CN105744737A - Circuit board processing method and circuit board - Google Patents
Circuit board processing method and circuit board Download PDFInfo
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- CN105744737A CN105744737A CN201410767565.2A CN201410767565A CN105744737A CN 105744737 A CN105744737 A CN 105744737A CN 201410767565 A CN201410767565 A CN 201410767565A CN 105744737 A CN105744737 A CN 105744737A
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Abstract
The invention provides a circuit board processing method and a circuit board, relates to the electronic circuit technology field and solves problems of low welding strength and poor welding reliability existing in a plugging portion of a perforation reflux device on a circuit board in the prior art. The method comprises steps that a substrate and a reinforcing board are bonded through an adhesion agent, the circuit board after bonding is drilled to acquire a to-be-electroplated through hole, the through hole is electroplated, and etching processing on the circuit board after electroplating is carried out. The method is used for processing the circuit board.
Description
Technical field
The present invention relates to electronic circuit technology field, particularly relate to processing method and the circuit board of a kind of circuit board.
Background technology
Flexible PCB (FlexiblePrintedCircuitBoard, FPC) refers to the printed circuit board (PCB) adopting flexible insulation base material such as polyimides or mylar to make, and has the features such as distribution density is high, suppleness is high, thickness is thin, intensity is low.Wherein, adopt single-side brass plate material to complete to cover afterwards layer protecting film at circuit, form the flexible PCB of a kind of only single-conductor, be one side FPC.And owing to one side FPC adopts flexible parent metal, its suppleness is high, intensity is low, make the backflow device of the perforation on one side FPC not easily fixing and easily lose, so that improved the weld strength of perforation backflow device plugging position by stiffening plate, ensureing that perforation backflow device is not easily lost simultaneously.
In prior art, on one side FPC, the stiffening plate of the electroplating ventilating hole of perforation backflow device needs at printed circuit board (PrintedCircuitBoard, PCB) producer carries out holing, electroplates and after the processed such as etching, be delivered to FPC producer as a material.FPC producer and then the device plugging position corresponding position boring that refluxes with perforation on one side FPC substrate, and after the processed such as overetch, when ensureing the lead to the hole site alignment that boring obtains, one side FPC substrate after processed and stiffening plate are overlapped and are bonded together by solid, form a through hole running through one side FPC substrate and stiffening plate, thus the plugging position of perforation backflow device is welded.Wherein, in prior art, the overall profile of the one side FPC substrate rear circuit board that formed bonding with stiffening plate may refer to Fig. 1.
Owing in prior art, stiffening plate and one side FPC substrate bond together after being processed process respectively, stiffening plate with one side FPC substrate bonding before carried out electroplating processes, thus the hole wall surface of stiffening plate has copper plate, and one side FPC substrate did not carry out electroplating processes before bonding with stiffening plate, thus the hole wall surface of the one side FPC substrate after processed does not have copper plate, only contain copper plate in the porose disc position of the circuit board surface comprising circuit.Wherein, in running through the one side FPC substrate whole through-hole wall with stiffening plate, the surface of solid is also without copper plate, so that it is discontinuous with the copper plate of the whole through-hole wall of stiffening plate to run through one side FPC substrate, namely the copper between one side FPC substrate and stiffening plate does not plan a successor, again due to hole wall surface exist copper place could by soldering paste with perforation backflow device plugging position weld, having thus resulted in perforation backflow device plugging position weld strength low, soldering reliability is poor.Additionally, stiffening plate to be processed uses as a material in the manufacturing process of one side FPC, it is necessary to prepare in advance, thus increase the fabrication cycle of one side FPC.
Summary of the invention
The present invention provides processing method and the circuit board of a kind of circuit board, it is possible to the weld strength of perforation backflow device plugging position solving to cause owing to circuit board through-hole inner wall copper plating layer is discontinuous in prior art is low, the problem of soldering reliability difference.
For reaching above-mentioned purpose, embodiments of the invention adopt the following technical scheme that
First aspect, it is provided that a kind of circuit board, described circuit board by substrate is first passed through with stiffening plate solid bonding after carry out drill hole reason, be all coated with metal inside the hole wall of the through hole obtained after boring.
In conjunction with first aspect, in the first mode in the cards of first aspect, described metal is copper, described substrate is single substrate, described single substrate includes front surface and back surface, described front surface is coated with copper, the non-copper facing of described back surface, and the back surface of described substrate is bonding by described solid with described stiffening plate.
The first possible implementation in conjunction with first aspect or first aspect, in the second mode in the cards of first aspect, described stiffening plate is single-side reinforced plate or two-sided stiffening plate, and described single-side reinforced plate one side covers copper, described two-sided stiffening plate double-sided copper-clad；
Wherein, if described stiffening plate is described single-side reinforced plate, then do not cover the surface of copper with described stiffening plate bonding by described solid for described substrate.
In conjunction with first aspect, in the third mode in the cards of first aspect, described circuit board is by obtaining after being etched the front surface of described substrate and the non-gluing of surfaces of described stiffening plate processing after to described through hole copper facing.
Second aspect, the embodiment of the present invention provides the processing method of a kind of circuit board, including:
Substrate is undertaken bonding with stiffening plate by solid；
Circuit board after bonding is holed, obtains the through hole of electroplated；
Described through hole is carried out electroplating processes；
It is etched the circuit board after electroplating processes processing.
In conjunction with second aspect, in the first mode in the cards of second aspect, described substrate is single substrate, and described single substrate includes front surface and back surface, and described front surface is coated with copper, the non-copper facing of described back surface.
The first possible implementation in conjunction with second aspect or second aspect, in the second mode in the cards of second aspect, described stiffening plate is single-side reinforced plate or two-sided stiffening plate, and described single-side reinforced plate one side covers copper, described two-sided stiffening plate double-sided copper-clad.
In conjunction with the implementation that the second of second aspect is possible, in the third mode in the cards of second aspect, if described stiffening plate is single-side reinforced plate, then described described substrate is carried out bonding including with stiffening plate by solid:
The copper surface of not covering of the back surface of described single substrate and described single-side reinforced plate is undertaken bonding by described solid.
In conjunction with second aspect, in the 4th kind of mode in the cards of second aspect, described described through hole carried out electroplating processes include:
To copper facing equal inside the hole wall of described through hole.
In conjunction with the first possible implementation of second aspect, in the 5th kind of mode in the cards of second aspect, described circuit board after electroplating processes be etched process include:
It is etched processing to the surface that the front surface of described circuit board and described stiffening plate are not bonding, to form circuit at the front surface of described circuit board and to remove described stiffening plate not bonding surface copper except porose disc.
Therefore, the processing method of a kind of circuit board that the embodiment of the present invention provides and circuit board, the substrate of circuit board is passed through with stiffening plate solid bonding after, make as a whole carrying out and hole, electroplate and etch processes, obtain circuit board.nullWherein，The substrate of circuit board is made with stiffening plate as a whole together with carry out electroplating processes，Can ensure that the through-hole wall of the substrate after the electroplating processes running through whole circuit board that boring obtains and stiffening plate is all coated with metal，This metal can be copper，Make the circuit board obtained can form a complete electroplating ventilating hole，So that in the welding process of perforation backflow device plugging position，Whole through-hole wall continuous print copper plate all can be welded by the plugging position of soldering paste with perforation backflow device，Avoid the substrate of circuit board and stiffening plate are processed by prior art respectively process again bonding after，Run through and all there is no copper plate inside the substrate of whole circuit board and the through-hole wall solid surface of stiffening plate and through-hole wall substrate，Make through-hole wall copper plate discontinuous，Thus the weld strength of the perforation backflow device plugging position caused is low，The problem of soldering reliability difference.In addition, the substrate of circuit board is carried out with stiffening plate bonding after make as a whole to carry out together holing, electroplate, the processed such as etching, avoid stiffening plate to be processed in prior art to need to prepare in advance as a material in circuit board making process, and the problem of the circuit board making cycle length caused.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the overall profile of a kind of circuit board of the prior art；
The overall profile of a kind of circuit board that Fig. 2 a provides for the embodiment of the present invention；
The overall profile of the another kind of circuit board that Fig. 2 b provides for the embodiment of the present invention；
The processing method flow chart of a kind of circuit board that Fig. 3 provides for the embodiment of the present invention；
A kind of stiffening plate profile that Fig. 4 a provides for the embodiment of the present invention；
The another kind of stiffening plate profile that Fig. 4 b provides for the embodiment of the present invention；
Fig. 5 is the top view of a kind of stiffening plate of the prior art；
The top view of a kind of stiffening plate that Fig. 6 provides for the embodiment of the present invention；
The profile of a kind of stiffening plate that Fig. 7 a provides for the embodiment of the present invention；
The profile of the another kind of stiffening plate that Fig. 7 b provides for the embodiment of the present invention.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is explicitly described, it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of protection of the invention.
The technical scheme that the embodiment of the present invention provides can apply to the various circuit board needing stiffening plate, including flexible PCB FPC and printing board PCB.Owing to FPC adopts flexible parent metal, its suppleness is high, intensity is low so that the perforation backflow device on FPC is not easily fixing and easily loses, so that improved the weld strength of perforation backflow device plugging position by stiffening plate.And the thickness of some thin PCB is thin, intensity is low, need also exist for being improved the weld strength of perforation backflow device plugging position by stiffening plate.
The embodiment of the present invention provides a kind of circuit board 200, circuit board 200 by substrate 210 is first passed through with stiffening plate 220 solid 230 bonding after carry out drill hole reason, be all coated with metal 250 inside the hole wall of the through hole 240 obtained after boring.
Concrete, stiffening plate 220 and the surface that solid 230 contacts pass through with substrate 210 solid 230 bonding after, stiffening plate 220 make with substrate 210 as a whole together with carry out holing, electroplating and etch processes.On circuit board 200, the metal 250 of through hole 240 inwall that the plugging position of perforation backflow device is obtained with boring by soldering paste welds, and this metal can be copper, it is also possible to for gold etc..
Alternatively, the substrate 210 in the embodiment of the present invention can be single substrate, and including front surface and back surface, front surface is coated with copper, the non-copper facing of back surface, and the back surface of substrate 210 is bonding by solid 230 with stiffening plate 220.Wherein, the circuit board 200 by obtaining after substrate 210 is processed process can be one side FPC or one side PCB.
Alternatively, the stiffening plate 220 in the embodiment of the present invention, it is possible to for single-side reinforced plate or two-sided stiffening plate, single-side reinforced plate one side covers copper, two-sided stiffening plate double-sided copper-clad；Wherein, if stiffening plate 220 is single-side reinforced plate, then do not cover the surface of copper with stiffening plate 220 bonding by solid 230 for substrate 210.
The circuit board 200 that the embodiment of the present invention provides, is by obtaining after the front surface of substrate 210 and the non-gluing of surfaces of stiffening plate 220 are etched process after to through hole 240 copper facing.Wherein, completing after etching obtains circuit board 200, as shown in Figure 2 a, the profile of a kind of circuit board 200 obtained by single-side reinforced plate 2202 is as shown in Figure 2 b for the profile of a kind of circuit board 200 that the embodiment of the present invention is obtained by two-sided stiffening plate 2201.It should be noted that substrate 210 is no longer the substrate after sawing sheet in Fig. 2 a and Fig. 2 b, but by bonding with stiffening plate for the substrate after sawing sheet and carry out holing, electroplate, substrate after the processed such as etching.Here the substrate after sawing sheet be do not carry out holing, electroplate, etch before the initial material cut out.
Therefore, the circuit board 200 that the embodiment of the present invention provides, substrate 210 and stiffening plate 220 is passed through solid 230 bonding after make as a whole carrying out and hole, electroplate and etch processes, obtain circuit board 200.nullWherein，Substrate 210 is made with stiffening plate 220 as a whole together with carry out electroplating processes，Can ensure that through hole 240 inwall of the substrate 210 after the electroplating processes running through circuit board 200 that boring obtains and stiffening plate 220 is all coated with metal 250，Make the circuit board 200 obtained can form a complete electroplating ventilating hole 240，So that in the welding process of perforation backflow device plugging position，Whole through hole 240 inwall continuous print metal 250 all can be welded by the plugging position of soldering paste with perforation backflow device，Avoid circuit board substrate 210 and stiffening plate 220 are processed by prior art respectively process again bonding after，Run through the substrate 210 of whole circuit board 200 and the surface of the through hole 240 inwall solid 230 of stiffening plate 220，And all there is no metal 250 inside through hole 240 inwall substrate 210，The metal 250 making through hole 240 inwall is discontinuous，Thus the weld strength of the perforation backflow device plugging position caused is low，The problem of soldering reliability difference.In addition, substrate 210 is carried out with stiffening plate 220 bonding after make as a whole to carry out together holing, electroplate, the processed such as etching, thus obtaining circuit board 200, avoid stiffening plate 220 to be processed in prior art to need to prepare in advance as a material in circuit board 200 manufacturing process, and the problem of the circuit board 200 fabrication cycle length caused.
Referring to Fig. 3, the embodiment of the present invention provides the processing method of a kind of circuit board, and key step may include that
301, substrate is undertaken bonding with stiffening plate by solid.
Substrate in this step refers in circuit board making process, utilizes the substrate after the sawing sheet such as automatic shearing machine or hobboing cutter segment cutter, and sawing sheet therein refers to, according to different product dimension layout design result, substrate divides the size being cut into needs.Exemplary, substrate can be base material-copper foil structure and copper-clad plate, or base material-native gold structure etc., substrate material therein can be flexible insulating material such as polyimides or polyester, it is also possible to be glass fibre, pottery etc..Substrate in the embodiment of the present invention will illustrate for copper-clad plate, but the concrete material of substrate is not limited.
Exemplary, in the embodiment of the present invention, the substrate of circuit board can be single substrate, and including front surface and back surface, front surface is coated with copper, the non-copper facing of back surface.Wherein, copper front surface plated is in order to etch the circuit on circuit board.The circuit board formed by single substrate can be such as one side FPC or one side PCB.The embodiment of the present invention will illustrate for one side FPC substrate and one side FPC.
Stiffening plate can improve intensity and the thickness of circuit board corresponding site, improves the weld strength of perforation backflow device on circuit board.Stiffening plate in the embodiment of the present invention can adopt the various materials such as polyester stiffening plate, polyimides stiffening plate, glass fiber-reinforced plate, politef stiffening plate, Merlon stiffening plate.The kind of stiffening plate is not limited by the embodiment of the present invention.
Alternatively, stiffening plate can be single-side reinforced plate or two-sided stiffening plate, and single-side reinforced plate one side covers copper, two-sided stiffening plate double-sided copper-clad.
Exemplary, the structure at two-sided copper clad laminate (Copper-cladLaminate, the CCL) stiffening plate being covered with Copper Foil of Kapton may refer to Fig. 4 a, and the upper and lower surface black part submeter of stiffening plate shows stiffening plate double-sided copper-clad；The structure of the CCL stiffening plate being covered with Copper Foil at Kapton one side may refer to Fig. 4 b, and one of them surface of stiffening plate is that black represents that this surface of stiffening plate is covered with Copper Foil.
Exemplary, can be undertaken bonding by the red glue in solid such as thermmohardening reinforced rubber sheet between one side FPC substrate and two-sided stiffening plate.Concrete, point gum machine can be passed through and utilize compression air, by red glue through on special Glue dripping head point to the one side not covering copper and back surface of one side FPC substrate, and carry out with one side FPC substrate on the surface of bonding two-sided stiffening plate, and utilize pre-attaching machine to heat to uniform temperature, red glue is made to start to solidify and hardening, thus one side FPC substrate and two-sided stiffening plate being bonded together.In bonding process, it is also possible to utilize vacuum machine to make two-sided stiffening plate and one side FPC substrates into intimate press together by suitable pressure or evacuation.It is of course also possible to red glue is coated on the surface of one side FPC substrate and the two-sided stiffening plate wanting bonding by modes such as silk screen printing or pin turn.In addition, solid between one side FPC substrate and two-sided stiffening plate can also is that pressure sensitive reinforced rubber sheet, without heating, can manually one side FPC substrate be carried out bonding with two-sided stiffening plate joint tool, and by cold press, one side FPC substrate and two-sided stiffening plate can be carried out tight pressing.The kind of solid is not limited by the embodiment of the present invention.
Alternatively, if stiffening plate is single-side reinforced plate, then substrate can be carried out bonding including with stiffening plate by solid: undertaken bonding by the copper surface of not covering of the back surface of single substrate and single-side reinforced plate by solid.Exemplary, for one side FPC substrate, if stiffening plate is single-side reinforced plate, then can being undertaken bonding by solids such as red glue by the surface that copper is not covered with single-side reinforced plate in the surface not covering copper of one side FPC substrate, concrete bonding process may refer to the bonding process of above-mentioned two-sided stiffening plate.
302, the circuit board after bonding is holed, obtain the through hole of electroplated.
Bonding by solid and tight pressing one side FPC substrate can make with stiffening plate as a whole together with hole, thus obtaining the through hole running through one side FPC substrate and stiffening plate of electroplated, namely obtain running through one side FPC substrate and stiffening plate bonding after the through hole of whole circuit board that obtains, here stiffening plate can be single-side reinforced plate, it is also possible to be two-sided stiffening plate.Wherein, boring can be undertaken by hole creating technologies such as digital control hole drilling, plasma boring, laser drill, punchings.The shape of through hole that boring obtains can be circular, oval etc., and diameter can be 0.4mm, 0.5mm etc., specifically can determine as desired, and the embodiment of the present invention does not limit.
It should be noted that, prior art is by processed after substrate and when the through hole alignment of stiffening plate after processed, substrate and stiffening plate are carried out bonding, error is would be likely to occur due in the process alignd by above-mentioned through hole, solid bonding location of solid when adhesive base plate and stiffening plate is likely to can exist error, and it is projected into through hole owing to solid is likely to be due to be squeezed in bonding process, thus result in bonding after through hole diminish, even through hole is blocked, thus cannot be carried out the welding of perforation backflow device plugging position, so that undertaken inside contracting process by solid in through hole, referring to Fig. 1.The embodiment of the present invention substrate and stiffening plate are carried out bonding after just punch, can ensure that when punching solid and substrate and stiffening plate maintenance are alignd, thus through hole solid be made without inside contracting, it is possible to referring to Fig. 2.
303, through hole is carried out electroplating processes.
After obtaining running through the one side FPC substrate through hole with stiffening plate by holing in step 302, it is possible to by all copper facing inside the electroplating process hole wall to through hole.
Wherein, electro-coppering can improve the uniformity of through-hole wall copper plate, can first carry out heavy copper facing before electro-coppering, makes the deposition thin copper of last layer in through hole, in order to can use as the conductor in electrolytic process when electro-coppering.In electro-coppering process, it is possible to use electrolysis principle plates one layer of thin copper again in heavy copper coatings.Concrete, can passing through fixture by the one side FPC substrate after bonding and boring and stiffening plate clamping, the copper ion in electrolytic solution is as anode, and through hole to be plated is as negative electrode, cation is formed copper plate in through-hole surfaces to be plated reduction, so that via metal.
Wherein, one side FPC substrate is made with stiffening plate as a whole together with carry out electroplating processes, can ensure that the through-hole wall running through the substrate after one side FPC electroplates and stiffening plate that boring obtains all is coated with copper, thus forming a complete electroplating ventilating hole, making in the welding process of perforation backflow device plugging position, whole through-hole wall continuous print copper plate all can be welded by the plugging position of soldering paste with perforation backflow device.And one side FPC substrate is carried out holing, etching by prior art respectively, undertaken stiffening plate holing, electroplate, bonding again after the processed such as etching, so that run through in the through-hole wall of circuit board, the hole wall surface of the one side FPC substrate after processed does not have copper plate, the surface of solid is also without copper plate, only containing copper plate in the porose disc position of the circuit board surface comprising circuit and stiffening plate hole wall surface, namely the copper plate of through-hole wall does not plan a successor.Do not plan a successor so that the copper plate discontinuous phase ratio of through-hole wall with the copper plate of through-hole wall in prior art, the processing method of the circuit board that the embodiment of the present invention provides, the copper plate of the through-hole wall running through one side PFC substrate and stiffening plate is continuous print, do not have tomography, thus the weld strength of perforation backflow device plugging position can be improved, avoid in prior art owing to through-hole wall copper plate is discontinuous, and the weld strength of the perforation backflow device plugging position caused is low, the problem of soldering reliability difference.
304, it is etched the circuit board after electroplating processes processing.
Complete electroplating process, and after the processed such as patch dry film, para-position, exposure, development, can be etched the surface that the front surface of circuit board and stiffening plate are not bonding processing, to form circuit at the front surface of circuit board and to remove stiffening plate not bonding surface copper except porose disc.Concrete, can be at a certain temperature, by the high-pressure nozzle of etching machine, etching liquid medicine jet is poured the front surface of one side FPC, to etch away unwanted part, the copper plate of reserved line part, and etching liquid medicine jet is poured the surface that stiffening plate is not bonding, etch away the copper beyond porose disc, to prevent impression of the hand, greasy dirt etc. from affecting the attractive in appearance of stiffening plate.Wherein, profile overall with two-sided stiffening plate for one side FPC after completing etching in the embodiment of the present invention may refer to Fig. 2 a；Profile overall with single-side reinforced plate for one side FPC after completing etching may refer to Fig. 2 b, and wherein the black part in Fig. 2 a and Fig. 2 b is divided into copper, and all there is copper on the surface that namely through-hole wall, porose disc and stiffening plate are bonding with one side FPC.
In one side FPC production process, the processed such as stiffening plate of the prior art needs to carry out in advance to hole as a material, electroplates, etching, and then one side FPC substrate is holed, after the processed such as etching, the one side FPC substrate after processed is carried out bonding with stiffening plate.Namely one side FPC substrate and stiffening plate need to be processed respectively processing, thus need through twice processed flow process in one side FPC production process.Need compared with twice processed flow process with prior art, in embodiments of the present invention, make after one side FPC substrate is bonding with stiffening plate as a whole together with carry out holing, electroplate and the processed such as etching, namely one side FPC manufacturing process has only to through time processing handling process, thus the process-cycle of one side FPC can be shortened, need to prepare in advance thus avoiding stiffening plate in prior art to use as a material, and the one side FPC Product processing cycle caused is long.
Additionally, stiffening plate of the prior art needs individually to be etched processing, on two surfaces of the stiffening plate after etching, except porose disc, the copper plate of other parts is all etched, and the profile of the stiffening plate after etching in prior art may refer to Fig. 1.From the side with the stiffening plate of one side FPC substrate bonding, the top view of stiffening plate may refer to Fig. 5, and wherein, black part is divided into the copper on porose disc, and on stiffening plate, the copper in other region except black part is all etched；Never seeing with the side of the stiffening plate of one side FPC substrate bonding, the top view of stiffening plate is consistent with Fig. 5.
In embodiments of the present invention, for two-sided stiffening plate, due to one side FPC substrate and two-sided stiffening plate be bonding after make as a whole being etched, all do not fallen by the moment with the surface of the two-sided stiffening plate of one side FPC substrate bonding copper plate except porose disc, never see with the side of the two-sided stiffening plate of one side FPC substrate bonding, the top view of two-sided stiffening plate is consistent with prior art, it is possible to referring to Fig. 5.And spray can be avoided to etching medicinal liquid with the surface of the two-sided stiffening plate of one side FPC substrate bonding, thus the copper plate on its surface can be remained by complete, from the side with the two-sided stiffening plate of one side FPC substrate bonding, the top view of two-sided stiffening plate may refer to Fig. 6.Different from Fig. 5, black part in Fig. 6 and on two-sided stiffening plate other region beyond through hole include porose disc part and all have copper so that and the complete copper plate that do not etch of the surface of the two-sided stiffening plate of one side FPC substrate bonding can form the screen layer of shielding interference (such as signal disturbing between plate).Simultaneously because the complete copper plate not etched with the two-sided stiffening plate surface of one side FPC substrate bonding is near the line layer of one side FPC, and it is electrically connected by through hole and line layer, thus can as the ground end of line layer signal, such that it is able to reduce the distance of signal backflow, shorten the time of signal backflow, reduce the interference of signal on one side FPC line layer.Additionally, under when FPC being designed in order to need the effects such as screen layer two-sided FPC, the embodiment of the present invention can reach same effect by the one side FPC mode adding stiffening plate, thus the dual platen in this kind of situation can be made into single sided board and make, such that it is able to reduce cost of manufacture.Wherein, in the circuit board processing method that the embodiment of the present invention provides, the two-sided stiffening plate profile after etching may refer to Fig. 7 a.By Fig. 7 a it can be seen that copper is contained on the surface of two-sided stiffening plate and one side FPC substrate bonding, there is copper another side perforated tray position.
And in embodiments of the present invention, for single-side reinforced plate, due to one side FPC substrate and single-side reinforced plate do not cover copper surface bonding after make as a whole being etched, all do not fallen by the moment with the surface of the single-side reinforced plate of one side FPC substrate bonding copper plate except porose disc, never see with the side of the single-side reinforced plate of one side FPC substrate bonding, the top view of single-side reinforced plate is consistent with prior art, it is possible to referring to Fig. 5.And do not cover copper with the surface of the single-side reinforced plate of one side FPC substrate bonding, thus its surface does not have copper plate, thus can not as two-sided stiffening plate, shielding or the effect of signal backflow can be played, from the side with the single-side reinforced plate of one side FPC substrate bonding, the top view of single-side reinforced plate still may refer to Fig. 5, and the single-side reinforced plate profile after etching may refer to Fig. 7 b, can be seen that by Fig. 7 b the surface of single-side reinforced plate and one side FPC substrate bonding does not have copper, there is copper another side perforated tray position.
Exemplary, in the embodiment of the present invention, the shape of porose disc can be circular, oval, square etc., and size can be determined according to specific needs, and the embodiment of the present invention does not limit.
It should be noted that the embodiment of the present invention illustrates for one side FPC, the processing method of the circuit board that the embodiment of the present invention provides, it is also possible to for other circuit board such as one side PCB needing stiffening plate, the embodiment of the present invention does not limit.
In addition, the processing method of the circuit board that the embodiment of the present invention provides, it is applicable not only to the scene needing stiffening plate to improve perforation backflow device plugging position weld strength, the scene of stiffening plate is needed for other, such as, when circuit board needs locally padded scene, the copper plate that the stiffening plate surface bonding with circuit board that can also be provided by the embodiment of the present invention is not etched is used as the ability of signal disturbing between the anti-plate that screen layer improves, and shortens the backflow distance of signal on circuit board simultaneously.
Therefore, the processing method of a kind of circuit board that the embodiment of the present invention provides, one side FPC substrate is passed through with stiffening plate solid bonding after, make as a whole carrying out and hole, electroplate and etch processes, obtain one side FPC circuit board.nullWherein，The substrate of one side FPC is made with stiffening plate as a whole together with carry out electroplating processes，Can ensure that the through-hole wall of the one side FPC substrate after the electroplating processes running through whole circuit board that boring obtains and stiffening plate is all coated with copper，Make the one side FPC circuit board obtained can form a complete electroplating ventilating hole，So that in the welding process of perforation backflow device plugging position，Whole through-hole wall continuous print copper plate all can be welded by the plugging position of soldering paste with perforation backflow device，Avoid one side FPC substrate and stiffening plate are processed by prior art respectively process again bonding after，Run through and all there is no copper plate inside the substrate of whole one side FPC and the through-hole wall solid surface of stiffening plate and through-hole wall one side FPC substrate，Make through-hole wall copper plate discontinuous，Thus the weld strength of the perforation backflow device plugging position caused is low，The problem of soldering reliability difference.In addition, one side FPC substrate is carried out with stiffening plate bonding after make as a whole to carry out together holing, electroplate, the processed such as etching, avoid stiffening plate to be processed in prior art to need to prepare in advance as a material in one side FPC manufacturing process, and the one side FPC fabrication cycle caused is long.
In several embodiments provided herein, it should be understood that disclosed circuit board and method, it is possible to realize by another way.Such as, circuit board embodiment described above is merely schematic.The all or part of step realizing said method embodiment can be completed by the hardware that programmed instruction is relevant, and aforesaid program can be stored in a computer read/write memory medium, and this program upon execution, performs to include the step of said method embodiment；And aforesaid storage medium includes: USB flash disk, portable hard drive, read only memory (ReadOnlyMemory, be called for short ROM), random access memory (RandomAccessMemory, be called for short RAM), the various media that can store program code such as magnetic disc or CD.
The above; being only the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, any those familiar with the art is in the technical scope that the invention discloses; change can be readily occurred in or replace, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should described be as the criterion with scope of the claims.
Claims (10)
1. a circuit board, it is characterised in that described circuit board by substrate is first passed through with stiffening plate solid bonding after carry out drill hole reason, be all coated with metal inside the hole wall of the through hole obtained after boring.
2. circuit board according to claim 1, it is characterized in that, described metal is copper, described substrate is single substrate, described single substrate includes front surface and back surface, described front surface is coated with copper, the non-copper facing of described back surface, and the back surface of described substrate is bonding by described solid with described stiffening plate.
3. circuit board according to claim 1 and 2, it is characterised in that described stiffening plate is single-side reinforced plate or two-sided stiffening plate, described single-side reinforced plate one side covers copper, described two-sided stiffening plate double-sided copper-clad；
Wherein, if described stiffening plate is described single-side reinforced plate, then do not cover the surface of copper with described stiffening plate bonding by described solid for described substrate.
4. circuit board according to claim 1, it is characterised in that described circuit board is by obtaining after being etched the front surface of described substrate and the non-gluing of surfaces of described stiffening plate processing after to described through hole copper facing.
5. the processing method of a circuit board, it is characterised in that including:
Substrate is undertaken bonding with stiffening plate by solid；
Circuit board after bonding is holed, obtains the through hole of electroplated；
Described through hole is carried out electroplating processes；
It is etched the circuit board after electroplating processes processing.
6. method according to claim 5, it is characterised in that described substrate is single substrate, described single substrate includes front surface and back surface, and described front surface is coated with copper, the non-copper facing of described back surface.
7. the method according to claim 5 or 6, it is characterised in that described stiffening plate is single-side reinforced plate or two-sided stiffening plate, described single-side reinforced plate one side covers copper, described two-sided stiffening plate double-sided copper-clad.
8. method according to claim 7, it is characterised in that if described stiffening plate is single-side reinforced plate, then described carry out bonding include with stiffening plate by solid by described substrate:
The copper surface of not covering of the back surface of described single substrate and described single-side reinforced plate is undertaken bonding by described solid.
9. method according to claim 5, it is characterised in that described described through hole is carried out electroplating processes include:
To copper facing equal inside the hole wall of described through hole.
10. method according to claim 6, it is characterised in that described circuit board after electroplating processes is etched process includes:
It is etched processing to the surface that the front surface of described circuit board and described stiffening plate are not bonding, to form circuit at the front surface of described circuit board and to remove described stiffening plate not bonding surface copper except porose disc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410767565.2A CN105744737A (en) | 2014-12-12 | 2014-12-12 | Circuit board processing method and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410767565.2A CN105744737A (en) | 2014-12-12 | 2014-12-12 | Circuit board processing method and circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN105744737A true CN105744737A (en) | 2016-07-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410767565.2A Pending CN105744737A (en) | 2014-12-12 | 2014-12-12 | Circuit board processing method and circuit board |
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| Country | Link |
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| CN (1) | CN105744737A (en) |
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| CN108093562A (en) * | 2018-01-10 | 2018-05-29 | 维沃移动通信有限公司 | A kind of circuit board and preparation method thereof |
| CN109413849A (en) * | 2018-11-20 | 2019-03-01 | 北京羽扇智信息科技有限公司 | Porose disc and its manufacturing method, printed circuit board for printed circuit board |
| CN112118681A (en) * | 2019-06-20 | 2020-12-22 | 北京梦之墨科技有限公司 | Manufacturing method of circuit board |
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| CN101668382A (en) * | 2009-09-30 | 2010-03-10 | 深圳华为通信技术有限公司 | Flexible printed circuit board and terminal |
| JP2013239565A (en) * | 2012-05-15 | 2013-11-28 | Yamaichi Electronics Co Ltd | Flexible wiring board with reinforcement plate and manufacturing method of the same |
| CN103841752A (en) * | 2012-11-23 | 2014-06-04 | 易鼎股份有限公司 | Welding structure of flexible circuit board and connector |
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| JP2006228902A (en) * | 2005-02-16 | 2006-08-31 | Sumitomo Bakelite Co Ltd | Flexible printed wiring board with stiffening plate |
| CN101321430A (en) * | 2007-06-04 | 2008-12-10 | 鸿富锦精密工业（深圳）有限公司 | Circuit board assembly and manufacturing method thereof |
| CN101668382A (en) * | 2009-09-30 | 2010-03-10 | 深圳华为通信技术有限公司 | Flexible printed circuit board and terminal |
| JP2013239565A (en) * | 2012-05-15 | 2013-11-28 | Yamaichi Electronics Co Ltd | Flexible wiring board with reinforcement plate and manufacturing method of the same |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108093562A (en) * | 2018-01-10 | 2018-05-29 | 维沃移动通信有限公司 | A kind of circuit board and preparation method thereof |
| CN108093562B (en) * | 2018-01-10 | 2019-11-05 | 维沃移动通信有限公司 | A kind of circuit board and preparation method thereof |
| CN109413849A (en) * | 2018-11-20 | 2019-03-01 | 北京羽扇智信息科技有限公司 | Porose disc and its manufacturing method, printed circuit board for printed circuit board |
| CN112118681A (en) * | 2019-06-20 | 2020-12-22 | 北京梦之墨科技有限公司 | Manufacturing method of circuit board |
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Application publication date: 20160706 |