CN106047197A - 陶瓷电子部件制造用的温敏性粘合片及陶瓷电子部件的制造方法 - Google Patents

陶瓷电子部件制造用的温敏性粘合片及陶瓷电子部件的制造方法 Download PDF

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Publication number: CN106047197A
Authority: CN; China
Prior art keywords: sensitive; side chain; thermo; crystalline polymer; temperature
Prior art date: 2015-04-14
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

CN201610210302.0A

Other languages

English (en)

Chinese (zh)

Inventor

小岛龙之介

山本正芳

河原伸郎

河原伸一郎

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Nitta Corp

Original Assignee

Nitta Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2015-04-14

Filing date

2016-04-06

Publication date

2016-10-26

2016-04-06 Application filed by Nitta Corp filed Critical Nitta Corp

2016-10-26 Publication of CN106047197A publication Critical patent/CN106047197A/zh

Status Pending legal-status Critical Current

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Classifications

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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/08—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers using foamed adhesives
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/14—Applications used for foams
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C

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Mechanical Engineering (AREA)
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CN201610210302.0A 2015-04-14 2016-04-06 陶瓷电子部件制造用的温敏性粘合片及陶瓷电子部件的制造方法 Pending CN106047197A (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN106244035A (zh) *	2015-06-04	2016-12-21	霓达株式会社	感温性粘合带
CN107163882A (zh) *	2017-06-10	2017-09-15	马可足	一种可热剥离型临时固定粘合剂及其制备方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2021155495A (ja) *	2020-03-25	2021-10-07	大日本印刷株式会社	発泡性接着シートおよび物品の製造方法
KR20220170055A (ko)	2021-06-22	2022-12-29	임현준	접이식 버티컬 마우스

Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN1355833A (zh) *	1999-06-10	2002-06-26	新田株式会社	用于临时粘附陶瓷电子器件生片材的粘合带以及制备陶瓷电子器件的方法
CN101126001A (zh) *	2006-08-14	2008-02-20	日东电工株式会社	粘合片、其制备方法、以及切割多层陶瓷片材的方法
CN202415432U (zh) *	2012-01-08	2012-09-05	荆门市维益电子包装材料有限公司	感温剥离膜片
TW201502232A (zh) *	2013-04-05	2015-01-16	Nitta Corp	假固定用兩面黏著膠帶及使用該膠帶之被加工物的假固定方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP5074715B2 (ja) *	2006-07-03	2012-11-14	ニッタ株式会社	粘着シート
JP5074716B2 (ja) *	2006-07-03	2012-11-14	ニッタ株式会社	粘着シート
JP5358086B2 (ja) *	2007-11-15	2013-12-04	ニッタ株式会社	感温性粘着剤

2015
- 2015-04-14 JP JP2015082764A patent/JP2016199725A/ja active Pending
2016
- 2016-04-06 CN CN201610210302.0A patent/CN106047197A/zh active Pending
- 2016-04-08 KR KR1020160043363A patent/KR20160122643A/ko not_active Application Discontinuation
- 2016-04-13 TW TW105111462A patent/TWI596187B/zh active

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN1355833A (zh) *	1999-06-10	2002-06-26	新田株式会社	用于临时粘附陶瓷电子器件生片材的粘合带以及制备陶瓷电子器件的方法
CN101126001A (zh) *	2006-08-14	2008-02-20	日东电工株式会社	粘合片、其制备方法、以及切割多层陶瓷片材的方法
CN202415432U (zh) *	2012-01-08	2012-09-05	荆门市维益电子包装材料有限公司	感温剥离膜片
TW201502232A (zh) *	2013-04-05	2015-01-16	Nitta Corp	假固定用兩面黏著膠帶及使用該膠帶之被加工物的假固定方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN106244035A (zh) *	2015-06-04	2016-12-21	霓达株式会社	感温性粘合带
CN107163882A (zh) *	2017-06-10	2017-09-15	马可足	一种可热剥离型临时固定粘合剂及其制备方法

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TWI596187B (zh)	2017-08-21
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KR20160122643A (ko)	2016-10-24

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Date	Code	Title	Description
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JP5074715B2 (ja)	2012-11-14	粘着シート
KR100945039B1 (ko)	2010-03-05	고온 발포시트를 이용한 연성회로기판의 제조방법
JP6897674B2 (ja)	2021-07-07	自己粘着性層
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TWI710593B (zh)	2020-11-21	自吸附性發泡片
JP2003213226A (ja)	2003-07-30	高周波電子部品用粘着テープ又はシート、及び該粘着テープ又はシートが貼着された高周波電子部品

CN106047197A - 陶瓷电子部件制造用的温敏性粘合片及陶瓷电子部件的制造方法 - Google Patents

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