CN203855645U - Chemical plating device - Google Patents
Chemical plating device Download PDFInfo
- Publication number
- CN203855645U CN203855645U CN201420209117.6U CN201420209117U CN203855645U CN 203855645 U CN203855645 U CN 203855645U CN 201420209117 U CN201420209117 U CN 201420209117U CN 203855645 U CN203855645 U CN 203855645U
- Authority
- CN
- China
- Prior art keywords
- groove
- chemical plating
- major trough
- attached groove
- cell body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000126 substance Substances 0.000 title claims abstract description 21
- 238000007747 plating Methods 0.000 title claims abstract description 19
- 238000010438 heat treatment Methods 0.000 claims abstract description 25
- 210000005056 cell body Anatomy 0.000 claims description 14
- 238000001914 filtration Methods 0.000 claims description 14
- 239000010949 copper Substances 0.000 abstract description 16
- 229910052802 copper Inorganic materials 0.000 abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 15
- 239000002245 particle Substances 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000003756 stirring Methods 0.000 abstract description 5
- 230000008021 deposition Effects 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 9
- 239000007788 liquid Substances 0.000 description 7
- 238000007772 electroless plating Methods 0.000 description 6
- 239000003814 drug Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000010924 continuous production Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 1
- 239000005750 Copper hydroxide Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000003637 basic solution Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 229910001956 copper hydroxide Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000012224 working solution Substances 0.000 description 1
Landscapes
- Chemically Coating (AREA)
Abstract
The utility model discloses a chemical plating device which comprises a groove body, a baffle, a heating device and an air stirring device, wherein the groove body comprises a main groove and an auxiliary groove which are independent of each other; the baffle is nested in the groove body and is used for spacing the main groove from the auxiliary groove; a filter net is mounted on the upper side of the baffle and is lower than the main groove and the auxiliary groove; the heating device and the air stirring device are arranged in the auxiliary groove; the air stirring device is positioned under the heating device. According to the chemical plating device, the main groove is spaced from the auxiliary groove through the baffle, the heating device is mounted in the auxiliary groove, and the air stirring device is mounted under the heating device, so that negative influence caused by deposition of copper particles, generated in the main groove due to local overheat, on the surface of a copper layer can be effectively avoided; the product appearance and the performance are effectively improved; due to the auxiliary groove, chemical replenishment can be finished while chemical plating is performed, so that the continuity of production and the production efficiency are improved.
Description
Technical field
The utility model belongs to molding interconnection element electroless plating field, and what be specifically related to is a kind of chemical plating appts, and this device can be stablized chemical copper plating groove liquid and avoid producing copper facing particle.
Background technology
Three dimensional mold interconnecting device (3D-MID, Three – dimensional Molded Interconnect Device) is that 3 D stereo circuit is integrated in to plastic carrier surface, realizes the electronic devices and components with electric property and mechanical property.The metallization of 3D-MID device and surface treatment at present used electroless plating technology, comprises electroless copper, chemical nickel plating and chemical gilding.
Chemical copper plating solution is basic solution, contains cupric ion, the components such as complexing agent and reductive agent.The electroless copper groove that is applied at present 3D-MID device uses single cell body, working solution in heat-processed easily because local superheating produces copper particle, this copper particle can adhere to plated workpiece surface cause outward appearance and quality bad.
In liquid medicine adding procedure, while particularly adding cupric ion, can produce copper hydroxide suspended substance, this suspended substance can cause electroless plating quality bad.The single cell body using at present will carry out liquid medicine after workpiece takes out from electroless plating tank and adds being plated in the time that liquid medicine is added.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of chemical plating appts, can stablize chemical copper plating groove liquid and avoid producing copper facing particle, has improved the yield of electroless copper.
For achieving the above object, the technical solution of the utility model is as follows:
A kind of chemical plating appts, comprising:
One cell body, described cell body comprises major trough and the attached groove of separate setting,
One baffler, described baffler is nested to be arranged in cell body, and by spaced apart to described major trough and attached groove, the upside of described baffler is installed a filtering net, and the height of described filtering net is lower than the height of major trough and attached groove,
One is arranged at heating unit and the air stirrer in attached groove, and described air stirrer is positioned under heating unit.
In a preferred embodiment of the present utility model, described filtering net is that filter screen order number is 0.1-200 micron, and this filtering net is as the passage that two-way circulates of the solution in major trough and attached groove.
In a preferred embodiment of the present utility model, described air stirrer comprises an inlet pipe perpendicular to cell body, a nozzle assembly being connected with inlet pipe, and described nozzle assembly comprises several gas ejector pipes, on described gas ejector pipe, offers tuyere.
In a preferred embodiment of the present utility model, described heating unit be one be parallel to bottom land arrange some heating tubes, the tube spacing between described heating tube is consistent.
By technique scheme, the beneficial effects of the utility model are:
The utility model with baffler by spaced apart to major trough and attached groove, heating unit is installed in attached groove, air stirrer is installed under heating unit, can effectively avoid the copper particle that produces in major trough due to local superheating, and then is deposited on copper layer surface and produces bad.The product appearance and the performance that have effectively improved.
And due to the setting of attached groove, can realize in electroless plating, completing liquid medicine and add, and continuous production is strengthened, production efficiency gets a promotion.
Brief description of the drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the structural representation of air stirrer of the present utility model.
Embodiment
For technique means, creation characteristic that the utility model is realized, reach object and effect is easy to understand, below in conjunction with concrete diagram, further set forth the utility model.
With reference to Fig. 1, a kind of chemical plating appts, comprising: a cell body 100, and this cell body 100 comprises major trough 200 and the attached groove 300 of separate setting, the base 110 that is applicable to barrel plating and the placement of rack plating hanger is installed in major trough both sides, and can complete and produce 3D-MID device,
One baffler 400, the arranged on left and right sides 410 of described baffler 400,420 and downside 430 be fixed in cell body, and by spaced apart to described major trough 200 and attached groove 300, the upside 440 of baffler is installed a filtering net 450, and the height of described filtering net 450 is lower than the height of major trough 200 and attached groove 300, solution in attached groove can carry out solution exchange by filtering net on baffler, in actual production when attached tank liquor position is during higher than major trough, can effectively supplement each component of major trough, make to produce and be achieved continuously.
Filtering net is that filter screen order number is 0.1-200 micron, and this filtering net is as the passage that two-way circulates of the solution in major trough and attached groove, and material is the material of unlisted filter cloth, filter bag and similar function of the homologous series such as polyethylene, polypropylene, urethane.
One is arranged at heating unit 500 and the air stirrer 600 in attached groove 300, and air stirrer 600 is positioned under heating unit 500.
With reference to Fig. 2, air stirrer 600 comprises the nozzle assembly 620 that an inlet pipe 610, perpendicular to cell body is connected with inlet pipe 610, and described nozzle assembly 620 comprises several gas ejector pipes 621, offers tuyere 622 on described gas ejector pipe.
Heating unit 500 be one be parallel to bottom land arrange some heating tubes 510, the tube spacing between described heating tube is consistent.
In actual production process, first starting heating unit 500 heats for the solution being positioned in attached groove, then open air stirrer 600, oil-free compressed air through filtering is passed through to inlet pipe 610, then successively by after gas ejector pipe 621, eject from tuyere 622, because pneumatic blending is larger to stirring of solution, and this air stirrer 600 is just in time positioned at heating unit 500 belows, solution to heating more can form good flow efficiency, effectively avoid the copper particle producing due to local superheating in major trough, and then be deposited on copper layer surface and produce bad, the product appearance and the performance that have effectively improved.
And with baffler by spaced apart to major trough and attached groove, the setting of attached groove, can realize in electroless plating, completing liquid medicine and add, and continuous production is strengthened, production efficiency gets a promotion.
More than show and described ultimate principle of the present utility model and principal character and advantage of the present utility model.The technician of the industry should understand; the utility model is not restricted to the described embodiments; that in above-described embodiment and specification sheets, describes just illustrates principle of the present utility model; do not departing under the prerequisite of the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (4)
1. a chemical plating appts, is characterized in that, comprising:
One cell body, described cell body comprises major trough and the attached groove of separate setting,
One baffler, described baffler is nested to be arranged in cell body, and by spaced apart to described major trough and attached groove, the upside of described baffler is installed a filtering net, and the height of described filtering net is lower than the height of major trough and attached groove,
One is arranged at heating unit and the air stirrer in attached groove, and described air stirrer is positioned under heating unit.
2. a kind of chemical plating appts according to claim 1, is characterized in that: described filtering net is that filter screen order number is 0.1-200 micron, and this filtering net is as the passage that two-way circulates of the solution in major trough and attached groove.
3. a kind of chemical plating appts according to claim 1, it is characterized in that: described air stirrer comprises an inlet pipe perpendicular to cell body, one nozzle assembly being connected with inlet pipe, described nozzle assembly comprises several gas ejector pipes, on described gas ejector pipe, offers tuyere.
4. a kind of chemical plating appts according to claim 1, is characterized in that: described heating unit be one be parallel to bottom land arrange some heating tubes, the tube spacing between described heating tube is consistent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420209117.6U CN203855645U (en) | 2014-04-25 | 2014-04-25 | Chemical plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420209117.6U CN203855645U (en) | 2014-04-25 | 2014-04-25 | Chemical plating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203855645U true CN203855645U (en) | 2014-10-01 |
Family
ID=51605512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420209117.6U Expired - Lifetime CN203855645U (en) | 2014-04-25 | 2014-04-25 | Chemical plating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203855645U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104294241A (en) * | 2014-10-17 | 2015-01-21 | 金川集团股份有限公司 | Chemical nickel plating device and chemical nickel plating method |
| CN105132896A (en) * | 2015-08-28 | 2015-12-09 | 上海美维电子有限公司 | Novel chemical copper deposition device |
| CN107955941A (en) * | 2017-12-26 | 2018-04-24 | 合肥恒力装备有限公司 | A kind of device and method for realizing chemical nickel plating coating uniformity |
-
2014
- 2014-04-25 CN CN201420209117.6U patent/CN203855645U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104294241A (en) * | 2014-10-17 | 2015-01-21 | 金川集团股份有限公司 | Chemical nickel plating device and chemical nickel plating method |
| CN105132896A (en) * | 2015-08-28 | 2015-12-09 | 上海美维电子有限公司 | Novel chemical copper deposition device |
| CN105132896B (en) * | 2015-08-28 | 2018-06-19 | 上海美维电子有限公司 | New chemical copper precipitation unit |
| CN107955941A (en) * | 2017-12-26 | 2018-04-24 | 合肥恒力装备有限公司 | A kind of device and method for realizing chemical nickel plating coating uniformity |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20141001 |