electroplating technology and its equipment of a kind of ni-based foam silver Download PDFInfo
- Publication number
- CN107119274A CN107119274A CN201710307407.2A CN201710307407A CN107119274A CN 107119274 A CN107119274 A CN 107119274A CN 201710307407 A CN201710307407 A CN 201710307407A CN 107119274 A CN107119274 A CN 107119274A
- Authority
- CN
- China
- Prior art keywords
- silver
- electroplating
- cell body
- foam
- hanger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The electroplating technology and its equipment of a kind of ni-based foam silver, belong to Foam silver electroplating technology field.Electroplating device includes cell body, anode baffle, anode basket, hanger and filter, electroplating technology carries out metalized for processing foam, foam after metallization is put into electroplating device by hanger and goes to be electroplated, staged current control is used in electroplating process, the foam after plating carries out last heat treatment step and completes product.The technology process flow is simple, changes silver-based into technique Ni-based, greatly saves the cost of production；The bad problem of nickel based conductive is directed in the technique, by improving rack design, needle-like conductive is changed into from common contact conduction, the uniformity of conduction is significantly increased.Processing is controlled using ladder electroplating parameter in the technique of the present invention, plating leakage and uneven coating problem as caused by nickel based conductive is bad is resolved.Production efficiency is improved, the qualification rate of product is added.
Description
Technical field
The invention belongs to Foam silver electroplating technology field, and in particular to a kind of ni-based foam silver electroplating technology and its set
It is standby.
Background technology
Plating is exactly the process for plating the other metal or alloy of a thin layer on some metal surfaces using electrolysis principle, is
Make the technique of the surface attachment layer of metal film of metal or other materials product using electrolysis prevents metal oxygen so as to play
Change（Such as corrosion）, improve wearability, electric conductivity, reflective, corrosion resistance (copper sulphate etc.）And the effect such as having improved aesthetic appearance.Common plating
Silver is by the way of silver-based is as metallization, but cost is very high, and the plating bad permeability of silver, using Ni-based, can drop significantly
The inexpensive but conductive decline problem of meeting, it may appear that the significant deficiency such as plating leakage, coating layering, coating skewness.
The content of the invention
The object of the invention provides the electroplating technology and its equipment of a kind of ni-based foam silver, is used as by the technique using Ni-based
Metallize raw material, saves the cost of raw material.The deficiency solved the above problems by using the equipment and electroplating parameter in technique.
The present invention is achieved in the following ways a kind of electroplating device of ni-based foam silver, and anode basket is affiliated in cell body
On inwall, anode basket is improved between anode basket and negative electrode built with ping-pong ball provided with anode baffle with blocking anode edge effect
The inwall connection of coating distributing homogeneity, the then edge of anode baffle and cell body, the side wall of described cell body is provided with filtering
Bag, filter bag is connected by outlet conduit with filter, and the inlet duct of filter is located at cell body bottom, and hanger is located at cell body
It is internal and be suspended on the cathode rod outside cell body, screen pack is provided between anode basket and encapsulated copper bar；Described hanger it is main by
Encapsulated copper bar, conductive pin, negative electrode hook and resin frame composition.The hole of described screen pack is 5um.Described anode baffle is adopted
Use PVC material.
Copper bar is to be welded conductive pin on matts shaped frame, copper bar, and except being sealed on conductive pin outer copper line
Glue processing.Resin plate is connected with copper bar in buckle-type.
A kind of electroplating technology of ni-based foam silver, technological process：First choice uses nickel target as metallization raw material, and to bubble
Cotton carries out PVD metallization process；Secondly by after metallization foam tiling pressing installed in hanger conductive pin on, resin plate with
Conductive pin is engaged and resin plate and hanger is snap connection；Then hanger is suspended on cathode rod and is positioned in cell body
Portion, the distance between hanger and anode basket place a diameter of 20mm ping-pong ball between 120-150mm, in anode basket, carry out silver
Electroplating processes；Plating control is using grading current processing in silver-colored electroplating process is carried out, and initial stage is 10-12ASD, and the time is 2 points
Clock, until uniformly upper plating is finished, second stage is 4-5ASD, until the surface density that achieves the goal；Finally will the uniform silver bubble of plating
Cotton is heat-treated, and heat treatment reduction temperature control is at 750-800 DEG C.
Beneficial effects of the present invention are that the technology process flow is simple, change silver-based into technique Ni-based, are greatly saved
The cost of production；The bad problem of nickel based conductive is directed in the technique, it is conductive by common contact by improving rack design
It is changed into needle-like conductive, significantly increases the uniformity of conduction.Processing is controlled using ladder electroplating parameter in the technique of the present invention,
It is resolved plating leakage and uneven coating problem as caused by nickel based conductive is bad.Production efficiency is improved, production is added
The qualification rate of product.
Brief description of the drawings
Fig. 1 is overall structure diagram；
Fig. 2 is hanger front view；
Fig. 3 is hanger side view；
As described in Fig. 1 to Fig. 3, filter bag（1）, cell body（2）, anode baffle（3）, ping-pong ball（4）, anode basket（5）, screen pack（6）,
Outlet conduit（7）, filter（8）, inlet duct（9）, encapsulated copper bar（10）, conductive pin（11）, negative electrode hook（12）, resin frame
（13）.
Embodiment
The electroplating technology and its equipment of a kind of ni-based foam silver, anode basket（5）It is affiliated in cell body（2）Inwall on, anode
Basket（5）It is interior to be provided with ping-pong ball（4）, in anode basket（5）With cell body（2）Between be provided with anode baffle（3）, then anode baffle（3）Side
Edge and cell body（2）Inwall connection, described cell body（2）Side wall be provided with filter bag（1）, filter bag（1）Pass through outlet
Pipeline（7）With filter（8）Connection, filter（8）Inlet duct（9）Positioned at cell body（2）Bottom, hanger is located at cell body（2）
Inside and be suspended on cell body（2）On outer cathode rod, anode basket（5）With encapsulated copper bar（10）Between be provided with screen pack（6）；Institute
The hanger stated is main by encapsulated copper bar（10）, conductive pin（11）, negative electrode hook（12）And resin frame（13）Composition.Described filtering
Net（6）Hole be 5um.Described anode baffle（3）Using PVC material.Copper bar is to be welded on matts shaped frame, copper bar
Conductive pin, and except carrying out handling in sealing on conductive pin outer copper line.Resin plate（13）With encapsulated copper bar（10）In buckle
Formula is connected.
A kind of electroplating technology of ni-based foam silver, technological process：First choice uses nickel target as metallization raw material, and to bubble
Cotton carries out PVD metallization process；Secondly by after metallization foam tiling pressing installed in hanger conductive pin on, resin plate with
Conductive pin is engaged and resin plate and hanger is snap connection；Then hanger is suspended on cathode rod and is positioned in cell body
Portion, the distance between hanger and anode basket place a diameter of 20mm ping-pong ball between 120-150mm, in anode basket, carry out silver
Electroplating processes；Plating control is using grading current processing in silver-colored electroplating process is carried out, and initial stage is 10-12ASD, and the time is 2 points
Clock, second stage is 4-5ASD, until uniformly upper plating is finished；Finally the uniform silver-colored foam of plating is heat-treated, is heat-treated
Reduction temperature is controlled at 750-800 DEG C.
Claims (4)
1. a kind of electroplating device of ni-based foam silver, it is characterised in that anode basket（5）It is affiliated in cell body（2）Inwall on, anode
Basket（5）It is interior to be provided with ping-pong ball（4）, in anode basket（5）With cell body（2）Between be provided with anode baffle（3）, then anode baffle（3）Side
Edge and cell body（2）Inwall connection, described cell body（2）Side wall be provided with filter bag（1）, filter bag（1）Pass through outlet
Pipeline（7）With filter（8）Connection, filter（8）Inlet duct（9）Positioned at cell body（2）Bottom, hanger is located at cell body（2）
Inside and be suspended on cell body（2）On outer cathode rod, anode basket（5）Screen pack is provided between hanger（6）；Described hanger
Mainly by encapsulated copper bar（10）, conductive pin（11）, negative electrode hook（12）And resin frame（13）Composition.
2. a kind of electroplating device of ni-based foam silver according to claim 1, it is characterised in that described screen pack（6）
Hole be 5um.
3. a kind of electroplating device of ni-based foam silver according to claim 1, it is characterised in that described anode baffle
（3）Using PVC material.
4. a kind of electroplating technology of ni-based foam silver, it is characterised in that technological process：
A, first choice carry out PVD metallization process using nickel target as metallization raw material, and to foam；
B, the conductive pin that secondly the foam tiling pressing after metallization is arranged on to hanger（11）On, resin plate（13）With conductive pin
（11）It is engaged and resin plate（13）With encapsulated copper bar（10）To snap connection；
C, then hanger is suspended on cathode rod and cell body is positioned over（2）Inside, hanger and anode basket（5）The distance between
Between 120-150mm, anode basket（5）The middle ping-pong ball for placing a diameter of 20mm（4）, carry out silver-colored electroplating processes；
D, plating control is using grading current processing in silver-colored electroplating process is carried out, and initial stage is 10-12ASD, and the time is 2 minutes,
Until uniformly upper plating is finished, second stage is 4-5ASD, until reaching target areal density；
E, finally the uniform silver-colored foam of plating is heat-treated, heat treatment reduction temperature is controlled at 750-800 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710307407.2A CN107119274B (en) | 2017-05-04 | 2017-05-04 | A kind of electroplating technology of ni-based foam silver |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710307407.2A CN107119274B (en) | 2017-05-04 | 2017-05-04 | A kind of electroplating technology of ni-based foam silver |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107119274A true CN107119274A (en) | 2017-09-01 |
| CN107119274B CN107119274B (en) | 2019-03-05 |
Family
ID=59727610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710307407.2A Active CN107119274B (en) | 2017-05-04 | 2017-05-04 | A kind of electroplating technology of ni-based foam silver |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107119274B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111663161A (en) * | 2020-07-16 | 2020-09-15 | 合肥微睿光电科技有限公司 | Large-size upper electrode plate hanger for anodic oxidation |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202011914U (en) * | 2010-12-31 | 2011-10-19 | 平高集团有限公司 | Plating bath for performing silver-graphite composite plating and plating equipment |
| CN204265876U (en) * | 2014-12-05 | 2015-04-15 | 重庆耀勇减震器有限公司 | Front shock absorber of automobile electroplating connecting rods hanger |
| CN204849063U (en) * | 2015-07-03 | 2015-12-09 | 爱蓝天高新技术材料(大连)有限公司 | But positive pole baffle of automatically regulated position |
| CN204874790U (en) * | 2015-07-30 | 2015-12-16 | 爱蓝天高新技术材料(大连)有限公司 | Novel foam nickel electroplating groove |
| CN105401205A (en) * | 2015-11-26 | 2016-03-16 | 有研粉末新材料（北京）有限公司 | Foamed nickel and foamed nickel-based alloy plating device |
| CN105887174A (en) * | 2016-06-07 | 2016-08-24 | 共青城超群科技协同创新股份有限公司 | Electroplating equipment for improving electroplating uniformity |
| CN106319584A (en) * | 2016-10-11 | 2017-01-11 | 爱蓝天高新技术材料(大连)有限公司 | Machining technology of ultrahigh-surface-density foam nickel |
| CN206089848U (en) * | 2016-10-11 | 2017-04-12 | 爱蓝天高新技术材料(大连)有限公司 | Convenient and fast's earth of positive pole processing apparatus |
-
2017
- 2017-05-04 CN CN201710307407.2A patent/CN107119274B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202011914U (en) * | 2010-12-31 | 2011-10-19 | 平高集团有限公司 | Plating bath for performing silver-graphite composite plating and plating equipment |
| CN204265876U (en) * | 2014-12-05 | 2015-04-15 | 重庆耀勇减震器有限公司 | Front shock absorber of automobile electroplating connecting rods hanger |
| CN204849063U (en) * | 2015-07-03 | 2015-12-09 | 爱蓝天高新技术材料(大连)有限公司 | But positive pole baffle of automatically regulated position |
| CN204874790U (en) * | 2015-07-30 | 2015-12-16 | 爱蓝天高新技术材料(大连)有限公司 | Novel foam nickel electroplating groove |
| CN105401205A (en) * | 2015-11-26 | 2016-03-16 | 有研粉末新材料（北京）有限公司 | Foamed nickel and foamed nickel-based alloy plating device |
| CN105887174A (en) * | 2016-06-07 | 2016-08-24 | 共青城超群科技协同创新股份有限公司 | Electroplating equipment for improving electroplating uniformity |
| CN106319584A (en) * | 2016-10-11 | 2017-01-11 | 爱蓝天高新技术材料(大连)有限公司 | Machining technology of ultrahigh-surface-density foam nickel |
| CN206089848U (en) * | 2016-10-11 | 2017-04-12 | 爱蓝天高新技术材料(大连)有限公司 | Convenient and fast's earth of positive pole processing apparatus |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111663161A (en) * | 2020-07-16 | 2020-09-15 | 合肥微睿光电科技有限公司 | Large-size upper electrode plate hanger for anodic oxidation |
| CN111663161B (en) * | 2020-07-16 | 2024-03-12 | 合肥微睿科技股份有限公司 | Hanger for anodic oxidation of large-size upper electrode plate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107119274B (en) | 2019-03-05 |
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