CN205305226U - Blue offset printing brush aluminum mesh in circuit board super large hole - Google Patents
Blue offset printing brush aluminum mesh in circuit board super large hole Download PDFInfo
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- CN205305226U CN205305226U CN201520933908.8U CN201520933908U CN205305226U CN 205305226 U CN205305226 U CN 205305226U CN 201520933908 U CN201520933908 U CN 201520933908U CN 205305226 U CN205305226 U CN 205305226U
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- hole
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- offset printing
- printing brush
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Abstract
The utility model discloses a blue offset printing brush aluminum mesh in circuit board super large hole, round hole in waiting to fill blue component hole of gluing in a plurality of centres of a circle, it is a plurality of it is mutually from setting up, a plurality of between the round hole the round hole with the component hole is crossing. Blue offset printing brush aluminum mesh in circuit board super large hole changes a plurality of little round holes that leave mutually into through a big round hole with among the prior art, because the same with the blue printing technology that glues among the prior art, blue thickness of gluing is the same, and obvious the reduction is glued to printing blue on the component hole for volume on the blue gluey circuit sheet -metal elements hole of biting reduces, avoids too much blue glue to pile up and permeate circuit sheet -metal elements hole bottom, pollutes the face. Keep the blue volume of biting of gluing of the best simultaneously, make blue glue of biting out from a plurality of round holes produce desmoplasia surface tension to the circuit board specified region's of cover cover is treated in the completion, has save and has pasted high temperature resistant red sticky tape, the waste of peeling off the manpower and material resources of red sticky tape after toasting again before the printing blue among the prior art is glued.
Description
Technical field
This utility model relates to circuit Baphicacanthus cusia offset printing dataller's technology field, particularly relates to a kind of circuit board super big hole indigo plant offset printing brush aluminum net.
Background technology
Blue glue typography is after board production finished product, for the needs of client welding, need to carry out interim protection for local pad. This application is very extensive. But, the insert hole that part is bigger, to clog and be coated with blue glue extremely difficult and time-consuming.
Method step commonly used in existing industry:
1) need coating to fill up the big hole site of blue glue at back of circuit board, first paste resistant to elevated temperatures red adhesive tape,
2) programming one aluminium flake printing net of milling, portion on aluminium flake is worn in milling, namely needs to cover the region of blue glue on circuit board,
3) installing aluminium flake net, printing blue glue, to plate face, then toasts, and peels off red adhesive tape after completing.
The defect of the method: tearing red adhesive tape after pasting red adhesive tape and baking before printing, it is necessary to expend more time and manpower, and red adhesive tape is expensive, cost is high.
Utility model content
The purpose of this utility model is to provide a kind of circuit board super big hole indigo plant offset printing brush aluminum net, decreases the blue glue amount of biting, and peels off the waste of the man power and material of red adhesive tape before eliminating printing blue glue of the prior art after the high temperature resistant red adhesive tape of patch and baking again.
For solving above-mentioned technical problem, this utility model embodiment provides a kind of circuit board super big hole indigo plant offset printing brush aluminum net, including multiple centers of circle circular hole in the component hole of blue glue to be filled, from setting between multiple described circular holes, multiple described circular holes intersect with described component hole.
Wherein, the ring spacing also including being positioned at described component hole and the circumference concentric with described component hole, described circumference and described component hole is 0.1mm, and the center of circle of multiple described circular holes is arranged on described circumference.
Wherein, the aperture of multiple described circular holes is equal.
Wherein, multiple described circular holes are uniformly distributed on described circumference.
Wherein, adjacent described circular hole spacing on the circumference of aluminium flake mesh is 0.4mm-0.6mm.
Wherein, also including being arranged in described circumference, and the concentric circle holes concentric with described circumference, described concentric circle holes and multiple described circular holes are from setting.
Wherein, the aperture of described concentric circle holes is equal to the aperture of multiple described circular holes.
The circuit board super big hole indigo plant offset printing brush aluminum net that this utility model embodiment provides, compared with prior art, has the advantage that
The described circuit board super big hole indigo plant offset printing brush aluminum net that this utility model embodiment provides, including multiple centers of circle circular hole in the component hole of blue glue to be filled, from setting between multiple described circular holes, multiple described circular holes intersect with described component hole.
Described circuit board super big hole indigo plant offset printing brush aluminum net, by a big hole of the prior art is changed into multiple from small sircle hole, after component hole is carried out blue offset printing brush, due to identical with blue glue typography of the prior art, the thickness of blue glue is identical, and the blue glue being printed on component hole significantly reduces so that the bite upper amount in circuit board component hole of blue glue reduces, avoid too much blue glue to pile up and penetrate at the bottom of circuit board component hole, polluting plate face. It is maintained with the blue glue amount of biting of the best, the blue glue bitten out from multiple circular holes is made to produce Adhesion formation surface tension, and complete circuit board to be covered is specified the covering in region, paste high temperature resistant red adhesive tape before eliminating printing blue glue of the prior art, after baking, peel off the waste of the man power and material of red adhesive tape again.
In sum, circuit board super big hole indigo plant offset printing brush aluminum net described in this utility model embodiment, by a big hole of the prior art is designed as multiple small sircle hole, decrease the blue glue amount of biting, before eliminating printing blue glue of the prior art, after the high temperature resistant red adhesive tape of patch and baking, peel off the waste of the man power and material of red adhesive tape again.
Accompanying drawing explanation
In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in the following describes is embodiments more of the present utility model, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is aluminum net design drawing of the prior art;
Fig. 2 is the top view schematic diagram of tool of the prior art;
Fig. 3 is the profile schematic diagram of blue offset printing brush of the prior art;
The circuit board super big hole indigo plant offset printing brush aluminum net top view schematic diagram that Fig. 4 provides for this utility model embodiment;
The circuit board super big hole indigo plant offset printing brush aluminum net that Fig. 5 provides for using this utility model embodiment carries out the circuit board longitudinal sectional drawing after blue offset printing brush;
A kind of position relationship schematic diagram of the mesh in the detailed description of the invention of the circuit board super big hole indigo plant offset printing brush aluminum net that Fig. 6 provides for this utility model embodiment and component hole.
Detailed description of the invention
Just as described in the background section, now in the art, as shown in Figure 1-Figure 3, Fig. 1 is aluminum net design drawing of the prior art, the circuit board component aperture 1 of blue glue to be filled and the ring spacing 3 of the aluminium flake mesh 2 of the printing blue glue of design, ring spacing 3 is typically designed as 0.1mm; Fig. 2 is the top view schematic diagram of tool of the prior art, and wherein dash area is aluminium flake, and elliptical section is divided into the Lan Jiao district that milling sky is bitten; Fig. 3 is the profile schematic diagram of blue offset printing brush of the prior art, and high temperature resistant red adhesive tape 5 must be posted in the back side of circuit board 4, and otherwise front is printed on the back side of circuit board 4 after the blue glue 6 on circuit board component hole will necessarily be bitten from aluminium flake mesh.Complex chart 1-Fig. 3 is it can be seen that tear red adhesive tape after pasting red adhesive tape and baking before the insert hole indigo plant offset printing brush that the part to circuit board is bigger, it is necessary to expending more time and manpower, and red adhesive tape is expensive, cost is high.
Based on this, this utility model embodiment provides a kind of circuit board super big hole indigo plant offset printing brush aluminum net, and including multiple centers of circle circular hole in the component hole of blue glue to be filled, from setting between multiple described circular holes, multiple described circular holes intersect with described component hole.
In sum, the described circuit board super big hole indigo plant offset printing brush aluminum net that this utility model embodiment provides, by a big hole of the prior art is changed into multiple from small sircle hole, after component hole is carried out blue offset printing brush, due to identical with blue glue typography of the prior art, the thickness of blue glue is identical, and the blue glue being printed on component hole significantly reduces, the bite upper amount in circuit board component hole of blue glue is reduced, avoid too much blue glue to pile up and penetrate at the bottom of circuit board component hole, polluting plate face. It is maintained with the blue glue amount of biting of the best, the blue glue bitten out from multiple circular holes is made to produce Adhesion formation surface tension, and complete circuit board to be covered is specified the covering in region, paste high temperature resistant red adhesive tape before eliminating printing blue glue of the prior art, after baking, peel off the waste of the man power and material of red adhesive tape again.
Understandable for enabling above-mentioned purpose of the present utility model, feature and advantage to become apparent from, below in conjunction with accompanying drawing, detailed description of the invention of the present utility model is described in detail.
Elaborate detail in the following description so that fully understanding this utility model. But this utility model can be different from alternate manner described here implement with multiple, and those skilled in the art can do similar popularization when without prejudice to this utility model intension. Therefore this utility model is not by the following public restriction being embodied as.
Refer to the circuit board super big hole indigo plant offset printing brush aluminum net top view schematic diagram that Fig. 4-Fig. 6, Fig. 4 provide for this utility model embodiment; The circuit board super big hole indigo plant offset printing brush aluminum net that Fig. 5 provides for using this utility model embodiment carries out the circuit board longitudinal sectional drawing after blue offset printing brush; A kind of position relationship schematic diagram of the mesh in the detailed description of the invention of the circuit board super big hole indigo plant offset printing brush aluminum net that Fig. 6 provides for this utility model embodiment and component hole.
In the concrete mode of one, described circuit board super big hole indigo plant offset printing brush aluminum net, including multiple centers of circle circular hole 30 in the component hole 50 of blue glue to be filled, from setting between multiple described circular holes 30, multiple described circular holes 30 intersect with described component hole 50.
The circuit board super big hole indigo plant offset printing brush aluminum net that Fig. 5 provides for using this utility model embodiment carries out the circuit board longitudinal sectional drawing after blue offset printing brush, owing to after blue offset printing brush, the blue glue 7 in front can only enter component hole 50 and can not arrive the back side of circuit board, namely after using the circuit board super big hole indigo plant offset printing brush aluminum net that provides of this utility model embodiment to carry out blue offset printing brush, the blue glue amount of biting is less, and high temperature resistant red adhesive tape just need not be used to be attached to the back side of component hole 50 of circuit board 8.
It should be noted that the diameter of described circular hole 30 is not specifically limited by this utility model, the diameter of multiple described circular holes 30 can be identical, it is also possible to different, as long as can complete the covering to component hole 50 after blue offset printing brush.
Described circuit board super big hole indigo plant offset printing brush aluminum net, by a big hole 30 of the prior art is changed into multiple from small sircle hole 30, after component hole 50 is carried out blue offset printing brush, due to identical with blue glue typography of the prior art, the thickness of blue glue is identical, and the blue glue being printed on component hole 50 significantly reduces so that the bite upper amount in circuit board component hole 50 of blue glue reduces, avoid too much blue glue to pile up and penetrate into the end, circuit board component hole 50, pollute plate face.It is maintained with the blue glue amount of biting of the best, the blue glue bitten out from multiple circular holes 30 is made to produce Adhesion formation surface tension, and complete circuit board to be covered is specified the covering in region, paste high temperature resistant red adhesive tape before eliminating printing blue glue of the prior art, after baking, peel off the waste of the man power and material of red adhesive tape again
Described circuit board super big hole indigo plant offset printing brush aluminum net also includes being positioned at described component hole 50 and the circumference 20 concentric with described component hole 50, the ring spacing 50 of described circumference 20 and described component hole 50 is 0.1mm, and the center of circle of multiple described circular holes 30 is arranged on described circumference 20.
The ring spacing 50 of described circumference 20 and described component hole 50 is 0.1mm, can ensure that in the process of blue offset printing brush, blue glue is as far as possible many covers described component hole 50, reduce the waste of blue glue, and multiple described circular hole 30 is positioned on described circumference, it is possible to cover everywhere as far as possible uniformly after making blue offset printing brush.
Preferably, the aperture of multiple described circular holes 30 is equal, and during due to blue offset printing brush, thickness is identical everywhere so that the amount of the blue glue that each described circular hole 30 receives is equal.
Preferably, multiple described circular holes 30 are uniformly distributed on described circumference 20 so that after diffusion, and the thickness that on component hole 50, blue glue everywhere covers is uniform so that the printing quality of blue glue is greatly improved.
For making the blue glue between multiple described circular hole 30 to spread as much as possible, the tension force between the blue glue of adjacent described circular hole 30 is big as far as possible, and the adjacent described circular hole 30 spacing 60 on the circumference of aluminium flake mesh is 0.4mm-0.6mm. When the adjacent described circular hole 30 spacing 60 on the circumference of described aluminium flake mesh is 0.5mm, the blue glue amount that printing uses is minimum, and the tension force of the blue glue in adjacent circular holes 30 is maximum, and blue offset printing brushing effects is best. It should be noted that, the above-mentioned adjacent described circular hole 30 spacing on the circumference of described aluminium flake mesh can also carry out appropriate fine setting according to the blue kind of glue and the thickness of viscosity and circuit board to be processed, corresponding fine setting can also be done in the aperture of described circular hole 30, it is typically on described circumference 20 and 8 described circular holes 30 are set, as shown in Figure 6.
It it is the blue offset printing brush of circuit board super big hole owing to this utility model is to be dealt with, if the aperture of the circular hole 30 on circumference 20 is less, the blue offset printing brush eventually formed can make the blue glue in component hole 50 be that middle sunken inside is middle even does not have blue glue, blue offset printing brush is caused to fall flat, therefore also circular hole 30 need to be set in described circumference 20, namely circuit board super big hole indigo plant offset printing brush aluminum net also includes being arranged in described circumference 20, and the concentric circle holes 10 concentric with described circumference 20, described concentric circle holes 10 and multiple described circular holes 30 are from setting. if the aperture of the concentric circle holes 10 arranged on described circumference 20 is less, also need to be arranged at the circular hole 30 more crossed, the center of circle of these circular holes 30 on the circle less with described circumference 20 concentric and more described circumference 20 diameter, simultaneously between these circular holes 30 and with described concentric circle holes 10 and the center of circle between the circular hole 30 on described circumference 20 from setting. it should be noted that quantity and the aperture of described circular hole 30 are not specifically limited by this utility model.
Preferably, the technology difficulty of the making of aluminum net, equal to the aperture of multiple described circular holes 30, so can be reduced in the aperture of described concentric circle holes 10, also is able to improve blue offset printing brushing effects simultaneously.
In sum, the circuit board super big hole indigo plant offset printing brush aluminum net that this utility model embodiment provides, by a big hole of the prior art is changed into multiple from small sircle hole, after component hole is carried out blue offset printing brush, due to identical with blue glue typography of the prior art, the thickness of blue glue is identical, and the blue glue being printed on component hole significantly reduces, the bite upper amount in circuit board component hole of blue glue is reduced, avoid too much blue glue to pile up and penetrate at the bottom of circuit board component hole, polluting plate face.It is maintained with the blue glue amount of biting of the best, the blue glue bitten out from multiple circular holes is made to produce Adhesion formation surface tension, and complete circuit board to be covered is specified the covering in region, paste high temperature resistant red adhesive tape before eliminating printing blue glue of the prior art, after baking, peel off the waste of the man power and material of red adhesive tape again.
Above circuit board super big hole indigo plant offset printing brush aluminum net provided by the utility model is described in detail. Principle of the present utility model and embodiment are set forth by specific case used herein, and the explanation of above example is only intended to help to understand method of the present utility model and core concept thereof. Should be understood that; for those skilled in the art; under the premise without departing from this utility model principle, it is also possible to this utility model carries out some improvement and modification, these improve and modification also falls in this utility model scope of the claims.
Claims (7)
1. a circuit board super big hole indigo plant offset printing brush aluminum net, it is characterised in that including multiple center of circle circular hole in the component hole of blue glue to be filled, from setting between multiple described circular holes, multiple described circular holes intersect with described component hole.
2. circuit board super big hole indigo plant offset printing brush aluminum net as claimed in claim 1, it is characterized in that, also include being positioned at described component hole and the circumference concentric with described component hole, the ring spacing of described circumference and described component hole is 0.1mm, and the center of circle of multiple described circular holes is arranged on described circumference.
3. circuit board super big hole indigo plant offset printing brush aluminum net as claimed in claim 2, it is characterised in that the aperture of multiple described circular holes is equal.
4. circuit board super big hole indigo plant offset printing brush aluminum net as claimed in claim 3, it is characterised in that multiple described circular holes are uniformly distributed on described circumference.
5. circuit board super big hole indigo plant offset printing brush aluminum net as claimed in claim 4, it is characterised in that adjacent described circular hole spacing on the circumference of aluminium flake mesh is 0.4mm-0.6mm.
6. circuit board super big hole indigo plant offset printing brush aluminum net as claimed in claim 5, it is characterised in that also include being arranged in described circumference, and the concentric circle holes concentric with described circumference, described concentric circle holes and multiple described circular holes are from setting.
7. circuit board super big hole indigo plant offset printing brush aluminum net as claimed in claim 6, it is characterised in that the aperture of described concentric circle holes is equal to the aperture of multiple described circular holes.
Priority Applications (1)
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CN201520933908.8U CN205305226U (en) | 2015-11-20 | 2015-11-20 | Blue offset printing brush aluminum mesh in circuit board super large hole |
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CN201520933908.8U CN205305226U (en) | 2015-11-20 | 2015-11-20 | Blue offset printing brush aluminum mesh in circuit board super large hole |
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CN205305226U true CN205305226U (en) | 2016-06-08 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109195339A (en) * | 2018-10-26 | 2019-01-11 | 南通深南电路有限公司 | The filling holes with resin device and method of pcb board |
CN111836475A (en) * | 2020-07-28 | 2020-10-27 | 深圳市迅捷兴科技股份有限公司 | Manufacturing method of blue rubber plate with hole diameter of more than 2.0mm and printing tool |
-
2015
- 2015-11-20 CN CN201520933908.8U patent/CN205305226U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109195339A (en) * | 2018-10-26 | 2019-01-11 | 南通深南电路有限公司 | The filling holes with resin device and method of pcb board |
CN111836475A (en) * | 2020-07-28 | 2020-10-27 | 深圳市迅捷兴科技股份有限公司 | Manufacturing method of blue rubber plate with hole diameter of more than 2.0mm and printing tool |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Blue offset printing brush aluminum mesh in circuit board super large hole Effective date of registration: 20190712 Granted publication date: 20160608 Pledgee: Bank of Changsha Limited by Share Ltd Liuyang branch Pledgor: Hunan Li'er Circuit Board Co., Ltd.|Hunan Lier Electronic Materials Co., Ltd. Registration number: 2019430000064 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |