CN104661446A - Circuit board processing method - Google Patents
Circuit board processing method Download PDFInfo
- Publication number
- CN104661446A CN104661446A CN201510070746.4A CN201510070746A CN104661446A CN 104661446 A CN104661446 A CN 104661446A CN 201510070746 A CN201510070746 A CN 201510070746A CN 104661446 A CN104661446 A CN 104661446A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- golden finger
- processing method
- dry film
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention discloses a circuit board processing method. The circuit board processing method comprises the following steps: providing a circuit board and forming a copper plating layer on the surface of the circuit board; providing a dry film and attaching the dry film onto the surface of the copper plating layer; exposing and developing the dry film, exposing part of the surface of the copper plating layer, forming a golden finger graph in an exposed area to obtain a circuit board with the golden finger graph; electrically plating the surface with the golden finger graph by using the conductivity of the copper plating layer to form a golden finger; removing the dry film to obtain the circuit board with the golden finger. By virtue of the circuit board processing method, the production process period is effectively shortened; the production efficiency and the quality of the product are improved.
Description
Technical field
The present invention relates to the manufacture craft field of circuit board, be specifically related to the golden finger circuit board processing method of a kind of electroless plating lead-in wire.
Background technology
The making of circuit board golden finger generally adopts electro-plating method, usually can increase electroplate lead wire in the position needing electrogilding to point, On current during for electroplating.But after plating, the electroplate lead wire of golden finger adopts the mode one-shot forming on milling limit to remove parcel plating lead-in wire usually, and therefore the root of golden finger usually can retain electroplate lead wire.Along with electronic product transmits more and more higher requirement to signal, the Electro Magnetic Compatibility of the signal meeting interference effect electronic equipment that the described electroplate lead wire retained brings.Therefore, the golden finger wiring board making electroless plating lead-in wire has become a kind of new demand.
In prior art, the processing of the circuit board of electroless plating lead-in wire adopts following four kinds of methods:
Method one: adopt and add lead-in wire electrogilding finger mode, before welding resistance or after welding resistance, etching adjustment is carried out to described lead-in wire.
The technical problem that described method one exists is: described circuit or golden finger edge still can remain pigtail splice, and the width of general joint, between 0.2 to 0.3mm, exists and has a strong impact on product appearance, impedance electric property, increases the problems such as mounting related components difficulty.
Method two: adopt the thick golden finger mode of re-plating after whole plate plating thin gold, then line pattern etches out together with sectional golden finger in etching process procedure.
The technical problem that described method two exists is: because needs justifying is gold-plated, and the cost that technological process makes is high; Owing to needing through repeatedly pad pasting in subsequent handling and moving back film, the gold-plated rear quality of whole plate is difficult to management and control, easily causes moving back film difficulty and the oxidation of golden face, and this technique can not meet other process of surface treatment; Unsettled phenomenon can be there is after the etching of golden finger described in the method.
Method three: adopt and add gage system at golden finger end, manual lead-in wire of tearing after finished product.
The technical problem of described method three is: rely on manual operations, production efficiency is low, is easily pulled up by golden finger while tearing lead-in wire simultaneously, and after lead-in wire tear fracture, remaining trace bottom base material, affects outward appearance.
Method four: adopt wet film and resist ink electric thick gold mode, then by secondary dry film, circuit and segmentation golden finger are etched out.
The technical problem of described method four is: because of anti-electric bronze ink operation need increase graph transfer printing operation cause the technological process of the method and the production cycle long, not utilization produce efficiency, production capacity promote; Need dry through baking temperature once during wet film before exposure pre-baked, easily occur that overbaking causes the clean problem of development.
In sum, exist in the processing method of the golden finger wiring board of described electroless plating lead-in wire and still need introduce electroplate lead wire and then remove described electroplate lead wire, or do not need to introduce electroplate lead wire, but technological process and production cycle longer problem.
Summary of the invention
Technical problem to be solved by this invention is that the golden finger wiring board of electroless plating lead-in wire still needs when Product processing introduce electroplate lead wire and then remove described electroplate lead wire, or do not need to introduce electroplate lead wire, but technological process and production cycle longer problem.
The invention provides a kind of circuit board processing method, it comprises the steps: to provide circuit board, forms copper plate in described circuit board surface; Dry film is provided, is attached at described copper plate surface; Described dry film exposed and develops, making described copper plate part surface exposed, and forming golden finger figure at described exposed region, obtaining the circuit board with golden finger figure; Utilize the conductivity of described copper plate, electroplate in described golden finger patterned surface, form golden finger; And remove described dry film, obtain the circuit board with described golden finger.
In a kind of preferred embodiment of circuit board processing method provided by the invention, form described copper plate in described circuit board surface and comprise the steps: to provide multilayer circuit board raw material; Respectively sawing sheet is carried out to circuit board raw material described in multilayer; In described circuit board raw material, carry out inner figure transfer printing to form internal layer circuit circuit as the surface of internal layer raw material, and automatic optics inspection is carried out to described internal layer circuit circuit; Circuit board raw material described in multilayer is carried out folded establishing, and pressing, to form described multilayer circuit board, is then practiced shooting and bore process to described multilayer circuit board further; And described multilayer circuit board is carried out heavy process for copper processing, obtain the circuit board covering described copper plate.
In a kind of preferred embodiment of circuit board processing method provided by the invention, described heavy process for copper is vertical heavy process for copper.
In a kind of preferred embodiment of circuit board processing method provided by the invention, remove described dry film, obtain after there is the step of the circuit board of described golden finger and also comprise the steps: to provide secondary dry film, be attached at described copper plate and described golden finger surface; Described secondary dry film is exposed and developed, makes described copper plate partial denudation to form the figure with the circuit-line of exposed copper plate; Alkaline etching liquid is provided, etches described exposed copper plate; And remove described secondary dry film, obtain the circuit board of the circuit-line with described golden finger conducting.
In a kind of preferred embodiment of circuit board processing method provided by the invention, design tear in the junction of described golden finger and described circuit-line and compensate.
In a kind of preferred embodiment of circuit board processing method provided by the invention, described alkaline etching liquid comprises ammoniacal liquor and ammonium chloride.
In a kind of preferred embodiment of circuit board processing method provided by the invention, remove after described secondary dry film obtains having the step of the circuit board of circuit-line and also comprise following arbitrary procedure of processing: automatic optics inspection, the coating of insulation green ink, gong plate, secondary gong plate, flying probe and final quality control.
In a kind of preferred embodiment of circuit board processing method provided by the invention, described golden finger is sectional golden finger.
In a kind of preferred embodiment of circuit board processing method provided by the invention, the plated material that plating forms described golden finger is nickel or gold.
In a kind of preferred embodiment of circuit board processing method provided by the invention, at the described dry film of removing, obtaining and have in the step of the circuit board of described golden finger, providing strong base solution, for removing described dry film.
Compared to prior art, circuit board processing method provided by the invention adopts dry film process to electroplate described golden finger.Avoid additionally introducing described circuit lead with described copper plate conducting electroplating current in the electroplating process of described golden finger, and the dry film preparation technology of described golden finger can also effectively avoid oozing gold and the golden problem of plating leakage in described golden finger preparation process.Therefore, described circuit board processing method can effectively shorten the production procedure cycle, enhances productivity and product quality.
And, after circuit board processing method provided by the invention electroplates described golden finger, also adopt alkali etching technique to print described circuit-line.The alkali etching technique that described circuit-line is printed can solve the problem that original acid etching liquid medicine corrodes golden face.Further, by compensating at the junction of described golden finger and described circuit-line design tear, improving the described circuit-line that may cause because of the existence of described junction difference in height and occurring open circuit and gap problem.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings, wherein:
Fig. 1 is the schematic flow sheet of a kind of circuit board processing method of the embodiment of the present invention;
Fig. 2 is the schematic diagram of the side structure of step S1 corresponding product in circuit board processing method shown in Fig. 1;
Fig. 3 is the process flow diagram of step S1 in circuit board processing method shown in Fig. 1;
Fig. 4 is the schematic diagram of the side structure of step S2 corresponding product in circuit board processing method shown in Fig. 1;
Fig. 5 is the floor map of step S3 corresponding product in circuit board processing method shown in Fig. 1;
Fig. 6 is the side schematic view of step S5 corresponding product in circuit board processing method shown in Fig. 1;
Fig. 7 is the process flow diagram of step S6 in circuit board processing method shown in Fig. 1;
Fig. 8 is the structural representation that the tear of step S6 in circuit board processing method shown in Fig. 1 compensates.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
Referring to Fig. 1, is the process flow diagram of a kind of circuit board processing method of the embodiment of the present invention.In the present embodiment, described circuit board processing method is applied to the circuit board that processing has sectional golden finger.In other alternate embodiments, described circuit board processing method can also be applied to the circuit board that processing has common isometric or different in size golden finger.Described circuit board processing method comprises the steps:
S1, provide a circuit board, described circuit board surface forms copper plate;
S2, attach dry film in described copper plate surface;
S3, exposing and develop to described dry film, make described copper plate part surface exposed, described exposed region forms golden finger figure, obtains the circuit board with golden finger figure;
S4, utilize the conductivity of described copper plate, electroplate in described golden finger patterned surface, form golden finger; And
S5, remove described dry film, obtain the circuit board with golden finger.
Below in conjunction with other accompanying drawings and the present embodiment, the present invention is described in further detail.
In step sl, as shown in Figure 2, provide a circuit board 1, described circuit board 1 surface forms copper plate 2.Wherein, described copper plate 2 covers described circuit board 1 surface integral.In the present embodiment, described circuit board 1 is multilayer circuit board.In other alternate embodiments, described circuit board 1 also can be single layer board.Described circuit board 1 obtains after being through the processing of heavy process for copper, and as shown in Figure 3, its making comprises the steps:
Step S11: multilayer circuit board raw material is provided;
Step S12: respectively sawing sheet is carried out to circuit board raw material described in multilayer;
Step S13: carry out inner figure transfer printing to form internal layer circuit circuit in described circuit board raw material as the surface of internal layer raw material, and automatic optics inspection is carried out to described internal layer circuit circuit;
Step S14: circuit board raw material described in multilayer is carried out folded establishing, and pressing, to form described multilayer circuit board, is then practiced shooting and bore process to described multilayer circuit board further; And
Step S15: described multilayer circuit board is carried out heavy process for copper processing, obtains the circuit board 1 covering described copper plate 2.
Preferably, the heavy process for copper in step S15 is vertical heavy process for copper.Alternately, described heavy process for copper can also sink process for copper for level.
In step s 2, as shown in Figure 4, described copper plate 2 attaches dry film 3.Wherein, described dry film 3 covers described copper plate 2 surface integral.Described dry film 3 is a kind of macromolecular compounds, polymer reaction can occur and form stable material under ultraviolet irradiation, thus realizes its function stopping plating and etching.
In step s3, as shown in Figure 5, described dry film 3 to be exposed and development makes described copper plate 2 partial denudation to form golden finger figure 4.Under described dry film 3 being positioned over described ultraviolet, exposure makes it that cross-linking polymerization occur, and described exposed portion is not by the impact of developer solution.The development of described dry film 3 is exactly use certain density developer solution to be dissolved by described dry film 3 unexposed portion, makes described copper plate 2 partial denudation thus forms golden finger figure 4.
In step s 4 which, utilize the conductivity of described copper plate 2, described golden finger figure 3 is electroplated.In electroplating process, do not need additionally to increase electroplate lead wire (not shown), but rely on described copper plate 2 conducting electroplating current, realize at described golden finger figure 3 electroplating surface.Preferably, plating forms the plated material of described golden finger is nickel or gold.Described nickel matter golden finger or golden golden finger have higher resistance to wear, and can reduce contact resistance.
In step s 5, as shown in Figure 6, after removing described dry film 3, the described golden finger 5 of plating on described copper plate 2 is obtained.Preferably, the strong base solution that described dry film 3 adopts is removed.Described strong base solution comprises the satisfactory highly basic of at least one such as NaOH, potassium hydroxide.So, the one end at described golden finger 5 place is the golden finger district 11 of described circuit board 1, and the other end adjacent with described golden finger district 11 is the circuit-line district 13 of described circuit board 1.
After terminating described step S5, obtain the circuit board 1 having golden finger 5 described in tool.As shown in Figure 7, in order on described circuit board 1, etching forms the circuit-line 6 with the conducting of described golden finger 5, described circuit board processing method also comprises step S6.Described step S6 comprises the steps:
Step S61: provide secondary dry film (not shown), is attached at described copper plate 2 and described golden finger 5 surface;
Step S62: expose described secondary dry film and develop, makes described copper plate 2 partial denudation to form the figure (not shown) of the circuit-line of the exposed copper plate of tool 2;
Step S63: provide alkaline etching liquid, etches described exposed copper plate 2; And
Step S64: remove described secondary dry film, obtains having the circuit board 1 with the circuit-line 6 of described golden finger 5 conducting.
It should be noted that, owing to being used in golden finger 5 described in described copper plate 2 electroplating surface, described golden finger 5 and described copper plate 2 there will be difference of height.Described difference of height numerical value depends on the thickness of described golden finger 5, and described in the present embodiment, difference of height is between 5 to 15um.
As shown in Figure 8, the existence due to described difference in height may cause the rear described circuit-line 6 of etching in step S6 to form breach, also may there will be open circuit when serious.Therefore, need to design in the junction 7 of described golden finger 5 and described circuit-line 6 tear and compensate 8 with what improve interface difference of height and ooze erosion, thus ensure the integrality of described circuit-line 6.
Further, described circuit board 1 also needs to carry out a series of subsequent processing operations before finished product packing.In the present embodiment, remove after described secondary dry film obtains having the circuit board 1 of circuit-line and also comprise following arbitrary procedure of processing: automatic optics inspection, the coating of insulation green ink, gong plate, secondary gong plate, flying probe and final quality control.
Should be appreciated that in other alternate embodiments, concrete condition is according to the needs of product, and described subsequent processing operations can also comprise the treatment process needed for other.
Compared to prior art, circuit board processing method provided by the invention adopts dry film process to electroplate described golden finger.Avoid additionally introducing described circuit lead with described copper plate conducting electroplating current in the electroplating process of described golden finger, and the dry film preparation technology of described golden finger can also effectively avoid oozing gold and the golden problem of plating leakage in described golden finger preparation process.Therefore, described circuit board processing method can effectively shorten the production procedure cycle, enhances productivity and product quality.
And, after circuit board processing method provided by the invention electroplates described golden finger, also adopt alkali etching technique to print described circuit-line.The alkali etching technique that described circuit-line is printed can solve the problem that original acid etching liquid medicine corrodes golden face.Further, by compensating at the junction of described golden finger and described circuit-line design tear, improving the described circuit-line that may cause because of the existence of described junction difference in height and occurring open circuit and gap problem.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize specification of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (10)
1. a circuit board processing method, is characterized in that, comprises the steps:
Circuit board is provided, forms copper plate in described circuit board surface;
Dry film is provided, is attached at described copper plate surface;
Described dry film exposed and develops, making described copper plate part surface exposed, and forming golden finger figure at described exposed region, obtaining the circuit board with golden finger figure;
Utilize the conductivity of described copper plate, electroplate in described golden finger patterned surface, form golden finger; And
Remove described dry film, obtain the circuit board with described golden finger.
2. circuit board processing method according to claim 1, is characterized in that, the step that described circuit board surface forms described copper plate comprises the steps:
Multilayer circuit board raw material is provided;
Respectively sawing sheet is carried out to circuit board raw material described in multilayer;
In described circuit board raw material, carry out inner figure transfer printing to form internal layer circuit circuit as the surface of internal layer raw material, and automatic optics inspection is carried out to described internal layer circuit circuit;
Circuit board raw material described in multilayer is carried out folded establishing, and pressing, to form described multilayer circuit board, is then practiced shooting and bore process to described multilayer circuit board further; And
Described multilayer circuit board is carried out heavy process for copper processing, obtains the circuit board covering described copper plate.
3. circuit board processing method according to claim 2, is characterized in that, described heavy process for copper is vertical heavy process for copper.
4. circuit board processing method according to claim 1, is characterized in that, removes described dry film, obtains after having the step of the circuit board of described golden finger and also comprises the steps:
Secondary dry film is provided, is attached at described copper plate and described golden finger surface;
Described secondary dry film is exposed and developed, makes described copper plate partial denudation to form the figure with the circuit-line of exposed copper plate;
Alkaline etching liquid is provided, etches described exposed copper plate; And
Remove described secondary dry film, obtain that there is the circuit board with the circuit-line of described golden finger conducting.
5. circuit board processing method according to claim 4, is characterized in that, designs tear compensate in the junction of described golden finger and described circuit-line.
6. circuit board processing method according to claim 4, is characterized in that, described alkaline etching liquid comprises ammoniacal liquor and ammonium chloride.
7. circuit board processing method according to claim 4, it is characterized in that, remove after described secondary dry film obtains having the step of the circuit board of circuit-line and also comprise following arbitrary procedure of processing: automatic optics inspection, the coating of insulation green ink, gong plate, secondary gong plate, flying probe and final quality control.
8. circuit board processing method according to claim 1, is characterized in that, described golden finger is sectional golden finger.
9. circuit board processing method according to claim 1, is characterized in that, the plated material that plating forms described golden finger is nickel or gold.
10. circuit board processing method according to claim 1, is characterized in that, at the described dry film of removing, obtaining and has in the step of the circuit board of described golden finger, providing strong base solution, for removing described dry film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510070746.4A CN104661446A (en) | 2015-02-10 | 2015-02-10 | Circuit board processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510070746.4A CN104661446A (en) | 2015-02-10 | 2015-02-10 | Circuit board processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104661446A true CN104661446A (en) | 2015-05-27 |
Family
ID=53252002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510070746.4A Pending CN104661446A (en) | 2015-02-10 | 2015-02-10 | Circuit board processing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104661446A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105555047A (en) * | 2016-02-04 | 2016-05-04 | 广州兴森快捷电路科技有限公司 | Method for producing leadless gold-plated circuit board |
| CN107318231A (en) * | 2017-07-20 | 2017-11-03 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of golden finger, printed wiring board |
| CN108366492A (en) * | 2018-01-19 | 2018-08-03 | 深圳崇达多层线路板有限公司 | It is a kind of pre- big without lead electro-plating method based on finger connection position |
| CN113316327A (en) * | 2020-02-27 | 2021-08-27 | 北大方正集团有限公司 | Method for manufacturing golden finger of circuit board and circuit board with golden finger |
| CN113498268A (en) * | 2021-06-07 | 2021-10-12 | 广州广合科技股份有限公司 | Secondary film removing method of circuit board and circuit board |
| CN114980535A (en) * | 2022-06-28 | 2022-08-30 | 珠海杰赛科技有限公司 | Manufacturing method of metal-wrapped microwave shielding circuit board |
| CN115884525A (en) * | 2023-02-10 | 2023-03-31 | 圆周率半导体(南通)有限公司 | Novel gold electroplating process |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009021581A (en) * | 2007-06-15 | 2009-01-29 | Meltex Inc | Buried copper plating method for manufacturing printed circuit board and printed circuit board obtained employing the buried copper plating method |
| CN103687322A (en) * | 2013-12-11 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Method for manufacturing lead-free printed circuit board partially plated with hard gold |
| CN103702526A (en) * | 2013-12-30 | 2014-04-02 | 景旺电子科技(龙川)有限公司 | Method for treating leadless electroplated golden finger |
-
2015
- 2015-02-10 CN CN201510070746.4A patent/CN104661446A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009021581A (en) * | 2007-06-15 | 2009-01-29 | Meltex Inc | Buried copper plating method for manufacturing printed circuit board and printed circuit board obtained employing the buried copper plating method |
| CN103687322A (en) * | 2013-12-11 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Method for manufacturing lead-free printed circuit board partially plated with hard gold |
| CN103702526A (en) * | 2013-12-30 | 2014-04-02 | 景旺电子科技(龙川)有限公司 | Method for treating leadless electroplated golden finger |
Non-Patent Citations (1)
| Title |
|---|
| 陈学平等: "《Protel 2004电路设计与电路仿真》", 31 October 2007 * |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105555047A (en) * | 2016-02-04 | 2016-05-04 | 广州兴森快捷电路科技有限公司 | Method for producing leadless gold-plated circuit board |
| CN105555047B (en) * | 2016-02-04 | 2018-09-25 | 广州兴森快捷电路科技有限公司 | A kind of production method of leadless gold plating wiring board |
| CN107318231A (en) * | 2017-07-20 | 2017-11-03 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of golden finger, printed wiring board |
| CN108366492A (en) * | 2018-01-19 | 2018-08-03 | 深圳崇达多层线路板有限公司 | It is a kind of pre- big without lead electro-plating method based on finger connection position |
| CN108366492B (en) * | 2018-01-19 | 2019-12-13 | 深圳崇达多层线路板有限公司 | leadless electroplating method based on finger connection position pre-enlargement |
| CN113316327A (en) * | 2020-02-27 | 2021-08-27 | 北大方正集团有限公司 | Method for manufacturing golden finger of circuit board and circuit board with golden finger |
| CN113316327B (en) * | 2020-02-27 | 2022-05-10 | 北大方正集团有限公司 | Method for manufacturing golden finger of circuit board and circuit board with golden finger |
| CN113498268A (en) * | 2021-06-07 | 2021-10-12 | 广州广合科技股份有限公司 | Secondary film removing method of circuit board and circuit board |
| CN114980535A (en) * | 2022-06-28 | 2022-08-30 | 珠海杰赛科技有限公司 | Manufacturing method of metal-wrapped microwave shielding circuit board |
| CN115884525A (en) * | 2023-02-10 | 2023-03-31 | 圆周率半导体(南通)有限公司 | Novel gold electroplating process |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104661446A (en) | Circuit board processing method | |
| CN103619125B (en) | A kind of PCB electro-plating method for improving electroplating evenness | |
| CN108617104B (en) | Method for manufacturing printed circuit board with thickened copper local pattern | |
| CN104411106B (en) | A kind of preparation method of printed circuit board fine-line | |
| CN101702869B (en) | Method for directly producing circuit boards from insulated substrate without cladding copper | |
| CN105704948B (en) | The production method of ultra-thin printed circuit board and ultra-thin printed circuit board | |
| CN112739069B (en) | Method for improving incomplete stripping of electroplated copper layer | |
| CN113056116A (en) | Method for plating hole copper and processing method of circuit board | |
| CN108882558A (en) | The gold plating method and golden finger circuit board of golden finger | |
| US10426039B2 (en) | Method for stencil printing during manufacture of printed circuit board | |
| CN104812178A (en) | Manufacturing method for circuit board with segmented metal pin | |
| KR830008634A (en) | Manufacturing method of thick film fine pattern conductor | |
| KR20120007909A (en) | Printed wiring board manufacturing method | |
| CN111787708A (en) | Manufacturing method of high-low copper PAD circuit board | |
| CN105282985A (en) | Circuit board single-sided local gold plating method and circuit board | |
| US8074352B2 (en) | Method of manufacturing printed circuit board | |
| CN104703401A (en) | Circuit board electroplating method | |
| CN110769609A (en) | Photosensitive film hole plugging plate and PCB resin hole plugging method | |
| CN110944454A (en) | Circuit board production process | |
| CN110545634A (en) | Manufacturing method of multilayer fine circuit board with circuit being firstly made and then plated with hole copper | |
| CN104968158A (en) | Thick copper foil fine line fine pitch circuit board outer line processing method | |
| CN112672543B (en) | Method for separating electroplated copper layer | |
| KR101201948B1 (en) | The printed circuit board manufacturing method | |
| CN210042390U (en) | Double-sided flexible circuit board of upper and lower layers of conductive silver paste | |
| KR100990575B1 (en) | Printed circuit board having fine pattern and manufacturing method of the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150527 |
|
| RJ01 | Rejection of invention patent application after publication |