CN105990257B - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN105990257B
CN105990257B CN201510096597.9A CN201510096597A CN105990257B CN 105990257 B CN105990257 B CN 105990257B CN 201510096597 A CN201510096597 A CN 201510096597A CN 105990257 B CN105990257 B CN 105990257B
Authority
CN
China
Prior art keywords
external connection
connection terminals
shell
semiconductor device
socket
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201510096597.9A
Other languages
English (en)
Chinese (zh)
Other versions
CN105990257A (zh
Inventor
佐藤宏贵
向田秀子
藤巻明子
筑山慧至
尾山胜彦
小坂善幸
渡辺章雄
原嶋志郎
安达浩祐
松浦永悟
山口量平
土肥雅之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kioxia Corp
Original Assignee
Toshiba Memory Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Memory Corp filed Critical Toshiba Memory Corp
Publication of CN105990257A publication Critical patent/CN105990257A/zh
Application granted granted Critical
Publication of CN105990257B publication Critical patent/CN105990257B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
CN201510096597.9A 2014-09-17 2015-03-04 半导体装置 Active CN105990257B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014188532A JP6334342B2 (ja) 2014-09-17 2014-09-17 半導体装置
JP2014-188532 2014-09-17

Publications (2)

Publication Number Publication Date
CN105990257A CN105990257A (zh) 2016-10-05
CN105990257B true CN105990257B (zh) 2019-06-07

Family

ID=55798070

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510096597.9A Active CN105990257B (zh) 2014-09-17 2015-03-04 半导体装置

Country Status (3)

Country Link
JP (1) JP6334342B2 (ja)
CN (1) CN105990257B (ja)
TW (1) TWI545850B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022050235A (ja) * 2020-09-17 2022-03-30 キオクシア株式会社 Ｕｓｂメモリおよびその製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3078616B2 (ja) * 1991-08-30 2000-08-21 ケル株式会社 プラグコネクタおよびその製造方法
JP2541653Y2 (ja) * 1993-05-21 1997-07-16 日本航空電子工業株式会社 コネクタ
JP2008084570A (ja) * 2006-09-26 2008-04-10 Calsonic Kansei Corp コネクタ
KR20110088885A (ko) * 2010-01-29 2011-08-04 삼성전자주식회사 핀 모듈을 포함하는 ｕｓｂ 장치
JP2011188193A (ja) * 2010-03-08 2011-09-22 Mitsubishi Electric Corp 記録再生装置及び記録再生方法
CN201708305U (zh) * 2010-04-30 2011-01-12 富士康(昆山)电脑接插件有限公司 移动存储装置及其电连接器
JP5781107B2 (ja) * 2013-02-22 2015-09-16 株式会社東芝 Ｕｓｂ装置
JP3185159U (ja) * 2013-05-23 2013-08-01 竺科科技股▲ふん▼有限公司 Ｕｓｂコネクタ組合せ構造
JP3185158U (ja) * 2013-05-23 2013-08-01 竺科科技股▲ふん▼有限公司 Ｕｓｂコネクタ組合せ構造

Also Published As

Publication number Publication date
JP2016062704A (ja) 2016-04-25
JP6334342B2 (ja) 2018-05-30
TWI545850B (zh) 2016-08-11
TW201613194A (en) 2016-04-01
CN105990257A (zh) 2016-10-05

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Legal Events

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20170809

Address after: Tokyo, Japan

Applicant after: TOSHIBA MEMORY Corp.

Address before: Tokyo, Japan

Applicant before: Toshiba Corp.

GR01 Patent grant
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: Tokyo

Patentee after: TOSHIBA MEMORY Corp.

Address before: Tokyo

Patentee before: Pangea Co.,Ltd.

Address after: Tokyo

Patentee after: Kaixia Co.,Ltd.

Address before: Tokyo

Patentee before: TOSHIBA MEMORY Corp.

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20220130

Address after: Tokyo

Patentee after: Pangea Co.,Ltd.

Address before: Tokyo

Patentee before: TOSHIBA MEMORY Corp.