CN107119274B - A kind of electroplating technology of ni-based foam silver - Google Patents
A kind of electroplating technology of ni-based foam silver Download PDFInfo
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- CN107119274B CN107119274B CN201710307407.2A CN201710307407A CN107119274B CN 107119274 B CN107119274 B CN 107119274B CN 201710307407 A CN201710307407 A CN 201710307407A CN 107119274 B CN107119274 B CN 107119274B
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- Prior art keywords
- foam
- electroplating
- silver
- hanger
- plating
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
A kind of electroplating technology of ni-based foam silver, belongs to Foam silver electroplating technology.Electroplating device includes groove body, anode baffle, anode basket, hanger and filter, electroplating technology is that processing foam carries out metalized, foam after metallization is put by hanger and goes to be electroplated in electroplating device, staged current control is used in electroplating process, the foam after plating carries out last heat treatment procedure and completes product.The technology process process is simple, changes silver-based into technique Ni-based, greatly saves the cost of production;It is directed to the bad problem of nickel based conductive in the technique, by improving rack design, needle-like conductive is become from common contact conduction, significantly increases conductive uniformity.Using the control processing of ladder electroplating parameter in technique of the invention, make as nickel based conductive it is bad caused by plating leakage and uneven coating problem be resolved.Production efficiency is improved, the qualification rate of product is increased.
Description
Technical field
The invention belongs to Foam silver electroplating technologies, and in particular to a kind of electroplating technology of ni-based foam silver.
Background technique
Plating is exactly to plate the process of the other metal or alloy of a thin layer on certain metal surfaces using electrolysis principle, is
The technique of the surface of metal or other materials product attachment layer of metal film is set to prevent metal oxygen to play using electrolysis
The effects of changing (as corroded), improving wearability, electric conductivity, reflective, corrosion resistance (copper sulphate etc.) and having improved aesthetic appearance.Common plating
Silver using silver-based as metallization by the way of, but cost is very high, and silver-colored plating bad permeability, using Ni-based, can drop significantly
The inexpensive but conductive decline problem of meeting, it may appear that the significant deficiencies such as plating leakage, coating are layered, coating is unevenly distributed.
Summary of the invention
The object of the invention provides a kind of electroplating technology of ni-based foam silver, by the technique using Ni-based former as metallization
Material saves the cost of raw material.By using the equipment and the deficiency that solves the above problems of electroplating parameter in technique.
The present invention is achieved in the following ways a kind of electroplating technology of ni-based foam silver, process flow: first choice uses
Nickel target carries out PVD metallization process as metallization raw material, and to foam;Secondly by the foam tiling pressing peace after metallization
On the conductive pin of hanger, resin plate is matched with conductive pin and resin plate and hanger are to snap connection;Then hanger is hanged
It hangs on cathode rod and is placed in inside groove body, the distance between hanger and anode basket are put in anode basket between 120-150mm
The ping-pong ball that diameter is 20mm is set, silver-colored electroplating processes are carried out;Plating control is processed using grading current in carrying out silver-colored electroplating process,
Initial stage is 10-12ASD, and the time is 2 minutes, until uniformly upper plating finishes, second stage 4-5ASD, until face of achieving the goal is close
Degree;Finally the uniform silver-colored foam of plating is heat-treated, heat treatment reduction temperature control is at 750-800 DEG C.
The equipment for implementing the electroplating technology of ni-based foam silver is that anode basket is affiliated on the inner wall of groove body, and anode basket is provided with
Ping-pong ball, being equipped with anode baffle between anode basket and cathode improves coating distributing homogeneity to block anode edge effect, then positive
The edge of pole baffle and the inner wall of groove body connect, and the one side wall of the groove body is equipped with filter bag, and filter bag passes through outlet
Road is connected to filter, and the inlet duct of filter is located at groove body bottom, and hanger is located at the inside of groove body and is suspended on outside groove body
Cathode rod on, between anode basket and encapsulated copper bar be equipped with filter screen;The hanger is mainly by encapsulated copper bar, conductive pin, yin
Pole hook and resin frame composition.The hole of the filter screen is 5um.The anode baffle uses PVC material.
Copper bar is matts shaped frame, is welded conductive pin on copper bar, and in addition to being sealed on conductive pin outer copper line
Glue processing.Resin plate is connect with copper bar in buckle-type.
Beneficial effects of the present invention are that the technology process process is simple, change silver-based into technique Ni-based, are greatly saved
The cost of production;The bad problem of nickel based conductive is directed in the technique, it is conductive by common contact by improving rack design
Become needle-like conductive, significantly increases conductive uniformity.It is processed in technique of the invention using the control of ladder electroplating parameter,
Make as nickel based conductive it is bad caused by plating leakage and uneven coating problem be resolved.Production efficiency is improved, production is increased
The qualification rate of product.
Detailed description of the invention
Fig. 1 is overall structure diagram;
Fig. 2 is hanger front view;
Fig. 3 is hanger side view;
As described in Fig. 1 to Fig. 3, filter bag (1), groove body (2), anode baffle (3), ping-pong ball (4), anode basket (5), filter screen
(6), outlet conduit (7), filter (8), inlet duct (9), encapsulated copper bar (10), conductive pin (11), cathode link up with (12), tree
Rouge frame (13).
Specific embodiment
A kind of electroplating technology of ni-based foam silver, process flow: first choice is used as metallization raw material using nickel target, and to bubble
Cotton carries out PVD metallization process;Secondly by after metallization foam tiling pressing be mounted on the conductive pin of hanger, resin plate with
Conductive pin matches and resin plate and hanger are to snap connection;Then hanger is suspended on cathode rod and is placed in groove body
Portion, the distance between hanger and anode basket place the ping-pong ball that diameter is 20mm between 120-150mm, in anode basket, carry out silver
Electroplating processes;Plating control is processed using grading current in carrying out silver-colored electroplating process, initial stage 10-12ASD, and the time is 2 points
Clock, second stage 4-5ASD, until uniformly upper plating finishes;Finally the uniform silver-colored foam of plating is heat-treated, is heat-treated
Reduction temperature is controlled at 750-800 DEG C.
The equipment of electroplating technology for implementing ni-based foam silver is that anode basket (5) are affiliated to inner wall in groove body (2), sun
Ping-pong ball (4) are equipped in pole basket (5), between anode basket (5) and groove body (2) equipped with anode baffle (3), then anode baffle (3)
Edge is connect with the inner wall of groove body (2), and the one side wall of the groove body (2) is equipped with filter bag (1), and filter bag (1) is by going out
Mouth pipeline (7) is connected to filter (8), and the inlet duct (9) of filter (8) is located at groove body (2) bottom, and hanger is located at groove body
(2) it inside and is suspended on the cathode rod of groove body (2) outside, filter screen is equipped between anode basket (5) and encapsulated copper bar (10)
(6);The hanger is mainly made of encapsulated copper bar (10), conductive pin (11), cathode hook (12) and resin frame (13).It is described
Filter screen (6) hole be 5um.The anode baffle (3) uses PVC material.Copper bar is matts shaped frame, copper bar
On be welded conductive pin, and in addition to carrying out handling in sealing on conductive pin outer copper line.Resin plate (13) and encapsulated copper bar (10)
It is connected in buckle-type.
Claims (1)
1. a kind of electroplating technology of ni-based foam silver, which is characterized in that process flow:
A, preferred that PVD metallization process is carried out as metallization raw material, and to foam using nickel target;
B, secondly the foam tiling pressing after metallization is mounted on the conductive pin (11) of hanger, resin plate (13) and conductive pin
(11) it matches and resin plate (13) and encapsulated copper bar (10) is to snap connection;
C, hanger is then suspended on cathode rod to and is placed in groove body (2) inside, the distance between hanger and anode basket (5) exist
The ping-pong ball (4) that diameter is 20mm is placed between 120-150mm, in anode basket (5), carries out silver-colored electroplating processes;
D, plating control is processed using grading current in carrying out silver-colored electroplating process, initial stage 10-12ASD, and the time is 2 minutes,
Until uniformly upper plating finishes, second stage 4-5ASD, until reaching target areal density;
E, finally the uniform silver-colored foam of plating is heat-treated, heat treatment reduction temperature control is at 750-800 DEG C.
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CN201710307407.2A CN107119274B (en) | 2017-05-04 | 2017-05-04 | A kind of electroplating technology of ni-based foam silver |
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CN201710307407.2A CN107119274B (en) | 2017-05-04 | 2017-05-04 | A kind of electroplating technology of ni-based foam silver |
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CN107119274B true CN107119274B (en) | 2019-03-05 |
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Families Citing this family (2)
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CN111663161B (en) * | 2020-07-16 | 2024-03-12 | 合肥微睿科技股份有限公司 | Hanger for anodic oxidation of large-size upper electrode plate |
CN115522251A (en) * | 2022-09-28 | 2022-12-27 | 陕西飞机工业有限责任公司 | Efficient flexible production equipment and method for automatic electroplating production line |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202011914U (en) * | 2010-12-31 | 2011-10-19 | 平高集团有限公司 | Plating bath for performing silver-graphite composite plating and plating equipment |
CN204265876U (en) * | 2014-12-05 | 2015-04-15 | 重庆耀勇减震器有限公司 | Front shock absorber of automobile electroplating connecting rods hanger |
CN204849063U (en) * | 2015-07-03 | 2015-12-09 | 爱蓝天高新技术材料(大连)有限公司 | But positive pole baffle of automatically regulated position |
CN204874790U (en) * | 2015-07-30 | 2015-12-16 | 爱蓝天高新技术材料(大连)有限公司 | Novel foam nickel electroplating groove |
CN105401205A (en) * | 2015-11-26 | 2016-03-16 | 有研粉末新材料(北京)有限公司 | Foamed nickel and foamed nickel-based alloy plating device |
CN105887174A (en) * | 2016-06-07 | 2016-08-24 | 共青城超群科技协同创新股份有限公司 | Electroplating equipment for improving electroplating uniformity |
CN106319584A (en) * | 2016-10-11 | 2017-01-11 | 爱蓝天高新技术材料(大连)有限公司 | Machining technology of ultrahigh-surface-density foam nickel |
CN206089848U (en) * | 2016-10-11 | 2017-04-12 | 爱蓝天高新技术材料(大连)有限公司 | Convenient and fast's earth of positive pole processing apparatus |
-
2017
- 2017-05-04 CN CN201710307407.2A patent/CN107119274B/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202011914U (en) * | 2010-12-31 | 2011-10-19 | 平高集团有限公司 | Plating bath for performing silver-graphite composite plating and plating equipment |
CN204265876U (en) * | 2014-12-05 | 2015-04-15 | 重庆耀勇减震器有限公司 | Front shock absorber of automobile electroplating connecting rods hanger |
CN204849063U (en) * | 2015-07-03 | 2015-12-09 | 爱蓝天高新技术材料(大连)有限公司 | But positive pole baffle of automatically regulated position |
CN204874790U (en) * | 2015-07-30 | 2015-12-16 | 爱蓝天高新技术材料(大连)有限公司 | Novel foam nickel electroplating groove |
CN105401205A (en) * | 2015-11-26 | 2016-03-16 | 有研粉末新材料(北京)有限公司 | Foamed nickel and foamed nickel-based alloy plating device |
CN105887174A (en) * | 2016-06-07 | 2016-08-24 | 共青城超群科技协同创新股份有限公司 | Electroplating equipment for improving electroplating uniformity |
CN106319584A (en) * | 2016-10-11 | 2017-01-11 | 爱蓝天高新技术材料(大连)有限公司 | Machining technology of ultrahigh-surface-density foam nickel |
CN206089848U (en) * | 2016-10-11 | 2017-04-12 | 爱蓝天高新技术材料(大连)有限公司 | Convenient and fast's earth of positive pole processing apparatus |
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