CN106936496A - Multiple IIC communication equipments hot plug devices - Google Patents
Multiple IIC communication equipments hot plug devices Download PDFInfo
- Publication number
- CN106936496A CN106936496A CN201710259960.3A CN201710259960A CN106936496A CN 106936496 A CN106936496 A CN 106936496A CN 201710259960 A CN201710259960 A CN 201710259960A CN 106936496 A CN106936496 A CN 106936496A
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- China
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- iic
- hot plug
- communication equipments
- sfp
- plug devices
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/07—Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems
- H04B10/073—Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems using an out-of-service signal
- H04B10/0731—Testing or characterisation of optical devices, e.g. amplifiers
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Connector Housings Or Holding Contact Members (AREA)
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Abstract
The invention discloses a kind of multiple IIC communication equipments hot plug devices, including microcontroller, PC, power module and test board, described microcontroller is connected with PC and power module respectively, described test board is connected between microcontroller and PC by iic bus respectively, described test board at least two, SFP modules insertion port is provided with test board described in each, one group of analog switch is sealed in the iic bus of each SFP module insertion port position.Through the above way, multiple IIC communication equipments hot plug devices of the invention, in whole test process, the hot plug of SFP packing forms optical modules IIC is realized, system iic bus failure is not resulted in, stability is strong, the system reboot dynamic time can be saved, operating efficiency is improved.
Description
Technical field
The invention belongs to the technical field for communicating, and in particular to a kind of multiple IIC communication equipments hot plug devices.
Background technology
In the sensitivity of automatic testing light module at present, transmitting luminous power, alarm high and low alarm parameter field, in test
Station is all a test parameter performance, not read through model internal data, and the module having on station before causing is burnt by internal data
The module of record mistake, loss or leakage burning is taken as certified products to be put in storage, and ultimately results in client returns and does over again.And SFP packing forms
Optical module be the module for being required to hot plug, in the past hot plug SFP encapsulation optical module is only connect module a power supply and a difference
Divided data holding wire, SFP encapsulation optical module IIC communication bus be to be not connected on the iic bus of system, and now in order to
Can read module internal data, it is necessary to iic bus also will can be thermally connected on iic bus, for system host read light
Inside modules data judge whether correctly.Because the iic bus of SFP encapsulation optical modules can be by the letter of original bus in hot plug
Number deformation is drawn, bus timing is become chaotic, cause often there is iic bus data outage to connect, communication connection unsuccessfully occurs, and needs
Relevant device is restarted into reset, the stability and operating efficiency of system is influenceed.
The content of the invention
The present invention solves the technical problem of a kind of multiple IIC communication equipments hot plug devices are provided, wait IIC total
Analog switch is connected again after line voltage stabilization, it is possible to achieve the iic bus of the optical module of SFP packing forms are connected to system IIC
In bus, in whole test process, the hot plug of SFP packing forms optical modules IIC is realized, do not result in system iic bus
Failure, stability is strong, can save the system reboot dynamic time, improves operating efficiency.
In order to solve the above technical problems, one aspect of the present invention is：Set there is provided a kind of multiple IIC communications
Standby hot plug device, including microcontroller, PC, power module and test board, described microcontroller respectively with PC
Machine is connected with power module, and described test board is connected between microcontroller and PC by iic bus respectively, described
Test board at least two, be provided with the test board described in each SFP modules insertion port, each SFP module insert
One group of analog switch is sealed in the iic bus of inbound port position.
In a preferred embodiment of the present invention, described microcontroller for control chip select peripheral hardware band IIC communication, string
Port communications and the chip of ADC samplings.
In a preferred embodiment of the present invention, described PC turns IIC ports with microcontroller phase by serial ports
Connection.
In a preferred embodiment of the present invention, described PC is common computer.
In a preferred embodiment of the present invention, the beginning state of described test board is electriferous state.
In a preferred embodiment of the present invention, the light of SFP packing forms is plugged with described SFP modules insertion port
Module.
In a preferred embodiment of the present invention, pull-up resistor is also respectively provided with described iic bus, by pull-up
The level of iic bus is pulled upward to supply voltage by resistance within the short time behind optical module insertion SFP module insertions port, then is connected
Analog switch.
In a preferred embodiment of the present invention, described analog switch is dynamic by the controlling switch control of microcontroller
Make.
The beneficial effects of the invention are as follows：Multiple IIC communication equipments hot plug devices of the invention, wait iic bus voltage
Analog switch is connected again after stabilization, it is possible to achieve the iic bus of the optical module of SFP packing forms are connected on system iic bus,
In whole test process, the hot plug of SFP packing forms optical modules IIC is realized, do not result in system iic bus failure, surely
It is qualitative strong, the system reboot dynamic time can be saved, improve operating efficiency.
Brief description of the drawings
Technical scheme in order to illustrate more clearly the embodiments of the present invention, below will be to that will make needed for embodiment description
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for
For those of ordinary skill in the art, on the premise of not paying creative work, other can also be obtained according to these accompanying drawings
Accompanying drawing, wherein：
Fig. 1 is the structured flowchart of a preferred embodiment of multiple IIC communication equipment hot plug devices of the invention.
Specific embodiment
The technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described implementation
Example is only a part of embodiment of the invention, rather than whole embodiments.Based on the embodiment in the present invention, this area is common
All other embodiment that technical staff is obtained under the premise of creative work is not made, belongs to the model of present invention protection
Enclose.
As shown in figure 1, the embodiment of the present invention includes：
A kind of multiple IIC communication equipments hot plug devices, including microcontroller, PC, power module and test board, it is described
Microcontroller be connected with PC and power module respectively, described test board is connected to miniature by iic bus respectively
Between controller and PC, described test board at least two is provided with the insertion of SFP modules on the test board described in each
Port, one group of analog switch is sealed in the iic bus of each SFP module insertion port position.
In above-mentioned, described microcontroller selects peripheral hardware with IIC communications, serial communication and ADC samplings for control chip
Chip.Wherein, described PC turns IIC ports and is connected with microcontroller by serial ports；Described PC is common
Computer.
Further, the beginning state of described test board is electriferous state.Wherein, described SFP modules insertion port
On be plugged with the optical module of SFP packing forms.
Further, pull-up resistor is also respectively provided with described iic bus, is inserted in optical module by pull-up resistor
The level of iic bus is pulled upward to supply voltage in the short time after entering SFP modules insertion port, then connects analog switch, waited
Analog switch is connected again after iic bus voltage stabilization, it is possible to achieve the iic bus of the optical module of SFP packing forms are connected to and are
On system iic bus.
The application seals in 1 group of simulation in the existing equipment and opens in the iic bus of the port position of each SFP module insertion
Close, this analog switch is by microcontroller controlling switch control action, microcontroller while the operating current of detection module is used
With the insertion for judging optical module.The beginning state of test board is "on" position, and analog switch is off-state.Now insert SFP
The optical module of packing forms, microcontroller can detect the operating current of module, and mould is waited until after determining module insertion
Analog switch is closed again after block internal work stabilization, closure analog switch indicator lamp is bright.So connection iic bus will not be total to original
Line is impacted, the normal operating conditions of the former bus of influence.The startup test process button on PC interfaces is then clicked on, works as PC
After judging that the whole test process of optical module is finished, test result is included on PC interface, finish test procedure.Work as operator
After member extracts the optical module of SFP packing forms, microcontroller is pulled out by the operating current judge module of detection module, this
When disconnect analog switch, wait the insertion test of next module.
The principle of control realization：The optical module of SFP packing forms is first inserted, due to the optical module of each SFP packing forms
Iic bus on have pull-up resistor, so the level of iic bus can be pulled upward into electricity in very short time after module insertion
Source voltage, now connects simulation and opens and system iic bus will not be impacted again, can smoothly by the optical mode of SFP packing forms
The iic bus of block are connected on system iic bus.
By the insertion of the optical module of SFP packing forms, analog switch is connected again after waiting iic bus voltage stabilization, can
It is connected on system iic bus with the iic bus for realizing the optical module of SFP packing forms.Be not in because SFP encapsulates optical mode
The signal of original bus can be drawn deformation by the iic bus of block in hot plug, bus timing is become chaotic, cause often to have
Iic bus data outage is connected, and communication connection unsuccessfully occurs, it is necessary to relevant device is restarted into reset, the stability of influence system.
The system reboot dynamic time can be saved, operating efficiency is improved.
In the present embodiment, the concrete model for using for：
1st, microcontroller selection C8051F336, peripheral hardware band IIC communication functions, band multi-channel A/D C functions, not limited to this model
Microcontroller;
2nd, analog switch selects MAX4706, the switch of not limited to this model；
4th, test board does not limit the optical module of insertion SFP packing forms.
In sum, multiple IIC communication equipments hot plug devices of the invention, connect again after waiting iic bus voltage stabilization
Logical analog switch, it is possible to achieve the iic bus of the optical module of SFP packing forms are connected on system iic bus, are entirely being tested
During, the hot plug of SFP packing forms optical modules IIC is realized, do not result in system iic bus failure, stability is strong, can be with
The system reboot dynamic time is saved, operating efficiency is improved.
Embodiments of the invention are the foregoing is only, the scope of the claims of the invention is not thereby limited, it is every to utilize this hair
Equivalent structure or equivalent flow conversion that bright description is made, or directly or indirectly it is used in other related technology necks
Domain, is included within the scope of the present invention.
Claims (8)
1. a kind of multiple IIC communication equipments hot plug devices, it is characterised in that including microcontroller, PC, power module with
And test board, described microcontroller is connected with PC and power module respectively, and described test board is total by IIC respectively
Line is connected between microcontroller and PC, described test board at least two, is respectively provided with the test board described in each
There are SFP modules to insert port, one group of analog switch is sealed in the iic bus of each SFP module insertion port position.
2. multiple IIC communication equipments hot plug devices according to claim 1, it is characterised in that described miniature control
Device selects chip of the peripheral hardware with IIC communications, serial communication and ADC samplings for control chip.
3. multiple IIC communication equipments hot plug devices according to claim 2, it is characterised in that described PC passes through
Serial ports turns IIC ports and is connected with microcontroller.
4. multiple IIC communication equipments hot plug devices according to claim 1, it is characterised in that described PC is general
Logical computer.
5. multiple IIC communication equipments hot plug devices according to claim 1, it is characterised in that described test board
Beginning state is electriferous state.
6. multiple IIC communication equipments hot plug devices according to claim 1, it is characterised in that described SFP modules are inserted
The optical module of SFP packing forms is plugged with inbound port.
7. multiple IIC communication equipments hot plug devices according to claim 6, it is characterised in that on described iic bus
Pull-up resistor is also respectively provided with, inserts in the short time that IIC is total after SFP modules insert port in optical module by pull-up resistor
The level of line is pulled upward to supply voltage, then connects analog switch.
8. multiple IIC communication equipments hot plug devices according to claim 1, it is characterised in that described analog switch
By the controlling switch control action of microcontroller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710259960.3A CN106936496B (en) | 2017-04-20 | 2017-04-20 | Hot plug device for multiple IIC communication devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710259960.3A CN106936496B (en) | 2017-04-20 | 2017-04-20 | Hot plug device for multiple IIC communication devices |
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| Publication Number | Publication Date |
|---|---|
| CN106936496A true CN106936496A (en) | 2017-07-07 |
| CN106936496B CN106936496B (en) | 2023-05-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710259960.3A Active CN106936496B (en) | 2017-04-20 | 2017-04-20 | Hot plug device for multiple IIC communication devices |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107271889A (en) * | 2017-08-18 | 2017-10-20 | 苏州佳风网络科技有限公司 | A kind of remote control test board electrifying device |
| CN109000734A (en) * | 2018-08-18 | 2018-12-14 | 成都飞机工业（集团）有限责任公司 | The method of real-time monitoring optical module working condition ageing process |
| CN109361467A (en) * | 2018-12-04 | 2019-02-19 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module |
| CN110299941A (en) * | 2019-05-23 | 2019-10-01 | 广东瑞谷光网通信股份有限公司 | The accurate test method of optical module IIC Ready Time, electronic equipment and computer readable storage medium |
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| CN1581026A (en) * | 2004-05-19 | 2005-02-16 | 中兴通讯股份有限公司 | Device and method for operating multiple I2C sub device in communication equipment |
| CN201698420U (en) * | 2010-07-26 | 2011-01-05 | 杭州华三通信技术有限公司 | Small-sized pluggable optical receiving-sending module control device based on I2C bus |
| CN202631620U (en) * | 2012-05-15 | 2012-12-26 | 东莞铭普光磁股份有限公司 | Optical module intelligent test board |
| CN104993863A (en) * | 2015-06-10 | 2015-10-21 | 四川华拓光通信股份有限公司 | Optical module for network communication equipment test |
| CN206686185U (en) * | 2017-04-20 | 2017-11-28 | 江苏奥雷光电有限公司 | Multiple IIC communication equipments hot plug devices |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1581026A (en) * | 2004-05-19 | 2005-02-16 | 中兴通讯股份有限公司 | Device and method for operating multiple I2C sub device in communication equipment |
| CN201698420U (en) * | 2010-07-26 | 2011-01-05 | 杭州华三通信技术有限公司 | Small-sized pluggable optical receiving-sending module control device based on I2C bus |
| CN202631620U (en) * | 2012-05-15 | 2012-12-26 | 东莞铭普光磁股份有限公司 | Optical module intelligent test board |
| CN104993863A (en) * | 2015-06-10 | 2015-10-21 | 四川华拓光通信股份有限公司 | Optical module for network communication equipment test |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107271889A (en) * | 2017-08-18 | 2017-10-20 | 苏州佳风网络科技有限公司 | A kind of remote control test board electrifying device |
| CN109000734A (en) * | 2018-08-18 | 2018-12-14 | 成都飞机工业（集团）有限责任公司 | The method of real-time monitoring optical module working condition ageing process |
| CN109361467A (en) * | 2018-12-04 | 2019-02-19 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module |
| CN109361467B (en) * | 2018-12-04 | 2021-07-06 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN110299941A (en) * | 2019-05-23 | 2019-10-01 | 广东瑞谷光网通信股份有限公司 | The accurate test method of optical module IIC Ready Time, electronic equipment and computer readable storage medium |
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| Publication number | Publication date |
|---|---|
| CN106936496B (en) | 2023-05-09 |
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