CN106532240A - 一种手机天线及其化镀工艺 - Google Patents
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- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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Abstract
本发明提供利用一般树脂制成的手机天线及其制造工艺,采用一般树脂作为天线素材做底层,由下至上依次为钯层、铜层、镍层和钯层。普通树脂是不导电体,所以无法进行化镀,但通过前处理转换到导电体后进行化镀,比其他素材能做到小型化及更薄化。使市场上流行的电器,电子设备等的天线开发更加有优势。本发明改善现有的无线电通讯设备内置天线制作工艺上存在的成本高及高不良的问题。利用容易造型的普通树脂制作天线,减少制作成本、缩短开发周期、提高生产效率,且比其他素材能做到小型化及薄片化,使市场上流行的电器,电子设备等的天线开发更加有优势。
Description
技术领域
本发明属于无线电通讯领域,特别涉及一种无线电通讯设备内置天线的制造工艺。
背景技术
现有的手机天线制作方法是,双色注塑工艺和LDS工艺。双色注塑工艺是需要两套注塑模,所以不良率较高,导致产量和生产效率低下等问题。LDS工艺需要使用非常昂贵的镭雕设备及LDS专用的树脂材料,因此生产成本很高,以及很难做到高难度的形状导致产生很多不良产品。
发明内容
为解决上述问题,本发明提供了一种能够在一般树脂上进行化镀的一种手机天线的制造工艺,所采用的技术方案为:
一种手机天线的制造工艺,包括如下步骤:
S10:在要处理的素材天线部位表面镭雕出凹凸均匀的被镀面;
S20:使用150g/L浓度的碱性脱脂剂处理被镀面1min,去除表面的油迹、灰尘;
S30:在55-65℃下用150ml/L的硫酸浸泡被镀面2-10min;
S40:用100ml/L的盐酸浸泡被镀面1-2min;
S50:用5-10g/L的氯化锡溶液浸泡被镀面2-3min,使被镀部位的凹凸面吸附氯化锡溶液中的金属离子;
S60:用100-200ml/L的氯化钯溶液浸泡被镀面2-5min;
S70:用50-100g/L的有机酸溶液浸泡被镀面1-3min,去除被镀面从氯化锡溶液中吸附的锡离子;
S80:重复步骤S70;
S90:冲击铜;
S100:在冲击铜表面进行化铜;
S110:用100-200ml/L的硫酸劲爆被镀面1-2min,去除天线部位周边的细微余镀;
S120:在铜层表面镀一层镍层,防止铜层被划伤造成脱落;
S130:在镍层表面再次进行镀钯,增强铜层和镍层之间的结合力;
S140:对钯层表面进行封孔工序。
优选的,所述步骤S100中,所述铜层的厚度为9-15μm。
优选的,所述步骤S120中,所述镍层厚度为1-5μm。
同时,本发明还提供了一种手机天线,所采用的技术方案为:
一种根据上述工艺制得的手机天线,采用一般树脂材料作为天线素材做底层,由下至上依次为钯层、铜层、镍层和钯层。
特别的,所述铜层分为两层。
优选的,所述铜层的总厚度为9-15μm。
优选的,所述镍层厚度为1-5μm。
普通树脂是不导电体,所以无法进行化镀,但通过前处理转换到导电体后进行化镀,比其他素材能做到小型化及更薄化。使市场上流行的电器,电子设备等的天线开发更加有优势。
本发明改善现有的无线电通讯设备内置天线制作工艺上存在的成本高及高不良的问题。利用容易造型的普通树脂制作天线,减少制作成本、缩短开发周期、提高生产效率,且比其他素材能做到小型化及薄片化,使市场上流行的电器,电子设备等的天线开发更加有优势。
附图说明
图1为本发明制作工艺示意图
图2为本发明手机天线结构示意图
具体实施方式
实施例1
一种手机天线的化镀工艺,包括如下步骤:
S10:在要处理的素材天线部位表面镭雕出凹凸均匀的被镀面;
S20:使用150g/L浓度的碱性脱脂剂处理被镀面1min,去除表面的油迹、灰尘;
S30:在55-65℃下用150ml/L的硫酸浸泡被镀面2min;
S40:用100ml/L的盐酸浸泡被镀面1min;
S50:用5-10g/L的氯化锡溶液浸泡被镀面2min,使被镀部位的凹凸面吸附氯化锡溶液中的金属离子;
S60:用100-200ml/L的氯化钯溶液浸泡被镀面2min;
S70:用50-100g/L的有机酸溶液浸泡被镀面1min,去除被镀面从氯化锡溶液中吸附的锡离子;
S80:重复步骤S70;
S90:冲击铜;
S100:在冲击铜表面进行化铜,所述铜层的厚度为9μm;
S110:用100-200ml/L的硫酸劲爆被镀面1min,去除天线部位周边的细微余镀;
S120:在铜层表面镀一层镍层,防止铜层被划伤造成脱落,所述镍层厚度为1μm;
S130:在镍层表面再次进行镀钯,增强铜层和镍层之间的结合力;
S140:对钯层表面进行封孔工序。
一种根据所述手机天线制造工艺制造获得的手机天线,由天线素材1为底层,由下至上依次为钯层2、铜层3、镍层4和钯层5。所述铜层3的厚度为9μm,所述镍层厚度为1μm。
实施例2
一种手机天线的化镀工艺,包括如下步骤:
S10:在要处理的素材天线部位表面镭雕出凹凸均匀的被镀面;
S20:使用150g/L浓度的碱性脱脂剂处理被镀面1min,去除表面的油迹、灰尘;
S30:在55-65℃下用150ml/L的硫酸浸泡被镀面6min;
S40:用100ml/L的盐酸浸泡被镀面1.5min;
S50:用5-10g/L的氯化锡溶液浸泡被镀面2.5min,使被镀部位的凹凸面吸附氯化锡溶液中的金属离子;
S60:用100-200ml/L的氯化钯溶液浸泡被镀面3.5min;
S70:用50-100g/L的有机酸溶液浸泡被镀面2min,去除被镀面从氯化锡溶液中吸附的锡离子;
S80:重复步骤S70;
S90:冲击铜;
S100:在冲击铜表面进行化铜,所述铜层的厚度为12μm;
S110:用100-200ml/L的硫酸劲爆被镀面1.5min,去除天线部位周边的细微余镀;
S120:在铜层表面镀一层镍层,防止铜层被划伤造成脱落,所述镍层的厚度为3μm;
S130:在镍层表面再次进行镀钯,增强铜层和镍层之间的结合力;
S140:对钯层表面进行封孔工序。
一种根据所述手机天线制造工艺制造获得的手机天线,由天线素材1为底层,由下至上依次为钯层2、铜层3、镍层4和钯层5。所述铜层3的厚度为12μm,所述镍层厚度为3μm。
实施例3
一种手机天线的化镀工艺,包括如下步骤:
S10:在要处理的素材天线部位表面镭雕出凹凸均匀的被镀面;
S20:使用150g/L浓度的碱性脱脂剂处理被镀面1min,去除表面的油迹、灰尘;
S30:在55-65℃下用150ml/L的硫酸浸泡被镀面10min;
S40:用100ml/L的盐酸浸泡被镀面2min;
S50:用5-10g/L的氯化锡溶液浸泡被镀面3min,使被镀部位的凹凸面吸附氯化锡溶液中的金属离子;
S60:用100-200ml/L的氯化钯溶液浸泡被镀面5min;
S70:用50-100g/L的有机酸溶液浸泡被镀面3min,去除被镀面从氯化锡溶液中吸附的锡离子;
S80:重复步骤S70;
S90:冲击铜;
S100:在冲击铜表面进行化铜,所述铜层的厚度为15μm;
S110:用100-200ml/L的硫酸劲爆被镀面2min,去除天线部位周边的细微余镀;
S120:在铜层表面镀一层镍层,防止铜层被划伤造成脱落,所述铜层的厚度为5μm;
S130:在镍层表面再次进行镀钯,增强铜层和镍层之间的结合力;
S140:对钯层表面进行封孔工序。
一种根据所述手机天线制造工艺制造获得的手机天线,由天线素材1为底层,由下至上依次为钯层2、铜层3、镍层4和钯层5。所述铜层3的厚度为15μm,所述镍层厚度为5μm。
Claims (7)
1.一种手机天线的制造工艺,包括如下步骤:
S10:在要处理的素材天线部位表面镭雕出凹凸均匀的被镀面;
S20:使用150g/L浓度的碱性脱脂剂处理被镀面1min,去除表面的油迹、灰尘;
S30:在55-65℃下用150ml/L的硫酸浸泡被镀面2-10min;
S40:用100ml/L的盐酸浸泡被镀面1-2min;
S50:用5-10g/L的氯化锡溶液浸泡被镀面2-3min,使被镀部位的凹凸面吸附氯化锡溶液中的金属离子;
S60:用100-200ml/L的氯化钯溶液浸泡被镀面2-5min;
S70:用50-100g/L的有机酸溶液浸泡被镀面1-3min,去除被镀面从氯化锡溶液中吸附的锡离子;
S80:重复步骤S70;
S90:冲击铜:在钯层表面镀铜;
S100:在冲击铜表面进行化铜;
S110:用100-200ml/L的硫酸劲爆被镀面1-2min,去除天线部位周边的细微余镀;
S120:在铜层表面镀一层镍层,防止铜层被划伤造成脱落;
S130:在镍层表面再次进行镀钯,增强铜层和镍层之间的结合力;
S140:对镍层表面进行封孔工序。
2.根据权利要求1所述的手机天线的制造工艺,其特征在于,所述步骤S100中,所述铜层的厚度为9-15μm。
3.根据权利要求1所述的手机天线的制造工艺,其特征在于,所述步骤S120中,所述镍层厚度为1-5μm。
4.一种根据权利要求1所述工艺制得的手机天线,其特征在于,天线素材做底层,由下至上依次为钯层、铜层、镍层和钯层。
5.根据权利要求4所述的手机天线,其特征在于,所述铜层分为两层。
6.根据权利要求4或5所述的手机天线,其特征在于,所述铜层的总厚度为9-15μm。
7.根据权利要求4所述的手机天线,其特征在于,所述镍层厚度为1-5μm。
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Cited By (2)
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CN110904473A (zh) * | 2019-12-04 | 2020-03-24 | 中山美力特环保科技有限公司 | 一种5g天线环保镀铜工艺 |
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