CN105990257B - 半导体装置 - Google Patents
半导体装置 Download PDFInfo
- Publication number
- CN105990257B CN105990257B CN201510096597.9A CN201510096597A CN105990257B CN 105990257 B CN105990257 B CN 105990257B CN 201510096597 A CN201510096597 A CN 201510096597A CN 105990257 B CN105990257 B CN 105990257B
- Authority
- CN
- China
- Prior art keywords
- external connection
- connection terminals
- shell
- semiconductor device
- socket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014188532A JP6334342B2 (ja) | 2014-09-17 | 2014-09-17 | 半導体装置 |
JP2014-188532 | 2014-09-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105990257A CN105990257A (zh) | 2016-10-05 |
CN105990257B true CN105990257B (zh) | 2019-06-07 |
Family
ID=55798070
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510096597.9A Active CN105990257B (zh) | 2014-09-17 | 2015-03-04 | 半导体装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6334342B2 (ja) |
CN (1) | CN105990257B (ja) |
TW (1) | TWI545850B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022050235A (ja) * | 2020-09-17 | 2022-03-30 | キオクシア株式会社 | Usbメモリおよびその製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3078616B2 (ja) * | 1991-08-30 | 2000-08-21 | ケル株式会社 | プラグコネクタおよびその製造方法 |
JP2541653Y2 (ja) * | 1993-05-21 | 1997-07-16 | 日本航空電子工業株式会社 | コネクタ |
JP2008084570A (ja) * | 2006-09-26 | 2008-04-10 | Calsonic Kansei Corp | コネクタ |
KR20110088885A (ko) * | 2010-01-29 | 2011-08-04 | 삼성전자주식회사 | 핀 모듈을 포함하는 usb 장치 |
JP2011188193A (ja) * | 2010-03-08 | 2011-09-22 | Mitsubishi Electric Corp | 記録再生装置及び記録再生方法 |
CN201708305U (zh) * | 2010-04-30 | 2011-01-12 | 富士康(昆山)电脑接插件有限公司 | 移动存储装置及其电连接器 |
JP5781107B2 (ja) * | 2013-02-22 | 2015-09-16 | 株式会社東芝 | Usb装置 |
JP3185159U (ja) * | 2013-05-23 | 2013-08-01 | 竺科科技股▲ふん▼有限公司 | Usbコネクタ組合せ構造 |
JP3185158U (ja) * | 2013-05-23 | 2013-08-01 | 竺科科技股▲ふん▼有限公司 | Usbコネクタ組合せ構造 |
-
2014
- 2014-09-17 JP JP2014188532A patent/JP6334342B2/ja active Active
-
2015
- 2015-03-04 CN CN201510096597.9A patent/CN105990257B/zh active Active
- 2015-03-04 TW TW104106910A patent/TWI545850B/zh active
Also Published As
Publication number | Publication date |
---|---|
JP2016062704A (ja) | 2016-04-25 |
JP6334342B2 (ja) | 2018-05-30 |
TWI545850B (zh) | 2016-08-11 |
TW201613194A (en) | 2016-04-01 |
CN105990257A (zh) | 2016-10-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170809 Address after: Tokyo, Japan Applicant after: TOSHIBA MEMORY Corp. Address before: Tokyo, Japan Applicant before: Toshiba Corp. |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo Patentee after: TOSHIBA MEMORY Corp. Address before: Tokyo Patentee before: Pangea Co.,Ltd. Address after: Tokyo Patentee after: Kaixia Co.,Ltd. Address before: Tokyo Patentee before: TOSHIBA MEMORY Corp. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220130 Address after: Tokyo Patentee after: Pangea Co.,Ltd. Address before: Tokyo Patentee before: TOSHIBA MEMORY Corp. |