CN106936496B

CN106936496B - Hot plug device for multiple IIC communication devices

Info

Publication number: CN106936496B
Application number: CN201710259960.3A
Authority: CN
Inventors: 高学严
Original assignee: Allray Inc ltd
Current assignee: Allray Inc ltd
Priority date: 2017-04-20
Filing date: 2017-04-20
Publication date: 2023-05-09
Anticipated expiration: 2037-04-20
Also published as: CN106936496A

Abstract

The invention discloses a hot plug device for a plurality of IIC communication equipment, which comprises a micro controller, a PC, a power module and a test board, wherein the micro controller is respectively connected with the PC and the power module, the test board is respectively connected between the micro controller and the PC through IIC buses, at least two test boards are arranged, SFP module insertion ports are arranged on each test board, and a group of analog switches are connected in series in the IIC buses at the positions of the SFP module insertion ports. Through the mode, the hot plug device for the plurality of IIC communication equipment realizes hot plug of the SFP packaging type optical module IIC in the whole testing process, cannot cause system IIC bus faults, is high in stability, can save the restarting time of the system, and improves the working efficiency.

Description

Hot plug device for multiple IIC communication devices

Technical Field

The invention belongs to the technical field of communication, and particularly relates to a hot plug device for a plurality of IIC communication devices.

Background

In the fields of the sensitivity, the emitted light power, the high alarm and the low alarm parameters of the current automatic test light module, only the parameter performance is tested at a test station, the internal data of the module is not read, so that the modules on the previous station are taken as qualified products to be put in storage, and finally, the customer returns to work. The SFP packaging type optical module is a module which requires hot plug, the former hot plug SFP packaging optical module only connects the power supply and the differential data signal line of the module, the IIC communication bus of the SFP packaging optical module is not connected to the IIC bus of the system, and the IIC bus is required to be thermally connected to the IIC bus for reading the internal data of the optical module by a system host computer so as to read the internal data of the optical module and judge whether the internal data of the optical module is correct or not. Because the IIC bus of the SFP packaging optical module can pull and deform signals of the original bus during hot plug, bus time sequence becomes chaotic, and the IIC bus data is often interrupted for connection, communication connection failure occurs, and related equipment needs to be restarted and reset to influence the stability and the working efficiency of the system.

Disclosure of Invention

The invention mainly solves the technical problem of providing a plurality of IIC communication equipment hot plug devices, which are used for connecting an IIC bus of an optical module in an SFP packaging form to a system IIC bus after IIC bus voltage is stabilized, and realizing hot plug of the optical module IIC in the SFP packaging form in the whole test process.

In order to solve the technical problems, the invention adopts a technical scheme that: the utility model provides a hot plug device of a plurality of IIC communication equipment, including microcontroller, PC, power module and test board, microcontroller be connected with PC and power module respectively, the test board respectively through IIC bus connection between microcontroller and PC, the test board at least two, every the test board on all be provided with SFP module insertion port, all cluster in the IIC bus of every SFP module insertion port position into a set of analog switch.

In a preferred embodiment of the present invention, the microcontroller selects a chip with IIC communication, serial communication and ADC sampling for the control chip.

In a preferred embodiment of the present invention, the PC is connected to the microcontroller through a serial to IIC communication port.

In a preferred embodiment of the present invention, the PC is a general-purpose computer.

In a preferred embodiment of the present invention, the start state of the test board is a charged state.

In a preferred embodiment of the present invention, the SFP module insertion port is plugged with an optical module in an SFP package form.

In a preferred embodiment of the present invention, pull-up resistors are further disposed on the IIC bus, respectively, and the level of the IIC bus is pulled up to the power supply voltage in a short time after the optical module is inserted into the SFP module insertion port through the pull-up resistors, and then the analog switch is turned on.

In a preferred embodiment of the present invention, the analog switch is controlled by a control pin of the microcontroller.

The beneficial effects of the invention are as follows: according to the hot plug device for the plurality of IIC communication equipment, the analog switch is turned on after the IIC bus voltage is stable, the IIC bus of the optical module in the SFP packaging form can be connected to the system IIC bus, the hot plug of the optical module IIC in the SFP packaging form is realized in the whole test process, the system IIC bus fault cannot be caused, the stability is high, the restarting time of the system can be saved, and the working efficiency is improved.

Drawings

For a clearer description of the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the description below are only some embodiments of the present invention, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art, wherein:

FIG. 1 is a block diagram of a hot plug apparatus for a plurality of IIC communication devices according to a preferred embodiment of the present invention.

Detailed Description

The following description of the technical solutions in the embodiments of the present invention will be clear and complete, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

As shown in fig. 1, an embodiment of the present invention includes:

a hot plug device for a plurality of IIC communication equipment comprises a micro controller, a PC, a power module and a test board, wherein the micro controller is respectively connected with the PC and the power module, the test board is respectively connected between the micro controller and the PC through IIC buses, at least two test boards are arranged, SFP module insertion ports are formed in each test board, and a group of analog switches are respectively connected in the IIC buses at the positions of the SFP module insertion ports in series.

In the above, the micro controller is a chip with IIC communication, serial communication and ADC sampling outside the control chip. The PC is connected with the micro controller through a serial port to IIC communication port; the PC is a common computer.

Further, the starting state of the test board is a charged state. The SFP module insertion port is inserted with an optical module in an SFP packaging form.

Still further still, still be provided with pull-up resistor on the IIC bus respectively, pull-up resistor is through the level of optical module with the IIC bus to power supply voltage in the short time after SFP module inserts the port, switch on analog switch again after waiting IIC bus voltage to stabilize, can realize that the IIC bus of SFP encapsulation form optical module is connected to system IIC bus.

According to the method, 1 group of analog switches are connected in series in the IIC bus at the position of the port where each SFP module is inserted on the existing equipment, the analog switches are controlled by pins to act through a micro controller, and the micro controller detects the working current of the module and judges the insertion of the optical module. The starting state of the test board is an energized state, and the analog switch is an off state. At the moment, the SFP packaging optical module is inserted, the microcontroller can detect the working current of the module, and when the module is determined to be inserted, the analog switch is closed after the internal work of the module is stable, and the analog switch indicator lamp is turned on. The connection IIC bus can not impact the original bus, and the normal working state of the original bus is affected. And then clicking a button for starting the testing process on the PC interface, and displaying the testing result on the PC interface after the PC judges that the whole testing process of the optical module is finished, so as to finish the testing process. After an operator pulls out the optical module in the SFP packaging form, the micro controller is pulled out through the working current judging module of the detection module, and at the moment, the analog switch is disconnected to wait for the insertion test of the next module.

Principle of control implementation: the optical modules in SFP package form are inserted first, and because the IIC bus of each optical module in SFP package form is provided with a pull-up resistor, the level of the IIC bus can be pulled up to the power supply voltage in a short time after the modules are inserted, and the system IIC bus is not affected by the connection of the analog switch, so that the IIC bus of the optical module in SFP package form can be smoothly connected to the system IIC bus.

By inserting the optical module in the SFP packaging form, after the IIC bus voltage is stabilized, the analog switch is turned on, so that the IIC bus of the optical module in the SFP packaging form can be connected to the system IIC bus. The IIC bus of the SFP packaging optical module can not deform the signal of the original bus during hot plug, so that the bus time sequence becomes disordered, the connection is often interrupted by IIC bus data, the communication connection failure occurs, and related equipment needs to be restarted and reset to influence the stability of the system. The time for restarting the system can be saved, and the working efficiency is improved.

In this embodiment, specific models adopted are:

1. the micro controller selects C8051F336, the peripheral device has IIC communication function and multi-channel ADC function, and the micro controller is not limited to the type of micro controller;

2. the analog switch is MAX4706, which is not limited to this type of switch;

4. the test board is not limited to inserting optical modules in SFP packages.

In summary, the plurality of IIC communication device hot plug devices of the present invention wait for the IIC bus voltage to stabilize and then turn on the analog switch, so that the IIC bus of the optical module in the SFP package form can be connected to the system IIC bus, and in the whole test process, the hot plug of the optical module IIC in the SFP package form is realized, so that the system IIC bus failure is not caused, the stability is strong, the time for restarting the system can be saved, and the working efficiency is improved.

The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes or direct or indirect application in other related arts are included in the scope of the present invention.

Claims

1. A hot plug device for a plurality of IIC communication equipment is characterized by comprising a micro controller, a PC, a power module and a test board, wherein the micro controller is respectively connected with the PC and the power module, the test board is respectively connected between the micro controller and the PC through IIC buses, at least two test boards are arranged, each test board is provided with an SFP module inserting port, a group of analog switches are respectively connected in the IIC buses at the positions of the SFP module inserting ports in series, the SFP module inserting ports are connected with optical modules in an SFP packaging mode in an inserting mode, pull-up resistors are respectively arranged on the IIC buses, the level of the IIC buses is pulled up to a power voltage in a short time after the optical modules are inserted into the SFP module inserting ports, the analog switches are connected, and the micro controller selects chips with IIC communication, serial communication and ADC sampling for a control chip.

2. The hot plug apparatus for a plurality of IIC communication devices according to claim 1, wherein the PC is connected to the microcontroller through a serial-to-IIC communication port.

3. The device for hot plugging of multiple IIC communication apparatuses according to claim 1, wherein said PC is a general computer.

4. The plurality of IIC communication device hot plug apparatus of claim 1, wherein the start state of the test board is a powered state.

5. The device for hot plugging of multiple IIC communication apparatuses according to claim 1, wherein the analog switch is controlled by a control pin of the micro controller.